TWM468767U - Thin key structure - Google Patents

Description

Thin button structure

This creation is related to a key structure, and in particular to a thin key structure.

The button structure is a common input device and is widely used in various electronic devices, such as mobile phones, personal handheld computers, and remote controls. At present, as various electronic devices are thinned, the thickness of the key structure is also becoming thinner. However, the existing key structure still has technical problems to be overcome.

For example, a conventional button structure is mainly composed of a button, an elastic layer, and a circuit board. The elastic layer is disposed under the button and supported on the circuit board, and the elastic layer forms an elastic piece at the corresponding button. Therefore, when the button is pressed down during operation, the elastic piece is pressed down, so that the middle portion of the elastic piece is concavely and elastically deformed, thereby touching the contact point on the circuit board, thereby connecting the elastic layer and the circuit board. Turning on, thereby achieving the transmission of the button trigger signal corresponding to each push button.

However, in the above design, each time the button is pressed down, the movement path of the button will be different according to the pressing position of the user, so that the position of the elastic piece touched by the button is not necessarily the same. Further, if the position of the elastic piece touched by the button is deviated from the center of the elastic piece, the elastic piece is likely to be displaced when deformed, and the elastic piece and the circuit board may not be electrically connected.

Therefore, the creator feels that the above-mentioned deficiency can be improved. He is devoted to research and cooperates with the application of theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned deficiency.

The present embodiment provides a thin key structure that maintains a fixed path of the actuation key to ensure abutment between the elastic member and the circuit module.

The present invention provides a thin-type button structure, including: a circuit module; a frame disposed on the circuit module and surrounding a receiving space; an elastic member disposed on the circuit module and having a capacity Positioned in the accommodating space of the frame, the elastic member defines an abutting portion; and a pressing module having a mounting portion, an actuating key, and a connecting portion connecting the mounting portion and the actuating key, The mounting portion is disposed on the frame and defines a rotation axis, and the actuation key is located above the abutting portion of the elastic member; wherein the actuation button is adapted to be pressed, so that the actuation button can be rotated with the rotation axis as an axis The elastic member is pressed to deform, so that the abutting portion can reciprocate between an initial position and a conductive position; wherein the abutting portion presses the circuit module when the abutting portion is in the conducting position.

In summary, the thin button structure provided by the present embodiment is designed to be fixed by the rotation structure of the pressing module, so that the moving path of the actuating key is kept fixed without being changed by the position of the user's force, thereby The actuating key contacts the specific elastic member position, thereby ensuring the abutment between the elastic member and the circuit module.

100‧‧‧Thin button structure

1‧‧‧Support module

11‧‧‧Support board

12‧‧‧ bumps

13‧‧‧Support sheet

131‧‧‧U-shaped holes

14‧‧‧Support block

2‧‧‧ circuit module

21‧‧‧Music film (Membrane)

211‧‧‧First conductive layer

2111‧‧‧Uplift block

212‧‧‧Second conductive layer

2121‧‧‧容口

2122‧‧‧Uplift block

213‧‧‧ spacer

2131‧‧‧ accommodating holes

2132‧‧‧容口

214‧‧‧ conduction layer

3‧‧‧Frame

31‧‧‧ accommodating space

32‧‧‧ pivotal department

33‧‧‧ accommodating slots

4‧‧‧Flexible parts

41‧‧‧Metal shrapnel

411‧‧‧Apartment

412‧‧ ‧ Collimation

42‧‧‧Rubber washers

421‧‧‧ Carrying Department

422‧‧‧Support

423‧‧‧Apartment

4231‧‧‧Electrical block

5‧‧‧ Pressing module

51‧‧‧ actuation keys

511‧‧ ‧ block

52‧‧‧Installation Department

521‧‧‧Perforation

53‧‧‧Connecting Department

54‧‧‧ Positioning sheet

C‧‧‧ center axis

R‧‧‧ axis

W‧‧‧bearer width

H‧‧‧ Rubber gasket height

Figure 1 is a perspective view of the first embodiment of the creation.

2 is a cross-sectional view showing the first embodiment of the present invention in an initial position.

3 is a cross-sectional view showing the first embodiment of the present invention in an on position.

4 is a cross-sectional view showing the first embodiment of the present invention in an initial position and the circuit film has a two-layer structure.

FIG. 5 is a cross-sectional view showing the first embodiment of the present invention in an on position and the circuit film has a two-layer structure.

Figure 6 is a cross-sectional view showing another aspect of the first embodiment of the creation.

Figure 7 is a perspective view of the second embodiment of the present invention.

Figure 8 is a cross-sectional view showing the second embodiment of the present invention in an initial position.

Figure 9 is a cross-sectional view showing the second embodiment of the present invention in an on position.

Figure 10 is a perspective view showing another aspect of the second embodiment of the present invention.

Figure 11 is a cross-sectional view showing another embodiment of the second embodiment of the present invention in an initial position.

Figure 12 is a cross-sectional view showing another embodiment of the second embodiment of the present invention in an on position.

Figure 13 is a schematic view showing another embodiment of the positioning piece of the second embodiment of the present invention.

FIG. 14 is a schematic view showing still another embodiment of the positioning piece according to the second embodiment of the present invention.

Figure 15 is a cross-sectional view showing the third embodiment of the present invention in an initial position.

Figure 16 is a cross-sectional view showing the third embodiment of the present invention in an on position.

Figure 17 is a cross-sectional view showing the third embodiment of the present invention in an initial position and the circuit film has a two-layer structure.

Figure 18 is a cross-sectional view showing the third embodiment of the present invention in an on position and the circuit film has a two-layer structure.

Figure 19 is a cross-sectional view showing the fourth embodiment of the present invention in an initial position.

Figure 20 is a cross-sectional view showing the fourth embodiment of the present invention in an on position.

Figure 21 is a cross-sectional view showing a variation of the fourth embodiment of the present invention.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the scope of the present invention. . It should be noted that the following description will be mainly made by using a single button structure as an example, but in practical applications, it is not limited thereto.

[First Embodiment]

Referring to FIG. 1 to FIG. 3 , which is a first embodiment of the present invention, the present invention is a thin button structure 100 including a support module 1 , a circuit module 2 , a frame 3 , and an elastic member 4 . And a pressing module 5. In the embodiment, the elastic member 4 is exemplified by a metal dome 41. However, in practical applications, the elastic member 4 is not limited thereto. For example, the elastic member 4 may also be a rubber washer. (Rubber Dome). Wherein, the embodiment particularly refers to a thin press with an overall thickness of less than 3.4 mm. In the key structure 100, the structure of each of the above elements will be separately described below, and then the connection relationship between the elements will be described later.

The support module 1 has a flat support plate 11 and a protrusion 12 disposed on the support plate 11. The plane of the support plate 11 defines a central axis C, and the central axis C is substantially perpendicular to the support plate. 11 is in the plane, and the protrusion 12 is on the central axis C.

It should be noted that, in the embodiment, the protrusion 12 is a separate component (such as a block) installed on the support plate 11 , but the support plate 11 is not directly formed by, for example, punching. Raised 12. In other words, the support plate 11 and the projection 12 may be in an integrally formed configuration.

The circuit module 2 is disposed on the support plate 11 and abuts against the protrusion 12, and the ridge block 2111 is formed at a portion of the circuit module 2 abutting on the protrusion 12. Specifically, the circuit module 2 includes a circuit film 21, the circuit film 21 has a three-layer structure and has a first conductive layer 211, a second conductive layer 212, and a first A spacer layer 213 between the conductive layer 211 and the second conductive layer 212, and the spacer layer 213 defines a receiving hole 2131. The first conductive layer 211 is disposed on the support plate 11 , and the first conductive layer 211 abuts the protrusion 12 to form the raised block 2111 , and the raised block 2111 is located in the receiving hole 2131 . Thereby, the first conductive layer 211 is formed with the raised block 2111 through the arrangement of the protrusions 12, and the shortest distance between the first conductive layer 211 and the second conductive layer 212 can be effectively shortened, thereby improving the circuit film 21. Sensitivity.

In more detail, the spacer layer 213 isolates and supports the first conductive layer 211 and the second conductive layer 212, and the second conductive layer 212 is elastically deformable corresponding to the portion accommodating the hole 2131. The embossed block 2111 of the first conductive layer 211 is spaced apart from the corresponding second conductive layer 212, and is respectively provided with electrodes of opposite electrical properties. When the second conductive layer 212 is deformed corresponding to the portion accommodating the hole 2131, When the bump 2111 of the first conductive layer 211 is abutted, the electrodes of the first conductive layer 211 and the second conductive layer 212 abut each other to achieve electrical conduction.

In addition, the circuit film 21 may also have a two-layer structure. As shown in FIG. 4 and FIG. 5, the circuit film 21 has a first conductive layer 211 and a second conductive layer disposed on the first conductive layer 211. 212, and the second conductive layer 212 defines a receiving port 2121. The first conductive layer 211 is disposed on the support plate 11. The first conductive layer 211 abuts the portion of the protrusion 12 to form the raised block 2111, and the raised block 2111 is located at the receiving port 2121. The port 2121 is accommodated and exposed.

In more detail, no electrical conduction is formed between the first conductive layer 211 and the second conductive layer 212. The first conductive layer 211 is exposed on the outer surface of the embossed block 2111 and the outer surface of the second conductive layer 212, respectively, and is provided with opposite electrodes. When a conductive member (such as a metal dome 41) is disposed on the first When the conductive member is deformed to abut the electrode of the first conductive layer 211, the first conductive layer 211 and the second conductive layer 212 will be electrically connected.

In the present embodiment, the circuit module 21 is exemplified by the circuit film 21. However, in practical applications, the circuit film 21 can also be a flexible printed circuit (FPC) or a flexible flat cable (Flexible Flat Cable). , FFC), or other objects with the same function are replaced.

Referring to FIG. 1 to FIG. 3 , the frame 3 is disposed on the circuit module 2 and defines an accommodating space 31 . The frame 3 surrounds one of the inner sidewalls forming the accommodating space 31 to form a pivoting portion 32 . In the embodiment, the pivoting portion 32 is a plurality of hooks having a certain elasticity, but is not limited thereto.

The metal dome 41 is disposed on the second conductive layer 212 of the circuit module 2 and is received in the accommodating space 31 of the frame 3 . The portion of the inner edge of the metal dome 41 on the central axis C is defined as an abutting portion 411, and the metal dome 41 is provided with a collimating portion 412 on the opposite side of the abutting portion 411, that is, the collimating portion 412 Located on the central axis C. Furthermore, in the present embodiment, the metal dome 41 is an integrally formed structure that is substantially symmetrical with respect to the central axis C. More specifically, the inner edge of the metal dome 41 is outwardly punched to form a convex portion having a substantially uniform thickness and equal thickness. The edge corresponds to the straightening portion 412, and the inner edge corresponds to the abutting portion 411.

The pressing module 5 includes an operating button 51 , a mounting portion 52 , and a connecting portion 53 connecting the mounting portion 52 and the operating button 51 . Further, the connecting portion 53 and the mounting portion 52 are formed by integrally extending the side edges of the self-actuating key 51, and the mounting portion 52 has an elongated shape and a long axis direction thereof is defined as a rotation axis R. The mounting portion 52 is rotatably mounted on the pivoting portion 32 of the frame 3 (that is, the mounting portion 52 is fastened to the pivot portion 32) such that the longitudinal direction of the mounting portion 52 is substantially perpendicular to the central axis C. . The actuating key 51 is located above the abutting portion 411 of the metal dome 41 and abuts against the collimating portion 412, that is, the collimating portion 412 is located between the abutting portion 411 of the metal dome 41 and the actuating key 51 of the pressing module 5. Therefore, when the movable key 51 is pressed, the operating key 51 can pivot with the rotation axis R as an axis.

The above is a structural description of the thin key structure 100 of the present embodiment, and the operation of the thin key structure 100 will be described below.

The actuating key 51 of the pressing module 5 is adapted to be pressed so that the actuating key 51 can be pivoted about the axis of rotation R, and the metal dome 41 is pressed by the collimating portion 412 to deform the metal dome 41. The joint portion 411 is reciprocally movable along the central axis C between an initial position (Fig. 2) and a conductive position (Fig. 3). When the abutting portion 411 is in the initial position, the abutting portion 411 is spaced apart from the circuit module 2; when the abutting portion 411 is in the conducting position, the edge of the abutting portion 411 is pressed against the circuit. Module 2.

In more detail, if the circuit film 21 has a three-layer structure, as shown in FIGS. 2 and 3, when the abutting portion 411 is at the initial position, the raised block 2111 of the first conductive layer 211 and its corresponding second conductive layer The 212 parts are arranged at intervals. When the abutting portion 411 is in the conducting position, the second conductive layer 212 is pressed by the edge of the abutting portion 411 to be deformed to abut the bump block 2111 of the first conductive layer 211, thereby making the first conductive layer 211 and the second conductive layer 211 Conductive layer 212 forms electrical conduction.

If the circuit film 21 has a two-layer structure, as shown in FIG. 4 and FIG. 5, when the abutting portion 411 is at the initial position, the raised block 2111 of the first conductive layer 211 passes through the receiving port 2121 and is adjacent to the abutting portion 411. Interval setting; when the abutting portion 411 is in the conducting position, The edge of the connecting portion 411 abuts the raised block 2111 of the first conductive layer 211 , so that the first conductive layer 211 is electrically connected to the second conductive layer 212 via the metal dome 41 .

In addition, the collimating portion 412 of the present embodiment is disposed outside the metal dome 41, and the collimating portion 412 can also be disposed on the operating button 51 of the pressing module 5 as shown in FIG. 6, and the collimating portion 412 is located at the operating button 51. Adjacent to one end of the metal dome 41. Thereby, the actuating key 51 is adapted to be pressed to compress the metal dome 41 by the collimating portion 412.

[Second embodiment]

Please refer to FIG. 7 to FIG. 9 , which is a second embodiment of the present invention. The present embodiment is similar to the first embodiment described above, and the same portions are not repeated, and the difference between the two is mainly in the frame 3 and the pressing mode. Group 5. Specifically, the frame 3 of the present embodiment is not formed with the pivoting portion 32, and the pressing module 5 of the present embodiment is substantially as follows.

The pressing module 5 has an operating button 51 and a positioning piece 54 . The positioning piece 54 defines a mounting portion 52 and a connecting portion 53 . In the present embodiment, the positioning piece body 54 is provided with a U-shaped hole, and the portion surrounded by the U-shaped hole is the connecting portion 53, and the remaining portion of the positioning piece body 54 except the connecting portion 53 is the mounting portion 52. Further, the block of the mounting portion 52 connected to and adjacent to the connecting portion 53 defines a rotation axis R, and one surface of the connecting portion 53 is bonded (e.g., pasted) to the actuating key 51.

The mounting portion 52 of the positioning piece 54 is fixed to an end of the frame 3 away from the circuit module 2 (such as the top end of the frame 3 in FIG. 8), and the linear portion of the mounting portion 52 connected to the connecting portion 53 is substantially perpendicular to the central axis. C. The actuating key 51 is located above the abutting portion 411 of the metal dome 41 and contacts the collimating portion 412 so that when the actuating key 51 is pressed, the actuating key 51 can pivot with the axis of rotation R as an axis. In more detail, the actuating key 51 is adapted to be pressed so that the actuating key 51 can be rotated by the rotation axis R as an axis to deform the pressing metal dome 41, so that the abutting portion 411 can be in the initial position (as shown in FIG. 8). The conduction position (Fig. 9) moves back and forth. Wherein, when the abutting portion 411 is located at the initial position, the mounting portion 52 and the connecting portion 53 of the positioning piece 54 are substantially coplanar.

Furthermore, the mounting portion 52 is disposed on the frame 3, and as shown in FIGS. 10 to 12, the mounting portion 52 of the positioning piece 54 is fixed to the adjacent circuit module of the frame 3. One end of 2 (as shown at the bottom of frame 3 of Figure 11). The frame 3 surrounds the inner side wall of the accommodating space 31, and a accommodating groove 33 is formed in a recessed portion away from the axis of rotation R, and a stop block 511 is formed on the side edge of the actuating key 51 away from the axis of rotation R. And the stopper block 511 is located in the accommodating groove 33 of the frame 3. Thereby, when the movable key 51 is pivoted about the rotation axis R, the transmission stopper 511 is restricted to the accommodation groove 33 of the frame 3, and the actuation key 51 can be prevented from being excessively inclined. Wherein, when the abutting portion 411 is in the conducting position, the mounting portion 52 and the connecting portion 53 of the positioning piece 54 are substantially coplanar.

The positioning piece 54 is exemplified in the embodiment shown in FIG. 7 , that is, the positioning piece 54 has a hard and strong characteristic, and is preferably made of, for example, polycarbonate (Polycarbonate, PC), Polyethylene Terephthalate (PET), or other hard materials of similar characteristics, but the design and material of the positioning sheet 54 are not limited thereto.

For example, the shape of the positioning piece 54 of FIG. 7 can be changed to be as shown in FIG. Specifically, the mounting portion 52 of the positioning piece 54 shown in FIG. 13 is connected and the block adjacent to the connecting portion 53 is extended, so that the positioning piece 54 can have a longer force arm when in use. Furthermore, the mounting portion 52 defines a through hole 521 adjacent to the block of the connecting portion 53 so as to reduce the cross section of the block by forming the through hole 521.

In addition, as shown in FIG. 14, the positioning piece 54 can also be made of a soft material such as Thermoplastic Polyurethane (TPU), rubber, or other soft material having similar properties. But it is not limited to this. Therefore, the connecting portion 53 of the positioning piece 54 is less suitable for being connected to the mounting portion 52 by only one side. In other words, if the connecting portion 53 is formed in an opening manner, at least three connecting points are required between the connecting portion 53 and the mounting portion 52. For example, four connecting points are formed between the connecting portion 53 and the mounting portion 52 as shown in FIG. , but not limited to this. In addition, the connecting portion 53 and the mounting portion 52 can also be completely connected without intentionally forming an opening (not shown).

[Third embodiment]

Referring to FIG. 15 and FIG. 16 , which is a third embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not repeated, and the difference between the two is mainly in the elastic member 4 . Specifically, the elastic member 4 of the present embodiment is a thin rubber dowel 42.

The rubber gasket 42 is disposed on the second conductive layer 212 of the circuit module 2 and accommodated in the accommodating space 31 of the frame 3, and the rubber gasket 42 is substantially symmetrical to the central axis C. The rubber washer 42 is formed with a bearing portion 421, a supporting portion 422, and an abutting portion 423. The supporting portion 422 and the abutting portion 423 respectively extend from the bottom edge of the carrying portion 421, and the supporting portion 422 has a substantially cross section. The abutting portion 423 is located in a space surrounded by the support portion 422. That is, the center of the carrying portion 421 and the center of the abutting portion 423 are located substantially on the central axis C. Furthermore, the width W of the carrying portion 421 is greater than the height H of the rubber gasket 42, that is, the length of the outer diameter of the cross-section of the bearing portion 421 perpendicular to the central axis C is greater than the height of the rubber gasket 42 corresponding to the central axis C.

The actuation key 51 of the pressing module 5 abuts against the bearing portion 421 of the rubber gasket 42. Thereby, when the actuation key 51 of the pressing module 5 is pressed, the actuation key 51 pivots about the rotation axis R and is pressed against the bearing portion 421 of the rubber gasket 42 to deform the support portion 422 of the rubber gasket 42. The abutting portion 423 can be reciprocally moved between the initial position (as shown in FIG. 15) and the conduction position (FIG. 16).

In addition, when the circuit film 21 has a two-layer structure, as shown in FIGS. 17 and 18, the circuit film 21 has a conductive layer 214 and a spacer layer 213 disposed on the conductive layer 214, and the spacer layer 213 is formed. There is a receiving port 2132. More specifically, the conductive layer 214 is exposed at the outer portion via the accommodating opening 2132, and a ring-shaped electrode and a center electrode located in the annular electrode and electrically opposite to the annular electrode are provided on the surface. When a conductive member (for example, the conductive block 4231 described below) simultaneously abuts against the ring-shaped electrode and the center electrode, the ring-shaped electrode and the center electrode of the conductive layer 214 are electrically connected to each other via a conductive member.

In order to correspond to the two-layer structure of the circuit film 21, the rubber gasket 42 is further provided with a conductive block 4231. Further, the abutting portion 423 is adjacent to the circuit. The portion of the module 2 is the above-mentioned conductive block 4231, and the bottom surface of the conductive block 4231 is substantially flat. Moreover, the support plate 11 is not provided with the protrusions 12, so that when the circuit film 21 is disposed on the support plate 11, the conductive layer 214 is substantially planar in the exposed portion through the accommodating opening 2132.

Therefore, when the actuation key 51 of the pressing module 5 is pressed, the actuation key 51 will press the bearing portion 421 of the rubber gasket 42 to deform the support portion 422 of the rubber gasket 42 so that the conductive block 4231 of the abutting portion 423 can simultaneously The ring electrode and the center electrode abut on the conduction layer 214.

[Fourth embodiment]

Referring to FIG. 19 and FIG. 20, which is a fourth embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not repeated, and the pressing module 5 is in this embodiment. The aspect of the first embodiment is exemplified, but it is not excluded that it can be replaced with the pressing module 5 of the second embodiment. The difference between the present embodiment and the first embodiment is mainly in the position of the protrusions 12, and the support module 1 of the embodiment further has a support body 13 and a plurality of support blocks 14 for specific description of the embodiment. It is roughly as follows.

The support sheet 13 is disposed above the second conductive layer 212, and the metal dome 41 is disposed on the support sheet 13. The protrusion 12 is disposed on the central axis C and disposed between the support sheet 13 and the second conductive layer 212. The support block 14 is also disposed between the support sheet 13 and the second conductive layer 212 and corresponds to the spacer layer. 213. Since the thickness of the protrusion 12 is greater than the thickness of the support block 14, and the width of the protrusion 12 is smaller than the aperture of the receiving hole 2131, the second conductive layer 212 abuts the portion of the protrusion 12 to form a raised block downward. 2122, and the raised block 2122 is located in the receiving hole 2131. Further, the portion of the support sheet 13 that abuts against the projection 12 is swelled upward. Thereby, the ridge block 2122 is formed to effectively shorten the shortest distance between the first conductive layer 211 and the second conductive layer 212, thereby improving the sensitivity of the circuit film 21. Moreover, the bulging formed by the raised block 2122 and the support piece 13 can also shorten the required stroke of the metal dome 41.

Therefore, when the abutting portion 411 is located at the initial position, the raised block 2122 of the second conductive layer 212 is spaced apart from the corresponding first conductive layer 211; when the abutting portion 411 is in the conductive position, the second conductive layer 212 The edge of the abutting portion 411 is pressed to be deformed so that the raised block 2122 abuts against the first conductive layer 211.

In addition, the support block 14 can also be replaced by other configurations. For example, the support sheet 13 corresponds to a portion of the frame 3 (such as the left and right sides in FIG. 19), and is disposed between the second conductive layer 212 and the second conductive layer 212. They can be fixed to each other in a bonded manner, thereby achieving the effect of replacing the support block 14. Furthermore, the support sheet 13 can be designed to have a plurality of U-shaped holes, which are substantially similar to the positioning piece 54 shown in FIG. 13 , and the portion surrounded by each U-shaped hole is used to carry the metal dome 41. In order to achieve the effect of reducing the pressing load. Therefore, when the metal dome 41 is deformed and pressed against the support sheet 13, the pressed portion of the support sheet 13 can be more sensitively deformed, and the thin button structure 100 has a better pressing touch.

Incidentally, the various components disclosed in the embodiments of the present invention can be assembled and assembled according to the needs of the designer to provide different thin key structure 100 patterns for the user. For example, as shown in FIG. 21, the thin button structure 100 of the present embodiment can replace the support block 14 with the above-mentioned bonding manner, the support sheet 13 is configured to open the U-shaped hole 131, and the pressing module 5 is second. In the aspect of the embodiment, a thin key structure 100 having an excellent pressing touch is obtained.

[Possible effects of this creative embodiment]

In summary, the thin button structure provided by the present embodiment is designed to be fixed by the rotation structure of the pressing module, so that the moving path of the actuating key is kept fixed without being changed by the position of the user's force, so that the actuating key is contacted. At a specific elastic member position, the abutment between the elastic member and the circuit module is ensured. Moreover, the positioning piece body of the pressing module can form a plurality of connecting parts, thereby being applied to a plurality of operating keys at the same time, thereby achieving the effects of rapid assembly and cost reduction.

The above description is only a preferred and feasible embodiment of the present invention, and it is not intended to limit the scope of the patent of the creation, and the equal variation and repair of the scope of the patent application according to the creation of the invention. Decorations should be covered by this creation.

100‧‧‧Thin button structure

1‧‧‧Support module

11‧‧‧Support board

12‧‧‧ bumps

2‧‧‧ circuit module

21‧‧‧Music film (Membrane)

211‧‧‧First conductive layer

2111‧‧‧Uplift block

212‧‧‧Second conductive layer

213‧‧‧ spacer

2131‧‧‧ accommodating holes

3‧‧‧Frame

31‧‧‧ accommodating space

32‧‧‧ pivotal department

4‧‧‧Flexible parts

41‧‧‧Metal shrapnel

411‧‧‧Apartment

412‧‧ ‧ Collimation

5‧‧‧ Pressing module

51‧‧‧ actuation keys

52‧‧‧Installation Department

53‧‧‧Connecting Department

C‧‧‧ center axis

Claims (10)

A thin key structure includes: a circuit module; a frame disposed on the circuit module and surrounding a receiving space; an elastic member disposed on the circuit module and housed in the frame In the accommodating space, the elastic member defines an abutting portion; and a pressing module having a mounting portion, an actuating key, and a connecting portion connecting the mounting portion and the actuating key, wherein the mounting portion is disposed at the The frame defines a rotation axis, and the actuation key is located above the abutting portion of the elastic member; wherein the actuation button is adapted to be pressed, so that the actuation key can be rotated by the axis of the rotation axis to compress and deform the elastic member The abutting portion is reciprocally movable between an initial position and a conductive position; wherein the abutting portion presses the circuit module when the abutting portion is in the conducting position. The thin key structure according to the first aspect of the invention, wherein the frame is formed with a pivoting portion, and the connecting portion and the mounting portion are formed integrally extending from the actuating key in a sequence, the mounting portion is elongated The pivoting portion of the frame is rotatably mounted on the frame, and the long axis direction of the mounting portion is defined as the axis of rotation. When the actuating button is pressed, the actuating button can be oriented on the axis of rotation. Pivot. The thin-type button structure according to the first aspect of the invention, wherein the pressing module has a positioning piece body, the positioning piece body is formed with the mounting portion and the connecting portion, and the mounting is connected adjacent to the connecting portion The block is defined by the axis of rotation, and when the actuating key is pressed, the actuating key can pivot with the axis of rotation as an axis. The thin key structure of the third aspect of the invention, wherein the mounting portion of the positioning piece is fixed to an end of the frame away from the circuit module, And when the abutting portion is located at the initial position, the mounting portion and the connecting portion of the positioning piece are substantially coplanar. The thin key structure of claim 1, wherein the elastic member includes a collimating portion, and the collimating portion is located at an end of the elastic member adjacent to the actuating key, and the actuating key is adapted to be pressed The alignment portion is pressed to deform the elastic member. The thin key structure of the first aspect of the invention, wherein the elastic member is further defined as a rubber dowel, the rubber gasket is formed with a bearing portion, a supporting portion, and the abutting portion, the supporting portion The abutting portion and the abutting portion respectively extend from a bottom edge of the carrying portion, and the abutting portion is located in a space surrounded by the supporting portion, and the width of the carrying portion is greater than a height of the rubber gasket. The thin button structure according to any one of the preceding claims, further comprising a support module, wherein the support module has a support plate and a protrusion, and the circuit module is disposed on the support The slab is abutted against the protrusion, and a protruding block is formed on the portion of the circuit module that abuts the protrusion. The thin key structure of the seventh aspect of the invention, wherein the protrusion is disposed on the support plate, the circuit module comprises a circuit film (Membrane), the circuit film has a first conductive layer, a first a second conductive layer, and a spacer layer disposed between the first conductive layer and the second conductive layer, the spacer layer defines a receiving hole; the first conductive layer is disposed on the supporting plate, the first And forming, by the conductive layer, the raised block, wherein the raised block is located in the receiving hole, the elastic member is disposed on the second conductive layer; when the abutting portion is located at the initial position, The raised block of the first conductive layer is spaced apart from the corresponding second conductive layer portion; when the abutting portion is located at the conductive position, the second conductive layer is pressed by the abutting portion to be deformed and abutted a raised block of the first conductive layer. The thin-type key structure of the seventh aspect of the invention, wherein the circuit module comprises a circuit film having a first conductive layer, a second conductive layer, and a first a spacer layer between the conductive layer and the second conductive layer, the spacer layer defines a receiving hole; the first conductive layer is disposed on the supporting plate, and the supporting module further has a supporting piece, the support The slab is disposed above the second conductive layer, and the protrusion is disposed between the support sheet and the second conductive layer, and the second conductive layer abuts the portion of the protrusion to form the ridge block. And the embossed block is located on the accommodating hole, and the elastic member is disposed on the supporting piece; when the abutting portion is located at the initial position, the embossed block of the second conductive layer and the corresponding first conductive layer The portion is spaced apart; when the abutting portion is in the conducting position, the second conductive layer is pressed by the abutting portion to be deformed such that the raised portion abuts against the first conductive layer. The thin key structure of the seventh aspect of the invention, wherein the protrusion is disposed on the support plate, the circuit module comprises a circuit film having a first conductive layer and a setting a second conductive layer on the first conductive layer, the second conductive layer defines a receiving opening; the first conductive layer is disposed on the supporting plate, and the first conductive layer abuts the protruding portion Forming the raised block, and the raised block is located at the receiving opening, the elastic member is disposed on the second conductive layer; when the abutting portion is located at the initial position, the raised block of the first conductive layer is The receiving port is spaced apart from the abutting portion; when the abutting portion is in the conducting position, the abutting portion abuts against the raised block of the first conductive layer.