TWM447608U - Board-to-board connector module - Google Patents
Board-to-board connector module Download PDFInfo
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- TWM447608U TWM447608U TW101215854U TW101215854U TWM447608U TW M447608 U TWM447608 U TW M447608U TW 101215854 U TW101215854 U TW 101215854U TW 101215854 U TW101215854 U TW 101215854U TW M447608 U TWM447608 U TW M447608U
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- board
- frame
- connector module
- top surface
- board connector
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- 239000002184 metal Substances 0.000 claims description 24
- 238000005476 soldering Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
Description
本創作是有關於一種板對板連接器模組,特別是有關於一種可縮小高度並且減少組件以降低成本之板對板連接器模組。The present invention relates to a board-to-board connector module, and more particularly to a board-to-board connector module that reduces the height and reduces components to reduce cost.
隨著消費性電子不斷朝輕、薄、短、小方向發展,例如在行動電話和PDA以及數碼相機等移動式設備中,相應於移動式設備的小型化和可擕式設計,就要求連接器模組尺寸縮小並具有薄斷面(Low profile)特徵,另外,移動通訊發展的多功能性,因此,安裝在電路板上的電子元件封裝密度增加,就需要對應精密排列的插頭和插座端子,因此不斷薄型化與小型化連接器模組為現今研究發展的潮流與趨勢。As consumer electronics continue to move toward light, thin, short, and small directions, such as in mobile devices such as mobile phones and PDAs and digital cameras, connectors are required for miniaturization and portable design of mobile devices. The module size is reduced and has a low profile feature. In addition, the versatility of mobile communication development, therefore, the density of electronic components mounted on the circuit board is increased, and the correspondingly arranged plug and socket terminals are required. Therefore, the continuous thinning and miniaturized connector modules are the trend and trend of research and development in the present day.
如中華民國專利公開第201034312號,所揭示的是一種板對板連接器模組,其結構主要包括有公母端連接器,而公母端連接器的結構則可細分為公母端絕緣本體及組裝於公母端絕緣本體之公母端端子所組成,此種習知的板對板連接器模組在公母端連接器互相對接結合後的高度大約會高於1mm以上。For example, the Republic of China Patent Publication No. 201034312 discloses a board-to-board connector module whose structure mainly includes a male-female end connector, and the structure of the male-female end connector can be subdivided into a male-female end insulating body. And the male-female terminal assembled in the male-female end insulating body, the height of the conventional board-to-board connector module after the mating and connecting of the male and female connectors is about 1 mm or more.
然而,當客戶需要將結合後的高度縮小至1mm以下時,此種習知的板對板連接器模組由於受限於公母端 連接器結構的高度限制及製程技術的侷限,因此無法達到客戶的需求,如此導致不利於市場競爭的問題。However, when the customer needs to reduce the combined height to less than 1 mm, such a conventional board-to-board connector module is limited by the male and female ends. The height limitation of the connector structure and the limitations of the process technology make it impossible to meet the needs of customers, which leads to problems that are not conducive to market competition.
習知板對板連接器模組之公母端連接器的結構設計容易使得結合後的高度無法再加以縮小的情形,如此導致無法滿足客戶需求及不利於市場競爭的問題。The structural design of the male-female connector of the conventional board-to-board connector module is easy to make the height after the combination cannot be reduced, which leads to the problem that the customer's demand cannot be satisfied and the competition is unfavorable.
本創作提供一種板對板連接器模組,包括一插頭及一插座,其中插頭包括一絕緣本體及設置於絕緣本體之複數端子,絕緣本體具有一頂面,每一個端子具有一接觸部,接觸部突出於頂面,頂面上設有一凸出部。插座包括一金屬框體及被金屬框體所圍繞之一框孔,插頭組裝於插座之框孔中且凸出部延伸突出於框孔外。The present invention provides a board-to-board connector module including a plug and a socket, wherein the plug includes an insulative housing and a plurality of terminals disposed on the insulative housing, the insulative housing has a top surface, and each of the terminals has a contact portion for contacting The portion protrudes from the top surface, and a convex portion is provided on the top surface. The socket includes a metal frame and a frame hole surrounded by the metal frame. The plug is assembled in the frame hole of the socket and the protrusion extends beyond the frame hole.
本創作所提供之板對板連接器模組,其係將公母端連接器中之母端連接器設計成一金屬框體,減少了習知技術中所需要的母端絕緣本體及母端端子,故可有效縮小公母端連接器結合後的高度,並且還可減少組件以降低製造成本,因此可解決習知板對板連接器模組所容易導致之結合後高度無法縮小進而無法滿足客戶需求及不利於市場競爭的問題。此外,在本創作之公端連接器之絕緣本體上還設有一凸出部可卡合於電路板,如此防止可能因為端子接觸反作用力的影響而造成電性接觸不良的問題。The board-to-board connector module provided by the present invention designs the female connector in the male-female connector as a metal frame, which reduces the female insulating body and the female terminal required in the prior art. Therefore, the height of the male and female end connectors can be effectively reduced, and the components can be reduced to reduce the manufacturing cost, so that the combination of the conventional board-to-board connector module can be solved, and the height cannot be reduced, thereby failing to satisfy the customer. Demand and problems that are not conducive to market competition. In addition, a protruding portion can be engaged with the circuit board on the insulating body of the male connector of the present invention, thereby preventing the problem of electrical contact failure due to the influence of the terminal contact reaction force.
請參照第一圖至第六圖所示,本創作之板對板連接器模組1包括一插頭2及與此插頭2對接之一插座3,此插座3設置於一電路板4上,此插頭2設置於另一電路板(未繪示)上。Referring to the first to sixth figures, the board-to-board connector module 1 of the present invention includes a plug 2 and a socket 3 that is mated with the plug 2, and the socket 3 is disposed on a circuit board 4. The plug 2 is disposed on another circuit board (not shown).
插頭2包括一絕緣本體21及設置於絕緣本體21之複數端子22,絕緣本體21係大致呈一矩形體結構,其具有一頂面211、相對頂面211設置之底面212及連接於頂面211與底面212之相對平行設置之二長側面213與二短側面214,絕緣本體21設有複數容置槽215,於頂面211之長度方向的二側向內凹設有該些容置槽215,且該些容置槽215延伸至二長側面213。The plug 2 includes an insulative housing 21 and a plurality of terminals 22 disposed on the insulative housing 21 . The insulative housing 21 has a substantially rectangular structure and has a top surface 211 , a bottom surface 212 disposed opposite the top surface 211 , and a top surface 211 . The two sides 213 and the two short sides 214 are disposed in parallel with the bottom surface 212. The insulating body 21 is provided with a plurality of accommodating grooves 215, and the accommodating grooves 215 are recessed in the two sides of the longitudinal direction of the top surface 211. And the receiving slots 215 extend to the two long sides 213.
複數端子22組裝於該些容置槽215內,每一個端子22具有一接觸部221、一焊接部222與一干涉部223,該干涉部223的兩端係分別連接接觸部221與焊接部222,其中焊接部222向外延伸凸出於絕緣本體21之長側面213外以與另一電路板焊接固定在一起,干涉部223干涉固定於絕緣本體21之容置槽215內以將端子22組裝固定於絕緣本體21,接觸部221突出於頂面211,且干涉部223與接觸部221係呈上下相對設置。The plurality of terminals 22 are assembled in the accommodating slots 215. Each of the terminals 22 has a contact portion 221, a soldering portion 222 and an interference portion 223. The two ends of the interference portion 223 are respectively connected to the contact portion 221 and the solder portion 222. The soldering portion 222 extends outwardly and protrudes from the long side surface 213 of the insulative housing 21 to be soldered and fixed to the other circuit board. The interference portion 223 is interference-fixed in the receiving slot 215 of the insulative housing 21 to assemble the terminal 22. It is fixed to the insulative housing 21, the contact portion 221 protrudes from the top surface 211, and the interference portion 223 and the contact portion 221 are disposed to face each other.
在本實施例中,此接觸部221係包括有二接觸點以形成W型結構,二接觸點延伸突出於絕緣本體21之頂 面211以形成較佳的電性接觸效果。頂面211上設有一凸出部216,且凸出部216係沿著頂面211之長度方向延伸設置,該些端子22之接觸部221平行排列對稱設置於凸出部216的二側。In this embodiment, the contact portion 221 includes two contact points to form a W-shaped structure, and the two contact points extend to protrude from the top of the insulating body 21. Face 211 is used to create a preferred electrical contact effect. A bulging portion 216 is disposed on the top surface 211 , and the protruding portion 216 extends along the longitudinal direction of the top surface 211 . The contact portions 221 of the terminals 22 are symmetrically disposed on two sides of the protruding portion 216 .
插座3包括一金屬框體31及被金屬框體31所圍繞之一框孔32,金屬框體31設置於電路板4上且界定出一搭接區41,搭接區41內設有對應於該些端子22之複數個接點411及對應於凸出部216之一卡槽412,當插頭2組裝於插座3之框孔32中時,絕緣本體21之頂面211係面對於搭接區41設置並且組裝於框孔32內,此時該些端子22電性接觸於該些接點411,但凸出部216則是會延伸突出於框孔32外以卡合固定於卡槽412。The socket 3 includes a metal frame 31 and a frame hole 32 surrounded by the metal frame 31. The metal frame 31 is disposed on the circuit board 4 and defines a landing area 41. The plurality of contacts 411 of the terminals 22 and the corresponding slots 412 of the protruding portion 216, when the plug 2 is assembled in the frame hole 32 of the socket 3, the top surface 211 of the insulating body 21 is facing the overlapping area 41 is disposed and assembled in the frame hole 32. At this time, the terminals 22 are electrically connected to the contacts 411, but the protruding portion 216 extends beyond the frame hole 32 to be engaged and fixed to the card slot 412.
在本實施例中,凸出部216係較該些端子22更為延伸突出於頂面211,使凸出部216能延伸突出於框孔32外以方便卡合固定於電路板4上,且凸出部216的長度係小於卡槽412的深度,如此以避免造成板對板連接器模組1結合後的高度增加。金屬框體31具有一第一框緣311及相對於第一框緣311之一第二框緣312,第一框緣311較第二框緣312鄰近於絕緣本體21之頂面211,且第一框緣311上設有複數個焊接點313,凸出部216係延伸凸出於第一框緣311外。In this embodiment, the protruding portion 216 protrudes from the top surface 211 more than the terminals 22, so that the protruding portion 216 can extend beyond the frame hole 32 to facilitate the locking and fixing on the circuit board 4. The length of the projection 216 is smaller than the depth of the card slot 412, so as to avoid an increase in the height of the board-to-board connector module 1 after bonding. The metal frame 31 has a first frame edge 311 and a second frame edge 312 opposite to the first frame edge 311. The first frame edge 311 is adjacent to the top surface 211 of the insulative housing 21 than the second frame edge 312. A frame edge 311 is provided with a plurality of solder joints 313 extending outwardly from the first frame edge 311.
第一框緣311與第二框緣312之間係形成相對平行設置之二長邊部314與相對平行設置之二短邊部 315,二長邊部314與二短邊部315係互相連接以形成矩形金屬框體31及矩形框孔32,此長邊部314係可對應於絕緣本體21之長側面213,此短邊部315係可對應於絕緣本體21之短側面214。此外,於絕緣本體21的二短側面214上各設有一金屬墊片5,該金屬墊片5設有一干涉點51可干涉於金屬框體31之短邊部315,如此以增加絕緣本體21固持於框孔32的效果。The first frame edge 311 and the second frame edge 312 are formed with two long side portions 314 arranged in parallel and two short side portions arranged in parallel. 315, the two long side portions 314 and the two short side portions 315 are connected to each other to form a rectangular metal frame body 31 and a rectangular frame hole 32. The long side portion 314 can correspond to the long side surface 213 of the insulating body 21, and the short side portion The 315 series may correspond to the short side 214 of the insulative body 21. In addition, a metal spacer 5 is disposed on each of the two short side surfaces 214 of the insulative housing 21, and the metal spacer 5 is provided with an interference point 51 to interfere with the short side portion 315 of the metal frame 31, so as to increase the holding of the insulating body 21. The effect of the frame hole 32.
金屬框體31上設有向外水平延伸之複數個焊接點313,電路板4上設有複數個固定點413,該些焊接點313焊接固定於該些固定點413上,如此以將金屬框體31固定於電路板4上。值得一提的是,此金屬框體31之焊接點313與端子22之焊接部222係位於不同平面上,如此以分別對應焊接固定於電路板4與另一電路板。The metal frame body 31 is provided with a plurality of soldering points 313 extending horizontally outwardly. The circuit board 4 is provided with a plurality of fixing points 413. The soldering points 313 are soldered and fixed to the fixing points 413, so as to place the metal frame. The body 31 is fixed to the circuit board 4. It is worth mentioning that the soldering point 313 of the metal frame 31 and the soldering portion 222 of the terminal 22 are located on different planes, so as to be soldered and fixed to the circuit board 4 and another circuit board respectively.
綜上所述,本創作之板對板連接器模組,其係將公母端連接器中之母端連接器設計成一金屬框體,減少了習知技術中所需要的母端絕緣本體及母端端子,故可有效縮小公母端連接器結合後的高度,並且還可減少組件以降低製造成本,因此可解決習知板對板連接器模組所容易導致之結合後高度無法縮小而無法滿足客戶需求及不利於市場競爭的問題。此外,在本創作之公端連接器之絕緣本體上還設有一凸出部可卡合於電路板,如此防止可能因為端子接觸反作用力的影響而造成電性接觸不良的問題。In summary, the board-to-board connector module of the present invention designs the female connector in the male-female connector as a metal frame, which reduces the female insulation body required in the prior art and The female terminal can effectively reduce the height of the male and female end connectors combined, and can also reduce the components to reduce the manufacturing cost, so that the height of the conventional board-to-board connector module can be reduced, and the height cannot be reduced. Unable to meet customer needs and issues that are not conducive to market competition. In addition, a protruding portion can be engaged with the circuit board on the insulating body of the male connector of the present invention, thereby preventing the problem of electrical contact failure due to the influence of the terminal contact reaction force.
上述詳細說明為針對本創作一種較佳之可行實施例說明而已,惟該實施例並非用以限定本創作之申請專利範圍,凡其它未脫離本創作所揭示之技藝精神下所完成之均等變化與修飾變更,均應包含於本創作所涵蓋之專利範圍中。The above detailed description is intended to illustrate a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation.
1‧‧‧板對板連接器模組1‧‧‧Board to board connector module
2‧‧‧插頭2‧‧‧ plug
21‧‧‧絕緣本體21‧‧‧Insulated body
211‧‧‧頂面211‧‧‧ top surface
212‧‧‧底面212‧‧‧ bottom
213‧‧‧長側面213‧‧‧ long side
214‧‧‧短側面214‧‧‧ Short side
215‧‧‧容置槽215‧‧‧ accommodating slots
216‧‧‧凸出部216‧‧‧protrusion
22‧‧‧端子22‧‧‧ Terminal
221‧‧‧接觸部221‧‧‧Contacts
222‧‧‧焊接部222‧‧‧Weld Department
223‧‧‧干涉部223‧‧‧Interference Department
3‧‧‧插座3‧‧‧ socket
31‧‧‧金屬框體31‧‧‧Metal frame
311‧‧‧第一框緣311‧‧‧ first frame
312‧‧‧第二框緣312‧‧‧second frame
313‧‧‧焊接點313‧‧‧ solder joints
314‧‧‧長邊部314‧‧‧Longside
315‧‧‧短邊部315‧‧‧ Short side
32‧‧‧框孔32‧‧‧Box hole
4‧‧‧電路板4‧‧‧ boards
41‧‧‧搭接區41‧‧‧ lap area
411‧‧‧接點411‧‧‧Contacts
412‧‧‧卡槽412‧‧‧ card slot
413‧‧‧固定點413‧‧‧ fixed point
5‧‧‧金屬墊片5‧‧‧Metal gasket
51‧‧‧干涉點51‧‧‧ Interference points
第一圖係本創作之板對板連接器模組的組合立體示意圖。The first figure is a combined perspective view of the board-to-board connector module of the present invention.
第二圖係第一圖之板對板連接器模組將插頭與插座分開的立體示意圖。The second figure is a three-dimensional schematic diagram of the board-to-board connector module of the first figure separating the plug from the socket.
第三圖係第一圖之板對板連接器模組將電路板隱藏的組合立體示意圖。The third figure is a combined perspective view of the board-to-board connector module of the first figure hiding the circuit board.
第四圖係第三圖之板對板連接器模組的立體分解示意圖。The fourth figure is a three-dimensional exploded view of the board-to-board connector module of the third figure.
第五圖係第一圖之板對板連接器模組沿AA線段的剖面示意圖。The fifth figure is a schematic cross-sectional view of the board-to-board connector module of the first figure along the AA line segment.
第六圖係第三圖之板對板連接器模組沿BB線段的剖面示意圖。The sixth figure is a cross-sectional view of the board-to-board connector module of the third figure along the BB line.
1‧‧‧板對板連接器模組1‧‧‧Board to board connector module
2‧‧‧插頭2‧‧‧ plug
216‧‧‧凸出部216‧‧‧protrusion
22‧‧‧端子22‧‧‧ Terminal
3‧‧‧插座3‧‧‧ socket
311‧‧‧第一框緣311‧‧‧ first frame
313‧‧‧焊接點313‧‧‧ solder joints
314‧‧‧長邊部314‧‧‧Longside
315‧‧‧短邊部315‧‧‧ Short side
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101215854U TWM447608U (en) | 2012-08-16 | 2012-08-16 | Board-to-board connector module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101215854U TWM447608U (en) | 2012-08-16 | 2012-08-16 | Board-to-board connector module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM447608U true TWM447608U (en) | 2013-02-21 |
Family
ID=48194992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101215854U TWM447608U (en) | 2012-08-16 | 2012-08-16 | Board-to-board connector module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM447608U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410541A (en) * | 2015-02-06 | 2017-02-15 | 泰科电子(上海)有限公司 | Electrical connector assembly |
| TWI720299B (en) * | 2017-06-06 | 2021-03-01 | 日商廣瀨電機股份有限公司 | Electrical connector |
-
2012
- 2012-08-16 TW TW101215854U patent/TWM447608U/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410541A (en) * | 2015-02-06 | 2017-02-15 | 泰科电子(上海)有限公司 | Electrical connector assembly |
| TWI580127B (en) * | 2015-02-06 | 2017-04-21 | 泰科電子(上海)有限公司 | Electrical connector assembly |
| CN106410541B (en) * | 2015-02-06 | 2020-10-13 | 泰科电子(上海)有限公司 | electrical connector assembly |
| TWI720299B (en) * | 2017-06-06 | 2021-03-01 | 日商廣瀨電機股份有限公司 | Electrical connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |