特別是指一種液冷式Especially a liquid-cooled
吸熱板ill是貼靠在圖形處理器13上， 是間隔突設於吸熱板⑴上，該風扇^ 鰭片112，藉以排散熱量。 M323069 八、新型說明: 【新型所屬之技術領域】 本新型是有關於一種吸熱裝置 吸熱裝置。 【先前技術】 運作過程中，有些電子零件會產生高溫，所以通常需要利 用一些吸熱裝置來魏«，而料來業界已陸續研發出 t ^ f II ± ^ ^ n mi (vide〇 Grapliics Army ，簡稱VGA)上的吸熱裝置來說明。 如圖1、2所示，一般視訊控制卡丨大致包含一水平基 板12，及一固定地安裝在該基板12上之圖形處理器 (Graphic Processing Unit，簡稱 Gp^ 包含一吸熱板111、複數散熱鰭片112，及一風扇113。j 此種吸熱裝置11雖然能排散熱量，然而其僅僅利用空 氣的流動來散熱，難以即時快速地帶走大量的熱量，特別 是圖形處理器13於運轉時會產生較多熱量，其周圍的螃境 的空氣溫度亦會隨之昇高，所以散熱效果較差，而有待改 M323069 【新型内容】 即在提供一種散熱敛果佳之液 因此，本新型之目的 冷式吸熱裝置。The heat absorbing plate ill is abutted on the graphic processor 13 and is spaced apart from the heat absorbing plate (1). The fan fins 112 are arranged to dissipate heat. M323069 VIII. New description: [New technical field] The new type is related to a heat absorbing device. [Prior Art] During the operation, some electronic parts will generate high temperature, so it is usually necessary to use some heat absorbing devices to make it, and it is expected that the industry has developed t ^ f II ± ^ ^ n mi (vide〇Grapliics Army, abbreviated The heat sink on VGA) is explained. As shown in FIG. 1 and FIG. 2, the general video control card 丨 generally includes a horizontal substrate 12, and a graphic processing unit (Graphic Processing Unit, Gp^ includes a heat absorbing plate 111, and a plurality of heat dissipation units) fixedly mounted on the substrate 12. The fin 112 and a fan 113. j. Although the heat absorbing device 11 can dissipate heat, it only uses the flow of air to dissipate heat, and it is difficult to quickly and quickly take away a large amount of heat, especially when the graphics processor 13 is in operation. It will generate more heat, and the air temperature around the surrounding environment will also increase accordingly, so the heat dissipation effect is poor, and it is necessary to change M323069 [new content] that is to provide a kind of liquid that dissipates heat and concentrates. Therefore, the purpose of this new type is cold. Heat sink.
於是，t新型液冷式吸熱裝置，適用於散除一發熱元 件f生之.熱置’亚包含—水冷座及一設置於水冷座旁側之 水箱f。該水冷座包括—可靠抵於該發熱元件的導熱基板 盍口又於¥熱基板上之外殼體，及多數間隔凸設於導熱 土板内側面之散熱片’該外殼體具有―注水孔，且該外 殼體、導熱基板與該等散熱縛片相配合界定出_可使注水 孔饥入之I體流、㈣等散熱鰭> 的導流空間。該水箱座是 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ t ^ Γί ^ J. ^ ^ - ^ ^ ^ ^ ^ 攻底點處連通之出水管。 【實施方式】 、有關本新型之前述及其他技術内容、特點與功效，在 Μ下配合參考圖式之三個較佳實施例的詳細說明中，將可 曰1本新型被詳細描述之前，要注意的是，在以下的說 月内谷中，類似的元件是以相同的編號來表示。 如圖3〜5所示，本新型液冷式吸熱裝置之第一較井杏 二例適用於組裝在―發熱元件21上，在本實施例中，該發 YGA ^(Vldeo Graphics Array ^ θ 士 處理為（Graphic Processing Unit，簡稱 GPU) 忒液冷式吸熱裝置是水平靠抵於該發熱元件21底面， 6 M323069 但實施時’可依據發熱元件2,之類型與設置位置而改變該 液冷式吸熱裝置之設置方式，不以上述為限。 该液冷式散設裝置包含一可用以抵接於讓發熱元件21 底面之水冷座3，&-連通固接於水冷座3左側之水箱座4 。該水冷座3包括一由導熱佳之材料製成的水平導熱基板 31、多數間隔前後延伸且平行地突設於導熱基板31底面之 散熱鯖片32、三間隔突設於導熱基板3 i底面且分別介於二Therefore, the new liquid-cooled heat absorbing device is suitable for dissipating a heat generating component. The heat setting includes a water cooling seat and a water tank f disposed beside the water cooling seat. The water-cooling base includes a heat-conducting substrate that is reliably opposite to the heat-generating component and an outer casing on the heat-generating substrate, and a plurality of fins that are spaced apart from the inner side of the heat-conducting soil plate. The outer casing has a water injection hole, and The outer casing and the heat-conducting substrate cooperate with the heat-dissipating tabs to define a flow guiding space for the I-flow, the (four) heat-dissipating fins of the water-filling hole. The water tank seat is ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ t ^ Γί ^ J. ^ ^ - ^ ^ ^ ^ ^ The outlet pipe connected at the bottom point. [Embodiment] With regard to the foregoing and other technical contents, features and effects of the present invention, in the detailed description of the three preferred embodiments of the reference drawing, the present invention will be described in detail before Note that in the following intra-month valley, similar components are denoted by the same reference numerals. As shown in FIG. 3 to FIG. 5, the first two cases of the liquid-cooled heat absorbing device of the present invention are suitable for being assembled on the heating element 21. In the present embodiment, the YGA ^ (Vldeo Graphics Array ^ θ 士Processing (Graphic Processing Unit, GPU for short) The liquid-cooling type heat absorbing device is horizontally opposed to the bottom surface of the heating element 21, 6 M323069, but the liquid cooling type can be changed according to the type and setting position of the heating element 2 when implemented. The heat-absorbing device is not limited to the above. The liquid-cooling device includes a water-cooling seat 3 that can be used to abut the bottom surface of the heating element 21, and a water tank seat that is fixed to the left side of the water-cooling seat 3 4. The water-cooling base 3 includes a horizontal heat-conducting substrate 31 made of a material having good heat conductivity, a plurality of heat-dissipating fins 32 extending from the bottom surface of the heat-conducting substrate 31 extending in a front-rear direction and extending in parallel, and three spacers protruding from the bottom surface of the heat-conducting substrate 3 i And between two
相鄰散熱鰭片32間之分隔板33，及一覆蓋該等散埶钱片 32與分隔板33地以其周緣固接於導熱基板3ι底面之^體 狀外殼體34。 料殼體34是以其底壁342抵接於該等散熱鰭片μ 舆分隔板33底側邊，並具有一貫穿其内、外周面之朝前注 水孔341，且該外殼體34、導熱基板3! _ 相配合界定出一導流空間3〇。而 太 ‘、、、"、 而左右兩外侧之分隔板33 疋勿別以其前側邊與外殼體34内周面抵接，相對中間之分 ^ ^ 33 ^^ ^ ^ ^ # 34 ^ ^ ^ ^ ^ ^ ^ ^ - :爲間3。區隔成一條物^ 間之早向迴流道。 埶其Γ水箱座4包括一由導崎 熱基板31左側邊之連接板4卜—開口朝上且4周緣^ 於連接板41底面並鱼外發，3 -連通固接於箱體‘繁=之蓋_ =半部具有—往下突伸之下凸部你且該水箱/Γ 連接板仆與外殼體34相配合界定出_與該她^ 7 M323069 逋，且涵蓋連接板 乂谷衮空間40 ’ 5亥谷裳空間40容積大於該導流空間3〇 / ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ’ 该出水管 43 是 連通設於箱體42之下凸部421前側面诉危、直# 田近底邊處，並具有一 與答裝空間40近最低點處連通之進水口 431。 在本實施例中，該導熱基板3V與連接板^是一體 型製成，而外殼體34是與箱體42相逯技、， 旦 从 ， 迷接，亚透過將相連 接之外殼體34與箱體42 -起蓋設於導熱基板31盘連接板 41上，而構成該液冷式吸熱裝置，但實施時，水冷座3盘 水箱座4之組接結構不以此為限。 八 該液冷式吸熱裝置使用時，是將—體相連之料 :=接，4i組裝固定於VGA卡2底面，使該導熱基板 接貼覆罪抵於該發熱元件21底面。且使用時，該水冷The partitioning plate 33 between the adjacent heat radiating fins 32 and the body outer casing 34 which is fixed to the bottom surface of the heat conducting substrate 31 by the peripheral edge of the heat sinking substrate 32 and the partitioning plate 33. The material housing 34 is abutted against the bottom side of the heat dissipating fins 舆 33 by the bottom wall 342 thereof, and has a front water injection hole 341 extending through the inner and outer peripheral surfaces thereof, and the outer casing 34, The thermally conductive substrate 3! _ cooperates to define a flow guiding space 3〇. And the partition plates 33 of the left and right sides of the right and left sides do not abut the inner peripheral surface of the outer casing 34 with the front side thereof, and the middle portion is ^ ^ 33 ^^ ^ ^ ^ # 34 ^ ^ ^ ^ ^ ^ ^ ^ - : For Inter 3 . The area is separated into an early return to the track.埶 Γ Γ 4 4 包括 包括 包括 4 4 由 由 由 由 由 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧 左侧The cover _ = half has - the lower projection under the convex part and the water tank / Γ connecting plate servant and the outer casing 34 cooperate to define _ with the her ^ 7 M323069 逋, and cover the connection plate 乂谷衮 space 40 '5 Haigushang space 40 volume is larger than the diversion space 3〇/ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ' The outlet pipe 43 is connected to the front side of the convex portion 421 below the box 42 to complain of danger, straight #田 near the bottom edge, and has a water inlet 431 that is connected to the lowest point of the answering space 40. In this embodiment, the heat-conducting substrate 3V and the connecting plate are integrally formed, and the outer casing 34 is similar to the casing 42 and is connected to the outer casing 34. The casing 42 is disposed on the heat transfer substrate 31 and the disk connection plate 41 to constitute the liquid-cooled heat absorbing device. However, the assembly structure of the water-cooling base 3 and the water tank seat 4 is not limited thereto. 8. When the liquid-cooled heat absorbing device is used, the material connected to the body is connected to the body: =, and 4i is assembled and fixed on the bottom surface of the VGA card 2, so that the heat-conducting substrate is covered against the bottom surface of the heating element 21. And when used, the water is cold
^ 3 341 ^ 4 ^ 43^ Μ ώ I 水管(圖未示）而連通至一幫書「 一 逆通主帛浦Λ圖未不），且會先於該水 相座4與水冷座3中填滿冷卻用液體。 ^ ^ f ^ M 40 ^ 鉍、工出水官43之進水口 43 1而進入該等水管中，並經由外 双體34之注水孔341進入導流空間30中，使進入導流空 、、之液體迂迴彎折流動地逐漸通過該等散熱鰭片32，而 31 ^ 32 ^ 二^ ▼走’且被該等散熱鰭片32之熱量加熱的液體流出導 旦、J 3〇而進入容裝空間40時，會立即與溫度較低之大 、、體進仃此合降溫，然後再次被幫浦經由該出水管43抽 出進订ί盾，；隹工—r* 可恆以容裝空間40内之較低溫液體餘該 8 M323069 進丁/牛，皿。另外，位於容裝空間40中且勺 覆於外殼體34外的谅騁 ★入丨^ ^ ^ ^ 匕 的液體，亦會吸收傳遞至連接板41盥外 殼體34的熱量，而有助於熱量之散除。 43與外殼體34之注皮；p丨：0^ ^ ^ ^ ^ ' 尺孔341間的水管進行循環流動， 時間循環降溫過程中，難备么士 ^ 肀難免會有一些液體經由水管本身或 水管與液冷式吸熱裝置之組接_蒸發掉，而造成容“ 間4〇内之液體減少，但是透過將該出水管43之進水口^； 設置在下凸部421折矻、息忐 、底邊處，而與容裝空間40近最低點處 j通的結構料，即使容裝” 4Q㈣水位㈣低，出水 B 43仍會維持在液面下，而可確保在—段很長的時間内， 一定會有液體可被幫浦打人水管與導流空間30中進行循環 但乂騎’該出水管43不以設置下凸部421前側面近 底邊，為》亦可設置於箱體42任一側面之較高處，_ 並將°亥出水官43位於容裝空間40内的區段設計成 往下料延伸靠近下時>1魏面近底緣處，而使進水 間40内剩餘的液轉隹、 且進仃循裱P牛溫，使該液冷式吸熱裝置可 維持一定之降溫水準。 另外’該液冷式吸熱裝置亦可改成直立設置於發熱元 件（圖未示）旁側，如圖7〜9所示，此時，該出水管衫可 峨上下延伸地插裝於箱體42上，並往下延伸入容裝空 中'^使其進水σ 43】鄰近容襄空間4〇最低點處， M323069 或者是設計成連通固接於箱體42左側面近底邊處，或設計 成連通固接於箱體42底面。^ 3 341 ^ 4 ^ 43^ Μ ώ I The water pipe (not shown) is connected to a bunch of books "one reverses the main 帛 Λ Λ 未"), and will precede the water phase seat 4 and the water cooling seat 3 Filling the liquid for cooling. ^ ^ f ^ M 40 ^ 铋, the water inlet 43 1 of the working water outlet 43 enters the water pipes, and enters the flow guiding space 30 through the water injection hole 341 of the outer double body 34, so as to enter The liquid that is diverted, and the liquid flows back and forth through the fins 32, and the liquid that is heated by the heat of the fins 32 flows out of the guide, J 3 When entering the container space 40, it will immediately cool down with the lower temperature, and the body will enter the package. Then, the pump will be pulled out again by the outlet pipe 43. The completion-r* can be constant. The lower temperature liquid in the containing space 40 leaves the 8 M 323 069 into the diced / ox, dish. In addition, the liquid in the accommodating space 40 and the spoon over the outer casing 34 is a liquid of the 骋 ^ ^ ^ ^ 匕It also absorbs the heat transferred to the outer casing 34 of the connecting plate 41, and contributes to the dissipation of heat. 43 and the outer casing 34; p丨: 0^ ^ ^ ^ ^ ' Circulating flow between the water pipes, during the time cycle cooling process, it is difficult to prepare a shovel ^ 肀 Inevitably there will be some liquid through the water pipe itself or the water pipe and the liquid-cooled heat absorbing device combination _ evaporation, resulting in a volume of 4 〇 The liquid is reduced, but the water inlet of the outlet pipe 43 is disposed at the lower convex portion 421 at a fold, a bottom, and a bottom edge, and the structural material that passes through the lowest point of the accommodation space 40 is even filled. 4Q(4) The water level (4) is low, and the water B 43 will remain below the liquid level, and it can be ensured that in the long period of time, there will be liquid that can be circulated by the pumping water pipe and the diversion space 30. The rider's water outlet 43 is not disposed at the lower side of the front side of the lower convex portion 421, and may be disposed at a higher position on either side of the casing 42, and is located in the accommodation space 40. The section is designed to extend to the lower part when the material is near to the bottom of the surface, and the remaining liquid in the water inlet 40 is turned, and the temperature of the water is increased, so that the liquid is cooled slowly. The device can maintain a certain level of cooling. In addition, the liquid-cooled heat absorbing device can be changed to an upright device. It is placed on the side of the heating element (not shown), as shown in Figures 7-9. At this time, the water outlet shirt can be inserted into the box 42 with the upper and lower extensions extending downwards into the air container. The water inlet σ 43 is adjacent to the lowest point of the housing space 4 , and the M323 069 is designed to be connected to the bottom side of the left side of the box 42 or to be connected to the bottom surface of the box 42 .
^見^日寸’亦可在該箱體42上設置一可供補充散熱用液 體的開口機構（圖未示），而於必要時，適時補充容裝空間 40中之液體，以便使該液冷式吸熱裝置維持最佳之降溫效 果:但實施時不以此為限。在本實施例中，談水冷座3之 遠等散熱鰭片32與分隔板33 f是—體成型於導熱基板31 上，但實施時，該等散熱鰭片32與分隔板33之數量與設 置方式皆不以此為限’且亦不以設置該等分隔板33為必要 ^另外，該箱體42之下凸部421設置位置亦可依需要而改 又’不以上逑位置輕’例如可往下突設於箱體Μ右端部 或中間部位等’且不以設置該下凸部42 i為必要。 7圖0所示，本新型液冷式吸熱裝置之第二較佳實施 例與第-實施懸異處僅在於：該水箱座4之箱體社構 。以下僅針對本實_㈣—實施财麟進行朗〆 在本實施例中，該箱體42是與外殼體34之導流空間 3〇連通地-體固接於該外殼體％左側邊，而未涵蓋外:體 34,底面。透過此種組接結構設計，仍然可利用容裝空間仂 ^ ^ ^ ^ ^ 3 〇 ^ ^ ^ μ # m ^ , ^ # f ^ ^ f ^ 2的熱里▼走，而達到散熱的功效。但實施時，該箱 42 外型不以此為限' ^ ^ ^ ^ ^ ^ 且 如® 11 '12所示’本新型液冷式吸熱裝置之第三幸 實施例與第—實施例不同處在於:水箱座4與水冷座 組接結構設計。 V厓3之 10 M323069 在本實施例中，該水冷座3之外殼體34 f向導熱基板 31 ^ ® a f 1¾ ^ f ^ ^ 30 ^ ^ it it iL 343 〇 水箱座4未設置連接板4 L，且該箱體42是以其周緣往上黎 與該連通孔343連通，且覆蓋外辟髀、广 — 产 y卜双體34底面之容裝空間4〇 。該出水管43是固接於箱體42 ,本 、， + 2右牛邛，亚與容裝空間40 近最低點處連通。 透過上述結構設計，可利用、为騁 士 ^用液體進入導流空間3〇且流^ see the "day" can also be provided on the box 42 an opening mechanism (not shown) for replenishing the heat-dissipating liquid, and if necessary, replenish the liquid in the housing space 40 in time to make the liquid The cold heat sink maintains the optimum cooling effect: but it is not limited to this. In the present embodiment, the far fins 32 and the partition plates 33 f of the water-cooling base 3 are integrally formed on the heat-conducting substrate 31, but in implementation, the number of the fins 32 and the partition plates 33 are implemented. And the setting method is not limited thereto, and it is not necessary to provide the partitioning plate 33. In addition, the position of the convex portion 421 under the casing 42 can be changed as needed. For example, it may be protruded downward from the right end portion or the intermediate portion of the casing, and the like, and it is not necessary to provide the lower convex portion 42 i. As shown in Fig. 0, the second preferred embodiment and the first embodiment of the liquid-cooled heat absorbing device of the present invention are only in the box structure of the water tank base 4. In the present embodiment, the box body 42 is connected to the flow guiding space 3 of the outer casing 34, and the body is fixed to the left side of the outer casing body. Not covered: body 34, bottom. Through the design of the assembly structure, the heat dissipation of the 仂 ^ ^ ^ ^ ^ 3 〇 ^ ^ ^ μ # m ^ , ^ # f ^ ^ f ^ 2 can still be utilized to achieve the heat dissipation effect. However, when implemented, the shape of the box 42 is not limited to ' ^ ^ ^ ^ ^ ^ and as shown in the ® 11 '12 'the third embodiment of the liquid cooling type heat sink is different from the first embodiment. It is: the structure design of the water tank base 4 and the water cooling seat. In the present embodiment, the outer casing 34 f of the water-cooling base 3 guides the hot substrate 31 ^ ® af 13⁄4 ^ f ^ ^ 30 ^ it it iL 343 The water tank seat 4 is not provided with the connecting plate 4 L And the box body 42 is connected to the communication hole 343 by its peripheral edge, and covers the accommodation space 4〇 of the bottom surface of the outer ridge and the wide yab body 34. The water outlet pipe 43 is fixed to the casing 42 and is connected to the lowest point of the container space 40. Through the above structural design, it can be utilized, and the liquid is used to enter the flow guiding space and flow.
經該等散熱鰭片32，來逐漸脾|舳一从V 木I新將發熱兀件21傳遞至導熱基板 31的熱量帶走，並使流出導流*門n夕1 / 命机工間30之液體經由該連通孔 343進入容裝空間40，而可先盥容梦 兀谷衣工間4〇内之較低溫液 體進行混合降溫後，再由出光总n μ八 丹田出水官43排出至外部循環降溫， 仍然可快速散除發熱元件21荖头夕刼曰 丁 u產生之熱ϊ，進而避免發熱元 件21溫度過局。 貫施日$ ’本貫施例之液人彳 + 、欣，式吸熱I置亦可以導熱基板 31直立罪抵發熱元件21，而兮屮士其η ^ … 出水官43則可採用第一實 施例之圖7〜9所揭示之結構設朴 每力士丁 得叹。卞但貝施日寸不以此為限。 歸納上述’透過以循環液體將傳導至該水冷座3之該 等散熱鰭片32的熱量帶走的讯斗 田 疋的双汁，可利用容裝空間4〇内 之怪較低温液體快速地散除傳導至該等散熱鰭片32的軌量 ，進而快速地降低發熱元件21之溫度，相較於習知單純以 空氣對流的散熱方式’具有極佳之散熱效果。再加上於出 水管43之進水口 431會連通於容裝空間4〇近底緣處的結 構設計’即使容裝空間4〇餐體水位出現下降，仍然可以 11 M323 069 =裝空間40内剩餘的液體進行循環降溫，使該液冷式吸熱 之目的有疋水準之降溫效果。因此，確實可達到本新型 ^惟以上所述者，僅為本新型之三較佳實施例而已，當 不:以此限疋本新型實施之範圍，即大凡依本新型申請專 仍屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1疋白知空氣對流式吸熱裝置之立體圖; 圖2是該習知吸熱裝置組裝於一 vga卡上的側視圖; 體分Ξ圖3是本新型液冷式吸熱衷置之第一較佳實施例的立 圖4疋4第一較佳實施例之俯視剖面圖； 圖5疋5亥第一較佳實施例之前側視剖面圖； 另二6二較佳實施例的左側視圖’說明-…的 料出圖水一較佳實施例直立設置時之前側視圖，說 明及出水官之另一設置型態； 態；圖8是類似圖7之視圖，說明嶋 態； 圖9是類似圖8之視圖，說明該出水管 之另一設置型 施例的前 圖10是本新型液冷式吸熱裝置之第二較佳者 侧視剖面圖〆 ^ ^ ^ ^ ^ ^ Μ 12 M323 069 圖11是本新型液冷式吸熱裝置之第三較佳實施例的立 體圖；及 圖12是該第三較佳實施例的前側視剖面圖。 13 M323 069 【主要元件符號說明】 2....... • •••VGA 卡 342···. ...底壁 21 .···· ....發熱元件 343.... ...連通孔 3........ ....水冷座 4 ....... ...水箱座 30 ..... ....導流空間 40 ..... ...容裝空間 31 ..... ....導熱基板 41 ..... ...連接板 32 ..... ....散熱鰭片 42 ·…· …箱體 33 ..... 421.... ...下凸部 34 ..... ....外殼體 43 ..... ...出水管 341.... ……注水孑L 431 .... ...進水口 14Through the heat dissipating fins 32, the spleen is gradually taken away from the heat transferred from the V wood I to the heat conducting substrate 31, and the outflow diversion is performed. The liquid enters the accommodating space 40 through the communication hole 343, and the lower temperature liquid in the 4 兀 兀 衣 衣 衣 衣 进行 进行 进行 进行 进行 进行 进行 进行 混合 混合 混合 兀 兀 兀 兀 兀 兀 兀 兀 兀 丹 丹 丹 丹 丹 丹By circulating the temperature, the heat generated by the heating element 21 can be quickly dissipated, thereby avoiding the temperature of the heating element 21 from passing through. Through the implementation of the daily '$ 本 施 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 For example, the structure disclosed in Figures 7 to 9 is designed to be sighed by Rex.卞 But Besch is not limited to this. The above-mentioned 'six juices of the hoppers that are carried away by the heat of the heat-dissipating fins 32 that are conducted to the water-cooling seat 3 by the circulating liquid can be quickly dispersed by using the strange lower-temperature liquid in the housing space. In addition to the amount of rails that are conducted to the heat dissipating fins 32, the temperature of the heat generating component 21 is quickly lowered, which has an excellent heat dissipation effect compared to the conventional heat dissipation method of air convection. In addition, the water inlet 431 of the water outlet pipe 43 is connected to the structural design of the container space 4 near the bottom edge. Even if the water level of the container space 4 is lowered, it can still be 11 M323 069 = the remaining space in the space 40 The liquid is circulated and cooled, so that the purpose of the liquid-cooled heat absorption is to achieve a leveling effect. Therefore, it is true that the above-mentioned novels are only described above, and are only the preferred embodiment of the present invention. When not, the scope of the present invention is limited to the scope of the present invention. Within the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an air convection heat absorbing device; FIG. 2 is a side view of the conventional heat absorbing device assembled on a vga card; FIG. 3 is a novel liquid cooling type absorbing heat A top cross-sectional view of the first preferred embodiment of the first preferred embodiment of the first preferred embodiment; FIG. 5 is a side elevational view of the first preferred embodiment of the first preferred embodiment; The left side view of the description of the water supply of the preferred embodiment is a front side view of the preferred embodiment, and another setting type of the water discharge officer; FIG. 8 is a view similar to FIG. Figure 9 is a view similar to Figure 8, illustrating a front view of another embodiment of the outlet pipe, Figure 10 is a second preferred side view of the liquid-cooled heat sink of the present invention. ^ ^ ^ ^ ^ ^ Μ 12 is a perspective view of a third preferred embodiment of the liquid-cooled heat sink of the present invention; and FIG. 12 is a front side sectional view of the third preferred embodiment. 13 M323 069 [Description of main component symbols] 2....... • ••• VGA card 342···....Bottom wall 21·····....heating element 343.... ...Connecting hole 3..............Water cooling seat 4....... Water tank seat 30 ..... .... Diversion space 40 ... .. ...receiving space 31 ..... ....thermal substrate 41 ..... ... connection plate 32 ..... .... heat sink fin 42 ·...·box Body 33 ..... 421.... lower convex portion 34 ..... .... outer casing 43 ..... ... water outlet 341.... ...... water injection 孑L 431 .... ...water inlet 14