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TWM383720U - Heat dissipation plate - Google Patents

Heat dissipation plate Download PDF

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Publication number
TWM383720U
TWM383720U TW098222952U TW98222952U TWM383720U TW M383720 U TWM383720 U TW M383720U TW 098222952 U TW098222952 U TW 098222952U TW 98222952 U TW98222952 U TW 98222952U TW M383720 U TWM383720 U TW M383720U
Authority
TW
Taiwan
Prior art keywords
heat sink
mesh
wall
mesh body
columns
Prior art date
Application number
TW098222952U
Other languages
Chinese (zh)
Inventor
Jun-Hong Lin
Zhang-Yin Chen
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW098222952U priority Critical patent/TWM383720U/en
Publication of TWM383720U publication Critical patent/TWM383720U/en
Priority to US12/956,241 priority patent/US20110132578A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M383720 五、新型說明: 【新型所屬之技術領域】 本創作為散熱板,特別是關於一種將壓扁之熱管與支撐择構 緊密結合,而形成良好之熱傳導結構者。 【先前技術】M383720 V. New description: [New technical field] This creation is a heat sink, especially for a kind of heat transfer structure that combines the flattened heat pipe with the support structure to form a good heat conduction structure. [Prior Art]

按’散熱板一般係由銅片構成密閉中空殼體,其中空部分被 抽成真空並填入工作流體,殼體内壁則附有毛細結構,然在抽真 空過程中,製程上難啸制最後的燒結品質,為使散熱板表面達 成均勻平整,f會在巾妓體喊人支撐結構,傳統的支撐結構 有利用銅網,縣酬上形紐數波綠支撐面,以切中空殼 體之上、下麵者,亦有於衫殼體㈣成複數支撐柱者。 j ,购網為支撐結構者,綱上需形成複數波浪狀支撐面, 製程較為絲;若_支撐柱為支撐結構者,聽齡與上 兩塊散熱板,透過料健結合’亦不方便。 有鑑槪’摘叙係為改善靖虹叙敎 ::;r:r称彡觸—_物艰改善上述 【新型内容】 撐結:::::。’在於提供-種利用熱管妓内部塞人支 本創作之另—曰 、’在提供—種由峨體結合倾所構成 3 M383720 的支撐結構。 本創作之再一目的, 樓結構的柱體上的毛細結 在於提供一種形成於散熱板的内壁及支 構’以達成良好之熱性傳導。 【實施方式】 、:、、、使貝審查委員能更進一步瞭解本創作之特徵及技術内 容’請參閱以下有關本創作之詳細說明與附圖,然而賴圖式僅 提供參考與說_ ’鱗峰對本創作純限制者。 -月參考第-圖’本案係為一種散熱板工,係包括一殼體1 1 及一支撐結構12,其中: 該成體11,其内部係形成有一容置空間丄丄2,包圍容置 空間112之内壁111的壁面設有銅粉之毛細結構丨丄丄a。 該支撐結構1 2,其係包含網.狀體2 2 i及複數個柱體丄2 2 ’該網狀體121係具有複數個孔洞丄2丄i,以及複數個結 合孔1212,該複數個結合孔丄2 i 2略大於孔洞丄2丄工, 其中該網狀體121自該結合孔1212之四端延伸突出數個固 定件1213,圖情示為扣勾形式,用以挾_滅122, 但不以此為限制,該固定件!2 i 3該與網狀體丨2 i之平面形 成有夾角(如第四圖),該等柱體i 2 2係分別插入該等結合孔丄2 12 ’藉由該固定件1213令該等柱體12 2分別結合固定於 該網狀體1 2 T_L ’且該體i 2 2之上、下端面分別抵持於 該内壁111。 、 藉此’待該散熱板1脉 1會將廢熱迅迷傳導至每轉(_上,底部之内壁i i ⑴’達成良好的散熱效:體^ 易。 此結構間早,且製作過程較為容 ir=22’軸可她域構(圖略)。 該殼體11係可為壓過之橢_管體,可 直接於橢_官體之容置空 丁 圓形管體進行壓扁、抽直空 “ 12 ’再對橢 ,最後形成扁平狀,以達到利 ,、圖所不 成散熱板的目的。㈤用熱賴扁㈣紅支撐結構而形 雖然本新型以前述之實施例揭露如上,然其並非用以限定本 :型。在不脫離本新型之精神和範_,所為之更動與潤飾,均 屬本新狀專娜護翻。本新型所界定之賴範圍請 所附之申請專利範圍。 ^ 【圖式簡單說明】 第一圖為本創作實施例之分解圖。 第二圖為摘作實酬之支撐結構之立體圖。 第三圖為摘作實酬之支撐結構之側視圖。 第四圖為本創作實補之域結構之局做大分解圖。 第五圖為本創作實補之麗扁前技合剖視圖。 第六圖為本創作實施例之壓扁後之組合剖視圖。 M383720 ' 【主要元件符號說明】 I ...............................散熱板 II .............................殼體 III ...........................内壁 . 112...........................容置空間 111a..........................毛細結才冓 • 12.............................支撐結構 121...........................網狀體 1211 .........................孔洞 1212 .........................結合孔 1213 .........................固定件 122...........................柱體According to the 'heat sink, the hollow plate is generally composed of copper sheets. The hollow part is vacuumed and filled with working fluid, and the inner wall of the shell is attached with capillary structure. However, during the vacuuming process, it is difficult to make a process. The final sintering quality, in order to achieve a uniform flat surface of the heat sink, f will scream the support structure in the body of the towel, the traditional support structure has the use of copper mesh, the county pays the shape of the wave green support surface, to cut the hollow shell Above and below, there are also those who have a plurality of support columns in the shirt shell (4). j. If the purchase network is a support structure, it is necessary to form a plurality of undulating support surfaces, and the process is relatively silky; if the support column is a support structure, it is also inconvenient to listen to the age and the upper two heat dissipation plates. In view of the fact that the review is to improve the Jinghong Xuan ::: r: r called the touch - _ things difficult to improve the above [new content] support:::::. It is to provide a support structure for the use of heat pipes, internal cages, and 3, 'providing a kind of 3 M383720. A further object of the present invention is that the capillary on the column of the floor structure provides an inner wall and support formed on the heat sink to achieve good thermal conduction. [Embodiment]:,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Peak is purely limited to this creation. - 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The wall surface of the inner wall 111 of the space 112 is provided with a capillary structure 铜a of copper powder. The support structure 12 includes a mesh body 2 2 i and a plurality of columns 丄 2 2 '. The mesh body 121 has a plurality of holes 丄 2 丄 i, and a plurality of bonding holes 1212, the plurality of The coupling hole 2 i 2 is slightly larger than the hole 丄 2, wherein the mesh body 121 extends from the four ends of the coupling hole 1212 to protrude a plurality of fixing members 1213, which are shown as a buckle shape for 挟_灭122 , but not as a limitation, the fixture! 2 i 3 is formed at an angle with the plane of the mesh body i 2 i (as shown in the fourth figure), and the columns i 2 2 are respectively inserted into the coupling holes 12 2 12 ′ by the fixing member 1213 The pillars 12 2 are respectively fixed and fixed to the mesh body 1 2 T_L ', and the lower surface of the body i 2 2 is respectively abutted against the inner wall 111. By this, 'waiting for the heat sink 1 pulse 1 will transfer the waste heat to each revolution (_ upper, bottom inner wall ii (1)' to achieve good heat dissipation: body ^ easy. This structure is early, and the production process is more The ir=22' axis can be her domain structure (figure omitted). The shell 11 can be a pressed ellipse_tube body, which can be directly flattened and pumped directly in the elliptical _ official body. Straight space "12" and then ellipse, and finally formed into a flat shape, in order to achieve profit, the figure does not become a heat sink. (5) with a hot flat (four) red support structure and shape, although the present invention is disclosed above in the above embodiments, It is not intended to limit this: the type. Without departing from the spirit and scope of this new type, the changes and retouchings are all protected by this new form. The scope of the patent application is defined by the scope of the new definition. ^ [Simple description of the drawings] The first figure is an exploded view of the creative embodiment. The second figure is a perspective view of the support structure extracted from the actual payment. The third picture is a side view of the support structure extracted from the actual payment. The figure is a large exploded view of the domain structure of the creative compensation. The fifth picture is the actual creation. A cross-sectional view of the sleek front splicing. The sixth drawing is a sectional view of the squashed after the splicing of the present embodiment. M383720 ' [Main component symbol description] I ................. .............. Heat Sink II .............................Shell III. ..........................Inner wall. 112..................... ... accommodation space 111a.......................... capillary knots 冓• 12........ .....................Support structure 121.......................... . mesh body 1211 ......................... hole 1212 .................. .......binary hole 1213........................fixing member 122............ ...............column

Claims (1)

M383720 六、申請專利範圍: εκ〇 ^ i v; 1. 一種散熱板,係包括: -殼體,其内部係、形成有—容置空間,包圍容置師之内壁的 壁面設有毛細結構;以及 -支撐結構,係置於該容置空咖,其包括一網狀體及複數柱 . 體’該,網狀體具複數孔洞及倾置該等柱體之結合孔,該等 . 柱體之上、下端面則分別抵持該内壁。 • 2.如申請專利範圍第1項所述之散熱板,其中該殼體為扁平狀。 3. 如申請專利範圍第丨項所述之散熱板,其中該毛細結構為銅粉 之毛細結構。 4. 如申請專利範圍第1項所述之散熱板,其中該網狀體為銅網。 5. 如申請專利範圍第1項所述之散熱板,其中該網狀體自該結合 孔複數端延伸突出複數固定件,達成組置該等柱體。 .6·如申請專利範圍第5項所述之散熱板,其中該等固定件係與該 ‘網狀體之平面形成夾角。 7·如申睛專利範圍第丨或6項所述之散熱板,其中該等固定件可 為扣勾,用以挾持該柱體。 8.如申睛專利範圍第1項所述之散熱板,其中該柱體周圍設有毛 細結構。M383720 VI. Patent application scope: εκ〇^ iv; 1. A heat dissipating plate comprising: - a casing, the interior of which is formed with a accommodating space, and a wall structure surrounding the inner wall of the accommodator is provided with a capillary structure; a support structure, disposed in the accommodating empty coffee, comprising a mesh body and a plurality of columns. The body of the mesh body has a plurality of holes and a combined hole for pouring the columns, the column. The upper and lower end faces respectively resist the inner wall. 2. The heat sink of claim 1, wherein the housing is flat. 3. The heat sink according to claim 2, wherein the capillary structure is a capillary structure of copper powder. 4. The heat sink of claim 1, wherein the mesh is a copper mesh. 5. The heat sink of claim 1, wherein the mesh body extends from the plurality of ends of the bonding hole to protrude a plurality of fixing members to form the columns. 6. The heat sink of claim 5, wherein the fasteners form an angle with the plane of the mesh body. 7. The heat sink according to claim 6 or claim 6, wherein the fixing member is a hook for holding the cylinder. 8. The heat sink of claim 1, wherein the cylinder is provided with a capillary structure.
TW098222952U 2009-12-08 2009-12-08 Heat dissipation plate TWM383720U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW098222952U TWM383720U (en) 2009-12-08 2009-12-08 Heat dissipation plate
US12/956,241 US20110132578A1 (en) 2009-12-08 2010-11-30 Heat-dissipating plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098222952U TWM383720U (en) 2009-12-08 2009-12-08 Heat dissipation plate

Publications (1)

Publication Number Publication Date
TWM383720U true TWM383720U (en) 2010-07-01

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TW098222952U TWM383720U (en) 2009-12-08 2009-12-08 Heat dissipation plate

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US (1) US20110132578A1 (en)
TW (1) TWM383720U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309996A (en) * 2011-08-17 2013-03-01 Chaun Choung Technology Corp Method of manufacturing light-weight heat pipe and product of the same
CN103335550B (en) * 2013-06-08 2014-12-31 华南理工大学 Compound imbibing core for thermal column array steam main line and manufacturing method thereof
JP6233125B2 (en) * 2014-03-20 2017-11-22 富士通株式会社 Loop-type heat pipe, manufacturing method thereof, and electronic device

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Publication number Priority date Publication date Assignee Title
US2359288A (en) * 1942-07-20 1944-10-03 Young Radiator Co Turbulence strip for heat exchangers
US4970624A (en) * 1990-01-22 1990-11-13 Molex Incorporated Electronic device employing a conductive adhesive
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
JP4057455B2 (en) * 2002-05-08 2008-03-05 古河電気工業株式会社 Thin sheet heat pipe
US6781088B2 (en) * 2002-09-12 2004-08-24 Wilson Greatbatch Technologies, Inc. Pin to thin plate joint and method for making the joint
US7032652B2 (en) * 2004-07-06 2006-04-25 Augux Co., Ltd. Structure of heat conductive plate
TWM299458U (en) * 2006-04-21 2006-10-11 Taiwan Microloops Corp Heat spreader with composite micro-structure
US20090040726A1 (en) * 2007-08-09 2009-02-12 Paul Hoffman Vapor chamber structure and method for manufacturing the same
TWM336673U (en) * 2008-02-04 2008-07-11 Celsia Technologies Taiwan Inc Vapor chamber and supporting structure thereof
CN101893401B (en) * 2009-05-19 2013-02-20 富准精密工业(深圳)有限公司 Flat-plate heat pipe and manufacturing method thereof

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US20110132578A1 (en) 2011-06-09

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