M347669 八、新型說明： 【新型所屬之技術領域】 及其=有關於一種研磨塾，特別是有關— 【先前技術】 大部分的電子“係藉㈣化不晴料_成，例如半導㈣ I ==之一’當每一個新的材料層被加上時，常需要使研磨或輾磨的步 :才去除錢的層㈣’以使此晶圓平坦化，或是達成其他的目的，而此種 磨的過程禮稱為化學機械研磨平坦化伽miealMeehaniea_hing， 由於晶▲片係由各種不__材料層所形成，因此必須經過多次的cmp研磨步 驟，才能將材料層由晶圓的表面均勻去除。 ★ 製造猶_進，晶圓上所佈設鱗_當細微，線寬也 相對的愈來愈微小，故執行研磨作業時，研磨機台所施 為 ’㈣職佩㈣力纖繼輪她，故確保^ ==Γ時，研磨機台所施予的壓力大小設定，對於研磨作業而言已 疋非*重要的摘。此外由於機台與待研磨工件之間會鱗—層研雜，因此 通常機台所奴杨讀力與實社轉較之壓力姉會產生落差，這種落 差往往也會間接造成研磨上的損壞。 有鑒於此’本創作提供一種具有壓力感測器之研磨塾及其研磨裝置， «力感廳具有触之設置方式，可確佩測S不會纽學研魏干擾盘 姑，且由勤感測器直接制研磨機⑽辭工件之動，並以主動或被動的 方式傳回射值之訊號，可避免機台施予社力值紐力分布不均的現象 發生，可她提高工件之良率，騎攸前技術純改良者。 M347669 【新型内容】 為解決先前技術之問題，本創作提供一種具有壓力感測器之研磨墊。此研 磨塾係用於半導體或其他工件之研磨製程，其包含一基材、至少一壓力感測器 以及至少一訊號傳遞模組，此基材包含一研磨面、一相對之底面以及至少一凹 槽’且凹槽設於基材之底面，而壓力感測器則設於凹槽中，用以提供一壓力訊 號，訊號傳遞模組則係設於研磨墊，用以傳遞壓力訊號，其中此壓力訊號即為 研磨墊一預先設定範圍所受之壓力值之大小以及分布狀況，藉此可監控研磨時 機台所施加之壓力’避免過度的研磨造成工件磨壞，以提高研磨之品質與良率。 • 因此’本創作之主要目的在於提供一種具有壓力感測器之研磨墊，可監控 研磨時之壓力大小與分布狀況。 本創作之又一目的在於提供一種具有壓力感測器之研磨墊，可避免過度的 研磨造成工件磨壞，以提高研磨之品質與良率。 本創作之再一目的在於提供一種具有壓力感測器之研磨墊，具有較佳之訊 號傳遞方式，可適時傳遞壓力訊號。 【實施方式】 鲁 由於本創作係揭露一種具有感測器之研磨墊裝置，其中所利用到的一些感 測器或研磨墊之詳細製造或處理過程，係利用現有技術來達成，故在下述說明 中，並不作完整描述。而且下述内文中之圖式，亦並未依據實際之相關尺寸完 -整緣製’其作用僅在表達與本創作特徵有關之示意圖。 第一圖係本創作研磨墊之一較佳實施例示意圖，研磨墊2係用於半導體或 其他工件之研磨製程，其包含至少—基材2卜至少-壓力感測H 3以及至少一 訊號傳遞模組(未示於圖中）。此基材21包含-研磨面21卜一相對之底面212 以及至少一凹槽213，且凹槽213設於基材21之底面212，而壓力感測器3則 設於凹槽213中，用以提供一壓力訊號，訊號傳遞模組則係設於研磨墊2，用以 傳遞壓力訊號，其中此壓力訊號即為研磨塾2 一預先設定範圍所受之壓力值之 6 M347669 大小以及分布狀況，藉此可監控研磨時機台所施加之壓力，避免過度的研磨造 成工件磨壞，以提高研磨之品質與良率。此外，如第二圖所示，研磨墊2係包 含兩層以上之基材21，其中壓力感測器3係夾設於基材21與基材21之間以形 成一複合型之研磨墊。 第三圖係本創作訊號傳遞模組之一較佳實施例示意圖，其中此訊號傳遞模 組包含一印刷電路板(PCB)31，並連接一電路311作為供電來源，以主動傳遞訊 號。 ’ 第四圖係本創作訊號傳遞模組之另一較佳實施例示意圖，其中此訊號傳遞 φ模組包含至少一導線32，此導線可作為供電來源並主動傳遞訊號。 第五圖係本創作訊號傳遞模組之又一較佳實施例示意圖，其中此訊號傳遞 模組包含至少一供電電池33，其中此供電電池33可為鈕釦電池、水銀電池、乾 電池、鹼性電池、鉛酸電池、鎳锡電池、鎳氫電池、二次鐘電池、鐘離子電池、 高分子鋰電池、燃料電池及太陽能電池等，此供電電池33即為主動式傳遞訊號 之電源。 第六圖係本創作訊號傳遞模組之再一較佳實施例示意圖，其中此訊號傳遞 模組包含至少一無線訊號發射器34,此無線訊號發射器34為被動式之訊號傳遞 方式。 • 本創作另提供一訊號傳遞模組之再一較佳實施例，其中壓力感測器3與訊 .號傳遞模組係為一整體(未示於圖中），其包含一晶片、一控制器、一無線訊號發 射器與至少一電源裝置，其中無線訊號發射器之頻段大約為1〇〇MHZ〜3GHZ， 而電源裝置可為-震動發電裝置、-外部磁場發電裝置，或者亦可為絲電池、 水銀電池、乾電池、鹼性電池、鉛酸電池、鎳鎘電池、鎳氫電池、二次鋰電池、 鋰離子電池、高分子鋰電池、燃料電池及太陽能電池等，此種方式即為被動式 之訊號傳遞方式。 第七圖係本創作研磨裝置之一較佳實施例示意圖，其中研磨裝置4係用以 研磨-工件5以及承載-研磨墊2，此研磨墊2包含至少—基材2卜至少一壓 7 M347669 .力感測器3以及至少第一訊號傳遞模組(未示於圖中)，其中，基材21包含一研 磨面211、一相對之底面212以及至少一凹槽213，且凹槽213設於基材21之 底面212,而壓力感測器3則設於凹槽213中，用以提供一壓力訊號，此第一訊 號傳遞模組則係設於研磨墊2，用以傳遞壓力感測器3所發出之壓力訊號，其中 此壓力訊號即為研磨墊2 —預先設定範圍所受之壓力值之大小以及分布狀況， 當壓力訊齡i先設定個之㈣，可由—警示裝置47發出麵訊號，此時 研磨裝置4會自動停止。 * 其+ ’研磨裝置4包含一第一平台41、一第二平台42、一驅動裝置奶、 擊一施壓裝置43、至少一訊號接收模組44以及一顯示裝置45。此第一平台4i係 用以承載研磨墊2，並與研磨墊2之底面212連接，其連接之方式係利用黏膠 46將研磨墊2接合並固定於第-平台41上，且此種黏膠你可為一種感壓膠;^ 驅動裝置411則係用以帶動該第一平台41轉動，此第二平台42係用以承載工 件5 ’施壓裝置43可使得第-平台上41之研磨墊2與第二平台42 ±之工件5 之間具有一特定壓力，訊號接收模組44係用以接收研磨墊2提供之壓力訊號， 此訊號接收模組44可為-無線訊號接收器441，顯示裝置45則翻靖^此種 壓力訊號。 承上所述，另可包含一第二訊號傳遞模組用以連接於研磨墊2之第一訊諕 ♦傳遞模組以及研磨裝置4之訊號接收且44之間，而此第二訊號傳遞模組可為 ,一印刷€路板(PCB)3卜導線32或連接器，且此第二訊號傳遞模組係設於第一 平台41上與研磨墊2連接之表面。 ‘ 冑鑒於此，本創作提供一種具有壓力感測器之研磨塾及其研磨裝置，其中 此壓力感測H具有較佳之設置方式，可確保❹指不會受化學研磨液干擾與侵 钱，且由壓力感測器直接監測研磨機台所施打件之壓力，並以主動或被動^ 方式傳回壓力值之碱，可避免機台奸過大賴力值錢力分布不均的現象 發生，可大幅提高研磨工件之良率，乃針對先前技術加以改良者。 以上所述僅為本創作之較佳實施例而已，並非用以限定本創作之申請專利 8 M347669 權利；同時以上的描述，對於熟知本技術領叙專門人士應可明瞭及實施，因 此其他未雜梢作_私_谓完成料舰 述之申請專利範圍中。 4修飾，均應包含在下 【圖式簡單說明】 第-圖至第六_本創作研雜之—實細示意圖。 第七圖係本創作研磨裝置之_實施例示意圖。 【主要元件符號說明】 2 研磨墊 21 基材 211 研磨面 212 底面 213 凹槽 3 壓力感測器 31 印刷電路板(PCB) 311 電路 32 導線 33 供電電池 34 無線訊號發射器 4 研磨裝置 41 第一平台 411 驅動裝置 42 第二平台 43 施壓裝置 44 訊號接收模組 M347669 441 無線訊號接收器 45 顯示裝置 46 黏膠 47 警示裝置 5 工件M347669 VIII. New description: [New technology field] and its = related to a kind of grinding 塾, especially related - [Prior Art] Most of the electrons are "four (4) opaque materials, such as semi-conductive (four) I == one of the 'when each new material layer is added, it is often necessary to make the grinding or honing step: the layer that removes the money (four)' to flatten the wafer, or to achieve other purposes, and This kind of grinding process is called chemical mechanical polishing flattening gamma MeieMeehaniea_hing. Since the crystal ▲ film is formed by various layers of material, it is necessary to go through multiple cmp grinding steps to get the material layer from the surface of the wafer. Uniform removal. ★ Manufacturing is still in, the scales are laid on the wafer. _ When it is fine, the line width is relatively small, so when the grinding operation is performed, the grinding machine is applied as '(4) 职佩(四)力纤继轮Therefore, when ^ ==Γ, the pressure setting given by the grinding machine is not important for the grinding operation. In addition, since the machine and the workpiece to be ground are scaly-layered, Usually the machine’s slave reading ability and reality There will be a drop in the pressure of the company, which will indirectly cause damage to the grinding. In view of this, the present invention provides a grinding device with a pressure sensor and its grinding device, «The force chamber has touch The setting method can be sure that S will not be a new student, and the machine will directly reproduce the movement of the workpiece (10) and return the signal value in an active or passive manner. Avoid the phenomenon that the machine is not distributed unevenly, and she can improve the yield of the workpiece and improve the technology before riding. M347669 [New content] In order to solve the problems of the prior art, this creation provides a a polishing pad for a pressure sensor. The polishing device is used for a semiconductor or other workpiece polishing process, and includes a substrate, at least one pressure sensor, and at least one signal transmission module, the substrate comprising a polishing surface, An opposite bottom surface and at least one groove ′, wherein the groove is disposed on the bottom surface of the substrate, and the pressure sensor is disposed in the groove for providing a pressure signal, and the signal transmission module is disposed on the polishing pad. use The pressure signal is transmitted, wherein the pressure signal is the magnitude and distribution of the pressure value of the polishing pad in a predetermined range, thereby monitoring the pressure applied by the grinding machine during the grinding process to avoid excessive grinding and causing the workpiece to be worn to improve the grinding. Quality and yield. • Therefore, the main purpose of this creation is to provide a polishing pad with a pressure sensor that monitors the pressure and distribution of the pressure during grinding. Another objective of the creation is to provide a pressure sensing The polishing pad of the device can avoid excessive grinding and cause the workpiece to be worn to improve the quality and yield of the grinding. A further object of the present invention is to provide a polishing pad with a pressure sensor, which has better signal transmission mode. The pressure signal is transmitted in a timely manner. [Embodiment] Lu has disclosed a polishing pad device with a sensor, and the detailed manufacturing or processing process of some of the sensors or polishing pads utilized therein is achieved by using the prior art. Therefore, in the following description, it is not completely described. Moreover, the drawings in the following texts are not based on the actual relevant dimensions. The function is only to express the schematic diagram related to the present feature. The first figure is a schematic view of a preferred embodiment of the present polishing pad. The polishing pad 2 is used for a polishing process of a semiconductor or other workpiece, and includes at least a substrate 2 at least a pressure sensing H 3 and at least one signal transmission. Module (not shown in the figure). The substrate 21 includes a polishing surface 21, an opposite bottom surface 212, and at least one recess 213, and the recess 213 is disposed on the bottom surface 212 of the substrate 21, and the pressure sensor 3 is disposed in the recess 213. To provide a pressure signal, the signal transmission module is disposed on the polishing pad 2 for transmitting a pressure signal, wherein the pressure signal is the size and distribution of the pressure value of the grinding 塾2 in a predetermined range of 6 M347669. In this way, the pressure applied by the grinding machine can be monitored to avoid excessive grinding and the workpiece is worn out, so as to improve the quality and yield of the grinding. Further, as shown in the second figure, the polishing pad 2 comprises two or more substrates 21, wherein the pressure sensor 3 is interposed between the substrate 21 and the substrate 21 to form a composite polishing pad. The third figure is a schematic diagram of a preferred embodiment of the present signal transmission module. The signal transmission module includes a printed circuit board (PCB) 31 and is connected to a circuit 311 as a power source for actively transmitting signals. The fourth figure is a schematic diagram of another preferred embodiment of the present signal transmission module, wherein the signal transmission φ module comprises at least one wire 32, which can serve as a power supply source and actively transmit signals. The fifth embodiment is a schematic diagram of another preferred embodiment of the present invention. The signal transmission module includes at least one power supply battery 33. The power supply battery 33 can be a button battery, a mercury battery, a dry battery, and an alkaline battery. A battery, a lead-acid battery, a nickel-tin battery, a nickel-hydrogen battery, a secondary clock battery, a clock ion battery, a polymer lithium battery, a fuel cell, and a solar battery, etc., the power supply battery 33 is a power source for actively transmitting signals. FIG. 6 is a schematic diagram of still another preferred embodiment of the present invention. The signal transmission module includes at least one wireless signal transmitter 34. The wireless signal transmitter 34 is a passive signal transmission mode. The present invention further provides a preferred embodiment of a signal transmission module, wherein the pressure sensor 3 and the signal transmission module are integrated (not shown), and include a wafer and a control. a wireless signal transmitter and at least one power supply device, wherein the frequency band of the wireless signal transmitter is about 1 〇〇 MHZ to 3 GHz, and the power supply device can be a vibration power generating device, an external magnetic field power generating device, or a wire Batteries, mercury batteries, dry batteries, alkaline batteries, lead-acid batteries, nickel-cadmium batteries, nickel-hydrogen batteries, secondary lithium batteries, lithium-ion batteries, polymer lithium batteries, fuel cells and solar cells, etc. The signal transmission method. Figure 7 is a schematic view of a preferred embodiment of the present invention, wherein the polishing device 4 is used for grinding - a workpiece 5 and a load-polishing pad 2, the polishing pad 2 comprising at least - a substrate 2 at least one pressure 7 M347669 a force sensor 3 and at least a first signal transmission module (not shown), wherein the substrate 21 comprises a polishing surface 211, an opposite bottom surface 212, and at least one recess 213, and the recess 213 is provided On the bottom surface 212 of the substrate 21, the pressure sensor 3 is disposed in the recess 213 for providing a pressure signal. The first signal transmission module is disposed on the polishing pad 2 for transmitting pressure sensing. The pressure signal sent by the device 3, wherein the pressure signal is the magnitude and distribution of the pressure value of the polishing pad 2 - the preset range, when the pressure age i is set first (four), the surface can be issued by the warning device 47 Signal, at this time the grinding device 4 will automatically stop. * The +' grinding device 4 includes a first platform 41, a second platform 42, a driving device milk, a pressing device 43, at least one signal receiving module 44, and a display device 45. The first platform 4i is used to carry the polishing pad 2 and is connected to the bottom surface 212 of the polishing pad 2 in a manner of bonding and fixing the polishing pad 2 to the first platform 41 by using the adhesive 46, and the adhesive is The glue can be a pressure sensitive glue; the driving device 411 is used to drive the rotation of the first platform 41, and the second platform 42 is used to carry the workpiece 5'. The pressing device 43 can make the grinding on the first platform 41 The signal receiving module 44 is configured to receive the pressure signal provided by the polishing pad 2, and the signal receiving module 44 can be a wireless signal receiver 441. The display device 45 turns over the pressure signal. In addition, a second signal transmission module can be connected between the first signal transmission module of the polishing pad 2 and the signal receiving portion 44 of the polishing device 4, and the second signal transmission mode The group can be a printed circuit board (PCB) 3 wire 32 or a connector, and the second signal transmission module is disposed on the surface of the first platform 41 connected to the polishing pad 2. In view of this, the present invention provides a grinding crucible having a pressure sensor and a grinding device thereof, wherein the pressure sensing H has a better arrangement to ensure that the finger is not interfered with and invaded by the chemical polishing liquid, and The pressure sensor directly monitors the pressure exerted by the grinding machine and returns the base of the pressure value in an active or passive manner, which can avoid the phenomenon that the machine is over-distributed and the uneven distribution of the force is greatly increased. The yield of the workpiece is improved for the prior art. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the rights of the patent application 8 M347669 of the present invention; at the same time, the above description should be understood and implemented by those skilled in the art, so that other miscellaneous The tipping _ private _ is said to be completed in the patent application scope. 4 Modifications, should be included in the following [Simple description of the diagram] The first to the sixth _ this creation is mixed - the actual schematic diagram. The seventh figure is a schematic view of an embodiment of the present invention. [Main component symbol description] 2 polishing pad 21 substrate 211 polishing surface 212 bottom surface 213 groove 3 pressure sensor 31 printed circuit board (PCB) 311 circuit 32 wire 33 power supply battery 34 wireless signal transmitter 4 polishing device 41 first Platform 411 Drive 42 Second platform 43 Pressure device 44 Signal receiving module M347669 441 Wireless signal receiver 45 Display device 46 Adhesive 47 Warning device 5 Workpiece