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TWM269454U - IC lead scanner - Google Patents

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Publication number
TWM269454U
TWM269454U TW93221236U TW93221236U TWM269454U TW M269454 U TWM269454 U TW M269454U TW 93221236 U TW93221236 U TW 93221236U TW 93221236 U TW93221236 U TW 93221236U TW M269454 U TWM269454 U TW M269454U
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TW
Taiwan
Prior art keywords
inspection
component
light source
detection
scope
Prior art date
Application number
TW93221236U
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Chinese (zh)
Inventor
Yi-Hong Lin
Original Assignee
Nat Pingtung University Of Sci
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Priority to TW93221236U priority Critical patent/TWM269454U/en
Publication of TWM269454U publication Critical patent/TWM269454U/en

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

M269454 四、創作說明(1) 【新型所屬之技術領域】 本創作係關於一種I c元件外觀檢測裝置,特別是關於一 滑軌沿線分設二檢測站,並在該二檢測站之間設置一旋轉 機構’以便快速檢測IC元件之四側引腳之外觀檢測裝置。 【先前技術】 習用I C取像技術發展係用以檢測各類J c在封裝後之各種 外觀尺寸項目,如第1及2圖所示,一般IC元件9之外觀尺 寸檢測項目包含:腳間距D1〔 pi tch〕、腳排彎D2 〔sweep〕、腳跨距d3〔 spread〕、腳高度D4〔 stand f〕、腳彎D5〔 bend〕、腳共平面D6〔 coplanarity〕、 9 共線D7〔 col ine〕、内側彎腳D8〔 toe in〕等缺陷。上述 . 與引腳9 1相關的缺陷涉及三維外觀尺寸,因此首要課題是 何建立IC元件9之三維外觀尺寸之取像技術。 為了檢測I C元件9之外觀尺寸,業界已發展的習用丨C元M269454 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about an appearance inspection device for an IC device, in particular, two inspection stations are arranged along a slide rail, and one inspection station is set between the two inspection stations. Rotating mechanism 'in order to quickly detect the appearance inspection device of the four sides of the IC component. [Previous technology] The development of conventional IC imaging technology is used to detect various appearance dimensions of various types of J c after encapsulation. As shown in Figures 1 and 2, the appearance dimensions of general IC components 9 include the foot distance D1. 〔Pi tch〕, foot row bend D2 〔sweep〕, foot span d3 〔spread〕, foot height D4 〔stand f〕, foot bend D5 〔bend〕, foot coplanar D6 〔coplanarity], 9 colinear D7 〔col ine], inside bend D8 [toe in] and other defects. The above-mentioned defects related to the pin 91 are related to the three-dimensional appearance dimension, so the first issue is how to establish the imaging technology of the three-dimensional appearance dimension of the IC component 9. In order to test the appearance and dimensions of I C element 9, the industry has developed a custom C element

如 件之外觀檢測裝置,其係由一機台、一滑執、一影像擷取 單元及一打光成像模組所構成,其主要在該滑軌中的某一 檢測站位置的兩侧設置打光成像模組,並在同一檢測站位 置的上、下側設置該影像擷取單元。在進行檢測作業時, 讓IC元件9在該滑軌上逐一滑動至檢測站,以進行擷取工c 元件9的上視及二側之影像。然而,上述外觀檢測裝置僅 · 適用於檢測二側佈有引腳9丨之丨c元件9,但卻不適用於檢 測四側全佈有引腳9丨之1(:元件9。該外觀檢測裝置不適用 的原因在於,當IC元件9之四側全佈有引腳91時,必然存 在二側之引腳9 1朝向該滑執的縱向方向。由於該滑執上無Such as the appearance inspection device, which is composed of a machine, a slider, an image capture unit and a light imaging module, which are mainly provided on both sides of the position of a detection station in the slide rail Light the imaging module, and set the image capture unit on the upper and lower sides of the same detection station. During the inspection operation, the IC element 9 is allowed to slide one by one to the inspection station on the slide rail to capture the top-view and two-side images of the process element 9. However, the above-mentioned appearance detection device is only suitable for detecting c-component 9 with pins 9 丨 on the two sides, but it is not suitable for detecting 1 (: component 9) with pins 9 丨 on all sides. The appearance detection The reason why the device is not applicable is that when all four sides of the IC component 9 are provided with pins 91, there must be pins 9 1 on both sides facing the longitudinal direction of the slider.

C:\Logo-5\Five Continents\PK9678. ptd 第5頁 M269454C: \ Logo-5 \ Five Continents \ PK9678.ptd Page 5 M269454

四、創作說明(2) 法固設任何打光成像模組,因此益 上之引腳9 1影像。為克n、+、λ/ 1、利取得該縱向方向 1C元件9必需先在一機台進行二側 ^王布有W腳91之 至1C料管,再將IC料管配送至另_ ,w/、彳,接著收集 側引腳9 1的檢測。如此,不但大幅限;二二,:打另二 範圍’且亦不利於簡化:: i 口素,確貫有必要進—步改良上述^件u卜“= 有鑑於此,本創作改良上述缺點,其係取 設二檢測站,該二檢測站之門 < 二:: /月九/口線分 承載之IC元件通過第一旋轉機構,當該滑執 侧的引腳檢測。藉此,元件之另二 速檢測流程及增廣適η增加檢測便利性、加p 【新型内容】 /Μ 本創作之主要目的係提供_種! c元件外觀檢立 係-滑軌沿線分設至少二檢測站,並在各二檢測』間設 置一旋轉機構,該旋轉機構用以90。旋轉該IC元件,以便 快速檢測1C元件之四側引腳,而使本創作具有增加檢測便 利性、加速檢測流程及增廣適用範圍之功效。 、 ^本創作之次要目的係提供一種丨c元件外觀檢測裝置,其 係二滑軌沿線分設至少二檢測站,並在最後一檢測站之下 方汉置一旋轉機構’該旋轉機構用以旋轉該丨c元件,以便 IC元件正確回料至IC料管内,而使本創作具有加速檢測流Fourth, the creation instructions (2) method of fixing any lighting imaging module, so the pin 9 1 image on the benefit. In order to obtain n, +, λ / 1, in order to obtain the 1C component 9 in the longitudinal direction, it is necessary to first perform two sides on a machine ^ Wang cloth has W feet 91 to 1C material tube, and then the IC material tube is distributed to another _, w /, 彳, then collect the detection of the side pin 9 1. In this way, not only is it greatly limited; it is not conducive to simplification: 22: It ’s not easy to simplify: i voxels, it is always necessary to further improve the above ^ pieces u = "In view of this, this creation improves the above shortcomings It is based on the setting of two inspection stations, and the gates of the two inspection stations < 2 :: / month nine / mouth line IC components carried by the first rotation mechanism, when the pin on the slider side detection. With this, The component's other two-speed detection process and the expansion of the camera will increase the convenience and increase the [new content] / M The main purpose of this creation is to provide _ species! C component appearance inspection system-at least two detections along the slide rail Stand and set a rotating mechanism between the two detections, the rotating mechanism is used for 90. Rotate the IC component to quickly detect the four pins of the 1C component, so that this creation has increased detection convenience and speeded up the detection process. And the effect of broadening the scope of application. ^ The secondary purpose of this creation is to provide a c component appearance inspection device, which is divided into at least two inspection stations along the second slide rail, and one is placed below the last inspection station. Rotating mechanism ' Turn the 丨 c component so that the IC component is correctly returned to the IC material tube, so that the creation has an accelerated detection flow

C:\Logo-5\Five Continents\PK9678. ptdC: \ Logo-5 \ Five Continents \ PK9678. Ptd

第6頁 M269454 四、創作說明(3) 程之功效 係:H 2另T的係提供一種1 c元件外觀檢測裝置, 钭美、至父二檢測站及至少-旋轉機構設置,其 Πΐ:以利用自由落體的方式讓1c元件在該滑倾 動,而使本創作具有減少輸送所需電能之功效。軌上滑 ^根據本創作之ic元件外觀檢測裝置,其包含一 ί:”站、一旋轉機構及一第二檢測站。該機台;右一 傾斜基板及一滑軌。該滑軌設於該傾斜基板上,龙:有- 送待檢測之1c元件。該滑軌沿線由上而下依序設輪 檢測站、旋轉機構及第二檢測站。該第一檢測站用二1 — 忒I C 7G件之二側引腳。該旋轉機構則用以g 〇。轉動双剛 該第一檢測站之1C元件,以便允許位於該旋轉機構下,過 第二檢測站順利檢測該1(:元件之另二側引腳。 方之 【實施方式】 〔 *為讓本創作之上述及其他目的、特徵、優點能更 且 懂,下文特舉本創作之較佳實施例,並配合所 ”、、f 詳細說明如下: u A ’作 八请f照第3圖所示,本創作之丨c元件外觀檢測裝置係包 含一機台1、一入料暨分離機構2、一第一檢測站3、一 g 了旋轉機構4、一第二檢測站5、一第二旋轉機構6、一分 類出料區7及一電腦8,其用以檢測封裝後之1(:元件9〔如 第6圖所示〕,特別是四侧皆具引腳之Ic元件9,例如利用 PLCC〔plastic leaded chip carrier,塑膠有引線晶片 載體〕方式封裝之IC元件9,該類I C封裝元件9之四侧皆具Page 6 M269454 IV. Creation instructions (3) Cheng's efficacy system: H 2 and T systems provide a 1 c component appearance inspection device, Amami, to the second parent inspection station and at least-rotation mechanism set, its Πΐ: to The free-fall method is used to allow the 1c element to slide at the slip, so that the creation has the effect of reducing the electrical energy required for transmission. Slide on the track ^ According to the ic element appearance detection device created by this creation, it includes a "" station, a rotating mechanism and a second detection station. The machine; a right slanted base plate and a slide rail. The slide rail is located at On the inclined substrate, Long: Yes-Send 1c components to be tested. The slide rail is provided with a wheel detection station, a rotation mechanism and a second detection station in order from top to bottom. The first detection station uses two 1 — 忒 ICs. The second side pin of the 7G piece. The rotating mechanism is used for g 0. Rotate the 1C element of the first inspection station in Shuanggang to allow it to be located under the rotation mechanism and pass the second inspection station to successfully detect the 1 (: element of The other two pins. Fang Zhi [Implementation] [* In order to make the above and other purposes, features, and advantages of this creation more understandable, the following exemplifies the preferred embodiment of this creation and cooperates with the "", f The detailed description is as follows: As shown in Fig. 3, the component c appearance inspection device of this creation includes a machine 1, a feeding and separating mechanism 2, a first detection station 3, a g. Rotating mechanism 4, a second detection station 5, a second rotating mechanism 6, a sorting output 7 and a computer 8, which are used to detect the packaged 1 (: component 9 (as shown in Figure 6), especially the Ic component 9 with pins on all sides, for example using PLCC [plastic leaded chip carrier, plastic IC chip 9 packaged with a leaded chip carrier], all four sides of this type of IC package element 9 have

M269454 四、創作說明u) 朝同一面彎折之數個IC引腳9 i。 請再參照第3及4圖所示,本創作之機台1設有一傾斜基 板11 °該傾斜基板丨丨固設一滑軌12。該滑執12沿線由上而 下依序設置該入料暨分離機構2、第一檢測站3、第一旋轉 機構4、第二檢測站5、第二旋轉機構6及分類出料區7。該 入料暨分離機構2係屬習知技術,其概分為一入料區2 1及 一分離區2 2。該入料區2 1位於該傾斜基板丨丨上方之平台 處’其利用氣壓缸及滑車等輸送構造〔未標示〕逐一抽取 至少一 1 C料管9 〇,以便由該I C料管9 0内取出該IC元件9, 並將該I C元件9送入該滑執丨2。該分離區2 2位於該傾斜基 板11上’其先利用一氣壓缸221〔如第4圖所示〕將大量1C 兀件9暫時定位於該滑執12上,再利用一擋塊222及另一氣 壓缸2 23逐一釋放單一顆1C元件9至下方之第一檢測站3。 由於該1 C元件利用自由落體的方式在該滑執1 2上滑動,因 而可相對減少輸送所需電能。 請再參照第3至6圖所示,本創作之第一檢測站3包含一 打光成像模組31及一定位擋塊32。該打光成像模組31設有 二組影像操取單元311、312、二組第一光源313、二組第 二光源314、一組背光光源315、二組反射鏡316及二組擴 散板3 1 7 °該滑執丨2對應該第一檢測站3設置玻璃板,以形 成檢測區。該定位擋塊32位於檢測區底緣,其利用氣壓缸 進行抬升或下降,以便使該丨c元件9定位於該檢測區,或 通過該檢測區至該第一旋轉機構4。 如第6圖所示,該影像擷取單元3 11對位於檢測區的正上M269454 4. Creation instructions u) Several IC pins 9 i bent towards the same side. Please refer to FIGS. 3 and 4 again, the machine 1 of this creation is provided with an inclined base plate 11 °, and the inclined base plate 丨 丨 is fixed with a slide rail 12. The feeding and separating mechanism 2, the first detecting station 3, the first rotating mechanism 4, the second detecting station 5, the second rotating mechanism 6 and the sorting and discharging area 7 are sequentially arranged along the line from top to bottom. The feeding and separating mechanism 2 is a conventional technology, and is roughly divided into a feeding area 21 and a separation area 22. The feeding area 21 is located at the platform above the inclined substrate. It uses a conveying structure (not labeled) such as a pneumatic cylinder and a pulley to extract at least one 1 C material tube 90 one by one so as to be contained in the IC material tube 90. Take out the IC element 9 and feed the IC element 9 into the slider 2. The separation area 22 is located on the inclined substrate 11 '. First, a large number of 1C elements 9 are temporarily positioned on the slider 12 by using a pneumatic cylinder 221 (as shown in FIG. 4), and then a stopper 222 and another are used. A pneumatic cylinder 2 23 releases a single 1C element 9 one by one to the first detection station 3 below. Since the 1 C element slides on the slider 12 in a free-fall manner, the power required for transmission can be relatively reduced. Please refer to FIG. 3 to FIG. 6 again. The first detection station 3 of this creation includes a light imaging module 31 and a positioning stop 32. The lighting imaging module 31 is provided with two sets of image manipulation units 311 and 312, two sets of first light sources 313, two sets of second light sources 314, one set of backlight light sources 315, two sets of reflectors 316, and two sets of diffusers 3 1 7 ° This slide holder 2 is provided with a glass plate corresponding to the first detection station 3 to form a detection area. The positioning stopper 32 is located at the bottom edge of the detection area, and is lifted or lowered by a pneumatic cylinder, so as to position the c element 9 in the detection area, or pass the detection area to the first rotating mechanism 4. As shown in FIG. 6, the image capturing unit 3 11 pairs are located directly above the detection area.

M269454M269454

方,該第一光源313、第二光源314、反射鏡316及擴散板 3 1 7設於檢測區的二側。該影像擷取單元3丨2設於檢測區的 正下方二側。該背光光源3 1 5設於檢測區的正下方。該影 像擷取單元311、312係選擇使用CCD型〔電荷耦合元件〕 或CMOS型〔互補金屬氧化物導體〕之數位影像擷取單元, 以便輸出影像數位檔案至電腦8進行影像分析處理。該第 一光源3 1 3及背光光源3 1 5採用紅色LED燈,該第二光源3 1 4 則採用綠色LED燈。 如第6及7圖所示,該第一光源313及背光光源315用以提 供該影像擷取單元3 11所需的投射光線〔紅光〕,以便分 別擷取該I C元件9之引腳9 1内緣及外緣的影像,並輪出影^^ 像數位檔案至電腦8進行影像分析處理,以決定該引腳91^^ 是否合於標準。該第二光源3 1 4則設於該反射鏡3 1 6及擴散 板3 1 7的後方,該第二光源3丨4之投射光線〔綠光〕先經由 該擴散板317均勻化,再低角度投射至該ic元件9之引腳91 成像’接著投射光線〔綠光〕由半透明之反射鏡3 1 6反射 至下方之影像擷取單元312,以擷取該引腳91最内緣位置 點之影像,並輸出影像數位檔案至電腦8進行影像分析處 理’以決定該引腳9 1是否合於標準。再者,下方的影像擷 取單元3 1 2加上濾掉紅光的濾鏡,以避免受到紅光干擾; 而上方的影像擷取單元3丨1則加上濾掉綠光的濾鏡,以避 免受到綠光干擾,藉此該影像擷取單元311、3 1 2可在紅、 綠光的投射下同時完成取像動作。 請再參照第3至5、7及8圖所示,本創作之第一旋轉機構The first light source 313, the second light source 314, the reflecting mirror 316, and the diffusion plate 3 1 7 are disposed on two sides of the detection area. The image capturing unit 3 丨 2 is located on two sides directly below the detection area. The backlight light source 3 1 5 is disposed directly below the detection area. The image capturing units 311 and 312 are digital image capturing units using a CCD type [Charge Coupled Device] or a CMOS type [Complementary Metal Oxide Conductor] to output digital image files to a computer 8 for image analysis and processing. The first light source 3 1 3 and the backlight light source 3 1 5 are red LED lights, and the second light source 3 1 4 are green LED lights. As shown in FIGS. 6 and 7, the first light source 313 and the backlight light source 315 are used to provide the projection light (red light) required by the image capturing unit 3 11 so as to capture the pins 9 of the IC component 9 respectively. 1 the inner and outer edges of the image, and turn out the image ^^ image digital file to the computer 8 for image analysis processing to determine whether the pin 91 ^^ meets the standard. The second light source 3 1 4 is disposed behind the reflecting mirror 3 1 6 and the diffuser plate 3 1 7. The projected light (green light) of the second light source 3 丨 4 is uniformized by the diffuser plate 317 and then lowered. Angle projection to the pin 91 of the ic element 9 and imaging. Then the projected light (green light) is reflected by the translucent mirror 3 1 6 to the image capturing unit 312 below to capture the innermost edge position of the pin 91 Point the image, and output the image digital file to the computer 8 for image analysis and processing 'to determine whether the pin 9 1 meets the standard. In addition, the lower image capturing unit 3 1 2 adds a filter that filters out red light to avoid being interfered by red light; and the upper image capturing unit 3 丨 1 adds a filter that filters out green light. In order to avoid interference from green light, the image capturing units 311 and 3 1 2 can simultaneously perform image capturing operations under the projection of red and green light. Please refer to Figures 3 to 5, 7, and 8 again, the first rotating mechanism of this creation

M269454 四、創作說明(6) 4设有一驅動裝置4 1及一 . 缸方疋轉盤42。該驅動裝置41用以帶 轉盤42形成9°。轉動。該旋轉盤42上設有一L形; 的門 止塊422。在該旋轉盤42轉動前,該L形導執421 :開口之-銜接上方之滑執12,因此可用以引入剛通過該 ί二檢測站3之1〇元件9。在進入該L形導軌⑵後,該心 X β止塊422適當定位。在該旋轉盤42轉動後,該L形 ^軌421的開口之一則銜接下方之滑執12,因此可便於使 忒1C το件9經由該滑軌12滑至該第二檢測站6。關於該第一 方疋,枝構4之動作而έ •當該第一檢測站3之打光成像模組 31完成檢測該1C元件9的二側引腳91後,利用該第一旋轉丨 機構4進行90。的旋轉,使得原本位於該滑軌12縱向的另 二側引腳9 1,轉動至朝向該滑執丨2之二侧。如此,尚未進 仃打光取像的引腳9 1,即可在該第二檢測站5順利進行檢 測。 嘆 凊參照第3至6及9圖所示,本創作之第二檢測站5的架構 相同於該第一檢測站3,其同樣包含一打光成像模組5丨及 一定位擋塊5 2。該第二檢測站5用以檢測該I C元件9經9 0。 旋轉後朝向該滑軌1 2側面之另二側引腳9 1,並將擷取之數 位影像輸出至該電腦8進行影像分析處理,以決定該引腳 91是否合於標準。 請參照第3至5、1 0及11圖所示,本創作之該第二旋轉機 構6的架構相同於該第一旋轉機構4,其同樣包含一驅動裝 置〔未繪示〕及一旋轉盤61。該驅動裝置用以帶動該旋轉 盤61再次90°轉動。該旋轉盤61亦設有一L形導執611及二M269454 Fourth, the creation instructions (6) 4 is provided with a driving device 41 and a cylinder-shaped square turntable 42. The driving device 41 is used to form a 9 ° with a turntable 42. Turn. The rotating disk 42 is provided with an L-shaped gate block 422. Before the rotating disk 42 rotates, the L-shaped guide 421: the opening-connects the sliding handle 12 above, so it can be used to introduce the 10 component 9 that has just passed the detection station 3. After entering the L-shaped guide rail ⑵, the heart X β stop 422 is properly positioned. After the rotating disk 42 is rotated, one of the openings of the L-shaped rail 421 is connected to the slider 12 below, so that the 忒 1C το member 9 can be easily slid to the second detection station 6 through the slide rail 12. Regarding the first party, the movement of the branch 4 is performed. When the lighting imaging module 31 of the first detection station 3 finishes detecting the two side pins 91 of the 1C element 9, the first rotation mechanism is used. 4 proceed to 90. The rotation of the slide rail 12 causes the pins 9 1 on the other side of the slide rail 12 to rotate toward the two sides of the slide rail 2. In this way, the pin 9 1 which has not been shot and captured can be successfully tested at the second testing station 5. With sighs, as shown in Figures 3 to 6 and 9, the architecture of the second detection station 5 is the same as that of the first detection station 3. It also includes a light imaging module 5 and a positioning block 5 2 . The second detection station 5 is used to detect the IC component 9 through 90. After the rotation, the other pin 9 1 on the side of the slide rail 12 is output to the computer 8 for image analysis processing to determine whether the pin 91 meets the standard. Please refer to Figs. 3 to 5, 10 and 11, the structure of the second rotating mechanism 6 is the same as that of the first rotating mechanism 4, and it also includes a driving device (not shown) and a rotating disk. 61. The driving device is used to drive the rotary disk 61 to rotate 90 ° again. The rotating disc 61 is also provided with an L-shaped guide 611 and two

C:\Logo-5\Five Continents\PK9678. ptd 第10頁 M269454 3、創作說明(7) 止塊6 1 2。該分類出料區7係屬習知技術,其設有一定位擋 塊71、一吸盤式機械臂72、一良品回收區73及一不良品回 收區74。 ^ 如第1 0及1 1圖所示,關於該第二旋轉機構6之動作而 言··在檢測前,該入料區2 1係由開口朝下的I c料管9 〇取出 該1C元件9。但是,在經過該二檢測站3、5後,該良品回 收區73及不良品回收區74處的丨C料管9 〇則是以開口朝上的 方式回收遠I C元件9。因此,經由該二旋轉機構4、6,共 將該1C元件9旋轉180。,如此將有利依原裝料方向將該1(: 元件9回收至1C料管90内。再者,在該1C元件9通過該第二、 旋轉機構6後,該1C元件9暫先定位在該定位擋塊71,以等 待該電腦8決定是否為良品或不良品。若判斷為良品,該傷 定位擋塊71將下降,使該ic元件9沿該滑軌12滑入該良品^ 回收區73之1C料管90内。若判斷為不良品,該定位擋塊71 將維持抬升狀態,而該吸盤式機械臂72將吸取該ic元件9 至该不良品回收區74之1C料管90内。 如上所述,相較於習用I c元件外觀檢測裝置無法在同一 機台上檢測該IC元件之四側引腳,以致僅適用檢測具二側 引腳之I C元件專缺點’第3圖之本創作藉由在該滑執1 2沿 線分設該第一及第二檢測站3、5,並在該第一及第二檢測 站3、5之間設置該第一旋轉機構4,藉由該第一旋轉機構4 加以9 0 °旋轉該IC元件9,其確實可方便由第二檢測站5進 行该I C元件之另一側的引腳檢測。藉此,本創作確實能增 加檢測便利性、加速檢測流程及增廣適用範圍。C: \ Logo-5 \ Five Continents \ PK9678. Ptd page 10 M269454 3. Creation instructions (7) Stop block 6 1 2. This sorting and discharging area 7 is a conventional technology, and is provided with a positioning stop 71, a sucker-type robot arm 72, a good product recovery area 73, and a defective product recovery area 74. ^ As shown in Fig. 10 and Fig. 11, regarding the operation of the second rotating mechanism 6, before the detection, the feeding area 21 is an I c tube 9 with the opening facing downwards, and the 1C is taken out. Element 9. However, after passing through the two inspection stations 3 and 5, the C pipe 9 at the good product recovery area 73 and the defective product recovery area 74 recovers the far IC component 9 with the opening facing upward. Therefore, the 1C element 9 is rotated by 180 through the two rotation mechanisms 4, 6 in total. In this way, it will be advantageous to recover the 1 (: component 9 into the 1C material tube 90 according to the original material direction. Moreover, after the 1C component 9 passes the second and rotating mechanism 6, the 1C component 9 is temporarily positioned at the first Position the stopper 71 to wait for the computer 8 to determine whether it is good or defective. If it is judged to be good, the injury stopper 71 will fall, causing the ic element 9 to slide into the good product along the slide rail ^ Recovery area 73 1C material tube 90. If it is judged that the product is defective, the positioning block 71 will maintain a lifted state, and the sucker robot arm 72 will suck the ic element 9 into the 1C material tube 90 of the defective product recovery area 74. As described above, compared to the conventional IC component appearance inspection device, the four sides of the IC component cannot be detected on the same machine, so that only the IC component with two side pins can be used. By creating the first and second detection stations 3, 5 along the slide 12 and creating the first rotation mechanism 4 between the first and second detection stations 3, 5, the creation The first rotating mechanism 4 rotates the IC component 9 by 90 °, which can indeed facilitate the IC component 9 by the second detection station 5. Pin detection side. In this way, this creation can really increase the ease of detection, speed detection process and broaden the scope of application.

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M269454M269454

圖式簡單說明 【圖式簡單說明 第1圖 第2圖 第3圖 第4圖 習用1C元件相關缺陷之側視圖。 另-習用I一C元件相關缺陷之上視圖。 本創作I C兀件外觀檢測裝置 人 本創作I C元件外觀浐、、丨驻 、、、、口立體圖。 構之立體透視圖。 14、、之檢測站及旋轉機 第5圖:本創作I c元件外_拾、、目丨丨姑里 t 構之立體仰視圖。卜觀檢測裝置之檢測站及旋轉機 第6圖:本創作I C元件外觀檢測裝 之示意圖。 j衣直之檢測站取像原理 第7圖:本創作1C元件外觀檢測裝置之第 檢測時之立體透視圖。 檢測站進仃 ' 第8圖:本創作1C元件外觀檢測裝置之第 行旋轉時之立體透視圖。 轉A構各 第9圖:本創作1C元件外觀檢測裝置之第 檢測時之立體透視圖。 、彳占進仃 第1 0圖:本創作IC元件外觀檢測穿 行旋轉時之立體透視圖。 A置之4二旋轉機構進 第!1圖:本創作K元件外觀檢測裝置之良品 行回料時之立體透視圖。 艮。口進 主要元件符號說明 1 機台 12 滑軌 11 傾斜基板 2 入料暨分離機構Brief Description of the Drawings [Simplified Illustration of the Drawings Figure 1 Figure 2 Figure 3 Figure 4 Side view of defects related to conventional 1C components. Another-View of defects related to conventional I-C components. This creative IC component appearance detection device. This creative IC component appearance is 浐 ,, 丨, ,,,, and 3D. A three-dimensional perspective view of the structure. 14. Detecting Station and Rotating Machine Figure 5: This is a stereoscopic bottom view of the components outside the I c of this creation. Inspection station and rotating machine of Buguan detection device Figure 6: Schematic diagram of the appearance detection device of the IC component of this creation. J Yizhi's principle of image acquisition at the inspection station Figure 7: This is a perspective view of the 1C component appearance inspection device during the first inspection. The inspection station enters' Figure 8: This is a perspective perspective view of the 1C component appearance inspection device during the first rotation. Figure 9: Three-dimensional perspective view of the 1C component appearance inspection device during inspection.彳, 立体 占 进 仃 Figure 10: This is a stereo perspective view of the IC component's appearance detection during rotation. A is placed in the second rotation mechanism! Figure 1: A perspective view of the good quality of the K-component appearance inspection device when returning materials. Gen. Oral inlet Main component symbol description 1 Machine 12 Slide rail 11 Inclined base plate 2 Feeding and separating mechanism

C:\Logo-5\Five Continents\PK9678. ptd 第13頁 M269454 # 圖式簡單說明 21 入 料 區 22 分 離 221 氣 壓 缸 222 擋 塊 223 氣 壓 缸 3 第 一 檢 測站 31 打 光 成 像 模組 311 影 像 擷 取 單 元 312 影 像 擷 取 XSXJ 一 早兀 313 第 一 光 源 314 第 二 光 源 315 背 光 光 源 316 反 射 鏡 317 擴 散 板 32 定 位 擋 塊 4 第 一 旋 轉 機 構 41 焉區 動 裝 置 42 旋 轉 盤 421 L形導執 422 止 塊 5 第 二 檢 測 站 51 打 光 成 像 模 組 52 定 位 擋 塊 6 第 二 旋 轉 機 構 61 旋 轉 盤 611 L形導軌 612 止 塊 7 分 類 出 料 區 71 定 位 擋 塊 72 吸 盤 式 機 械 臂 73 良 品 回 收 區 74 不 良 品 回 收 區 8 電 腦 9 1C 元 件 90 1C 料 管 91 引 腳C: \ Logo-5 \ Five Continents \ PK9678. Ptd Page 13 M269454 # Brief description of the drawing 21 Feed area 22 Separation 221 Pneumatic cylinder 222 Stopper 223 Pneumatic cylinder 3 First inspection station 31 Lighting imaging module 311 Image Capture unit 312 Image capture XSXJ Early morning 313 First light source 314 Second light source 315 Backlight light source 316 Reflector 317 Diffuser plate 32 Positioning stopper 4 First rotation mechanism 41 Zone motion device 42 Rotating disk 421 L-shaped guide 422 Stopper 5 Second inspection station 51 Lighting imaging module 52 Positioning stopper 6 Second rotation mechanism 61 Rotating disc 611 L-shaped guide 612 Stopper 7 Sorting out area 71 Positioning stopper 72 Suction robot arm 73 Good product recovery area 74 Defective product recycling area 8 Computer 9 1C component 90 1C material tube 91 pin

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Claims (1)

M269454 一種i c元 一機台, 傾斜基板 一第一檢 檢測該I C 至少一旋 測站 測站 一第 下方 另二 依申 其中 像擷 、二 設置 依申 其中 光源 ,該 光源 依申 其中 該第 下方 之1C 二檢 ,該 侧引 請專 該第 取單 反射 玻璃 請專 該影 、第 影像 設於 請專 該第 二光 件外 其設 上, 測站 元件 轉機 ,該 元件 測站 第二 腳。 觀檢測裝置,其包含: 有一傾斜基板及一滑執,該滑執設 用以輸送待檢測之I c元件; ’其設於該滑軌上,該第一檢測站 之二側引腳; 構’其設於該滑軌上,並位於該第 旋轉機構用以9 0。轉動已通過該第 ;及 ’其設於該滑執上,並位於該旋轉 檢測站用以檢測已9 〇。轉動之丨c元 利範圍第1項所 一檢 元、 鏡及 板, 利範 像擷 二光 擷取 檢測 利範 一光 源則 測站設有一 二第一光源 二擴散板, 以形成檢測 圍第2項所 取單元對位 源、反射鏡 單元設於檢 區的正下方 圍第2項所 源及背光光 採用不同之 述之IC元件外觀檢測裝 打光成像模組,其包含 、一第二光源、一背光 且該滑執對應該第一檢 區。 述之1C元件外觀檢測裝 於檢測區的正上方,該 及擴散板設於檢測區的 測區的正下方二側,該 〇 於該 用以 一檢 一檢 機構 件的 置 % 三影 光源 測站 置, 第一 二側 背光 置, 光, 述之IC元件外觀檢測裝 源採用相同之第一種色 第二種色光。M269454 An IC unit, a tilted substrate, the first inspection and detection of the IC, at least one rotating measuring station, the first one, the second one, which is under the image capture, the second, which is the source, and the light source, which is the first The second inspection of 1C, the side guide, please take the first single reflection glass, please the shadow, the second image is located on the outside of the second light, please set up the station component, the second leg of the component station. The inspection device includes: an inclined substrate and a slider, the slider is configured to convey the I c element to be detected; 'it is arranged on the slide rail, and two pins of the first detection station; 'It is arranged on the slide rail and is located on the second rotation mechanism for 90. The rotation has passed the first; and 'It is provided on the slider, and is located at the rotation detection station for detecting 90 °. Rotate one element, mirror, and plate in the first range of the c-benefit range, and the Lifan image capture two light capture detection Lifan one light source, the station is equipped with one or two first light sources and two diffusers to form the detection area second item. The unit alignment source and the reflector unit are located directly below the inspection area. The second source and the backlight light use different IC component appearance detection and lighting imaging modules, which include, a second light source, A backlight and the slider correspond to the first inspection area. The 1C component appearance inspection is installed directly above the inspection area, and the diffuser plate is located on the two sides directly below the inspection area of the inspection area. The 0 is used for inspection of one inspection mechanism. Stand, the first and second sides are set with backlight, light, and the IC component appearance detection device mentioned above uses the same first color and second color light. M269454 五、申請專利範圍 5、 依申請專利範圍第4項所述之I c元件外觀檢測裝置, 其中該第一光源及背光光源採用紅色LED燈,該第二 光源則採用綠色L £ d燈。 6、 依申请專利範圍第2項所述之I c元件外觀檢測裝置, 其中該影像擷取單元選擇使用CCD型、CMOS型之數位 影像擷取單元,以便輸出影像數位檔案至一電腦進行 影像分析處理。 7、 依申請專利範圍第1項所述之1(:元件外觀檢測裝置, 其中該第一檢測站設有一定位擋塊,其位於第一檢測 站之檢測區底緣,其利用氣壓缸進行抬升及下降,以《 使該I C元件選擇定位於該檢測區及通過該檢測區至該 旋轉機構。 8、 依申請專利範圍第1項所述之1C元件外觀檢測裳置_ 其中該旋轉機構設有一驅動裝置及一旋轉盤,該驅動 裝置用以帶動該旋轉盤形成9〇。轉動。 9、 依申請專利範圍第8項所述之IC元件外觀檢測裝置, 其中該旋轉盤上設有一 L形導執及二止塊,在該旋轉 盤轉動前,該L形導軌的開口之一銜接上方之滑執, 以引入I C元件,在該旋轉盤轉動後,該[形導軌的開 口之一銜接下方之滑執,以導出IC元件。 I 1 0、依申請專利範圍第1項所述之I c元件外觀檢測袭置, 其中該第二檢測站設有一打光成像模組,其包含三聲 像擷取單元、二第一光源、二第二光源、一背光光5 、二反射鏡及二擴散板,且該滑執對應該第二檢測站'M269454 5. Scope of patent application 5. According to the IC device appearance inspection device described in item 4 of the scope of patent application, the first light source and the backlight light source are red LED lights, and the second light source is a green L £ d light. 6. According to the IC device appearance inspection device described in item 2 of the scope of the patent application, the image capture unit selects a CCD-type or CMOS-type digital image capture unit in order to output an image digital file to a computer for image analysis deal with. 7. According to item 1 (: component appearance inspection device) described in item 1 of the scope of patent application, wherein the first inspection station is provided with a positioning stopper, which is located at the bottom edge of the inspection area of the first inspection station, and is lifted by a pneumatic cylinder And descending, so that the IC component is selected to be positioned in the detection area and passed through the detection area to the rotating mechanism. 8. According to the 1C component appearance inspection dress described in the first scope of the patent application__, the rotating mechanism is provided with a A driving device and a rotating disk, the driving device is used to drive the rotating disk to form a 90 ° rotation. 9. According to the IC component appearance detection device described in item 8 of the scope of patent application, wherein the rotating disk is provided with an L-shaped guide Before the rotary disk is rotated, one of the openings of the L-shaped guide rail is connected to the upper slide to introduce the IC component. After the rotary disk is rotated, one of the openings of the [shaped guide rail is connected to the lower one. Slide to get IC components. I 1 0. According to the appearance inspection of I c components described in item 1 of the scope of the patent application, the second detection station is provided with a light-emitting imaging module, which includes three acoustic image captures. Take unit, A first light source, two second light sources, a backlight light 5, two mirrors and two diffusion plate, and the slide should be performed on a second detection station ' C:\Logo-5\Five Continents\PK9678. ptd 第16頁 M269454C: \ Logo-5 \ Five Continents \ PK9678.ptd Page 16 M269454 五、申請專利範圍 設置玻璃板,以形成檢測區。 11、依申明專利範圍第1 〇項所述之IC元件外觀檢測裝置 其中該影像擷取單元對位於檢測區的正上方,該第— 光源、第二光源、反射鏡及擴散板設於檢測區的二 ,該影像擷取單元設於檢測區的正下方二側,該北二 光源設於檢測區的正下方。 /月光 1 2、依申請專利範圍第1 〇項所述之丨c元件外觀檢測裝置, 其中該第一光源及背光光源採用相同之第一種^光,’ 該第二光源則採用不同之第二種色光。 1 3、依申請專利範圍第1 2項所述之ic元件外觀檢測裝置, 其中該第一光源及背光光源採用紅sLEE)燈,該第二 1 光源則採用綠色LED燈。 1 4、依申請專利範圍第1 〇項所述之I c元件外觀檢測裝置, 其中該影像擷取單元選擇使用CCD型、CMOS型之數位 、 影像擷取單元,以便輸出影像數位檔案至一電腦進行 影像分析處理。 1 5、依申請專利範圍第1項所述之I c元件外觀檢測裝置, 其中遺第一檢測站設有一定位擒塊,其位於第二檢測 站之檢測區底緣,其利用氣壓缸進行抬升及下降,以 使該I C元件選擇定位於該檢測區及通過該檢測區。 1 6、依申請專利範圍第1項所述之I c元件外觀檢測裝置, 其中該第二檢測站之下方包含另一旋轉機構,其用以 再次9 0 轉動已通過該第二檢測站之IC元件,以便將 I C元件依原裝料方向回收至各I c料管内。V. Scope of patent application Set up a glass plate to form a detection area. 11. The IC component appearance inspection device according to Item 10 of the declared patent scope, wherein the image capturing unit pair is located directly above the detection area, and the first light source, the second light source, the reflector, and the diffusion plate are disposed in the detection area. Second, the image capturing unit is located on two sides directly below the detection area, and the north two light source is located directly below the detection area. / Moonlight 1 2. According to the c-component appearance inspection device described in Item 10 of the scope of the patent application, wherein the first light source and the backlight light source use the same first light, and the second light source uses a different light source. Two shades of light. 1 3. According to the IC device appearance detection device described in Item 12 of the scope of the patent application, the first light source and the backlight light source are red sLEE) lamps, and the second light source is a green LED lamp. 14. According to the I c component appearance inspection device described in Item 10 of the scope of patent application, wherein the image capture unit selects the use of a CCD type, a CMOS type digital, and an image capture unit in order to output an image digital file to a computer Perform image analysis processing. 15. According to the I c component appearance inspection device described in item 1 of the scope of the patent application, the first inspection station is provided with a positioning block, which is located at the bottom edge of the inspection area of the second inspection station. It is lifted by a pneumatic cylinder. And down so that the IC component is selectively positioned in the detection area and passes through the detection area. 16. The appearance inspection device for IC components according to item 1 of the scope of the patent application, wherein the second inspection station includes another rotating mechanism for rotating the IC that has passed the second inspection station again by 90. Components in order to recycle the IC components into each I c material tube in the original material direction. M269454 五、申請專利範圍 17、依申請專利範圍第16項所述之1C元件外觀檢測裝 動 18 其中該旋轉機構設有一驅動裝置及一旋轉盤,^ ^, 裝置用以帶動該旋轉盤形成9 0。轉動。 Λ驅 請專利範圍第Η項所述之1C元件外觀檢測 其中该旋轉盤上設有一L形導軌及_ : I, 盤轉動前:該L形導執的開口之一;;;方=轉 以引入1C 70件’在該旋轉盤轉動後 口之—銜接下方之滑軌,以導出“元件。的開M269454 Fifth, the scope of the applied patent 17, the appearance inspection of the 1C component according to item 16 of the scope of the applied patent 18, where the rotating mechanism is provided with a driving device and a rotating disk, ^ ^, the device is used to drive the rotating disk to form 9 0. Turn. Λ drives the appearance inspection of the 1C component described in item Η of the patent scope. The rotary disk is provided with an L-shaped guide and _: I. Before the disk rotates: one of the openings of the L-shaped guide; Introduce 1C 70 pieces' after the rotation of the rotary disk—connect the slide rails below to derive the opening of "components." C:\Logo-5\Five Continents\PK9678.ptd 第18頁C: \ Logo-5 \ Five Continents \ PK9678.ptd Page 18
TW93221236U 2004-12-30 2004-12-30 IC lead scanner TWM269454U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381200B (en) * 2008-11-11 2013-01-01 Au Optronics Suzhou Corp Alignment inspection method and apparatus
CN103813703A (en) * 2012-11-09 2014-05-21 财团法人工业技术研究院 Method and system for judging pin positions of electronic parts and inserting electronic parts
CN114950990A (en) * 2020-11-30 2022-08-30 深圳市华力宇电子科技有限公司 Receiving mechanism and corresponding IC chip detection device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381200B (en) * 2008-11-11 2013-01-01 Au Optronics Suzhou Corp Alignment inspection method and apparatus
CN103813703A (en) * 2012-11-09 2014-05-21 财团法人工业技术研究院 Method and system for judging pin positions of electronic parts and inserting electronic parts
TWI493201B (en) * 2012-11-09 2015-07-21 Ind Tech Res Inst Method and system for pins detection and insertion of electrical component
CN103813703B (en) * 2012-11-09 2016-05-11 财团法人工业技术研究院 Method and system for judging pin positions of electronic parts and inserting electronic parts
US9456536B2 (en) 2012-11-09 2016-09-27 Industrial Technology Research Institute Method for pins detection and insertion of electronic component
CN114950990A (en) * 2020-11-30 2022-08-30 深圳市华力宇电子科技有限公司 Receiving mechanism and corresponding IC chip detection device
CN114950991A (en) * 2020-11-30 2022-08-30 深圳市华力宇电子科技有限公司 Detection mechanism and corresponding IC chip detection device
CN114950990B (en) * 2020-11-30 2023-12-29 深圳市华力宇电子科技有限公司 IC chip detecting device
CN114950991B (en) * 2020-11-30 2023-12-29 深圳市华力宇电子科技有限公司 Detection mechanism and corresponding IC chip detection device

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