TWM248021U - Structure of probe card - Google Patents

Description

M248021 V. Creation Instructions (l) [Technical Field to which the New Type belongs] This creation relates to a detection card, and particularly to a detection card with a grooved elastic buffer layer. [Previous technology] It is known that integrated circuits are formed on a semiconductor wafer through multiple 2s. When the wafer is not cut into multiple individual wafer types, the wafer needs to be tested to know the integrated circuits. Electrical function, and a test apparatus using a semiconductor wafer is equipped with a probe card [pr0be card], the probe card includes a probe head (Pi ^ b'head) and a multilayer circuit A plurality of probe pins are formed on the meter and the head of the disc-shaped printed circuit board for electrically connecting the solder pads 晴) or the bumps (b), for testing the detection of the wafer integrated circuit. Card, as disclosed in China's Patent Bulletin No. 50481 9 "Detection of Γ / Λββ · ® Probe Card Combination Structure", please refer to the Mth wooden test card combination structure system including a circuit board 10, a socket connection The mounting substrate 3Q, less i-the second stone substrate 40 and a plurality of electrical properties = device 50 'the socket 20 series, combined with the circuit board 10, the first silicon-based substrate is combined with the substrate The seat 20 is formed on the upper surface of the first stone substrate 30: a plurality of electrodes 31, pads 32, and The connection pad 33, the first silicon-based electrode 31 and the solder pads 32 are electrically connected to the corresponding ones, and the lower surface of the first silicon substrate 40 is bonded to the first silicon-based surface without covering the first silicon-based surface. The electrodes 31 of the first silicon substrate 30 and the pads 4 ° above the second silicon substrate are formed with a plurality of electrical and connecting pads 42 'around the second silicon substrate 40. The electrodes 41 Creation instructions (2) ϊ: ϊί ϊ ΐ: 连接 of the connection pad 42, and the sexual connection of the second stone substrate 40 is connected to the pad 32 of the 3rd wonderful substrate 3G, the electrical circuit boards Π0 is f-connected to the connection pad 33 of the first silicon substrate 30 to the or metal II. @ = J These electrical connection devices 5 0 is a flexible printed circuit board Gokin :: line 'and no other dielectric material package Overlay is prone to noise. 537496 Γ "Another kind of conventional probe card" is the first system in China's patent announcement, the two systems ::, the combination structure of the probe card for the connection line, X; two of them have a main substrate, a silicon substrate It is provided with a plurality of coaxial transmission and supply power sources I. The light is provided on the main substrate, and has a plurality of probes to be tested. [The periphery of the Shixi substrate is provided with at least one socket. To maintain electrical continuity, the coaxial transmission ΓΓί holder and the main substrate are used to change the connection line. When the socket substrate is used, the coaxial transmission lines must be combined with the two boards, and because of the large number of coaxial transmission lines To: The coaxial transmission lines-when connected to the main substrate, it is not easy to accurately [new content] "The main purpose of this creation is to provide a probe card structure, using: elastic buffer layer formed with a plurality of grooves, When a plurality of coaxial cables are provided with a J 垓 elastic buffer layer 'and connected to a detection head, the grooves guide the j 2 coaxial cables, so that the coaxial cables are accurately aligned and installed in the elastic buffer. Floor The second purpose of this creation is to provide a probe card structure that uses

Page 6 M248021 V. Creative Instructions (3)-: The buffer layer is placed between a base and a probe, and the stress of the head when testing a semiconductor wafer. The collection of money is based on the structure of the probe card created by this article. It consists of a circuit board, an elastic buffer layer, a probe head, and a plurality of second power units. The board system has a surface and a positioning hole. The base system :: : Hole 'The elastic buffer layer is provided on the base, and the elastic buffer layer is: 嫜 Here, 鲞 ^ face and at least one side, the front face is formed with a plurality of grooves, and one end of the two grooves is exposed at On the side, the probe head is provided on the elastic buffer layer, the probe head has a probe surface and a back surface, the probe surface is formed with a plurality of probe pins, and the back surface is formed with a plurality of guides. Terminals, the probe pins are electrically connected to the lead terminals, each coaxial cable system includes a center wire, each center wire is covered with an outer dielectric layer, each of: the wire system has a first One end and a second end, the first system of the center wires is not covered by the outer dielectric layers, and is disposed in the grooves of the elastic buffer layer, and the second end system of the center wires It is arranged on the surface of the circuit board and is used for transmitting test signals. [Embodiment] With reference to the attached drawings, the present invention will enumerate the following embodiment descriptions. According to a specific embodiment of the present invention, please refer to FIG. 2, a structure of a detection card 100 ′ includes a circuit board 110, a base 1 2 0, an elastic buffer layer 1 3 0, and a detection head. 1 40 and a plurality of coaxial cables (CCoaxial Cable) 150, wherein the circuit board 110 is a multilayer printed circuit board or a multilayer ceramic circuit board formed with a detection circuit for assembling to a semiconductor test machine (not shown in the figure) ) Transmission interface, the circuit board

Page 7 M248021 V. Creation Instructions (4)

The material of 110 is FR-4, FR-5 or BT. It has a surface 111 and a positioning hole 11 2. The positioning hole 1 1 2 can pass through the circuit board 11 0 or not pass through the circuit board 110. The positioning hole 11 2 is rectangular. The material of the base 1 2 0 is metal such as Shao, iron or copper, and the size of the base 1 2 0 is not larger than the positioning hole 1 12 to be provided in the Positioning holes of the circuit board 1 1 0 2 The elastic buffer layer 1 30 is provided on the base 12 2 The material of the elastic buffer layer 1 3 0 is polyimide (PI), silicone Or rubber to protect the probe head 1 40 and absorb the probe head] 40. When testing a semiconductor wafer, the elastic buffer layer 130 has a front surface 1 31 and at least one side surface 132, and the front surface 131 is formed. There are a plurality of v-shaped or u-shaped grooves 133. One end of the grooves 133 is exposed on the side 32, and the grooves 33 are filled with solder 160 or anisotropic conductive adhesive [anis〇tr〇 pic conductive paste, ACP], an adhesive layer 170 is provided between the elastic buffer layer 13 and the probe u ′, so that the probe 140 is adhered to the elastic buffer. On layer 130, the material of the probe head 40 may be a ceramic substrate or a silicon substrate to reduce the difference in thermal expansion coefficient between the probe head 40 and the semiconductor wafer. The probe head 40 includes a probe surface 141 and A back surface 142, the probe surface 141 is formed with a plurality of probe pins 143, and the probe pins 143 are formed by Micro Electro Mechanical System (MEMS) technology.

It has a variety of feasible types, such as a vertical vertical stylus or a flexible elastic stylus with a bent shape, etc., for testing the semiconductor device to be tested. Lead terminals 144, the lead terminals 144 are solder balls or bumps corresponding to the grooves 133, and are combined with the solder 16 in the grooves 133. In this embodiment, the detection Head 14o series

Page 8 M248021 V. Creation instructions (5) A plurality of through holes 1 4 5 are formed. The through holes 1 4 5 are penetrating the probe surface 1 4 1 and the back surface 1 4 2 and the probe pins 1 The 4 3 series are electrically connected to the lead ends 1 4 4 through the through holes 1 4 5. Each coaxial cable 1 50 includes a center wire 151, and each center wire 151 is covered with an outer dielectric. The electrical layer 152, preferably, an inner dielectric layer and a conductive shield are provided between the center wires 151 and the outer dielectric layer 152 of the coaxial cables 150, that is, the outer dielectric layers 152 cover the conductive shields. Sleeves, the conductive shields covering the inner dielectric layers, the inner dielectric layers covering the center conductors 151, each center conductor 151 having a first end 151a and a second end 151b, the The first ends 151a of the center wires 151 are not covered by the outer dielectric layer 152, the inner dielectric layer, and the conductive shield, and the first ends 1 5 1 a of the center wires 1 5 1 are provided at The grooves 1 3 3 of the elastic buffer layer 1 3 0, preferably, the first ends 1 51 a of the center wires 1 51 are formed with fresh material 1 6 0, so that the center wires 1 5 1 First end 151a The plurality of solder 160 in grooves 133 closely, the plurality of center conductors 151 of the second end 151 disposed in line B of the surface of the circuit board 1 π 1 1 billion, the test signal for transmission. When the coaxial cables 150 are installed in the elastic buffer layer 130, the grooves formed in the elastic buffer layer 130 are used to guide the coaxial cables 150 to make the These coaxial cables are accurately aligned, and the coaxial cables 150 are connected to the probe 140. In addition, since the elastic buffer layer 13 is provided on the base 120 and the probe 1, 4 In between, it can absorb the stress of the probe 1 40 when testing the semiconductor wafer. The scope of protection of this creation shall be determined by the scope of the attached patent application ’Anyone who is familiar with this skill will not deviate from the spirit and scope of this creation

Page 9 M248021

Page 10 M248021

Simple description of the formula C ® 4] & Figure 1: Cross-sectional schematic diagram of the structure of the probe card combination for testing semiconductor wafers in China Patent Bulletin No. 5048 1 9; and Figure 2 • Implementation in accordance with one of this creation Example, a schematic cross-sectional view of a probe card structure. Simple explanation of component symbols: 10 circuit board 2 0 socket 30 first silicon substrate 31 33 connection pad 40 second silicon substrate 41 50 electrical connection device 100 detection card 110 circuit board 111 120 base 130 elastic buffer layer 131 133 groove 140 Probe head 141 143 Probe pin 144 150 Coaxial electrical gauge 151 151b Second end 152 160 Solder 170 Adhesive layer electrode 32 Pad electrode 42 Connection pad surface 112 Positioning hole front side 132 Side contact surface 142 Back side lead end 145 Conduction Hole center wire outer dielectric layer 151a first end

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Claims (1)

M248021 [Scope of patent application] 1. A probe card structure, including a circuit board having a surface; a base provided on the circuit board; an elastic buffer layer having a front surface and at least it attached to the base The elastic buffer layer has a side surface, the front surface is formed with a plurality of grooves, one end of the grooves is exposed on the side surface and the elastic buffer layer is provided, and the probe head has a ^ surface and a back surface, The probe surface is formed with a plurality of probe pins and a plurality of lead terminals, and the probe needles correspond to the grooves with the lead terminals of the pens; and a probe head, a probe The plural contacts are electrically connected to form a sexual connection. Cable, each center conductor has an electrical layer envelope end system 2. If the first end of the cable is buffered, and the circuit is provided in the patented layer of the trench cable, the female-coaxial cable system includes a center The wires are covered with an outer dielectric layer, and each center wire is a second end, and the first ends are not surrounded by the grooves outside the elastic buffer layer, and the surface of the second plates. . The detection card structure described in item 1, wherein the bomb is V-shaped. 3. The probe card structure as described in item 1 of the scope of patent application, further comprising an anisotropic conductive adhesive, which is filled in the grooves. 4. The probe card structure described in item 1 of the scope of patent application, wherein the first ends of the center wires are formed with solder. 5. The probe card structure described in item 1 of the scope of patent application, wherein the lead end of the probe is a solder ball. Page 12 M248021 The probe card structure according to item 1 of the scope of patent application, wherein the probe head is formed with a plurality of through holes. 7. The probe card structure as described in item 丨 of the patent application scope, further comprising an adhesive layer, which is disposed between the back surface of the probe head and the elastic buffer layer. The probe card structure as described in the first item of the patent application scope, wherein the circuit board is formed with a positioning hole. The probe card structure as described in item 1 of the scope of patent application, wherein the material of the base is metal. 3. A probe card structure comprising: a circuit board; / an elastic buffer layer provided on the circuit board, the elastic buffer layer having at least one side, and the elastic buffer layer formed with a plurality of grooves. One end of the grooves is exposed on the side; a probe head is provided on the elastic buffer layer, the probe head has a probe surface, and the probe surface is formed with a plurality of probe pins; and For coaxial cables, one end of the coaxial cables is provided in the grooves of the elastic buffer layer, and the other end of the coaxial cables is provided in the circuit board. 11. The probe card structure as described in item 10 of the scope of patent application, wherein the groove of the elastic buffer layer is V-shaped. 1 2. The probe card structure as described in item No. 丨 0 of the patent application scope, which additionally includes an anisotropic conductive adhesive, which is filled in the grooves. 1 3. The probe card structure as described in the scope of application for patent No. 丨 0, wherein the Page 13 M248021 6. Scope of patent application The probe head is formed with a plurality of through holes. 14. The probe card structure as described in item 10 of the scope of patent application, which additionally includes an adhesive layer, which is disposed between the probe head and the elastic buffer layer. 15. The detection card structure according to item 10 of the scope of patent application, wherein the circuit board is formed with a positioning hole. 16. The probe card structure as described in item 10 of the scope of patent application, wherein the material of the base is metal. Page 14