TWI900227B - Positioning adjustment system for laser processing and operating method thereof - Google Patents

Abstract

A positioning adjustment system for laser processing and an operating method thereof are provided. A processor of the positioning adjustment system outputs two batches of a first control voltage and a second control voltage to a first galvo scanner and a second galvo scanner of a scanning module, respectively, so that a laser beam sequentially forms a first focusing point and a second focusing point at two corresponding positions in a processing area. A position detector of a platform unit is then used to detect a displacement between the first focus point and the second focus point of the laser beam to adjust the first galvo scanner and the second galvo scanner so that the positioning of the focus point of the laser beam in the processing area can be corrected.

Description

Positioning adjustment system for laser processing and operating method thereof

The present invention relates to a processing system and an operating method thereof, and in particular to a positioning adjustment system for laser processing and an operating method thereof.

Typically, laser processing involves focusing a penetrating laser beam onto a workpiece and irradiating it to separate it. Specifically, laser processing involves modulating the laser beam through a laser source and other optical components, controlling the laser beam's focus to a specific location on the workpiece for processing.

Currently, the primary method for laser processing is row-by-row or column-by-column scanning. However, both methods utilize micro-motors to control the rotation of the scanning lens to control the row-by-row and column-by-column movement of the laser beam. However, this method still results in a significant degree of positioning error at the laser beam's focal point, making it impossible to achieve precise processing results on the workpiece.

Therefore, in order to overcome the shortcomings and deficiencies in the prior art, it is necessary to provide an improved positioning adjustment system for laser processing and an operating method thereof to solve the problems existing in the above-mentioned conventional technology.

The primary objective of this invention is to provide a positioning adjustment system for laser machining and its operating method. Two batches of control voltages are used to operate a first galvanometer scanner and a second galvanometer scanner to transfer the laser beam's focal point at two locations, thereby obtaining a displacement. The correlation between the displacement and the control voltage is then calculated to calibrate the positioning of the laser beam's focal point within the machining area, thereby achieving higher machining accuracy and micromachining technology.

To achieve the above-mentioned purpose, the present invention provides a positioning adjustment system for laser processing, comprising an oscillator, an optical module, a scanning module, a platform unit and a processor; the oscillator is used to emit a laser beam; the optical module is located on a path transmitted by the laser beam and is used to adjust the diffusion angle of the laser beam; the scanning module is set on the laser beam The laser beam is focused on a processing area through the first galvanometer scanner, the second galvanometer scanner and the lens. The platform unit is arranged in the processing area and is located below the lens of the scanning module. The platform unit includes a platform and a position detection unit. The platform is configured to place a processing object in a processing area, and the position detector is disposed in the platform to detect the position of the focal point of the laser beam. The processor is electrically connected to the first galvanometer scanner, the second galvanometer scanner, and the position detector. The processor outputs at least two batches of first control voltage and second control voltage to the first galvanometer scanner and the second galvanometer scanner, respectively, so that the laser beam sequentially forms a first focal point and a second focal point at two positions corresponding to the processing area. The position detector is then used to detect a displacement between the first focal point and the second focal point of the laser beam, so as to adjust the first galvanometer scanner and the second galvanometer scanner to correct the positioning of the focal point of the laser beam in the processing area.

In one embodiment of the present invention, the optical module includes a wave plate stage and a stage controller. The wave plate stage is positioned in the path of the laser beam and after the oscillator. The stage controller is electrically connected between the processor and the wave plate stage and is configured to control the rotation angle of the wave plate stage.

In one embodiment of the present invention, the optical module further includes a polarizer and an obstruction device. The polarizer is disposed in the path of the laser beam and located behind the wave plate turret. The polarizer is configured to separate the laser beam into a polarized beam. The obstruction device is disposed in the path of the polarized beam and located behind the polarizer. The obstruction device is configured to obstruct the polarized beam.

In one embodiment of the present invention, the optical module further includes a beam splitter and a beam monitor. The beam splitter is arranged in the path of the laser beam and is located after the polarizer. The beam splitter is configured to split the laser beam into a branch beam. The beam monitor is arranged in the path of the branch beam and is located after the beam splitter. The beam monitor is configured to monitor the directionality of the branch beam.

In one embodiment of the present invention, a first galvanometer scanner includes a first motor and a first galvanometer. The first galvanometer is positioned in the path of the laser beam and after the beam splitter. The first motor is configured to receive a first control voltage from a processor and drive the first galvanometer to swing an angle corresponding to the first control voltage.

In one embodiment of the present invention, the second galvanometer scanner includes a second motor and a second galvanometer. The second galvanometer is positioned in the path of the laser beam and between the first galvanometer and the lens. The second motor is configured to receive a second control voltage from the processor and drive the second galvanometer to swing an angle corresponding to the second control voltage.

In one embodiment of the present invention, the first galvanometer scanner is configured to focus the laser beam in a first direction corresponding to the processing area based on a first control voltage, and the second galvanometer scanner is configured to focus the laser beam in a second direction corresponding to the processing area based on a second control voltage. The platform unit further includes a platform driver electrically connected between the processor and the platform. The platform driver is configured to drive the platform to move along the first direction or the second direction.

To achieve the above-mentioned objectives, the present invention provides an operating method for a positioning and adjustment system for laser processing, comprising: step S201: placing a processing object on a processing area of a platform of a platform unit; step S202: emitting a laser beam using an oscillator and adjusting the divergence angle of the laser beam through an optical module so that the laser beam is transmitted along a path; step S203: outputting a first control voltage and a second control voltage in batches to a first galvanometer scanner and a second galvanometer scanner of a scanning module through a processor, respectively, so that the laser beam forms a first focal point at a position corresponding to the processing area; step S204: The processor outputs a second batch of first control voltages and second control voltages to the first galvanometer scanner and the second galvanometer scanner of the scanning module, respectively, so that the laser beam forms a second focal point at another position corresponding to the processing area; and step S205: using a position detector of the platform unit to detect a displacement between the first focal point and the second focal point of the laser beam to adjust the first galvanometer scanner and the second galvanometer scanner to correct the positioning of the focal point of the laser beam in the processing area.

In one embodiment of the present invention, step S202 further includes using a beam splitter of the optical module to split the laser beam into a branch beam, and then monitoring the directionality of the branch beam through a beam monitor of the optical module.

In one embodiment of the present invention, the first galvanometer scanner is configured to focus the laser beam in a first direction corresponding to the processing area based on a first control voltage, and the second galvanometer scanner is configured to focus the laser beam in a second direction corresponding to the processing area based on a second control voltage. Step S204 further includes displacing the focal point of the laser beam at the two positions in a direction parallel to the first direction or the second direction.

As described above, transmitting the laser beam through the first and second galvanometer scanners of the scanning module offers the advantages of high energy density, fast processing speed, and minimal heat impact on the processing area. Simultaneously, utilizing two batches of control voltages, the first and second galvanometer scanners are operated to transmit the laser beam at the focal points of the two locations, thereby obtaining displacement. The correlation between the displacement and the control voltage is then calculated to calibrate the positioning of the laser beam's focal point within the processing area, thereby achieving higher processing precision and micromachining technology.

In order to make the above-mentioned and other purposes, features and advantages of the present invention more clearly understood, the following will specifically cite the embodiments of the present invention and provide detailed descriptions with reference to the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as up, down, top, bottom, front, back, left, right, inside, outside, side, periphery, center, horizontal, transverse, vertical, longitudinal, axial, radial, topmost or bottommost, etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention. It should be noted that the drawings are all simplified schematic diagrams, and therefore, only the components and combination relationships related to the present invention are shown to provide a clearer description of the basic structure or implementation method of the present invention, and the actual components and layout may be more complex. In addition, for the sake of convenience, the elements shown in the various figures of the present invention are not drawn to scale with the actual number, shape, and size. The detailed scale can be adjusted according to design requirements.

Referring to FIG. 1 , there is shown a schematic diagram of an embodiment of the positioning and adjustment system for laser processing according to the present invention. The positioning and adjustment system for laser processing includes an oscillator 2, an optical module 3, a scanning module 4, a platform unit 5, and a processor 6. Through a non-contact processing mode, a micron-scale light spot is formed on the surface of the object being processed. The detailed structure, assembly relationship, and operating principle of each component are described in detail below.

Specifically, oscillator 2 is used to emit a laser beam, wherein the laser beam is an ultrashort laser with high peak power and narrow pulse width. In this embodiment, oscillator 2 uses titanium sapphire as the gain medium.

1 and 2 , FIG2 is a schematic diagram of a beam splitter and a beam monitor according to an embodiment of the present invention for positioning and adjusting a system for laser processing, wherein an optical module 3 is located on a path B along which the laser beam is transmitted, and is used to adjust the divergence angle of the laser beam.

Specifically, the optical module 3 includes a wave plate stage 31, a stage controller 32, a polarizer 33, and an absorber 34. The wave plate stage 31 is positioned along the path B of the laser beam and after the oscillator 2. The stage controller 32 is electrically connected between the processor 6 and the wave plate stage 31. The stage controller 32 is configured to control the rotation angle of the wave plate stage 31 to change the polarization direction of the laser beam.

In addition, a polarizing filter 33 is disposed on the path B of the laser beam and is located after the wave plate turret 31. The polarizing filter 33 is configured to separate the laser beam into a polarized beam. The polarized beam propagates along the path B1, wherein the laser beam reflected from the polarizing filter 33 and the polarized beam passing through the polarizing filter 33 each have two orthogonal linear polarization components. The blocker 34 is disposed on the path B1 of the polarized beam and is located after the polarizing filter 33. The blocker 34 is configured to block the polarized beam.

More specifically, optical module 3 further includes a beam splitter 35, a beam monitor 36, and an optical path element 37. Beam splitter 35 is positioned along path B of the laser beam and after polarizer 33. Beam splitter 35 is configured to split the laser beam into a branch beam, which propagates along path B2. Beam monitor 36 is positioned along path B2 of the branch beam and after beam splitter 35. Beam monitor 36 is configured to monitor the directionality of the branch beam. Optical path element 37 is positioned between polarizer 33 and beam splitter 35 and is used to adjust the path B along which the laser beam propagates. In this embodiment, beam splitter 35 is an optical element used to split a single incident beam into two independent beams, such as a laser beam and a branch beam.

For example, when the branch light beam is guided along path B2 into the photocoupler sensor of the beam monitor 36, the light flux received by the pixels at different positions on the chip of the photocoupler sensor is converted into an electrical signal, and then converted into a digital signal through an amplifier. The light intensity of the pixels at each position of the branch light beam in an array can be plotted, and the beam monitor 36 can detect the spot shape and center position of the branch light beam.

During operation, if the change in the spot shape of the branched beam detected by the beam monitor 36 exceeds 5% of the original design, the beam monitor 36 sends a signal back to the processor 6, which then stops the system and notifies personnel for maintenance. If the center position of the branched beam spot detected by the beam monitor 36 changes, the beam monitor 36 sends a signal back to the processor 6, which then immediately controls the corresponding positions of the first galvanometer scanner 41, the second galvanometer scanner 42, and the platform 51 located in the processing area A to compensate. If the instantaneous change in the center position exceeds an absorbance of 50 urad, the beam monitor 36 sends a signal back to the processor 6, which then stops the system and notifies personnel for maintenance.

Accordingly, by setting a beam monitor 36 in the path B2 of the branched light beam, the spot shape and the center position of the branched light beam can be effectively detected. When the spot shape and the center position of the branched light beam exceed the set value, the corresponding positions of the first galvanometer scanner 41, the second galvanometer scanner 42 and the platform 51 located in the processing area A are controlled to perform real-time correction on the processing position, thereby improving its processing accuracy.

1 and 3 , FIG3 is a schematic diagram illustrating an embodiment of a positioning and adjustment system for laser processing according to the present invention, including a first galvanometer scanner and a second galvanometer scanner, wherein the scanning module 4 is disposed on the path B of the laser beam and located behind the optical module 3 .

Specifically, the scanning module 4 includes a first galvanometer scanner 41, a second galvanometer scanner 42, and a lens 43. The laser beam is focused on a processing area A along a path B through the first galvanometer scanner 41, the second galvanometer scanner 42, and the lens 43. The first galvanometer scanner 41 is configured to focus the laser beam in a first direction corresponding to the processing area A (e.g., the X-axis direction) based on a first control voltage, and the second galvanometer scanner 42 is configured to focus the laser beam in a second direction corresponding to the processing area A (e.g., the Y-axis direction) based on a second control voltage.

In this embodiment, the first galvanometer scanner 41 includes a first motor 411 and a first galvanometer 412. The first galvanometer 412 is positioned along the path B of the laser beam and after the beam splitter 35. The first motor 411 is configured to receive a first control voltage from a processor 6 (e.g., an industrial computer (IPC)) and drive the first galvanometer 412 to swing a corresponding angle based on the first control voltage. Furthermore, the second galvanometer scanner 42 includes a second motor 421 and a second galvanometer mirror 422. The second galvanometer mirror 422 is positioned along the laser beam path B and between the first galvanometer mirror 412 and the lens 43. The second motor 421 is configured to receive a second control voltage from the processor 6 and, in response to the second control voltage, drive the second galvanometer mirror to oscillate by a corresponding angle. In this embodiment, the micro-motors of the first motor 411 and the second motor 421 respectively control the rotation of the first galvanometer mirror 412 and the second galvanometer mirror 422, rapidly changing the laser beam's exit position and thereby cutting the object 101 that meets specifications.

1 and 2 , the platform unit 5 is disposed in the processing area A and is located below the lens 43 of the scanning module 4. The platform unit 5 includes a platform 51, a position detector 52, and a platform driver 53. The platform 51 is configured to place the processing object 101 in the processing area A. The position detector 52 (e.g., a charge-coupled device detector, CCD Detector) is disposed within the platform 51 to detect the position of the focal point P of the laser beam. The platform driver 53 is electrically connected between the processor 6 and the platform 51. The platform driver 53 is configured to drive the platform 51 to move along a first direction or a second direction, i.e., the X-axis direction or the Y-axis direction.

1 and 4, FIG4 is a schematic diagram showing the movement of the focal point of the laser beam between two positions according to an embodiment of the positioning adjustment system for laser processing of the present invention, wherein the processor 6 is electrically connected to the first galvanometer scanner 41 and the second galvanometer scanner 42 of the scanning module 4 and the position detector 52 of the platform unit 5. Specifically, the processor 6 outputs the first galvanometer scanner 41 and the second galvanometer scanner 42 to the position detector 52. By applying two batches of the first control voltage and the second control voltage, the laser beam sequentially forms a first focal point P1 and a second focal point P2 at two positions corresponding to the processing area A. The position detector 52 is then used to detect a displacement between the first focal point P1 and the second focal point P2 of the laser beam to adjust the first galvanometer scanner 41 and the second galvanometer scanner 42 to correct the positioning of the focal point P of the laser beam in the processing area A.

For example, as shown in FIG5 , an embodiment of the positioning adjustment system for laser processing of the present invention is disclosed, which is a schematic diagram of a light beam passing through a first galvanometer and a second galvanometer to a lens, wherein the light beam leaving the second galvanometer scanner 42 is split by a spectrometer 102 and then transmitted through a lens 43′ to a position detector 52 for measurement by the position detector 52.

5 and 6, FIG6 is a schematic diagram of beam positioning, the processor 6 gives at least two batches of first control voltages to the first galvanometer scanner 41 and the second galvanometer scanner 42 respectively. and the second control voltage , such as rated voltage ,Right now to , and then the position detector 52 measures the actual position of the light beam on the processing object 101 、 , such as positional values ,Right now to .

The above control voltage and beam positioning The relationship is , where A and B are parameters, through and The sum of squared errors of the two is calculated to obtain the optimal values of parameters A and B. Based on this, the parameters A and B are reversely calculated from the actual position value measured by the position detector 52 to compensate for the galvanometer angles of the first galvanometer scanner 41 and the second galvanometer scanner 42.

It should be noted that before calibration and compensation, the light beam is first projected onto the square pattern used for calibration to measure and determine whether the accuracy of the square pattern is the same as the design value. If it exceeds the defined tolerance, the galvanometers of the first galvanometer scanner 41 and the second galvanometer scanner 42 need to be calibrated and compensated.

According to the above structure, the laser beam generated by the oscillator 2, optical module 3, and scanning module 4 can process products at the micron level. The processing mode used for laser cutting is an ultra-short pulse laser, which reduces the heat-affected area of the processed object 101. The first motor 411 and the second motor 421 respectively drive the first galvanometer mirror 412 and the second galvanometer mirror 422 to rotate, rapidly changing the light output position of the laser beam, thereby enabling very fine cutting results for the processed object 101.

Furthermore, by changing the operating mode of the micro-motors within the galvanometers of the first and second galvanometer scanners 41 and 42, the focus position in the X- and Y-axis directions is adjusted, thereby changing the laser beam's emission position and cutting a standardized object 101. Furthermore, by observing the displacement of the laser beam's focus point using a position detector 52 mounted within the platform 51, the voltage of the first and second galvanometer scanners 41 and 42 relative to the displacement can be calculated, thereby improving the positioning accuracy of the system's processing. During the process of guiding the laser beam, by placing the beam splitter 35 and the beam monitor 36 on the path B of the laser beam, the stability of the directivity of the laser beam can be monitored in real time, and the positioning accuracy of the focus point of the laser beam can be corrected in real time.

Referring to FIG. 7 in conjunction with FIG. 1 , FIG. 7 is a flow chart illustrating the operating method of the positioning and adjustment system for laser processing according to the present invention. The operating method is performed using the positioning and adjustment system and includes steps S201, S202, S203, S204, and S205. The operating steps and operating principles of each component of the present invention are described in detail below.

In step S201, the object 101 is placed in the processing area A of the platform 51 of the platform unit 5. Next, in step S202, the oscillator 2 emits a laser beam, and the optical module 3 adjusts the divergence angle of the laser beam so that the laser beam propagates along path B. In this embodiment, a beam splitter 35 of the optical module 3 can also be used to split the laser beam into a branch beam (along path B2). The directionality of this branch beam (along path B2) is then monitored by a beam monitor 36 of the optical module 3.

As shown in FIG4 , in step S203, the processor 6 outputs a first control voltage and a second control voltage of a first batch to the first galvanometer scanner 41 and the second galvanometer scanner 42 of the scanning module 4, respectively, so that the laser beam forms a first focal point P1 at a position corresponding to the processing area A, wherein the first galvanometer scanner 41 is configured to focus the laser beam in a first direction (e.g., X-axis direction) corresponding to the processing area according to the first control voltage, and the second galvanometer scanner 42 is configured to focus the laser beam in a first direction (e.g., X-axis direction) corresponding to the processing area according to the second control voltage. The laser beam is focused in a second direction (e.g., the Y-axis direction) corresponding to the processing area. Then, in step S204, the processor 6 outputs a second batch of first control voltages and second control voltages to the first galvanometer scanner 41 and the second galvanometer scanner 42 of the scanning module 4, respectively, so that the laser beam forms a second focal point P2 at another position corresponding to the processing area. In this embodiment, the displacement direction of the focal point P of the laser beam at the two positions is parallel to the first direction (X-axis direction) or the second direction (Y-axis direction).

Finally, in step S205, the position detector 52 of the platform unit 5 is used to detect a displacement between the first focal point P1 and the second focal point P2 of the laser beam to adjust the first galvanometer scanner 41 and the second galvanometer scanner 42 to correct the positioning of the focal point P of the laser beam in the processing area.

As described above, the laser beam is transmitted through the first galvanometer scanner 41 and the second galvanometer scanner 42 of the scanning module 4, which has the advantages of high energy density, fast processing speed, and small heat impact area of the processing area A. At the same time, two batches of control voltages are used to operate the first galvanometer scanner 41 and the second galvanometer scanner 42 to transmit the laser beam at two positions, the first focal point P1 and the second focal point P2, to obtain the displacement. The correlation between the displacement and the control voltage is then calculated to correct the positioning of the focal point P of the laser beam in the processing area A, thereby achieving higher processing accuracy and micromachining technology.

Although the present invention has been disclosed with reference to the embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

101: Processing object 102: Spectrometer 2: Oscillator 3: Optical module 31: Wave plate stage 32: Stage controller 33: Polarizer 34: Blocker 35: Beam splitter 36: Beam monitor 37: Optical path element 4: Scanning module 41: First galvanometer scanner 411: First motor 412: First galvanometer 42: Second galvanometer scanner 421: Second motor 422: Second galvanometer 43, 43': Lens 5: Stage unit 51: Stage 52: Position detector 53: Stage driver 6: Processor A: Processing areas B, B1, B2: Path P: Focus point P1: First focus point P2: Second focus point X, Y: Coordinate axes 、 :position 、 :Control voltage 、 :Position value 、 :Rated voltage

FIG1 is a schematic diagram of an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG2 is a schematic diagram showing a beam splitter and a beam monitor according to an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG3 is a schematic diagram of a first galvanometer scanner and a second galvanometer scanner according to an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG4 is a schematic diagram showing the movement of the focal point of a laser beam between two positions according to an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG5 is a schematic diagram showing a light beam passing through a first galvanometer mirror and a second galvanometer mirror to a lens according to an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG6 is a schematic diagram illustrating beam positioning according to an embodiment of a positioning adjustment system for laser processing according to the present invention.

FIG. 7 is a flow chart illustrating an operating method of a positioning adjustment system for laser processing according to the present invention.

2: Oscillator

3: Optical module

31: Wave plate rotating stage

32: Turntable controller

33: Polarizing filter

34: Blocker

35: Beam splitter

36: Beam Monitor

37: Optical Path Components

4: Scanning module

5: Platform unit

51: Platform

52: Position Detector

53: Platform Driver

6: Processor

B, B1, B2: Path

Claims (10)

A positioning and adjustment system for laser processing includes: an oscillator for emitting a laser beam; an optical module located on a path along which the laser beam is transmitted, for adjusting the divergence angle of the laser beam; a scanning module disposed on the path of the laser beam and located behind the optical module, wherein the scanning module includes a first galvanometer scanner, a second galvanometer scanner, and a lens, wherein the laser beam is focused on a processing area via the first galvanometer scanner, the second galvanometer scanner, and the lens; a platform unit disposed in the processing area and located below the lens of the scanning module, the platform unit including a platform and a position detector, wherein the platform is configured to place a processing object in the processing area The processing area includes a processing area, a position detector disposed in the platform and configured to detect the position of the focal point of the laser beam; and a processor electrically connected to the first galvanometer scanner, the second galvanometer scanner, and the position detector. The processor outputs at least two batches of first control voltages and second control voltages to the first galvanometer scanner and the second galvanometer scanner, respectively, so that the laser beam sequentially forms a first focal point and a second focal point at two positions corresponding to the processing area. The position detector then detects a displacement between the first focal point and the second focal point of the laser beam to adjust the first galvanometer scanner and the second galvanometer scanner to correct the positioning of the focal point of the laser beam in the processing area. A positioning and adjustment system for laser processing as described in claim 1, wherein the optical module includes a wave plate turntable and a turntable controller, the wave plate turntable is arranged on the path of the laser beam and is located after the oscillator, the turntable controller is electrically connected between the processor and the wave plate turntable, and the turntable controller is configured to control the rotation angle of the wave plate turntable. A positioning and adjustment system for laser processing as described in claim 2, wherein the optical module further includes a polarizer and a blocker, the polarizer is arranged on the path of the laser beam and located behind the wave plate turret, the polarizer is configured to separate the laser beam into a polarized beam, the blocker is arranged on the path of the polarized beam and located behind the polarizer, and the blocker is configured to block the polarized beam. A positioning and adjustment system for laser processing as described in claim 3, wherein the optical module further includes a beam splitter and a beam monitor, the beam splitter is arranged on the path of the laser beam and is located after the polarizer, the beam splitter is configured to split the laser beam into a branch beam, the beam monitor is arranged on the path of the branch beam and is located after the beam splitter, and the beam monitor is configured to monitor the directionality of the branch beam. A positioning adjustment system for laser processing as described in claim 4, wherein the first galvanometer scanner includes a first motor and a first galvanometer, the first galvanometer is arranged on the path of the laser beam and is located after the beam splitter, and the first motor is configured to receive a first control voltage issued by the processor and drive the first galvanometer to swing an angle corresponding to the first control voltage. A positioning adjustment system for laser processing as described in claim 5, wherein the second oscillating mirror scanner includes a second motor and a second oscillating mirror, the second oscillating mirror is arranged on the path of the laser beam and is located between the first oscillating mirror and the lens, and the second motor is configured to receive a second control voltage issued by the processor and drive the second oscillating mirror to swing an angle corresponding to the second control voltage. A positioning adjustment system for laser processing as described in claim 1, wherein the first galvanometer scanner is configured to focus the laser beam in a first direction corresponding to the processing area based on the first control voltage, and the second galvanometer scanner is configured to focus the laser beam in a second direction corresponding to the processing area based on the second control voltage, and the platform unit further includes a platform driver electrically connected between the processor and the platform, and the platform driver is configured to drive the platform to move along the first direction or the second direction. A method for operating a positioning and adjustment system for laser processing includes: step S201: placing a processing object on a processing area of a platform of a platform unit; step S202: emitting a laser beam using an oscillator and adjusting the divergence angle of the laser beam through an optical module so that the laser beam is transmitted along a path; step S203: outputting a first control voltage and a second control voltage in batches to a first galvanometer scanner and a second galvanometer scanner of a scanning module through a processor, respectively, so that the laser beam forms a first focal point at a position corresponding to the processing area; step S204: The processor outputs a second batch of first control voltages and second control voltages to the first galvanometer scanner and the second galvanometer scanner of the scanning module, respectively, so that the laser beam forms a second focal point at another position corresponding to the processing area; and step S205: using a position detector of the platform unit to detect a displacement between the first focal point and the second focal point of the laser beam to adjust the first galvanometer scanner and the second galvanometer scanner to correct the positioning of the focal point of the laser beam in the processing area. The operating method of the positioning and adjustment system for laser processing as described in claim 8, wherein step S202 further includes using a beam splitter of the optical module to split the laser beam into a branch beam, and then monitoring the directionality of the branch beam through a beam monitor of the optical module. An operating method for a positioning and adjustment system for laser processing as described in claim 8, wherein the first galvanometer scanner is configured to focus the laser beam in a first direction corresponding to the processing area based on the first control voltage, and the second galvanometer scanner is configured to focus the laser beam in a second direction corresponding to the processing area based on the second control voltage, and step S204 further includes a displacement direction of the focal point of the laser beam at the two positions parallel to the first direction or the second direction.