[go: up one dir, main page]

TWI832205B - Optical measurement device and measurement method - Google Patents

Optical measurement device and measurement method Download PDF

Info

Publication number
TWI832205B
TWI832205B TW111113751A TW111113751A TWI832205B TW I832205 B TWI832205 B TW I832205B TW 111113751 A TW111113751 A TW 111113751A TW 111113751 A TW111113751 A TW 111113751A TW I832205 B TWI832205 B TW I832205B
Authority
TW
Taiwan
Prior art keywords
board
tested
image
sample plate
top surface
Prior art date
Application number
TW111113751A
Other languages
Chinese (zh)
Other versions
TW202340751A (en
Inventor
黃建德
黃敬恆
粘弘昇
張信澤
陳旅涵
Original Assignee
惠亞工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠亞工程股份有限公司 filed Critical 惠亞工程股份有限公司
Priority to TW111113751A priority Critical patent/TWI832205B/en
Publication of TW202340751A publication Critical patent/TW202340751A/en
Application granted granted Critical
Publication of TWI832205B publication Critical patent/TWI832205B/en

Links

Images

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

一種光學量測裝置與量測方法,其中主要利用三雷射測量儀進行雷射測量,先測量一樣本板以定義各雷射測量儀之間的關係,然後再測量待測板,可達到方便測量待測板的目的;此外,還可以影像測量進行輔助,影像測量以計算水平及垂直像素間距離的方式算出待測板的四邊長,可藉以減少誤差。 An optical measurement device and measurement method, which mainly uses three laser measuring instruments for laser measurement. First, a sample plate is measured to define the relationship between the laser measuring instruments, and then the plate to be measured is measured, which can achieve convenience The purpose of measuring the board to be tested; in addition, it can also be assisted by image measurement. Image measurement calculates the length of the four sides of the board to be tested by calculating the distance between horizontal and vertical pixels, which can reduce errors.

Description

光學量測裝置與量測方法 Optical measurement device and measurement method

本發明係關於一種光學量測裝置與量測方法;特別關於一種以雷射測量並可以影像測量進行輔助的光學量測裝置與量測方法。 The present invention relates to an optical measurement device and a measurement method; in particular, it relates to an optical measurement device and a measurement method that use laser measurement and can be assisted by image measurement.

高架地板的地板單元為一種長方體,頂面為方形,其加工精度要求很高,例如某些場合的公差範圍在正負0.01mm以內。然而,習用的測量方法大多採用人工測量,容易產生誤差,造成很多困擾。 The floor unit of the raised floor is a rectangular parallelepiped with a square top surface, and its processing accuracy is very high. For example, in some cases, the tolerance range is within plus or minus 0.01mm. However, most of the commonly used measurement methods use manual measurement, which is prone to errors and causes a lot of trouble.

發明人有鑑於此,乃苦思細索,積極研究,加以多年從事相關產品研究之經驗,並經不斷試驗及改良,終於發展出本發明。 In view of this, the inventor thought hard and actively researched. With many years of experience in related product research, and through continuous testing and improvement, he finally developed the present invention.

本發明的目的在於提供一種可方便測量待測板的光學量測裝置。 The object of the present invention is to provide an optical measuring device that can conveniently measure a board to be tested.

本發明達成上述目的之結構包括:一平台;一第一雷射測量儀,架設該平台的一側;一第二雷射測量儀,架設於該平台的相對於該第一雷射測量儀的另一側,與該第一雷射測量儀水平對正,並間隔一第一間隔距離;一第三雷射測量儀,架設於該平台的相對於該第一雷射測 量儀的另一側,與該第二雷射測量儀間隔一第二間隔距離。 The structure of the present invention to achieve the above object includes: a platform; a first laser measuring instrument installed on one side of the platform; and a second laser measuring instrument installed on the side of the platform relative to the first laser measuring instrument. The other side is aligned horizontally with the first laser measuring instrument and separated by a first separation distance; a third laser measuring instrument is installed on the platform relative to the first laser measuring instrument. The other side of the measuring instrument is separated from the second laser measuring instrument by a second separation distance.

較佳者,該平台上方架設有一照相機,能以影像測量進行輔助。 Preferably, a camera is installed above the platform to assist with image measurement.

較佳者,該平台為可調整高度的結構,可上升或下降,可方便測量不同高度的待測板。 Preferably, the platform is a height-adjustable structure that can be raised or lowered to facilitate measurement of boards to be tested at different heights.

本發明的另一目的在於提供一種可方便測量待測板的光學量測方法。 Another object of the present invention is to provide an optical measurement method that can conveniently measure the board to be tested.

本發明達成上述目的之步驟包括:S101:將一第一雷射測量儀架設於一平台的一側,並將一第二雷射測量儀及一第三雷射測量儀架設於該平台的相對於該第一雷射測量儀的另一側,該第一雷射測量儀與該第二雷射測量儀間隔一第一間隔距離(D1),該第二雷射測量儀與該第三雷射測量儀間隔一預定的第二間隔距離(D2);S102:將一樣本板放置在該平台上;該樣本板為長方體,頂面為方形,具有預定的樣本板頂面左邊長(L11)、樣本板頂面上邊長(L12)、樣本板頂面右邊長(L13)、樣本板頂面下邊長(L14);S103:分別以該第一、第二及第三雷射測量儀測量其與該樣本板之間的第一雷射間距(X1)、第二雷射間距(X2)及第三雷射間距(X3);S104:計算取得該第一間隔距離(D1)的數值;S105:取走該樣本板,將一待測板放置在該平台上;該待測板為長方體,頂面為方形,具有待測板頂面左邊長(L15)、待測板頂面上邊長(L16)、待測板頂面右邊長(L17)、待測板頂面下邊長(L18);S106:分別以該第 一、第二及第三雷射測量儀測量其與該待測板之間的第四雷射間距(X4)、第五雷射間距(X5)及第六雷射間距(X6);S107:計算取得該待測板頂面下邊長(L18)的數值。 The steps of the present invention to achieve the above object include: S101: Set up a first laser measuring instrument on one side of a platform, and set up a second laser measuring instrument and a third laser measuring instrument on the opposite side of the platform. On the other side of the first laser measuring instrument, the first laser measuring instrument and the second laser measuring instrument are separated by a first separation distance (D1), and the second laser measuring instrument and the third laser measuring instrument are separated by a first separation distance (D1). The radiometric measuring instruments are separated by a predetermined second separation distance (D2); S102: Place a sample plate on the platform; the sample plate is a rectangular parallelepiped, the top surface is square, and has a predetermined left side length of the top surface of the sample plate (L11) , the length of the top surface of the sample plate (L12), the length of the right side of the top surface of the sample plate (L13), and the length of the bottom surface of the top surface of the sample plate (L14); S103: Measure the first, second and third laser measuring instruments respectively. The first laser distance (X1), the second laser distance (X2) and the third laser distance (X3) between the sample plate and the sample plate; S104: Calculate and obtain the value of the first separation distance (D1); S105 : Take the sample board and place a board to be tested on the platform; the board to be tested is a rectangular parallelepiped with a square top surface, with the length of the left side of the top surface of the board to be tested (L15) and the length of the top surface of the board to be tested ( L16), the length of the right side of the top surface of the board to be tested (L17), and the length of the bottom side of the top surface of the board to be tested (L18); S106: respectively 1. The second and third laser measuring instruments measure the fourth laser distance (X4), the fifth laser distance (X5) and the sixth laser distance (X6) between them and the board to be tested; S107: Calculate and obtain the value of the lower side length (L18) of the top surface of the board to be tested.

較佳者,在該步驟S104中,以第一公式計算取得該第一間隔距離(D1)的數值;第一公式:

Figure 111113751-A0305-02-0005-1
,可方便確認第一及第二雷射測量儀之間的關係。 Preferably, in step S104, a first formula is used to calculate the value of the first separation distance (D1); the first formula:
Figure 111113751-A0305-02-0005-1
, which can easily confirm the relationship between the first and second laser measuring instruments.

較佳者,在該步驟S107中,以第二公式計算取得該待測板頂面下邊長(L18)的數值;第二公式:

Figure 111113751-A0305-02-0005-2
,可達到方便測量待測板的目的。 Preferably, in step S107, the second formula is used to calculate the value of the lower side length (L18) of the top surface of the board to be tested; the second formula:
Figure 111113751-A0305-02-0005-2
, which can achieve the purpose of conveniently measuring the board to be tested.

較佳者,在該步驟S102之後,進行步驟S201~S206;S201:將一照相機架設在該平台上方,並利用該照相機照相以取得一樣本板原圖;該照相機具有預定的水平解析度及垂直解析度;S202:對該樣本板原圖進行鏡頭魚眼校正,產生一樣本板校正圖;S203:將該樣本板校正圖轉換成一第一灰度圖,再將該第一灰度圖轉換成一第一輪廓圖;S204:對該第一輪廓圖進行四角點查找,取得一第一四角點座標;該第一四角點座標是在該樣本板校正圖中的樣本板的四角點座標;S205:計算取得在該樣本板 校正圖中的樣本板的第一水平像素範圍及第一垂直像素範圍;S206:計算取得該樣本板校正圖中的第一水平像素間距離及第一垂直像素間距離,可對待測板做影像測量。 Preferably, after step S102, perform steps S201 to S206; S201: Set up a camera above the platform, and use the camera to take pictures to obtain an original image of the sample plate; the camera has a predetermined horizontal resolution and vertical resolution. Resolution; S202: Perform lens fisheye correction on the original image of the sample plate to generate a sample plate correction image; S203: Convert the sample plate correction image into a first grayscale image, and then convert the first grayscale image into a The first contour map; S204: Perform a four-corner point search on the first contour map to obtain a first four-corner point coordinate; the first four-corner point coordinate is the four-corner point coordinate of the sample plate in the sample plate calibration map; S205: Calculation is obtained on the sample board Calibrate the first horizontal pixel range and the first vertical pixel range of the sample board in the calibration chart; S206: Calculate and obtain the first horizontal pixel distance and the first vertical pixel distance in the sample board calibration chart, which can be used to create an image of the test board Measure.

較佳者,在該步驟S105之後,進行步驟S207~S212;S207:利用該照相機照相以取得一待測板原圖;S208:對該待測板原圖進行鏡頭魚眼校正,產生一待測板校正圖;S209:將該待測板校正圖轉換成一第二灰度圖,再將該第二灰度圖轉換成一第二輪廓圖;S210:對該第二輪廓圖進行四角點查找,取得一第二四角點座標;該第二四角點座標是在該待測板校正圖中的樣本板的四角點座標;S211:計算取得在該待測板校正圖中的待測板頂面左邊像素範圍、待測板頂面上邊像素範圍、待測板頂面右邊像素範圍、待測板頂面下邊像素範圍;S212:計算取得在該待測板校正圖中的待測板頂面左邊長、待測板頂面上邊長、待測板頂面右邊長、待測板頂面下邊長,可對待測板做影像測量。 Preferably, after step S105, steps S207~S212 are performed; S207: Use the camera to take pictures to obtain an original image of the board to be tested; S208: Perform lens fisheye correction on the original image of the board to be tested to generate an original image of the board to be tested. Plate correction image; S209: Convert the plate correction image to be tested into a second grayscale image, and then convert the second grayscale image into a second contour image; S210: Perform a four-corner point search on the second contour image to obtain A second four-corner point coordinate; the second four-corner point coordinate is the four-corner point coordinate of the sample plate in the correction chart of the board to be tested; S211: Calculate and obtain the top surface of the board to be tested in the correction chart of the board to be tested The left pixel range, the upper pixel range of the top surface of the board to be tested, the pixel range of the right side of the top surface of the board to be tested, and the pixel range of the lower side of the top surface of the board to be tested; S212: Calculate and obtain the left side of the top surface of the board to be tested in the correction chart of the board to be tested The length, the length of the top side of the board to be tested, the length of the right side of the top surface of the board to be tested, and the length of the bottom side of the top surface of the board to be tested can be used for image measurement of the board to be tested.

較佳者,在該步驟S102之後,進行步驟S301~S311;S301:將一照相機架設在該平台上方,並利用該照相機照相以取得一樣本板原圖;該照相機具有預定的水平解析度及垂直解析度;S302:對該樣本板原圖進行鏡頭魚眼校正,產生一樣本板校正圖;S303:將該樣本板校正圖轉換成一第一灰度圖,再將該第一灰度圖轉換成一第一輪廓圖;S304:對該第一輪廓圖進行四角點查找,取得一第一四角點座標;該第一四角點座標是在該樣本板校正 圖中的樣本板的四角點座標;S305:設定一第三四角點座標,並將該第一四角點座標及第三四角點座標代入一第一透視變換公式,藉以計算出一透視變換矩陣;S306:將該透視變換矩陣代入該第一透視變換公式中以產生一第二透視變換公式;S307:以該第二透視變換公式對該樣本板校正圖進行透視變換,產生一樣本板俯視平面影像圖;S308:將該樣本板俯視平面影像圖轉換成一第三灰度圖,再將該第三灰度圖轉換成一第三輪廓圖;S309:對該第三輪廓圖進行四角點查找,取得一第四四角點座標;該第四四角點座標是在該樣本板俯視平面影像圖中的樣本板的四角點座標;S310;計算取得在該樣本板俯視平面影像圖中的樣本板的第二水平像素範圍及第二垂直像素範圍;S311:計算取得該樣本板俯視平面影像圖中的第二水平像素間距離及第二垂直像素間距離,可對待測板做影像測量。 Preferably, after step S102, perform steps S301 to S311; S301: Set up a camera above the platform, and use the camera to take pictures to obtain an original image of the sample plate; the camera has a predetermined horizontal resolution and vertical resolution. Resolution; S302: Perform lens fisheye correction on the original image of the sample plate to generate a sample plate correction image; S303: Convert the sample plate correction image into a first grayscale image, and then convert the first grayscale image into a The first contour map; S304: Perform a four-corner point search on the first contour map to obtain a first four-corner point coordinate; the first four-corner point coordinate is corrected on the sample plate The four corner point coordinates of the sample plate in the figure; S305: Set a third four corner point coordinate, and substitute the first four corner point coordinate and the third four corner point coordinate into a first perspective transformation formula to calculate a perspective Transformation matrix; S306: Substitute the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula; S307: Use the second perspective transformation formula to perform perspective transformation on the sample plate correction image to generate a sample plate Top-down plane image; S308: Convert the top-down plane image of the sample plate into a third grayscale image, and then convert the third grayscale image into a third contour image; S309: Perform four-corner point search on the third contour diagram , obtain a fourth four-corner point coordinate; the fourth four-corner point coordinate is the four corner point coordinates of the sample plate in the top-view plane image of the sample plate; S310; calculate and obtain the sample in the top-view plane image of the sample plate The second horizontal pixel range and the second vertical pixel range of the board; S311: Calculate and obtain the second horizontal distance between pixels and the second distance between vertical pixels in the top-view plane image of the sample board, which can be used for image measurement of the board to be tested.

較佳者,該第一透視變換公式為:

Figure 111113751-A0305-02-0007-3
,在該第一透視變換公式中,xi、yi為該第一四角點座標中的各點的座標,xj、yj為該第三四角點座標中的各點的座標,可方便進行透視變換。 Preferably, the first perspective transformation formula is:
Figure 111113751-A0305-02-0007-3
, in the first perspective transformation formula, xi and yi are the coordinates of each point in the first four-corner point coordinates, xj, yj are the coordinates of each point in the third four-corner point coordinates, which can facilitate perspective Transform.

較佳者,該第一、第三四角點座標中的各點的座標帶入該第一透視變換公式可求得該透視變換矩陣

Figure 111113751-A0305-02-0008-4
,再將該透視變換矩陣代入該第一透視變換公式中以產生一第二透視變換公式,第二透視變換公式為:
Figure 111113751-A0305-02-0008-5
,在該第二透視變換公式中,xk、yk為該樣本板校正圖中的各像素點的座標,算出的xm、ym即為樣本板俯視平面影像圖中的各像素點的座標,可提到測量精度。 Preferably, the perspective transformation matrix can be obtained by bringing the coordinates of each point in the first and third four-corner coordinates into the first perspective transformation formula.
Figure 111113751-A0305-02-0008-4
, and then substitute the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula. The second perspective transformation formula is:
Figure 111113751-A0305-02-0008-5
, in the second perspective transformation formula, xk and yk are the coordinates of each pixel point in the sample plate correction map, and the calculated xm and ym are the coordinates of each pixel point in the sample plate top-view plane image map. It can be provided to the measurement accuracy.

較佳者,在該步驟S105之後,先進行步驟S312~S318;S312:利用該照相機照相以取得一待測板原圖;S313:對該待測板原圖進行鏡頭魚眼校正,產生一待測板校正圖;S314:以該第二透視變換公式對該待測板校正圖進行透視變換,產生一待測板俯視平面影像圖;S315:將該待測板俯視平面影像圖轉換成一第四灰度圖,再將該第四灰度圖轉換成一第四輪廓圖;S316:對該第四輪廓圖進行四角點查找,取得一第五四角點座標;該第五四角點座標是在該待測板俯視平面影像圖中的待測板的四角點座標;S317:計算取得在該待測板俯視平面影像圖中的待測板頂面左邊像素範圍、待測板頂面上邊像素範圍、待測板頂面右邊像素範圍、待測板頂面下邊像素範圍;S318:計算取得在該待測板俯視平面影像圖中的待測板頂面左邊長、待測板頂面上邊長、待測板頂面右邊長、 待測板頂面下邊長,可對待測板做影像測量。 Preferably, after step S105, steps S312~S318 are performed first; S312: Use the camera to take pictures to obtain an original image of the board to be tested; S313: Perform lens fisheye correction on the original image of the board to be tested to generate an original image of the board to be tested. Test board correction chart; S314: Use the second perspective transformation formula to perform perspective transformation on the board to be tested correction chart to generate a top-view planar image of the board to be tested; S315: Convert the top-view planar image of the board to be tested into a fourth Grayscale image, and then convert the fourth grayscale image into a fourth contour image; S316: Perform a four-corner point search on the fourth contour image to obtain a fifth four-corner point coordinate; the fifth four-corner point coordinate is in The coordinates of the four corners of the board to be tested in the top-down plane image of the board to be tested; S317: Calculate and obtain the pixel range on the left side of the top surface of the board to be tested and the pixel range on the top surface of the board to be tested in the top-down plane image of the board to be tested , the pixel range on the right side of the top surface of the board to be tested, and the pixel range below the top surface of the board to be tested; S318: Calculate and obtain the length of the left side of the top surface of the board to be tested, the length of the top surface of the board to be tested, and The right side of the top surface of the board to be tested is long, The length of the lower side of the top surface of the board to be tested can be used for image measurement of the board to be tested.

本發明為達到上述及其他目的,其所採取之技術手段、元件及其功效,茲採一較佳實施例配合圖示說明如下。 In order to achieve the above and other objects, the technical means, components and effects adopted by the present invention are described below using a preferred embodiment with illustrations.

100:光學量測裝置 100: Optical measurement device

1:平台 1:Platform

11:第一雷射測量儀 11:The first laser measuring instrument

12:第二雷射測量儀 12: Second laser measuring instrument

13:第三雷射測量儀 13: The third laser measuring instrument

21:照相機 21:Camera

3:支架 3: Bracket

101:樣本板 101:Sample plate

102:待測板 102: Board to be tested

D1:第一間隔距離 D1: first separation distance

D2:第二間隔距離 D2: The second separation distance

L11:樣本板頂面左邊長 L11: The length of the left side of the top surface of the sample plate

L12:樣本板頂面上邊長 L12: The length of the top surface of the sample plate

L13:樣本板頂面右邊長 L13: The length of the right side of the top surface of the sample plate

L14:樣本板頂面下邊長 L14: The length of the bottom side of the top surface of the sample plate

L15:待測板頂面左邊長 L15: The length of the left side of the top surface of the board to be tested

L16:待測板頂面上邊長 L16: The length of the top surface of the board to be tested

L17:待測板頂面右邊長 L17: The length of the right side of the top surface of the board to be tested

L18:待測板頂面下邊長 L18: The length of the bottom side of the top surface of the board to be tested

PA1:樣本板原圖 PA1: Original image of sample board

PA2:待測板原圖 PA2: Original image of the board to be tested

PB1:樣本板校正圖 PB1: Sample plate calibration chart

PB2:待測板校正圖 PB2: Calibration chart of the board to be tested

PC1:第一灰度圖 PC1: first grayscale image

PD1:第一輪廓圖 PD1: First contour map

PE1:樣本板俯視平面影像圖 PE1: Sample plate top view plan image

PE2:待測板俯視平面影像圖 PE2: Planar image of the board to be tested from above

PF1:第三灰度圖 PF1: The third grayscale image

PF2:第四灰度圖 PF2: The fourth grayscale image

PG1:第三輪廓圖 PG1: Third contour map

PG2:第四輪廓圖 PG2: Fourth contour map

S101~S107、S201~S212、S301~S318:步驟 S101~S107, S201~S212, S301~S318: steps

X1:第一雷射間距 X1: first laser distance

X2:第二雷射間距 X2: The second laser distance

X3:第三雷射間距 X3: The third laser distance

X4:第四雷射間距 X4: The fourth laser distance

X5:第五雷射間距 X5: The fifth laser distance

X6:第六雷射間距 X6: The sixth laser distance

[圖1]為本發明第一實施例的流程圖。 [Fig. 1] is a flow chart of the first embodiment of the present invention.

[圖2]為本發明的光學量測裝置的示意圖。 [Fig. 2] is a schematic diagram of the optical measurement device of the present invention.

[圖3]為本發明第一、第二及第三雷射測量儀與樣本板之間的關係示意圖。 [Fig. 3] is a schematic diagram of the relationship between the first, second and third laser measuring instruments of the present invention and the sample plate.

[圖4]為本發明第一、第二及第三雷射測量儀與待測板之間的關係示意圖。 [Fig. 4] is a schematic diagram of the relationship between the first, second and third laser measuring instruments of the present invention and the board to be tested.

[圖5]為本發明第二實施例的流程圖。 [Fig. 5] is a flow chart of the second embodiment of the present invention.

[圖6]為本發明第三實施例的流程圖。 [Fig. 6] is a flow chart of the third embodiment of the present invention.

[圖7]為本發明的樣本板原圖的示意圖。 [Fig. 7] is a schematic diagram of the original drawing of the sample plate of the present invention.

[圖8]為本發明的樣本板校正圖的示意圖。 [Fig. 8] is a schematic diagram of a sample plate calibration diagram of the present invention.

[圖9]為本發明的第一灰度圖及第一輪廓圖的示意圖。 [Fig. 9] is a schematic diagram of the first grayscale image and the first contour image of the present invention.

[圖10]為本發明的樣本板俯視平面影像圖的示意圖。 [Fig. 10] is a schematic diagram of a top plan view of the sample plate of the present invention.

[圖11]為本發明的第三灰度圖及第三輪廓圖的示意圖。 [Fig. 11] is a schematic diagram of the third grayscale image and the third contour image of the present invention.

[圖12]為本發明的待測板原圖的示意圖。 [Fig. 12] is a schematic diagram of the original drawing of the board to be tested according to the present invention.

[圖13]為本發明的待測板校正圖的示意圖。 [Fig. 13] is a schematic diagram of the calibration diagram of the board to be tested according to the present invention.

[圖14]為本發明的待測板俯視平面影像圖的示意圖。 [Fig. 14] is a schematic diagram of a top plan view of the board to be tested according to the present invention.

[圖15]為本發明的第四灰度圖及第四輪廓圖的示意圖。 [Fig. 15] is a schematic diagram of the fourth grayscale image and the fourth contour image of the present invention.

圖1~4為本發明的第一實施例。如圖1~4所示,本發明光學量測裝置與量測方法包括下列步驟:S101:將一第一雷射測量儀11架設於一平台1的一側,並將一第二雷射測量儀12及一第三雷射測量儀13架設於平台1的相對於第一雷射測量儀11的另一側,第一雷射測量儀11與第二雷射測量儀12間隔一第一間隔距離D1,第二雷射測量儀12與第三雷射測量儀13間隔一第二間隔距離D2;S102:將一樣本板101放置在平台1上;樣本板101為長方體,頂面為方形,具有預定的樣本板頂面左邊長L11、樣本板頂面上邊長L12、樣本板頂面右邊長L13、樣本板頂面下邊長L14;S103:分別以第一、第二及第三雷射測量儀測量其與樣本板之間的第一雷射間距X1、第二雷射間距X2及第三雷射間距X3;S104:計算取得第一間隔距離D1的數值;S105:取走樣本板101,將一待測板102放置在平台1上;待測板102為長方體,頂面為方形,具有待測板頂面左邊長L15、待測板頂面上邊長L16、待測板頂面右邊長L17、待測板頂面下邊長L18;S106:分別以第一、第二及第三雷射測量儀11、12、13測量其與待測板102之間的第四雷射間距X4、第五雷射間距X5及第六雷射間距X6;S107:計算取得待測板頂面下邊長L18的數值;藉此方法,可以達到方便測量待測板的目的。下文將詳予說明。 Figures 1 to 4 show the first embodiment of the present invention. As shown in Figures 1 to 4, the optical measurement device and measurement method of the present invention include the following steps: S101: Set up a first laser measuring instrument 11 on one side of a platform 1, and use a second laser measuring instrument 11 to The instrument 12 and a third laser measuring instrument 13 are set up on the other side of the platform 1 relative to the first laser measuring instrument 11. The first laser measuring instrument 11 and the second laser measuring instrument 12 are separated by a first interval. The distance D1, the second laser measuring instrument 12 and the third laser measuring instrument 13 are separated by a second separation distance D2; S102: Place a sample plate 101 on the platform 1; the sample plate 101 is a rectangular parallelepiped and the top surface is square. It has a predetermined length L11 on the left side of the top surface of the sample plate, L12 on the top side of the sample plate, L13 on the right side of the top surface of the sample plate, and L14 on the bottom side of the top surface of the sample plate; S103: Measure with the first, second and third lasers respectively. The instrument measures the first laser distance X1, the second laser distance X2 and the third laser distance X3 between it and the sample plate; S104: Calculate and obtain the value of the first separation distance D1; S105: Take away the sample plate 101, Place a board 102 to be tested on the platform 1; the board 102 to be tested is a rectangular parallelepiped with a square top surface, with a length of L15 on the left side of the top surface of the board to be tested, a length of L16 on the top side of the top surface of the board to be tested, and a length on the right side of the top surface of the board to be tested. L17, the length of the lower side of the top surface of the board to be tested is L18; S106: Use the first, second and third laser measuring instruments 11, 12 and 13 to measure the fourth laser distance X4 between it and the board to be tested 102. The fifth laser spacing is X5 and the sixth laser spacing is This will be explained in detail below.

配合上述光學量測裝置與量測方法的平台可以是運送待測板的輸送帶(圖中未示),當然亦可以另外建 構一光學量測裝置100,藉以進行測量。光學量測裝置100包括:一平台1,可承載一樣本板或一待測板,該平台具有第一側、第二側、第三側及第四側,其中該第一側與第三側為相對側,且分別連接該第二側及第四側;一第一雷射測量儀11架設平台1的一側(即該平台的第一側);一第二雷射測量儀12,架設於平台1的相對於第一雷射測量儀11的另一側(即該平台的第三側),與第一雷射測量儀11水平對正,並間隔一第一間隔距離D1;一第三雷射測量儀13,架設於平台1的相對於第一雷射測量儀11的另一側(即該平台的第三側),與第二雷射測量儀12間隔一第二間隔距離D2;藉此結構可以方便進行光學量測裝置與量測方法,進而測量待測板的邊長數值。此外,為了方便進行影像測量,還可在平台上方加裝一照相機21。架設第一、第二及第三雷射測量儀11、12、13以及架設照相機21的支架3為常見的支架結構,故不再贅述。 The platform that cooperates with the above-mentioned optical measurement device and measurement method can be a conveyor belt (not shown in the figure) that transports the board to be tested. Of course, it can also be built separately. An optical measurement device 100 is constructed to perform measurement. The optical measurement device 100 includes: a platform 1, which can carry a sample plate or a plate to be tested. The platform has a first side, a second side, a third side and a fourth side, wherein the first side and the third side is the opposite side, and is connected to the second side and the fourth side respectively; a first laser measuring instrument 11 is erected on one side of the platform 1 (i.e., the first side of the platform); a second laser measuring instrument 12 is erected On the other side of the platform 1 relative to the first laser measuring instrument 11 (that is, the third side of the platform), it is horizontally aligned with the first laser measuring instrument 11 and separated by a first separation distance D1; The three laser measuring instruments 13 are installed on the other side of the platform 1 relative to the first laser measuring instrument 11 (that is, the third side of the platform), and are separated from the second laser measuring instrument 12 by a second separation distance D2. ; This structure can facilitate the use of optical measurement devices and measurement methods to measure the side length of the board to be measured. In addition, in order to facilitate image measurement, a camera 21 can also be installed above the platform. The bracket 3 for erecting the first, second and third laser measuring instruments 11, 12, 13 and erecting the camera 21 is a common bracket structure and will not be described again.

步驟S101為將一第一雷射測量儀11架設於一平台1的一側,並將一第二雷射測量儀12及一第三雷射測量儀13架設於平台1的相對於第一雷射測量儀11的另一側,第一雷射測量儀11與第二雷射測量儀12間隔一第一間隔距離D1,第二雷射測量儀12與第三雷射測量儀13間隔一第二間隔距離D2。 Step S101 is to set up a first laser measuring instrument 11 on one side of a platform 1, and to set up a second laser measuring instrument 12 and a third laser measuring instrument 13 on the side of the platform 1 relative to the first laser measuring instrument. On the other side of the laser measuring instrument 11, the first laser measuring instrument 11 and the second laser measuring instrument 12 are separated by a first separation distance D1, and the second laser measuring instrument 12 and the third laser measuring instrument 13 are separated by a first separation distance D1. The two separation distances are D2.

第一雷射測量儀11與第二雷射測量儀12應水平對正,例如使第一雷射測量儀11的雷射光線與第二雷射測量儀12的雷射光線重疊,或使第一雷射測量儀11與第二雷射測量儀12的雷射光互相打在對方的鏡面上。第二雷射測量儀12與第三雷射測量儀13的雷射光則相互平行。 The first laser measuring instrument 11 and the second laser measuring instrument 12 should be aligned horizontally, for example, so that the laser light of the first laser measuring instrument 11 overlaps with the laser light of the second laser measuring instrument 12, or so that the second laser measuring instrument 12 overlaps. The laser lights of the first laser measuring instrument 11 and the second laser measuring instrument 12 hit each other's mirror surfaces. The laser lights of the second laser measuring instrument 12 and the third laser measuring instrument 13 are parallel to each other.

步驟S102為將一樣本板101放置在平台1上;樣本板101為長方體,頂面為方形,具有預定的樣本板頂面 左邊長L11、樣本板頂面上邊長L12、樣本板頂面右邊長L13、樣本板頂面下邊長L14。 Step S102 is to place a sample plate 101 on the platform 1; the sample plate 101 is a rectangular parallelepiped with a square top surface and a predetermined sample plate top surface. The length of the left side is L11, the length of the top side of the sample plate is L12, the length of the right side of the top side of the sample plate is L13, and the length of the bottom side of the top side of the sample plate is L14.

一般而言,樣本板101是特別訂製的,故樣本板101具有預定並已知數值的四邊長L11~L14,可作為測量的基準。此外,樣本板101的頂面可以是正方形,使其四邊長L11~L14相等,藉以方便操作。 Generally speaking, the sample plate 101 is specially customized, so the sample plate 101 has four side lengths L11 to L14 with predetermined and known values, which can be used as a basis for measurement. In addition, the top surface of the sample plate 101 can be square, with the lengths L11 to L14 of its four sides being equal, so as to facilitate operation.

步驟S103為分別以第一、第二及第三雷射測量儀11、12、13測量其與樣本板101之間的第一雷射間距X1、第二雷射間距X2及第三雷射間距X3。 Step S103 is to measure the first laser distance X1, the second laser distance X2 and the third laser distance between the sample plate 101 and the first, second and third laser measuring instruments 11, 12 and 13 respectively. X3.

步驟S104為計算取得第一間隔距離D1的數值。 Step S104 is to calculate and obtain the value of the first separation distance D1.

計算第一間隔距離D1的方式不只一種,例如可以下列的第一公式計算取得第一間隔距離D1的數值。第一公式為:

Figure 111113751-A0305-02-0012-6
There is more than one way to calculate the first separation distance D1. For example, the value of the first separation distance D1 can be calculated using the following first formula. The first formula is:
Figure 111113751-A0305-02-0012-6

透過第一、第二及第三雷射測量儀11、12、13配合第一公式計算出第一間隔距離D1,可方便確認第一及第二雷射測量儀之間的關係,並可以確保就算是樣本板或待測板有些微傾斜,也能正確的測量。此外,在例如更換、移動、重置雷射測量儀等情況,都可能造成第一間隔距離D1的數值,此時只需要重新放入樣本板並進行步驟S101~S104即可取得新的第一間隔距離D1。再者,不同的雷射測量儀的鏡面與感測物之間的距離(例 如第一雷射間距X1)是很難在安裝雷射測量儀時就先測量好的,因此,藉由測量樣本板101以算出第一間隔距離D1的方式,可以減少誤差。 Calculating the first separation distance D1 by using the first, second and third laser measuring instruments 11, 12 and 13 in conjunction with the first formula can easily confirm the relationship between the first and second laser measuring instruments and ensure Even if the sample plate or the plate to be tested is slightly tilted, it can still be measured correctly. In addition, when the laser measuring instrument is replaced, moved, or reset, the value of the first separation distance D1 may be affected. In this case, you only need to re-insert the sample plate and perform steps S101 to S104 to obtain a new first separation distance D1. The separation distance is D1. Furthermore, the distance between the mirror of different laser measuring instruments and the sensing object (for example For example, the first laser distance X1) is difficult to measure when installing the laser measuring instrument. Therefore, by measuring the sample plate 101 to calculate the first distance D1, the error can be reduced.

步驟S105為取走樣本板101,將一待測板102放置在平台1上;待測板102可為高架地板的地板單元,其為長方體,頂面為方形,具有待測板頂面左邊長L15、待測板頂面上邊長L16、待測板頂面右邊長L17、待測板頂面下邊長L18。 Step S105 is to remove the sample plate 101 and place a plate 102 to be tested on the platform 1; the plate 102 to be tested can be a floor unit of a raised floor, which is a rectangular parallelepiped with a square top surface and a length of L15, the length of the top side of the board to be tested is L16, the length of the right side of the top surface of the board to be tested is L17, and the length of the bottom side of the top surface of the board to be tested is L18.

待測板102的四邊長L15~L18的數值是未知的,本方法的目的就在於方便測量待測板102的四邊長L15~L18的數值,藉以方便使用者評估待測板的加工情況。 The values of the lengths L15 ~ L18 of the four sides of the board to be tested 102 are unknown. The purpose of this method is to conveniently measure the values of the lengths L15 ~ L18 of the four sides of the board to be tested 102 so as to facilitate the user to evaluate the processing condition of the board to be tested.

步驟S106為分別以第一、第二及第三雷射測量儀11、12、13測量其與待測板102之間的第四雷射間距X4、第五雷射間距X5及第六雷射間距X6。 Step S106 is to measure the fourth laser distance X4, the fifth laser distance X5 and the sixth laser distance between the first, second and third laser measuring instruments 11, 12 and 13 and the board to be tested 102 respectively. Spacing X6.

步驟S107為計算取得待測板頂面下邊長L18的數值。 Step S107 is to calculate and obtain the value of the lower side length L18 of the top surface of the board to be tested.

計算待測板頂面下邊長L18的方式不只一種,例如可以下列的第二公式計算取得待測板頂面下邊長L18的數值。第二公式為:

Figure 111113751-A0305-02-0013-7
There is more than one way to calculate the bottom side length L18 of the top surface of the board to be tested. For example, the value of the bottom side length L18 of the top surface of the board to be tested can be calculated using the second formula below. The second formula is:
Figure 111113751-A0305-02-0013-7

一般而言,本方法可以應用在測量經過銑邊加工後的待測板,藉以測量銑邊後的待測板的四邊長是否在公 差範圍內。當然,為了進一步確保測量精度,可以透過其他公式算出待測板頂面下邊長L18以外的三邊長L15~17,或是將待測板轉動約九十度以後再測量一邊長,並共進行一至三次,即可得到待測板的四邊長L15~L18的數值。 Generally speaking, this method can be used to measure the board to be tested after milling, so as to measure whether the four side lengths of the board to be tested after milling are within 1 cm. within the difference range. Of course, in order to further ensure the measurement accuracy, you can use other formulas to calculate the three side lengths L15~17 other than the bottom side length L18 of the top surface of the board to be tested, or rotate the board to be tested about 90 degrees and then measure the length of one side, and proceed together. After one to three times, the values of L15~L18 of the four sides of the board to be tested can be obtained.

藉由步驟S101~S107的雷射測量,可以方便測量待測板的邊長數值。此外,由於只有使用三個雷射測量儀,結構簡單,所以能夠配合待測板的加工流程設置,例如以運送待測板的輸送帶作為平台,將一組以上的三個雷射測量儀設置在待測板加工設備的前側及/或後側,可在運送待測板時一併測量待測板(圖中未示)。 Through the laser measurement in steps S101 to S107, the side length value of the board to be tested can be conveniently measured. In addition, because only three laser measuring instruments are used, the structure is simple, so it can be set up to match the processing flow of the board to be tested. For example, using the conveyor belt that transports the board to be tested as a platform, a group of more than three laser measuring instruments can be set up. On the front side and/or the rear side of the processing equipment for the board to be tested, the board to be tested can be measured together with the board to be tested (not shown in the figure).

圖5為本發明的第二實施例。如圖5所示,前述的步驟S101~S107已經可以測量出待測板的四邊長L15~L18的數值。不過,為了減少誤差,在進行步驟S101~S107時,可以穿插步驟S201~S212的影像測量進行輔助。 Figure 5 is a second embodiment of the present invention. As shown in Figure 5, the aforementioned steps S101~S107 can already measure the values of the four side lengths L15~L18 of the board to be tested. However, in order to reduce errors, when performing steps S101 to S107, the image measurement of steps S201 to S212 can be interspersed for assistance.

步驟S201為將一照相機架設在平台上方,並利用照相機照相以取得一樣本板原圖PA1;照相機具有預定的水平解析度及垂直解析度。 Step S201 is to set up a camera above the platform and use the camera to take pictures to obtain a sample plate original image PA1; the camera has predetermined horizontal resolution and vertical resolution.

步驟S202為對樣本板原圖PA1進行鏡頭魚眼校正,產生一樣本板校正圖PB1。 Step S202 is to perform lens fisheye correction on the original sample plate image PA1 to generate a sample plate correction image PB1.

透過鏡頭魚眼校正能使減少魚眼鏡頭產生的畸變。 Fisheye correction through the lens can reduce the distortion caused by the fisheye lens.

步驟S203為將樣本板校正圖PB1轉換成一第一 灰度圖PC1,再將第一灰度圖PC1轉換成一第一輪廓圖PD1。 Step S203 is to convert the sample plate correction chart PB1 into a first Grayscale image PC1, and then convert the first grayscale image PC1 into a first contour image PD1.

將樣本板校正圖PB1轉換成第一灰度圖PC1,再轉換成一第一輪廓圖PD1,可減少例如反光、色差等問題產生的影響,方便查找出在樣本板校正圖PB1中的樣本板的四角點座標。 Converting the sample plate correction chart PB1 into the first grayscale image PC1 and then into a first profile image PD1 can reduce the impact of problems such as reflection and color difference, and facilitate the search for the sample plate in the sample plate correction chart PB1. Four corner point coordinates.

步驟S204為對第一輪廓圖PD1進行四角點查找,取得一第一四角點座標;第一四角點座標是在樣本板校正圖PB1中的樣本板的四角點座標,也是在第一灰度圖PC1及第一輪廓圖PD1中的樣本板的四角點座標。 Step S204 is to perform a four-corner point search on the first contour map PD1 to obtain a first four-corner point coordinate; the first four-corner point coordinate is the four-corner point coordinate of the sample plate in the sample plate correction map PB1, which is also in the first grayscale. The coordinates of the four corner points of the sample plate in the degree diagram PC1 and the first contour diagram PD1.

步驟S205為計算取得在樣本板校正圖PB1中的樣本板的第一水平像素範圍R21及第一垂直像素範圍R22。 Step S205 is to calculate and obtain the first horizontal pixel range R21 and the first vertical pixel range R22 of the sample plate in the sample plate correction map PB1.

步驟S206為計算取得樣本板校正圖PB1中的第一水平像素間距離PP21及第一垂直像素間距離PP22。 Step S206 is to calculate and obtain the first horizontal inter-pixel distance PP21 and the first vertical inter-pixel distance PP22 in the sample plate correction map PB1.

透過樣本板校正圖PB1的像素間距離PP21、PP22作為測量待測板的基準,可提高測量精度,減少例如更換待測板造成的位置偏差或旋轉所產生的誤差。 By using the inter-pixel distances PP21 and PP22 of the sample plate correction chart PB1 as a benchmark for measuring the plate to be tested, the measurement accuracy can be improved and errors caused by positional deviation or rotation caused by replacing the plate to be tested can be reduced.

步驟S207為利用照相機照相以取得一待測板原圖PA2。 Step S207 is to use a camera to take pictures to obtain an original image PA2 of the board to be tested.

步驟S208為對待測板原圖PA2進行鏡頭魚眼校正,產生一待測板校正圖PB2。 Step S208 is to perform lens fisheye correction on the original image PA2 of the board to be tested, and generate a correction image PB2 of the board to be tested.

步驟S209為將待測板校正圖PB2轉換成一第二灰度圖PC2,再將第二灰度圖PC2轉換成一第二輪廓圖PD2。 Step S209 is to convert the correction image PB2 of the board to be tested into a second grayscale image PC2, and then convert the second grayscale image PC2 into a second contour image PD2.

步驟S210為對第二輪廓圖PD2進行四角點查找,取得一第二四角點座標;第二四角點座標是在待測板 校正圖PB2中的樣本板的四角點座標。 Step S210 is to perform a four-corner point search on the second contour image PD2 to obtain a second four-corner point coordinate; the second four-corner point coordinate is on the board to be tested. Calibrate the coordinates of the four corner points of the sample plate in Figure PB2.

步驟S211為計算取得在待測板校正圖PB2中的待測板頂面左邊像素範圍R23、待測板頂面上邊像素範圍R24、待測板頂面右邊像素範圍R25、待測板頂面下邊像素範圍R26。 Step S211 is to calculate and obtain the pixel range R23 on the left side of the top surface of the board to be tested, the pixel range R24 on the upper side of the top surface of the board to be tested, the pixel range R25 on the right side of the top surface of the board to be tested, and the bottom side of the top surface of the board to be tested in the correction chart PB2 of the board to be tested. Pixel range R26.

步驟S212為計算取得在待測板校正圖PB2中的待測板頂面左邊長L21、待測板頂面上邊長L22、待測板頂面右邊長L23、待測板頂面下邊長L24。 Step S212 is to calculate and obtain the left length L21 of the top surface of the board to be tested, the length L22 of the top surface of the board to be tested, the right length L23 of the top surface of the board to be tested, and the length L24 of the bottom surface of the top surface of the board to be tested in the correction chart PB2 of the board to be tested.

藉由步驟S201~S212的影像測量,可方便取得待測板的四邊長L21~L24的數值。此外,還可與雷射測量一起分析,例如在精度要求較高的場合時,可要求雷射測量取得的待測板的四邊長L15~L18的數值與影像測量取得的待測板的四邊長L21~L24的數值均符合預定的公差範圍才算是合格的待測板。 Through the image measurement in steps S201 to S212, the values of the four side lengths L21 to L24 of the board to be tested can be easily obtained. In addition, it can also be analyzed together with laser measurement. For example, in situations with high accuracy requirements, the values of the four-side length L15~L18 of the board to be tested obtained by laser measurement and the four-side length of the board to be tested obtained by image measurement can be required. Only when the values of L21~L24 meet the predetermined tolerance range can it be considered a qualified board to be tested.

圖6為本發明的第三實施例。如圖6所示,在進行步驟S101~S107時,亦可穿插以步驟S301~S318的影像測量進行輔助。第三實施例大致是在第二實施例的基礎上加入透視變換,藉以減少可能的待測板頂面傾斜所產生的誤差,進而提高測量的精度。步驟S201~S212、S301~S318的影像測量進行輔助主要利用照相機取得影像以進行測量,可與步驟S101~S107一併進行。例如在步驟S102之後進行步驟S201~S206、S301~S311,在步驟S105之後進行步驟S207~S212、S312~S318。 Figure 6 is a third embodiment of the present invention. As shown in FIG. 6 , when performing steps S101 to S107, the image measurement of steps S301 to S318 may also be interspersed for assistance. The third embodiment roughly adds perspective transformation on the basis of the second embodiment, thereby reducing possible errors caused by the tilt of the top surface of the board to be measured, thereby improving measurement accuracy. The image measurement assistance in steps S201 to S212 and S301 to S318 mainly uses a camera to obtain images for measurement, and can be performed together with steps S101 to S107. For example, steps S201 to S206 and S301 to S311 are performed after step S102, and steps S207 to S212 and S312 to S318 are performed after step S105.

步驟S301~S304與步驟S201~S204相同。其中, 步驟S201~S204查找第一四角點座標是為了計算取得樣本板校正圖PB1中的像素間距離PP21~PP22,而步驟S301~S304查找第一四角點座標則是為了進行後續的透視變換。 Steps S301 to S304 are the same as steps S201 to S204. in, The purpose of finding the coordinates of the first four corner points in steps S201 to S204 is to calculate and obtain the inter-pixel distances PP21 to PP22 in the sample plate correction map PB1, while the purpose of finding the coordinates of the first four corner points in steps S301 to S304 is to perform subsequent perspective transformation.

步驟S305為設定一第三四角點座標,並將第一四角點座標及第三四角點座標代入一第一透視變換公式,藉以計算出一透視變換矩陣。 Step S305 is to set a third four-corner point coordinate, and substitute the first four-corner point coordinate and the third four-corner point coordinate into a first perspective transformation formula to calculate a perspective transformation matrix.

第三四角點座標的設定值可以第一四角點座標為依據,設定一範圍小於第一四角點座標的值,藉以提高精度。透視變換公式是通用公式。在第三實施例中,第一透視變換公式為:

Figure 111113751-A0305-02-0017-8
The setting value of the coordinates of the third and fourth corner points can be based on the coordinates of the first four corner points, and a range is set to a value smaller than the coordinates of the first four corner points, thereby improving accuracy. The perspective transformation formula is a general formula. In the third embodiment, the first perspective transformation formula is:
Figure 111113751-A0305-02-0017-8

在第一透視變換公式中,xi、yi為第一四角點座標中的各點的座標,xj、yj為第三四角點座標中的各點的座標。將第一、第三四角點座標中的各點的座標帶入第一透視變換公式可求得透視變換矩陣,透視變換矩陣為:

Figure 111113751-A0305-02-0017-9
In the first perspective transformation formula, xi and yi are the coordinates of each point in the first four-corner coordinates, and xj and yj are the coordinates of each point in the third four-corner coordinates. By bringing the coordinates of each point in the first and third four-corner coordinates into the first perspective transformation formula, the perspective transformation matrix can be obtained. The perspective transformation matrix is:
Figure 111113751-A0305-02-0017-9

步驟S306為將透視變換矩陣代入第一透視變換公式中以產生一第二透視變換公式。 Step S306 is to substitute the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula.

將透視變換矩陣代入第一透視變換公式中以產生一第二透視變換公式,第二透視變換公式為:

Figure 111113751-A0305-02-0018-10
Substituting the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula, the second perspective transformation formula is:
Figure 111113751-A0305-02-0018-10

在第二透視變換公式中,xk、yk為樣本板校正圖PB1中的各像素點的座標,算出的xm、ym即為樣本板俯視平面影像圖PE1中的各像素點的座標。 In the second perspective transformation formula, xk and yk are the coordinates of each pixel in the sample plate correction map PB1, and the calculated xm and ym are the coordinates of each pixel in the sample plate top-view plane image PE1.

步驟S307:以第二透視變換公式對樣本板校正圖PB1進行透視變換,產生一樣本板俯視平面影像圖PE1。 Step S307: Use the second perspective transformation formula to perform perspective transformation on the sample plate correction image PB1 to generate a sample plate top plan image PE1.

步驟S308為將樣本板俯視平面影像圖PE1轉換成一第三灰度圖PF1,再將第三灰度圖PF1轉換成一第三輪廓圖PG1。 Step S308 is to convert the sample plate top plan image PE1 into a third grayscale image PF1, and then convert the third grayscale image PF1 into a third contour image PG1.

步驟S309為對第三輪廓圖PG1進行四角點查找,取得一第四四角點座標;第四四角點座標是在樣本板俯視平面影像圖PE1中的樣本板的四角點座標。 Step S309 is to perform a four-corner point search on the third contour image PG1 to obtain a fourth four-corner point coordinate; the fourth four-corner point coordinate is the four corner point coordinates of the sample plate in the sample plate top-view plane image PE1.

步驟S310為計算取得在樣本板俯視平面影像圖PE1中的樣本板的第二水平像素範圍R31及第二垂直像素範圍R32。 Step S310 is to calculate and obtain the second horizontal pixel range R31 and the second vertical pixel range R32 of the sample plate in the sample plate top plan image PE1.

步驟S311為計算取得樣本板俯視平面影像圖PE1中的第二水平像素間距離PP31及第二垂直像素間距離PP32。 Step S311 is to calculate and obtain the second horizontal inter-pixel distance PP31 and the second vertical inter-pixel distance PP32 in the top plan image PE1 of the sample plate.

步驟S308~S311與步驟S203~S206的大致原理相同,只是作用的目標不同。步驟S203~S206作用於經過鏡 頭魚眼校正的樣本板校正圖PB1。步驟S308~S311作用於經過鏡頭魚眼校正及透視變換的樣本板俯視平面影像圖PE1,可進一步提高測量精度。 The general principles of steps S308 to S311 are the same as those of steps S203 to S206, but the targets are different. Steps S203~S206 act on the passing mirror Sample plate correction chart PB1 for fish eye correction. Steps S308 to S311 act on the top-view planar image PE1 of the sample plate that has undergone lens fisheye correction and perspective transformation, which can further improve the measurement accuracy.

步驟S312為利用照相機照相以取得一待測板原圖PA2。 Step S312 is to use a camera to take pictures to obtain an original image PA2 of the board to be tested.

步驟S313為對待測板原圖PA2進行鏡頭魚眼校正,產生一待測板校正圖PB2。 Step S313 is to perform lens fisheye correction on the original image PA2 of the board to be tested, and generate a correction image PB2 of the board to be tested.

步驟S314為以第二透視變換公式對待測板校正圖PB2進行透視變換,產生一待測板俯視平面影像圖PE2。 Step S314 is to perform perspective transformation on the correction image PB2 of the board to be tested using the second perspective transformation formula to generate a top-view planar image PE2 of the board to be tested.

進行步驟S314時,第二透視變換公式的xk、yk為待測板校正圖PB2中的各像素點的座標,算出的xm、ym即為待測板俯視平面影像圖PE2中的各像素點的座標。在步驟S307、S314進行的透視變換可以將可能傾斜的樣本板、待測板轉換成平面影像,藉以減少誤差。 When step S314 is performed, xk and yk of the second perspective transformation formula are the coordinates of each pixel in the correction image PB2 of the plate to be tested, and the calculated xm and ym are the coordinates of each pixel in the top-view plane image PE2 of the plate to be tested. coordinates. The perspective transformation performed in steps S307 and S314 can convert possibly tilted sample plates and plates to be tested into flat images, thereby reducing errors.

步驟S315為將待測板俯視平面影像圖PE2轉換成一第四灰度圖PF2,再將第四灰度圖PF2轉換成一第四輪廓圖PG2。 Step S315 is to convert the top planar image PE2 of the board to be tested into a fourth grayscale image PF2, and then convert the fourth grayscale image PF2 into a fourth contour image PG2.

步驟S316為對第四輪廓圖PG2進行四角點查找,取得一第五四角點座標;第五四角點座標是在待測板俯視平面影像圖PE2中的待測板的四角點座標。 Step S316 is to perform a four-corner point search on the fourth contour image PG2 to obtain a fifth four-corner point coordinates; the fifth four-corner point coordinates are the four-corner point coordinates of the board to be tested in the top-down plane image of the board to be tested PE2.

步驟S317:計算取得在待測板俯視平面影像圖PE2中的待測板頂面左邊像素範圍R33、待測板頂面上邊像素範圍R34、待測板頂面右邊像素範圍R35、待測板頂面下 邊像素範圍R36。 Step S317: Calculate and obtain the pixel range R33 on the left side of the top surface of the board to be tested, the pixel range R34 on the upper side of the top surface of the board to be tested, the pixel range R35 on the right side of the top surface of the board to be tested, and the pixel range R35 on the top side of the board to be tested in the top-view plane image PE2 of the board to be tested. Under the surface Edge pixel range R36.

步驟S318:計算取得在待測板俯視平面影像圖PE2中的待測板頂面左邊長L31、待測板頂面上邊長L32、待測板頂面右邊長L33、待測板頂面下邊長L34。 Step S318: Calculate and obtain the length of the left side of the top surface of the board to be tested L31, the length of the top surface of the board to be tested L32, the length of the right side of the top surface of the board to be tested L33, and the length of the bottom side of the top surface of the board to be tested in the top plane image PE2 of the board to be tested. L34.

在前述各實施例中,例如第一至六雷射間距X1~X6等屬於測量得到的數值,可以在進行多次(例如60次)以後取平均值作為最終數值,藉以減少誤差。 In the above-mentioned embodiments, for example, the first to sixth laser spacings X1 to X6 are measured values, and the average value can be taken as the final value after multiple measurements (for example, 60 times) to reduce errors.

藉由光學量測裝置與量測方法可以方便計算出第一間隔距離D1,因此可以用於測量不同大小的待測板。此外,平台1可以是可調整高度的結構,藉以控制待測板上升或下降,進而可在不調整第一、第二及第三雷射測量儀的情況下,測量不同高度的待測板。 The first separation distance D1 can be easily calculated through the optical measurement device and measurement method, so it can be used to measure boards of different sizes. In addition, the platform 1 can be a height-adjustable structure to control the rise or fall of the board to be tested, so that boards to be tested at different heights can be measured without adjusting the first, second and third laser measuring instruments.

為了方便理解本發明的精神,茲以下列範例示意。 In order to facilitate understanding of the spirit of the present invention, the following examples are provided.

範例1以步驟S101~S107測量出待測板四邊長L15~L18的數值。 Example 1 uses steps S101 to S107 to measure the lengths L15 to L18 of the four sides of the board to be tested.

進行步驟S101,此時的第一間隔距離D1為未知,第二間隔距離D2為240mm。 Proceed to step S101. At this time, the first separation distance D1 is unknown, and the second separation distance D2 is 240 mm.

進行步驟S102,預定的樣本板頂面左邊長L11、樣本板頂面上邊長L12、樣本板頂面右邊長L13、樣本板頂面下邊長L14皆為600.017mm。 Proceed to step S102. The predetermined left length L11 of the top surface of the sample plate, the length L12 of the top surface of the sample plate, the length L13 of the right side of the top surface of the sample plate, and the length L14 of the bottom side of the top surface of the sample plate are all 600.017 mm.

進行步驟S103,測量出第一雷射間距X1為153.623mm,第二雷射間距X2為216.377mm,第三雷射間距X3為214.311mm。 Proceed to step S103 and measure the first laser distance X1 to be 153.623mm, the second laser distance X2 to be 216.377mm, and the third laser distance X3 to be 214.311mm.

進行步驟S104,計算取得第一間隔距離D1為970.039mm。 Proceed to step S104 and calculate the first separation distance D1 to be 970.039 mm.

進行步驟S105,此時的待測板頂面左邊長L15、待測板頂面上邊長L16、待測板頂面右邊長L17、待測板頂面下邊長L18為未知。 Proceed to step S105. At this time, the length of the left side of the top surface of the board to be tested is L15, the length of the top side of the board to be tested is L16, the length of the right side of the top surface of the board to be tested is L17, and the length of the bottom side of the top surface of the board to be tested is L18.

進行步驟S106,測量出第四雷射間距X4為154.589mm,第五雷射間距X5為215.636mm,第六雷射間距X6為214.641mm。 Step S106 is performed, and the fourth laser distance X4 is measured to be 154.589mm, the fifth laser distance X5 is 215.636mm, and the sixth laser distance X6 is 214.641mm.

進行步驟S107,待測板頂面下邊長L18為599.809mm。將待測板轉動約九十度以後再進行S101~S107共三次得到待測板頂面左邊長L15、待測板頂面上邊長L16、待測板頂面右邊長L17的皆為599.809mm。 Proceed to step S107. The length L18 of the lower side of the top surface of the board to be tested is 599.809mm. Rotate the board to be tested about 90 degrees and then perform S101~S107 three times in total. The length of the left side of the top surface of the board to be tested is L15, the length of the top side of the board to be tested is L16, and the length of the right side of the top surface of the board to be tested is L17, all of which are 599.809mm.

範例2以步驟S101~S107穿插步驟S301~S318,測量出兩組待測板的四邊長L15~L18、L31~L34的數值,兩組數值可以相互對照分析。在範例2中,不再重複步驟S101~S107。 Example 2 intersperses steps S101 to S107 with steps S301 to S318 to measure the four-side lengths L15 to L18 and L31 to L34 of two sets of boards to be tested. The two sets of values can be compared and analyzed with each other. In Example 2, steps S101 to S107 are not repeated.

如圖7所示,進行步驟S301,取得一樣本板原圖PA1。在範例2中,照相機的水平解析度為3200pixel、垂直解析度為1800pixel,例如採用Logitech 4k Brio。 As shown in Figure 7, step S301 is performed to obtain a sample plate original image PA1. In Example 2, the camera has a horizontal resolution of 3200pixels and a vertical resolution of 1800pixels, such as Logitech 4k Brio.

如圖8所示,進行步驟S302,產生一樣本板校正圖PB1。 As shown in Figure 8, step S302 is performed to generate a sample plate correction chart PB1.

如圖9所示,進行步驟S303,產生第一灰度圖PC1及第一輪廓圖PD1。 As shown in Figure 9, step S303 is performed to generate the first grayscale image PC1 and the first contour image PD1.

進行步驟S304,第一四角點座標為:左上xi1: 92,yi1:609,左下xi2:107,yi2:2147,右上xi3:1623,yi3:596,右下xi4:1648,yi4:2124。 Proceed to step S304. The coordinates of the first four corner points are: upper left xi1: 92, yi1: 609, lower left xi2: 107, yi2: 2147, upper right xi3: 1623, yi3: 596, lower right xi4: 1648, yi4: 2124.

進行步驟S305,第三四角點座標為:左上xj1:107,yj1:609,左下xj2:107,yj2:2147,右上xj3:1623,yj3:609,右下xj4:1623,yj4:2124。將第一、第三四角點座標中的各點的座標帶入第一透視變換公式可求得透視變換矩陣,透視變換矩陣為:

Figure 111113751-A0305-02-0022-11
Proceed to step S305. The coordinates of the third and fourth corner points are: upper left xj1:107, yj1:609, lower left xj2:107, yj2:2147, upper right xj3:1623, yj3:609, lower right xj4:1623, yj4:2124. By bringing the coordinates of each point in the first and third four-corner coordinates into the first perspective transformation formula, the perspective transformation matrix can be obtained. The perspective transformation matrix is:
Figure 111113751-A0305-02-0022-11

進行步驟S306,第二透視變換公式為:

Figure 111113751-A0305-02-0022-13
Proceed to step S306, the second perspective transformation formula is:
Figure 111113751-A0305-02-0022-13

如圖10所示,進行步驟S307,產生一樣本板俯視平面影像圖PE1。 As shown in Figure 10, step S307 is performed to generate a top plan image PE1 of the sample plate.

如圖11所示,進行步驟S308,產生第三灰度圖PF1及第三輪廓圖PG1。 As shown in Figure 11, step S308 is performed to generate a third grayscale image PF1 and a third contour image PG1.

進行步驟S309,第四四角點座標為:左上xm1:108,ym1:610,左下xm2:108,ym2:2125,右上xm3:1623,ym3:610,右下xm4:1623,ym4:2125。 Proceed to step S309. The coordinates of the fourth four corner points are: upper left xm1:108, ym1:610, lower left xm2:108, ym2:2125, upper right xm3:1623, ym3:610, lower right xm4:1623, ym4:2125.

進行步驟S310,第二水平像素範圍R31為|xm3-xm1|=1515mm/pixel,第二垂直像素範圍R32為|ym2-ym1|=1515mm/pixel。 Proceed to step S310, the second horizontal pixel range R31 is |xm3-xm1|=1515mm/pixel, and the second vertical pixel range R32 is |ym2-ym1|=1515mm/pixel.

進行步驟S311,第二水平像素間距離PP31為L14/R31=0.396051,第二垂直像素間距離PP32為L13/R32=0.396051。 Proceed to step S311, the second horizontal inter-pixel distance PP31 is L14/R31=0.396051, and the second vertical inter-pixel distance PP32 is L13/R32=0.396051.

如圖12所示,進行步驟S312,取得一待測板原圖PA2。 As shown in Figure 12, step S312 is performed to obtain an original image PA2 of the board to be tested.

如圖13所示,進行步驟S313,產生一待測板校正圖PB2。 As shown in Figure 13, step S313 is performed to generate a correction chart PB2 of the plate to be tested.

如圖14所示,進行步驟S314,產生一待測板俯視平面影像圖PE2。 As shown in Figure 14, step S314 is performed to generate a top plan image PE2 of the board to be tested.

如圖15所示,進行步驟S315,產生一第四灰度圖PF2及一第四輪廓圖PG2。 As shown in Figure 15, step S315 is performed to generate a fourth grayscale image PF2 and a fourth contour image PG2.

進行步驟S316,第五四角點座標為:左上xn1:109,yn1:617,左下xn2:109,yn2:2130,右上xn3:1622,yn3:617,右下xn4:1622,yn4:2130。 Proceed to step S316. The coordinates of the fifth four-corner point are: upper left xn1:109, yn1:617, lower left xn2:109, yn2:2130, upper right xn3:1622, yn3:617, lower right xn4:1622, yn4:2130.

進行步驟S317,待測板頂面左邊像素範圍R33為|yn2-yn1|=1513mm/pixel,待測板頂面上邊像素範圍R34為|xn3-xn1|=1513mm/pixel,待測板頂面右邊像素範圍R35為|yn4-yn3|=1513mm/pixel,待測板頂面下邊像素範圍R36為|xn4-xn2|=1513mm/pixel。 Proceed to step S317, the pixel range R33 on the left side of the top surface of the board to be tested is |yn2-yn1|=1513mm/pixel, the pixel range R34 on the top surface of the board to be tested is |xn3-xn1|=1513mm/pixel, and the right side of the top surface of the board to be tested is The pixel range R35 is |yn4-yn3|=1513mm/pixel, and the pixel range R36 under the top surface of the board to be tested is |xn4-xn2|=1513mm/pixel.

進行步驟S318,待測板頂面左邊長L31為PP31*R33=599.225mm,待測板頂面上邊長L32為PP32*R34=599.225mm,待測板頂面右邊長L33為PP31*R35=599.225mm,待測板頂面下邊長L34為PP32*R36=599.225mm。 Proceed to step S318. The length L31 of the left side of the top surface of the board to be tested is PP31*R33=599.225mm. The length L32 of the top side of the board to be tested is PP32*R34=599.225mm. The length L33 of the right side of the top surface of the board to be tested is PP31*R35=599.225. mm, the length L34 of the lower side of the top surface of the board to be tested is PP32*R36=599.225mm.

第一、第二及第三雷射測量儀11、12、13,以及照相機21均能以有線或無線的方式連接一電腦(圖中未示),而前述各步驟中的計算及影像轉換均可由該電腦進行處理,藉以節省成本。 The first, second and third laser measuring instruments 11, 12, 13 and the camera 21 can all be connected to a computer (not shown in the figure) in a wired or wireless manner, and the calculations and image conversions in the above steps are It can be processed by the computer, thereby saving costs.

以上為本發明所舉之實施例,僅為便於說明而設,當不能以此限制本發明之意義,即大凡依所列申請專利範圍所為之各種變換設計,均應包含在本發明之專利範圍中。 The above-mentioned embodiments of the present invention are only for convenience of explanation. They should not be used to limit the significance of the present invention. That is, all various transformation designs based on the listed patent scope should be included in the patent scope of the present invention. middle.

1:平台 1:Platform

11:第一雷射測量儀 11:The first laser measuring instrument

12:第二雷射測量儀 12: Second laser measuring instrument

13:第三雷射測量儀 13: The third laser measuring instrument

101:樣本板 101:Sample plate

D1:第一間隔距離 D1: first separation distance

D2:第二間隔距離 D2: The second separation distance

L11:樣本板頂面左邊長 L11: The length of the left side of the top surface of the sample plate

L12:樣本板頂面上邊長 L12: The length of the top surface of the sample plate

L13:樣本板頂面右邊長 L13: The length of the right side of the top surface of the sample plate

L14:樣本板頂面下邊長 L14: The length of the bottom side of the top surface of the sample plate

X1:第一雷射間距 X1: first laser distance

X2:第二雷射間距 X2: The second laser distance

X3:第三雷射間距 X3: The third laser distance

Claims (12)

一種光學量測裝置,其中包括:一平台,承載一待測板,該平台具有第一側、第二側、第三側及第四側,其中該第一側與第三側為相對側,且分別連接該第二側及第四側;一第一雷射測量儀,架設該平台的第一側;一第二雷射測量儀,架設於該平台的相對於該第一雷射測量儀的該第三側,與該第一雷射測量儀水平對正,並間隔一第一間隔距離;一第三雷射測量儀,架設於該平台的相對於該第一雷射測量儀的該第三側,與該第二雷射測量儀間隔一第二間隔距離;該第一雷射測量儀的雷射光線與該第二雷射測量儀的雷射光線重疊。 An optical measurement device, which includes: a platform carrying a board to be measured, the platform having a first side, a second side, a third side and a fourth side, wherein the first side and the third side are opposite sides, and are respectively connected to the second side and the fourth side; a first laser measuring instrument is installed on the first side of the platform; a second laser measuring instrument is installed on the platform relative to the first laser measuring instrument The third side is horizontally aligned with the first laser measuring instrument and is separated by a first separation distance; a third laser measuring instrument is installed on the platform relative to the first laser measuring instrument. The third side is separated from the second laser measuring instrument by a second separation distance; the laser light of the first laser measuring instrument overlaps with the laser light of the second laser measuring instrument. 如請求項1之光學量測裝置,其中該平台上方架設有一照相機。 The optical measurement device of claim 1, wherein a camera is installed above the platform. 如請求項1之光學量測裝置,其中該平台為可調整高度的結構,可上升或下降。 Such as the optical measurement device of claim 1, wherein the platform is a height-adjustable structure that can be raised or lowered. 一種光學量測方法,其中包括下列步驟:S101:將一第一雷射測量儀架設於一平台的一側,並將一第二雷射測量儀及一第三雷射測量儀架設於該平台的相對於該第一雷射測量儀的另一側,該第一雷射測量儀與該第二雷射測量儀間隔一第一間隔距離(D1),該第二雷射測量儀與該第三雷射測量儀 間隔一預定的第二間隔距離(D2);S102:將一樣本板放置在該平台上;該樣本板為長方體,頂面為方形,具有預定的樣本板頂面左邊長(L11)、樣本板頂面上邊長(L12)、樣本板頂面右邊長(L13)、樣本板頂面下邊長(L14);S103:分別以該第一、第二及第三雷射測量儀測量其與該樣本板之間的第一雷射間距(X1)、第二雷射間距(X2)及第三雷射間距(X3);S104:計算取得該第一間隔距離(D1)的數值;S105:取走該樣本板,將一待測板放置在該平台上;該待測板為長方體,頂面為方形,具有待測板頂面左邊長(L15)、待測板頂面上邊長(L16)、待測板頂面右邊長(L17)、待測板頂面下邊長(L18);S106:分別以該第一、第二及第三雷射測量儀測量其與該待測板之間的第四雷射間距(X4)、第五雷射間距(X5)及第六雷射間距(X6);S107:計算取得該待測板頂面下邊長(L18)的數值。 An optical measurement method, which includes the following steps: S101: Set up a first laser measuring instrument on one side of a platform, and set up a second laser measuring instrument and a third laser measuring instrument on the platform Relative to the other side of the first laser measuring instrument, the first laser measuring instrument is separated from the second laser measuring instrument by a first separation distance (D1), and the second laser measuring instrument is separated from the third laser measuring instrument. Three laser measuring instruments Spacing a predetermined second spacing distance (D2); S102: Place a sample plate on the platform; the sample plate is a rectangular parallelepiped, the top surface is square, and has a predetermined left side length (L11) of the top surface of the sample plate. The length of the top side (L12), the length of the right side of the top side of the sample plate (L13), and the length of the bottom side of the top side of the sample plate (L14); S103: Use the first, second and third laser measuring instruments to measure them and the sample respectively. The first laser spacing (X1), the second laser spacing (X2) and the third laser spacing (X3) between the boards; S104: Calculate and obtain the value of the first spacing distance (D1); S105: Take away For this sample board, place a board to be tested on the platform; the board to be tested is a rectangular parallelepiped with a square top surface, with the length of the left side of the top surface of the board to be tested (L15), the length of the top side of the board to be tested (L16), The length of the right side of the top surface of the board to be tested (L17), and the length of the bottom side of the top surface of the board to be tested (L18); S106: Use the first, second and third laser measuring instruments to measure the third distance between it and the board to be tested. The fourth laser distance (X4), the fifth laser distance (X5) and the sixth laser distance (X6); S107: Calculate and obtain the value of the lower side length (L18) of the top surface of the board to be tested. 如請求項4之光學量測方法,其中在該步驟S104中,以第一公式計算取得該第一間隔距離(D1)的數值;第一公式:
Figure 111113751-A0305-02-0027-21
The optical measurement method of claim 4, wherein in step S104, the value of the first separation distance (D1) is calculated using a first formula; the first formula:
Figure 111113751-A0305-02-0027-21
如請求項4之光學量測方法,其中在該步驟S107 中,以第二公式計算取得該待測板頂面下邊長(L18)的數值;第二公式:
Figure 111113751-A0305-02-0028-15
For example, the optical measurement method of claim 4, wherein in step S107, the value of the lower side length (L18) of the top surface of the board to be measured is calculated using a second formula; the second formula:
Figure 111113751-A0305-02-0028-15
如請求項4之光學量測方法,其中在該步驟S102之後,進行步驟S201~S206;S201:將一照相機架設在該平台上方,並利用該照相機照相以取得一樣本板原圖;該照相機具有預定的水平解析度及垂直解析度;S202:對該樣本板原圖進行鏡頭魚眼校正,產生一樣本板校正圖;S203:將該樣本板校正圖轉換成一第一灰度圖,再將該第一灰度圖轉換成一第一輪廓圖;S204:對該第一輪廓圖進行四角點查找,取得一第一四角點座標;該第一四角點座標是在該樣本板校正圖中的樣本板的四角點座標;S205:計算取得在該樣本板校正圖中的樣本板的第一水平像素範圍及第一垂直像素範圍;S206:計算取得該樣本板校正圖中的第一水平像素間距離及第一垂直像素間距離。 For example, the optical measurement method of claim 4, wherein after step S102, steps S201 to S206 are performed; S201: Set up a camera above the platform, and use the camera to take pictures to obtain an original image of the sample plate; the camera has Predetermined horizontal resolution and vertical resolution; S202: Perform lens fisheye correction on the original sample plate image to generate a sample plate correction image; S203: Convert the sample plate correction image into a first grayscale image, and then convert the sample plate correction image into a first grayscale image. The first grayscale image is converted into a first contour image; S204: Perform a four-corner point search on the first contour image to obtain a first four-corner point coordinate; the first four-corner point coordinate is in the sample plate correction image The coordinates of the four corner points of the sample plate; S205: Calculate and obtain the first horizontal pixel range and the first vertical pixel range of the sample plate in the sample plate correction map; S206: Calculate and obtain the first horizontal pixel range in the sample plate correction map distance and the distance between the first vertical pixels. 如請求項7之光學量測方法,其中在該步驟S105之後,進行步驟S207~S212;S207:利用該照相機照相以取得一待測板原圖; S208:對該待測板原圖進行鏡頭魚眼校正,產生一待測板校正圖;S209:將該待測板校正圖轉換成一第二灰度圖,再將該第二灰度圖轉換成一第二輪廓圖;S210:對該第二輪廓圖進行四角點查找,取得一第二四角點座標;該第一四角點座標是在該待測板校正圖中的樣本板的四角點座標;S211:計算取得在該待測板校正圖中的待測板頂面左邊像素範圍、待測板頂面上邊像素範圍、待測板頂面右邊像素範圍、待測板頂面下邊像素範圍;S212:計算取得在該待測板校正圖中的待測板頂面左邊長、待測板頂面上邊長、待測板頂面右邊長、待測板頂面下邊長。 For example, the optical measurement method of claim 7, wherein after step S105, steps S207~S212 are performed; S207: use the camera to take pictures to obtain an original image of the board to be tested; S208: Perform lens fisheye correction on the original image of the board to be tested to generate a correction image of the board to be tested; S209: Convert the correction image of the board to be tested into a second grayscale image, and then convert the second grayscale image into a Second contour map; S210: Perform a four-corner point search on the second contour map to obtain a second four-corner point coordinate; the first four-corner point coordinate is the four-corner point coordinate of the sample plate in the calibration chart of the plate to be tested ; S211: Calculate and obtain the pixel range on the left side of the top surface of the board to be tested, the pixel range on the upper side of the top surface of the board to be tested, the pixel range on the right side of the top surface of the board to be tested, and the pixel range on the bottom side of the top surface of the board to be tested in the correction chart of the board to be tested; S212: Calculate and obtain the length of the left side of the top surface of the board to be tested, the length of the top surface of the board to be tested, the length of the right side of the top surface of the board to be tested, and the length of the bottom side of the top surface of the board to be tested in the correction chart of the board to be tested. 如請求項4之光學量測方法,其中在該步驟S102之後,進行步驟S301~S311;S301:將一照相機架設在該平台上方,並利用該照相機照相以取得一樣本板原圖;該照相機具有預定的水平解析度及垂直解析度;S302:對該樣本板原圖進行鏡頭魚眼校正,產生一樣本板校正圖;S303:將該樣本板校正圖轉換成一第一灰度圖,再將該第一灰度圖轉換成一第一輪廓圖;S304:對該第一輪廓圖進行四角點查找,取得一第一四角點座標;該第一四角點座標是在該樣本板校正圖 中的樣本板的四角點座標;S305:設定一第三四角點座標,並將該第一四角點座標及第三四角點座標代入一第一透視變換公式,藉以計算出一透視變換矩陣;S306:將該透視變換矩陣代入該第一透視變換公式中以產生一第二透視變換公式;S307:以該第二透視變換公式對該樣本板校正圖進行透視變換,產生一樣本板俯視平面影像圖;S308:將該樣本板俯視平面影像圖轉換成一第三灰度圖,再將該第三灰度圖轉換成一第三輪廓圖;S309:對該第三輪廓圖進行四角點查找,取得一第四四角點座標;該第四四角點座標是在該樣本板俯視平面影像圖中的樣本板的四角點座標;S310:計算取得在該樣本板俯視平面影像圖中的樣本板的第二水平像素範圍及第二垂直像素範圍;S311:計算取得該樣本板俯視平面影像圖中的第二水平像素間距離及第二垂直像素間距離。 For example, the optical measurement method of claim 4, wherein after step S102, steps S301 to S311 are performed; S301: Set up a camera above the platform, and use the camera to take pictures to obtain an original image of the sample plate; the camera has Predetermined horizontal resolution and vertical resolution; S302: Perform lens fisheye correction on the original sample plate image to generate a sample plate correction image; S303: Convert the sample plate correction image into a first grayscale image, and then convert the sample plate correction image into a first grayscale image. The first grayscale image is converted into a first contour image; S304: Perform a four-corner point search on the first contour image to obtain a first four-corner point coordinate; the first four-corner point coordinate is in the sample plate correction image The four corner point coordinates of the sample plate in; S305: Set a third four corner point coordinate, and substitute the first four corner point coordinate and the third four corner point coordinate into a first perspective transformation formula to calculate a perspective transformation matrix; S306: Substitute the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula; S307: Use the second perspective transformation formula to perform perspective transformation on the sample plate correction image to generate a sample plate top view Plane image; S308: Convert the top-view planar image of the sample plate into a third grayscale image, and then convert the third grayscale image into a third contour map; S309: Perform a four-corner point search on the third contour map, Obtain a fourth four-corner point coordinate; the fourth four-corner point coordinate is the four corner point coordinates of the sample plate in the top-view planar image of the sample plate; S310: Calculate and obtain the sample plate in the top-view planar image of the sample plate The second horizontal pixel range and the second vertical pixel range; S311: Calculate and obtain the second horizontal inter-pixel distance and the second vertical inter-pixel distance in the top-view plane image of the sample plate. 如請求項9之光學量測方法,其中該第一透視變換公式為:
Figure 111113751-A0305-02-0030-16
,在該第一透視變換公式中,xi、yi為該第一四角點座標中的各點的座標,xj、yj為該第三四角點座標中的各 點的座標。
For example, the optical measurement method of claim 9, wherein the first perspective transformation formula is:
Figure 111113751-A0305-02-0030-16
, in the first perspective transformation formula, xi and yi are the coordinates of each point in the first four-corner point coordinates, and xj and yj are the coordinates of each point in the third four-corner point coordinates.
如請求項10之光學量測方法,其中該第一、第三四角點座標中的各點的座標帶入該第一透視變換公式可求得該透視變換矩陣
Figure 111113751-A0305-02-0031-19
,再將該透視變換矩陣代入該第一透視變換公式中以產生一第二透視變換公式,第二透視變換公式為:
Figure 111113751-A0305-02-0031-20
,在該第二透視變換公式中,xk、yk為該樣本板校正圖中的各像素點的座標,算出的xm、ym即為樣本板俯視平面影像圖中的各像素點的座標。
The optical measurement method of claim 10, wherein the perspective transformation matrix can be obtained by bringing the coordinates of each point in the first and third four-corner point coordinates into the first perspective transformation formula.
Figure 111113751-A0305-02-0031-19
, and then substitute the perspective transformation matrix into the first perspective transformation formula to generate a second perspective transformation formula. The second perspective transformation formula is:
Figure 111113751-A0305-02-0031-20
, in the second perspective transformation formula, xk and yk are the coordinates of each pixel point in the sample plate correction map, and the calculated xm and ym are the coordinates of each pixel point in the sample plate top-view plane image.
如請求項11之光學量測方法,其中在該步驟S105之後,先進行步驟S312~S318;S312:利用該照相機照相以取得一待測板原圖;S313:對該待測板原圖進行鏡頭魚眼校正,產生一待測板校正圖;S314:以該第二透視變換公式對該待測板校正圖進行透視變換,產生一待測板俯視平面影像圖;S315:將該待測板俯視平面影像圖轉換成一第四灰度圖,再將該第四灰度圖轉換成一第四輪廓圖;S316:對該第四輪廓圖進行四角點查找,取得一第五四 角點座標;該第五四角點座標是在該待測板俯視平面影像圖中的待測板的四角點座標;S317:計算取得在該待測板俯視平面影像圖中的待測板頂面左邊像素範圍、待測板頂面上邊像素範圍、待測板頂面右邊像素範圍、待測板頂面下邊像素範圍;S318:計算取得在該待測板俯視平面影像圖中的待測板頂面左邊長、待測板頂面上邊長、待測板頂面右邊長、待測板頂面下邊長。 For example, the optical measurement method of claim 11, wherein after step S105, steps S312 to S318 are first performed; S312: use the camera to take pictures to obtain an original image of the board to be tested; S313: take a lens of the original image of the board to be tested. Fisheye correction generates a correction image of the board to be tested; S314: Use the second perspective transformation formula to perform perspective transformation on the correction chart of the board to be tested to generate a planar image of the board to be tested; S315: View the board to be tested from a top view The plane image image is converted into a fourth grayscale image, and then the fourth grayscale image is converted into a fourth contour image; S316: Perform a four-corner point search on the fourth contour image to obtain a fifth and fourth contour image. Corner point coordinates; the fifth four corner point coordinates are the four corner point coordinates of the board to be tested in the top-down plane image of the board to be tested; S317: Calculate and obtain the top of the board to be tested in the top-down plane image of the board to be tested The pixel range on the left side of the surface, the upper pixel range on the top surface of the board to be tested, the pixel range on the right side of the top surface of the board to be tested, and the pixel range on the lower side of the top surface of the board to be tested; S318: Calculate and obtain the board to be tested in the top-view plane image of the board to be tested The length of the left side of the top surface, the length of the top side of the board to be tested, the length of the right side of the top surface of the board to be tested, and the length of the bottom side of the top surface of the board to be tested.
TW111113751A 2022-04-08 2022-04-08 Optical measurement device and measurement method TWI832205B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111113751A TWI832205B (en) 2022-04-08 2022-04-08 Optical measurement device and measurement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111113751A TWI832205B (en) 2022-04-08 2022-04-08 Optical measurement device and measurement method

Publications (2)

Publication Number Publication Date
TW202340751A TW202340751A (en) 2023-10-16
TWI832205B true TWI832205B (en) 2024-02-11

Family

ID=89856026

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111113751A TWI832205B (en) 2022-04-08 2022-04-08 Optical measurement device and measurement method

Country Status (1)

Country Link
TW (1) TWI832205B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116952135A (en) * 2022-04-14 2023-10-27 金溪惠亚科技有限公司 Optical measuring device and measuring method
TWI875568B (en) * 2024-04-12 2025-03-01 惠亞工程股份有限公司 Foot height measuring device for floor units of raised floors
TWI875566B (en) * 2024-04-12 2025-03-01 惠亞工程股份有限公司 Measuring device for floor units of raised floors
TWI875567B (en) * 2024-04-12 2025-03-01 惠亞工程股份有限公司 Device for measuring the side length of floor units of raised floors

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6611787B2 (en) * 1989-09-01 2003-08-26 Quantronix, Inc. Object measuring and weighing apparatus
TWM455858U (en) * 2012-12-14 2013-06-21 Univ Nat Taiwan Science Tech Optical measuring device
TW201504750A (en) * 2013-06-14 2015-02-01 Kla Tencor Corp System and method for determining the position of defects on objects, coordinate measuring unit and computer program for coordinate measuring unit
TWM632582U (en) * 2022-04-08 2022-10-01 惠亞工程股份有限公司 Optical measurement device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6611787B2 (en) * 1989-09-01 2003-08-26 Quantronix, Inc. Object measuring and weighing apparatus
TWM455858U (en) * 2012-12-14 2013-06-21 Univ Nat Taiwan Science Tech Optical measuring device
TW201504750A (en) * 2013-06-14 2015-02-01 Kla Tencor Corp System and method for determining the position of defects on objects, coordinate measuring unit and computer program for coordinate measuring unit
TWM632582U (en) * 2022-04-08 2022-10-01 惠亞工程股份有限公司 Optical measurement device

Also Published As

Publication number Publication date
TW202340751A (en) 2023-10-16

Similar Documents

Publication Publication Date Title
TWI832205B (en) Optical measurement device and measurement method
CN111536902B (en) Galvanometer scanning system calibration method based on double checkerboards
CN109454634B (en) A robot hand-eye calibration method based on plane image recognition
WO2023165632A1 (en) Active vision three-dimensional calibration method and system based on galvanometer camera, and device
CN103759638B (en) A kind of part detection method
CN109029299A (en) The double camera measuring device and measuring method of bay section pin hole docking corner
CN107462184A (en) The parameter recalibration method and its equipment of a kind of structured light three-dimensional measurement system
CN110966956A (en) Binocular vision-based three-dimensional detection device and method
CN112802123B (en) Binocular linear array camera static calibration method based on stripe virtual target
CN110285770B (en) A kind of bridge deflection change measurement method, device and equipment
CN114018932A (en) Pavement disease index measuring method based on rectangular calibration object
CN111397513A (en) X-Y orthogonal motion platform motion calibration system and method
CN112258455A (en) Detection method for detecting spatial position of part based on monocular vision
CN110281240A (en) The positioning of liquid crystal display panel glass, pick-up method and system and vision processing system
CN112505663A (en) Calibration method for multi-line laser radar and camera combined calibration
CN208254424U (en) A kind of laser blind hole depth detection system
CN118509576A (en) Method and device for measuring optical center position of camera module
CN105928946A (en) Compensation method for detection equipment
CN111754584A (en) A system and method for calibrating parameters of a long-distance large field of view camera
CN113552133A (en) Cell skirt edge cracking detection method and visual detection device
CN111457942B (en) Plane height-fixing calibration device
CN104050661B (en) The method of real-time adjustment of Surface scan three-dimension measuring system precision
TWM632582U (en) Optical measurement device
CN110864879B (en) TOF depth module flatness testing system and method based on projection module
CN114708164B (en) Method for correcting image large and small head distortion caused by object inclination in machine vision measurement