TWI830632B - Solid state drives and circuit boards for solid state drives - Google Patents

Abstract

The present invention discloses a solid state drive and a circuit board for a solid state drive. The solid state drive includes a circuit board and flash memory. The circuit board includes a plurality of fixed areas for flash memory. The circuit board includes four groups of holes and a plurality of first holes. Each group of holes includes a plurality of second holes. At least two second holes within the same hole group expose different areas of the same auxiliary connection structure of the circuit board. Part of the auxiliary connection structure is covered by the protective layer of circuit board. Each first hole and each second hole pass through the protective layer. The four corners of the flash memory are connected to the auxiliary connection structure through soldering structures to enhance the connection strength of both. The flash memory is electrically connected to the circuit board through the electrical contact pads in each first hole.

Description

Solid state drives and solid state drive circuit boards

The present invention relates to a hard disk and a circuit board of the hard disk, in particular to a solid state hard disk and a circuit board of the solid state hard disk.

Solid state drives (SSDs) that do not include a casing are now common. When the user disassembles and installs the SSD on the computer motherboard, the user will directly come into contact with the flash memory of the SSD. Therefore, , after the solid state drive has been repeatedly disassembled and assembled for a long time, the flash memory may peel off in the solid state drive. In addition, with the existing flash technology of solid-state drives, the flash memory is prone to peeling off when the solid-state drive is bumped or dropped.

The invention discloses a solid state hard drive and a circuit board of the solid state hard drive, which are mainly used to improve the existing solid state hard drive that does not include a casing. The flash memory is easily peeled off from the circuit board due to external force.

One embodiment of the present invention discloses a solid state hard drive, which includes: a circuit board and a plurality of flash memories. One end of the circuit board has a plug-in structure. The plug-in structure is used to plug into a slot of an electronic device. The circuit board includes a plurality of memory fixing areas. One side of the circuit board has a protective layer. The circuit board is located in each of the slots. The memory fixing area has a plurality of first perforations and four perforation groups. Each first perforation penetrates the protective layer, and the circuit board exposes an electrical contact pad at each first perforation. The four perforation groups are located in the memory fixation area. At the four corners, each perforation group contains N second perforations, and each second perforation penetrates the protective layer. Any second perforation included in the same perforation group and at least one of the remaining second perforations in the same perforation group are exposed. Different areas of one of the auxiliary connection structures of the circuit board; the edge of any auxiliary connection structure is not exposed by any second through hole, and the edges of all auxiliary connection structures are not exposed to the protective layer, and any auxiliary connection structure is not exposed to the protective layer. Connected to any electrical contact pad; wherein, the circuit board has M auxiliary connection structures at the four corners of each memory fixed area, M < N, and M ≧ 1; multiple flash memories are respectively fixed on the circuit A board has a plurality of electrical contact portions and four fixing portion groups on one side of each flash memory. The four fixing portion groups are located at the four corners of the flash memory. Each fixing portion group includes a plurality of non-electrical fixing portions; When each flash memory is fixed on the circuit board, the plurality of electrical contact parts are electrically connected to the plurality of electrical contact pads, and each non-electrical fixing part is connected to a part of one of the auxiliary connection structures, and the same fixing part Any non-electrical fixing part of the group is connected to the same auxiliary connection structure as one of the remaining non-electrical fixing parts.

One embodiment of the present invention discloses a circuit board of a solid-state hard drive. One end of the circuit board has a plug-in structure. The plug-in structure is used to plug into a slot of an electronic device. The circuit board of the solid-state hard drive includes a plurality of memories. In the body fixing area, one side of the circuit board of the solid state drive has a protective layer. The circuit board of the solid state drive has a plurality of first through holes and four through hole groups in each memory fixing area. Each first through hole penetrates the protective layer. , and the circuit board of the solid state drive exposes an electrical contact pad in each first through hole, and four through hole groups are located at the four corners of the memory fixed area. Each through hole group contains N second through holes, and each second through hole penetrates the protective layer. Any second through hole included in the same through hole group is a part of one of the auxiliary connection structures of the circuit board of the solid state drive, and is partially connected to the remaining portion exposed by at least one second through hole; any auxiliary connection The edge of the structure is not exposed by any second through hole, and the edges of all auxiliary connection structures are not exposed on the protective layer, and any auxiliary connection structure is not connected to any electrical contact pad; wherein, each memory fixed area A flash memory is provided, and each memory fixed area includes a plurality of electrical contact pads and a plurality of auxiliary connection structures for connecting with a plurality of electrical contact portions and a plurality of non-electrical contacts of the flash memory. Fixed part connection; wherein, the circuit board of the solid state drive has M auxiliary connection structures at the four corners of each memory fixed area, M<N, and M≧1.

To sum up, the solid state drive and the circuit board of the solid state drive of the present invention, through the design of the four perforation groups and the auxiliary connection structure of the circuit board, cooperate with any second perforation included in the same perforation group to expose the circuit. A part of one of the auxiliary connection structures of the board is connected to the remaining part exposed by at least one second through hole, which can effectively strengthen the connection strength between the flash memory and the circuit board, thereby improving the conventional knowledge. The flash memory of solid-state drives is prone to peeling off due to external force.

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.

In the following description, if it is pointed out that please refer to a specific diagram or as described in a specific diagram, it is only used to emphasize that in the subsequent explanation, most of the relevant content mentioned appears in the specific diagram. However, this is not limited to the specific drawings that can only be referred to in the subsequent description.

Please refer to FIGS. 1 to 5 together. FIG. 1 is a schematic diagram of the solid-state hard drive of the present invention. FIG. 2 is a schematic diagram of a partial circuit board and flash memory of the solid-state hard drive of the present invention. FIG. 3 is a schematic diagram of the solid-state hard drive of the present invention. A partial top view of the circuit board of the first embodiment of the hard disk. Figure 4 is a schematic three-dimensional sectional view of the partial circuit board of the solid-state hard disk of the first embodiment of the present invention. Figure 5 is a schematic diagram of the solid-state hard disk of the present invention along the line of Figure 1 Schematic diagram of partial section along section line V-V.

The solid state drive 100 of the present invention includes a circuit board 1, a processing module 2 and two flash memories 3. One end of the circuit board 1 has a plug-in structure 11 , and the plug-in structure 11 is used to plug into a slot of an electronic device (such as a computer motherboard). The style of the plug-in structure 11 is not limited to that shown in the figure. The processing module 2 includes, for example, a processing chip 21 and other related electronic components. The number of flash memories 3 included in the solid state hard drive 100 and their locations on the circuit board 1 are not limited to those shown in the figure. In different embodiments, the solid state drive 100 may also include more than three flash memories 3 .

The circuit board 1 includes two memory fixing areas 1A. The two memory fixing areas 1A can be arranged side by side. Two flash memories 3 are fixed on the circuit board 1, and each flash memory 3 is located in one of them. in memory fixed area 1A.

The circuit board 1 includes a protective layer 12 , a plurality of first through holes 13 , eight through hole groups 14 , a plurality of electrical contact pads 15 , a plurality of auxiliary connection structures 16 and an underlying structure 17 . A plurality of electrical contact pads 15 and a plurality of auxiliary connection structures 16 are formed on one side of the underlying structure 17 .

The protective layer 12 is formed on the side of the underlying structure 17 where the electrical contact pads 15 and the auxiliary connection structures 16 are formed, and part of the protective layer 12 covers the auxiliary connection structures 16 . The protective layer 12 is, for example, an insulating layered structure (Solder-Mask) such as green paint, which is not limited thereto. The circuit board 1 has a plurality of first through holes 13 and four through hole groups 14 in each memory fixing area 1A. In practical applications, the circuit board 1 can be a multi-layer board structure such as a four-layer board or a six-layer board according to actual needs. The underlying structure 17 in this embodiment is only a simple schematic diagram, and the underlying structure 17 can actually be a multi-layer structure. .

Each first through hole 13 penetrates the protective layer 12 , and the circuit board 1 has an electrical contact pad 15 exposed at each first through hole 13 . Each electrical contact pad 15 is commonly known as PAD. In practical applications, the inner diameter of each first through hole 13 may be larger than the outer diameter of each electrical contact pad 15 , and a gap S1 is formed between each electrical contact pad 15 and the inside of the first through hole 13 . That is to say, any part of each electrical contact pad 15 is not covered by the protective layer 12 , and the outer edge of the electrical contact pad 15 can be seen through any first through hole 13 . It should be noted that in actual applications, some of the electrical contact pads 15 may also be connected to other circuit structures (ie, commonly known as circuits and wiring) on the underlying structure 17 , and the electrical contact pads 15 are not limited to Individually (like an island) provided in the underlying structure 17 .

The four perforation groups 14 included in each memory fixed area 1A are located at the four corners of the memory fixed area 1A. Each perforation group 14 may include six second perforations 141 . The number of second through holes 141 included in a single through hole group 14 and the arrangement of the second through holes 141 are not limited to those shown in the figures. In different embodiments, a single through hole group 14 may also include four or eight second through holes 141 according to requirements.

Each second through hole 141 penetrates the protective layer 12 , and any second through hole 141 included in the same through hole group 14 and at least one of the remaining second through holes 141 expose one of the auxiliary connection structures 16 of the circuit board 1 of different areas. That is to say, the circuit board 1 has at least one auxiliary connection structure 16 at the four corners of each memory fixing area 1A, and a part of each auxiliary connection structure 16 is exposed through at least one second through hole 141 of one of the through hole groups 14 . Among them, the circuit board 1 has N second through holes 141 and M auxiliary connection structures 16 at the four corners of each memory fixing area 1A, M<N, and M≧1. In this embodiment, N=6 and M=1 are taken as an example, but it is not limited to this.

As shown in Figures 3 and 4, the circuit board 1 may have one auxiliary connection structure 16 at the four corners of each memory fixing area 1A, and the circuit board has four auxiliary connection structures 16 at each memory fixation area 1A. . All the second through holes 141 included in each through hole group 14 of each memory fixing area 1A of the circuit board 1 respectively expose different areas of the same auxiliary connection structure 16; that is, the user can access the circuit board 1 at any location on the circuit board 1. Any second through hole 141 included in the through hole group 14 will see the same auxiliary connection structure 16 .

In practical applications, each auxiliary connection structure 16 may be made of the same material (such as copper foil) as each electrical contact pad 15 . In the manufacturing process of the circuit board 1 , all auxiliary connection structures 16 and all electrical contacts Pad 15 can be completed together in the same process step.

The number of auxiliary connection structures 16 provided at the four corners of each memory fixing area 1A of the circuit board 1 and the appearance of each auxiliary connection structure 16 are not limited to those shown in the figure. They can be determined according to the flash memory. 3. Design the number and arrangement of the non-electrical fixing parts 321 included in the four corners.

As shown in Figures 1, 2 and 5, each flash memory 3 is fixedly installed in the memory fixing area 1A of the circuit board 1. One side of each flash memory 3 has a plurality of electrical contact portions 31 and Four fixed groups 32. Four fixing portion groups 32 are located at four corners of the flash memory 3 , and each fixing portion group 32 includes a plurality of non-electric fixing portions 321 .

When each flash memory 3 is fixed on the circuit board 1 , the plurality of electrical contact portions 31 are electrically connected to the plurality of electrical contact pads 15 . In this embodiment, the circuit board 1 has a single auxiliary connection structure 16 at the four corners of each memory fixing area 1A, and the fixing portion groups 32 at the four corners of the flash memory 3 include all non-electrical fixing portions. 321 is connected to the same auxiliary connection structure 16 of the circuit board 1 .

As shown in Figures 2 and 5, in practical applications, the relevant equipment may be to first implant solder balls into each first through hole 13 and each second through hole 141 of the circuit board 1, and then place each flash memory 3 In each memory fixing area 1A, each electrical contact portion 31 and each electrical contact pad 15 are connected through solder balls, and the non-electrical fixing portion 321 of the same fixing portion group 32 is connected to the same one. The auxiliary connection structures 16 are connected to each other through a plurality of solder balls disposed in a plurality of second through holes 141 . Finally, each solder ball is solidified into the welding structure 4 through a related curing process.

Following the above, it should be particularly emphasized that if the circuit board 1 has six auxiliary connection structures 16 at each corner of each memory fixing area 1A, and each auxiliary connection structure 16 is not connected to each other, and each second The through hole 141 corresponds to exposing an auxiliary connection structure 16. With this design, when the flash memory 3 is acted upon by an external force, each auxiliary connection structure 16 will easily move with the flash memory 3 and peel off the circuit board 1; conversely, , if the auxiliary connection structure 16 and the second through hole 141 of the present invention are designed according to the above, when the flash memory 3 is subjected to the same external force, the flash memory 3 will be relatively difficult to peel off the circuit board 1 .

When the flash memory 3 is fixed to the circuit board 1 through the plurality of welding structures 4, the signal transmission between the flash memory 3 and the circuit board 1 will be carried out through the electrical contact pads 15 and the electrical contact portions 31 , and the plurality of non-electrical fixing parts 321 and the auxiliary connection structure 16 will not transmit any signals. The plurality of non-electrical fixing parts 321 and the auxiliary connection structure 16 are only used to strengthen the connection strength between the flash memory 3 and the circuit board 1 .

It is worth mentioning that in a preferred application, the edge of any auxiliary connection structure 16 is not exposed by any second through hole 141 , and the edges of all auxiliary connection structures 16 are not exposed on the protective layer 12 . That is to say, the edge of any auxiliary connection structure 16 cannot be seen through any second through hole 141 of the circuit board 1 , and the edge of the auxiliary connection structure 16 is covered by the protective layer 12 .

Furthermore, in general, the connection strength between the welding structure 4 and the auxiliary connection structure 16 is better than the connection strength between the welding structure 4 and the underlying structure 17 of the circuit board 1 forming the auxiliary connection structure 16 . Therefore, if the edges of the auxiliary connection structure 16 are not exposed through the second through hole 141 , the welding structure 4 located between the non-electrical fixing part 321 and the auxiliary connection structure 16 will not be connected to the underlying structure 17 of the circuit board 1 connection, thereby further improving the connection strength between the flash memory 3 and the circuit board 1 .

In other words, if the edge of the auxiliary connection structure 16 is exposed through part of the second through hole 141 , then a part of the welding structure 4 located between the non-electrical fixing part 321 and the auxiliary connection structure 16 will be connected to the underlying structure 17 , in this way, when the flash memory 3 is pulled by external force, cracks will easily appear at the connection position between the welding structure 4 and the underlying structure 17; when cracks appear at the connection position between the welding structure 4 and the underlying structure 17, if the flash memory If the memory 3 is still pulled by external force, stress concentration will occur at the crack, causing the auxiliary connection structure 16 and the underlying structure 17 to separate from each other.

As shown in FIGS. 4 and 5 , each non-electrical fixing part 321 of the flash memory 3 is connected to a part of one of the auxiliary connection structures 16 (for example, through the aforementioned welding structure 4 ), and the same fixing part group 32 Any one of the non-electrical fixing parts 321 is connected to the same auxiliary connection structure 16 as the remaining non-electrical fixing parts 321 .

As mentioned above, the solid state drive 100 of the present invention can effectively strengthen the flash memory 3 and the circuit by designing the circuit board 1 to have perforation groups 14 and auxiliary connection structures 16 at the four corners of each memory fixing area 1A. The connection strength between the circuit boards 1 is such that when the user repeatedly disassembles and installs the solid state drive 100, the flash memory 3 is still not easy to peel off the circuit board 1, and the solid state drive 100 is not easily peeled off during the drop test. The flash memory 3 is also relatively difficult to peel off the circuit board 1 .

Please refer to FIG. 6 , which is a partial top view of the circuit board of the solid state drive according to the second embodiment of the present invention. The circuit board 1 of the solid state drive 100 of the present invention has N second through holes 141 and M auxiliary connection structures 16 respectively at the four corners of each memory fixing area 1A, M<N, and M≧1. In this embodiment, In the example, N=6 and M=2.

That is to say, the circuit board 1 has two auxiliary connection structures 16 at the four corners of each memory fixing area 1A, and each through hole group 14 of the circuit board 1 includes six second through holes 141, three of which are second through holes 141. The perforations 141 expose different areas of the same auxiliary connection structure 16 , while the other three second perforations 141 expose different areas of another auxiliary connection structure 16 .

From the perspective of the flash memory 3, some non-electrical fixing portions 321 of the same fixing portion group 32 are connected to the same auxiliary connection structure 16 (for example, through the aforementioned welding structure 4), and the same fixing portion The non-electrical fixing part 321 of another part of the group 32 is connected to another auxiliary connection structure 16 .

It should be noted that as long as the conditions of M<N and M≧1 are met, the number of second through holes 141 and the number of auxiliary connection structures 16 provided by the circuit board 1 at the four corners of each memory fixing area 1A are not the same as in this embodiment. It is limited to the examples given in the foregoing embodiments. For example, in another different embodiment, N=8, M=4, that is, each perforation group 14 includes 8 second perforations 141, and every two second perforations 141 correspond to exposing the same auxiliary device. Connecting different areas of the structure 16.

In addition, in the embodiment of M≧2, the appearance and arrangement of the auxiliary connection structures 16 provided on the circuit board 1 at the four corners of each memory fixing area 1A can be changed according to requirements.

As shown in Figures 3 and 6, the circuit board 1 of this embodiment has a gap S2 between the two auxiliary connection structures 16 included in each corner of each memory fixing area 1A, and the aforementioned gap shown in Figure 3 In the first embodiment, the gap S2 does not exist. Therefore, the solid state drive 100 of this embodiment has less material for the auxiliary connection structure 16 than the solid state drive 100 of the first embodiment. In the case of mass production, the solid state drive 100 of this embodiment can save some production costs compared with the aforementioned first embodiment.

Please refer to FIG. 7 , which is a partial top view of the circuit board of the solid state drive according to the third embodiment of the present invention. The biggest difference between this embodiment and the previous embodiment is that all the second perforations included in two adjacent perforation groups belonging to different memory fixing areas expose different areas of the same auxiliary connection structure.

More specifically, the four corners of one of the memory fixed areas 1A of the circuit board 1 have four through-hole groups 14A, 14B, 14C, and 14D respectively. The four corners of one of the memory fixed areas 1A of the other circuit board 1 have four holes respectively. perforation groups 14E, 14F, 14G, 14H. The two perforation groups 14A and 14C included in one memory fixed area 1A are arranged adjacent to the two perforation groups 14F and 14H included in the other memory fixed area 1A, and all the second perforation groups 14A The through holes 141 and all the second through holes 141 of the through hole group 14F expose different areas of the same auxiliary connection structure 16. All the second through holes 141 of the through hole group 14C and all the second through holes 141 of the through hole group 14H expose the same auxiliary connection structure. Connecting different areas of the structure 16.

That is to say, in the aforementioned first embodiment shown in Figure 3, the circuit board 1 has a total of eight auxiliary connection structures 16 in the two memory fixing areas 1A; in the diagram of this embodiment in Figure 7, the circuit board 1 There are only six auxiliary connection structures 16 in the two memory fixed areas 1A of 1.

Through the design of this embodiment, part of the non-electrical fixing parts of the two flash memories included in the solid state drive can be connected to the same auxiliary connection structure 16 through a welding structure. In this way, it can be further improved. The connection strength between flash memory and circuit board 1.

Please refer to FIG. 8 , which is a partial top view of the circuit board of the fourth embodiment of the solid state drive of the present invention. The biggest difference between this embodiment and the aforementioned third embodiment is that two adjacent perforation groups belonging to different memory fixing areas each contain part of the second perforation, which exposes the same auxiliary connection structure. area, and the circuit board 1 of this embodiment includes a total of 8 auxiliary connection structures.

More specifically, the three (not limited to this number) second through holes 141 included in the through hole group 14A of one memory fixed area 1A are different from the three second through holes 141 included in the through hole group 14F of the other memory fixed area 1A. (not limited to this numerical value) second through holes 141 expose different areas of the same auxiliary connection structure 16A; among them, the other three (not limited to this numerical value) included in the through hole group 14A of one memory fixed area 1A ) The second through hole 141 and the other three (not limited to this number) second through hole 141 included in the through hole group 14F of the other memory fixed area 1A are different areas exposing the same auxiliary connection structure 16B.

Similarly, the three second through holes 141 included in the through hole group 14C and the three second through holes 141 included in the through hole group 14H expose different areas of the same auxiliary connection structure 16C; the other three included in the through hole group 14C The two second through holes 141 and the other three second through holes 141 included in the through hole group 14H expose different areas of the same auxiliary connection structure 16D.

Please refer to FIG. 9 , which is a partial top view of the circuit board of the solid state drive according to the fifth embodiment of the present invention. The difference between this embodiment and the foregoing fourth embodiment is that the two adjacent perforation groups belonging to different memory fixed areas each contain a part of the second perforation that exposes the same one. Different areas of the auxiliary connection structure, and another part of the second through holes included in each of the memory fixing areas, expose different areas of the same auxiliary connection structure.

More specifically, the circuit board 1 of this embodiment includes a total of 10 auxiliary connection structures, 4 (not limited to this numerical value) of the second through-holes 141 of the through-hole group 14A, and 4 (not limited to this number) of the through-hole group 14F. The second perforations 141 (not limited to the numerical value) expose different areas of the same auxiliary connection structure 16E; the other two second perforations 141 (not limited to the numerical value) of the perforation group 14A expose another auxiliary connection structure 16F. Different areas; the other two (not limited to this numerical value) second through holes 141 of the through hole group 14F expose another auxiliary connection structure 16G.

Similarly, the four second perforations 141 of the perforation group 14C and the four second perforations 141 of the perforation group 14H expose different areas of the same auxiliary connection structure 16H; the other two second perforations 141 of the perforation group 14C, Different areas of another auxiliary connection structure 16K are exposed; the other two second through holes 141 of the through hole group 14H are used to expose another auxiliary connection structure 16M.

It should be noted that the circuit board 1 of the solid state drive 100 described in any of the above embodiments can be independently manufactured, implemented, and sold, and the circuit board 1 is not limited to the solid state drive 100. sold in the form of.

In summary, the solid state drive and the circuit board of the solid state drive of the present invention have perforation groups and at least one auxiliary connection structure at the four corners of each memory fixed area on the circuit board, and make part of each perforation group The design of the two perforations is to expose different areas of the same auxiliary connection structure, which can effectively increase the connection strength between the flash memory and the circuit board, thereby effectively reducing the peeling of the flash memory of the solid-state hard drive due to external forces. situation.

The above are only the best possible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

100:Solid state drive 1:Circuit board 11: Plug-in structure 1A: Memory fixed area 12:Protective layer 13: First piercing 14: Piercing group 14A: Perforation group 14B: Piercing group 14C: Perforation group 14D: Perforation group 14E: Perforation group 14F: Perforation group 14G: Perforation group 14H: Piercing group 141: Second piercing 15: Electrical contact pad 16: Auxiliary connection structure 16A: Auxiliary connection structure 16B: Auxiliary connection structure 16C: Auxiliary connection structure 16D: Auxiliary connection structure 16E: Auxiliary connection structure 16F: Auxiliary connection structure 16G: Auxiliary connection structure 16H: Auxiliary connection structure 16K: Auxiliary connection structure 16M: Auxiliary connection structure 17:Underlying structure 2: Processing module 21: Processing wafers 3: Flash memory 31: Electrical contact part 32: Fixed group 321: Non-electrical fixation part 4: Welded structure S1: gap S2: Gap

Figure 1 is a schematic diagram of the solid state hard drive of the present invention.

FIG. 2 is a schematic diagram of a partial circuit board and flash memory of the solid state drive of the present invention.

FIG. 3 is a partial top view of the circuit board of the solid state drive according to the first embodiment of the present invention.

4 is a schematic three-dimensional cross-sectional view of a partial circuit board of the solid state drive according to the first embodiment of the present invention.

FIG. 5 is a partial cross-sectional schematic view of the solid-state hard drive of the present invention along the cross-section line V-V in FIG. 1 .

FIG. 6 is a partial top view of the circuit board of the solid state drive according to the second embodiment of the present invention.

FIG. 7 is a partial top view of the circuit board of the third embodiment of the solid state drive of the present invention.

8 is a partial top view of the circuit board of the fourth embodiment of the solid state drive of the present invention.

FIG. 9 is a partial top view of the circuit board of the solid state drive according to the fifth embodiment of the present invention.

1:Circuit board

12:Protective layer

13: First piercing

14: Piercing group

141: Second piercing

15: Electrical contact pad

16: Auxiliary connection structure

17:Underlying structure

S1: gap

Claims (10)

A solid state drive containing: A circuit board has a plug-in structure at one end thereof. The plug-in structure is used to be inserted into a slot of an electronic device. The circuit board includes a plurality of memory fixing areas. One side of the circuit board has a plug-in structure. A protective layer, the circuit board has a plurality of first through holes and four through hole groups in each of the memory fixing areas, each of the first through holes penetrates the protective layer, and the circuit board has a plurality of first through holes in each of the memory fixing areas. The first perforation exposes an electrical contact pad, four perforation groups are located at the four corners of the memory fixing area, each perforation group includes N second perforations, and each second perforation penetrates the protective layer, Any one of the second through holes included in the same through hole group is different from at least one of the remaining second through holes in the same through hole group in that it exposes one of the auxiliary connection structures of the circuit board. area; the edges of any of the auxiliary connection structures are not exposed by any of the second through holes, and the edges of all of the auxiliary connection structures are not exposed on the protective layer, and any of the auxiliary connection structures are not exposed Connected to any of the electrical contact pads; wherein the circuit board has M auxiliary connection structures at the four corners of each memory fixing area, M<N, and M≧1; A plurality of flash memories are respectively fixed on the circuit board. One side of each flash memory has a plurality of electrical contact parts and four fixing part groups. The four fixing part groups are located at the At the four corners of the flash memory, each of the fixing portion groups includes a plurality of non-electrical fixing portions; when each of the flash memories is fixed to the circuit board, the plurality of electrical contact portions are connected to the plurality of non-electrical fixing portions. The electrical contact pads are electrically connected, each of the non-electrical fixing parts is connected to a part of one of the auxiliary connection structures, and any one of the non-electrical fixing parts of the same fixing part group is connected to a part of the auxiliary connection structure. One of the remaining non-electrical fixing parts is connected to the same auxiliary connection structure. The solid state drive according to claim 1, wherein the inner diameter of each first through hole is larger than the outer diameter of each electrical contact pad, and the inner diameter of each electrical contact pad and the first through hole is A gap is formed therebetween, each of the electrical contact pads is connected to one of the electrical contact parts through a welding structure, a part of the welding structure is located in the gap, and the welding structure covers the around electrical contact pads. The solid state drive according to claim 1, wherein the circuit board has one of the auxiliary connection structures at four corners of each of the flash memory fixing areas, and each of the second second holes in the same through hole group The perforations expose different areas of the same auxiliary connection structure, and all the non-electrical fixing parts of the same fixing part group are connected to the same auxiliary connection structure. The solid state drive according to claim 1, wherein the two adjacent perforation groups belonging to different memory fixed areas each contain at least one second perforation that exposes the same one. Different areas of the auxiliary connection structure. The solid state drive as claimed in claim 1, wherein all the second perforations included in two adjacent perforation groups belonging to different memory fixed areas expose the same second perforation group. Describe the different areas of the auxiliary connection structure. A solid-state hard drive circuit board has a plug-in structure at one end. The plug-in structure is used to be inserted into a slot of an electronic device. The solid-state hard drive circuit board includes a plurality of memory fixing areas. One side of the circuit board of the solid state drive has a protective layer, and the circuit board of the solid state drive has a plurality of first through holes and four through hole groups in each of the memory fixing areas, and each of the first through holes It penetrates the protective layer, and the circuit board of the solid state drive exposes an electrical contact pad at each of the first through holes. Four of the through hole groups are located at the four corners of the memory fixing area. Each of the through holes The group includes N second perforations, each of the second perforations penetrates the protective layer, and any one of the second perforations included in the same perforation group is one of the auxiliary means for exposing the circuit board of the solid state drive. A part of the connection structure, and part of it is connected to the remaining part exposed by at least one of the second perforations; the edge of any of the auxiliary connection structures is not exposed by any of the second perforations, and all of the auxiliary connection structures The edge of the connection structure is not exposed to the protective layer, and any of the auxiliary connection structures is not connected to any of the electrical contact pads; wherein each of the memory fixing areas is used to set a flash memory , and the plurality of electrical contact pads and the plurality of auxiliary connection structures included in each memory fixed area are used to communicate with the plurality of electrical contact portions and the plurality of non-electrical contacts of the flash memory. Fixed portion connection; wherein, the circuit board of the solid state drive has M auxiliary connection structures at four corners of each memory fixed area, M<N, and M≧1. The solid-state hard drive circuit board according to claim 6, wherein the inner diameter of each first through hole is larger than the outer diameter of each electrical contact pad, and each electrical contact pad is in contact with the first A gap is formed between the inner sides of the through holes, and the gap is used to provide a part of a welding structure, and the welding structure is used to connect one of the electrical contact pads and one of the electrical contact parts. The solid-state hard drive circuit board according to claim 6, wherein one side of each flash memory has a plurality of electrical contact parts and four fixing part groups, and the four fixing part groups are located on the At the four corners of the flash memory, each of the fixed portion groups includes a plurality of non-electrical fixing portions, and the circuit board of the solid state drive has four of the auxiliary connection structures in each of the flash memory fixed areas. Each of the second through holes in a through hole group exposes a different area of the same auxiliary connection structure, and all the non-electrical fixing parts of the same fixing part group are connected to the same auxiliary connection structure. connected. The circuit board of a solid-state hard drive according to claim 6, wherein the two adjacent through-hole groups belonging to different memory fixed areas each include at least one second through-hole. Different areas of the same auxiliary connection structure are exposed. The solid-state hard drive circuit board as claimed in claim 6, wherein all the second through-holes included in two adjacent through-hole groups belonging to different memory fixing areas are exposed Different areas of the same auxiliary connection structure.

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