TWI815498B - Sensing device - Google Patents
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Abstract
Description
本發明係關於一種感測裝置，尤指一種應用於皮膚組織漫反射訊號量測之感測裝置。The present invention relates to a sensing device, in particular to a sensing device used for measuring diffuse reflection signals of skin tissue.
現代人越來越注重身體健康，使得可監測身體狀況之感測裝置成了許多人生活中之必需品。使用者可依據不同需求，將這些感測裝置短期或長期配戴在身上，以取得身體之基本生理參數，例如脈搏、血氧濃度、血壓、血糖等數值，作為判斷目前健康與否之參考。Modern people pay more and more attention to their health, making sensing devices that can monitor physical conditions a necessity in many people's lives. Users can wear these sensing devices on their bodies for short or long periods according to different needs to obtain basic physiological parameters of the body, such as pulse, blood oxygen concentration, blood pressure, blood sugar and other values, as a reference for judging current health.
目前市面上常見之這些感測裝置，大多都是由光源、光感測元件及訊號處理電路所組成。光源朝向被測物發出光，而自被測物反射之光經過光感測元件接收，最後進行訊號處理以取得感測結果。這些感測裝置之主要問題是，由於光源之發光角度較大（例如貼片式光源，一般其發光角度會達到130度），只有一部分光會照射到被測物之待感測位置，而大部分之光會因為照射到其他不需要之地方而被浪費掉，使得感測裝置產生之訊號強度比較弱；正因為訊號弱，造成感測裝置之信噪比高，進而導致感測裝置容易出現靈敏度低、感測訊號不準確等問題。Most of these sensing devices currently on the market are composed of light sources, light sensing elements and signal processing circuits. The light source emits light toward the object to be measured, and the light reflected from the object to be measured is received by the light sensing element, and finally the signal is processed to obtain the sensing result. The main problem of these sensing devices is that due to the large luminous angle of the light source (such as a patch type light source, the luminous angle generally reaches 130 degrees), only a part of the light will illuminate the position of the object to be sensed, and most of the light will illuminate the position of the object to be sensed. Part of the light will be wasted by shining on other unnecessary places, causing the signal intensity generated by the sensing device to be relatively weak. Because of the weak signal, the signal-to-noise ratio of the sensing device is high, which in turn causes the sensing device to easily appear. Problems such as low sensitivity and inaccurate sensing signals.
因此，如何設計出能改善前述問題之感測裝置，提高感測裝置之感測效能，實為一個值得研究之課題。Therefore, how to design a sensing device that can improve the aforementioned problems and improve the sensing performance of the sensing device is indeed a topic worthy of study.
本發明之目的在於提供一種應用於皮膚組織漫反射訊號量測之感測裝置。The object of the present invention is to provide a sensing device for measuring diffuse reflection signals of skin tissue.
為達上述目的，本發明之感測裝置包括基板、複數光源組及至少一光感測元件。複數光源組及至少一光感測元件均設置於基板。每一光源組包括至少二半導體光源，且同一光源組中之至少二半導體光源所發出之光具有相同之波長。每一光感測元件對應複數光源組之至少一組，且定義任一光感測元件與對應之每一光源組中最接近光感測元件之半導體光源之中心間距為A，任一光感測元件與對應之每一光源組中第二接近光感測元件之半導體光源之中心間距為2A，以此類推。To achieve the above object, the sensing device of the present invention includes a substrate, a plurality of light source groups and at least one light sensing element. A plurality of light source groups and at least one light sensing element are arranged on the substrate. Each light source group includes at least two semiconductor light sources, and the light emitted by the at least two semiconductor light sources in the same light source group has the same wavelength. Each light sensing element corresponds to at least one of the plurality of light source groups, and the center distance between any light sensing element and the corresponding semiconductor light source in each light source group that is closest to the light sensing element is defined as A, and any light sensing element and the corresponding The center distance of the second semiconductor light source close to the light sensing element in each light source group is 2A, and so on.
在本發明之一實施例中，基板為玻璃纖維基板、陶瓷基板、軟性基板、金屬基板或半導體基板。In one embodiment of the present invention, the substrate is a fiberglass substrate, a ceramic substrate, a flexible substrate, a metal substrate or a semiconductor substrate.
在本發明之一實施例中，當基板為半導體基板時，基板可內建功率放大電路、驅動電路或控制電路。In one embodiment of the present invention, when the substrate is a semiconductor substrate, the substrate may have a built-in power amplification circuit, a driving circuit or a control circuit.
在本發明之一實施例中，當每一光源組之至少二半導體光源之數量為三個或三個以上時，該些半導體光源沿直線方向等距排列。In one embodiment of the present invention, when the number of at least two semiconductor light sources in each light source group is three or more, the semiconductor light sources are arranged equidistantly along a straight line.
在本發明之一實施例中，至少一光感測元件之數量為複數光源組之組數之0.1倍至2倍。In one embodiment of the present invention, the number of at least one light sensing element is 0.1 to 2 times the number of the plurality of light source groups.
在本發明之一實施例中，每一光源組中相鄰二個該半導體光源之中心間距為0.5 釐米(mm)至1.5釐米。In one embodiment of the present invention, the center distance between two adjacent semiconductor light sources in each light source group is 0.5 centimeters (mm) to 1.5 centimeters.
在本發明之一實施例中，每一光源組對應之波長可選自以下群組中之其中一者波段：405 nm、445 nm、455 nm、470 nm、500 nm、515 nm、525 nm、535 nm、 545 nm、560 nm、570 nm、595 nm、600 nm、615 nm、630 nm、645 nm、660 nm、700 nm、730 nm、760 nm、810 nm、830 nm、850 nm、880 nm、940 nm、970 nm、1050 nm、1150 nm、1250 nm、1350 nm、1450 nm、1550 nm或1650 nm。In one embodiment of the present invention, the wavelength corresponding to each light source group can be selected from one of the following groups: 405 nm, 445 nm, 455 nm, 470 nm, 500 nm, 515 nm, 525 nm, 535 nm, 545 nm, 560 nm, 570 nm, 595 nm, 600 nm, 615 nm, 630 nm, 645 nm, 660 nm, 700 nm, 730 nm, 760 nm, 810 nm, 830 nm, 850 nm, 880 nm , 940 nm, 970 nm, 1050 nm, 1150 nm, 1250 nm, 1350 nm, 1450 nm, 1550 nm or 1650 nm.
在本發明之一實施例中，任一光感測元件與對應之光源組中最接近之半導體光源之中心間距等於對應之光源組中相鄰二個半導體光源之中心間距。In one embodiment of the present invention, the center distance between any light sensing element and the closest semiconductor light source in the corresponding light source group is equal to the center distance between two adjacent semiconductor light sources in the corresponding light source group.
在本發明之一實施例中，複數光源組可執行複數次亮燈程序，每次亮燈程序定義為以單一光源組為單位，當任一光源組中之所有半導體光源依序執行一次亮燈操作後，才跳至下一光源組執行相同亮燈操作，直到複數光源組均執行亮燈操作完畢後，即完成該次亮燈程序。In one embodiment of the present invention, a plurality of light source groups can execute a plurality of lighting procedures. Each lighting procedure is defined as a unit of a single light source group. When all the semiconductor light sources in any light source group perform one lighting sequence in sequence, After the operation, it jumps to the next light source group to perform the same lighting operation. When multiple light source groups have completed the lighting operation, the lighting procedure is completed.
在本發明之一實施例中，兩次亮燈程序之間隔時間不小於1秒(s)，且不大於15分鐘(min)。In one embodiment of the present invention, the interval between two lighting procedures is not less than 1 second (s) and not more than 15 minutes (min).
在本發明之一實施例中，每一半導體光源之亮燈時間不大於100 毫秒(ms)。In one embodiment of the present invention, the lighting time of each semiconductor light source is no more than 100 milliseconds (ms).
在本發明之一實施例中，前後二個半導體光源之亮燈操作之間隔時間不大於1秒(s)。In one embodiment of the present invention, the interval between the lighting operations of the two semiconductor light sources is no more than 1 second (s).
在本發明之一實施例中，各光感測元件之長寬比為1:1至1:3。In one embodiment of the present invention, the aspect ratio of each light sensing element is 1:1 to 1:3.
在本發明之一實施例中，複數光源組至少包括二種以上之波長。In an embodiment of the present invention, the plurality of light source groups includes at least two or more wavelengths.
在本發明之一實施例中，當至少一光感測元件為複數時，複數光感測元件中之至少二者可同時接收同一光源組所射出之光。In one embodiment of the present invention, when at least one light sensing element is plural, at least two of the plurality of light sensing elements can receive light emitted by the same light source group at the same time.
據此，本發明之感測裝置藉由複數光源組及至少一光感測元件之相應配置，能提高感測靈敏度、降低信噪比以得到良好之感測訊號。此外，本發明之感測裝置配合光源點亮時間之設計，可縮短光源點亮之時間以降低能源消耗，達到節能省電效果。Accordingly, the sensing device of the present invention can improve the sensing sensitivity and reduce the signal-to-noise ratio to obtain good sensing signals through the corresponding configuration of the plurality of light source groups and at least one light sensing element. In addition, the sensing device of the present invention is designed in conjunction with the lighting time of the light source, which can shorten the lighting time of the light source to reduce energy consumption and achieve energy-saving effects.
由於各種態樣與實施例僅為例示性且非限制性，故在閱讀本說明書後，具有通常知識者在不偏離本發明之範疇下，亦可能有其他態樣與實施例。根據下述之詳細說明與申請專利範圍，將可使該等實施例之特徵及優點更加彰顯。Since various aspects and embodiments are only illustrative and non-limiting, after reading this description, a person with ordinary knowledge may also have other aspects and embodiments without departing from the scope of the present invention. According to the following detailed description and patent application scope, the features and advantages of these embodiments will be more clearly demonstrated.
於本文中，係使用「一」或「一個」來描述本文所述的元件和組件。此舉只是為了方便說明，並且對本發明之範疇提供一般性的意義。因此，除非很明顯地另指他意，否則此種描述應理解為包括一個或至少一個，且單數也同時包括複數。As used herein, "a" or "an" are used to describe elements and components described herein. This is done for convenience of explanation only and to provide a general sense of the scope of the invention. Accordingly, unless it is obvious otherwise, such description shall be understood to include one or at least one, and the singular shall also include the plural.
於本文中，用語「第一」或「第二」等類似序數詞主要是用以區分或指涉相同或類似的元件或結構，且不必然隱含此等元件或結構在空間或時間上的順序。應了解的是，在某些情形或組態下，序數詞可以交換使用而不影響本創作之實施。In this article, the terms "first" or "second" and similar ordinal numbers are mainly used to distinguish or refer to the same or similar elements or structures, and do not necessarily imply the spatial or temporal spatial or temporal arrangement of these elements or structures. order. It should be understood that in certain situations or configurations, ordinal words can be used interchangeably without affecting the implementation of the invention.
於本文中，用語「包括」、「具有」或其他任何類似用語意欲涵蓋非排他性之包括物。舉例而言，含有複數要件的元件或結構不僅限於本文所列出之此等要件而已，而是可以包括未明確列出但卻是該元件或結構通常固有之其他要件。As used herein, the terms "includes," "has," or any other similar term are intended to cover a non-exclusive inclusion. For example, an element or structure containing plural elements is not limited to the elements listed herein, but may include other elements not expressly listed but that are generally inherent to the element or structure.
在以下各實施例中，本發明之感測裝置所提及之所有必要元件可一併設置於裝置之外殼體內（圖未示），而本發明之感測裝置主要著重前述必要元件之配置；由於外殼體之設置屬於習知技術，在此不多加贅述。此外，本發明中所述兩個元件之中心間距，係指從一個元件之中心點至另一個元件之中心點之最短直線距離。In the following embodiments, all the necessary components mentioned in the sensing device of the present invention can be disposed in the outer casing of the device (not shown), and the sensing device of the present invention mainly focuses on the configuration of the aforementioned necessary components; Since the arrangement of the outer casing is a common technique, no further details will be given here. In addition, the center distance between two elements in the present invention refers to the shortest straight-line distance from the center point of one element to the center point of the other element.
以下請參考圖1為本發明之感測裝置之第一實施例之示意圖。如圖1所示，本發明之感測裝置1包括基板10、複數光源組20及至少一光感測元件30。基板10主要作為可供設置複數光源組20及至少一光感測元件30之基礎元件。在以下各實施例中，基板10可為玻璃纖維基板、陶瓷基板、軟性基板、金屬基板、半導體基板或其他材料製成之基板，端視不同之使用需求而調整。其中，當基板10為半導體基板時，基板10可內建功率放大電路、驅動電路、控制電路或其他電子電路元件，以利於驅動複數光源組20及至少一光感測元件30、傳輸訊號或執行其他相應功能，但本發明不以此為限。Please refer to FIG. 1 below, which is a schematic diagram of the first embodiment of the sensing device of the present invention. As shown in FIG. 1 , the sensing device 1 of the present invention includes a substrate 10 , a plurality of light source groups 20 and at least one light sensing element 30 . The substrate 10 is mainly used as a basic component for disposing a plurality of light source groups 20 and at least one light sensing element 30 . In the following embodiments, the substrate 10 can be a fiberglass substrate, a ceramic substrate, a flexible substrate, a metal substrate, a semiconductor substrate, or a substrate made of other materials, which can be adjusted according to different usage requirements. When the substrate 10 is a semiconductor substrate, the substrate 10 can have built-in power amplifier circuits, drive circuits, control circuits or other electronic circuit components to facilitate driving the plurality of light source groups 20 and at least one light sensing element 30, transmitting signals or executing Other corresponding functions, but the present invention is not limited thereto.
複數光源組20設置於基板10。複數光源組20主要發出光以照射到皮膚。複數光源組20之組數會依據不同之使用需求而調整，且相鄰設置之二個光源組20之間會保持間距而彼此不接觸。每一光源組20包括至少二半導體光源21，也就是說，每一光源組20之半導體光源21之數量必定為二個或二個以上。為了能較清楚呈現本發明之感測裝置1之技術特徵，在以下各實施例中，本發明之感測裝置1中每一光源組20僅以包括二個半導體光源21之實施態樣加以說明，但依據不同之使用需求，每一光源組20可包括三個、四個或更多個半導體光源21。在本發明之一實施例中，當每一光源組20之半導體光源21之數量為三個或三個以上時，該些半導體光源21會沿同一直線方向等距排列。此外，在本發明之一實施例中，每一光源組20中相鄰二個半導體光源21之中心間距約為0.5釐米(mm)至1.5釐米(mm)，視配置或需求不同而加以調整。A plurality of light source groups 20 are provided on the substrate 10 . The plurality of light source groups 20 mainly emits light to illuminate the skin. The number of the plurality of light source groups 20 will be adjusted according to different usage requirements, and the distance between two adjacent light source groups 20 will be maintained without contacting each other. Each light source group 20 includes at least two semiconductor light sources 21 , that is to say, the number of semiconductor light sources 21 in each light source group 20 must be two or more. In order to more clearly present the technical features of the sensing device 1 of the present invention, in the following embodiments, each light source group 20 in the sensing device 1 of the present invention is only described in an implementation mode including two semiconductor light sources 21 , but depending on different usage requirements, each light source group 20 may include three, four or more semiconductor light sources 21 . In one embodiment of the present invention, when the number of semiconductor light sources 21 in each light source group 20 is three or more, the semiconductor light sources 21 will be arranged equidistantly along the same straight line direction. In addition, in one embodiment of the present invention, the center distance between two adjacent semiconductor light sources 21 in each light source group 20 is approximately 0.5 centimeters (mm) to 1.5 centimeters (mm), which can be adjusted depending on different configurations or needs.
在本發明中，複數光源組20至少包括二種以上之波長，且於同一光源組20中之所有半導體光源21所發出之光具有相同波段之波長。舉例來說，假設本發明之感測裝置1包括二個光源組20，其中一個光源組20之所有半導體光源21都發出波長為P1之光，另一個光源組20之所有半導體光源21都發出波長為P2之光，且P1相異於P2；又假設本發明之感測裝置1包括三個光源組20，每一光源組20之所有半導體光源21都發出相同波長之光，有可能三個光源組20對應之波長均不相同，或者其中二個光源組20對應之波長相同，但與另一個光源組20對應之波長不相同，以此類推。在設計上，複數光源組20會根據人體皮膚內生理特徵之吸收光譜而提供相對應之波長，以便於進行相應生理特徵之感測。In the present invention, the plurality of light source groups 20 includes at least two or more wavelengths, and the light emitted by all the semiconductor light sources 21 in the same light source group 20 has the same wavelength band. For example, assume that the sensing device 1 of the present invention includes two light source groups 20. All the semiconductor light sources 21 of one light source group 20 emit light of wavelength P1, and all the semiconductor light sources 21 of the other light source group 20 emit light of wavelength P1. is the light of P2, and P1 is different from P2; also assuming that the sensing device 1 of the present invention includes three light source groups 20, and all the semiconductor light sources 21 of each light source group 20 emit light of the same wavelength, there may be three light sources. The wavelengths corresponding to the groups 20 are different, or the wavelengths corresponding to the two light source groups 20 are the same, but the wavelengths corresponding to the other light source group 20 are different, and so on. In terms of design, the plurality of light source groups 20 will provide corresponding wavelengths according to the absorption spectrum of physiological characteristics in human skin to facilitate sensing of corresponding physiological characteristics.
根據不同之感測目的，每一光源組20會選用波段介於400nm~1650nm之間之波長。舉例來說，一般光源針對膽紅素之測量會選用波段為400nm~530nm之波長，針對血紅素之測量上則選用波段為500nm(奈米)~600nm之波長為主、針對血糖之測量上則選用波段為800nm~1600nm之波長為主。而在本發明之一實施例中，每一光源組20對應之波長可選自以下群組之其中一者波段：405 nm、445 nm、455 nm、470 nm、500 nm、515 nm、525 nm、535 nm、 545 nm、560 nm、570 nm、595 nm、600 nm、615 nm、630 nm、645 nm、660 nm、700 nm、730 nm、760 nm、810 nm、830 nm、850 nm、880 nm、940 nm、970 nm、1050 nm、1150 nm、1250 nm、1350 nm、1450 nm、1550 nm或1650 nm。According to different sensing purposes, each light source group 20 will select a wavelength between 400nm and 1650nm. For example, the general light source will use the wavelength band of 400nm~530nm for the measurement of bilirubin, the wavelength band of 500nm (nanometer)~600nm for the measurement of hemoglobin, and the wavelength band of 500nm (nanometer)~600nm for the measurement of blood sugar. The wavelength band mainly used is 800nm~1600nm. In an embodiment of the present invention, the wavelength corresponding to each light source group 20 can be selected from one of the following groups: 405 nm, 445 nm, 455 nm, 470 nm, 500 nm, 515 nm, 525 nm. , 535 nm, 545 nm, 560 nm, 570 nm, 595 nm, 600 nm, 615 nm, 630 nm, 645 nm, 660 nm, 700 nm, 730 nm, 760 nm, 810 nm, 830 nm, 850 nm, 880 nm, 940 nm, 970 nm, 1050 nm, 1150 nm, 1250 nm, 1350 nm, 1450 nm, 1550 nm or 1650 nm.
至少一光感測元件30設置於基板10。當複數光源組20發出之光照射到皮膚後，可由至少一光感測元件30接收經漫反射傳遞回來之光訊號，這些訊號可再經進一步推算出欲獲得之生理參數。在設計上，每一光感測元件30對應複數光源組20之至少一組，使得每一光感測元件30可感測到對應之至少一組光源組20所發出之光，以利於執行後續感測數據之分析。每一光感測元件30與其對應之光源組20之任一半導體光源均會保持間距而彼此不接觸。在本發明中，由於每一光源組20包括至少二半導體光源21，因此定義任一光感測元件30與對應之每一光源組20中最接近光感測元件30之半導體光源21之中心間距為A，任一光感測元件30與對應之每一光源組20中第二接近光感測元件30之半導體光源21之中心間距為2A，以此類推（例如假設光源組20包括三個半導體光源21，則光感測元件30與對應之光源組20中第三接近光感測元件30之半導體光源21之中心間距為3A，但本發明不以此為限）。At least one light sensing element 30 is disposed on the substrate 10 . When the light emitted by the plurality of light source groups 20 irradiates the skin, at least one light sensing element 30 can receive light signals transmitted back through diffuse reflection, and these signals can be further deduced to obtain the physiological parameters to be obtained. In terms of design, each light sensing element 30 corresponds to at least one group of the plurality of light source groups 20, so that each light sensing element 30 can sense the light emitted by the corresponding at least one group of light source groups 20 to facilitate subsequent execution. Analysis of sensing data. Each light sensing element 30 and any semiconductor light source of the corresponding light source group 20 maintain a distance and do not contact each other. In the present invention, since each light source group 20 includes at least two semiconductor light sources 21, the center distance between any light sensing element 30 and the corresponding semiconductor light source 21 closest to the light sensing element 30 in each light source group 20 is defined as A , the center distance between any light sensing element 30 and the second semiconductor light source 21 close to the light sensing element 30 in each corresponding light source group 20 is 2A, and so on (for example, assuming that the light source group 20 includes three semiconductor light sources 21, then The center distance between the light sensing element 30 and the third semiconductor light source 21 close to the light sensing element 30 in the corresponding light source group 20 is 3A, but the invention is not limited thereto).
在本發明之一實施例中，任一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距等於對應之光源組20中相鄰二個半導體光源21之中心間距。舉例來說，假設任一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距為A，則對應之光源組20中相鄰二個半導體光源21之中心間距也同樣為A，也就是說，自光感測元件30至對應之光源組20中最接近之半導體光源21之中心間距為A，而自光感測元件30至對應之光源組20中第二接近之半導體光源21之中心間距為2A。藉由前述設計，使得沿相同直線方向排列之光感測元件30及該些半導體光源21可呈現等距排列，以利於執行後續感測數據之分析計算。In one embodiment of the present invention, the center distance between any light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is equal to the center distance between two adjacent semiconductor light sources 21 in the corresponding light source group 20 . For example, assuming that the center distance between any light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is A, then the center distance between two adjacent semiconductor light sources 21 in the corresponding light source group 20 is also A. , that is to say, the center distance from the light sensing element 30 to the closest semiconductor light source 21 in the corresponding light source group 20 is A, and from the light sensing element 30 to the second closest semiconductor light source in the corresponding light source group 20 The center distance of 21 is 2A. Through the above design, the light sensing elements 30 and the semiconductor light sources 21 arranged along the same linear direction can be equidistantly arranged, which facilitates the analysis and calculation of subsequent sensing data.
至少一光感測元件30之數量與複數光源組20之組數會依據不同配置或設計需求而作調整。在本發明之一實施例中，至少一光感測元件30之數量為複數光源組20之組數之0.1倍至2倍。舉例來說，當光感測元件30之數量為一個時，光源組20之組數最多可為十組；而當光感測元件30之數量為二個時，光源組20之組數最少可為一組。The number of at least one light sensing element 30 and the number of light source groups 20 will be adjusted according to different configurations or design requirements. In one embodiment of the present invention, the number of at least one light sensing element 30 is 0.1 to 2 times the number of the plurality of light source groups 20 . For example, when the number of light sensing elements 30 is one, the number of light source groups 20 can be at most ten; and when the number of light sensing elements 30 is two, the number of light source groups 20 can be at least ten. as a group.
此外，在本發明之一實施例中，當至少一光感測元件30為複數時，複數光感測元件30中之至少二者可同時接收同一光源組20所射出之光。以前段內容為例，當光感測元件30之數量為二個且光源組20之組數為一組時，自單一光源組20所發出之光可同時被二個光感測元件30接收以進行感測。In addition, in one embodiment of the present invention, when at least one light sensing element 30 is plural, at least two of the plurality of light sensing elements 30 can receive light emitted by the same light source group 20 at the same time. Taking the previous paragraph as an example, when the number of light sensing elements 30 is two and the number of light source groups 20 is one, the light emitted from a single light source group 20 can be received by two light sensing elements 30 at the same time. Perform sensing.
在本發明之一實施例中，各光感測元件30之長寬比為1:1至1:3。藉由光感測元件30之長寬比之變化，以調整單一光感測元件30可對應之複數光源組20之數量。In one embodiment of the present invention, the aspect ratio of each light sensing element 30 is 1:1 to 1:3. By changing the aspect ratio of the light sensing element 30, the number of the plurality of light source groups 20 that a single light sensing element 30 can correspond to is adjusted.
本發明之感測裝置1在實際使用時，內部元件會驅動複數光源組20執行複數次亮燈程序，每次亮燈程序定義為以單一光源組20為單位，當任一光源組20中之所有半導體光源21依序執行一次亮燈操作後，才跳至下一光源組20執行相同亮燈操作，直到複數光源組20均執行亮燈操作完畢後，即完成該次亮燈程序。此處所述半導體光源21之亮燈操作是指驅動半導體光源21從暗到亮，再由亮到暗，即完成一次亮燈操作。When the sensing device 1 of the present invention is actually used, the internal components will drive the plurality of light source groups 20 to perform a plurality of lighting procedures. Each lighting procedure is defined as a unit of a single light source group 20. When any one of the light source groups 20 After all semiconductor light sources 21 perform a lighting operation in sequence, they jump to the next light source group 20 to perform the same lighting operation. After all light source groups 20 complete the lighting operation, the lighting procedure is completed. The lighting operation of the semiconductor light source 21 described here refers to driving the semiconductor light source 21 from dark to bright, and then from bright to dark, that is, completing a lighting operation.
在本發明之一實施例中，每一半導體光源21之亮燈時間不大於100 ms，且前後二個半導體光源21之亮燈操作之間隔時間不大於1s。藉由亮燈時間之控制，可以減少半導體光源21因亮燈操作產生之熱累積，除了可提升半導體光源21之發光效率外，還可降低能源消耗，達到節省電能源之效果。In one embodiment of the present invention, the lighting time of each semiconductor light source 21 is no more than 100 ms, and the interval between the lighting operations of the two semiconductor light sources 21 before and after is no more than 1 s. By controlling the lighting time, the heat accumulation generated by the lighting operation of the semiconductor light source 21 can be reduced. In addition to improving the luminous efficiency of the semiconductor light source 21, it can also reduce energy consumption and achieve the effect of saving electrical energy.
在本發明之一實施例中，複數光源組20之兩次亮燈程序之間隔時間不小於1秒(s)，且不大於15分鐘(min)。由於兩次亮燈程序之間隔時間代表生理參數之取樣間隔，為了能達到有效監測人體生理狀況，兩次亮燈程序之間隔時間不宜過短或過長，以避免無法達到連續生理參數追蹤的目的。In one embodiment of the present invention, the interval between two lighting procedures of the plurality of light source groups 20 is not less than 1 second (s) and not more than 15 minutes (min). Since the time interval between two lighting procedures represents the sampling interval of physiological parameters, in order to effectively monitor human physiological conditions, the time interval between two lighting procedures should not be too short or too long to avoid failure to achieve the purpose of continuous physiological parameter tracking. .
以下將以不同實施例來說明本發明之感測裝置1之元件配置、驅動時序及應用。請一併參考圖1及圖2，其中圖2為本發明之感測裝置之第一實施例之驅動時序示意圖。如圖1所示，在本實施例中，本發明之感測裝置1於基板10上設置八組光源組20及四個光感測元件30，並且依序以四組光源組20、四個光感測元件30及四組光源組20之排列方式大致平行排成三排，該八組光源組20以四個光感測元件30為中心呈左右對稱。每一光源組20包括二個半導體光源21。每一組光源組20對應一個光感測元件30，使得該光感測元件30接收該光源組20所射出之光。每一光感測元件30對應二組光源組20，該二組光源組20以對應之光感測元件30為中心呈左右對稱，且該二組光源組20之所有半導體光源21之中心與光感測元件30之中心位於同一直線上。每一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距為A，且每一光感測元件30與對應之光源組20中第二接近之半導體光源21之中心間距為2A。The component configuration, driving timing and application of the sensing device 1 of the present invention will be described below with different embodiments. Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic diagram of the driving timing of the first embodiment of the sensing device of the present invention. As shown in FIG. 1 , in this embodiment, the sensing device 1 of the present invention is provided with eight light source groups 20 and four light sensing elements 30 on the substrate 10 , and sequentially uses four light source groups 20 and four light sensing elements 30 . The light sensing elements 30 and the four light source groups 20 are arranged in three rows in a substantially parallel manner. The eight light source groups 20 are left and right symmetrical with the four light sensing elements 30 as the center. Each light source group 20 includes two semiconductor light sources 21 . Each light source group 20 corresponds to a light sensing element 30 , so that the light sensing element 30 receives the light emitted by the light source group 20 . Each light sensing element 30 corresponds to two sets of light source groups 20. The two sets of light source sets 20 are left and right symmetrical with the corresponding light sensing element 30 as the center, and the center of all the semiconductor light sources 21 of the two sets of light source sets 20 is in contact with the light source. The centers of the sensing elements 30 are located on the same straight line. The center distance between each light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is A, and the center distance between each light sensing element 30 and the second closest semiconductor light source 21 in the corresponding light source group 20 is The spacing is 2A.
在圖1及圖2中，為了便於說明，將複數半導體光源21進一步標示為半導體光源(1)至半導體光源(16)，以及將光感測元件30進一步標示為光感測元件(a)至光感測元件(d)。於後的實施例說明中，將以相同的方式表示半導體光源與光感測元件。In FIGS. 1 and 2 , for convenience of explanation, the plurality of semiconductor light sources 21 are further denoted as semiconductor light sources (1) to (16), and the light sensing elements 30 are further denoted as light sensing elements (a) to (1) to (16). Light sensing element (d). In the following description of the embodiments, the semiconductor light source and the light sensing element will be expressed in the same manner.
如圖2所示，在本實施例中，本發明之感測裝置1之驅動時序為：點亮第一個半導體光源21(1)，此時相對應之第一光感測元件30(a)同步收光，並於第一個半導體光源21(1)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)，此時相對應之第一光感測元件30(a)同步收光，並於第二個半導體光源21(2)點亮0.05秒後關閉電源。等待0.5秒後，點亮第三個半導體光源21(3)，此時相對應之第一光感測元件30(a)同步收光，並於第三個半導體光源21(3)點亮0.05秒後關閉電源；…依此類推，直到依序至第十六個半導體光源21(16)執行亮燈操作，此時相對應之第四光感測元件30(d)同步收光，並於第十六個半導體光源21(16)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。As shown in Figure 2, in this embodiment, the driving timing of the sensing device 1 of the present invention is: lighting the first semiconductor light source 21(1), at this time the corresponding first light sensing element 30(a) ) synchronizes the light collection, and turns off the power after the first semiconductor light source 21(1) lights up for 0.05 seconds. After waiting for 0.5 seconds, the second semiconductor light source 21(2) is lit. At this time, the corresponding first light sensing element 30(a) simultaneously receives light and lights up the second semiconductor light source 21(2) for 0.05 seconds. Turn off the power after seconds. After waiting for 0.5 seconds, the third semiconductor light source 21(3) is turned on. At this time, the corresponding first light sensing element 30(a) simultaneously receives light and lights up the third semiconductor light source 21(3) for 0.05 seconds. Turn off the power after seconds; ... and so on, until the sixteenth semiconductor light source 21 (16) performs the lighting operation. At this time, the corresponding fourth light sensing element 30 (d) synchronously receives light, and The sixteenth semiconductor light source 21 (16) lights up for 0.05 seconds and then turns off the power. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures.
藉由本實施例之元件排列及配置，可縮小本發明之感測裝置1之面積，使得本發明之感測裝置1在量測皮膚組織之特性時，不易受到身體之微小動作所影響，得到更準確之訊號；同時，本發明之感測裝置1之光源驅動方式可有效降低熱累積，得到更穩定之訊號，而所使用之光感測元件數量相較於習知技術少，不只達到節省電能源之效果，也可降低成本。Through the arrangement and configuration of the components in this embodiment, the area of the sensing device 1 of the present invention can be reduced, so that the sensing device 1 of the present invention is not easily affected by the small movements of the body when measuring the characteristics of skin tissue, and can obtain better results. Accurate signals; at the same time, the light source driving method of the sensing device 1 of the present invention can effectively reduce heat accumulation and obtain a more stable signal, and the number of light sensing elements used is smaller than that of the conventional technology, which not only saves power The energy effect can also reduce costs.
請一併參考圖3及圖4，其中圖3為本發明之感測裝置之第二實施例之示意圖，圖4為本發明之感測裝置之第二實施例之驅動時序示意圖。如圖3所示，在本實施例中，本發明之感測裝置1a於基板10上設置六組光源組20及四個光感測元件30，並且依序以三組光源組20、四個光感測元件30及三組光源組20之排列方式大致平行排成三排，該六組光源組20以四個光感測元件30為中心呈左右對稱。每一光源組20包括二個半導體光源21。每一組光源組20對應二個光感測元件30，使得該二個光感測元件30可同時接收該光源組20所射出之光。每一光感測元件30對應二組至四組光源組20（例如第一光感測元件30(a)及第四光感測元件30(d)對應二組光源組20，第二光感測元件30(b)及第三光感測元件30(c)對應四組光源組20）。該二組或四組光源組20以對應之光感測元件30為中心呈左右對稱，且該二組或四組光源組20之所有半導體光源21之中心與光感測元件30之中心並非位於同一直線上。每一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距為A，且每一光感測元件30與對應之光源組20中第二接近之半導體光源21之中心間距為2A。Please refer to FIG. 3 and FIG. 4 together. FIG. 3 is a schematic diagram of the second embodiment of the sensing device of the present invention, and FIG. 4 is a schematic diagram of the driving timing of the second embodiment of the sensing device of the present invention. As shown in Figure 3, in this embodiment, the sensing device 1a of the present invention is provided with six light source groups 20 and four light sensing elements 30 on the substrate 10, and sequentially uses three light source groups 20, four light sensing elements 30, and three light source groups 20. The light sensing elements 30 and the three sets of light source groups 20 are arranged in three rows in a substantially parallel manner. The six sets of light source groups 20 are left and right symmetrical with the four light sensing elements 30 as the center. Each light source group 20 includes two semiconductor light sources 21 . Each light source group 20 corresponds to two light sensing elements 30 , so that the two light sensing elements 30 can receive the light emitted by the light source group 20 at the same time. Each light sensing element 30 corresponds to two to four light source groups 20 (for example, the first light sensing element 30(a) and the fourth light sensing element 30(d) correspond to two light source groups 20, and the second light sensing element 30 corresponds to two light source groups 20. The detection element 30(b) and the third light sensing element 30(c) correspond to the four light source groups 20). The two or four light source groups 20 are symmetrical with the corresponding light sensing element 30 as the center, and the center of all the semiconductor light sources 21 of the two or four light source groups 20 and the center of the light sensing element 30 are not located at On the same straight line. The center distance between each light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is A, and the center distance between each light sensing element 30 and the second closest semiconductor light source 21 in the corresponding light source group 20 is The spacing is 2A.
如圖4所示，在本實施例中，本發明之感測裝置1a之驅動時序為：點亮第一個半導體光源21(1)，此時相對應之第一光感測元件30(a)及第二光感測元件30(b)同步收光，並於第一個半導體光源21(1)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)，此時相對應之第一光感測元件30(a)及第二光感測元件30(b)同步收光，並於第二個半導體光源21(2)點亮0.05秒後關閉電源。…點亮第五個半導體光源21(5)，此時相對應之第二光感測元件30(b)及第三光感測元件30(c)同步收光，並於第五個半導體光源21(5)點亮0.05秒後關閉電源；…依此類推，直到依序至第十二個半導體光源21(12)執行亮燈操作，此時相對應之第三光感測元件30(c)及第四光感測元件30(d)同步收光，並於第十二個半導體光源21(12)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。也就是說，在本實施例中，當第一光源組20與第二光源組20亮燈時，對應之第一光感測元件30(a)與第二光感測元件30(b)同步收光；當第三光源組20與第四光源組20亮燈時，對應之第二光感測元件30(b)與第三光感測元件30(c)同步收光；當第五光源組20與第六光源組20亮燈時，對應之第三光感測元件30(c)與第四光感測元件30(d)同步收光。As shown in Figure 4, in this embodiment, the driving sequence of the sensing device 1a of the present invention is: lighting the first semiconductor light source 21(1), at this time the corresponding first light sensing element 30(a ) and the second light sensing element 30(b) simultaneously collect light, and turn off the power 0.05 seconds after the first semiconductor light source 21(1) lights up. After waiting for 0.5 seconds, the second semiconductor light source 21(2) is turned on. At this time, the corresponding first light sensing element 30(a) and the second light sensing element 30(b) receive light simultaneously, and at the The two semiconductor light sources 21(2) light up for 0.05 seconds and then turn off the power. ...lights up the fifth semiconductor light source 21(5). At this time, the corresponding second light sensing element 30(b) and the third light sensing element 30(c) simultaneously collect light and activate the fifth semiconductor light source. 21(5) lights up for 0.05 seconds and then turns off the power; ...and so on, until the twelfth semiconductor light source 21(12) performs the lighting operation, at this time the corresponding third light sensing element 30(c ) and the fourth light sensing element 30(d) simultaneously collect light, and turn off the power 0.05 seconds after the twelfth semiconductor light source 21(12) lights up. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures. That is to say, in this embodiment, when the first light source group 20 and the second light source group 20 turn on, the corresponding first light sensing element 30(a) and the second light sensing element 30(b) are synchronized. Receive light; when the third light source group 20 and the fourth light source group 20 light up, the corresponding second light sensing element 30(b) and the third light sensing element 30(c) simultaneously receive light; when the fifth light source When the group 20 and the sixth light source group 20 turn on, the corresponding third light sensing element 30(c) and the fourth light sensing element 30(d) receive light simultaneously.
在應用上，由於水針對近紅外光（例如波長為1400nm以上的波段）有極強之吸收，一旦光源發出之光大部分被水吸收，就只有少部分之光會經漫反射能被光感測元件30接收，因而使得光訊號偏弱。因此，藉由本實施例之元件排列及配置，在每個半導體光源21亮燈時，能夠以二個光感測元件30同步接收經由皮膚組織漫反射回來之光訊號，進而得到二倍之光訊號，可讓後續之訊號處理更穩定且數據更準確。In terms of application, since water has extremely strong absorption of near-infrared light (such as wavelengths above 1400nm), once most of the light emitted by the light source is absorbed by the water, only a small part of the light will be diffusely reflected and can be sensed. The element 30 receives, thus making the optical signal weak. Therefore, through the element arrangement and configuration of this embodiment, when each semiconductor light source 21 is turned on, the two light sensing elements 30 can simultaneously receive the light signal diffusely reflected back by the skin tissue, thereby obtaining twice the light signal. , which can make subsequent signal processing more stable and data more accurate.
實務上，因為光源之波長不同，其對應之光感測元件也有所不同，例如波長1000nm以下所對應之光感測元件通常為Si晶圓、而波長1000nm以上所對應之光感測元件通常為InGaAs晶圓。因此，本實施例可採用另一種變化型式為：令第一、二、五、六光源組20使用波長為1000nm以下之光源；第三與第四光源組30使用波長為1000nm以上之光源。當第一光源組20與第二光源組20亮燈時，以對應之第一光感測元件30(a)收光；當第三光源組20與第四光源組20亮燈時，以對應之第二光感測元件30(b)與第三光感測元件30(c)同步收光；當第五光源組20與第六光源組20亮燈時，以對應之第四光感測元件30(d)收光。據此，本實施例可同時感測波長為1000nm以下及1000nm以上之光源，且能避免1000nm以上光源被水吸收而造成光訊號偏低之問題。In practice, because the wavelength of the light source is different, the corresponding light sensing elements are also different. For example, the light sensing elements corresponding to wavelengths below 1000nm are usually Si wafers, while the light sensing elements corresponding to wavelengths above 1000nm are usually Si wafers. InGaAs wafer. Therefore, another variation can be adopted in this embodiment: the first, second, fifth, and sixth light source groups 20 use light sources with wavelengths below 1000 nm; the third and fourth light source groups 30 use light sources with wavelengths above 1000 nm. When the first light source group 20 and the second light source group 20 turn on, the corresponding first light sensing element 30(a) collects light; when the third light source group 20 and the fourth light source group 20 turn on, the corresponding The second light sensing element 30(b) and the third light sensing element 30(c) receive light synchronously; when the fifth light source group 20 and the sixth light source group 20 light up, the corresponding fourth light sensing element Element 30(d) collects light. Accordingly, this embodiment can simultaneously sense light sources with wavelengths below 1000 nm and above 1000 nm, and can avoid the problem of low light signals caused by light sources above 1000 nm being absorbed by water.
請一併參考圖5及圖6，其中圖5為本發明之感測裝置之第三實施例之示意圖，圖6為本發明之感測裝置之第三實施例之驅動時序示意圖。如圖5所示，在本實施例中，本發明之感測裝置1b於基板10上設置八組光源組20及二個光感測元件30，並且依序以四組光源組20、二個光感測元件30及四組光源組20之排列方式大致平行排成三排，該八組光源組20以二個光感測元件30為中心呈左右對稱。每一光源組20包括二個半導體光源21。每一組光源組20對應一個光感測元件30，使得該光感測元件30接收該光源組20所射出之光。每一光感測元件30對應四組光源組20，該四組光源組20以對應之光感測元件30為中心呈左右對稱，且該四組光源組20之所有半導體光源21之中心與光感測元件30之中心並非位於同一直線上。每一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距為A，且每一光感測元件30與對應之光源組20中第二接近之半導體光源21之中心間距為2A。Please refer to FIG. 5 and FIG. 6 together. FIG. 5 is a schematic diagram of the third embodiment of the sensing device of the present invention, and FIG. 6 is a schematic diagram of the driving timing of the third embodiment of the sensing device of the present invention. As shown in FIG. 5 , in this embodiment, the sensing device 1 b of the present invention is provided with eight light source groups 20 and two light sensing elements 30 on the substrate 10 , and sequentially uses four light source groups 20 and two light sensing elements 30 . The light sensing elements 30 and the four light source groups 20 are arranged in three rows in approximately parallel manner. The eight light source groups 20 are left and right symmetrical with the two light sensing elements 30 as the center. Each light source group 20 includes two semiconductor light sources 21 . Each light source group 20 corresponds to a light sensing element 30 , so that the light sensing element 30 receives the light emitted by the light source group 20 . Each light sensing element 30 corresponds to four groups of light source groups 20. The four groups of light source groups 20 are left and right symmetrical with the corresponding light sensing element 30 as the center, and the center of all the semiconductor light sources 21 of the four groups of light source groups 20 is directly related to the light source group 20. The centers of the sensing elements 30 are not located on the same straight line. The center distance between each light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is A, and the center distance between each light sensing element 30 and the second closest semiconductor light source 21 in the corresponding light source group 20 is The spacing is 2A.
如圖6所示，在本實施例中，本發明之感測裝置1b之驅動時序為：點亮第一個半導體光源21(1)，此時相對應之第一光感測元件30(a)同步收光，並於第一個半導體光源21(1)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)，此時相對應之第一光感測元件30(a)同步收光，並於第二個半導體光源21(2)點亮0.05秒後關閉電源。…點亮第九個半導體光源21(9)，此時相對應之第二光感測元件30(b)同步收光，並於第九個半導體光源21(9)點亮0.05秒後關閉電源；……依此類推，直到依序至第十六個半導體光源21(16)執行亮燈操作，此時相對應之第二光感測元件30(b)同步收光，並於第十六個半導體光源21(16)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。As shown in Figure 6, in this embodiment, the driving sequence of the sensing device 1b of the present invention is: lighting the first semiconductor light source 21(1), at this time the corresponding first light sensing element 30(a ) synchronizes the light collection, and turns off the power after the first semiconductor light source 21(1) lights up for 0.05 seconds. After waiting for 0.5 seconds, the second semiconductor light source 21(2) is lit. At this time, the corresponding first light sensing element 30(a) simultaneously receives light and lights up the second semiconductor light source 21(2) for 0.05 seconds. Turn off the power after seconds. ...lights up the ninth semiconductor light source 21(9). At this time, the corresponding second light sensing element 30(b) simultaneously collects light, and turns off the power 0.05 seconds after the ninth semiconductor light source 21(9) lights up. ;...and so on, until the sixteenth semiconductor light source 21 (16) performs the lighting operation. At this time, the corresponding second light sensing element 30(b) synchronously collects light, and on the sixteenth Each semiconductor light source 21 (16) lights up for 0.05 seconds and then turns off the power. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures.
由於光感測元件30所接收到之光訊號與面積成正比，因此在本實施例中，藉由使用較大尺寸之光感測元件30，可具有較大之感測面積而得到更強之光訊號，使得每個光感測元件30可接收四組光源組之訊號。然而，在皮膚組織之漫反射架構中，若是光感測元件30之面積過大，反而會接收到更多雜訊光而影響正確之數據判斷，因此，在設計上，光感測元件30之長寬比約介於1:1至1:3之間，但本發明不以此為限。Since the light signal received by the light sensing element 30 is proportional to the area, in this embodiment, by using a larger size light sensing element 30, a larger sensing area can be obtained and a stronger signal can be obtained. The light signal allows each light sensing element 30 to receive signals from four light source groups. However, in the diffuse reflection structure of skin tissue, if the area of the light sensing element 30 is too large, it will receive more noise light and affect the correct data judgment. Therefore, in terms of design, the length of the light sensing element 30 The width ratio is approximately between 1:1 and 1:3, but the present invention is not limited thereto.
請一併參考圖7及圖8，其中圖7為本發明之感測裝置之第四實施例之示意圖，圖8為本發明之感測裝置之第四實施例之驅動時序示意圖。如圖7所示，在本實施例中，本發明之感測裝置1c於基板10上設置四組光源組20及八個光感測元件30，並且依序以四個光感測元件30、四組光源組20及四個光感測元件30之排列方式大致平行排成三排，該八個光感測元件30以四組光源組20為中心呈左右對稱。每一光源組20包括二個半導體光源21。每一組光源組20對應二個光感測元件30，使得該二個光感測元件30可同時接收該光源組20所射出之光。每一光感測元件30對應一組光源組20。該二個光感測元件30以對應之光源組20為中心呈左右對稱，且該光源組20之所有半導體光源21之中心與該二個光感測元件30之中心位於同一直線上。每一光感測元件30與對應之光源組20中最接近之半導體光源21之中心間距為A，且每一光感測元件30與對應之光源組20中第二接近之半導體光源21之中心間距為2A。Please refer to FIG. 7 and FIG. 8 together. FIG. 7 is a schematic diagram of a fourth embodiment of the sensing device of the present invention, and FIG. 8 is a schematic diagram of the driving timing of the fourth embodiment of the sensing device of the present invention. As shown in Figure 7, in this embodiment, the sensing device 1c of the present invention is provided with four light source groups 20 and eight light sensing elements 30 on the substrate 10, and sequentially uses four light sensing elements 30, The four light source groups 20 and the four light sensing elements 30 are arranged in three rows in a substantially parallel manner, and the eight light sensing elements 30 are left and right symmetrical with the four light source groups 20 as the center. Each light source group 20 includes two semiconductor light sources 21 . Each light source group 20 corresponds to two light sensing elements 30 , so that the two light sensing elements 30 can receive the light emitted by the light source group 20 at the same time. Each light sensing element 30 corresponds to a group of light source groups 20 . The two light sensing elements 30 are left-right symmetrical with the corresponding light source group 20 as the center, and the centers of all the semiconductor light sources 21 of the light source group 20 are located on the same straight line as the centers of the two light sensing elements 30 . The center distance between each light sensing element 30 and the closest semiconductor light source 21 in the corresponding light source group 20 is A, and the center distance between each light sensing element 30 and the second closest semiconductor light source 21 in the corresponding light source group 20 is The spacing is 2A.
如圖8所示，在本實施例中，本發明之感測裝置1c之驅動時序為：點亮第一個半導體光源21(1)，此時相對應之第一光感測元件30(a)及第二光感測元件30(b)同步收光，並於第一個半導體光源21(1)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)，此時相對應之第一光感測元件30(a)及第二光感測元件30(b)同步收光，並於第二個半導體光源21(2)點亮0.05秒後關閉電源。點亮第三個半導體光源21(3)，此時相對應之第三光感測元件30(c)及第二光感測元件30(d)同步收光，並於第三個半導體光源21(3)點亮0.05秒後關閉電源。…依此類推，直到依序至第八個半導體光源21(8)執行亮燈操作，此時相對應之第七光感測元件30(g)及第八光感測元件30(h)同步收光，並於第八個半導體光源21(8)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。也就是說，在本實施例中，當第一光源組20亮燈時，對應之第一光感測元件30(a)與第二光感測元件30(b)同步收光；當第二光源組20亮燈時，對應之第三光感測元件30(c)與第四光感測元件30(d)同步收光；當第三光源組20亮燈時，對應之第五光感測元件30(e)與第六光感測元件30(f)同步收光；當第四光源組20亮燈時，對應之第七光感測元件30(g)及第八光感測元件30(h)同步收光。As shown in Figure 8, in this embodiment, the driving timing of the sensing device 1c of the present invention is: lighting the first semiconductor light source 21(1), at this time the corresponding first light sensing element 30(a) ) and the second light sensing element 30(b) simultaneously collect light, and turn off the power 0.05 seconds after the first semiconductor light source 21(1) lights up. After waiting for 0.5 seconds, the second semiconductor light source 21(2) is turned on. At this time, the corresponding first light sensing element 30(a) and the second light sensing element 30(b) receive light simultaneously, and at the The two semiconductor light sources 21(2) light up for 0.05 seconds and then turn off the power. The third semiconductor light source 21(3) is turned on. At this time, the corresponding third light sensing element 30(c) and the second light sensing element 30(d) receive light synchronously, and the third semiconductor light source 21(3) (3) Turn off the power after lighting up for 0.05 seconds. ...and so on, until the eighth semiconductor light source 21(8) sequentially performs the lighting operation. At this time, the corresponding seventh light sensing element 30(g) and eighth light sensing element 30(h) are synchronized. Receive the light, and turn off the power after the eighth semiconductor light source 21(8) lights up for 0.05 seconds. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures. That is to say, in this embodiment, when the first light source group 20 lights up, the corresponding first light sensing element 30(a) and the second light sensing element 30(b) receive light simultaneously; when the second light sensing element 30(b) When the light source group 20 lights up, the corresponding third light sensing element 30(c) and the fourth light sensing element 30(d) receive light simultaneously; when the third light source group 20 lights up, the corresponding fifth light sensor The measuring element 30(e) and the sixth light sensing element 30(f) receive light simultaneously; when the fourth light source group 20 turns on, the corresponding seventh light sensing element 30(g) and the eighth light sensing element 30(h) Synchronous light collection.
藉由本實施例之元件排列及配置，在同一光源組20中之任一半導體光源21亮燈時，可利用相對應之二個光感測元件30同時間分別取得距離A與距離2A之光訊號；而在同一光源組20中之另一半導體光源21亮燈時，可利用相對應之二個光感測元件30同時間分別取得距離2A與距離A之光訊號。因此，依據同一光源組20中之二個半導體光源21分別亮燈時所得到之光訊號，可進行交叉比較與計算，以獲得更準確之數據。Through the element arrangement and configuration of this embodiment, when any semiconductor light source 21 in the same light source group 20 is turned on, the two corresponding light sensing elements 30 can be used to obtain light signals at distance A and distance 2A respectively at the same time. ; When another semiconductor light source 21 in the same light source group 20 turns on, the two corresponding light sensing elements 30 can be used to obtain light signals at the distance 2A and the distance A respectively at the same time. Therefore, based on the light signals obtained when the two semiconductor light sources 21 in the same light source group 20 are respectively turned on, cross comparison and calculation can be performed to obtain more accurate data.
請一併參考圖9及圖10，其中圖9為本發明之感測裝置之第五實施例之示意圖，圖10為本發明之感測裝置之第五實施例之驅動時序示意圖。如圖9所示，在本實施例中，本發明之感測裝置1d於基板10上設置六組光源組20及一個光感測元件30，並且六組光源組20係以光感測元件30為中心呈環狀排列。每一光源組20包括二個半導體光源21。每一組光源組20對應該光感測元件30，使得該光感測元件30接收每一組光源組20所射出之光。每一組光源組20之所有半導體光源21之中心與光感測元件30之中心位於同一直線上。光感測元件30與對應之每一組光源組20中最接近之半導體光源21之中心間距為A，且光感測元件30與對應之每一組光源組20中第二接近之半導體光源21之中心間距為2A。Please refer to FIG. 9 and FIG. 10 together. FIG. 9 is a schematic diagram of the fifth embodiment of the sensing device of the present invention, and FIG. 10 is a schematic diagram of the driving timing of the fifth embodiment of the sensing device of the present invention. As shown in FIG. 9 , in this embodiment, the sensing device 1d of the present invention is provided with six light source groups 20 and one light sensing element 30 on the substrate 10 , and the six light source groups 20 are based on the light sensing element 30 Arranged in a ring with the center. Each light source group 20 includes two semiconductor light sources 21 . Each light source group 20 corresponds to the light sensing element 30 , so that the light sensing element 30 receives the light emitted by each light source group 20 . The center of all the semiconductor light sources 21 of each light source group 20 and the center of the light sensing element 30 are located on the same straight line. The center distance between the light sensing element 30 and the closest semiconductor light source 21 in each corresponding light source group 20 is A, and the light sensing element 30 and the second closest semiconductor light source 21 in each corresponding light source group 20 are The center distance is 2A.
如圖10所示，在本實施例中，本發明之感測裝置1d之驅動時序為：點亮第一個半導體光源21(1)，此時光感測元件30同步收光，並於第一個半導體光源21(1)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)，此時光感測元件30同步收光，並於第二個半導體光源21(2)點亮0.05秒後關閉電源。…依此類推，直到依序至第十二個半導體光源21(12)執行亮燈操作，此時光感測元件30同步收光，並於第十二個半導體光源21(12)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。也就是說，在本實施例中，只使用一個光感測元件30負責收光，藉由十二個半導體光源21依序執行亮燈操作，使得光感測元件30依序收光，最後分別得到十二個半導體光源21所產生之光訊號。As shown in Figure 10, in this embodiment, the driving sequence of the sensing device 1d of the present invention is: lighting the first semiconductor light source 21(1), at this time the light sensing element 30 collects light synchronously, and at the first Each semiconductor light source 21(1) lights up for 0.05 seconds and then turns off the power. After waiting for 0.5 seconds, the second semiconductor light source 21(2) is turned on. At this time, the light sensing element 30 receives light synchronously, and the power is turned off 0.05 seconds after the second semiconductor light source 21(2) is turned on. ...and so on, until the twelfth semiconductor light source 21 (12) performs the lighting operation. At this time, the light sensing element 30 simultaneously receives light and lights up for 0.05 seconds after the twelfth semiconductor light source 21 (12) Then turn off the power. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures. That is to say, in this embodiment, only one light sensing element 30 is used to collect light, and the twelve semiconductor light sources 21 sequentially perform lighting operations, so that the light sensing element 30 collects light sequentially, and finally respectively The light signals generated by the twelve semiconductor light sources 21 are obtained.
在本實施例中，可依需求改變本發明之感測裝置1d之光源組20亮燈及光感測元件30收光之時序，藉以不同感測效果。如圖11所示，舉例來說，本發明之感測裝置1d之驅動時序可變化為：同時點亮第一個半導體光源21(1)及第七個半導體光源21(7)，此時光感測元件30同步收光，並於第一個半導體光源21(1)及第七個半導體光源21(7)點亮0.05秒後關閉電源。等待0.5秒後，點亮第二個半導體光源21(2)及第八個半導體光源21(8)，此時光感測元件30同步收光，並於第二個半導體光源21(2)及第八個半導體光源21(8)點亮0.05秒後關閉電源。…依此類推，直到依序至第六個半導體光源21(6)及第十二個半導體光源21(12)執行亮燈操作，此時光感測元件30同步收光，並於第六個半導體光源21(6)及第十二個半導體光源21(12)點亮0.05秒後關閉電源。最後，等待12秒後，再進行下一輪之亮燈程序。藉由同時點亮二個半導體光源21，光感測元件30可以得到兩倍之光訊號，如此一來，可讓後續之訊號處理更穩定，且數據更準確。In this embodiment, the timing of the light source group 20 of the sensing device 1d of the present invention turning on and the light sensing element 30 receiving light can be changed according to the needs, so as to achieve different sensing effects. As shown in Figure 11, for example, the driving timing of the sensing device 1d of the present invention can be changed to: light up the first semiconductor light source 21(1) and the seventh semiconductor light source 21(7) at the same time. At this time, the light sensor The measuring element 30 receives light synchronously, and turns off the power supply 0.05 seconds after the first semiconductor light source 21(1) and the seventh semiconductor light source 21(7) light up. After waiting for 0.5 seconds, the second semiconductor light source 21(2) and the eighth semiconductor light source 21(8) are turned on. At this time, the light sensing element 30 simultaneously collects light and switches on the second semiconductor light source 21(2) and the eighth semiconductor light source 21(8). The eight semiconductor light sources 21(8) light up for 0.05 seconds and then turn off the power. ...and so on, until the sixth semiconductor light source 21(6) and the twelfth semiconductor light source 21(12) perform the lighting operation. At this time, the light sensing element 30 synchronously collects light and switches on the sixth semiconductor light source 21(6). The light source 21(6) and the twelfth semiconductor light source 21(12) light up for 0.05 seconds and then turn off the power. Finally, wait for 12 seconds before proceeding with the next round of lighting procedures. By lighting up the two semiconductor light sources 21 at the same time, the light sensing element 30 can obtain twice the light signal, which makes subsequent signal processing more stable and the data more accurate.
綜上所述，本發明之感測裝置可依序點亮光源以照射皮膚表面，並由相對應之光感測元件接收經皮膚組織漫反射傳遞回來之光訊號。在設計上採用複數光源組，且光感測元件與相應之光源組之所有半導體光源之中心距離呈等差排列，因此可依據自不同距離之半導體光源所得到之光訊號強度推算出雜訊比例，進而得到準確之訊號。此外，藉由控制光源組之亮燈時間與間隔時間能避免光源之熱累積，降低對光感測元件之靈敏度影響，To sum up, the sensing device of the present invention can sequentially light up the light source to illuminate the skin surface, and the corresponding light sensing element receives the light signal transmitted back through diffuse reflection by the skin tissue. A plurality of light source groups are used in the design, and the center distances between the light sensing elements and all the semiconductor light sources of the corresponding light source group are arranged equally. Therefore, the noise ratio can be calculated based on the light signal intensity obtained from the semiconductor light sources at different distances. , and then get accurate signals. In addition, by controlling the lighting time and interval of the light source group, heat accumulation of the light source can be avoided and the impact on the sensitivity of the light sensing element can be reduced.
以上實施方式本質上僅為輔助說明，且並不欲用以限制申請標的之實施例或該等實施例的應用或用途。此外，儘管已於前述實施方式中提出至少一例示性實施例，但應瞭解本發明仍可存在大量的變化。同樣應瞭解的是，本文所述之實施例並不欲用以透過任何方式限制所請求之申請標的之範圍、用途或組態。相反的，前述實施方式將可提供本領域具有通常知識者一種簡便的指引以實施所述之一或多種實施例。再者，可對元件之功能與排列進行各種變化而不脫離申請專利範圍所界定的範疇，且申請專利範圍包含已知的均等物及在本專利申請案提出申請時的所有可預見均等物。The above embodiments are merely auxiliary explanations in nature and are not intended to limit the embodiments of the subject matter of the application or the applications or uses of these embodiments. Furthermore, although at least one exemplary embodiment has been set forth in the foregoing embodiments, it should be understood that numerous variations are possible in the present invention. It should also be understood that the embodiments described herein are not intended to limit in any way the scope, uses, or configurations of the claimed subject matter. Rather, the foregoing description will provide those skilled in the art with a convenient guide for implementing one or more of the described embodiments. Furthermore, various changes can be made in the function and arrangement of the components without departing from the scope defined by the patent application, and the patent application scope includes known equivalents and all foreseeable equivalents at the time this patent application is filed.
1、1a、1b、1c、1d:感測裝置1, 1a, 1b, 1c, 1d: sensing device
10:基板10:Substrate
20:光源組20:Light source group
21:半導體光源21:Semiconductor light source
30:光感測元件30:Light sensing element
A:中心間距A: Center distance
圖1為本發明之感測裝置之第一實施例之示意圖。 圖2為本發明之感測裝置之第一實施例之驅動時序示意圖。 圖3為本發明之感測裝置之第二實施例之示意圖。 圖4為本發明之感測裝置之第二實施例之驅動時序示意圖。 圖5為本發明之感測裝置之第三實施例之示意圖。 圖6為本發明之感測裝置之第三實施例之驅動時序示意圖。 圖7為本發明之感測裝置之第四實施例之示意圖。 圖8為本發明之感測裝置之第四實施例之驅動時序示意圖。 圖9為本發明之感測裝置之第五實施例之示意圖。 圖10為本發明之感測裝置之第五實施例之驅動時序示意圖。 圖11為本發明之感測裝置之第五實施例之另一驅動時序示意圖。 Figure 1 is a schematic diagram of the first embodiment of the sensing device of the present invention. FIG. 2 is a schematic diagram of the driving timing of the first embodiment of the sensing device of the present invention. FIG. 3 is a schematic diagram of the second embodiment of the sensing device of the present invention. FIG. 4 is a schematic diagram of the driving timing of the second embodiment of the sensing device of the present invention. FIG. 5 is a schematic diagram of a third embodiment of the sensing device of the present invention. FIG. 6 is a schematic diagram of the driving timing of the third embodiment of the sensing device of the present invention. FIG. 7 is a schematic diagram of the fourth embodiment of the sensing device of the present invention. FIG. 8 is a schematic diagram of the driving timing of the fourth embodiment of the sensing device of the present invention. FIG. 9 is a schematic diagram of the fifth embodiment of the sensing device of the present invention. FIG. 10 is a schematic diagram of the driving timing of the fifth embodiment of the sensing device of the present invention. FIG. 11 is another driving timing diagram of the fifth embodiment of the sensing device of the present invention.
1:感測裝置 1: Sensing device
10:基板 10:Substrate
20:光源組 20:Light source group
21:半導體光源 21:Semiconductor light source
30:光感測元件 30:Light sensing element
A:中心間距 A: Center distance
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| TW201526868A (en) * | 2013-12-09 | 2015-07-16 | Samsung Electronics Co Ltd | Modular sensor platform |
| TW201726060A (en) * | 2015-12-30 | 2017-08-01 | 曜諦測氧股份有限公司 | System, device and method for performing transabdominal fetal oxygen saturation and/or transabdominal fetal pulse oximetry monitoring |
| CN110868920A (en) * | 2017-03-29 | 2020-03-06 | 格拉夫特沃克斯公司 | Wearable device with multimodal diagnostics |
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| TW201526868A (en) * | 2013-12-09 | 2015-07-16 | Samsung Electronics Co Ltd | Modular sensor platform |
| TW201726060A (en) * | 2015-12-30 | 2017-08-01 | 曜諦測氧股份有限公司 | System, device and method for performing transabdominal fetal oxygen saturation and/or transabdominal fetal pulse oximetry monitoring |
| CN110868920A (en) * | 2017-03-29 | 2020-03-06 | 格拉夫特沃克斯公司 | Wearable device with multimodal diagnostics |
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