TWI814313B - Flexible Heat Dissipating Metal Plate - Google Patents
Flexible Heat Dissipating Metal Plate Download PDFInfo
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- TWI814313B TWI814313B TW111111851A TW111111851A TWI814313B TW I814313 B TWI814313 B TW I814313B TW 111111851 A TW111111851 A TW 111111851A TW 111111851 A TW111111851 A TW 111111851A TW I814313 B TWI814313 B TW I814313B
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- metal plate
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- flexible heat
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 239000002952 polymeric resin Substances 0.000 claims abstract description 28
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000011852 carbon nanoparticle Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 5
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 5
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 5
- 239000005011 phenolic resin Substances 0.000 claims abstract description 5
- 239000004814 polyurethane Substances 0.000 claims abstract description 5
- 229920002635 polyurethane Polymers 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 48
- 239000011241 protective layer Substances 0.000 claims description 12
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical group [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000003973 paint Substances 0.000 abstract description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical class O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/20—Metallic substrate based on light metals
- B05D2202/25—Metallic substrate based on light metals based on Al
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2502/00—Acrylic polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2503/00—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2504/00—Epoxy polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2518/00—Other type of polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一種可撓性散熱金屬板，包含一金屬基板、一形成在該金屬基板上的底漆層及一形成在該底漆層上的油墨層。該底漆層的材料包括第一聚合物樹脂，該第一聚合物樹脂為環氧樹脂。該油墨層的材料包括第二聚合物樹脂及多個分散在該第二聚合物樹脂中的碳奈米顆粒。該第二聚合物樹脂是選自於環氧樹脂、聚氨酯、熱固性丙烯酸樹脂或酚醛樹脂。該可撓性散熱金屬板在後續加工過程中不會因為彎折產生裂縫或掉漆，進而減損其散熱功能，適合透過後續加工成型作為電子產品的外殼，可降低製程的作業成本。A flexible heat-dissipating metal plate includes a metal substrate, a primer layer formed on the metal substrate, and an ink layer formed on the primer layer. The material of the primer layer includes a first polymer resin, and the first polymer resin is an epoxy resin. The material of the ink layer includes a second polymer resin and a plurality of carbon nanoparticles dispersed in the second polymer resin. The second polymer resin is selected from epoxy resin, polyurethane, thermosetting acrylic resin or phenolic resin. The flexible heat dissipation metal plate will not cause cracks or paint peeling due to bending during subsequent processing, thereby reducing its heat dissipation function. It is suitable for subsequent processing and molding as the casing of electronic products, which can reduce the operating cost of the manufacturing process.
Description
本發明是有關於一種金屬板，特別是指一種可撓性散熱金屬板。The present invention relates to a metal plate, in particular to a flexible heat dissipation metal plate.
電子產品(例如：硬碟)普遍是朝向體積減小及運算速度加快的趨勢發展，因此電子產品的過熱問題也漸趨嚴重。Electronic products (such as hard drives) are generally developing towards smaller sizes and faster computing speeds, so the overheating problem of electronic products is becoming increasingly serious.
參閱圖1，一種現有散熱金屬板1包含一金屬基板11及一形成在該金屬基板11上的油墨層12。該油墨層12的材料包括聚合物樹脂及多個分散在該聚合物樹脂中的碳奈米顆粒121。上述散熱金屬板1可作為電子產品的外殼，藉由該油墨層12有助於該金屬基板11將電子產品的熱量傳遞至外界環境，以降低過熱問題。Referring to FIG. 1 , a conventional heat dissipation metal plate 1 includes a metal substrate 11 and an ink layer 12 formed on the metal substrate 11 . The ink layer 12 is made of a polymer resin and a plurality of carbon nanoparticles 121 dispersed in the polymer resin. The above-mentioned heat dissipation metal plate 1 can be used as a casing of an electronic product. The ink layer 12 helps the metal substrate 11 transfer the heat of the electronic product to the external environment to reduce overheating problems.
然而，上述散熱金屬板1一般是先將該金屬基板11沖壓或彎折成型，隨後經過清洗及防鏽處理，再利用噴塗或電鍍使該油墨層12形成在該金屬基板11上而得，需要耗費較高的作業成本，且噴塗或電鍍容易產生嚴重的環境汙染。However, the above-mentioned heat dissipation metal plate 1 is generally obtained by stamping or bending the metal substrate 11 first, then cleaning and anti-rust treatment, and then using spraying or electroplating to form the ink layer 12 on the metal substrate 11. This requires It consumes high operating costs, and spraying or electroplating can easily cause serious environmental pollution.
因此，本發明之目的，即在提供一種可撓性散熱金屬板，可以克服上述先前技術的缺點。Therefore, the object of the present invention is to provide a flexible heat-dissipating metal plate that can overcome the above-mentioned shortcomings of the prior art.
於是，本發明可撓性散熱金屬板包含一金屬基板、一形成在該金屬基板上的底漆層及一形成在該底漆層上的油墨層。該底漆層的材料包括第一聚合物樹脂，該第一聚合物樹脂為環氧樹脂。該油墨層的材料包括第二聚合物樹脂及多個分散在該第二聚合物樹脂中的碳奈米顆粒。該第二聚合物樹脂是選自於環氧樹脂、聚氨酯、熱固性丙烯酸樹脂或酚醛樹脂。Therefore, the flexible heat dissipation metal plate of the present invention includes a metal substrate, a primer layer formed on the metal substrate, and an ink layer formed on the primer layer. The material of the primer layer includes a first polymer resin, and the first polymer resin is an epoxy resin. The material of the ink layer includes a second polymer resin and a plurality of carbon nanoparticles dispersed in the second polymer resin. The second polymer resin is selected from epoxy resin, polyurethane, thermosetting acrylic resin or phenolic resin.
本發明之功效在於：該可撓性散熱金屬板在後續加工過程中不會因為彎折產生裂縫或掉漆，進而減損其散熱功能，適合透過後續加工成型作為電子產品的外殼，可降低製程的作業成本及汙染。The effect of the present invention is that the flexible heat dissipation metal plate will not cause cracks or paint peeling due to bending during subsequent processing, thereby reducing its heat dissipation function. It is suitable for subsequent processing and molding as the casing of electronic products, which can reduce the cost of the manufacturing process. Operating costs and pollution.
以下將就本發明內容進行詳細說明：The content of the present invention will be described in detail below:
較佳地，本發明可撓性散熱金屬板還包含一形成在該油墨層上的保護層。該保護層的材料包括第三聚合物樹脂。該第三聚合物樹脂是選自於環氧樹脂、聚氨酯、熱固性丙烯酸樹脂或酚醛樹脂。Preferably, the flexible heat-dissipating metal plate of the present invention further includes a protective layer formed on the ink layer. The material of the protective layer includes a third polymer resin. The third polymer resin is selected from epoxy resin, polyurethane, thermosetting acrylic resin or phenolic resin.
較佳地，該環氧樹脂是選自於雙酚A二縮水甘油醚(bisphenol-A diglycidyl ether)、聚酯環氧樹脂(polyester epoxy resin)、環氧壓克力樹脂(acrylic epoxy resin)、聚碳酸酯環氧樹脂(polycarbonate epoxy resin)或其組合。Preferably, the epoxy resin is selected from bisphenol-A diglycidyl ether, polyester epoxy resin, acrylic epoxy resin, Polycarbonate epoxy resin or combinations thereof.
較佳地，該碳奈米顆粒是選自於碳黑、棒富碳(jumbo fullerene)或其組合。Preferably, the carbon nanoparticles are selected from carbon black, jumbo fullerene or combinations thereof.
較佳地，以該油墨層的總重為100 wt%，該碳奈米顆粒的含量範圍為0.1~30 wt%。Preferably, when the total weight of the ink layer is 100 wt%, the content of the carbon nanoparticles ranges from 0.1 to 30 wt%.
較佳地，該金屬基板的材料是選自於鋁、銅、鋅、鐵或其與其他元素結合而成的合金。Preferably, the material of the metal substrate is selected from aluminum, copper, zinc, iron or alloys thereof combined with other elements.
較佳地，該底漆層的厚度範圍為1~20 μm。Preferably, the thickness of the primer layer ranges from 1 to 20 μm.
較佳地，該油墨層的厚度範圍為1~100 μm。Preferably, the thickness of the ink layer ranges from 1 to 100 μm.
更佳地，該保護層的厚度範圍為1~20 μm。More preferably, the thickness of the protective layer ranges from 1 to 20 μm.
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated with the same numbering.
本發明將就以下實施例來作進一步說明，但應瞭解的是，該實施例僅為例示說明之用，而不應被解釋為本發明實施之限制。The present invention will be further described with reference to the following embodiments, but it should be understood that these embodiments are only for illustrative purposes and should not be construed as limitations on the implementation of the present invention.
〈比較例〉<Comparative example>
參閱圖1，比較例的散熱金屬板1包含一金屬基板11及一形成在該金屬基板11上的油墨層12。Referring to FIG. 1 , the heat dissipation metal plate 1 of the comparative example includes a metal substrate 11 and an ink layer 12 formed on the metal substrate 11 .
在本比較例中，該金屬基板11是鋁基板。In this comparative example, the metal substrate 11 is an aluminum substrate.
該油墨層12的材料包括聚合物樹脂及多個分散在該聚合物樹脂中的碳奈米顆粒121。在本比較例中，該油墨層12是將含有雙酚A二縮水甘油醚、乙二醇丁醚、甲基化三聚氰胺甲醛樹脂、顏料、碳黑、棒富碳及有機溶劑的散熱組成物(固含量為40±3%)與稀釋劑(二甲苯、異丙醇與乙酸正丁酯的混合物)以10：3的重量比混合，攪拌均勻後，印刷塗布在該鋁基板上，並置於180℃烘箱中烘乾10 min而得。在本比較例中，該油墨層12的厚度約為8 μm。在本比較例中，以該油墨層12的總重為100 wt%，該碳黑及棒富碳的總含量為15 wt%。The ink layer 12 is made of a polymer resin and a plurality of carbon nanoparticles 121 dispersed in the polymer resin. In this comparative example, the ink layer 12 is a heat dissipation composition ( The solid content is 40±3%) and the diluent (a mixture of xylene, isopropyl alcohol and n-butyl acetate) are mixed at a weight ratio of 10:3. After stirring evenly, print and coat on the aluminum substrate and place it at 180 Dried in oven for 10 minutes. In this comparative example, the thickness of the ink layer 12 is about 8 μm. In this comparative example, assuming that the total weight of the ink layer 12 is 100 wt%, the total content of the carbon black and rod-rich carbon is 15 wt%.
〈實施例〉<Example>
參閱圖2，本發明可撓性散熱金屬板2之一實施例包含一金屬基板21、一形成在該金屬基板21上的底漆層22、一形成在該底漆層22上的油墨層23及一形成在該油墨層23上的保護層24。Referring to Figure 2, one embodiment of the flexible heat dissipation metal plate 2 of the present invention includes a metal substrate 21, a primer layer 22 formed on the metal substrate 21, and an ink layer 23 formed on the primer layer 22. and a protective layer 24 formed on the ink layer 23.
在本實施例中，該金屬基板21是鋁基板。In this embodiment, the metal substrate 21 is an aluminum substrate.
該底漆層22的材料包括第一聚合物樹脂，該第一聚合物樹脂為環氧樹脂。在本實施例中，該底漆層22是將含有雙酚A二縮水甘油醚、乙二醇丁醚、甲基化三聚氰胺甲醛樹脂、顏料及有機溶劑的底漆組成物(固含量為33±3%)與稀釋劑(二甲苯、異丙醇與乙酸正丁酯的混合物)以10：3的重量比混合，攪拌均勻後，印刷塗布在該鋁基板上，並置於180℃烘箱中烘乾10 min而得。在本實施例中，該底漆層22的厚度約為4 μm。The material of the primer layer 22 includes a first polymer resin, and the first polymer resin is an epoxy resin. In this embodiment, the primer layer 22 is a primer composition containing bisphenol A diglycidyl ether, ethylene glycol butyl ether, methylated melamine formaldehyde resin, pigments and organic solvents (solid content is 33 ± 3%) and diluent (a mixture of xylene, isopropyl alcohol and n-butyl acetate) at a weight ratio of 10:3. After stirring evenly, print and coat on the aluminum substrate and place it in an oven at 180°C to dry. 10 minutes. In this embodiment, the thickness of the primer layer 22 is approximately 4 μm.
該油墨層23的材料包括第二聚合物樹脂及多個分散在該第二聚合物樹脂中的碳奈米顆粒231。在本實施例中，該油墨層23是將含有雙酚A二縮水甘油醚、乙二醇丁醚、甲基化三聚氰胺甲醛樹脂、顏料、碳黑、棒富碳及有機溶劑的散熱組成物(固含量為40±3%)與稀釋劑(二甲苯、異丙醇與乙酸正丁酯的混合物)以10：3的重量比混合，攪拌均勻後，印刷塗布在該底漆層22上，並置於180℃烘箱中烘乾10 min而得。在本實施例中，該油墨層23的厚度約為8 μm。在本實施例中，以該油墨層23的總重為100 wt%，該碳黑及棒富碳的總含量為15 wt%。The material of the ink layer 23 includes a second polymer resin and a plurality of carbon nanoparticles 231 dispersed in the second polymer resin. In this embodiment, the ink layer 23 is a heat dissipation composition ( The solid content is 40 ± 3%) and the diluent (a mixture of xylene, isopropyl alcohol and n-butyl acetate) are mixed at a weight ratio of 10:3. After stirring evenly, the primer layer 22 is printed and coated, and placed Obtained by drying in an oven at 180°C for 10 minutes. In this embodiment, the thickness of the ink layer 23 is about 8 μm. In this embodiment, the total weight of the ink layer 23 is 100 wt%, and the total content of the carbon black and rod carbon is 15 wt%.
該保護層24的材料包括第三聚合物樹脂。在本實施例中，該保護層24是將含有雙酚A二縮水甘油醚、乙二醇丁醚、甲基化三聚氰胺甲醛樹脂、顏料及有機溶劑的保護組成物(固含量為36±3%)與稀釋劑(二甲苯、異丙醇與乙酸正丁酯的混合物)以10：3的重量比混合，攪拌均勻後，印刷塗布在該鋁基板上，並置於180℃烘箱中烘乾10 min而得。在本實施例中，該保護層24的厚度約為4 μm。The protective layer 24 is made of a third polymer resin. In this embodiment, the protective layer 24 is a protective composition containing bisphenol A diglycidyl ether, ethylene glycol butyl ether, methylated melamine formaldehyde resin, pigments and organic solvents (solid content is 36±3% ) and diluent (a mixture of xylene, isopropyl alcohol and n-butyl acetate) at a weight ratio of 10:3. After stirring evenly, print and coat on the aluminum substrate, and place it in an oven at 180°C to dry for 10 minutes. And get. In this embodiment, the thickness of the protective layer 24 is approximately 4 μm.
[[ 可撓性測試Flexibility test ]]
分別利用沖壓機將上述比較例的散熱金屬板1及上述實施例的可撓性散熱金屬板2彎曲對折至呈約180度的夾角，結果分別如圖3及圖4所示。The heat dissipation metal plate 1 of the above comparative example and the flexible heat dissipation metal plate 2 of the above embodiment are bent and folded in half using a punching machine to form an included angle of approximately 180 degrees. The results are shown in Figures 3 and 4 respectively.
由圖3及圖4可以看出，比較例的散熱金屬板1經彎曲對折至呈約180度的夾角後，其油墨層12在夾角外側的彎折處產生相當明顯的裂縫及剝離(如圖3所示)；而實施例的可撓性散熱金屬板2經彎曲對折至呈約180度的夾角後，其油墨層23在夾角外側的彎折處沒有任何肉眼可見的裂縫或剝離(如圖4所示)，顯示本發明實施例的可撓性散熱金屬板2可耐彎折，其散熱功能不會因為彎折而有所減損。It can be seen from Figures 3 and 4 that after the heat dissipation metal plate 1 of the comparative example was bent in half to form an included angle of about 180 degrees, the ink layer 12 produced quite obvious cracks and peeling at the bend outside the included angle (as shown in the figure 3); and after the flexible heat dissipation metal plate 2 of the embodiment is bent and folded to an included angle of about 180 degrees, the ink layer 23 does not have any visible cracks or peeling at the bend outside the included angle (as shown in the figure) 4), it shows that the flexible heat dissipation metal plate 2 according to the embodiment of the present invention can withstand bending, and its heat dissipation function will not be reduced due to bending.
綜上所述，本發明可撓性散熱金屬板2藉由該底漆層22及該油墨層23的配置，在後續加工過程中不會因為彎折產生裂縫或掉漆，進而減損其散熱功能，適合透過後續加工成型作為電子產品的外殼，可降低製程的作業成本及汙染，故確實能達成本發明之目的。In summary, the flexible heat dissipation metal plate 2 of the present invention, through the configuration of the primer layer 22 and the ink layer 23, will not cause cracks or paint peeling due to bending during subsequent processing, thereby impairing its heat dissipation function. , suitable for subsequent processing and molding as the casing of electronic products, which can reduce the operating cost and pollution of the manufacturing process, so the purpose of the present invention can indeed be achieved.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of this invention.
1:散熱金屬板 11:金屬基板 12:油墨層 121:碳奈米顆粒 2:可撓性散熱金屬板 21:金屬基板 22:底漆層 23:油墨層 231:碳奈米顆粒 24:保護層 1:Heating metal plate 11:Metal substrate 12: Ink layer 121:Carbon nanoparticles 2: Flexible heat dissipation metal plate 21:Metal substrate 22: Primer layer 23: Ink layer 231:Carbon nanoparticles 24:Protective layer
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： ［圖1］是現有散熱金屬板的不完整的剖視示意圖； ［圖2］是本發明可撓性散熱金屬板的一實施例的不完整的剖視示意圖； ［圖3］是一比較例的散熱金屬板經彎折後的照片；及 ［圖4］是該實施例的可撓性散熱金屬板經彎折後的照片。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: [Figure 1] is an incomplete cross-sectional schematic diagram of an existing heat dissipation metal plate; [Figure 2] is an incomplete cross-sectional schematic diagram of an embodiment of the flexible heat dissipation metal plate of the present invention; [Figure 3] is a photo of a comparative example of a heat dissipation metal plate after being bent; and [Figure 4] is a photo of the flexible heat dissipation metal plate of this embodiment after being bent.
2:可撓性散熱金屬板 2: Flexible heat dissipation metal plate
21:金屬基板 21:Metal substrate
22:底漆層 22: Primer layer
23:油墨層 23: Ink layer
231:碳奈米顆粒 231:Carbon nanoparticles
24:保護層 24:Protective layer
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| TW111111851A TWI814313B (en) | 2022-03-29 | 2022-03-29 | Flexible Heat Dissipating Metal Plate |
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| US20130008697A1 (en) * | 2010-03-23 | 2013-01-10 | Lintec Corporation | Irregular-surface forming method using plasma-etching process, and electrode member |
| CN105339166A (en) * | 2013-05-31 | 2016-02-17 | 住友电气工业株式会社 | Metal-resin composite body, wiring material, and method for producing metal-resin composite body |
| TW202028325A (en) * | 2018-10-16 | 2020-08-01 | 日商三菱化學股份有限公司 | Liquid composition, resin composite, liquid sealing material, sealing material, and electronic device |
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| CN102711421B (en) * | 2012-06-28 | 2015-08-19 | 东莞市群跃电子材料科技有限公司 | Shielding heat dissipation material |
| KR101403752B1 (en) * | 2012-11-16 | 2014-06-03 | 주식회사 포스코 | Black resin coating steel sheet with heat-spreading ability |
| US11104108B2 (en) * | 2015-04-08 | 2021-08-31 | Amogreentech Co., Ltd. | Heat dissipating coating composition and heat dissipating unit formed using same |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
| CN110062567B (en) * | 2019-05-14 | 2023-12-15 | 士彩材料科技（苏州）有限公司 | Heat conduction and heat dissipation structure with high heat conduction efficiency |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130008697A1 (en) * | 2010-03-23 | 2013-01-10 | Lintec Corporation | Irregular-surface forming method using plasma-etching process, and electrode member |
| CN105339166A (en) * | 2013-05-31 | 2016-02-17 | 住友电气工业株式会社 | Metal-resin composite body, wiring material, and method for producing metal-resin composite body |
| TW202028325A (en) * | 2018-10-16 | 2020-08-01 | 日商三菱化學股份有限公司 | Liquid composition, resin composite, liquid sealing material, sealing material, and electronic device |
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