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TWI800623B - 液處理裝置及液處理方法 - Google Patents

液處理裝置及液處理方法 Download PDF

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Publication number
TWI800623B
TWI800623B TW108109208A TW108109208A TWI800623B TW I800623 B TWI800623 B TW I800623B TW 108109208 A TW108109208 A TW 108109208A TW 108109208 A TW108109208 A TW 108109208A TW I800623 B TWI800623 B TW I800623B
Authority
TW
Taiwan
Prior art keywords
liquid processing
processing device
processing method
liquid
processing
Prior art date
Application number
TW108109208A
Other languages
English (en)
Other versions
TW201941263A (zh
Inventor
井手裕幸
志手英男
吉原孝介
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201941263A publication Critical patent/TW201941263A/zh
Application granted granted Critical
Publication of TWI800623B publication Critical patent/TWI800623B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW108109208A 2018-03-23 2019-03-19 液處理裝置及液處理方法 TWI800623B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-056684 2018-03-23
JP2018056684 2018-03-23

Publications (2)

Publication Number Publication Date
TW201941263A TW201941263A (zh) 2019-10-16
TWI800623B true TWI800623B (zh) 2023-05-01

Family

ID=67987291

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109208A TWI800623B (zh) 2018-03-23 2019-03-19 液處理裝置及液處理方法

Country Status (6)

Country Link
US (1) US11465168B2 (zh)
JP (1) JP7107362B2 (zh)
KR (1) KR102723944B1 (zh)
CN (1) CN111868882B (zh)
TW (1) TWI800623B (zh)
WO (1) WO2019182036A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210132637A1 (en) * 2019-11-04 2021-05-06 Tokyo Electron Limited Methods and systems to monitor, control, and synchronize dispense systems
KR20230025614A (ko) * 2021-08-13 2023-02-22 주식회사 제우스 기판처리방법
KR20230051888A (ko) * 2021-10-12 2023-04-19 삼성전자주식회사 감광액 공급 시스템 및 이를 이용한 반도체 장치의 제조 방법
CN114975183B (zh) * 2022-05-31 2025-09-16 北京北方华创微电子装备有限公司 半导体工艺设备的补水控制方法和半导体工艺设备
KR20240102710A (ko) * 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치
KR102774335B1 (ko) * 2023-04-13 2025-02-27 (주)에스티아이 액 공급 장치 및 이를 이용한 액 공급 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063121A1 (en) * 2000-05-01 2002-05-30 Shori Mokuo Heating device, liquid processing apparatus using the heating device and method of detecting failure thereof
TW201005076A (en) * 2008-07-31 2010-02-01 Nihon Valqua Kogyo Kk Process for regenerating a phosphoric acid-containing treatment liquid
TW201526076A (zh) * 2013-11-01 2015-07-01 Tokyo Electron Ltd 處理液供給裝置及處理液供給方法
TWM514103U (zh) * 2014-01-20 2015-12-11 Tokyo Electron Ltd 處理液供給配管迴路
TW201807512A (zh) * 2016-04-28 2018-03-01 富士軟片股份有限公司 處理液及處理液收容體

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3668959B2 (ja) * 1998-07-14 2005-07-06 独立行政法人理化学研究所 微量液体制御機構
JP2005230691A (ja) * 2004-02-19 2005-09-02 Renesas Technology Corp 処理液吐出装置、半導体製造装置および半導体装置の製造方法
JP2007222703A (ja) * 2006-02-21 2007-09-06 Seiko Epson Corp レンズのスピンコート方法及びスピンコート装置
JP4824792B2 (ja) * 2009-07-02 2011-11-30 東京エレクトロン株式会社 塗布装置
JP5565482B2 (ja) 2012-02-16 2014-08-06 東京エレクトロン株式会社 液処理方法及びフィルタ内の気体の除去装置
JP5439579B2 (ja) * 2012-02-27 2014-03-12 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5453561B1 (ja) 2012-12-20 2014-03-26 東京エレクトロン株式会社 液処理装置、液処理方法及び液処理用記憶媒体
JP6020405B2 (ja) * 2013-10-02 2016-11-02 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP5967045B2 (ja) * 2013-10-02 2016-08-10 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP2016087548A (ja) * 2014-11-05 2016-05-23 東レエンジニアリング株式会社 塗布装置及びエア溜まり除去方法
JP6736989B2 (ja) * 2016-06-07 2020-08-05 東京エレクトロン株式会社 処理液供給装置、機器ユニット、処理液供給方法及び記憶媒体
JP6856323B2 (ja) 2016-06-30 2021-04-07 東レエンジニアリング株式会社 塗布装置及び塗布方法
JP6942497B2 (ja) 2016-09-08 2021-09-29 東京エレクトロン株式会社 処理液供給装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063121A1 (en) * 2000-05-01 2002-05-30 Shori Mokuo Heating device, liquid processing apparatus using the heating device and method of detecting failure thereof
TW201005076A (en) * 2008-07-31 2010-02-01 Nihon Valqua Kogyo Kk Process for regenerating a phosphoric acid-containing treatment liquid
TW201526076A (zh) * 2013-11-01 2015-07-01 Tokyo Electron Ltd 處理液供給裝置及處理液供給方法
TWM514103U (zh) * 2014-01-20 2015-12-11 Tokyo Electron Ltd 處理液供給配管迴路
TW201807512A (zh) * 2016-04-28 2018-03-01 富士軟片股份有限公司 處理液及處理液收容體

Also Published As

Publication number Publication date
US11465168B2 (en) 2022-10-11
CN111868882B (zh) 2024-07-05
TW201941263A (zh) 2019-10-16
US20210008588A1 (en) 2021-01-14
KR20200134259A (ko) 2020-12-01
KR102723944B1 (ko) 2024-10-31
WO2019182036A1 (ja) 2019-09-26
JP7107362B2 (ja) 2022-07-27
CN111868882A (zh) 2020-10-30
JPWO2019182036A1 (ja) 2021-03-18

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