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TWI800051B - Condensing structure - Google Patents

Condensing structure Download PDF

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Publication number
TWI800051B
TWI800051B TW110139519A TW110139519A TWI800051B TW I800051 B TWI800051 B TW I800051B TW 110139519 A TW110139519 A TW 110139519A TW 110139519 A TW110139519 A TW 110139519A TW I800051 B TWI800051 B TW I800051B
Authority
TW
Taiwan
Prior art keywords
condensing structure
condensing
Prior art date
Application number
TW110139519A
Other languages
Chinese (zh)
Other versions
TW202317925A (en
Inventor
何志明
Original Assignee
奇鋐科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奇鋐科技股份有限公司 filed Critical 奇鋐科技股份有限公司
Priority to TW110139519A priority Critical patent/TWI800051B/en
Application granted granted Critical
Publication of TWI800051B publication Critical patent/TWI800051B/en
Publication of TW202317925A publication Critical patent/TW202317925A/en

Links

TW110139519A 2021-10-25 2021-10-25 Condensing structure TWI800051B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110139519A TWI800051B (en) 2021-10-25 2021-10-25 Condensing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110139519A TWI800051B (en) 2021-10-25 2021-10-25 Condensing structure

Publications (2)

Publication Number Publication Date
TWI800051B true TWI800051B (en) 2023-04-21
TW202317925A TW202317925A (en) 2023-05-01

Family

ID=86948784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110139519A TWI800051B (en) 2021-10-25 2021-10-25 Condensing structure

Country Status (1)

Country Link
TW (1) TWI800051B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103813695A (en) * 2012-11-13 2014-05-21 台达电子工业股份有限公司 Siphon type heat radiator
TWM580672U (en) * 2019-02-20 2019-07-11 龍大昌精密工業有限公司 Heat dissipating structure of condenser
TWM625080U (en) * 2021-10-25 2022-04-01 奇鋐科技股份有限公司 Condensing structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103813695A (en) * 2012-11-13 2014-05-21 台达电子工业股份有限公司 Siphon type heat radiator
TWM580672U (en) * 2019-02-20 2019-07-11 龍大昌精密工業有限公司 Heat dissipating structure of condenser
TWM625080U (en) * 2021-10-25 2022-04-01 奇鋐科技股份有限公司 Condensing structure

Also Published As

Publication number Publication date
TW202317925A (en) 2023-05-01

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