TWI899571B - Electronic device and working mode judging method for electronic device - Google Patents

Abstract

An electronic device including a host module, an external cooling module and an external power supply module is provided. The host module includes a computing unit. The external cooling module is detachably connected to the host module. The external power supply module is detachably connected to the host module or the external cooling module to supply power to the host module. When the external power supply module and the external cooling module are disconnected from the host module, the computing unit of the host module operates in a first working state. When one of the external power supply module and the external cooling module is connected to the host module, the computing unit operates in the first working state or a second working state. When the host module is connected with the external cooling module and the external power supply module, the computing unit is adapted to operate in the first working state, the second working state or a third working state.

Description

Electronic device and method for determining operating mode of electronic device

The present invention relates to an electronic device and a method for determining an operating mode of the electronic device, and in particular to a method applicable to a portable electronic device that determines a series of operating modes based on whether the portable electronic device is connected to an external device.

While today's portable electronic devices, such as mini PCs and tablets, offer portability, they lack sufficient internal heat dissipation space, limiting them to tasks within their intended scope (such as browsing the internet, document processing, light gaming, and drawing). Furthermore, they are not capable of excessive computing (e.g., overclocking). Furthermore, the performance of the chips within these devices is determined by the programs they process. If the high temperatures generated by these chips during continuous operation cannot be effectively and promptly cooled within the device, the device may overheat, leading to poor user experience, reduced chip computing efficiency, and even chip damage and write-offs. Furthermore, if the chip operates at high performance when the portable electronic device is low on power, the usable time of the microcomputer host will be shortened, which is detrimental to the use of the electronic device.

The present invention provides an electronic device and a method for determining an operating mode of the electronic device, which can adjust the operating mode of an operation unit according to the connection status of the electronic device to facilitate the use of the electronic device.

The electronic device of the present invention includes a host module, an external heat dissipation module and an external power supply module. The host module includes an operation unit. The external heat dissipation module is detachably connected to the host module. The external power supply module is detachably connected to the host module or the external heat dissipation module to supply power to the host module. When the external power supply module and the external heat dissipation module are disconnected from the host module, the operation unit of the host module operates in a first working state. When one of the external power supply module and the external heat dissipation module is connected to the host module, the operation unit operates in a first working state or a second working state. When the host module is connected to the external heat dissipation module and the external power supply module, the operation unit is suitable for operating in the first working state, the second working state or a third working state.

The working mode determination method of an electronic device of the present invention is applicable to an electronic device. The electronic device includes a host module, an external heat dissipation module and an external power supply module. The working mode determination method of the electronic device includes the following steps: determining whether the host module is connected to at least one of the external heat dissipation module or the external power supply module. When the external power supply module and the external heat dissipation module are disconnected from the host module, an operation unit of the host module operates in a first working state. When one of the external power supply module and the external heat dissipation module is connected to the host module, the operation unit operates in a first working state or a second working state. When the external heat dissipation module and the external power supply module are connected to the host module, the operation unit is suitable for operating in the first working state, the second working state or a third working state.

Based on the above, the host module of the electronic device of the present invention can adjust the operating state of the computing unit (first operating state, second operating state, and third operating state) based on the connection status with the external heat dissipation module and the external power supply module. The computing unit can operate in the appropriate operating state to ensure that the host module does not overheat or lack of power, which may cause the computing unit to fail.

In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings.

FIG1A is a schematic diagram of an electronic device according to an embodiment of the present invention before assembly. FIG1B is a schematic diagram of the electronic device of FIG1A after assembly. FIG2 is a block diagram of some components of the host module and the external heat sink module of FIG1 after assembly. FIG3 is a schematic front view of the host module of FIG1. Referring to FIG1A to FIG3 together, the electronic device 100a includes a host module 110, an external heat sink module 120a, and an external power supply module 130. The external heat sink module 120a is detachably connected to the host module 110 to dissipate heat from the host module 110. The external power supply module 130 is detachably connected to the host module 110 or the external heat sink module 120a to directly or indirectly supply power to the host module 110.

Specifically, when the external power module 130 is connected to the host module 110, the external power module 130 directly supplies power to the host module 110. When the external power module 130 is connected to the external heat sink module 120a, the external power module 130 first supplies power to the external heat sink module 120a and then transmits the power to the host module 110 for indirect power supply.

As shown in Figure 1A, the host module 110 includes a housing 112, an operational unit (APU) 111, and a battery unit 118. The APU 111 and battery unit 118 are housed within the housing 112. The external heat sink module 120a includes a battery 128 and a heat sink assembly 125. When the host module 110 is connected to the external heat sink module 120a, the heat sink assembly 125 of the external heat sink module 120a dissipates heat from the housing 112 and the APU 111 of the host module 110, while the battery 128 supplies power to the host module 110. The APU 111 is an electronic component that generates heat during operation, such as, but not limited to, a central processing unit (CPU) and a graphics processing unit (GPU). The external power module 130 is, for example, a power supply (AC-adapter), but is not limited thereto.

When the external power module 130 and the external heat sink module 120a are disconnected from the host module 110, the host module 110 is powered by its own battery unit 118, and the computing unit 111 of the host module 110 operates in a first operating state. When one of the external power module 130 and the external heat sink module 120a is connected to the host module 110, the host module 110 is powered by its own battery unit 118 and can also receive power from the battery 128 of the external power module 130 or from one of the external power modules 130, allowing the computing unit 111 to operate in either the first operating state or the second operating state.

When the host module 110 is connected to the external heat dissipation module 120a and the external power module 130, the power source of the host module 110 is the battery unit 118, the battery 128 and the external power module 130. In particular, when the external power module 130 continuously supplies power to the host module 110 directly or indirectly, the computing unit 111 can operate in a first working state, a second working state or a third working state.

The first operating state includes a first sub-operating state and a second sub-operating state. In terms of power consumption, the computing unit 111 consumes less wattage when operating in the first sub-operating state than when operating in the second sub-operating state. The computing unit 111 consumes less wattage when operating in the first operating state than when operating in the second operating state, and the computing unit 111 consumes less wattage when operating in the second operating state than when operating in the third operating state.

In terms of computing performance, the computing clock rate of the computing unit 111 when operating in the first sub-working state is less than the computing clock rate of the computing unit 111 when operating in the second sub-working state. The computing clock rate of the computing unit 111 when operating in the second sub-working state is less than the computing clock rate of the computing unit 111 when operating in the second working state. The computing clock rate of the computing unit 111 when operating in the second working state is less than the computing clock rate of the computing unit 111 when operating in the third working state.

The computing unit 111 can adjust its operating state based on the power supply status. When the power supply is sufficient, the computing unit 111 can operate in a high-wattage operating state (the second operating state and the third operating state). In some computing workload categories, the third operating state can be a special mode that allows the computing unit 111 to perform overload operations, while the second operating state can be a mode that allows the computing unit 111 to perform medium or high-load operations within the load range. When the power supply is low, the computing unit 111 can operate in a low-wattage operating state (the first operating state) to increase the operating time of the electronic device 100a.

Specifically, since the host module 110 is powered by its own battery cell 118, to prevent excessive computing from causing excessive power consumption and potentially causing an unwarned shutdown of the host module 110, the first and second sub-operating states are primarily distinguished based on whether the battery cell 118's charge level is below a threshold. As long as the battery cell 118's charge level is below the threshold, the computing unit 111 operates only in the first sub-operating state. When the battery cell 118's charge level reaches the threshold, the computing unit 111 can operate in the second sub-operating state.

In addition, the computing unit 111 can dynamically adjust the heat dissipation performance of the heat dissipation module based on the overall heat dissipation conditions of the host module 110. As shown in Figures 1B and 2, the host module 110 includes a temperature sensing component 115 disposed within the housing 112. The temperature sensing component 115 is electrically connected to the computing unit 111 to return a temperature signal TS (Figure 2). The temperature sensing component 115 can sense the temperature of the computing unit 111 and the temperature of a contact area 114 (Figure 3) of the housing 112. As shown in Figure 3, the contact area 114 of the housing 112 is the location where a user's hand H contacts the housing 112. Figure 3 schematically illustrates two contact areas 114, but the location, size, and number of contact areas 114 are not limited to this embodiment. When the computing unit 111 is operating, heat energy from the computing unit 111 is transferred to the housing 112, causing the housing 112 (contact areas 114) to heat up. Specifically, the contact areas 114 of the housing 112 refer to the housing surface that the user's hand continuously contacts during operation. For example, this housing surface includes the keyboard and touch panel.

As shown in Figure 2, the external cooling module 120a further includes a controller 121, and the heat dissipation component 125 is electrically connected to the controller 121. When the external cooling module 120a is connected to the host module 110, the computing unit 111 of the host module 110 is electrically connected to the controller 121 of the external cooling module 120a (Figure 2). The controller 121 of the external cooling module 120a adjusts the cooling performance of the heat dissipation component 125 based on the temperature signal TS returned by the computing unit 111. The heat dissipation assembly 125 can dissipate heat from the computing unit 111 to prevent the temperature of the computing unit 111 from being too high, and the heat dissipation assembly 125 can dissipate heat from the contact area 114 of the housing 112 to prevent the temperature of the contact area 114 from exceeding the human body temperature (e.g., 40 degrees Celsius).

The heat dissipation assembly 125 of this embodiment includes a fan 126 and at least one cooling chip 127. The controller 121 activates at least one of the fan 126 and the cooling chip 127 based on a temperature signal TS. The temperature signal TS is, for example, the temperature difference between the computing unit 111 and the contact area 114 of the host module 110. The heat dissipation performance of the external heat dissipation module 120a (heat dissipation assembly 125) is negatively correlated with the temperature difference. In particular, if the controller 121 adjusts the heat dissipation performance of the heat dissipation assembly 125 based on the temperature state of the computing unit 111, the fan 126 may generate noise due to the instantaneous high-speed operation, or the cooling chip 127 may cause condensation to quickly condense inside the housing 125 due to the instantaneous high voltage.

To avoid these issues, the present invention dynamically adjusts the heat dissipation performance of the heat sink 125 based on factors such as the temperature difference between the computing unit 111 and the contact area 114, the operating duration of the host module 110, and the operating state of the computing unit 111. For example, when the host module 110 is initially started or the computing unit 111 is operating in its first operating state, the temperature difference between the computing unit 111 and the contact area 114 of the housing 112 is large. Therefore, the controller 121 can activate only the fan 126 for heat dissipation. In this case, the fan 126 can operate at its standard speed. When the computing unit 111 operates in the second operating state, the heat energy generated by the computing unit 111 increases, causing the temperature of the contact area 114 of the housing 112 to rise. The temperature difference between the computing unit 111 and the contact area 114 decreases, and the controller 121 can reactivate the cooling chip 127. At this time, the fan 126 can operate at a standard speed and the cooling chip 127 can operate at a low voltage. When the computing unit 111 operates in the third operating state, the temperature difference between the computing unit 111 and the contact area 114 further decreases. The controller 121 can control the fan 126 to operate at a high speed and the cooling chip 127 to operate at a high voltage.

In short, controller 121 dynamically adjusts the cooling performance of external heat sink module 120a (heat sink assembly 125) based on the magnitude of the temperature difference. As the temperature difference decreases, the cooling performance of heat sink assembly 125 is gradually increased, meaning the speed of fan 126 and the voltage of cooling chip 127 are gradually increased. Conversely, as the temperature difference increases, the cooling performance of heat sink assembly 125 is gradually decreased. This prevents noise from the fan 126 of heat sink assembly 125 due to momentary high-speed operation, and prevents condensation from rapidly condensing on cooling chip 127 due to momentary high voltage, which can lead to water droplets remaining inside housing 112. On the other hand, when the host module 110 is connected to the external heat dissipation module 120a and the external power module 130 is absent, the dynamic adjustment method of the heat dissipation component 125 can also help save power of the battery unit 118 and the battery 128.

In addition, the external heat dissipation module 120a of this embodiment controls the heat dissipation component 125 through the internal controller 121, and the computing unit 111 does not directly control the heat dissipation component 125, thereby reducing the computing burden of the computing unit 111.

As shown in Figure 1A, the external heat dissipation module 120a of this embodiment includes a main body 122a and a display assembly 124, and the controller 121 and the heat dissipation module 125 are arranged in the main body 122a. The main body 122a includes a first end E1, a second end E2 and a connecting portion 123a. The connecting portion 123a is, for example, a groove, but is not limited to this. The display assembly 124 can be pivotally connected to the first end E1 of the main body 122a. When the external heat dissipation module 120a is connected to the host module 110, the host module 110 can be set on the connecting portion 123a of the main body 122a, and the host module 110 is electrically connected to the display assembly 124. The connection method between the host module 110 and the external heat dissipation module 120a is, for example, through a connector C, but is not limited to this. Connector C is, for example, a spring connector.

As shown in Figures 1B and 2 , when the host module 110 is positioned on the connection portion 123a, the heat dissipation module 125 is located below the host module 110 and includes at least two cooling chips 127. One cooling chip 127 is connected to the processing unit 111 to cool the processing unit 111, while the other cooling chip 127 contacts the housing 112 to cool the contact area 114 (Figure 3). A fan 126 blows air toward the host module 110 to cool the host module 110.

FIG1B schematically illustrates the direction of airflow with arrows. The fan 126 of this embodiment, for example, draws air from below the external heat dissipation module 120a, and the airflow flows toward the main module 110 to exchange heat with the main module 110. The side of the housing 112 of the main module 110 includes a plurality of heat dissipation holes (not shown). After heat exchange with the main module 110, the airflow with high heat content leaves the main module 110 through these heat dissipation holes. In an embodiment not shown, the fan 126 can draw air from the side of the external heat dissipation module 120a. In another embodiment not shown, the airflow blown out by the fan 126 can pass through the cooling chip 127 to further reduce the temperature of the airflow, thereby improving the heat dissipation efficiency of the heat dissipation module 125.

In addition, the host module 110 further includes a heat sink 116 and an input component 119. The heat sink 116 is connected to the computing unit 111 to increase the heat dissipation area and improve the heat dissipation efficiency of the computing unit 111. The input component 119 is, for example, a keyboard. The external heat sink module 120a may include a touch panel 129. When the host module 110 is connected to the external heat sink module 120a, the touch panel 129 is electrically connected to the computing unit 111.

In addition, since the host module 110 of this embodiment is cooled by the external heat dissipation module 120a, the host module 110 does not need to be equipped with heat dissipation elements such as fans or cooling chips, thereby further reducing the overall volume of the host module 110 and improving the portability of the host module 110.

Figure 4 is a schematic diagram of another assembly method for the host module and external heat sink module of Figure 1. Referring to Figure 4 , the host module 110 can also be mounted at the second end E2 of the main body 122a. A connector C is provided at the second end E2 for connection to the host module 110. Users can select the appropriate connection method based on their needs. In this case, the fan 126 can draw air from the side of the external heat sink module 120a. The airflow from the fan 126 flows toward the second end E2 and enters the host module 110.

In the embodiments shown in Figures 1 and 4 , the external heat sink module 120a is connected to the host module 110, and the external power module 130 is connected to the external heat sink module 120a. The external power module 130 supplies power to the host module 110 via the external heat sink module 120a, but this is not limited to the embodiment. In an embodiment not shown, the external power module 130 can be directly connected to the host module 110.

Figure 5 is a schematic diagram illustrating the assembly of an electronic device according to another embodiment of the present invention. Figure 6 is another schematic diagram illustrating the assembly of the host module and external heat sink module of Figure 5 . Referring to Figures 1 , 5 , and 6 , the electronic device 100b of this embodiment is similar to the aforementioned embodiment. The difference between the two is that the connection portion 123b of the external heat sink module 120b of this embodiment is an inclined surface, facing away from the first end E1. The electronic device 100b further includes a display 140. The host module 110 is wirelessly connected to the display 140 (e.g., via Bluetooth). The display 140 is positioned adjacent to the first end E1 of the external heat sink module 120b. When the external heat dissipation module 120b is connected to the host module 110, the host module 110 can be disposed on the inclined surface (connection portion 123b) as shown in FIG5, or disposed at the second end E2 of the main body 122b as shown in FIG6.

Figure 7 is a flow chart of a method for determining an operating mode of an electronic device according to an embodiment of the present invention. Referring to Figure 1B and Figure 7 , the method for determining an operating mode of an electronic device according to this embodiment can be applied to electronic devices 100a and 100b. The method includes step S202. In step S202, the computing unit 111 of the host module 110 determines whether the host module 110 is connected to at least one of the external heat sink modules 120a and 120b or the external power supply module 130.

Specifically, step S202 first determines whether the host module 110 is connected to the external heat dissipation modules 120a and 120b (step S210), and then determines whether the host module 110 is directly or indirectly connected to the external power module 130 (steps S220 and S230).

Once the computing unit 111 confirms in step S210 that the host module 110 is connected to the external heat dissipation modules 120a and 120b, it proceeds to step S220 to determine whether the host module 110 or one of the external heat dissipation modules 120a and 120b is connected to the external power module 130. Once it is confirmed in step S220 that the host module 110 and one of the external heat sink modules 120a, 120b are connected to the external power module 130 ( FIG. 1B ), the host module 110 can achieve better heat dissipation efficiency through the external heat sink modules 120a, 120b, and the host module 110 has sufficient power supply capabilities (including limited power provided by the battery unit 118, the battery 128, and direct or indirect continuous power supply from the external power module 130), allowing the computing unit 111 to operate in any working state.

It should be noted that if the host module 110 allows for overloaded computing or a special function that allows the chip to operate at high loads for extended periods, this may not necessarily be required by the user at the time. Therefore, a judgment condition in step S221 is added, allowing the user to independently decide whether to enable this special function. Specifically, when the external power supply module 130 continues to directly or indirectly power the host module 110, the computing unit 111 may display a warning screen on the display assembly 124 and the monitor 140 to inquire about whether to disable the third operating state (step S221). If the host module 110 decides to disable the third operating state, the computing unit 111 operates in either the first or second operating state (step S222). When the host module 110 determines that the third operating state is not enabled, the computing unit 111 operates in the first operating state, the second operating state, or the third operating state (step S223). The computing unit 111 can switch between the three operating states. The third operating state here refers to the operating state of the special function mentioned above.

Returning to step S220, if it is determined that the host module 110 and one of the external heat sink modules 120a, 120b are disconnected from the external power supply module 130, this indicates that while the host module 110 can achieve better heat dissipation efficiency through the external heat sink modules 120a, 120b, the host module 110 can only rely on the external battery (i.e., battery 128) for recharging, in addition to its own battery power (i.e., battery unit 118). To prevent rapid depletion of recharged power during extended operation, the system proceeds to step S224 to determine whether the charge level of the host module 110's battery unit 118 is above a threshold. This threshold can be an arbitrary value set by the user based on the wattage consumption of the computing unit 111. When the battery level of battery unit 118 (host module 110) is above the threshold, host module 110 can rely on the power of battery 128 to obtain a longer operating time, allowing computing unit 111 to operate in the second sub-operating state or the second operating state (step S225). When the battery level of host module 110 is below the threshold, host module 110 has a relatively shorter operating time, forcing computing unit 111 to operate only in the first sub-operating state (step S226).

Returning to step S210, if it is determined that the host module 110 is disconnected from the external heat dissipation modules 120a and 120b, the process proceeds to step S230 to determine whether the host module 110 is connected to the external power module 130. If it is confirmed in step S230 that the host module 110 is connected to the external power module 130, this indicates that the heat dissipation efficiency of the host module 110 is low and that the host module 110 has a certain power supply capacity (battery unit 118 and external power module 130). Therefore, the computing unit 111 can operate in the second operating state or the first operating state (step S231).

Returning to step S230, if it is determined that the host module 110 is disconnected from the external power supply module 130, this indicates that the heat dissipation efficiency of the host module 110 is low and the power supply capacity of the host module 110 (battery unit 118) is low. Next, it is determined whether the power level of the battery unit 118 of the host module 110 is above a threshold value (step S232). When the power level of the host module 110 (battery unit 118) is above the threshold value, the computing unit 111 operates in the second sub-operating state (step S233). When the power level of the host module 110 (battery unit 118) is below the threshold value, the computing unit 111 operates only in the first sub-operating state (step S234).

As can be seen, the operational state of the operational unit 111 can be dynamically determined based on the connection status with the external heat dissipation modules 120a and 120b, the power supply status, and the remaining charge of the battery unit 118. This prevents the host module 110 from overheating and causing a shutdown due to poor heat dissipation efficiency, and prevents the host module 110 from experiencing a reduction in operating time due to insufficient power supply.

In summary, the host module of the electronic device of the present invention first adjusts the operating state of the operational unit (first, second, and third operating states) based on the connection status with the external heat sink module and the external power supply module. The operational unit can operate in the appropriate operating state to ensure that the host module does not fail due to overheating or insufficient power. Then, when the host module is connected to the heat sink module, the operational unit will further dynamically adjust the heat dissipation performance of the heat sink module based on the host module's heat dissipation status to avoid fan noise and condensation on the cooling chip, thereby improving the user's operating experience and the operational stability of the host module.

Although the present invention has been disclosed above by way of embodiments, they are not intended to limit the present invention. Any person having ordinary skill in the art may make slight modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

C: Connector E1: First end E2: Second end H: Hand S202, S210, S220, S221, S222, S223, S224, S225, S226, S230, S231, S232, S233, S234: Steps TS: Temperature signal 100a, 100b: Electronic device 110: Host module 111: Computing unit 112: Housing 114: Contact area 115: Temperature sensor 116: Vapor chamber 118: Battery unit 119: Input component 120a, 120b: External heat sink 121: Controller 122a, 122b: Main unit 123a, 123b: Connectors 124: Display assembly 125: Heat sink 126: Fan 127: Cooling chip 128: Battery 129: Touch panel 130: External power supply 140: Display

Figure 1A is a schematic diagram of an electronic device according to an embodiment of the present invention before assembly. Figure 1B is a schematic diagram of the electronic device of Figure 1A after assembly. Figure 2 is a block diagram of some components of the assembled host module and external heat sink module of Figure 1. Figure 3 is a front view schematic diagram of the host module of Figure 1. Figure 4 is a schematic diagram of another assembly method of the host module and external heat sink module of Figure 1. Figure 5 is a schematic diagram of another assembly method of the electronic device according to another embodiment of the present invention. Figure 6 is a schematic diagram of another assembly method of the host module and external heat sink module of Figure 5. Figure 7 is a flow chart of a method for determining an operating mode of an electronic device according to an embodiment of the present invention.

C: Connector

E1: First End

E2: Second end

100a: Electronic devices

110: Host Module

111: Arithmetic Unit

112: Shell

115: Temperature sensor assembly

116: Vapor Chamber

118:Battery cell

119: Input component

120a: External heat sink module

122a: Subject

123a: Connection section

124: Display component

125: Heat dissipation component

128:Battery

129: Touch Panel

130: External power module

Claims (18)

An electronic device includes: a host module including an input component, an operation unit, a housing, and a temperature sensing component, wherein the operation unit and the temperature sensing component are arranged in the housing, and the temperature sensing component is electrically connected to the operation unit; an external heat dissipation module detachably connected to the host module; and an external power supply module detachably connected to the host module or the external heat dissipation module. module to supply power to the host module; wherein the computing unit adjusts the working state of the computing unit according to whether the host module is connected to at least one of the external heat dissipation module or the external power supply module; when the external power supply module and the external heat dissipation module are disconnected from the host module, the computing unit of the host module operates in a first working state; when one of the external power supply module and the external heat dissipation module is connected to the host module, the computing unit operates in the first working state or a second working state; when the host module is connected to the external heat dissipation module and the external power supply module, the computing unit is suitable for operating in the first working state, the second working state or a third working state; wherein the temperature sensing component senses the temperature of the computing unit and a contact area of the housing The external cooling module detects the temperature of the computing unit and transmits a temperature signal back to the computing unit. When the external cooling module is connected to the host module, the module adjusts the cooling performance based on the temperature signal, where the temperature signal represents the temperature difference between the computing unit and the contact area. The external cooling module dissipates heat from the computing unit to the contact area of the housing, which is the surface of the housing where the input component is located. The electronic device of claim 1, wherein the power consumption of the computing unit when operating in the first working state is less than the power consumption when operating in the second working state, and the power consumption of the computing unit when operating in the second working state is less than the power consumption when operating in the third working state. The electronic device of claim 1, wherein the first operating state includes a first sub-operating state and a second sub-operating state, and the power consumption of the computing unit when operating in the first sub-operating state is less than the power consumption when operating in the second sub-operating state. The electronic device of claim 1, wherein the external heat dissipation module includes a battery, and when the host module is connected to the external heat dissipation module, the battery supplies power to the host module. The electronic device of claim 1, wherein the external heat dissipation module includes a controller and a heat dissipation component electrically connected to the controller. When the external heat dissipation module is connected to the host module, the controller is electrically connected to the computing unit. The controller adjusts the heat dissipation performance of the heat dissipation component based on a temperature signal returned by the computing unit. The electronic device of claim 5, wherein the heat dissipation component includes a fan and at least one cooling chip, and the controller activates at least one of the fan and the at least one cooling chip based on the temperature signal. The electronic device as described in claim 1, wherein the heat dissipation performance of the external heat dissipation module is negatively correlated with the temperature difference. In the electronic device of claim 1, when the external heat dissipation module is connected to the host module and the external power module is connected to the external heat dissipation module, the external power module supplies power to the host module through the external heat dissipation module. The electronic device as described in claim 1 further includes a display, wherein the host module is connected to the display via a wireless connection. The electronic device as described in claim 1, wherein the external heat dissipation module includes a main body and a display assembly, the display assembly is pivotally connected to a first end of the main body, when the external heat dissipation module is connected to the host module, the host module is adapted to be disposed on a connection portion of the main body or on a second end of the main body, the host module and the display assembly are electrically connected, the first end is opposite to the second end, the connection portion is a groove and is located between the first end and the second end, wherein a bottom surface and a side surface of the host module are connected A connector is provided in each of the groove and the second end. When the host module is placed in the groove, the heat dissipation module is located below the host module, and a fan in the heat dissipation module blows air toward the host module. The connector disposed on the bottom surface is connected to the connector disposed in the groove. When the host module is placed at the second end, the airflow blown by the fan flows toward the second end and enters the host module. The connector disposed on the side surface is connected to the connector disposed at the second end. A method for determining an operating mode of an electronic device is applicable to an electronic device comprising an input component, a host module, an external heat sink module, and an external power supply module. The host module comprises an operating unit, a housing, and a temperature sensing component. The operating unit and the temperature sensing component are disposed in the housing, and the temperature sensing component is electrically connected to the operating unit. The working mode determination method includes the following steps: determining whether the host module is connected to at least one of the external heat dissipation module or the external power supply module to adjust the working state of the computing unit, wherein when the external power supply module and the external heat dissipation module are disconnected from the host module, an computing unit of the host module operates in a first working state, wherein when one of the external power supply module and the external heat dissipation module is connected to the host module, the computing unit operates in the first working state or a second working state, wherein when the external heat dissipation module and the external power supply module are connected to the host module, the computing unit is suitable for operating in the first working state, the second working state or a third working state; and sensing the temperature of the computing unit and a temperature of the housing through the temperature sensing component. The external heat dissipation module measures the temperature of the contact area and transmits a temperature signal back to the computing unit. When the external heat dissipation module is connected to the host module, the external heat dissipation module adjusts the heat dissipation performance based on the temperature signal. The temperature signal is a temperature difference between the computing unit and the contact area. The external heat dissipation module dissipates heat from the computing unit and the contact area of the housing. The contact area is the surface of the housing where the input component is located. The method for determining an operating mode of an electronic device as described in claim 11, wherein the power consumption of the computing unit when operating in the first operating state is less than the power consumption when operating in the second operating state, and the power consumption of the computing unit when operating in the second operating state is less than the power consumption when operating in the third operating state. In the method for determining an operating mode of an electronic device as described in claim 11, the step of determining whether the host module is connected to at least one of the external heat dissipation module or the external power supply module specifically comprises: determining whether the host module is connected to the external heat dissipation module; when the host module is connected to the external heat dissipation module, determining whether one of the host module and the external heat dissipation module is connected to the external power supply module; and when the host module is disconnected from the external heat dissipation module, determining whether the host module is connected to the external power supply module. The method for determining an operating mode of an electronic device as described in claim 13, wherein when the host module is connected to the external heat dissipation module and one of the host module and the external heat dissipation module is connected to the external power module, it is determined whether the host module has disabled the third operating state. When the host module has disabled the third operating state, the computing unit operates in the first operating state or the second operating state. When the host module has not disabled the third operating state, the computing unit operates in the first operating state, the second operating state, or the third operating state. The operating mode determination method of claim 13, wherein when the host module is disconnected from the external heat dissipation module and connected to the external power supply module, the computing unit operates in the second operating state or the first operating state. The method for determining an operating mode of an electronic device as described in claim 13, wherein the first operating state includes a first sub-operating state and a second sub-operating state, and the power consumption of the computing unit when operating in the first sub-operating state is less than the power consumption when operating in the second sub-operating state. The operating mode determination method of an electronic device as described in claim 16, wherein when the host module is connected to the external heat dissipation module and the host module and the external heat dissipation module are disconnected from the external power supply module, it is determined whether the power of the host module is higher than a threshold value. When the power of the host module is higher than the threshold value, the computing unit operates in the second sub-operating state or the second operating state. When the power of the host module is lower than the threshold value, the computing unit operates in the first sub-operating state. The method for determining an operating mode of an electronic device as described in claim 16, wherein when the host module is disconnected from the external heat dissipation module and the host module is disconnected from the external power supply module, it is determined whether the power level of the host module is higher than a threshold value. When the power level of the host module is higher than the threshold value, the computing unit operates in the second sub-operating state; when the power level of the host module is lower than the threshold value, the computing unit operates in the first sub-operating state.