TWI896963B - Touchpad device and manufacturing method thereof - Google Patents

Abstract

A touchpad device includes a substrate and a touch panel. The substrate has a top surface. The touch panel is arranged above the top surface of the substrate, and the touch panel includes a touch board, a circuit board and an adhesive layer. The touch board has a first surface, the first surface has a middle area and a peripheral area, and the peripheral area surrounds the middle area. The circuit board has a second surface, the circuit board and the touch board are stacked on each other, and the second surface faces the first surface. The adhesive layer is located between the touch board and the circuit board, the adhesive layer includes a first adhesive layer and a second adhesive layer. The first adhesive layer is adhered to the middle area and the second surface, the first adhesive layer is a light-curing adhesive layer and is in a cured state, the second adhesive layer is adhered to the peripheral area and the second surface, and the viscosity of the second adhesive layer is greater than the viscosity of the first adhesive layer.

Description

Touch panel device and manufacturing method thereof

The present invention relates to an input device, and more particularly to a touch panel device and a manufacturing method thereof.

A touchpad is an input device widely used in computers to sense the movement or pressure of a user's finger to control cursor movements (such as displacement or clicking).

The current manufacturing method for touch panel devices primarily involves applying liquid adhesive to the touch panel using a glue dispenser, then attaching the circuit board to the adhesive, allowing the adhesive to secure the touch panel and circuit board together. However, this manufacturing method requires the glue dispenser to apply the liquid adhesive at a specific angle, which is time-consuming and inconvenient. Furthermore, the rigidity of the bond between the touch panel and circuit board is poor, making it prone to wobble, bending, and excessive idle travel when pressure is applied to corners.

In view of the above, in one embodiment, a method for manufacturing a touch panel device is provided, comprising preparing a first plate and a second plate, wherein the first plate has a first surface, the first surface has a middle area and a peripheral area, the peripheral area surrounds the middle area, the second plate has a second surface, and one of the first plate and the second plate is a touch panel and the other is a circuit board; attaching an adhesive layer to the first plate The first surface of the second plate is illuminated by a light emitting element to illuminate the adhesive layer; the second surface of the second plate is attached to the adhesive layer by a machine; and the adhesive layer forms a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is a light-curing adhesive layer that is converted into a cured state and is attached to the outer region and the second surface, and the viscosity of the second adhesive layer is greater than that of the first adhesive layer.

In another embodiment, a touch panel device is provided, comprising a substrate and a touch panel. The substrate has a top surface. The touch panel is disposed above the top surface of the substrate and includes a touch pad, a circuit board, and an adhesive layer. The touch pad has a first surface, the first surface having a central region and a peripheral region, the peripheral region surrounding the central region. The circuit board has a second surface, the circuit board and the touch pad being stacked one on top of the other, with the second surface facing the first surface. The adhesive layer is located between the touch panel and the circuit board. The adhesive layer includes a first adhesive layer and a second adhesive layer. The first adhesive layer is a light-curing adhesive layer and is in a cured state. The second adhesive layer is connected to the outer area and the second surface, and the viscosity of the second adhesive layer is greater than that of the first adhesive layer.

In summary, according to the touch panel device and its manufacturing method of the embodiments of the present invention, the first adhesive layer is a cured light-curing adhesive layer that is bonded to the middle area of the touch panel and the second surface of the circuit board. This allows for improved flatness and a thinner profile of the touch panel and circuit board after bonding. Furthermore, the cured light-curing adhesive layer provides enhanced rigidity, preventing issues such as wobble, bending, or excessive idle travel when pressure is applied to the corners of the touch panel. Furthermore, the second adhesive layer, with a higher viscosity, is bonded to the outer area of the touch panel and the second surface of the circuit board, preventing delamination around the touch panel due to stress.

It should be noted that in the descriptions of the various embodiments, the terms "first" and "second" are used to describe different components, and these components are not limited by these terms. Furthermore, for the sake of convenience and clarity, the thicknesses or dimensions of the various components in the drawings are exaggerated, omitted, or schematically represented to facilitate understanding and reading by those familiar with the art. The dimensions of each component are not necessarily their actual dimensions and are not intended to limit the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in size, provided they do not affect the efficacy and objectives of the present invention, shall remain within the scope of the technical content disclosed herein. The same reference numerals will be used throughout the drawings to represent identical or similar components.

Figure 1 is a schematic diagram illustrating an embodiment of the touchpad device of the present invention. As shown in Figure 1 , touchpad device 1 can be used in a computer product. Users can operate touchpad device 1 by sliding or pressing their fingers, controlling the movement of a cursor or generating corresponding control signals. For example, in this embodiment, touchpad device 1 is used in a notebook computer N, but this is not a limitation. In other embodiments, touchpad device 1 can also be used in other portable computers (such as tablet computers). Alternatively, touchpad device 1 can be a standalone device connected externally to a portable computer, although this embodiment is not limiting.

Figure 2 is an exploded perspective view of an embodiment of the touchpad device of the present invention. As shown in Figure 2 , the touchpad device 1 includes a substrate 20 and a touch panel 30. The substrate 20 can be a rigid plate made of metal (e.g., iron, aluminum, or an alloy) or plastic. In this embodiment, the substrate 20 is located at the bottom layer of the touchpad device 1 and has a top surface 21. The touch panel 30 is disposed above the top surface 21.

As shown in Figure 2, the touch panel 30 includes a touch pad 31, a circuit board 33, and an adhesive layer 35. The circuit board 33 and the touch pad 31 are stacked and positioned between the substrate 20 and the touch pad 31. The touch pad 31 is used for touch operations by a user's finger. For example, a user's finger can slide or press on the touch pad 31. The circuit board 33 can respond to the user's finger sliding or gesture on the touch pad 31 to generate functions such as scrolling, zooming in, zooming out, or opening windows. Alternatively, the circuit board 33 can respond to the user's finger pressing or double-clicking on the touch pad 31 to generate functions such as selection or displaying a menu.

In some embodiments, the touch panel 31 may be made of glass or mylar. The circuit board 33 may be a conventional printed circuit board (PCB) or a rigid-flex PCB.

As shown in FIG2 , the touch panel 31 has a first surface 32 facing the top surface 21 of the substrate 20. The first surface 32 includes a central region 321 and a peripheral region 322. FIG2 shows a dotted line clearly demarcating the boundary between the central region 321 and the peripheral region 322. As will be noted, the dotted line is not a solid line. In this embodiment, the peripheral region 322 surrounds the central region 321 and corresponds to the multiple side edges 311 and multiple corners 312 of the touch panel 31.

As shown in FIG. 2 , in this embodiment, the touch panel 31 and its first surface 32 are rectangular, and the middle area 321 of the first surface 32 is also rectangular. However, this is not limiting. In some embodiments, the first surface 32 and the middle area 321 may also have other shapes, depending on actual product requirements.

As shown in Figure 2, circuit board 33 has a second surface 34 that faces first surface 32 of touch panel 31. Adhesive layer 35 is located between touch panel 31 and circuit board 33 to connect them. Adhesive layer 35 includes a first adhesive layer 38 and a second adhesive layer 39. First adhesive layer 38 and second adhesive layer 39 are localized regions of adhesive layer 35 at different locations. In some embodiments, adhesive layer 35 may be a film with a specific shape. As shown in Figure 2, first adhesive layer 38 and second adhesive layer 39 are each represented by different fill lines to clearly define their boundaries (the same applies to Figures 6 and 8-19). In this embodiment, the second adhesive layer 39 is annular and surrounds the first adhesive layer 38. The first adhesive layer 38 is a light-curing adhesive layer and is in a cured state. The second adhesive layer 39 is connected to the outer area 322 of the touch panel 31 and the second surface 34 of the circuit board 33. The viscosity of the second adhesive layer 39 is greater than that of the first adhesive layer 38.

In some embodiments, the first adhesive layer 38 contains a photoinitiator or a photosensitizer, wherein the photoinitiator or photosensitizer can react when exposed to specific light (e.g., ultraviolet light, infrared light, or visible light), causing the entire first adhesive layer 38 to be cured from an uncured state to the cured state. For example, the first adhesive layer 38 can be an ultraviolet light-curable adhesive layer. When the first adhesive layer 38 is exposed to ultraviolet light, it can react from an uncured state to a cured state. When the first adhesive layer 38 is in the cured state, the viscosity of the first adhesive layer 38 will decrease (e.g., the viscosity will be reduced by at least half), and the rigidity will be relatively improved.

As can be seen from the aforementioned properties of the photocurable adhesive layer, if the entire adhesive layer 35 is a cured photocurable adhesive layer, it will at least cause the adhesion between the touch panel 31 and the circuit board 33 in the surrounding area (such as the portion corresponding to the outer area 322) to decrease, so that the adhesive is likely to delaminate when the touch panel 30 is subjected to force. Therefore, the touch panel device 1 of the present embodiment has a first adhesive layer 38 of the adhesive layer 35 that is a cured light-curing adhesive layer that is bonded to the middle region 321 of the touch panel 31 and the second surface 34 of the circuit board 33. This allows the touch panel 31 and the circuit board 33 to be bonded together with improved flatness and a thinner profile. Furthermore, the cured first adhesive layer 38 provides greater rigidity to prevent the corners of the touch panel 30 from shaking, bending, or excessive idle travel when pressure is applied. Furthermore, the second adhesive layer 39 of the adhesive layer 35, which has a higher viscosity, is bonded to the outer area 322 of the touch panel 31 and the second surface 34 of the circuit board 33, thereby preventing the adhesive from delaminating around the touch panel 30 due to stress. Therefore, the configuration of the adhesive layer 35 improves both the rigidity and bonding strength of the touch panel 30.

In some embodiments, the second adhesive layer 39 may be a photocurable adhesive layer and integrally connected to the first adhesive layer 38. In addition, the second adhesive layer 39 is in an uncured state, which means that the photoinitiator or photosensitizer of the second adhesive layer 39 has not been irradiated with specific light and has not yet reacted and cured. Therefore, the viscosity of the second adhesive layer 39 will be greater than the viscosity of the first adhesive layer 38. For example, the viscosity of the second adhesive layer 39 is more than twice the viscosity of the first adhesive layer 38.

In some embodiments, the second rubber layer 39 may be a non-photocurable rubber layer having a viscosity greater than that of the first rubber layer 38. For example, the second rubber layer 39 may be a resin rubber or an acrylic rubber.

As shown in Figure 2 , in this embodiment, the area of the central region 321 of the first surface 32 of the touch panel 31 is larger than the area of the peripheral region 322. This allows the first adhesive layer 38 of the adhesive layer 35 to cover a larger area than the second adhesive layer 39, further enhancing the rigidity of the bond between the touch panel 31 and the circuit board 33. In other embodiments, the area of the central region 321 of the first surface 32 of the touch panel 31 may be equal to or smaller than the area of the peripheral region 322.

As shown in Figure 2 , in this embodiment, a resilient member 211 is disposed between the circuit board 33 and the top surface 21 of the substrate 20. For example, the resilient member 211 can be an elastic member such as a rubber dome, a metal dome, a plastic dome, a spring, or a spring. This member maintains the touch panel 30 at a certain height while maintaining a distance from the substrate 20. Consequently, when the touch panel 30 is compressed and lowered relative to the substrate 20, the resilient member 211 is compressed, triggering a signal in the circuit board 33. When the touch panel 30 is released, the accumulated elastic force of the resilient member 211 causes it to rise and return to the aforementioned height.

FIG3 is a flowchart of a method for manufacturing a touch panel device according to an embodiment of the present invention. The method for manufacturing the touch panel device 1 according to the embodiment of the present invention includes steps S01 to S05. The hardware structure mentioned below can refer to the embodiments disclosed in FIG2 and FIG4 to FIG8, but is not intended to limit the present invention.

As shown in Figure 3, in step S01, a first plate and a second plate are prepared, one of which is a touch panel 31 and the other is a circuit board 33. Please refer to Figure 4, which is a schematic assembly diagram of an embodiment of the touch panel device of the present invention. In this embodiment, the first plate is the aforementioned touch panel 31 and has a first surface 32, which includes a central area 321 and an outer area 322.

As shown in Figure 3, after step S01, step S02 can proceed: attaching an adhesive layer 35 to the first surface 32 of the first plate (here, the touch panel 31). For example, referring to Figure 4, in step S02, the adhesive layer 35 can be a light-curing adhesive layer and be in an uncured state. For example, the adhesive layer 35 can be a UV-curing adhesive layer, and the adhesive layer 35 has not yet been exposed to UV light and is in an uncured state. Furthermore, the adhesive layer 35 has a central region 36 and a peripheral region 37. In Figure 4, the boundary between the central region 36 and the peripheral region 37 is clearly demarcated by a dotted line; however, the dotted line is not a solid line. In this embodiment, the outer block 37 surrounds the middle block 36. When the adhesive layer 35 is attached to the first surface 32 of the touch panel 31, the outer block 37 corresponds to the outer area 322 of the first surface 32, and the middle block 36 corresponds to the middle area 321 of the first surface 32.

As shown in Figure 3 , after step S02 , step S03 can proceed: light is emitted from the light emitting element 40 to illuminate the adhesive layer 35 . For example, when the adhesive layer 35 is a UV-curable adhesive layer, the light emitted by the light emitting element 40 is UV light. Please refer to Figure 5 , which is an assembly diagram following Figure 4 . In step S03 , the light emitted by the light emitting element 40 can illuminate the middle section 36 of the adhesive layer 35 but not the outer section 37 . For example, a light shielding member 60 can be placed between the outer section 37 of the adhesive layer 35 and the light emitting element 40, so that the light emitted by the light emitting element 40 illuminates only the middle section 36 of the adhesive layer 35 .

Continuing with the above, as shown in Figure 5 , in this embodiment, the light shielding member 60 is an annular, opaque plate that blocks the area between the outer region 37 of the adhesive layer 35 and the light-emitting element 40. Therefore, light emitted by the light-emitting element 40 can pass through the hollow area surrounded by the light shielding member 60 and illuminate only the central region 36 of the adhesive layer 35. To illustrate this, please compare Figures 5 and 6 . Figure 6 is a plan view of the first embodiment of the light shielding member of the present invention. The light shielding member 60 in Figure 6 is presented in a transparent manner, clearly showing the area blocked by the light shielding member 60 (the same applies to Figures 9 , 11 , 13 , and 15 ). In this embodiment, since the middle area 36 of the adhesive layer 35 is exposed to light, the middle area 36 begins to react and gradually transforms from an uncured state to a cured state. Conversely, since the outer area 37 of the adhesive layer 35 is shielded by the light shielding member 60 and is not exposed to light, the outer area 37 does not react and remains in an uncured state.

As shown in Figure 3, after step S03, step S04 can be performed: the second surface 34 of the second board is attached to the adhesive layer 35 using a tool 50. Referring to Figure 7, which is a schematic assembly diagram following Figure 5, in step S04, the second board can be the aforementioned circuit board 33 and has a second surface 34. Before the middle region 36 of the adhesive layer 35 reacts and solidifies, the second surface 34 of the circuit board 33 is quickly attached to the adhesive layer 35 using a tool 50 (e.g., a robotic arm). The tool 50 can further apply pressure to the circuit board 33, pressing the circuit board 33 against the adhesive layer 35 for a better bonding effect. It should be noted that since both the touch panel 31 and the circuit board 33 are non-transparent plates, during the manufacturing process of the touch panel device 1, the adhesive layer 35 must first be illuminated by the light emitting element 40 (as in the aforementioned step S03) before the circuit board 33 is attached to the adhesive layer 35 (as in the aforementioned step S04).

As shown in FIG3, after step S04, step S05 can be performed: the adhesive layer 35 forms a first adhesive layer 38 and a second adhesive layer 39. Please compare FIG2, FIG5 and FIG8. FIG8 is a three-dimensional diagram of the first embodiment of the touch panel of the present invention. The circuit board 33 in FIG8 is presented in a perspective manner so that the different adhesive layers of the adhesive layer 35 can be clearly seen. In step S05, the middle block 36 of the adhesive layer 35 is transformed into a solidified state after being irradiated by light to form the first adhesive layer 38 (such as the oblique line filled area in FIG8). The first adhesive layer 38 is connected to the first adhesive layer 38. The adhesive layer 35 is attached to the middle area 321 of the touch panel 31 and the second surface 34 of the circuit board 33. The outer area 37 of the adhesive layer 35 is not exposed to light, forming a second adhesive layer 39 (as shown in the dotted fill area in Figure 8). The second adhesive layer 39 is connected to the outer area 322 of the touch panel 31 and the second surface 34 of the circuit board 33, bonding the touch panel 31 and the circuit board 33 to form the touch panel 30.

In some embodiments, during step S03, the light shielding member 60 may further block the area between the local middle block 36 of the adhesive layer 35 and the light emitting member 40, allowing the second adhesive layer 39 to further contact the local middle area 321 of the touch panel 31. The light shielding member 60 may have various embodiments, which are described below with reference to the accompanying drawings.

Figure 9 is a plan view of the second embodiment of the light shielding element of the present invention, and Figure 10 is a perspective view of the second embodiment of the touch panel of the present invention. Comparing Figures 3 and 9, the light shielding element 60a of this embodiment comprises an annular plate 61a and a connecting plate 65a. The annular plate 61a has an inner periphery 62a, which has two opposing long sides 621a and two opposing short sides 622a. The connecting plate 65a connects between the two long sides 621a. In step S03, the annular plate 61a of the light shielding member 60a blocks the light emitting member 40 from the outer peripheral area 37 of the adhesive layer 35a, and the connecting plate 65a of the light shielding member 60a blocks the light emitting member 40 from the partial middle area 36 of the adhesive layer 35a. Comparing Figures 3 and 10 , in step S05, the blocked local middle region 36 of the adhesive layer 35a is not exposed to light, allowing the first adhesive layer 38a (as indicated by the hatched area in Figure 10 ) to adhere to the local middle region 321 of the touch panel 31. Furthermore, the second adhesive layer 39a (as indicated by the dotted area in Figure 10 ), which has a higher viscosity, not only adheres to the outer region 322 of the touch panel 31 but also adheres to the local middle region 321 of the touch panel 31. This improves the bonding strength between the middle region 321 of the touch panel 31 and the second surface 34 of the circuit board 33, preventing debonding in the middle region 321 of the touch panel 31.

Figure 11 is a plan view of a third embodiment of the light shielding element of the present invention, and Figure 12 is a perspective view of a third embodiment of the touch panel of the present invention. Comparing Figures 3 and 11 , the light shielding element 60b of this embodiment similarly comprises an annular plate 61b and a connecting plate 65b. The inner circumference 62b of the annular plate 61b has two opposing long sides 621b and two opposing short sides 622b, with the connecting plate 65b connected between the two short sides 622b. In step S03, the annular plate 61b of the light shielding element 60b blocks the light emitting element 40 from the outer peripheral region 37 of the adhesive layer 35b, while the connecting plate 65b of the light shielding element 60b blocks the light emitting element 40 from the partial middle region 36 of the adhesive layer 35b. Comparing Figures 3 and 12 , in step S05 , the blocked local middle region 36 of the adhesive layer 35b is not exposed to light. This allows the first adhesive layer 38b (as indicated by the hatched area in Figure 12 ) to adhere to the local middle region 321 of the touch panel 31 . Furthermore, the second adhesive layer 39b (as indicated by the dotted area in Figure 12 ) with higher viscosity not only adheres to the outer region 322 of the touch panel 31 but also to the local middle region 321 of the touch panel 31 , thereby enhancing the bonding strength between the middle region 321 of the touch panel 31 and the second surface 34 of the circuit board 33 .

Figure 13 is a plan view of a fourth embodiment of the light shielding element of the present invention, and Figure 14 is a perspective view of a fourth embodiment of the touch panel of the present invention. Comparing Figures 3 and 13 , the light shielding element 60c of this embodiment comprises an annular plate 61c and two connecting plates 65c. The inner periphery 62c of the annular plate 61c has two opposing long sides 621c and two opposing short sides 622c. One connecting plate 65c connects between the two short sides 622c, and the other connecting plate 65c connects between the two long sides 621c. In step S03, the annular plate 61c of the light shielding member 60c blocks the light emitting member 40 from the outer peripheral area 37 of the adhesive layer 35c, and the two connecting plates 65c of the light shielding member 60c blocks the light emitting member 40 from the partial middle area 36 of the adhesive layer 35c. Comparing Figures 3 and 14 , in step S05, the blocked local middle region 36 of the adhesive layer 35c is not exposed to light. This allows the first adhesive layer 38c (as indicated by the hatched area in Figure 14 ) to adhere to the local middle region 321 of the touch panel 31. Furthermore, the second adhesive layer 39c (as indicated by the dotted area in Figure 14 ) with higher viscosity not only adheres to the outer region 322 of the touch panel 31 but also adheres to the local middle region 321 of the touch panel 31, thereby enhancing the bonding strength between the middle region 321 of the touch panel 31 and the second surface 34 of the circuit board 33.

Figure 15 is a plan view of the fifth embodiment of the light shielding element of the present invention, and Figure 16 is a perspective view of the fifth embodiment of the touch panel of the present invention. Comparing Figures 3 and 15 , the light shielding element 60d of this embodiment comprises an annular plate 61d and four connecting plates 65d. The inner periphery 62d of the annular plate 61d has two opposing long sides 621d and two opposing short sides 622d. The four connecting plates 65d extend from the two long sides 621d and the two short sides 622d, respectively. In step S03, the annular plate 61d of the light shielding member 60d blocks the outer area 37 of the adhesive layer 35d and the light emitting element 40, and the four connecting plates 65d of the light shielding member 60d blocks the middle area 36 of the adhesive layer 35d and the light emitting element 40. Comparing Figures 3 and 16 , in step S05 , the blocked local middle region 36 of the adhesive layer 35d is not exposed to light. This allows the first adhesive layer 38d (as indicated by the hatched area in Figure 16 ) to adhere to the local middle region 321 of the touch panel 31 . Furthermore, the second adhesive layer 39d (as indicated by the dotted area in Figure 16 ) with higher viscosity not only adheres to the outer region 322 of the touch panel 31 but also adheres to the local middle region 321 of the touch panel 31 , thereby enhancing the bonding strength between the middle region 321 of the touch panel 31 and the second surface 34 of the circuit board 33 .

Figure 17 is a perspective view of a sixth embodiment of the light shielding member of the present invention, and Figure 18 is a perspective view of a sixth embodiment of the touch panel of the present invention. In some embodiments, during step S03, the light shielding member 60 may only block the area between the partial peripheral region 37 of the adhesive layer 35 and the light-emitting element 40, allowing the first adhesive layer 38 to further contact the partial peripheral region 322. For example, comparing Figures 3 and 17, the light shielding member 60e of this embodiment is a transparent plate, and the four corners of the light shielding member 60e are respectively provided with light-shielding regions 66. In step S03 , the four light-shielding regions 66 of the light-shielding element 60 e only block the area between the partial peripheral block 37 of the adhesive layer 35 (here, the four corner areas of the peripheral block 37 ) and the light-emitting element 40 . Therefore, please compare Figures 3 and 18. In step S05, the unobstructed local peripheral area 37 of the adhesive layer 35e is exposed to light, allowing the first adhesive layer 38e (such as the area with the diagonal fill line in Figure 18) to connect to the local middle area 321 of the touch panel 31, and further connect to the local peripheral area 322 of the touch panel 31. The second adhesive layer 39e with higher viscosity (such as the area with the dotted fill line in Figure 18) only connects to the four corners of the peripheral area 322 of the touch panel 31, thereby increasing the coverage area of the first adhesive layer 38e and further improving the overall rigidity of the touch panel 30.

FIG19 is a perspective view of another embodiment of the adhesive layer of the present invention. Comparing FIG3 with FIG19 , in step S02, the middle region 36' of the adhesive layer 35f can be an uncured light-curing adhesive layer, while the outer regions 37' are made of a non-light-curing adhesive layer having a higher viscosity than the middle region 36'. Consequently, in step S03, when light from the light-emitting element 40 illuminates the adhesive layer 35, the outer regions 37' of the adhesive layer 35f do not react and cure. Consequently, a separate light-blocking element 60 is not required to block the light during the manufacturing process, resulting in a simplified manufacturing process.

Although the technical contents of the present invention have been disclosed above with reference to the preferred embodiments, they are not intended to limit the present invention. Any slight changes and modifications made by anyone skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

N: Laptop 1: Touchpad device 20: Substrate 21: Top surface 211: Elastic return element 30: Touch panel 31: Touch pad 311: Side 312: Corner 32: First surface 321: Middle area 322: Peripheral area 33: Circuit board 34: Second surface 35, 35a-35f: Adhesive layer 36, 36': Middle area 37, 37': Peripheral area 38, 38a-38e: First adhesive layer 39, 39a-39e: Second adhesive layer 40: Light-emitting element 50: Tool 60, 60a-60e: Light-shielding element 61a-61d: Ring plate 62a-62d: Inner ring 621a-621d: Long side 622a-622d: Short side 65a-65d: Connecting plate 66: Light-shielding area S01-S05: Steps

Figure 1 is a schematic diagram illustrating an application of a touch panel device according to an embodiment of the present invention. Figure 2 is an exploded perspective view of a touch panel device according to an embodiment of the present invention. Figure 3 is a flow chart illustrating the steps of a method for manufacturing a touch panel device according to an embodiment of the present invention. Figure 4 is a schematic diagram illustrating the assembly of a touch panel device according to an embodiment of the present invention. Figure 5 is a schematic diagram following Figure 4. Figure 6 is a plan view of a first embodiment of a light shielding element according to the present invention. Figure 7 is a schematic diagram following Figure 5. Figure 8 is a perspective view of a first embodiment of a touch panel according to the present invention. Figure 9 is a plan view of a second embodiment of a light shielding element according to the present invention. Figure 10 is a perspective view of a second embodiment of a touch panel according to the present invention. Figure 11 is a plan view of a third embodiment of a light shielding member of the present invention. Figure 12 is a perspective view of a third embodiment of a touch panel of the present invention. Figure 13 is a plan view of a fourth embodiment of a light shielding member of the present invention. Figure 14 is a perspective view of a fourth embodiment of a touch panel of the present invention. Figure 15 is a plan view of a fifth embodiment of a light shielding member of the present invention. Figure 16 is a perspective view of a fifth embodiment of a touch panel of the present invention. Figure 17 is a perspective view of a sixth embodiment of a light shielding member of the present invention. Figure 18 is a perspective view of a sixth embodiment of a touch panel of the present invention. Figure 19 is a perspective view of another embodiment of an adhesive layer of the present invention.

1: Touchscreen assembly 20: Substrate 21: Top surface 211: Elastic return element 30: Touch panel 31: Touch pad 311: Side 312: Corner 32: First surface 321: Middle area 322: Peripheral area 33: Circuit board 34: Second surface 35: Adhesive layer 38: First adhesive layer 39: Second adhesive layer

Claims (15)

A method for manufacturing a touch panel device includes: (a) preparing a first plate and a second plate, wherein the first plate has a first surface, the first surface having a middle area and a peripheral area, the peripheral area surrounding the middle area, and the second plate has a second surface, and one of the first plate and the second plate is a touch panel and the other is a circuit board; (b) attaching an adhesive layer to the first surface of the first plate; (c) irradiating the adhesive layer with a light emitting element; (d) attaching the second surface of the second plate to the adhesive layer using a tool; and (e) The adhesive layer forms a first adhesive layer and a second adhesive layer. The first adhesive layer is a light-curing adhesive layer that is converted into a cured state and is in an uncured state. The second adhesive layer is in contact with the outer region and the second surface, and the viscosity of the second adhesive layer is greater than that of the first adhesive layer. A method for manufacturing a touch panel device as described in claim 1, wherein the adhesive layer in step (b) has a middle block and a peripheral block, the peripheral block surrounds the middle block, and the position of the peripheral block corresponds to the position of the peripheral area, and the position of the middle block corresponds to the position of the middle area; the step (c) further includes: blocking with a light-shielding member between the peripheral block and the light-emitting member; and the step (e) further includes: the middle block forms the first adhesive layer, and the peripheral block forms the second adhesive layer. The manufacturing method of the touch panel device as described in claim 2, wherein the shading member in the step (c) further blocks the portion between the middle block and the light-emitting member, and the second adhesive layer in the step (e) further contacts the portion of the middle area. The manufacturing method of the touch panel device as described in claim 2, wherein the shading member in the step (c) only blocks the area between the partial peripheral block and the light-emitting member, and the first adhesive layer in the step (e) further contacts the partial peripheral area. A method for manufacturing a touch panel device as described in claim 4, wherein the outer block of the adhesive layer in the step (b) has four corner blocks, the light-shielding member in the step (c) only blocks between the corner blocks and the light-emitting member, and the second adhesive layer in the step (e) only contacts the four corners of the outer area. A method for manufacturing a touch panel device includes: (a) preparing a first plate and a second plate, wherein the first plate has a first surface, the first surface having a middle area and a peripheral area, the peripheral area surrounding the middle area, and the second plate has a second surface, and one of the first plate and the second plate is a touch panel and the other is a circuit board; (b) attaching an adhesive layer to the first surface of the first plate; (c) irradiating the adhesive layer with a light emitting element; (d) attaching the second surface of the second plate to the adhesive layer using a tool; and (e) The adhesive layer forms a first adhesive layer and a second adhesive layer. The first adhesive layer is connected to the middle area and the second surface, and the first adhesive layer is a light-curing adhesive layer and is converted into a solidified state. The second adhesive layer is connected to the outer area and the second surface, and the viscosity of the second adhesive layer is greater than the viscosity of the first adhesive layer. The second adhesive layer in step (e) is a non-light-curing adhesive layer. The method for manufacturing a touch panel device as described in claim 1 or 6, wherein the area of the middle region in step (a) is larger than the area of the outer region. A touch panel device includes: a substrate having a top surface; and a touch panel disposed above the top surface of the substrate, the touch panel including: a touch plate having a first surface, the first surface having a central region and a peripheral region, the peripheral region surrounding the central region; a circuit board having a second surface, the circuit board and the touch plate being stacked on each other, with the second surface facing the first surface; and an adhesive layer located between the touch panel and the circuit board, the adhesive layer comprising a first adhesive layer and a second adhesive layer, the first adhesive layer being in contact with the middle region and the second surface, the first adhesive layer being a photocurable adhesive layer in a cured state, the second adhesive layer being in an uncured state, the second adhesive layer being in contact with the outer region and the second surface, and the viscosity of the second adhesive layer being greater than that of the first adhesive layer. The touch panel device of claim 8, wherein the first adhesive layer and the second adhesive layer are integrally connected to each other. The touch panel device as described in claim 8, wherein the second adhesive layer is annular and surrounds the first adhesive layer. A touch panel device includes: a substrate having a top surface; and a touch panel disposed above the top surface of the substrate, the touch panel including: a touch plate having a first surface, the first surface having a middle area and a peripheral area, the peripheral area surrounding the middle area; a circuit board having a second surface, the circuit board and the touch plate being stacked on each other, the second surface facing the first surface. and an adhesive layer located between the touch panel and the circuit board, the adhesive layer comprising a first adhesive layer and a second adhesive layer, the first adhesive layer being in contact with the middle region and the second surface, the first adhesive layer being a light-curing adhesive layer and being in a cured state, the second adhesive layer being in contact with the outer region and the second surface, and the viscosity of the second adhesive layer being greater than that of the first adhesive layer, wherein the second adhesive layer is a non-light-curing adhesive layer. The touch panel device of claim 8 or 11, wherein the area of the middle region is larger than the area of the outer region. The touch panel device as described in claim 8 or 11, wherein the first adhesive layer is further connected to the local peripheral area. The touch panel device as described in claim 8 or 11, wherein the second adhesive layer is further connected to the local middle area. The touch panel device as claimed in claim 8 or 11, wherein the second adhesive layer is only attached to the four corners of the peripheral area.