TWI893628B - How to clean the baseboard - Google Patents

Abstract

A method for cleaning a substrate includes: placing a substrate having at least one solder pad on it, filling a liquid material between the substrate and the solder pad so that the liquid material covers the substance to be cleaned on the substrate, placing the substrate containing the liquid material in a chamber, controlling the chamber temperature to between 25°C and 200°C, and using a pressure increasing and decreasing device and/or a vacuum generator to generate gas in the chamber. Oscillatory pressure increase and decrease and/or oscillatory vacuuming utilizes gas pressure differential fluctuations to cause changes in the liquid material. The pressure differential fluctuations include pressure differential fluctuations under vacuum, pressure differential fluctuations from high pressure to 1 atmosphere, or pressure differential fluctuations from high pressure to vacuum. The gas pressure differential fluctuations cause the liquid material to be scrubbed by the pressure differential fluctuations, removing the material to be cleaned from the contact plate.

Description

How to clean the baseboard

The present invention provides a technical field for soleplate cleaning, and more particularly, a method for cleaning soleplates, wherein the method utilizes a liquid material in combination with an oscillating airflow pressure differential to drive the liquid material to rub or stir, thereby improving the efficiency of residue cleaning.

Advanced semiconductor manufacturing often requires the use of adhesives to bond materials. This is especially true for metal bonding. Some adhesives are often highly acidic and corrosive, effectively removing the dense oxide layer formed on the bonding surface. However, the corrosive nature of these adhesives can severely impact the performance of microelectronic components. Therefore, a cleaning step is necessary to remove any adhesive residue or residues from reactions between the adhesive and the metal oxide. Some adhesives also leave behind organic matter, leaving a layer of oil on the bonding surface. This oil also requires a cleaning step to prevent subsequent reliability issues for the semiconductor component. However, as the circuitry on the substrate becomes denser, the bumps used for bonding on the substrate become smaller, or the gap between the substrate and the solder pad becomes narrower, these residues become increasingly difficult to clean. If the corrosive adhesive remaining in the substrate or joints is not completely removed, it will significantly reduce component reliability. Furthermore, the current common method of using cleaning solvents to clean these residues can have an impact on the environment if not handled properly.

Therefore, in response to the above-mentioned problems in the cleaning of advanced semiconductor component manufacturing, how to develop a more ideal, practical and economical method for cleaning the substrate is what consumers are eagerly looking forward to. It is also the goal and direction that related industries must strive to research and develop breakthroughs.

In light of this, the inventor, drawing upon years of experience in the manufacturing, development, and design of related products, has, after careful design and careful evaluation, ultimately arrived at the present invention, which is truly practical, with the aforementioned objectives in mind.

The primary objective of the present invention is to provide a method for cleaning substrates. The method utilizes a liquid material that covers the substrate to be cleaned, places the substrate in a chamber, raises the temperature, and applies a pulsating airflow pressure differential to drive the liquid material to rub or stir, thereby enhancing the residue cleaning efficiency.

To achieve the above-mentioned object, the present invention provides a method for cleaning a substrate, comprising: welding at least one soldering piece to a substrate, filling a liquid material between the substrate and the soldering piece to cover the surface of the substrate to be cleaned; placing the substrate containing the liquid material in a chamber, controlling the chamber temperature to between 25°C and 200°C, and using a high-pressure pressure increasing and decreasing device and/or a low-pressure vacuum generator to generate a pressure differential variable airflow, thereby controlling the pressure differential variation of the gas in the chamber to cause the liquid material to change. The pressure differential fluctuations can generate a wave-like pressure change, which produces a frictional cleaning effect, or accelerates the dissolution of the substance to be cleaned in the liquid material. This is like adding sugar to water and applying agitation to accelerate the dissolution of the sugar. The pressure differential fluctuations include pressure differential fluctuations under vacuum, pressure differential fluctuations from high pressure to 1 atmosphere, or pressure differential fluctuations from high pressure to vacuum. The pressure differential fluctuations of the gas are used to cause the liquid material to fluctuate, and the liquid material in contact with the substance to be cleaned generates greater energy through friction and scrubbing brought about by the pressure differential fluctuations, thereby removing the substance to be cleaned attached to the base plate from the base plate and the liquid material. Furthermore, controlling the chamber temperature within the aforementioned chamber to between 25°C and 200°C will cause the existing grease film, a portion of the material to be cleaned, or moisture adsorbed within the substrate to evaporate due to heat, generating gas. By utilizing the aforementioned pressure differential changes under vacuum, from high pressure to 1 atmosphere, or from high pressure to vacuum, the pressure differential changes of the gas can be used to cause changes in the liquid material, thereby discharging the gas from the liquid material.

The techniques, means and effects employed in the present invention are described in detail below with reference to a preferred embodiment and accompanying drawings. It is believed that the above-mentioned objectives, structures and features of the present invention can be thoroughly and specifically understood from the embodiments.

The present invention provides a method for cleaning a soleplate.

To help you gain a deeper understanding of the purpose, features, and efficacy of this invention, we hereby provide a detailed description of its implementation and accompanying diagrams as follows:

Referring to FIG. 1 , the present invention provides a method for cleaning a baseboard, the steps of which include:

(a) Welding the soldering pad 10a: Welding at least one soldering pad to a connecting base plate;

(b) Covering liquid material 20a: filling a liquid material between the connecting substrate and at least one of the solder pads to cover a substance to be cleaned on the connecting substrate;

(c) placing in a chamber 30a: placing the substrate containing the liquid material in a chamber;

(d) Controlling the chamber temperature 40a: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is adjusted to match the viscosity of the liquid material and is between 25°C and 200°C to increase the fluidity of the liquid material;

(e) Oscillating pressure difference change cleaning 50a: A vacuum generator is used to generate an oscillating low-pressure control on the gas in the chamber, so that the gas molecules in the chamber generate a pressure difference change airflow, which is a pressure difference change under low pressure, ranging from a maximum value of no more than 1 atmosphere to a minimum value of ^10-5 atmosphere. The vacuum generator is used to perform an oscillating vacuum suction and release on the low-pressure gas in the chamber, and the gas change generated causes the change of the liquid material. The liquid material exists in at least one of the soldering sheet and the bottom plate, because the capillary force between them and the surface tension of the liquid material can pull the liquid material to not overflow even when a larger change occurs, so that this is the same as the liquid material. The liquid material in contact with the cleaning material generates greater energy through friction and scrubbing due to the pressure differential fluctuation, effectively removing the cleaning material from the connecting plate and the liquid material, achieving a cleaning effect that cannot be achieved by traditional solution cleaning. The pressure differential fluctuation of the gas induces the liquid material to fluctuate, which can reduce direct energy transfer and alleviate damage to the object caused by excessive fluctuation or splashing of the liquid material.

In the method for cleaning a substrate, the substance to be cleaned may be flux, flux residue, oil, grease, photoresist, or products produced during the manufacturing process.

In the method for cleaning a base plate, the liquid material may be a base glue, which may contain hard particles. The hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect, thereby helping to clean the material to be removed.

Referring to FIG. 2 , the present invention provides another method for cleaning a floor, the steps of which include:

(a) Welding the soldering tabs 10b: Soldering at least one soldering tab to a connecting substrate;

(b) Covering liquid material 20b: filling a liquid material between the connecting substrate and at least one of the solder pads to cover a substance to be cleaned on the connecting substrate;

(c) placing in a chamber 30b: placing the substrate containing the liquid material in a chamber;

(d) Controlling the chamber temperature 40b: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is adjusted to match the viscosity of the liquid material and is between 25°C and 200°C to increase the fluidity of the liquid material;

(e) Oscillating pressure difference change cleaning 50b: A pressure increasing and decreasing device and a vacuum generator are used to generate an oscillating high pressure increase and decrease and an oscillating low pressure vacuum in the gas in the chamber, so that the gas molecules in the chamber generate a pressure difference change airflow, which is the pressure difference change of the gas molecules generated by the oscillating high pressure of the pressure increasing and decreasing device and the oscillating low pressure of the vacuum generator, ranging from a maximum of 50 atmospheres to a minimum of 10 ^-5 atmospheres, the pressure difference changes in the oscillating gas molecules by the high pressure of the pressure increasing and decreasing device and the low pressure of the vacuum generator, causing the change of the liquid material. The liquid material exists in at least one of the welding pieces and the bottom plate. Because of the capillary force between them and the surface tension of the liquid material, the liquid material will not overflow even when a larger change occurs, so that this is consistent with the The liquid material in contact with the cleaning material is scrubbed by friction due to the greater energy generated by the pressure differential fluctuation. This effectively removes the cleaning material from the connecting plate and the liquid material, achieving a cleaning effect that cannot be achieved by traditional solution cleaning. The liquid material is induced to move by the pressure differential fluctuation of the gas, which can reduce direct energy transfer and mitigate damage to the object caused by excessive movement or splashing of the liquid material.

In the method for cleaning a substrate, the substance to be cleaned may be flux, flux residue, oil, grease, photoresist, or products produced during the manufacturing process.

In the method for cleaning a base plate, the liquid material may be a base glue, which may contain hard particles. The hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect, thereby helping to clean the material to be removed.

Referring to FIG. 3 , the present invention provides another method for cleaning a floor, the steps of which include:

(a) Welding the soldering tabs 10c: Soldering at least one soldering tab to a connecting substrate;

(b) Covering liquid material 20c: filling a liquid material between the connecting substrate and at least one of the solder pads to cover a substance to be cleaned on the connecting substrate;

(c) placing in a chamber 30c: placing the substrate containing the liquid material in a chamber;

(d) Controlling the chamber temperature 40c: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is adjusted to match the viscosity of the liquid material and is between 25°C and 200°C to increase the fluidity of the liquid material;

(e) Oscillating pressure differential change cleaning 50c: A pressure increasing and decreasing device is used to generate an oscillating pressure increase and decrease on the gas in the chamber, so that the gas molecules in the chamber generate a pressure differential change airflow, which is a pressure differential change from high pressure to 1 atmosphere, and the range is between a maximum of 50 atmospheres and a minimum of 1 atmosphere. The oscillating pressure differential change of the high-pressure gas by the pressure increasing and decreasing device causes the liquid material to change. The liquid material existing in at least one of the soldering pieces and the bottom plate is subjected to a capillary force with the liquid material. The surface tension of the gas can pull the liquid material to avoid overflow even under greater fluctuations. The liquid material in contact with the cleaning material is subjected to frictional scrubbing caused by the greater energy generated by the pressure differential fluctuation. This effectively removes the cleaning material attached to the connecting plate and the liquid material, achieving a cleaning effect that cannot be achieved by traditional solution cleaning. The liquid material is pulled into motion by the pressure differential fluctuation of the gas, which can reduce direct energy transfer and alleviate damage to the object caused by excessive fluctuation or splashing of the liquid material.

In the method for cleaning a substrate, the substance to be cleaned may be flux, flux residue, oil, grease, photoresist, or products produced during the manufacturing process.

In the method for cleaning a base plate, the liquid material may be a base glue, which may contain hard particles. The hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect, thereby helping to clean the material to be removed.

Referring to FIG. 4 , the present invention provides another method for cleaning a baseboard, the steps of which include:

(a) Welding the soldering tabs 10d: Soldering at least one soldering tab to a connecting substrate;

(b) Covering with liquid material 20d: filling a liquid material between the connecting substrate and at least one of the solder pads to cover a substance to be cleaned on the connecting substrate;

(c) placing in a chamber 30d: placing the substrate containing the liquid material in a chamber;

(d) Controlling the chamber temperature 40d: Controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is adjusted to match the viscosity of the liquid material and is between 25° C. and 200° C. to increase the fluidity of the liquid material;

(e) Physical dissolution cleaning 50d: A pressurizing device is used to generate a predetermined pressure within the chamber, ranging from a maximum of 50 atmospheres to a minimum of 1 atmosphere. The physical dissolution generated by the contact between the filled liquid material and the material to be cleaned dissolves the material to be cleaned attached to the substrate in the liquid material. The predetermined temperature and the concentration gradient after dissolution generate a diffusion force to remove the material to be cleaned attached to the substrate from the substrate and the liquid material, achieving a cleaning effect that cannot be achieved by traditional solution cleaning.

In the method for cleaning a substrate, the substance to be cleaned may be flux, flux residue, oil, grease, photoresist, or products produced during the manufacturing process.

The present invention places a substrate containing the material to be cleaned in a chamber and covers it with a liquid material. Fluctuations in gas pressure differentials cause the liquid material to fluctuate. This pressure differential generates greater energy, causing frictional scrubbing in the liquid material in contact with the material to be cleaned. This friction removes the material from the substrate and the liquid material, achieving a cleaning effect unattainable with traditional solution cleaning methods. Furthermore, the pressurized environment increases the number of gas molecules, increasing gas density and viscosity, and thus increasing the inherent pressure within the liquid material, enhancing cleaning effectiveness. It also mitigates shock waves injected into the gas and gravitational waves extracted from the gas, minimizing adverse effects.

As can be seen from the above, the present invention's method for cleaning substrates is truly the first of its kind in the industry and meets the novelty requirement for an invention patent. Its comprehensive innovative design also meets the advancement requirement for an invention patent. The method utilizes a liquid material that fills the space between the solder pad and the substrate, covering the material to be cleaned on the substrate. The liquid material is placed in a chamber and utilizes its own surface tension, as well as capillary forces between the substrate and the solder pad on the substrate. By increasing the temperature and applying a oscillatory pressure increase/decrease or oscillatory vacuum, the pressure differential in the airflow drives the liquid material to rub or stir, thereby enhancing the residue cleaning efficiency and meeting the requirements for better industrial applicability.

The foregoing description provides a detailed description of the technical features of the present invention with respect to the preferred embodiments thereof. However, persons skilled in the art may make changes and modifications to the present invention without departing from the spirit and principles of the present invention, and such changes and modifications shall be within the scope defined by the following patent application.

In summary, the present invention provides a method for cleaning floorboards, which has achieved all of the present invention's objectives. Furthermore, the spatial configuration of its combined structure is not seen in similar products and has not been disclosed prior to the application. Therefore, it complies with the provisions of the Patent Law, and the application is filed in accordance with the law.

10a: Soldering the solder pad 20a: Covering with liquid material 30a: Inserting into the chamber 40a: Controlling chamber temperature 50a: Oscillatory pressure differential cleaning 10b: Soldering the solder pad 20b: Covering with liquid material 30b: Inserting into the chamber 40b: Controlling chamber temperature 50b: Oscillatory pressure differential cleaning 10c: Soldering the solder pad 20c: Covering with liquid material 30c: Inserting into the chamber 40c: Controlling chamber temperature 50c: Oscillatory pressure differential cleaning 10d: Soldering the solder pad 20d: Covering with liquid material 30d: Inserting into the chamber 40d: Controlling chamber temperature 50d: Physical dissolution cleaning

[Figure 1] is a flow chart of a method according to one embodiment of the present invention. [Figure 2] is a flow chart of a method according to another embodiment of the present invention. [Figure 3] is a flow chart of a method according to yet another embodiment of the present invention. [Figure 4] is a flow chart of a method according to yet another embodiment of the present invention.

10a: Soldering the soldering lugs

20a: Covering with liquid material

30a: Place in chamber

40a: Control chamber temperature

50a: Oscillating pressure differential cleaning

Claims (10)

A method for cleaning a substrate, comprising the following steps: (a) welding a soldering pad: welding at least one soldering pad to a substrate; (b) covering with a liquid material: filling a liquid material between the substrate and at least one of the soldering pads to cover a substance to be cleaned on the substrate; (c) placing the substrate in a chamber: placing the substrate containing the liquid material in a chamber; (d) Controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, which is in the range of 25-200°C, in accordance with the viscosity of the liquid material; (e) Oscillating pressure differential change cleaning: using a vacuum generator to generate an oscillating low-pressure control on the gas in the chamber, so that the gas molecules in the chamber generate a pressure differential change flow, which is a pressure differential change under low pressure, ranging from a maximum value of no more than 1 atmosphere to a minimum value of 10 The pressure differential fluctuates between ^-5 atmospheres in an oscillatory manner. The low-pressure fluctuations of the vacuum suction and release force of the gas cause the liquid material to fluctuate. The liquid material in contact with the material to be cleaned is scrubbed by the friction of the pressure differential fluctuation, and the material to be cleaned attached to the base plate is removed from the base plate and the liquid material. The method for cleaning a substrate as described in claim 1, wherein the substance to be cleaned may be flux, flux residue, oil grease, photoresist, or products produced during the manufacturing process. In the method for cleaning a base plate as described in claim 1, the liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect. A method for cleaning a substrate, comprising the following steps: (a) welding a soldering pad: welding at least one soldering pad to a substrate; (b) covering with a liquid material: filling a liquid material between the substrate and at least one of the soldering pads to cover a substance to be cleaned on the substrate; (c) placing the substrate in a chamber: placing the substrate containing the liquid material in a chamber; (d) Controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, which is in the range of 25-200°C, in accordance with the viscosity of the liquid material; (e) Oscillating pressure differential change cleaning: using a pressure increasing and decreasing device and a vacuum generator to generate an oscillating high-pressure increase and decrease and an oscillating low-pressure vacuum on the gas in the chamber, so that the gas molecules in the chamber generate a pressure differential change flow, which is an oscillating pressure differential change of the gas molecules between the oscillating high pressure and the oscillating low pressure, ranging from a maximum of 50 atmospheres to a minimum of 10 ^-5 atmospheres, and uses the high pressure of the pressure increasing and decreasing device and the low pressure of the vacuum generator to cause the pressure difference of the gas molecules to fluctuate, causing the liquid material to fluctuate. The liquid material in contact with the material to be cleaned is rubbed by the pressure difference fluctuation, and the material to be cleaned attached to the connecting plate is removed from the connecting plate and the liquid material. The method for cleaning a substrate as described in claim 4, wherein the substance to be cleaned may be flux, flux residue, oil grease, photoresist, or products produced during the manufacturing process. In the method for cleaning a base plate as described in claim 4, the liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect. A method for cleaning a substrate, comprising the following steps: (a) welding a soldering pad: welding at least one soldering pad to a substrate; (b) covering with a liquid material: filling a liquid material between the substrate and at least one of the soldering pads to cover a substance to be cleaned on the substrate; (c) placing the substrate in a chamber: placing the substrate containing the liquid material in a chamber; (d) Controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, which is in the range of 25-200°C, in accordance with the viscosity of the liquid material; (e) Oscillating pressure differential cleaning: using a pressure increasing and decreasing device to generate an oscillating pressure increase and decrease on the gas in the chamber, so that the gas molecules in the chamber generate a pressure differential flow, which is a pressure differential change from high pressure to 1 atmosphere, with a range of The pressure differential fluctuates between a maximum of 50 atmospheres and a minimum of 1 atmosphere. The high-pressure gas is subjected to an oscillatory pressure differential fluctuation using a pressure increasing and decreasing device, causing the liquid material to fluctuate. The liquid material in contact with the material to be cleaned is scrubbed by the pressure differential fluctuation, and the material to be cleaned attached to the base plate is removed from the base plate and the liquid material. A method for cleaning a substrate, comprising the following steps: (a) welding a soldering pad: welding at least one soldering pad to a substrate; (b) covering with a liquid material: filling a liquid material between the substrate and at least one of the soldering pads to cover a substance to be cleaned on the substrate; (c) placing the substrate in a chamber: placing the substrate containing the liquid material in a chamber; (d) Controlling the chamber temperature: The chamber is controlled at at least one predetermined temperature, which is adjusted to the viscosity of the liquid material and is between 25°C and 200°C. (e) Physical dissolution cleaning: A pressurizing device is used to generate at least one predetermined pressure within the chamber, ranging from a maximum of 50 atmospheres to a minimum of 1 atmosphere. Physical dissolution occurs when the liquid material comes into contact with the material to be cleaned, dissolving the material to be cleaned attached to the substrate in the liquid material. The material to be cleaned attached to the substrate is then removed from the substrate and the liquid material by diffusion forces generated by the predetermined temperature and the concentration gradient after dissolution. The method for cleaning a substrate as described in claim 7 or 8, wherein the substance to be cleaned may be flux, flux residue, oil grease, photoresist or products produced during the manufacturing process. In the method for cleaning a base plate as described in claim 7, the liquid material may be a base glue, and the base glue may contain hard particles, and the hard particles roll as the base glue moves, thereby increasing the friction and scrubbing effect.