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TWI890441B - Single crystal growth device - Google Patents

Single crystal growth device

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Publication number
TWI890441B
TWI890441B TW113118248A TW113118248A TWI890441B TW I890441 B TWI890441 B TW I890441B TW 113118248 A TW113118248 A TW 113118248A TW 113118248 A TW113118248 A TW 113118248A TW I890441 B TWI890441 B TW I890441B
Authority
TW
Taiwan
Prior art keywords
crystal growth
temperature
furnace body
single crystal
furnace
Prior art date
Application number
TW113118248A
Other languages
Chinese (zh)
Other versions
TW202517850A (en
Inventor
郭杰
趙藝惠
陳志平
趙衡煜
王錄生
張彬鏡
劉俊杰
汪瑞
沈仁奇
莊擊勇
鄭燕青
Original Assignee
大陸商廈門鎢業股份有限公司
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Publication date
Application filed by 大陸商廈門鎢業股份有限公司 filed Critical 大陸商廈門鎢業股份有限公司
Publication of TW202517850A publication Critical patent/TW202517850A/en
Application granted granted Critical
Publication of TWI890441B publication Critical patent/TWI890441B/en

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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14Heating of the melt or the crystallised materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/006Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • C30B29/22Complex oxides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02Heat treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

A single crystal growth device, and relates to the technical field of crystal growth. The single crystal growth device includes a furnace body, a supporting assembly, a lifting driving mechanism, a flow stabilizing plate and a cooling ring. The furnace body forms a furnace cavity, and a heating assembly is disposed at an inner side of the furnace body. The supporting assembly includes an objective table and a supporting shaft, where the objective table is located in the furnace cavity and used for the placement of a crucible. The lifting driving mechanism is used for driving the furnace body and/or the supporting assembly to lift the furnace body relative to the supporting assembly. A cooling ring is communicated with an exterior of the furnace body through a first pipeline and a second pipeline. The temperature field in the furnace cavity can be effectively controlled by the cooling ring, so that an appropriate temperature gradient is provided for crystal growth and the quality of crystal growth is ensured. Due to the arrangement of the flow stabilizing plate, the gas convection is reduced, which is beneficial to ensuring the crystal quality; the power required for the temperature of the space where the crucible is located is reduced.

Description

單晶生長設備Single crystal growth equipment

本發明涉及晶體生長技術領域,具體而言,涉及一種單晶生長設備。The present invention relates to the field of crystal growth technology, and more particularly, to a single crystal growth device.

下降法單晶生長設備在製備大尺寸晶體過程中,需要在爐體內形成具有一定溫度梯度的溫度場,然後將盛裝有原料熔體的坩堝緩慢下降,由高溫區域向低溫區域移動,實現結晶。現有的單晶生長設備因結構不合理,對溫度場的控制效果不佳,導致生長的晶體雜質分佈較廣,品質較差,因此難以製備大尺寸晶體。To produce large crystals, single crystal growth equipment using the descending method requires creating a temperature field with a defined temperature gradient within the furnace. The crucible containing the molten raw material is then slowly lowered, moving from a high-temperature zone to a low-temperature zone to achieve crystallization. Existing single crystal growth equipment, due to its irrational structure, poorly controls the temperature field, resulting in a wide distribution of impurities in the grown crystals and poor quality, making it difficult to produce large crystals.

鑒於此,特提出本發明。In view of this, the present invention is proposed.

本發明的目的包括提供一種單晶生長設備,其生長晶體的品質較好,有利於生長大尺寸晶體。The present invention aims to provide a single crystal growth apparatus that has good quality of grown crystals and is advantageous for growing large-sized crystals.

本發明的實施例可以這樣實現:The embodiment of the present invention can be implemented as follows:

本發明提供一種單晶生長設備,包括:The present invention provides a single crystal growth device, comprising:

爐體,爐體形成爐腔,爐體的內側設置有加熱組件;A furnace body forms a furnace cavity, and a heating component is provided on the inner side of the furnace body;

支撐組件,包括載物台與支撐軸,載物台位於爐腔內,用於放置坩堝,支撐軸的一端連接於載物台底部,另一端從爐體的下端伸出爐腔;The support assembly includes a loading platform and a support shaft. The loading platform is located in the furnace cavity and is used to place the crucible. One end of the support shaft is connected to the bottom of the loading platform, and the other end extends out of the furnace cavity from the lower end of the furnace body.

升降驅動機構,用於驅動爐體和/或支撐組件,以使爐體相對於支撐組件升降;A lifting drive mechanism is used to drive the furnace body and/or the support assembly to lift the furnace body relative to the support assembly;

穩流板,位於爐腔內且間隔地設置於位於載物台的上方,穩流板可隨載物台相對於爐體升降;以及A flow stabilizing plate is located in the furnace cavity and is spaced apart above the loading platform. The flow stabilizing plate can be raised and lowered relative to the furnace body along with the loading platform; and

冷卻環,設置於爐腔內,冷卻環中部形成通孔,用於供載物台和支撐軸穿過,冷卻環內部形成供冷媒流動的冷卻通道,冷卻環通過第一管路和第二管路與爐體的外部連通。The cooling ring is arranged in the furnace cavity. A through hole is formed in the middle of the cooling ring for the carrier and the support shaft to pass through. A cooling channel for the flow of refrigerant is formed inside the cooling ring. The cooling ring is connected to the outside of the furnace body through the first pipeline and the second pipeline.

在可選的實施方式中,單晶生長設備包括冷源,冷源連接於第一管路。In an optional embodiment, the single crystal growth equipment includes a cooling source connected to the first pipeline.

在可選的實施方式中,冷源通過第一管路、第二管路與冷卻環形成冷卻回路。In an optional embodiment, the cooling source forms a cooling circuit through the first pipeline, the second pipeline and the cooling ring.

在可選的實施方式中,冷媒可以為水,冷源包括冷水機。In an optional embodiment, the refrigerant can be water, and the cooling source includes a chiller.

在可選的實施方式中,加熱組件包括第一加熱組件和第二加熱組件,第一加熱組件間隔地設置於第二加熱組件上方,冷卻環設置於第一加熱組件和第二加熱組件之間。In an optional embodiment, the heating assembly includes a first heating assembly and a second heating assembly, the first heating assembly is arranged above the second heating assembly at an interval, and the cooling ring is arranged between the first heating assembly and the second heating assembly.

在可選的實施方式中,爐體內設置有第一保溫件,第一保溫件凸設於爐腔的內壁,並沿爐腔的周向延伸而形成環狀,第一保溫件的中部形成供載物台和支撐軸穿過的通孔,第一保溫件在豎直方向上位於第一加熱組件和第二加熱組件之間,冷卻環位於第一加熱組件的下端,第一保溫件位於第二加熱組件的上端,冷卻環間隔地設置於第一保溫件上方。In an optional embodiment, a first insulation member is provided in the furnace body, the first insulation member protrudes from the inner wall of the furnace cavity, and extends along the circumference of the furnace cavity to form a ring shape. A through hole is formed in the middle of the first insulation member for the loading platform and the supporting shaft to pass through. The first insulation member is located between the first heating component and the second heating component in the vertical direction, the cooling ring is located at the lower end of the first heating component, the first insulation member is located at the upper end of the second heating component, and the cooling ring is arranged at intervals above the first insulation member.

在可選的實施方式中,爐體內設置有第二保溫件,第二保溫件凸設於爐腔的內壁,並沿爐腔的周向延伸而形成環狀,第二保溫件的中部形成供載物台和支撐軸穿過的通孔,第二保溫件設置於第二加熱組件的下方。In an optional embodiment, a second insulation member is provided in the furnace body, the second insulation member protrudes from the inner wall of the furnace cavity and extends along the circumference of the furnace cavity to form a ring shape, a through hole is formed in the middle of the second insulation member for the loading platform and the support shaft to pass through, and the second insulation member is arranged below the second heating assembly.

在可選的實施方式中,第二保溫件的通孔的口徑可調。In an optional embodiment, the diameter of the through hole of the second thermal insulation component is adjustable.

在可選的實施方式中,穩流板的外周側與爐體的內壁滑動連接,以使穩流板能夠相對爐體升降。In an optional embodiment, the outer peripheral side of the flow plate is slidably connected to the inner wall of the furnace body so that the flow plate can be raised and lowered relative to the furnace body.

在可選的實施方式中,單晶生長設備還包括旋轉驅動機構,旋轉驅動機構與支撐軸傳動連接,用於驅動支撐軸轉動。In an optional embodiment, the single crystal growth apparatus further includes a rotation drive mechanism, which is operatively connected to the support shaft and is used to drive the support shaft to rotate.

本發明實施例的有益效果包括,例如:The beneficial effects of the embodiments of the present invention include, for example:

本發明提供的單晶生長設備包括爐體、支撐組件、升降驅動機構、穩流板和冷卻環。爐體形成爐腔,爐體的內側設置有加熱組件。支撐組件包括載物台與支撐軸,載物台位於爐腔內,用於放置坩堝,支撐軸的一端連接於載物台底部,另一端從爐體的下端伸出爐腔。升降驅動機構用於驅動爐體和/或支撐組件,以使爐體相對於支撐組件升降。穩流板位於爐腔內且間隔地設置於位於載物台的上方,可隨載物台相對於爐體升降。冷卻環設置於爐腔內,冷卻環中部形成通孔,用於供載物台和支撐軸穿過,冷卻環內部形成供冷媒流動的冷卻通道,冷卻環通過第一管路和第二管路與爐體的外部連通。通過第一管路可向冷卻環內通入冷媒,冷媒帶走熱量後從第二管路送出爐體,因此可以在爐腔內形成具有一定溫度梯度的溫度場,而控制冷媒的流量則可以對溫度梯度進行控制。通過本發明的單晶生長設備,能夠有效地對爐腔內溫度場進行控制,為晶體生長提供合適的溫度梯度,因此能夠使結晶的速率不至於過快,而保持在一個合理的區間,有利於雜質排至晶體頂部,保證晶體生長品質。因此,本發明提供的單晶生長設備有利於製備大尺寸晶體。另外,由於設置了可隨載物台一同移動的穩流板,使得在載物台下降時,穩流板可以隨載物台一同下降,使得坩堝以上的空間不會過大,減小了空氣流動,因此溫度場更為穩定,有利於減少晶體內雜質的分佈區間,提高晶體生長品質,為大尺寸晶體的生長創造良好條件。此外,由於設置了穩流板,減小了氣體對流,因此維持坩堝所在空間的溫度所需要的功率也會降低,有利於減少單晶生長設備的能耗。The single crystal growth equipment provided by the present invention includes a furnace body, a support assembly, a lifting drive mechanism, a flow stabilizing plate, and a cooling ring. The furnace body forms a furnace cavity, and a heating assembly is provided on the inner side of the furnace body. The support assembly includes a loading platform and a supporting shaft. The loading platform is located in the furnace cavity and is used to place the crucible. One end of the supporting shaft is connected to the bottom of the loading platform, and the other end extends out of the furnace cavity from the lower end of the furnace body. The lifting drive mechanism is used to drive the furnace body and/or the support assembly to lift the furnace body relative to the support assembly. The flow stabilizing plate is located in the furnace cavity and is arranged at intervals above the loading platform. It can be lifted and lowered relative to the furnace body along with the loading platform. The cooling ring is installed within the furnace cavity. A through-hole is formed in the center of the ring for the stage and support shaft to pass through. A cooling channel is formed within the ring for the refrigerant to flow through. The cooling ring is connected to the exterior of the furnace via a first and second pipeline. Refrigerant is introduced into the cooling ring through the first pipeline, removing heat before exiting the furnace through the second pipeline. This creates a temperature gradient within the furnace cavity, which is controlled by controlling the refrigerant flow rate. The single crystal growth equipment of the present invention can effectively control the temperature field in the furnace chamber, providing a suitable temperature gradient for crystal growth. Therefore, the crystallization rate can be kept within a reasonable range rather than being too fast, which is conducive to the discharge of impurities to the top of the crystal and ensuring the quality of crystal growth. Therefore, the single crystal growth equipment provided by the present invention is conducive to the preparation of large-sized crystals. In addition, since a stabilizing plate that can move with the stage is provided, when the stage descends, the stabilizing plate can descend with the stage, so that the space above the crucible is not too large, reducing air flow, and thus the temperature field is more stable, which is conducive to reducing the distribution range of impurities in the crystal, improving the quality of crystal growth, and creating good conditions for the growth of large-sized crystals. In addition, the installation of a flow stabilizing plate reduces gas convection, thereby reducing the power required to maintain the temperature of the crucible space, which helps reduce the energy consumption of the single crystal growth equipment.

為使本發明實施例的目的、技術方案和優點更加清楚,下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例是本發明一部分實施例,而不是全部的實施例。通常在此處附圖中描述和示出的本發明實施例的組件可以以各種不同的配置來佈置和設計。To further clarify the objectives, technical solutions, and advantages of the embodiments of the present invention, the following will provide a clear and complete description of the technical solutions of the embodiments of the present invention, in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein can be arranged and designed in a variety of different configurations.

因此,以下對在附圖中提供的本發明的實施例的詳細描述並非旨在限制要求保護的本發明的範圍,而是僅僅表示本發明的選定實施例。基於本發明中的實施例,本領域普通技術人員在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

應注意到:相似的標號和字母在下面的附圖中表示類似項,因此,一旦某一項在一個附圖中被定義,則在隨後的附圖中不需要對其進行進一步定義和解釋。It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in the subsequent drawings.

在本發明的描述中,需要說明的是,若出現術語“上”、“下”、“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,或者是該發明產品使用時慣常擺放的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate directions or positional relationships, they are based on the directions or positional relationships shown in the accompanying drawings, or the directions or positional relationships in which the product of the present invention is usually placed when in use. These are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limitations on the present invention.

此外,若出現術語“第一”、“第二”等僅用於區分描述,而不能理解為指示或暗示相對重要性。In addition, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

需要說明的是,在不衝突的情況下,本發明的實施例中的特徵可以相互結合。It should be noted that, without conflict, the features of the embodiments of the present invention can be combined with each other.

晶體生長過程中,如果生長溫度梯度不合適或出現生長加速度的現象,晶體容易出現包裹體過多、排雜不好等現象。但目前現有相關技術中的下降法單晶生長設備,對晶體生長的溫度梯度無法較好地控制,因此往往對原料的純度要求很高,不能有太多雜質,導致成本較高。大尺寸單晶在製備的中後期,往往會因為晶體自身導熱加大而導致結晶的梯度變小,甚至過冷從而導致生長加速度。因此,現有的設備和方法難以製備高品質的大尺寸單晶。另外,坩堝在下降過程中,頂部空間逐漸變大,空氣對流變得越發強烈,導致溫度場不夠穩定。由於晶體生長需要穩定的溫度場,而不穩定的溫度場則容易導致晶體生長品質變差,比如雜質分佈區域較廣。此外,隨著坩堝上方的爐腔空間變大,維持合適的溫度所需的設備功率會較高,因此相關技術中的單晶生長設備的能耗也較大。During the crystal growth process, if the growth temperature gradient is inappropriate or growth acceleration occurs, the crystal is prone to excessive inclusions and poor impurity removal. However, the current descent method single crystal growth equipment in related technologies cannot effectively control the temperature gradient of crystal growth. Therefore, it often requires very high purity of the raw materials and cannot have too many impurities, resulting in high costs. In the middle and late stages of the preparation of large-sized single crystals, the crystallization gradient often becomes smaller due to the increased thermal conductivity of the crystal itself, or even overcooling, resulting in growth acceleration. Therefore, existing equipment and methods make it difficult to produce high-quality large-sized single crystals. In addition, as the crucible descends, the top space gradually increases, and the air convection becomes more intense, resulting in an unstable temperature field. Crystal growth requires a stable temperature field, while an unstable temperature field can easily lead to poor crystal growth quality, such as widespread impurity distribution. Furthermore, as the furnace cavity space above the crucible increases, the equipment power required to maintain the appropriate temperature increases, resulting in higher energy consumption in single crystal growth equipment used in related technologies.

為了改善上述相關技術中的至少一個不足之處,本發明實施例提供一種單晶生長設備,通過在爐腔內增設冷卻環和穩流板,在爐腔內形成合適的溫度場,改善流場的穩定性,從而提高晶體生長品質,為大尺寸晶體製備提供良好條件。To address at least one of the shortcomings of the aforementioned related technologies, an embodiment of the present invention provides a single crystal growth apparatus. By adding a cooling ring and a flow stabilizing plate within the furnace chamber, a suitable temperature field is formed within the furnace chamber, improving the stability of the flow field, thereby enhancing the quality of crystal growth and providing favorable conditions for the preparation of large-sized crystals.

圖1為本發明一種實施例中單晶生長設備010的示意圖;圖2為本發明一種實施例中單晶生長設備010的剖視圖。如圖1和圖2所示,本發明實施例提供的單晶生長設備010包括爐體、支撐組件200、升降驅動機構300、穩流板170以及冷卻環140。爐體形成爐腔,爐體的內側設置有加熱組件;支撐組件200包括載物台210與支撐軸220,載物台210位於爐腔內,用於放置坩堝020,支撐軸220的一端連接於載物台210底部,另一端從爐體的下端伸出爐腔。升降驅動機構300用於驅動爐體和/或支撐組件200,以使爐體相對於支撐組件200升降。冷卻環140位於爐腔內,冷卻環140中部形成通孔,用於供載物台210和支撐軸220穿過,冷卻環140內部形成供冷媒流動的冷卻通道,冷卻環140通過第一管路和第二管路與爐體的外部連通。穩流板170位於爐腔內且間隔地設置於位於載物台210的上方,可隨載物台210相對於爐體升降。Figure 1 is a schematic diagram of a single crystal growth apparatus 010 according to an embodiment of the present invention; Figure 2 is a cross-sectional view of the single crystal growth apparatus 010 according to an embodiment of the present invention. As shown in Figures 1 and 2, the single crystal growth apparatus 010 provided in this embodiment of the present invention includes a furnace body, a support assembly 200, a lifting drive mechanism 300, a flow stabilizing plate 170, and a cooling ring 140. The furnace body forms a furnace cavity, and a heating assembly is disposed inside the furnace body. The support assembly 200 includes a stage 210 and a support shaft 220. The stage 210 is located within the furnace cavity and is used to place the crucible 020. One end of the support shaft 220 is connected to the bottom of the stage 210, and the other end extends from the bottom end of the furnace body out of the furnace cavity. The lifting drive mechanism 300 is used to drive the furnace body and/or support assembly 200, raising and lowering the furnace body relative to the support assembly 200. A cooling ring 140 is located within the furnace cavity. A through-hole is formed in the center of the cooling ring 140 for the stage 210 and support shaft 220 to pass through. A cooling channel is formed within the cooling ring 140 for the flow of refrigerant. The cooling ring 140 is connected to the exterior of the furnace body via a first pipeline and a second pipeline. A flow stabilizing plate 170 is located within the furnace cavity and spaced apart above the stage 210, allowing it to be raised and lowered relative to the furnace body.

在本實施例中,爐體包括上爐體110和下爐體120,上爐體110和下爐體120在軸向上連通,共同形成爐腔。下爐體120的底端形成開口,支撐軸220的下端從該開口上伸出。上爐體110和下爐體120中都包括保溫材料,使得爐腔內的溫度能夠保持。In this embodiment, the furnace body comprises an upper furnace body 110 and a lower furnace body 120. The upper and lower furnace bodies 110 and 120 are axially connected to form a furnace cavity. The lower furnace body 120 has an opening at its bottom end, through which the lower end of the support shaft 220 extends. Both the upper and lower furnace bodies 110 and 120 contain insulation material to maintain the temperature within the furnace cavity.

本實施例中,加熱組件包括第一加熱組件111和第二加熱組件121,第一加熱組件111間隔地設置於第二加熱組件121上方。第一加熱組件111和第二加熱組件121均包含多個沿周向間隔佈置的加熱件,從而能夠營造在周向上均勻的溫度場。第一加熱組件111和第二加熱組件121所包含的加熱件可以是感應線圈,也可以是電阻絲。In this embodiment, the heating assembly includes a first heating assembly 111 and a second heating assembly 121, with the first heating assembly 111 spaced apart above the second heating assembly 121. Both the first heating assembly 111 and the second heating assembly 121 include multiple heating elements spaced apart circumferentially, thereby creating a uniform temperature field. The heating elements in the first heating assembly 111 and the second heating assembly 121 can be either induction coils or resistors.

可選地,冷卻環140在豎直方向上位於第一加熱組件111和第二加熱組件121之間。冷卻環可以是圓環狀,其中心軸線與爐腔的中心軸線重合。具體的,冷卻環140設置在第一加熱組件111的下端,坩堝020內的原料被第一加熱組件111加熱至熔融狀態,坩堝020內的原料熔體在下降至冷卻環140附近時開始結晶。通過第一管路141能夠持續不斷地向冷卻環140提供冷媒,冷媒吸收爐腔內的熱量後通過第二管路142流出爐腔。通過控制冷媒的流量則可以控制爐腔內冷卻環140附近的溫度,為結晶構建一個合適的溫度場。冷媒可以是氣體,也可以是液體,比如,冷媒可以是氮氣、空氣、水或者油等。Optionally, cooling ring 140 is positioned vertically between first heating assembly 111 and second heating assembly 121. The cooling ring can be annular, with its central axis coinciding with the central axis of the furnace cavity. Specifically, cooling ring 140 is positioned at the lower end of first heating assembly 111. The raw material in crucible 020 is heated to a molten state by first heating assembly 111. The molten raw material in crucible 020 begins to crystallize as it descends near cooling ring 140. A refrigerant is continuously supplied to cooling ring 140 via first pipeline 141. The refrigerant absorbs heat from the furnace cavity and then flows out of the furnace cavity via second pipeline 142. By controlling the flow of the refrigerant, the temperature near the cooling ring 140 in the furnace cavity can be controlled, creating a suitable temperature field for crystallization. The refrigerant can be a gas or a liquid, for example, nitrogen, air, water, or oil.

可選地,單晶生長設備010還包括冷源(圖中未示出),冷源連接於第一管路,從而能夠持續地通過第一管路向冷卻環140內提供冷媒。可選地,冷源通過第一管路、第二管路與冷卻環形成冷卻回路。冷源可以是提供冷水的設備,比如冷水機。在一個實施例中,冷水機通過第一管路141、冷卻環140以及第二管路142形成冷卻回路,冷水機將水冷卻並通過第一管路141泵送至冷卻環140,冷水吸收熱量後升溫,再通過第二管路142返回至冷水機,冷水機將其冷卻後再次泵送至冷卻環140,形成了冷媒的循環。通過調節冷水機的冷卻功率和冷媒的循環速率,就可以調節冷卻環140吸收熱量的效率,從而調整溫度場,進而調節結晶的溫度梯度。Optionally, single crystal growth apparatus 010 further includes a cooling source (not shown), which is connected to the first pipeline, thereby continuously providing refrigerant to cooling ring 140 through the first pipeline. Optionally, the cooling source forms a cooling circuit through the first pipeline, the second pipeline, and the cooling ring. The cooling source can be a device that provides cold water, such as a chiller. In one embodiment, the chiller forms a cooling circuit through first pipeline 141, cooling ring 140, and second pipeline 142. The chiller cools water and pumps it through first pipeline 141 to cooling ring 140. The cold water absorbs heat and rises in temperature, then returns to the chiller through second pipeline 142. The chiller cools the water and pumps it back to cooling ring 140, forming a refrigerant circulation loop. By adjusting the cooling power of the chiller and the circulation rate of the refrigerant, the efficiency of the cooling loop 140 in absorbing heat can be adjusted, thereby adjusting the temperature field and further adjusting the temperature gradient of the crystallization.

在可選的其他實施例中,冷源可以僅與第一管路141連通,冷媒經過冷卻環140吸收熱量後直接通過第二管路142釋放,因此可以不形成冷卻回路。冷源還可以是水龍頭,僅與第一管路141連通,通過調整水龍頭開度來調整冷卻環140的冷卻強度。In alternative embodiments, the cooling source may be connected only to the first pipe 141. After absorbing heat through the cooling ring 140, the refrigerant is released directly through the second pipe 142, thus eliminating the need for a cooling loop. Alternatively, the cooling source may be a faucet, connected only to the first pipe 141. Adjusting the faucet opening adjusts the cooling intensity of the cooling ring 140.

在可選的實施例中,冷卻環140還可以設置為上下位置可調,比如通過電機和相關的傳動結構實現高度調節。In an optional embodiment, the cooling ring 140 can also be set to be adjustable in up and down positions, such as by achieving height adjustment through a motor and a related transmission structure.

進一步的,爐體內設置有第一保溫件150,第一保溫件150凸設於爐腔的內壁,並沿爐腔的周向延伸而形成環狀。第一保溫件150的中部形成供載物台210和支撐軸220穿過的通孔,第一保溫件150在豎直方向上位於第一加熱組件111和第二加熱組件121之間。第一保溫件150的中心軸線與爐腔的中心軸線重合。在本實施例中,第一保溫件150位於第二加熱組件121的上端,冷卻環140間隔地設置於第一保溫件150上方。Furthermore, a first insulation member 150 is disposed within the furnace body. The first insulation member 150 protrudes from the inner wall of the furnace cavity and extends circumferentially around the cavity, forming a ring. A through-hole is formed in the center of the first insulation member 150, through which the loading platform 210 and the support shaft 220 pass. The first insulation member 150 is vertically positioned between the first heating assembly 111 and the second heating assembly 121. The central axis of the first insulation member 150 coincides with the central axis of the furnace cavity. In this embodiment, the first insulation member 150 is positioned above the second heating assembly 121, and the cooling ring 140 is intermittently positioned above the first insulation member 150.

可見,冷卻環140、第一保溫件150將爐腔大體分成了三個區域,冷卻環140上方的區域為高溫區,由第一加熱組件111控制溫度。冷卻環140與第一保溫件150之間的區域為過渡區,該區域溫度低於高溫區,通常情況下熔融的原料在進入該區域後開始結晶。第一保溫件150以下為退火區,其溫度由第二加熱組件121來控制,用於對晶體進行退火,以緩解晶體內部應力。相較于高溫區,過渡區和退火區的溫度相對較低。As can be seen, the cooling ring 140 and the first insulation element 150 roughly divide the furnace cavity into three zones. The area above the cooling ring 140 is the high-temperature zone, whose temperature is controlled by the first heating assembly 111. The area between the cooling ring 140 and the first insulation element 150 is the transition zone, where the temperature is lower than the high-temperature zone. Typically, molten material begins to crystallize after entering this zone. Below the first insulation element 150 is the annealing zone, whose temperature is controlled by the second heating assembly 121. This zone is used to anneal the crystal to relieve internal stress. Compared to the high-temperature zone, the temperatures in the transition and annealing zones are relatively low.

進一步的,爐體內設置還有第二保溫件160,第二保溫件160凸設於爐腔的內壁,並沿爐腔的周向延伸而形成環狀,第二保溫件160的中部形成供載物台210和支撐軸220穿過的通孔,第二保溫件160設置於第二加熱組件121的下方。退火區位於第一保溫件150與第二保溫件160之間。可選地,第二保溫件160設置在下爐體120的開口處。Furthermore, a second insulation member 160 is installed within the furnace body. This member protrudes from the inner wall of the furnace cavity and extends along the circumference of the furnace cavity, forming a ring. A through-hole is formed in the center of the second insulation member 160 for the loading platform 210 and support shaft 220 to pass through. The second insulation member 160 is positioned below the second heating assembly 121. The annealing zone is located between the first insulation member 150 and the second insulation member 160. Alternatively, the second insulation member 160 is positioned at the opening of the lower furnace body 120.

在本實施例中,第二保溫件160的通孔的口徑可調。由於第二保溫件160的通孔下端與外部環境連通,因此通過調節第二保溫件160的口徑,能夠一定程度調節退火區的溫度場,從而對退火工藝進行控制。較小的口徑能夠減少外部空氣與爐內空氣的對流,有利於提高退火溫度;較大的口徑可方便坩堝020取出。In this embodiment, the diameter of the through-hole of the second heat-insulating element 160 is adjustable. Since the lower end of the through-hole of the second heat-insulating element 160 is connected to the external environment, adjusting the diameter of the second heat-insulating element 160 can adjust the temperature field in the annealing zone to a certain extent, thereby controlling the annealing process. A smaller diameter can reduce convection between the external air and the air inside the furnace, which is conducive to increasing the annealing temperature; a larger diameter can facilitate the removal of crucible 020.

第一保溫件150和第二保溫件160都可以採用保溫磚製成。第二保溫件160可以由分體式地多個部件構成,從而實現口徑可調。比如,將第二保溫件160設計成類似光圈的多片式結構。Both the first insulation member 150 and the second insulation member 160 can be made of insulation bricks. The second insulation member 160 can be composed of multiple separate components to achieve adjustable caliber. For example, the second insulation member 160 can be designed as a multi-piece structure similar to an aperture.

在本發明實施例中,爐體上設置有若干熱電偶,用於檢測爐腔內的溫度。In this embodiment of the present invention, a plurality of thermocouples are provided on the furnace body for detecting the temperature in the furnace cavity.

具體的,若干熱電偶從上至下依次包括高溫監控熱電偶131、高溫控溫熱電偶132、第一結晶監控熱電偶133、第二結晶監控熱電偶134、退火監控熱電偶135以及退火控溫熱電偶136。本實施例中,高溫控溫熱電偶132設置在高溫區的中部位置,通過將設置的高溫區目標溫度與高溫控溫熱電偶132的檢測溫度來進行比較,從而控制第一加熱組件111對高溫區的溫度進行調控;換言之,高溫區是否達到目標溫度根據高溫控溫熱電偶132回饋的溫度決定的。第一結晶監控熱電偶133和第二結晶監控熱電偶134分別設置在冷卻環140的上下兩側,用於監測結晶溫度情況,因為熔體在冷卻環140附近開始結晶。通過將設置的退火區目標溫度與退火控溫熱電偶136的檢測溫度來進行比較,從而控制第二加熱組件121對退火區的溫度進行調控;換言之,退火區是否達到目標溫度是根據退火控溫熱電偶136回饋的溫度決定的。退火監控熱電偶135設置在第二加熱組件121的下側。通過各個熱電偶對整個爐腔的不同位置的溫度進行檢測,可以有效地對爐腔的溫度場進行監控。Specifically, the plurality of thermocouples include, from top to bottom, a high-temperature monitoring thermocouple 131, a high-temperature control thermocouple 132, a first crystallization monitoring thermocouple 133, a second crystallization monitoring thermocouple 134, an annealing monitoring thermocouple 135, and an annealing control thermocouple 136. In this embodiment, the high-temperature control thermocouple 132 is located in the middle of the high-temperature zone. By comparing the set high-temperature zone target temperature with the detected temperature of the high-temperature control thermocouple 132, the first heating assembly 111 is controlled to regulate the temperature of the high-temperature zone. In other words, whether the high-temperature zone reaches the target temperature is determined by the temperature feedback from the high-temperature control thermocouple 132. First and second crystallization monitoring thermocouples 133 and 134 are located on the upper and lower sides of cooling ring 140, respectively, to monitor crystallization temperature conditions. Crystallization of the melt begins near cooling ring 140. The second heating assembly 121 regulates the annealing zone temperature by comparing the set annealing zone target temperature with the temperature detected by annealing temperature-control thermocouple 136. In other words, whether the annealing zone has reached the target temperature is determined by the temperature feedback from annealing temperature-control thermocouple 136. Annealing monitoring thermocouple 135 is located on the lower side of second heating assembly 121. By detecting the temperature at different positions of the entire furnace cavity through various thermocouples, the temperature field of the furnace cavity can be effectively monitored.

本實施例中,升降驅動機構300與爐體傳動連接,用於驅動爐體相對於支撐組件200升降。通過驅動爐體來移動,能夠使載物台210上的坩堝020處於一個更為穩定的狀態,從而保證更好地結晶。在可選的其他實施例中,升降驅動機構300也可以與支撐組件200傳動連接,而爐體固定不動,通過驅動支撐組件200上下移動來實現坩堝020相對於爐體升降。In this embodiment, the lifting drive mechanism 300 is operatively connected to the furnace body and is used to drive the furnace body up and down relative to the support assembly 200. By driving the furnace body to move, the crucible 020 on the stage 210 is placed in a more stable state, thereby ensuring better crystallization. In alternative embodiments, the lifting drive mechanism 300 can also be operatively connected to the support assembly 200, while the furnace body remains stationary. The crucible 020 can be raised and lowered relative to the furnace body by driving the support assembly 200 up and down.

可選地,升降驅動機構300機構包括驅動件310和傳動組件320,傳動組件320將驅動件310和爐體傳動連接。驅動件310可以是電機,比如步進電機。傳動組件320可以包括絲杠-螺母組件,來實現爐體的升降。Optionally, the lifting drive mechanism 300 includes a drive member 310 and a transmission assembly 320, which connects the drive member 310 to the furnace body. The drive member 310 can be a motor, such as a stepper motor. The transmission assembly 320 can include a screw-nut assembly to achieve the lifting and lowering of the furnace body.

進一步的,單晶生長設備010還包括旋轉驅動機構230,旋轉驅動機構230與支撐軸220傳動連接,用於驅動支撐軸220轉動。通過在結晶之前令載物台210帶動坩堝020轉動,有利於使原料充分熔融,進而使雜質更有效地排布在晶體表面。Furthermore, single crystal growth apparatus 010 includes a rotary drive mechanism 230, which is rotatably connected to support shaft 220 and is used to drive support shaft 220 to rotate. By rotating crucible 020 with stage 210 before crystallization, the raw materials are fully melted, thereby more effectively distributing impurities on the crystal surface.

在本實施例中,穩流板170能夠相對於爐體上下移動,在晶體生長工藝中,其能夠隨坩堝020同步,相對於爐體升降。具體的,穩流板170相對於爐體的運動範圍限定在高溫區內,即爐腔的頂部到冷卻環140之間的區域。穩流板170在晶體生長工藝中隨坩堝020運動,因此在其抵達冷卻環140之前,坩堝020頂部空間不會因坩堝020相對於爐體下降而擴大,因此不會具有較大的空氣對流,有利於坩堝020附近溫度場的穩定。同時,根據能量守恆定律,由於穩流板170的隔熱作用,維持坩堝020附近溫度場穩定所需要熱量相對較小(相較於無穩流板170,坩堝020上方空間較大的情況),因此有利於降低設備能耗。In this embodiment, the flow stabilizing plate 170 is capable of moving up and down relative to the furnace body. During the crystal growth process, it can rise and fall synchronously with the crucible 020 relative to the furnace body. Specifically, the movement range of the flow stabilizing plate 170 relative to the furnace body is limited to the high-temperature zone, namely, the area between the top of the furnace cavity and the cooling ring 140. The flow stabilizing plate 170 moves with the crucible 020 during the crystal growth process. Therefore, before it reaches the cooling ring 140, the space above the crucible 020 does not expand due to the crucible 020 descending relative to the furnace body. Therefore, there is no significant air convection, which is beneficial to the stability of the temperature field near the crucible 020. At the same time, according to the law of conservation of energy, due to the insulating effect of the flow stabilizing plate 170, the heat required to maintain a stable temperature field near the crucible 020 is relatively small (compared to the case where there is no flow stabilizing plate 170 and the space above the crucible 020 is larger), which is beneficial to reducing the energy consumption of the equipment.

可選地,穩流板170的外周側與爐體的內壁滑動連接,以使穩流板170能夠相對爐體升降。比如,穩流板170的外周側設置滑塊,爐體內壁設置滑槽,穩流板170下表面抵接於坩堝020頂部,穩流板170即可隨坩堝020升降。可選地,穩流板170也可以是圓形,與爐體的內壁之間保持間隙。在可選的其他實施例中,穩流板170也可以與一個驅動組件傳動連接,通過驅動組件來驅動穩流板170相對於爐體升降。Optionally, the outer periphery of the flow stabilizing plate 170 is slidably connected to the inner wall of the furnace body, allowing the flow stabilizing plate 170 to be raised and lowered relative to the furnace body. For example, a slider is provided on the outer periphery of the flow stabilizing plate 170, and a chute is provided on the inner wall of the furnace body. The lower surface of the flow stabilizing plate 170 abuts the top of the crucible 020, allowing the flow stabilizing plate 170 to rise and fall with the crucible 020. Alternatively, the flow stabilizing plate 170 can be circular, maintaining a gap between it and the inner wall of the furnace body. In other optional embodiments, the flow stabilizing plate 170 can also be connected to a drive assembly, which drives the flow stabilizing plate 170 to rise and fall relative to the furnace body.

本發明實施例提供的單晶生長設備010的使用方法如下:The method of using the single crystal growth apparatus 010 provided in the embodiment of the present invention is as follows:

首先,將籽晶放入坩堝020底部,再將原料裝入坩堝020內,蓋好蓋板,將坩堝020放置於載物台210。按照晶體正常生長溫度,通過第一加熱組件111將高溫區提升至目標溫度,使原料完全熔融。在晶體生長前期,可以控制旋轉驅動機構230將坩堝020旋轉速度控制在0~30rpm,使其將原料充分熔融。待晶體開始生長時,停止旋轉,保持坩堝020穩定。First, place a seed crystal at the bottom of crucible 020, then load the raw material into crucible 020, secure the lid, and place crucible 020 on stage 210. Based on the normal crystal growth temperature, the first heating assembly 111 raises the high-temperature zone to the target temperature to completely melt the raw material. During the early stages of crystal growth, the rotation drive mechanism 230 can be controlled to maintain a rotation speed of 0-30 rpm in crucible 020 to fully melt the raw material. Once crystal growth begins, rotation is stopped to keep crucible 020 stable.

原料充分熔融後,控制升降驅動機構300按照設定的生長速率驅動爐體往上慢慢移動,此時坩堝020相對於爐體慢慢下降,冷卻環140內持續通入冷媒。當溫度場具有合適的溫度梯度時,通過上移爐體,使籽晶頂部與熔體緩慢經過固液介面進行接種。通過將爐體往上移動,使其熔體通過冷卻環140。在此過程中穩流板170同時跟隨坩堝020一起下降,可以防止熱量因爐體上移而快速散熱,導致設備功率上升以及爐腔對流空間的加大使溫度場出現波動。結晶溫度可以通過第一結晶監控熱電偶133和第二結晶監控熱電偶134進行監控,通過控制冷卻環140的冷媒流量,使其始終形成合適的結晶溫度梯度。冷卻環140還可以根據晶體生長長度所需進行上下適當調節。After the raw materials are fully melted, the lifting drive mechanism 300 is controlled to slowly move the furnace upward at the set growth rate. Crucible 020 then slowly descends relative to the furnace, and refrigerant is continuously introduced into the cooling ring 140. When the temperature field has an appropriate temperature gradient, the furnace body is moved upward, allowing the top of the seed crystal to slowly contact the melt through the solid-liquid interface. By moving the furnace body upward, the melt passes through the cooling ring 140. During this process, the flow plate 170 simultaneously descends with the crucible 020, preventing rapid heat dissipation due to the upward movement of the furnace body, which would increase equipment power and cause temperature fluctuations due to the increased convection space in the furnace cavity. The crystallization temperature can be monitored by the first crystallization monitoring thermocouple 133 and the second crystallization monitoring thermocouple 134. By controlling the refrigerant flow of the cooling ring 140, a suitable crystallization temperature gradient is always formed. The cooling ring 140 can also be appropriately adjusted up and down according to the required crystal growth length.

當坩堝020進入到第一保溫件150以下時,晶體進入退火區。通過退火監控熱電偶135能夠監控退火區的溫度是否適合晶體退火,同時可以通過退火控溫熱電偶136和第二加熱組件121對退火溫度進行調節。When crucible 020 enters below first heat preservation part 150, the crystal enters annealing zone. Annealing monitoring thermocouple 135 can monitor whether the temperature of annealing zone is suitable for crystal annealing. At the same time, annealing temperature control thermocouple 136 and second heating assembly 121 can adjust the annealing temperature.

第二保溫件160可根據退火溫度情況進行口徑大小的調節。可選地,在坩堝020下降的初始階段,第二保溫件160的通孔內緣到支撐軸220的距離小於10mm,待退火溫度達到設定溫度後,第二保溫件160的通孔內緣到支撐軸220的距離控制在10~30mm,具體可根據實際溫度與退火溫度的差值進行調節。The diameter of the second heat-insulating element 160 can be adjusted based on the annealing temperature. Optionally, during the initial descent of the crucible 020, the distance between the inner edge of the through-hole of the second heat-insulating element 160 and the support shaft 220 is less than 10 mm. After the annealing temperature reaches the set point, the distance between the inner edge of the through-hole of the second heat-insulating element 160 and the support shaft 220 is controlled to be between 10 and 30 mm. This distance can be adjusted based on the difference between the actual temperature and the annealing temperature.

可選地,根據生產需要,可以將本發明的單晶生長設備010做成陣列式的多工位,進行批量化生產。Optionally, according to production needs, the single crystal growth equipment 010 of the present invention can be made into an array of multiple stations for batch production.

本發明實施例提供的單晶生長設備010通過調節冷卻環140帶走的熱量,能夠很好的滿足各種晶體所需要的溫度梯度,以至於能夠製備出較佳品質的晶體。通過調節冷卻環140,可以有效的調節晶體生長早期、中期、後期各階段所需要的溫度梯度,能夠有效的進行排雜,以至於能夠製備出大尺寸的晶體。由於在爐腔內設置的穩流板170,在大尺寸晶體生長過程中,特別是中後期,因能夠對溫場起到穩定作用,為晶體生長提供了穩定的溫場,以至於能夠製備出大尺寸晶體。由於穩流板170可以給晶體製備提供穩定的溫場,所以有利於排雜,提高晶體品質。在原料熔融過程中,通過旋轉機構支撐軸220的有效旋轉,使得在晶體製備過程中,能夠對原料進行充分的熔融,進而使雜質更有效的排布於晶體表面,加上生長過程中,因穩流板170提供的穩定溫場,使得雜質能夠更有效地排至晶體頂部。通過設置穩流板170,還能夠有效地降低晶體在製備中後期能耗過高的問題。The single crystal growth apparatus 010 provided in this embodiment of the present invention can effectively meet the temperature gradient required by various crystals by adjusting the amount of heat removed by the cooling ring 140, thereby producing high-quality crystals. By adjusting the cooling ring 140, the temperature gradient required in the early, middle, and late stages of crystal growth can be effectively adjusted, effectively removing impurities, and thus producing large-sized crystals. Due to the flow stabilizing plate 170 installed in the furnace chamber, it can stabilize the temperature field during the growth process of large-sized crystals, especially in the middle and late stages, providing a stable temperature field for crystal growth, thereby enabling the production of large-sized crystals. Because flow stabilizing plate 170 provides a stable temperature field during crystal preparation, it facilitates impurity removal and improves crystal quality. During the raw material melting process, the effective rotation of the rotary support shaft 220 ensures that the raw material is fully melted, effectively distributing impurities on the crystal surface. Furthermore, during the growth process, the stable temperature field provided by flow stabilizing plate 170 allows impurities to be more effectively discharged to the top of the crystal. The installation of flow stabilizing plate 170 also effectively reduces excessive energy consumption in the later stages of crystal preparation.

以下通過兩個試驗例對本發明實施例的單晶生長設備010中的冷卻環140和穩流板170的功效進行說明。The following two experimental examples illustrate the effectiveness of the cooling ring 140 and the flow stabilizing plate 170 in the single crystal growth equipment 010 of the embodiment of the present invention.

一、以製備CNGS(Ca3NbGa3Si2O14)晶體為例。坩堝020長度為300mm,爐腔高度為400mm,晶體生長長度為180mm,其生長溫度1330℃(即高溫控溫熱電偶132設置控溫溫度為1387℃,使接種溫度高於熔點50℃)。1. Take the preparation of CNGS (Ca3NbGa3Si2O14) crystals as an example. Crucible 020 is 300mm long, the furnace chamber is 400mm high, the crystal growth length is 180mm, and the growth temperature is 1330°C (i.e., high-temperature thermocouple 132 is set to 1387°C, ensuring the inoculation temperature is 50°C above the melting point).

不設置冷卻環140(以保溫磚代替)和穩流板170時所測資料如下:The measured data when the cooling ring 140 is not installed (it is replaced by insulation bricks) and the flow plate 170 is as follows:

晶體化料階段,高溫監控熱電偶131所測溫度為1487℃,第一結晶監控熱電偶133所測溫度為1380℃,第二結晶監控熱電偶134所測溫度為1243℃,功率為2.46KW。During the crystallization stage, the temperature measured by the high-temperature monitoring thermocouple 131 was 1487°C, the temperature measured by the first crystallization monitoring thermocouple 133 was 1380°C, and the temperature measured by the second crystallization monitoring thermocouple 134 was 1243°C. The power was 2.46KW.

晶體生長至80mm時,高溫監控熱電偶131所測溫度為1492℃,第一結晶監控熱電偶133的溫度為1367℃,第二結晶監控熱電偶134的溫度為1252℃,功率為2.67KW。晶體宏觀上沒有異常情況,晶瑩剔透,用雷射觀察晶體內部,無光路,說明晶體排雜效果比較好。When the crystal grew to 80 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1492°C, the temperature of the first crystal monitoring thermocouple 133 was 1367°C, and the temperature of the second crystal monitoring thermocouple 134 was 1252°C. The power was 2.67 kW. Macroscopically, the crystal was crystal clear and showed no abnormalities. Laser observation of the interior of the crystal revealed no optical path, indicating that the crystal had good impurity removal.

晶體生長至130mm時,高溫監控熱電偶131所測溫度為1513℃,第一結晶監控熱電偶133的溫度為1356℃,第二結晶監控熱電偶134的溫度為1263℃,功率為3.12KW。用雷射觀察晶體內部,晶體從116mm開始出現微小的氣泡,但基本分佈於外表面。When the crystal grew to 130 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1513°C, the temperature of the first crystal monitoring thermocouple 133 was 1356°C, and the temperature of the second crystal monitoring thermocouple 134 was 1263°C. The power was 3.12 kW. Laser observation of the interior of the crystal revealed tiny bubbles starting at 116 mm, but these bubbles were primarily distributed on the outer surface.

晶體生長至180mm時,高溫監控熱電偶131所測溫度為1532℃,第一結晶監控熱電偶133的溫度為1338℃,第二結晶監控熱電偶134的溫度為1275℃,功率為3.98KW。用雷射觀察晶體內部,晶體從142mm處,雜質慢慢向中心包裹,晶體外表面氣泡、內部雜質較為明顯。When the crystal grew to 180 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1532°C, the temperature of the first crystal monitoring thermocouple 133 was 1338°C, and the temperature of the second crystal monitoring thermocouple 134 was 1275°C. The power was 3.98 kW. Laser observation of the interior of the crystal revealed that impurities gradually expanded toward the center of the crystal from 142 mm. Bubbles on the outer surface of the crystal and impurities within the crystal were more obvious.

圖3為不設置冷卻環140和穩流板170的情況下所生長的CNGS晶體情況。如圖3所示,從晶體頂部(圖3中方框區域)可以發現雜質比較明顯。Figure 3 shows a CNGS crystal grown without the cooling ring 140 and the flow stabilizing plate 170. As shown in Figure 3, impurities are more noticeable at the top of the crystal (the boxed area in Figure 3).

設置冷卻環140、穩流板170後所測資料如下:After installing the cooling ring 140 and the stabilizing plate 170, the measured data are as follows:

晶體化料階段,高溫監控熱電偶131所測溫度為1483℃,第一結晶監控熱電偶133的溫度為1376℃,第二結晶監控熱電偶134的溫度為1196℃,功率為2.31KW。During the crystallization stage, the temperature measured by the high-temperature monitoring thermocouple 131 was 1483°C, the temperature of the first crystallization monitoring thermocouple 133 was 1376°C, the temperature of the second crystallization monitoring thermocouple 134 was 1196°C, and the power was 2.31KW.

晶體生長至80mm時,高溫監控熱電偶131所測溫度為1485℃,第一結晶監控熱電偶133的溫度為1373℃,第二結晶監控熱電偶134的溫度為1193℃,功率為2.38KW。用雷射觀察晶體內部,無光路,說明晶體排雜效果比較好,和沒有設置冷卻環和穩流板沒有什麼區別。When the crystal grew to 80 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1485°C, the temperature of the first crystal monitoring thermocouple 133 was 1373°C, and the temperature of the second crystal monitoring thermocouple 134 was 1193°C. The power was 2.38 kW. Laser observation of the interior of the crystal revealed no optical path, indicating that the crystal's impurity removal was effective and indistinguishable from that obtained without the cooling ring and flow stabilizer.

晶體生長至130mm時,高溫監控熱電偶131所測溫度為1489℃,第一結晶監控熱電偶133的溫度為1367℃,第二結晶監控熱電偶134的溫度為1187℃,功率為2.52KW。用雷射觀察晶體內部,晶體同樣沒有發現雜質。When the crystal grew to 130 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1489°C, the temperature of the first crystal monitoring thermocouple 133 was 1367°C, and the temperature of the second crystal monitoring thermocouple 134 was 1187°C. The power was 2.52 kW. Laser observation of the interior of the crystal also revealed no impurities.

晶體生長至180mm時,高溫監控熱電偶131所測溫度為1492℃,第一結晶監控熱電偶133的溫度為1362℃,第二結晶監控熱電偶134的溫度為1183℃,功率為2.78KW。用雷射觀察,晶體在173mm以上開始出現氣泡、雜質,在173mm以下,晶體內部並無發現雜質、氣泡等,說明晶體總體生長品質比較好,排雜效果明顯。When the crystal grew to 180 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 1492°C, the temperature of the first crystallization monitoring thermocouple 133 was 1362°C, and the temperature of the second crystallization monitoring thermocouple 134 was 1183°C. The power was 2.78 kW. Laser observation showed that bubbles and impurities began to appear above 173 mm in the crystal. Below 173 mm, no impurities or bubbles were found inside the crystal, indicating that the overall growth quality of the crystal was good and the decontamination effect was significant.

圖4為本發明實施例的單晶生長設備010所生長的CNGS晶體情況。如圖4所示,晶體在173mm以上(圖4中方框和圓框內區域)才出現部分雜質。Figure 4 shows a CNGS crystal grown using single crystal growth apparatus 010 according to an embodiment of the present invention. As shown in Figure 4, some impurities only appear above 173 mm (the area within the square and circular boxes in Figure 4).

從上述資料對比可知,不設冷卻環140和穩流板170時,功率隨著晶體生長的長度加大而升高,能耗增加。同時,由於高溫區的空間越來越大,熱量不斷的向上散熱,空間對流加強,高溫區所測的溫度是一個動態的溫度,所以溫度相對偏高。晶體在生長結晶過程中,第一結晶監控熱電偶133會隨著晶體生長長度的增加而增大導熱,溫度逐漸下降。同時第二結晶監控熱電偶134因為晶體結晶後所處的區域因晶體自身潛熱的擴散,此區域的溫度逐漸升高,最終導致梯度變小,排雜能力變差。From the above data comparison, it can be seen that when the cooling ring 140 and the stabilizing plate 170 are not provided, the power increases as the length of the crystal growth increases, and energy consumption increases. At the same time, as the space in the high-temperature zone becomes larger and larger, heat is continuously dissipated upward, and spatial convection is enhanced. The temperature measured in the high-temperature zone is a dynamic temperature, so the temperature is relatively high. During the crystal growth and crystallization process, the first crystal monitoring thermocouple 133 will increase thermal conductivity as the crystal growth length increases, and the temperature gradually decreases. At the same time, the second crystal monitoring thermocouple 134 is located in the area where the crystal is located after crystallization. Due to the diffusion of the crystal's own latent heat, the temperature of this area gradually increases, which ultimately leads to a smaller gradient and a poorer impurity removal ability.

相反,設置冷卻環140和穩流板170後,晶體在化料階段因為冷卻環140帶走一部分熱量的緣故,功率相對沒有設冷卻環高,但晶體慢慢開始生長後,功率相對趨於穩定,波動較小。高溫區也因在穩流板170的作用下,減小了高溫區爐腔的對流,熱電偶所測溫度相對波動較小。同時,第一結晶監控熱電偶133和第二結晶監控熱電偶134,因冷卻環140的作用下,前期溫度相對較低,但後期相對波動較小。從梯度來看,雖然設置了冷卻環140和穩流板170後,在晶體製備後期梯度有所波動,但相比前者來說,這個波動已經很小,並且是可以接受的。這種有效控制晶體生長過程梯度趨於穩定狀態是製備大尺寸晶體很關鍵的因素。In contrast, with cooling ring 140 and stabilizing plate 170 installed, power is lower during the crystal formation phase because cooling ring 140 removes some heat. However, as crystal growth gradually begins, power becomes more stable, with less fluctuation. In the high-temperature zone, stabilizing plate 170 reduces convection within the furnace cavity, resulting in less temperature fluctuation in the thermocouples. Furthermore, the first and second crystal monitoring thermocouples 133 and 134 maintain relatively low temperatures during the initial stages of crystal formation due to the cooling ring 140, but experience relatively less fluctuation in the later stages. From a gradient perspective, although the installation of cooling ring 140 and stabilizing plate 170 resulted in some fluctuations in the gradient in the later stages of crystal preparation, these fluctuations were minimal and acceptable compared to the previous stage. This effective control of the gradient during crystal growth, ensuring a stable state, is crucial for producing large-scale crystals.

二、以製備TeO2晶體為例。坩堝020長度為300mm,爐腔高度為400mm,晶體生長長度為180mm,其生長溫度733℃(高溫控溫熱電偶132設置控溫溫度為780℃)。2. Take the preparation of TeO2 crystals as an example. Crucible 020 is 300mm long, the furnace chamber is 400mm high, the crystal growth length is 180mm, and the growth temperature is 733°C (high temperature control thermocouple 132 is set to 780°C).

不設置冷卻環140(以保溫磚代替)和穩流板170所測資料如下:The measured data without the cooling ring 140 (replaced with insulation bricks) and the flow plate 170 are as follows:

晶體化料階段,高溫監控熱電偶131所測溫度為865℃,第一結晶監控熱電偶133的溫度為772℃,第二結晶監控熱電偶134的溫度為618℃,功率為1.92KW。During the crystallization stage, the temperature measured by the high-temperature monitoring thermocouple 131 was 865°C, the temperature of the first crystallization monitoring thermocouple 133 was 772°C, the temperature of the second crystallization monitoring thermocouple 134 was 618°C, and the power was 1.92KW.

晶體生長至80mm時,高溫監控熱電偶131所測溫度為876℃,第一結晶監控熱電偶133的溫度為765℃,第二結晶監控熱電偶134的溫度為624℃,功率為2.13KW。用雷射觀察晶體,並無發現雜質、氣泡等。When the crystal grew to 80 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 876°C, the temperature of the first crystal monitoring thermocouple 133 was 765°C, and the temperature of the second crystal monitoring thermocouple 134 was 624°C. The power was 2.13 kW. Laser observation of the crystal revealed no impurities or bubbles.

晶體生長至130mm時,高溫監控熱電偶131所測溫度為891℃,第一結晶監控熱電偶133的溫度為753℃,第二結晶監控熱電偶134的溫度為633℃,功率為2.36KW。用雷射觀察晶體,晶體從123mm處開始具有微小氣泡,微小氣泡形成於晶體表面。When the crystal grew to 130 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 891°C, the temperature of the first crystallization monitoring thermocouple 133 was 753°C, and the temperature of the second crystallization monitoring thermocouple 134 was 633°C. The power was 2.36 kW. Laser observation of the crystal revealed tiny bubbles starting at 123 mm, forming on the crystal surface.

晶體生長至180mm時,高溫監控熱電偶131所測溫度為904℃,第一結晶監控熱電偶133的溫度為741℃,第二結晶監控熱電偶134的溫度為645℃,功率為2.84KW。用雷射觀察晶體內部,晶體從156mm處開始慢慢出現微弱的光路,晶體從159mm開始出現外表面氣泡以及內部雜質,雜質集中分佈於晶體頂部以下10mm範圍內。When the crystal grew to 180 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 904°C, the temperature of the first crystal monitoring thermocouple 133 was 741°C, and the temperature of the second crystal monitoring thermocouple 134 was 645°C. The power was 2.84 kW. Laser observation of the interior of the crystal revealed a faint optical path starting at 156 mm. At 159 mm, bubbles began to appear on the outer surface of the crystal, along with internal impurities. The impurities were concentrated within 10 mm below the top of the crystal.

圖5為不設置冷卻環140和穩流板170的情況下所生長的TeO 2晶體情況。如圖5所示,晶體在159mm處及以上(圖5中方框內區域)開始慢慢出現雜質。 Figure 5 shows a TeO2 crystal grown without the cooling ring 140 and the stabilizing plate 170. As shown in Figure 5, impurities begin to appear in the crystal at and above 159 mm (the area within the box in Figure 5).

設置冷卻環140、穩流板170之後所測資料如下:After installing the cooling ring 140 and the flow stabilizing plate 170, the measured data are as follows:

晶體化料階段,高溫監控熱電偶131所測溫度為863℃,第一結晶監控熱電偶133的溫度為776℃,第二結晶監控熱電偶134的溫度為626℃,功率為1.81KW。During the crystallization stage, the temperature measured by the high-temperature monitoring thermocouple 131 was 863°C, the temperature of the first crystallization monitoring thermocouple 133 was 776°C, the temperature of the second crystallization monitoring thermocouple 134 was 626°C, and the power was 1.81KW.

晶體生長至80mm時,高溫監控熱電偶131所測溫度為865℃,第一結晶監控熱電偶133的溫度為774℃,第二結晶監控熱電偶134的溫度為624℃,功率為1.89KW。用雷射觀察晶體,並無發現雜質、氣泡等。When the crystal grew to 80 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 865°C, the temperature of the first crystallization monitoring thermocouple 133 was 774°C, and the temperature of the second crystallization monitoring thermocouple 134 was 624°C. The power was 1.89 kW. Laser observation of the crystal revealed no impurities or bubbles.

晶體生長至130mm時,高溫監控熱電偶131所測溫度為867℃,第一結晶監控熱電偶133的溫度為772℃,第二結晶監控熱電偶134的溫度為622℃,功率為2.11KW。用雷射觀察晶體內部,沒有發現雜質。When the crystal grew to 130 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 867°C, the temperature of the first crystal monitoring thermocouple 133 was 772°C, and the temperature of the second crystal monitoring thermocouple 134 was 622°C. The power was 2.11 kW. Laser observation of the interior of the crystal revealed no impurities.

晶體生長至180mm時,高溫監控熱電偶131所測溫度為871℃,第一結晶監控熱電偶133的溫度為771℃,第二結晶監控熱電偶134的溫度為621℃,功率為2.35KW。用雷射觀察晶體內部,晶體從173mm處開始慢慢出現微弱的光路,經過對晶體的單線切割後發現是氣泡。晶體從175mm到晶體頂部出現大量的雜質。When the crystal grew to 180 mm, the temperature measured by high-temperature monitoring thermocouple 131 was 871°C, the temperature of the first crystal monitoring thermocouple 133 was 771°C, and the temperature of the second crystal monitoring thermocouple 134 was 621°C. The power was 2.35 kW. Laser observation of the interior of the crystal revealed a faint optical path starting at 173 mm. Single-wire cutting of the crystal revealed bubbles. A large amount of impurities appeared from 175 mm to the top of the crystal.

圖6為本發明實施例的單晶生長設備010所生長的TeO 2晶體情況。如圖6所示,晶體在175mm處及以上(圖6中方框內區域)開始出現雜質。 Figure 6 shows a TeO2 crystal grown using the single crystal growth apparatus 010 according to an embodiment of the present invention. As shown in Figure 6, impurities begin to appear in the crystal at and above 175 mm (the area within the box in Figure 6).

從上述資料對比可知,本發明實施例提供的單晶生長設備製備TeO2晶體的效果同樣明顯,只因所需溫度相對較低,在節能方面相對於高溫晶體來說沒有那麼明顯。但對於製備大尺寸晶體所體現的排雜等效果是一樣關鍵和重要。As can be seen from the above data comparison, the single crystal growth apparatus provided by the present invention is equally effective in producing TeO2 crystals. Due to the relatively low temperature required, the energy savings are not as significant as those achieved with high-temperature crystals. However, the impurity removal effects demonstrated in producing large-scale crystals are equally crucial and important.

由上述兩個試驗例可見,在使用放置保溫磚代替冷卻環140且未設置穩流板170的方式的情況下,晶體在生長起始階段,變化不大,但隨著晶體生長至140mm左右之後,由於晶體自身排雜能力越來越差,加上晶體自身導熱等因素影響下,晶體表面雜質會越來越多,這樣製備出的晶體尺寸上受限,無法製備出品質較佳的大尺寸晶體。在使用冷卻環140進行的情況下,能夠有效的根據晶體品種所需要的溫梯度,通過冷卻環140進行有效調節,使晶體生長早期、中期、後期都能達到所需要的溫梯度,這樣有利於製備出大尺寸、品質完好的單晶。並且隨著晶體生長至80mm之後,由於爐腔空間越來越大,空氣對流所引起的流動性越來越強,高溫監控熱電偶131所測的溫度也逐漸上升。因高溫控溫熱電偶132溫度設置是恒定的,根據能量守恆定律,設備需要提供更高的功率來維持這個溫度平衡,故能耗在生長後期逐漸加大。在放置有穩流板170的情況下,爐腔高溫監控熱電偶131在晶體生長起始階段,因頂部空間不大,所以溫度變化不大。通過資料可以發現,雖然晶體生長至80mm、130mm、180mm三個階段高溫監控熱電偶131溫度雖然有些上升,但由於坩堝020頂部隔著穩流板170,爐腔頂部空氣流動性相對較差,高溫監控熱電偶131所測的溫度相較與沒放置穩流板170變化較小。同時也可以通過對比控制設備功率表功率變化情況發現,在加了穩流板170的情況下,晶體生長至中後期,功率相較於沒加穩流板170低。The two experimental examples above show that when using insulation bricks instead of cooling rings 140 and without stabilizing plates 170, the crystal growth rate remains relatively stable during the initial growth phase. However, as the crystal grows to approximately 140 mm, impurities on the surface of the crystal increase due to the crystal's inherent impurity removal capabilities becoming increasingly poor and, due to factors such as the crystal's own thermal conductivity, the crystal's surface impurities become increasingly numerous. This limits the size of the produced crystals, making it impossible to produce high-quality, large-sized crystals. Using cooling rings 140, the temperature gradient required by the crystal type can be effectively adjusted through cooling rings 140, ensuring that the desired temperature gradient is achieved in the early, middle, and late stages of crystal growth. This facilitates the production of large, high-quality single crystals. As the crystal grows to 80 mm, the furnace cavity space becomes larger and the fluidity caused by air convection becomes stronger, causing the temperature measured by high-temperature monitoring thermocouple 131 to gradually rise. Because the temperature setting of high-temperature control thermocouple 132 is constant, according to the law of conservation of energy, the equipment needs to provide higher power to maintain this temperature balance, so energy consumption gradually increases in the later stages of growth. With the flow stabilizing plate 170 in place, the temperature of the furnace cavity high-temperature monitoring thermocouple 131 does not fluctuate much during the initial crystal growth stage because the top space is limited. The data reveals that while the temperature of high-temperature monitoring thermocouple 131 rose slightly at the 80mm, 130mm, and 180mm crystal growth stages, the relatively poor air flow at the top of the furnace chamber due to the presence of flow stabilizer 170 above crucible 020 led to smaller temperature fluctuations compared to when flow stabilizer 170 was not in place. Comparing the power changes on the control equipment's power meter reveals that with flow stabilizer 170 in place, power consumption was lower in the middle and late stages of crystal growth.

以上,僅為本發明的具體實施方式,但本發明的保護範圍並不局限於此,任何熟悉本技術領域的技術人員在本發明揭露的技術範圍內,可輕易想到的變化或替換,都應涵蓋在本發明的保護範圍之內。因此,本發明的保護範圍應以申請專利範圍的保護範圍為準。The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that a person skilled in the art could easily conceive of within the technical scope disclosed herein should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the patent application.

010:單晶生長設備 020:坩堝 110:上爐體 111:第一加熱組件 120:下爐體 121:第二加熱組件 131:高溫監控熱電偶 132:高溫控溫熱電偶 133:第一結晶監控熱電偶 134:第二結晶監控熱電偶 135:退火監控熱電偶 136:退火控溫熱電偶 140:冷卻環 141:第一管路 142:第二管路 150:第一保溫件 160:第二保溫件 170:穩流板 200:支撐組件 210:載物台 220:支撐軸 230:旋轉驅動機構 300:升降驅動機構 310:驅動件 320:傳動組件 010: Single Crystal Growth Equipment 020: Crucible 110: Upper Furnace 111: First Heating Assembly 120: Lower Furnace 121: Second Heating Assembly 131: High-Temperature Monitoring Thermocouple 132: High-Temperature Control Thermocouple 133: First Crystallization Monitoring Thermocouple 134: Second Crystallization Monitoring Thermocouple 135: Annealing Monitoring Thermocouple 136: Annealing Control Thermocouple 140: Cooling Ring 141: First Pipeline 142: Second Pipeline 150: First Insulation Component 160: Second Insulation Component 170: Flow Stabilizer 200: Support Assembly 210: Stage 220: Support shaft 230: Rotary drive mechanism 300: Lifting drive mechanism 310: Drive element 320: Transmission assembly

為了更清楚地說明本發明實施例的技術方案,下面將對實施例中所需要使用的附圖作簡單地介紹,應當理解,以下附圖僅示出了本發明的某些實施例,因此不應被看作是對範圍的限定,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據這些附圖獲得其他相關的附圖。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without any creative effort.

圖1為本發明一種實施例中單晶生長設備的示意圖; 圖2為本發明一種實施例中單晶生長設備的剖視圖; 圖3為不設置冷卻環和穩流板的情況下所生長的CNGS晶體情況; 圖4為本發明實施例的單晶生長設備所生長的CNGS晶體情況; 圖5為不設置冷卻環和穩流板的情況下所生長的TeO 2晶體情況; 圖6為本發明實施例的單晶生長設備所生長的TeO 2晶體情況。 Figure 1 is a schematic diagram of a single crystal growth apparatus in an embodiment of the present invention; Figure 2 is a cross-sectional view of the single crystal growth apparatus in an embodiment of the present invention; Figure 3 shows a CNGS crystal grown without a cooling ring and a stabilizing plate; Figure 4 shows a CNGS crystal grown by the single crystal growth apparatus in an embodiment of the present invention; Figure 5 shows a TeO2 crystal grown without a cooling ring and a stabilizing plate; and Figure 6 shows a TeO2 crystal grown by the single crystal growth apparatus in an embodiment of the present invention.

020:坩堝 020: Crucible

110:上爐體 110: Upper furnace body

111:第一加熱組件 111: First heating component

120:下爐體 120: Lower furnace body

121:第二加熱組件 121: Second heating component

131:高溫監控熱電偶 131: High temperature monitoring thermocouple

132:高溫控溫熱電偶 132: High temperature control thermocouple

133:第一結晶監控熱電偶 133: First crystal monitoring thermocouple

134:第二結晶監控熱電偶 134: Second crystal monitoring thermocouple

135:退火監控熱電偶 135: Annealing monitoring thermocouple

136:退火控溫熱電偶 136: Annealing temperature control thermocouple

140:冷卻環 140: Cooling Ring

141:第一管路 141: First pipeline

142:第二管路 142: Second pipeline

150:第一保溫件 150: First insulation component

160:第二保溫件 160: Second insulation component

170:穩流板 170: Flow stabilizer

200:支撐組件 200: Support assembly

210:載物台 210: Stage

220:支撐軸 220: Support shaft

230:旋轉驅動機構 230: Rotary drive mechanism

300:升降驅動機構 300: Lifting drive mechanism

310:驅動件 310: Drive parts

320:傳動組件 320: Transmission components

Claims (10)

一種單晶生長設備,其特徵在於,包括: 爐體,所述爐體形成爐腔,所述爐體的內側設置有加熱組件; 支撐組件,包括載物台與支撐軸,所述載物台位於所述爐腔內,用於放置坩堝,所述支撐軸的一端連接於所述載物台底部,另一端從所述爐體的下端伸出所述爐腔; 升降驅動機構,用於驅動所述爐體和/或支撐組件,以使所述爐體相對於所述支撐組件升降; 穩流板,位於所述爐腔內且間隔地設置於位於所述載物台的上方,所述穩流板可隨所述載物台相對於所述爐體升降;以及 冷卻環,設置於所述爐腔內,所述冷卻環中部形成通孔,用於供所述載物台和所述支撐軸穿過,所述冷卻環內部形成供冷媒流動的冷卻通道,所述冷卻環通過第一管路和第二管路與所述爐體的外部連通。 A single crystal growth apparatus is characterized by comprising: a furnace body, the furnace body forming a furnace cavity, a heating assembly disposed inside the furnace body; a support assembly, comprising a carrier and a support shaft, the carrier being located within the furnace cavity and used to place a crucible, one end of the support shaft being connected to the bottom of the carrier and the other end extending out of the furnace cavity from the lower end of the furnace body; a lifting drive mechanism for driving the furnace body and/or the support assembly to cause the furnace body to rise and fall relative to the support assembly; a flow stabilizing plate, located within the furnace cavity and spaced apart above the carrier, the flow stabilizing plate being capable of rising and falling relative to the furnace body along with the carrier; and A cooling ring is disposed within the furnace cavity. A through hole is formed in the center of the cooling ring for the stage and the support shaft to pass through. A cooling channel is formed inside the cooling ring for the flow of refrigerant. The cooling ring is connected to the outside of the furnace body through a first pipeline and a second pipeline. 如請求項1所述的單晶生長設備,其特徵在於,所述單晶生長設備包括冷源,所述冷源連接於所述第一管路。The single crystal growth apparatus as described in claim 1 is characterized in that the single crystal growth apparatus includes a cooling source connected to the first pipeline. 如請求項2所述的單晶生長設備,其特徵在於,所述冷源通過所述第一管路、所述第二管路與所述冷卻環形成冷卻回路。The single crystal growth apparatus as described in claim 2 is characterized in that the cooling source forms a cooling circuit through the first pipeline, the second pipeline and the cooling ring. 如請求項3所述的單晶生長設備,其特徵在於,所述冷媒為水,所述冷源包括冷水機。The single crystal growth apparatus as described in claim 3 is characterized in that the refrigerant is water and the cooling source includes a chiller. 如請求項1所述的單晶生長設備,其特徵在於,所述加熱組件包括第一加熱組件和第二加熱組件,所述第一加熱組件間隔地設置於所述第二加熱組件上方,所述冷卻環設置於所述第一加熱組件和所述第二加熱組件之間。The single crystal growth device as described in claim 1 is characterized in that the heating component includes a first heating component and a second heating component, the first heating component is arranged above the second heating component at intervals, and the cooling ring is arranged between the first heating component and the second heating component. 如請求項5所述的單晶生長設備,其特徵在於,所述爐體內設置有第一保溫件,所述第一保溫件凸設於所述爐腔的內壁,並沿所述爐腔的周向延伸而形成環狀,所述第一保溫件的中部形成供所述載物台和所述支撐軸穿過的通孔,所述第一保溫件在豎直方向上位於所述第一加熱組件和第二加熱組件之間,所述冷卻環位於所述第一加熱組件的下端,所述第一保溫件位於所述第二加熱組件的上端,所述冷卻環間隔地設置於所述第一保溫件上方。The single crystal growth equipment as described in claim 5 is characterized in that a first heat-insulating member is provided in the furnace body, the first heat-insulating member is protruded from the inner wall of the furnace cavity and extends along the circumference of the furnace cavity to form a ring shape, a through hole is formed in the middle of the first heat-insulating member for the worktable and the support shaft to pass through, the first heat-insulating member is located between the first heating component and the second heating component in the vertical direction, the cooling ring is located at the lower end of the first heating component, the first heat-insulating member is located at the upper end of the second heating component, and the cooling ring is arranged at intervals above the first heat-insulating member. 如請求項6所述的單晶生長設備,其特徵在於,所述爐體內設置有第二保溫件,所述第二保溫件凸設於所述爐腔的所述內壁,並沿所述爐腔的周向延伸而形成環狀,所述第二保溫件的中部形成供所述載物台和所述支撐軸穿過的通孔,所述第二保溫件設置於所述第二加熱組件的下方。The single crystal growth equipment as described in claim 6 is characterized in that a second thermal insulation member is provided in the furnace body, the second thermal insulation member is protruded from the inner wall of the furnace cavity and extends along the circumference of the furnace cavity to form a ring shape, a through hole is formed in the middle of the second thermal insulation member for the worktable and the support shaft to pass through, and the second thermal insulation member is arranged below the second heating assembly. 如請求項7所述的單晶生長設備,其特徵在於,所述第二保溫件的通孔的口徑可調。The single crystal growth apparatus as described in claim 7 is characterized in that the diameter of the through hole of the second heat-insulating member is adjustable. 如請求項1所述的單晶生長設備,其特徵在於,所述穩流板的外周側與所述爐體的內壁滑動連接,以使所述穩流板能夠相對所述爐體升降。The single crystal growth apparatus as claimed in claim 1 is characterized in that the outer peripheral side of the flow stabilizing plate is slidably connected to the inner wall of the furnace body so that the flow stabilizing plate can be raised and lowered relative to the furnace body. 如請求項1所述的單晶生長設備,其特徵在於,所述單晶生長設備還包括旋轉驅動機構,所述旋轉驅動機構與所述支撐軸傳動連接,用於驅動所述支撐軸轉動。The single crystal growth apparatus as described in claim 1 is characterized in that the single crystal growth apparatus further includes a rotation drive mechanism, which is transmission-connected to the support shaft and is used to drive the support shaft to rotate.
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CN118207628B (en) * 2024-05-21 2024-07-26 浙江康鹏半导体有限公司 Gallium arsenide monocrystal growing device and preparation method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534798A (en) * 2012-01-06 2012-07-04 西安交通大学 High-temperature high-pressure crystal growth equipment
CN203846135U (en) * 2014-03-28 2014-09-24 江苏华盛天龙光电设备股份有限公司 Lift type monocrystalline silicon furnace
CN218812214U (en) * 2022-11-17 2023-04-07 磐石创新(江苏)电子装备有限公司 Multifunctional crystal growth furnace
CN116536755A (en) * 2023-04-25 2023-08-04 南京宏泰晶智能装备科技有限公司 Preparation method and growth device for growth of multiple silicon carbide crystals

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534798A (en) * 2012-01-06 2012-07-04 西安交通大学 High-temperature high-pressure crystal growth equipment
CN203846135U (en) * 2014-03-28 2014-09-24 江苏华盛天龙光电设备股份有限公司 Lift type monocrystalline silicon furnace
CN218812214U (en) * 2022-11-17 2023-04-07 磐石创新(江苏)电子装备有限公司 Multifunctional crystal growth furnace
CN116536755A (en) * 2023-04-25 2023-08-04 南京宏泰晶智能装备科技有限公司 Preparation method and growth device for growth of multiple silicon carbide crystals

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