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TWI887572B - Circuit path simplifying method and system thereof - Google Patents

Circuit path simplifying method and system thereof Download PDF

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TWI887572B
TWI887572B TW111137471A TW111137471A TWI887572B TW I887572 B TWI887572 B TW I887572B TW 111137471 A TW111137471 A TW 111137471A TW 111137471 A TW111137471 A TW 111137471A TW I887572 B TWI887572 B TW I887572B
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TW202414266A (en
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蔡璧禧
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大陸商環勝電子(深圳)有限公司
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Abstract

A circuit path simplifying method and a system thereof are proposed. An initial path sequence obtaining step is performed to obtain a plurality of initial path sequences. Each of the initial path sequences includes a plurality of component labels and a plurality of path labels, and the component labels and the path labels are alternately arranged with each other. A path label searching step is performed to search for the same path label to generate a path label confirming result. A component label comparing step is performed to compare whether two component labels adjacent to the same path label are identical according to the path label confirming result. In response to determining that the two component labels are identical, a merging step is performed to generate a merged component label and a merged path label. In response to determining that the two component labels are not identical, the arranging step is performed to generate an arranged component label and the merged line label. Therefore, the initial path sequences are simplified into a simplified path sequence.

Description

電路路徑簡化方法及其系統Circuit path simplification method and system

本發明係關於一種電子數位資料處理技術,特別是關於一種電路路徑簡化方法及其系統。The present invention relates to an electronic digital data processing technology, and more particularly to a circuit path simplification method and system thereof.

隨著電路的複雜度提高,在電路圖中要判斷二電子元件是否有線路連接,或者是要判斷某一電子元件所受到的偏壓或流經的電流實屬不便,且前述過程不只耗費較多時間,甚至會產生人為疏失。倘若以電腦軟體來協助判斷,則需要將電路圖轉化為電腦進行運算與處理的文字資料型態。商業電腦軟體雖有資料轉換的格式與其內部處理的程序,但通常是營業機密並無法對外公開。學術上電路表示法,例如:積體電路用模擬程式(Simulation Program with Integrated Circuit Emphasis;SPICE),其雖可表示出電路圖上的各電子元件之間的連接關係,但在查找過程中連接關係較不直覺而無法快速辨識。As circuits become more complex, it is inconvenient to determine whether two electronic components are connected in a circuit diagram, or to determine the bias voltage or current flowing through a certain electronic component. The above process is not only time-consuming, but may also lead to human errors. If computer software is used to assist in the judgment, the circuit diagram needs to be converted into text data for computer calculation and processing. Although commercial computer software has data conversion formats and internal processing procedures, they are usually trade secrets and cannot be disclosed to the public. Academic circuit representation methods, such as the Simulation Program with Integrated Circuit Emphasis (SPICE), can show the connection relationship between the various electronic components on the circuit diagram, but the connection relationship is not intuitive and cannot be quickly identified during the search process.

當二電子元件之間的線路查找完畢時,通常會出現複數條路徑。路徑上的線路有時還會在其他電子元件間的路徑上出現,這種並聯電路關係可供判斷元件上的分壓/分流或訊號分流。但是,目前仍需要人為去花費大量時間來查找電路圖內的並聯關係。當電路複雜且電子元件數量較多時,人為查找就顯得困難。When the line search between two electronic components is completed, multiple paths usually appear. The lines on the path sometimes appear on the paths between other electronic components. This parallel circuit relationship can be used to determine the voltage/current division or signal division on the component. However, it still takes a lot of time to manually search for parallel relationships in the circuit diagram. When the circuit is complex and the number of electronic components is large, manual search becomes difficult.

有鑑於此,如何開發一種能顯示電路之間有無並聯關係且可簡化多條路徑的方法及其系統,實為須努力研發突破之目標及方向。In view of this, how to develop a method and system that can display whether there is a parallel relationship between circuits and can simplify multiple paths is indeed a goal and direction that requires hard work and breakthrough research and development.

因此,本發明之目的在於提供一種電路路徑簡化方法及其系統,其透過元件標籤與線路標籤所形成的初始路徑序列,以簡易地呈現電路路徑的連接關係,然後依據於多個初始路徑序列中相同的線路標籤來合併線路標籤且排列元件標籤,進而簡化多個初始路徑序列為簡化後路徑序列。Therefore, the purpose of the present invention is to provide a circuit path simplification method and system, which uses an initial path sequence formed by component labels and line labels to simply present the connection relationship of the circuit path, and then merges the line labels and arranges the component labels according to the same line labels in multiple initial path sequences, thereby simplifying multiple initial path sequences into simplified path sequences.

依據本發明的一實施方式提供一種電路路徑簡化方法,其用以簡化對應一電路圖的複數初始路徑序列,且電路圖包含複數電子元件及複數線路。電路路徑簡化方法包含一初始路徑序列取得步驟、一線路標籤查找步驟及一元件標籤比對步驟。初始路徑序列取得步驟係驅動一運算處理單元從一儲存單元取得對應電路圖的此些初始路徑序列。各初始路徑序列包含對應部分此些電子元件的複數元件標籤及對應部分此些線路的複數線路標籤,且此些元件標籤及此些線路標籤彼此交互排列。線路標籤查找步驟係驅動運算處理單元於此些初始路徑序列中查找相同的其中一線路標籤而產生一線路標籤確認結果。元件標籤比對步驟係驅動運算處理單元依據線路標籤確認結果比對其中二初始路徑序列中相鄰列於其中一線路標籤的二元件標籤是否相同,以簡化此些初始路徑序列。當二元件標籤為相同時,驅動運算處理單元執行一合併步驟。合併步驟係合併其中二初始路徑序列之二元件標籤而產生一合併後元件標籤,並合併其中二初始路徑序列之其中一線路標籤而產生一合併後線路標籤。合併後元件標籤與合併後線路標籤排列以形成一簡化後路徑序列。當二元件標籤不相同時,驅動運算處理單元執行一排列步驟。排列步驟係排列其中二初始路徑序列之二元件標籤而產生一排列後元件標籤,並合併其中二初始路徑序列之其中一線路標籤而產生合併後線路標籤。排列後元件標籤與合併後線路標籤排列以形成另一簡化後路徑序列。According to an embodiment of the present invention, a circuit path simplification method is provided, which is used to simplify a plurality of initial path sequences corresponding to a circuit diagram, and the circuit diagram includes a plurality of electronic components and a plurality of circuits. The circuit path simplification method includes an initial path sequence acquisition step, a circuit label search step, and a component label matching step. The initial path sequence acquisition step is to drive an operation processing unit to obtain these initial path sequences corresponding to the circuit diagram from a storage unit. Each initial path sequence includes a plurality of component labels corresponding to a portion of these electronic components and a plurality of circuit labels corresponding to a portion of these circuits, and these component labels and these circuit labels are arranged alternately with each other. The circuit label search step drives the operation processing unit to search for the same circuit label in these initial path sequences to generate a circuit label confirmation result. The component label comparison step drives the operation processing unit to compare whether two component labels in adjacent columns of one of the circuit labels in two of the initial path sequences are the same according to the circuit label confirmation result, so as to simplify these initial path sequences. When the two component labels are the same, the operation processing unit is driven to execute a merging step. The merging step merges the two component labels of two of the initial path sequences to generate a merged component label, and merges one of the circuit labels of two of the initial path sequences to generate a merged circuit label. The merged component label and the merged line label are arranged to form a simplified path sequence. When the two component labels are different, the operation processing unit is driven to execute an arrangement step. The arrangement step arranges the two component labels of the two initial path sequences to generate an arranged component label, and merges one line label of the two initial path sequences to generate a merged line label. The arranged component label and the merged line label are arranged to form another simplified path sequence.

依據本發明的另一實施方式提供一種電路路徑簡化系統,其用以簡化對應一電路圖的複數初始路徑序列,且電路圖包含複數電子元件及複數線路。電路路徑簡化系統包含一儲存單元與一運算處理單元。儲存單元儲存對應電路圖的此些初始路徑序列。各初始路徑序列包含對應部分此些電子元件的複數元件標籤及對應部分此些線路的複數線路標籤,且此些元件標籤及此些線路標籤彼此交互排列。運算處理單元連接儲存單元並取得此些初始路徑序列,且運算處理單元經配置以實施一線路標籤查找步驟與一元件標籤比對步驟。線路標籤查找步驟係於此些初始路徑序列中查找相同的其中一線路標籤而產生一線路標籤確認結果。元件標籤比對步驟係依據線路標籤確認結果比對其中二初始路徑序列中相鄰列於其中一線路標籤的二元件標籤是否相同,以簡化此些初始路徑序列。當二元件標籤為相同時,運算處理單元執行一合併步驟。合併步驟係合併其中二初始路徑序列之二元件標籤而產生一合併後元件標籤,並合併其中二初始路徑序列之其中一線路標籤而產生一合併後線路標籤。合併後元件標籤與合併後線路標籤排列以形成一簡化後路徑序列。當二元件標籤不相同時,運算處理單元執行一排列步驟。排列步驟係排列其中二初始路徑序列之二元件標籤而產生一排列後元件標籤,並合併其中二初始路徑序列之其中一線路標籤而產生合併後線路標籤。排列後元件標籤與合併後線路標籤排列以形成另一簡化後路徑序列。According to another embodiment of the present invention, a circuit path simplification system is provided, which is used to simplify a plurality of initial path sequences corresponding to a circuit diagram, and the circuit diagram includes a plurality of electronic components and a plurality of circuits. The circuit path simplification system includes a storage unit and an operation processing unit. The storage unit stores these initial path sequences corresponding to the circuit diagram. Each initial path sequence includes a plurality of component labels corresponding to a portion of these electronic components and a plurality of circuit labels corresponding to a portion of these circuits, and these component labels and these circuit labels are arranged alternately with each other. The operation processing unit is connected to the storage unit and obtains these initial path sequences, and the operation processing unit is configured to implement a circuit label search step and a component label comparison step. The line label search step is to search for the same one of the line labels in these initial path sequences to generate a line label confirmation result. The component label comparison step is to compare whether the two component labels in the adjacent line labels in two of the initial path sequences are the same based on the line label confirmation result, so as to simplify these initial path sequences. When the two component labels are the same, the operation processing unit executes a merging step. The merging step is to merge the two component labels of two of the initial path sequences to generate a merged component label, and merge one of the line labels of two of the initial path sequences to generate a merged line label. The merged component label and the merged line label are arranged to form a simplified path sequence. When the two component labels are different, the operation processing unit executes an arrangement step. The arrangement step arranges the two component labels of the two initial path sequences to generate an arranged component label, and merges one of the line labels of the two initial path sequences to generate a merged line label. The arranged component label and the merged line label are arranged to form another simplified path sequence.

藉此,本發明之電路路徑簡化方法及其系統,其在所有初始路徑序列中找到相同的線路標籤,然後合併相同的元件標籤而產生合併後元件標籤,或排列不同的元件標籤而產生排列後元件標籤,且合併相同的線路標籤而產生合併後線路標籤,進而簡化多個初始路徑序列為簡化後路徑序列。Thus, the circuit path simplification method and system of the present invention finds the same line labels in all initial path sequences, then merges the same component labels to generate merged component labels, or arranges different component labels to generate arranged component labels, and merges the same line labels to generate merged line labels, thereby simplifying multiple initial path sequences into simplified path sequences.

請一併參照第1圖與第2圖,其中第1圖係繪示依照本發明之第一實施例之電路路徑簡化方法100的流程示意圖;以及第2圖係繪示本發明之電路路徑簡化方法100應用於多個初始路徑序列I 1、I 2、I 3、I 4、I 5的示意圖。如圖所示,電路路徑簡化方法100包含初始路徑序列取得步驟S02、線路標籤查找步驟S04及元件標籤比對步驟S06,並用以簡化對應電路圖的初始路徑序列I 1、I 2、I 3、I 4、I 5為簡化後路徑序列S 1Please refer to FIG. 1 and FIG. 2 together, wherein FIG. 1 is a schematic diagram showing the process of the circuit path simplification method 100 according to the first embodiment of the present invention; and FIG. 2 is a schematic diagram showing the circuit path simplification method 100 of the present invention applied to a plurality of initial path sequences I 1 , I 2 , I 3 , I 4 , I 5. As shown in the figure, the circuit path simplification method 100 includes an initial path sequence acquisition step S02, a line label search step S04 and a component label comparison step S06, and is used to simplify the initial path sequences I 1 , I 2 , I 3 , I 4 , I 5 of the corresponding circuit diagram into a simplified path sequence S 1 .

初始路徑序列取得步驟S02係驅動運算處理單元從儲存單元取得對應電路圖的初始路徑序列I 1、I 2、I 3、I 4、I 5。電路圖包含複數電子元件及複數線路。初始路徑序列I 1、I 2、I 3、I 4、I 5包含對應前述電子元件的複數元件標籤E 1、E 2、E 3、E 4、E 5、E 6、E 7及對應前述線路的複數線路標籤P 1、P 2、P 3。具體而言,第2圖中的初始路徑序列I 1包含元件標籤E 1、E 2、E 3及線路標籤P 1、P 2、P 3,且元件標籤E 1、E 2、E 3及線路標籤P 1、P 2、P 3由前至後(即由左至右)彼此交互排列。相鄰排列的元件標籤E 1與線路標籤P 1可表示元件標籤E 1所對應的電子元件電性連接線路標籤P 1所對應的線路,且其他初始路徑序列依此類推。此外,前述電路圖係可由繪圖軟體(Allegro)所繪製,並透過繪圖軟體轉檔為XML資料檔案,其可包含所有電子元件資料與其兩兩電子元件間相連的線路資料。利用人工或是軟體找出電路圖中所有的電子元件與線路間之組合,以重新編排XML資料檔案內的電子元件資料及線路資料而產生以JavaScript Object Notation (JSON)格式為基礎的數位資料(即初始路徑序列I 1、I 2、I 3、I 4、I 5)。 The initial path sequence acquisition step S02 is to drive the operation processing unit to acquire the initial path sequence I 1 , I 2 , I 3 , I 4 , I 5 corresponding to the circuit diagram from the storage unit. The circuit diagram includes a plurality of electronic components and a plurality of circuits. The initial path sequence I 1 , I 2 , I 3 , I 4 , I 5 includes a plurality of component labels E 1 , E 2 , E 3 , E 4 , E 5 , E 6 , E 7 corresponding to the aforementioned electronic components and a plurality of circuit labels P 1 , P 2 , P 3 corresponding to the aforementioned circuits. Specifically, the initial path sequence I1 in FIG. 2 includes component labels E1 , E2 , E3 and circuit labels P1 , P2 , P3 , and the component labels E1 , E2 , E3 and circuit labels P1 , P2 , P3 are arranged alternately from front to back (i.e., from left to right). The adjacently arranged component label E1 and circuit label P1 can indicate that the electronic component corresponding to the component label E1 is electrically connected to the circuit corresponding to the circuit label P1 , and other initial path sequences are similar. In addition, the aforementioned circuit diagram can be drawn by drawing software (Allegro) and converted into an XML data file through the drawing software, which can include all electronic component data and circuit data connecting two electronic components. All the combinations of electronic components and circuits in the circuit diagram are found manually or by software, so as to rearrange the electronic component data and circuit data in the XML data file and generate digital data based on the JavaScript Object Notation (JSON) format (i.e., the initial path sequence I 1 , I 2 , I 3 , I 4 , I 5 ).

線路標籤查找步驟S04係驅動運算處理單元於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中查找相同的線路標籤而產生至少一線路標籤確認結果110。由第2圖可知,由於初始路徑序列I 1、I 2、I 3、I 4、I 5皆列有相同的線路標籤P 1、P 2、P 3,因此運算處理單元分別產生對應線路標籤P 1、P 2、P 3的複數線路標籤確認結果110。 The circuit label search step S04 drives the operation processing unit to search for the same circuit label in all initial path sequences I 1 , I 2 , I 3 , I 4 , I 5 to generate at least one circuit label confirmation result 110. As shown in FIG. 2 , since the initial path sequences I 1 , I 2 , I 3 , I 4 , I 5 all have the same circuit labels P 1 , P 2 , P 3 , the operation processing unit generates a plurality of circuit label confirmation results 110 corresponding to the circuit labels P 1 , P 2 , P 3 , respectively.

元件標籤比對步驟S06係驅動運算處理單元依據對應線路標籤P 1的線路標籤確認結果110比對二初始路徑序列I 1、I 2中相鄰列於線路標籤P 1的二元件標籤E 1是否相同。須說明的是,運算處理單元會將具有線路標籤P 1的所有初始路徑序列皆納入比對過程中;換言之,運算處理單元亦能根據所有線路標籤確認結果110階段性地比對所有初始路徑序列I 1、I 2、I 3、I 4、I 5中相鄰列於線路標籤P 1、P 2、P 3的多個元件標籤E 1、E 2、E 3、E 4、E 5、E 6、E 7是否相同。當二元件標籤為相同時,驅動運算處理單元執行合併步驟S062。合併步驟S062係合併二初始路徑序列之二元件標籤而產生合併後元件標籤,並合併二初始路徑序列之線路標籤而產生合併後線路標籤。當二元件標籤不相同時,驅動運算處理單元執行排列步驟S064。排列步驟S064係排列二初始路徑序列之二元件標籤而產生排列後元件標籤,並合併二初始路徑序列之線路標籤而產生合併後線路標籤。 The component label comparison step S06 is to drive the operation processing unit to compare the two component labels E1 adjacent to the circuit label P1 in the two initial path sequences I1 and I2 according to the circuit label confirmation result 110 corresponding to the circuit label P1 to see whether they are the same. It should be noted that the operation processing unit includes all initial path sequences with the line label P1 in the comparison process; in other words, the operation processing unit can also phase-by-phase compare whether multiple component labels E1 , E2 , E3 , E4, E5 , E6, E7 adjacent to the line labels P1 , P2 , P3 in all initial path sequences I1 , I2 , I3 , I4 , I5 are the same according to all the line label confirmation results 110. When two component labels are the same, the operation processing unit is driven to execute the merging step S062. The merging step S062 is to merge the two component labels of the two initial path sequences to generate a merged component label, and merge the line labels of the two initial path sequences to generate a merged line label. When the two component labels are different, the operation processing unit is driven to execute the arrangement step S064. The arrangement step S064 is to arrange the two component labels of the two initial path sequences to generate an arranged component label, and merge the line labels of the two initial path sequences to generate a merged line label.

舉例來說,於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中位於線路標籤P 1前的多個元件標籤E 1均相同,運算處理單元執行合併步驟S062。合併步驟S062係驅動運算處理單元合併位於線路標籤P 1前的多個元件標籤E 1而產生合併後元件標籤M E1,且合併所有初始路徑序列I 1、I 2、I 3、I 4、I 5之線路標籤P 1而產生合併後線路標籤M P1。運算處理單元將合併後元件標籤M E1列於合併後線路標籤M P1之前。同理,於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中位於線路標籤P 1後的多個元件標籤E 2均相同,運算處理單元亦執行合併步驟S062。合併步驟S062係驅動運算處理單元合併位於線路標籤P 1後的多個元件標籤E 2而產生合併後元件標籤M E2。運算處理單元將合併後元件標籤M E2列於合併後線路標籤M P1之後。 For example, the multiple component labels E1 located before the line label P1 in all the initial path sequences I1 , I2 , I3 , I4 , and I5 are the same, and the operation processing unit executes the merging step S062. The merging step S062 drives the operation processing unit to merge the multiple component labels E1 located before the line label P1 to generate a merged component label ME1 , and merge the line labels P1 of all the initial path sequences I1 , I2 , I3 , I4 , and I5 to generate a merged line label MP1 . The operation processing unit lists the merged component label ME1 before the merged line label MP1 . Similarly, in all initial path sequences I 1 , I 2 , I 3 , I 4 , and I 5 , the multiple component labels E 2 located after the line label P 1 are the same, and the operation processing unit also executes the merging step S062. The merging step S062 drives the operation processing unit to merge the multiple component labels E 2 located after the line label P 1 to generate a merged component label ME2 . The operation processing unit lists the merged component label ME2 after the merged line label MP1 .

若以線路標籤P 2為中心,於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中位於線路標籤P 2前的多個元件標籤E 2均相同,運算處理單元產生合併後元件標籤M E2,且合併所有初始路徑序列I 1、I 2、I 3、I 4、I 5之線路標籤P 2而產生合併後線路標籤M P2。運算處理單元將合併後元件標籤M E2列於合併後線路標籤M P2之前。 If the multiple component labels E2 located before the line label P2 in all the initial path sequences I1 , I2 , I3 , I4 , I5 are the same, the operation processing unit generates a merged component label ME2 , and merges the line labels P2 of all the initial path sequences I1 , I2 , I3 , I4 , I5 to generate a merged line label MP2 . The operation processing unit lists the merged component label ME2 before the merged line label MP2 .

特別的是,於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中位於線路標籤P 2後的元件標籤E 3、E 4、E 5、E 6、E 7彼此不相同,運算處理單元執行排列步驟S064。排列步驟S064係驅動運算處理單元依序排列元件標籤E 3、E 4、E 5、E 6、E 7而產生排列後元件標籤A E1。運算處理單元將排列後元件標籤A E1列於合併後線路標籤M P2之後。 In particular, the component labels E3 , E4, E5 , E6 , and E7 after the line label P2 in all the initial path sequences I1 , I2 , I3 , I4 , and I5 are different from each other, and the operation processing unit executes the arrangement step S064. The arrangement step S064 drives the operation processing unit to arrange the component labels E3 , E4 , E5 , E6 , and E7 in sequence to generate the arranged component label A E1 . The operation processing unit arranges the arranged component label A E1 after the merged line label MP2 .

若以線路標籤P 3為中心,於所有初始路徑序列I 1、I 2、I 3、I 4、I 5中位於線路標籤P 3前的元件標籤E 3、E 4、E 5、E 6、E 7彼此不相同,運算處理單元執行排列步驟S064。排列步驟S064係驅動運算處理單元依序排列元件標籤E 3、E 4、E 5、E 6、E 7而產生排列後元件標籤A E1,並合併所有初始路徑序列I 1、I 2、I 3、I 4、I 5之線路標籤P 3而產生合併後線路標籤M P3。運算處理單元將排列後元件標籤A E1列於合併後線路標籤M P3之前。最終,運算處理單元依序排列合併後元件標籤M E1、合併後線路標籤M P1、合併後元件標籤M E2、合併後線路標籤M P2、排列後元件標籤A E1及合併後線路標籤M P3而形成簡化後路徑序列S 1If the component labels E3 , E4 , E5 , E6 , and E7 before the line label P3 in all the initial path sequences I1 , I2 , I3 , I4 , and I5 are different from each other, the operation processing unit executes the arrangement step S064. The arrangement step S064 drives the operation processing unit to arrange the component labels E3 , E4 , E5 , E6 , and E7 in sequence to generate the arranged component label A E1 , and merge the line label P3 of all the initial path sequences I1 , I2 , I3 , I4 , and I5 to generate the merged line label MP3 . The operation processing unit arranges the arranged component label A E1 before the merged line label MP3 . Finally, the operation processing unit arranges the merged component label ME1 , the merged line label MP1 , the merged component label ME2 , the merged line label MP2 , the arranged component label A E1 and the merged line label MP3 in sequence to form a simplified path sequence S1 .

再者,運算處理單元於合併後線路標籤M P1中引入第一符號Q 1。第一符號Q 1位於線路標籤P 1前。第一符號Q 1表示串接,即線路標籤P 1所對應的線路串接元件標籤E 1所對應的電子元件,並同時表示元件標籤E 1所對應的電子元件經由線路標籤P 1所對應的線路串接元件標籤E 2所對應的電子元件。運算處理單元於合併後線路標籤M P2中引入第二符號Q 2。第二符號Q 2位於線路標籤P 2前。第二符號Q 2表示並聯,即線路標籤P 2所對應的線路並聯元件標籤E 3、E 4、E 5、E 6、E 7所對應的電子元件,並同時表示元件標籤E 2所對應的電子元件經由線路標籤P 2所對應的線路並聯元件標籤E 3、E 4、E 5、E 6、E 7所對應的電子元件,且合併後線路標籤M P3依此類推。 Furthermore, the operation processing unit introduces the first symbol Q 1 in the merged circuit label MP1 . The first symbol Q 1 is located before the circuit label P 1. The first symbol Q 1 represents a series connection, that is, the circuit corresponding to the circuit label P 1 is connected in series with the electronic component corresponding to the component label E 1 , and at the same time represents that the electronic component corresponding to the component label E 1 is connected in series with the electronic component corresponding to the component label E 2 via the circuit corresponding to the circuit label P 1. The operation processing unit introduces the second symbol Q 2 in the merged circuit label MP2 . The second symbol Q 2 is located before the circuit label P 2 . The second symbol Q2 represents parallel connection, that is, the circuit corresponding to the circuit label P2 is connected in parallel with the electronic components corresponding to the component labels E3 , E4 , E5 , E6 , and E7 , and at the same time, it represents that the electronic component corresponding to the component label E2 is connected in parallel with the electronic components corresponding to the component labels E3 , E4 , E5 , E6 , and E7 corresponding to the circuit label P2 , and the same applies to the merged circuit label MP3.

值得注意的是,前述合併後元件標籤的數位資料等同於合併前元件標籤之數位資料;意謂著,合併後元件標籤M E1所對應的JSON資料等同於元件標籤E 1所對應的JSON資料,且其他合併後元件標籤依此類推,不另贅述。因此,運算處理單元可將對應電路圖的簡化後路徑序列S 1轉換為簡化後電路圖C 1。由第2圖的簡化後電路圖C 1可知,元件標籤E 1所對應的電子元件與元件標籤E 2所對應的電子元件經由線路標籤P 1所對應的線路彼此串接。元件標籤E 2所對應的電子元件和各元件標籤E 3、E 4、E 5、E 6、E 7所對應的電子元件經由線路標籤P 2所對應的線路彼此並聯。所有元件標籤E 3、E 4、E 5、E 6、E 7均並聯於線路標籤P 3所對應的線路。藉此,本發明之電路路徑簡化方法100可在所有初始路徑序列I 1、I 2、I 3、I 4、I 5中找到相同的線路標籤P 1、P 2、P 3,然後根據合併相同的元件標籤E 1、E 2而分別產生合併後元件標籤M E1、M E2,或排列不同的元件標籤E 3、E 4、E 5、E 6、E 7而產生排列後元件標籤A E1,且合併相同的線路標籤P 1、P 2、P 3而分別產生合併後線路標籤M P1、M P2、M P3,進而將所有初始路徑序列I 1、I 2、I 3、I 4、I 5簡化為簡化後路徑序列S 1,以方便使用者於簡化後電路圖C 1中更輕易地了解各元件與各線路之間的連接關係。因此,當電路圖內的電路較複雜時,使用者仍可利用簡化後路徑序列S 1輕易地查看且判斷電子元件上的分壓/分流或訊號分流。 It is worth noting that the digital data of the aforementioned merged component label is equivalent to the digital data of the component label before the merge; that is, the JSON data corresponding to the merged component label ME1 is equivalent to the JSON data corresponding to the component label E1 , and the other merged component labels are similar and will not be elaborated on. Therefore, the operation processing unit can convert the simplified path sequence S1 of the corresponding circuit diagram into a simplified circuit diagram C1 . From the simplified circuit diagram C1 of Figure 2, it can be seen that the electronic component corresponding to the component label E1 and the electronic component corresponding to the component label E2 are connected in series through the line corresponding to the line label P1 . The electronic component corresponding to the component label E2 and the electronic components corresponding to the component labels E3 , E4 , E5 , E6 , and E7 are connected in parallel to each other via the circuit corresponding to the circuit label P2 . All component labels E3 , E4 , E5 , E6 , and E7 are connected in parallel to the circuit corresponding to the circuit label P3 . Thus, the circuit path simplification method 100 of the present invention can find the same line labels P1 , P2 , P3 in all initial path sequences I1 , I2 , I3 , I4 , I5 , and then generate the merged component labels ME1 , ME2 respectively by merging the same component labels E1 , E2 , or generate the arranged component label A E1 by arranging different component labels E3 , E4 , E5 , E6 , E7 , and merge the same line labels P1 , P2 , P3 to generate the merged line labels MP1 , MP2 , MP3 respectively, and then all the initial path sequences I1 , I2 , I3 , I4 , I5 are combined. 5 is simplified to a simplified path sequence S 1 , so that the user can more easily understand the connection relationship between each component and each circuit in the simplified circuit diagram C 1. Therefore, when the circuit in the circuit diagram is more complicated, the user can still use the simplified path sequence S 1 to easily view and judge the voltage division/current division or signal division on the electronic component.

請一併參照第1圖與第3圖,其中第3圖係繪示本發明之電路路徑簡化方法100應用於多個初始路徑序列I 6、I 7的另一示意圖。如圖所示,線路標籤查找步驟S04係驅動運算處理單元於對應另一電路圖的二初始路徑序列I 6、I 7中查找相同的線路標籤而產生線路標籤確認結果110。由第3圖可知,由於初始路徑序列I 6、I 7皆列有相同的線路標籤P 1、P 2,因此運算處理單元分別產生對應線路標籤P 1、P 2的線路標籤確認結果110。以下僅詳細介紹對應線路標籤P 1的線路標籤確認結果110,其他線路標籤確認結果110不另贅述。 Please refer to FIG. 1 and FIG. 3 together, wherein FIG. 3 is another schematic diagram showing the circuit path simplification method 100 of the present invention applied to multiple initial path sequences I 6 and I 7. As shown in the figure, the circuit label search step S04 drives the operation processing unit to search for the same circuit label in two initial path sequences I 6 and I 7 corresponding to another circuit diagram to generate a circuit label confirmation result 110. As can be seen from FIG. 3, since the initial path sequences I 6 and I 7 both list the same circuit labels P 1 and P 2 , the operation processing unit generates circuit label confirmation results 110 corresponding to the circuit labels P 1 and P 2 respectively. The following only introduces in detail the line label confirmation result 110 corresponding to the line label P1 , and other line label confirmation results 110 are not described separately.

元件標籤比對步驟S06係驅動運算處理單元依據對應線路標籤P 1的線路標籤確認結果110比對二初始路徑序列I 6、I 7中相鄰列於線路標籤P 1前的二元件標籤E 1是否相同,並比對二初始路徑序列I 6、I 7中相鄰列於線路標籤P 1後的二元件標籤E 2、E 3是否相同。於二初始路徑序列I 6、I 7中位於線路標籤P 1前的二元件標籤E 1均相同,運算處理單元執行合併步驟S062。合併步驟S062係驅動運算處理單元合併位於線路標籤P 1前的二元件標籤E 1而產生合併後元件標籤M E1,且合併二初始路徑序列I 6、I 7之線路標籤P 1而產生合併後線路標籤M P4。運算處理單元將合併後元件標籤M E1列於合併後線路標籤M P4之前。於二初始路徑序列I 6、I 7中位於線路標籤P 1後的元件標籤E 2、E 3不相同,運算處理單元執行排列步驟S064。排列步驟S064係驅動運算處理單元依序排列元件標籤E 2和線路標籤P 2而產生排列後元件標籤A E2,並依序排列元件標籤E 3、線路標籤P 3、元件標籤E 4及線路標籤P 2而產生排列後元件標籤A E3。運算處理單元將排列後元件標籤A E2列於合併後線路標籤M P4之後,且將排列後元件標籤A E3列於排列後元件標籤A E2之後,以形成簡化後路徑序列S 2The component label comparison step S06 drives the operation processing unit to compare whether the two component labels E1 in the two initial path sequences I6 and I7 that are adjacent to the line label P1 are the same according to the line label confirmation result 110 corresponding to the line label P1 , and compare whether the two component labels E2 and E3 in the two initial path sequences I6 and I7 that are adjacent to the line label P1 are the same. If the two component labels E1 in the two initial path sequences I6 and I7 that are located before the line label P1 are the same, the operation processing unit executes the merging step S062. The merging step S062 drives the operation processing unit to merge the two component labels E1 located before the line label P1 to generate a merged component label ME1 , and merge the line label P1 of the two initial path sequences I6 and I7 to generate a merged line label MP4 . The operation processing unit arranges the merged component label ME1 before the merged line label MP4 . The component labels E2 and E3 located after the line label P1 in the two initial path sequences I6 and I7 are different, and the operation processing unit executes the arrangement step S064. The arrangement step S064 drives the operation processing unit to arrange the component label E2 and the circuit label P2 in sequence to generate the arranged component label A E2 , and to arrange the component label E3 , the circuit label P3 , the component label E4 and the circuit label P2 in sequence to generate the arranged component label A E3 . The operation processing unit arranges the arranged component label A E2 after the merged circuit label MP4 , and arranges the arranged component label A E3 after the arranged component label A E2 to form a simplified path sequence S 2 .

另外,運算處理單元於合併後線路標籤M P4中引入第二符號Q 2。第二符號Q 2位於線路標籤P 1前。第二符號Q 2表示並聯,即元件標籤E 1所對應的電子元件經由線路標籤P 1所對應的線路並聯元件標籤E 2、E 3所對應的電子元件。運算處理單元於線路標籤P 3前引入第一符號Q 1,其表示串接,即元件標籤E 3所對應的電子元件經由線路標籤P 3所對應的線路串接元件標籤E 4所對應的電子元件。因此,運算處理單元可將對應另一電路圖的簡化後路徑序列S 2轉換為簡化後電路圖C 2。由第3圖的簡化後電路圖C 2可知,元件標籤E 1所對應的電子元件並聯連接於線路標籤P 1所對應的線路後的元件標籤E 2、E 3所對應的電子元件。元件標籤E 3所對應的電子元件串接連接於線路標籤P 3所對應的線路後的元件標籤E 4所對應的電子元件,且元件標籤E 2、E 4所對應的電子元件串接線路標籤P 2所對應的線路。 In addition, the operation processing unit introduces the second symbol Q 2 in the merged circuit label MP4 . The second symbol Q 2 is located before the circuit label P 1. The second symbol Q 2 represents parallel connection, that is, the electronic component corresponding to the component label E 1 is connected in parallel with the electronic components corresponding to the component labels E 2 and E 3 via the circuit corresponding to the circuit label P 1. The operation processing unit introduces the first symbol Q 1 before the circuit label P 3 , which represents series connection, that is, the electronic component corresponding to the component label E 3 is connected in series with the electronic component corresponding to the component label E 4 via the circuit corresponding to the circuit label P 3. Therefore, the operation processing unit can convert the simplified path sequence S 2 corresponding to another circuit diagram into the simplified circuit diagram C 2 . From the simplified circuit diagram C2 of FIG. 3, it can be seen that the electronic component corresponding to the component label E1 is connected in parallel to the electronic components corresponding to the component labels E2 and E3 after the circuit corresponding to the circuit label P1 . The electronic component corresponding to the component label E3 is connected in series to the electronic component corresponding to the component label E4 after the circuit corresponding to the circuit label P3 , and the electronic components corresponding to the component labels E2 and E4 are connected in series to the circuit corresponding to the circuit label P2 .

請一併參照第1圖與第4圖,其中第4圖係繪示本發明之電路路徑簡化方法100應用於多個初始路徑序列I 8、I 9、I 10、I 11的又一示意圖。如圖所示,線路標籤查找步驟S04係驅動運算處理單元於對應又一電路圖的初始路徑序列I 8、I 9、I 10、I 11中查找相同的線路標籤而產生線路標籤確認結果110。由第4圖可知,由於初始路徑序列I 8、I 9、I 10、I 11皆列有相同的線路標籤P 1、P 2、P 3,因此運算處理單元分別產生對應線路標籤P 1、P 2、P 3的線路標籤確認結果110。以下僅詳細介紹對應線路標籤P 1、P 2的線路標籤確認結果110,對應線路標籤P 3的線路標籤確認結果110不另贅述。 Please refer to FIG. 1 and FIG. 4 together, wherein FIG. 4 is another schematic diagram showing the circuit path simplification method 100 of the present invention applied to multiple initial path sequences I 8 , I 9 , I 10 , I 11. As shown in the figure, the circuit label search step S04 drives the operation processing unit to search for the same circuit label in the initial path sequence I 8 , I 9 , I 10 , I 11 corresponding to another circuit diagram to generate a circuit label confirmation result 110. As can be seen from FIG. 4, since the initial path sequences I8 , I9 , I10 , and I11 all have the same line labels P1 , P2 , and P3 , the operation processing unit generates line label confirmation results 110 corresponding to the line labels P1 , P2 , and P3, respectively. The following only introduces the line label confirmation results 110 corresponding to the line labels P1 and P2 in detail, and the line label confirmation result 110 corresponding to the line label P3 is not described separately.

若以線路標籤P 1為中心,元件標籤比對步驟S06係驅動運算處理單元依據對應線路標籤P 1的線路標籤確認結果110比對初始路徑序列I 8、I 9、I 10、I 11中相鄰列於線路標籤P 1前的四個元件標籤E 1是否相同,並比對相鄰列於線路標籤P 1後的二元件標籤E 2及二元件標籤E 3是否相同。於初始路徑序列I 8、I 9、I 10、I 11中位於線路標籤P 1前的四個元件標籤E 1均相同,運算處理單元執行合併步驟S062。合併步驟S062係驅動運算處理單元合併位於線路標籤P 1前的四個元件標籤E 1而產生合併後元件標籤M E1,且運算處理單元合併初始路徑序列I 8、I 9、I 10、I 11之線路標籤P 1而產生合併後線路標籤M P4,其中運算處理單元於合併後線路標籤M P4中引入第二符號Q 2,並將合併後線路標籤M P4列於合併後元件標籤M E1之後。 If the circuit label P 1 is taken as the center, the component label comparison step S06 drives the operation processing unit to compare the four component labels E 1 adjacent to the circuit label P 1 in the initial path sequence I 8 , I 9 , I 10 , and I 11 according to the circuit label confirmation result 110 corresponding to the circuit label P 1 to see if they are the same, and to compare the two component labels E 2 and the two component labels E 3 adjacent to the circuit label P 1 to see if they are the same. If the four component labels E 1 in the initial path sequence I 8 , I 9 , I 10 , and I 11 before the circuit label P 1 are all the same, the operation processing unit executes the merging step S062. The merging step S062 drives the operation processing unit to merge the four component labels E1 located before the circuit label P1 to generate a merged component label ME1 , and the operation processing unit merges the circuit labels P1 of the initial path sequence I8 , I9 , I10 , and I11 to generate a merged circuit label MP4 , wherein the operation processing unit introduces the second symbol Q2 into the merged circuit label MP4 , and lists the merged circuit label MP4 after the merged component label ME1 .

於初始路徑序列I 8、I 9、I 10、I 11中位於線路標籤P 1後的二元件標籤E 2相同且二元件標籤E 3相同,運算處理單元執行合併步驟S062。合併步驟S062係驅動運算處理單元合併二元件標籤E 2而產生合併後元件標籤M E2,且合併二元件標籤E 3而產生合併後元件標籤M E3。接著,由於合併後元件標籤M E2與合併後元件標籤M E3彼此不相同,運算處理單元執行排列步驟S064。排列步驟S064係驅動運算處理單元排列合併後元件標籤M E2與合併後元件標籤M E3而產生排列後元件標籤A E4In the initial path sequence I 8 , I 9 , I 10 , I 11 , the two component labels E 2 and the two component labels E 3 located after the line label P 1 are the same, and the operation processing unit executes the merging step S062. The merging step S062 drives the operation processing unit to merge the two component labels E 2 to generate a merged component label M E2 , and merge the two component labels E 3 to generate a merged component label M E3 . Then, since the merged component label M E2 and the merged component label M E3 are different from each other, the operation processing unit executes the arrangement step S064. The arrangement step S064 is to drive the operation processing unit to arrange the merged component label ME2 and the merged component label ME3 to generate an arranged component label AE4 .

若以線路標籤P 2為中心,元件標籤比對步驟S06係驅動運算處理單元依據對應線路標籤P 2的線路標籤確認結果110比對初始路徑序列I 8、I 9、I 10、I 11中相鄰列於線路標籤P 2前的二元件標籤E 2及二元件標籤E 3彼此是否相同,並比對相鄰列於線路標籤P 2後的二元件標籤E 4及二元件標籤E 5彼此是否相同。針對二元件標籤E 2及二元件標籤E 3之簡化過程如前所述,故不另贅述。 If the circuit label P 2 is taken as the center, the component label comparison step S06 drives the operation processing unit to compare the two component labels E 2 and the two component labels E 3 adjacent to the circuit label P 2 in the initial path sequence I 8 , I 9 , I 10 , and I 11 according to the circuit label confirmation result 110 corresponding to the circuit label P 2 to see if they are the same, and to compare the two component labels E 4 and the two component labels E 5 adjacent to the circuit label P 2 to see if they are the same. The simplified process for the two component labels E 2 and the two component labels E 3 is as described above, so it will not be described separately.

於初始路徑序列I 8、I 9、I 10、I 11中位於線路標籤P 2後的二元件標籤E 4相同且二元件標籤E 5相同,運算處理單元執行合併步驟S062。合併步驟S062係驅動運算處理單元合併二元件標籤E 4而產生合併後元件標籤M E4,且合併二元件標籤E 5而產生合併後元件標籤M E5。運算處理單元合併初始路徑序列I 8、I 9、I 10、I 11之線路標籤P 2而產生合併後線路標籤M P2,其中運算處理單元於合併後線路標籤M P2中引入第二符號Q 2。接著,由於合併後元件標籤M E4與合併後元件標籤M E5彼此不相同,運算處理單元執行排列步驟S064。排列步驟S064係驅動運算處理單元排列合併後元件標籤M E4與合併後元件標籤M E5而產生排列後元件標籤A E5,且運算處理單元將合併後線路標籤M P2列於排列後元件標籤A E4、A E5之間。最終,運算處理單元依序排列合併後元件標籤M E1、合併後線路標籤M P4、排列後元件標籤A E4、合併後線路標籤M P2、排列後元件標籤A E5、合併後線路標籤M P3及合併後元件標籤M E6而形成簡化後路徑序列S 3In the initial path sequence I8 , I9 , I10 , I11 , the two component labels E4 and the two component labels E5 after the line label P2 are the same, and the operation processing unit executes the merging step S062. The merging step S062 drives the operation processing unit to merge the two component labels E4 to generate a merged component label ME4 , and merge the two component labels E5 to generate a merged component label ME5 . The operation processing unit merges the line label P2 of the initial path sequence I8 , I9 , I10 , I11 to generate a merged line label MP2 , wherein the operation processing unit introduces the second symbol Q2 into the merged line label MP2 . Then, since the merged component label ME4 and the merged component label ME5 are different from each other, the operation processing unit executes the arrangement step S064. The arrangement step S064 drives the operation processing unit to arrange the merged component label ME4 and the merged component label ME5 to generate an arranged component label A E5 , and the operation processing unit arranges the merged line label MP2 between the arranged component labels A E4 and A E5 . Finally, the operation processing unit sequentially arranges the merged component label ME1 , the merged line label MP4 , the arranged component label AE4 , the merged line label MP2 , the arranged component label AE5 , the merged line label MP3 and the merged component label ME6 to form a simplified path sequence S3 .

因此,運算處理單元可將對應又一電路圖的簡化後路徑序列S 3轉換為簡化後電路圖C 3。由第4圖的簡化後電路圖C 3可知,元件標籤E 1所對應的電子元件並聯連接於線路標籤P 1所對應的線路後的元件標籤E 2、E 3所對應的電子元件。元件標籤E 2、E 3所對應的電子元件經由線路標籤P 2所對應的線路並聯元件標籤E 4、E 5所對應的電子元件。元件標籤E 4、E 5所對應的電子元件並聯至線路標籤P 2所對應的線路,且經由線路標籤P 3所對應的線路串接元件標籤E 6所對應的電子元件。 Therefore, the operation processing unit can convert the simplified path sequence S3 corresponding to another circuit diagram into a simplified circuit diagram C3 . From the simplified circuit diagram C3 of Figure 4, it can be seen that the electronic component corresponding to the component label E1 is connected in parallel to the electronic components corresponding to the component labels E2 and E3 after the line corresponding to the line label P1 . The electronic components corresponding to the component labels E2 and E3 are connected in parallel to the electronic components corresponding to the component labels E4 and E5 through the line corresponding to the line label P2 . The electronic components corresponding to the component labels E4 and E5 are connected in parallel to the line corresponding to the line label P2 , and the electronic component corresponding to the component label E6 is connected in series through the line corresponding to the line label P3 .

請一併參閱第1圖與第5圖,其中第5圖係繪示依照本發明之第二實施例之電路路徑簡化系統200的示意圖。如圖所示,電路路徑簡化系統200用以簡化對應電路圖211的複數初始路徑序列212,且包含儲存單元210與運算處理單元220。儲存單元210儲存電路圖211及對應電路圖211的此些初始路徑序列212。運算處理單元220電性連接儲存單元210並取得此些初始路徑序列212。運算處理單元220經配置以實施線路標籤查找步驟S12、元件標籤比對步驟S14、合併步驟S142及排列步驟S144,其與第一實施例中電路路徑簡化方法100所對應的步驟相同,不另贅述。此外,運算處理單元220可為一數位訊號處理器(Digital Signal Processor;DSP)、一微處理器(Micro Processing Unit;MPU)、一中央處理器(Central Processing Unit;CPU)或其他電子處理器,但本發明不以此為限。Please refer to FIG. 1 and FIG. 5 together, wherein FIG. 5 is a schematic diagram of a circuit path simplification system 200 according to a second embodiment of the present invention. As shown in the figure, the circuit path simplification system 200 is used to simplify a plurality of initial path sequences 212 corresponding to a circuit diagram 211, and includes a storage unit 210 and an operation processing unit 220. The storage unit 210 stores the circuit diagram 211 and these initial path sequences 212 corresponding to the circuit diagram 211. The operation processing unit 220 is electrically connected to the storage unit 210 and obtains these initial path sequences 212. The operation processing unit 220 is configured to implement the circuit label search step S12, the component label comparison step S14, the merging step S142 and the arranging step S144, which are the same as the corresponding steps of the circuit path simplification method 100 in the first embodiment and are not further described. In addition, the operation processing unit 220 can be a digital signal processor (DSP), a microprocessor (MPU), a central processing unit (CPU) or other electronic processors, but the present invention is not limited thereto.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.

100:電路路徑簡化方法 110:線路標籤確認結果 200:電路路徑簡化系統 210:儲存單元 220:運算處理單元 211:電路圖 212,I 1,I 2,I 3,I 4,I 5,I 6,I 7,I 8,I 9,I 10,I 11:初始路徑序列 E 1,E 2,E 3,E 4,E 5,E 6,E 7:元件標籤 P 1,P 2,P 3:線路標籤 M E1,M E2,M E3,M E4,M E5,M E6:合併後元件標籤 M P1,M P2,M P3,M P4:合併後線路標籤 A E1,A E2,A E3,A E4,A E5:排列後元件標籤 Q 1:第一符號 Q 2:第二符號 S 1,S 2,S 3:簡化後路徑序列 C 1,C 2,C 3:簡化後電路圖 S02:初始路徑序列取得步驟 S04,S12:線路標籤查找步驟 S06,S14:元件標籤比對步驟 S062,S142:合併步驟 S064,S144:排列步驟 100: Circuit path simplification method 110: Circuit label confirmation result 200: Circuit path simplification system 210: Storage unit 220: Operation processing unit 211: Circuit diagram 212, I 1 , I 2 , I 3 , I 4 , I 5 , I 6 , I 7 , I 8 , I 9 , I 10 , I 11 : Initial path sequence E 1 , E 2 , E 3 , E 4 , E 5 , E 6 , E 7 : Component label P 1 , P 2 , P 3 : Circuit label ME1 , ME2 , ME3 , ME4 , ME5 , ME6 : Merged component label MP1 , MP2 , MP3 , MP4 P4 : Merged circuit labels A E1 , A E2 , A E3 , A E4 , A E5 : Arranged component labels Q 1 : First symbol Q 2 : Second symbol S 1 , S 2 , S 3 : Simplified path sequence C 1 , C 2 , C 3 : Simplified circuit diagram S02: Initial path sequence acquisition step S04, S12: Circuit label search step S06, S14: Component label comparison step S062, S142: Merge step S064, S144: Arrangement step

第1圖係繪示依照本發明之第一實施例之電路路徑簡化方法的流程示意圖; 第2圖係繪示本發明之電路路徑簡化方法應用於多個初始路徑序列的示意圖; 第3圖係繪示本發明之電路路徑簡化方法應用於多個初始路徑序列的另一示意圖; 第4圖係繪示本發明之電路路徑簡化方法應用於多個初始路徑序列的又一示意圖;以及 第5圖係繪示依照本發明之第二實施例之電路路徑簡化系統的示意圖。 FIG. 1 is a schematic diagram showing a flow chart of a circuit path simplification method according to the first embodiment of the present invention; FIG. 2 is a schematic diagram showing the circuit path simplification method of the present invention applied to multiple initial path sequences; FIG. 3 is another schematic diagram showing the circuit path simplification method of the present invention applied to multiple initial path sequences; FIG. 4 is another schematic diagram showing the circuit path simplification method of the present invention applied to multiple initial path sequences; and FIG. 5 is a schematic diagram showing a circuit path simplification system according to the second embodiment of the present invention.

100:電路路徑簡化方法 100: Circuit path simplification method

110:線路標籤確認結果 110: Line label confirmation result

S02:初始路徑序列取得步驟 S02: Initial path sequence acquisition step

S04:線路標籤查找步驟 S04: Line label search steps

S06:元件標籤比對步驟 S06: Component label comparison step

S062:合併步驟 S062: Merge steps

S064:排列步驟 S064: Arrangement steps

Claims (8)

一種電路路徑簡化方法,用以簡化對應一電路圖的複數初始路徑序列,該電路圖包含複數電子元件及複數線路,該電路路徑簡化方法包含以下步驟:一初始路徑序列取得步驟,係驅動一運算處理單元從一儲存單元取得對應該電路圖的該些初始路徑序列,其中各該初始路徑序列包含對應部分該些電子元件的複數元件標籤及對應部分該些線路的複數線路標籤,該些元件標籤及該些線路標籤彼此交互排列;一線路標籤查找步驟,係驅動該運算處理單元於該些初始路徑序列中查找相同的該些線路標籤的一者而產生一線路標籤確認結果;以及一元件標籤比對步驟,係驅動該運算處理單元依據該線路標籤確認結果比對其中二該初始路徑序列中相鄰列於該些線路標籤的該者的該些元件標籤的二者是否相同,以簡化該些初始路徑序列;其中,當該些元件標籤的該二者為相同時,驅動該運算處理單元執行一合併步驟,該合併步驟係合併其中二該初始路徑序列之該些元件標籤的該二者而產生一合併後元件標籤,並合併其中二該初始路徑序列之該些線路標籤的該者而產生一合併後線路標籤,該合併後元件標籤與該合併後線路標籤排列以形成一簡化後路徑序列;其中,當該些元件標籤的該二者不相同時,驅動該運算處理單元執行一排列步驟,該排列步驟係排列其中二該初 始路徑序列之該些元件標籤的該二者而產生一排列後元件標籤,並合併其中二該初始路徑序列之該些線路標籤的該者而產生該合併後線路標籤,該排列後元件標籤與該合併後線路標籤排列以形成另一簡化後路徑序列;其中,該運算處理單元於該合併後線路標籤中引入一第一符號與一第二符號之一者,該第一符號與該第二符號之該者位於該些線路標籤的該者前,該第一符號表示列於該些線路標籤的該者前的該些元件標籤的一者所對應的該些電子元件的一者經由該些線路標籤的該者所對應的該些線路的一者串接列於該些線路標籤的該者後的另一該元件標籤所對應的該些電子元件的一者,且該第二符號表示列於該些線路標籤的該者前的該些元件標籤的該者所對應的該些電子元件的該者經由該些線路標籤的該者所對應的該些線路的該者並聯列於該些線路標籤的該者後的至少二該元件標籤所對應的至少二該電子元件。 A circuit path simplification method is used to simplify a plurality of initial path sequences corresponding to a circuit diagram, wherein the circuit diagram includes a plurality of electronic components and a plurality of circuits. The circuit path simplification method includes the following steps: an initial path sequence acquisition step, which drives an operation processing unit to acquire the initial path sequences corresponding to the circuit diagram from a storage unit, wherein each of the initial path sequences includes a plurality of component labels corresponding to a portion of the electronic components and a plurality of circuit labels corresponding to a portion of the circuits, wherein the component labels and the circuit labels are arranged alternately with each other; a circuit label search step, which drives the operation processing unit to search for the same circuit labels in the initial path sequences. and generating a circuit label confirmation result according to one of the circuit labels; and a component label comparison step, which drives the operation processing unit to compare whether the two component labels of the adjacent ones of the circuit labels in the two initial path sequences are the same, so as to simplify the initial path sequences; wherein, when the two component labels are the same, the operation processing unit is driven to execute a merging step, which is to merge the two component labels of the two initial path sequences to generate a merged component label, and merge the one of the circuit labels of the two initial path sequences to generate a merged circuit label, the merged circuit label The component label and the merged circuit label are arranged to form a simplified path sequence; wherein, when the two of the component labels are different, the operation processing unit is driven to execute an arrangement step, the arrangement step is to arrange the two of the component labels of two of the initial path sequences to generate an arranged component label, and merge the one of the circuit labels of two of the initial path sequences to generate the merged circuit label, the arranged component label and the merged circuit label are arranged to form another simplified path sequence; wherein, the operation processing unit introduces one of a first symbol and a second symbol into the merged circuit label, the first symbol and the second symbol are The first symbol indicates that one of the electronic components corresponding to one of the component labels listed before the one of the circuit labels is connected in series with one of the electronic components corresponding to another component label listed after the one of the circuit labels via one of the circuits corresponding to the one of the circuit labels, and the second symbol indicates that one of the electronic components corresponding to the one of the component labels listed before the one of the circuit labels is connected in parallel with at least two electronic components corresponding to at least two component labels listed after the one of the circuit labels via the one of the circuits corresponding to the one of the circuit labels. 如請求項1所述之電路路徑簡化方法,其中相鄰排列的該些元件標籤的一者與該些線路標籤的一者表示該些元件標籤的該者所對應的該些電子元件的一者電性連接該些線路標籤的該者所對應的該些線路的一者。 A circuit path simplification method as described in claim 1, wherein one of the component labels and one of the circuit labels arranged adjacently indicate that one of the electronic components corresponding to the component labels is electrically connected to one of the circuits corresponding to the circuit labels. 如請求項1所述之電路路徑簡化方法,其中於該元件標籤比對步驟中,當於其中二該初始路徑序列中位於該些線路標籤的該者 前的該些元件標籤的二者為相同時,該合併步驟係驅動該運算處理單元合併位於該些線路標籤的該者前的該些元件標籤的該二者;及當於其中二該初始路徑序列中位於該些線路標籤的該者後的該些元件標籤的二者為相同時,該合併步驟係驅動該運算處理單元合併位於該些線路標籤的該者後的該些元件標籤的該二者。 The circuit path simplification method as described in claim 1, wherein in the component label comparison step, when two of the component labels located before one of the line labels in two of the initial path sequences are the same, the merging step is to drive the operation processing unit to merge the two of the component labels located before the one of the line labels; and when two of the component labels located after the one of the line labels in two of the initial path sequences are the same, the merging step is to drive the operation processing unit to merge the two of the component labels located after the one of the line labels. 如請求項1所述之電路路徑簡化方法,其中於該元件標籤比對步驟中,當於其中二該初始路徑序列中位於該些線路標籤的該者前的該些元件標籤的二者為相同時,該合併步驟係驅動該運算處理單元合併位於該些線路標籤的該者前的該些元件標籤的該二者;及當於其中二該初始路徑序列中位於該些線路標籤的該者後的該些元件標籤的二者不相同時,該排列步驟係驅動該運算處理單元排列位於該些線路標籤的該者後的該些元件標籤的該二者。 The circuit path simplification method as described in claim 1, wherein in the component label comparison step, when two of the component labels located before one of the line labels in two of the initial path sequences are the same, the merging step is to drive the operation processing unit to merge the two of the component labels located before the one of the line labels; and when two of the component labels located after the one of the line labels in the two initial path sequences are different, the arranging step is to drive the operation processing unit to arrange the two of the component labels located after the one of the line labels. 如請求項1所述之電路路徑簡化方法,其中於該元件標籤比對步驟中,當於其中二該初始路徑序列中位於該些線路標籤的該者前的該些元件標籤的二者不相同時,該排列步驟係驅動該運算處理單元排列位於該些線路標籤的該者前的該些元件 標籤的該二者;及當於其中二該初始路徑序列中位於該些線路標籤的該者後的該些元件標籤的二者為相同時,該合併步驟係驅動該運算處理單元合併位於該些線路標籤的該者後的該些元件標籤的該二者。 The circuit path simplification method as described in claim 1, wherein in the component label comparison step, when the two component labels located before the one of the circuit labels in two of the initial path sequences are different, the arrangement step is to drive the operation processing unit to arrange the two component labels located before the one of the circuit labels; and when the two component labels located after the one of the circuit labels in the two initial path sequences are the same, the merging step is to drive the operation processing unit to merge the two component labels located after the one of the circuit labels. 如請求項1所述之電路路徑簡化方法,其中於該元件標籤比對步驟中,當於其中二該初始路徑序列中位於該些線路標籤的該者前的該些元件標籤的二者不相同時,該排列步驟係驅動該運算處理單元排列位於該些線路標籤的該者前的該些元件標籤的該二者;及當於其中二該初始路徑序列中位於該些線路標籤的該者後的該些元件標籤的二者不相同時,該排列步驟係驅動該運算處理單元排列位於該些線路標籤的該者後的該些元件標籤的該二者。 The circuit path simplification method as described in claim 1, wherein in the component label comparison step, when two of the component labels located before one of the circuit labels in two of the initial path sequences are different, the arrangement step is to drive the operation processing unit to arrange the two of the component labels located before the one of the circuit labels; and when two of the component labels located after the one of the circuit labels in two of the initial path sequences are different, the arrangement step is to drive the operation processing unit to arrange the two of the component labels located after the one of the circuit labels. 一種電路路徑簡化系統,用以簡化對應一電路圖的複數初始路徑序列,該電路圖包含複數電子元件及複數線路,該電路路徑簡化系統包含:一儲存單元,儲存對應該電路圖的該些初始路徑序列,其中各該初始路徑序列包含對應部分該些電子元件的複數元件標籤及對應部分該些線路的複數線路標籤,該些元件標籤及該些線路標籤彼此交互排列;以及 一運算處理單元,連接該儲存單元並取得該些初始路徑序列,且該運算處理單元經配置以實施包含以下步驟:一線路標籤查找步驟,係於該些初始路徑序列中查找相同的該些線路標籤的一者而產生一線路標籤確認結果;及一元件標籤比對步驟,係依據該線路標籤確認結果比對其中二該初始路徑序列中相鄰列於該些線路標籤的該者的該些元件標籤的二者是否相同,以簡化該些初始路徑序列;其中,當該些元件標籤的該二者為相同時,該運算處理單元執行一合併步驟,該合併步驟係合併其中二該初始路徑序列之該些元件標籤的該二者而產生一合併後元件標籤,並合併其中二該初始路徑序列之該些線路標籤的該者而產生一合併後線路標籤,該合併後元件標籤與該合併後線路標籤排列以形成一簡化後路徑序列;其中,當該些元件標籤的該二者不相同時,該運算處理單元執行一排列步驟,該排列步驟係排列其中二該初始路徑序列之該些元件標籤的該二者而產生一排列後元件標籤,並合併其中二該初始路徑序列之該些線路標籤的該者而產生該合併後線路標籤,該排列後元件標籤與該合併後線路標籤排列以形成另一簡化後路徑序列;其中,該運算處理單元於該合併後線路標籤中引入一第一符號與一第二符號之一者,該第一符號與該第二符號之該者位於該些線路標籤的該者前,該第一符號表示 列於該些線路標籤的該者前的該些元件標籤的一者所對應的該些電子元件的一者經由該些線路標籤的該者所對應的該些線路的一者串接列於該些線路標籤的該者後的另一該元件標籤所對應的該些電子元件的一者,且該第二符號表示列於該些線路標籤的該者前的該些元件標籤的該者所對應的該些電子元件的該者經由該些線路標籤的該者所對應的該些線路的該者並聯列於該些線路標籤的該者後的至少二該元件標籤所對應的至少二該電子元件。 A circuit path simplification system is used to simplify a plurality of initial path sequences corresponding to a circuit diagram, wherein the circuit diagram includes a plurality of electronic components and a plurality of circuits. The circuit path simplification system includes: a storage unit, storing the initial path sequences corresponding to the circuit diagram, wherein each of the initial path sequences includes a plurality of component labels corresponding to a portion of the electronic components and a plurality of circuit labels corresponding to a portion of the circuits, wherein the component labels and the circuit labels are arranged alternately with each other; and an operation processing unit, connected to the storage unit and obtaining the initial path sequences, and the operation processing unit is configured to implement the following steps: a circuit label search step, which is performed on the initial path sequences; The method comprises the steps of searching for one of the identical circuit labels in the path sequence to generate a circuit label confirmation result; and a component label comparison step, which compares the two component labels of the adjacent circuit labels in two of the initial path sequences according to the circuit label confirmation result to determine whether the two component labels are identical, so as to simplify the initial path sequences; wherein, when the two component labels are identical, the operation processing unit executes a merging step, wherein the merging step is to merge the two component labels of the two initial path sequences to generate a merged component label, and merge the one of the circuit labels of the two initial path sequences to generate a merged circuit label, wherein the The merged component label and the merged circuit label are arranged to form a simplified path sequence; wherein, when the two of the component labels are different, the operation processing unit executes an arrangement step, the arrangement step is to arrange the two of the component labels of two of the initial path sequences to generate an arranged component label, and merge the one of the circuit labels of two of the initial path sequences to generate the merged circuit label, the arranged component label and the merged circuit label are arranged to form another simplified path sequence; wherein, the operation processing unit introduces one of a first symbol and a second symbol into the merged circuit label, the first symbol and the second symbol The first symbol indicates that one of the electronic components corresponding to one of the component labels listed before the one of the circuit labels is connected in series with one of the electronic components corresponding to another component label listed after the one of the circuit labels through one of the circuits corresponding to the one of the circuit labels, and the second symbol indicates that one of the electronic components corresponding to the one of the component labels listed before the one of the circuit labels is connected in parallel with at least two electronic components corresponding to at least two component labels listed after the one of the circuit labels through the one of the circuits corresponding to the one of the circuit labels. 如請求項7所述之電路路徑簡化系統,其中相鄰排列的該些元件標籤的一者與該些線路標籤的一者表示該些元件標籤的該者所對應的該些電子元件的一者電性連接該些線路標籤的該者所對應的該些線路的一者。 A circuit path simplification system as described in claim 7, wherein one of the component labels and one of the circuit labels arranged adjacently indicate that one of the electronic components corresponding to the component labels is electrically connected to one of the circuits corresponding to the circuit labels.
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