TWI886819B - Test socket structure - Google Patents

Abstract

The present invention provides a structure of a test seat, which is a plurality of through holes from an upper surface to a lower surface of a base, the through holes are arranged adjacent to each other, one end of each of a plurality of probes is slidably arranged in one of the through holes, and a contact portion is arranged at the other end of each of the probes, and the contact portions of each of the probes are in electrical contact with each other. When the probes are in contact with an object to be tested, the contact portions of each of the probes are electrically connected to each other, so as to reduce the difference in current provided by the individual probes to the object to be tested.

Description

Test socket structure

The present invention relates to a test socket structure, and more particularly to a test socket in which a plurality of probe contact ends are mutually contacted and electrically connected to reduce current error.

With the booming development of electronic technology and related technologies such as the Internet, as well as the ever-increasing consumption level of the global electronics market, the demand for consumer electronic products has risen rapidly, which has driven the prosperous development of the semiconductor industry.

Semiconductor manufacturing involves several key steps, including IC design, wafer fabrication, wafer probe, wafer packaging, and post-packaging testing. Among these steps, the purpose of wafer testing and post-packaging testing is to test the electrical functions of one or more dies on an uncut wafer, or one or more dies that have been cut from a wafer, in order to detect and eliminate unqualified dies.

Usually, when semiconductor die are tested, the tester needs to contact the DUT through a test socket. In other words, the test socket is regarded as the transmission interface of the test signal and power signal between the tester and the DUT. At the same time, the test socket and the tester use control and analysis programs to achieve accurate measurement of the electrical characteristics of the DUT. This test socket plays a key role in ensuring the accuracy and reliability of the test, thereby ensuring the production of high-quality semiconductor components.

It is known that the test socket is generally composed of two parts: one is the socket body, a component made of metal or plastic with a precision cut cavity; the other is the spring probe inserted into the perforation of the test socket, providing a retractable electrical path to connect the chip to the test system. The probes are usually multiple and densely arranged to ensure that they can contact the conductive components on the object under test.

However, it is known that when the test socket is at a higher current, the current flowing through multiple probes will gradually become different, resulting in different currents flowing through each probe. This is because the current will select the probe with lower impedance, causing some probes to withstand higher currents and generate higher temperatures. The uneven distribution of probe impedance and current and the high temperature will directly affect the results of the DUT detection and damage the test socket, resulting in inaccurate test results. Therefore, the industry needs a test socket structure that can average the current.

In view of the above problems of the prior art, the present invention provides a test socket structure in which the individual contact parts of a plurality of probes of the base are in contact with each other and are conductive, providing a test socket capable of reducing the difference in individual current of the probes.

One purpose of the present invention is to provide a test socket structure in which a plurality of probes are slidably mounted on a base, and individual contact portions of the plurality of probes are in contact with and conductive to each other. Through the mutually electrically conductive contact portions, the impedance of the individual probes is reduced, the current difference supplied to the object to be tested is reduced, and the temperature generated by the probes is further reduced.

In order to achieve the above-mentioned purposes and effects, the present invention provides a test seat structure, which includes a base and a plurality of probes. A plurality of through holes are formed from an upper surface to a lower surface of the base, and the through holes are disposed adjacent to each other. One end of each of the plurality of probes is slidably disposed in one of the through holes, and a contact portion is disposed at the other end of each of the plurality of probes. The contact portions of each of the plurality of probes are in electrical contact with each other. With this structure, the current difference provided by each of the probes to the object to be tested is reduced.

In one embodiment of the present invention, a portion of the upper surface of the base is recessed to form a receiving groove, and the ends of the probes protrude from the upper surface and extend to the receiving groove.

In an embodiment of the present invention, a plate is disposed on top of one of the accommodating grooves, and the ends of the respective probes penetrate the plate.

In one embodiment of the present invention, each of the probes is sleeved with an elastic member, one end of the elastic member abuts against a lower portion of the plate, and the other end of the elastic member abuts against the probes, and the elastic member is used to provide a downward thrust to the probes.

In an embodiment of the present invention, a plurality of gaskets are further included. The gaskets are respectively sleeved on the ends of the probes, and a bottom of one of the gaskets abuts against an upper part of the plate.

In an embodiment of the present invention, a limiting groove is disposed at the end of each of the probes, and each of the pads is disposed in the limiting groove of each of the probes.

In one embodiment of the present invention, the contact portion of each of the probes is a hexagonal column, and the contact portions of each of the probes are in electrical contact with each other.

In one embodiment of the present invention, a plurality of bump structures are disposed below one of the contact portions of each of the probes.

In one embodiment of the present invention, the base and the probes are made of a conductive material.

In an embodiment of the present invention, a moving distance of each of the probes is smaller than a height of the contact portion of each of the probes.

In order to enable you to have a deeper understanding and knowledge of the features and effects of the present invention, we would like to provide practical examples and accompanying explanations as follows:

In view of the above-mentioned problems of the prior art, the present invention is a structure of a test seat, which is a plurality of through holes from an upper surface to a lower surface of a base, and the through holes are arranged adjacent to each other. One end of each of a plurality of probes is slidably arranged in one of the through holes, and a contact portion is arranged at the other end of each of the probes. The contact portions of each of the probes are in contact with each other and electrically conductive. When the probes abut against the object to be tested, the contact portions of each of the probes are electrically conductive with each other, thereby solving the problem of uneven current conduction and high temperature generated by the probes of the prior art test seat.

Please refer to FIG. 1 , which is a schematic exploded view of the structure of an embodiment of the present invention. As shown in the figure, this embodiment is the first embodiment. This embodiment is a structure 1 of a test socket, which includes a base 10 and a plurality of probes 20 .

Refer to Figure 1 again and refer to Figure 2A and Figure 2B. Figure 2A is a schematic side view of the structure of an embodiment of the present invention, and Figure 2B is an enlarged schematic side view of the structure of an embodiment of the present invention. As shown in the figure, in this embodiment, a plurality of through holes 14 are penetrated from an upper surface 11 to a lower surface 12 of the base 10, and the through holes 14 are arranged adjacent to each other. One end of each of the probes 20 is slidably arranged in one of the through holes 14, and a contact portion 22 is arranged at the other end of each of the probes 20. The contact portions 22 of each of the probes 20 are in contact with each other and conductive.

Continuing from the above, in FIG. 2A and FIG. 2B, the dotted line portion represents the rear probe.

Continuing with the above, in this embodiment, the base 10 and the probes 20 are made of a conductive material, so that the probes 20 are electrically connected to the base 10 .

Please refer to Figures 3A to 3B, which are schematic diagrams of the structural operation of an embodiment of the present invention. As shown in the figure, in this embodiment, the structure 1 of the test socket is used to test an object under test 30. The object under test 30 is provided with a first conductive component 32 and a second conductive component 34. The first conductive component 32 is a conductive element protruding from the second conductive component 34, and is used to indicate conductive elements of different heights on the object under test 30.

Continuing from the above, when the test seat structure 1 is used for testing, the base 10 moves toward the object to be tested 30 and drives the probes 20 to move. When the probes 20 move to the object to be tested 30, a portion of the probes 20 first abut against the protruding first conductive member 32, and then another portion of the probes 20 abut against the lower second conductive member 34, so that the probes 20 form a step difference with each other. In this embodiment, the individual probes 20 are The contact portion 22 has a height H1. When the object to be tested 30 is moved, each of the probes 20 moves a moving distance H2. The moving distance H2 refers to the height difference between a portion of the probe 20 abutting against the first conductive member 32 and another portion of the probe 20 abutting against the second conductive member 34 (as shown in FIG. 3B ). The moving distance H2 is smaller than the height H1 to avoid excessive height difference, so that the contact portions 22 of the probes 20 do not contact each other.

The probes 20 of this embodiment are in contact with each other to balance and reduce individual impedance. After balancing the impedance of each probe 20, the current unevenness can be avoided. After reducing the impedance, the overall current carrying capacity can be improved and the heat generation can be reduced.

Please refer to FIG. 4A, which is a schematic diagram of the contact portion structure of an embodiment of the present invention. FIG. 4A is a bottom view. As shown in the figure, in this embodiment, the contact portion 22 of each of the probes 20 is a hexagonal prism. The contact portion 22 of the hexagonal prism is densely laid (flat filling) on the lower surface 12, and the contact portions 22 of each of the probes 20 are in surface contact with each other, so that they are electrically conductive to each other.

Please refer to FIG. 4B, which is a schematic diagram of the contact portion structure of another embodiment of the present invention. FIG. 4B is a bottom view. As shown in the figure, in another embodiment of the contact portion 22, the contact portion 22 of each of the probes 20 is a quadrangular prism, and the contact portion 22 of the quadrangular prism is densely laid (flat filling) on the lower surface 12, and the contact portions 22 of each of the probes 20 are in surface contact with each other, so that they are electrically conductive with each other. The other component relationships of this embodiment are the same as those of the first embodiment, so they are not repeated here.

Please refer to FIG. 4C, which is a schematic diagram of the contact portion structure of another embodiment of the present invention. FIG. 4C is a bottom view. As shown in the figure, in another embodiment of the contact portion 22, the contact portion 22 of each of the probes 20 is a cylinder. The cylindrical contact portions 22 are arranged on the lower surface 12, and the contact portions 22 of each of the probes 20 are in line contact with each other so that they are electrically conductive with each other. The other component relationships of this embodiment are the same as those of the first embodiment, so they are not repeated.

Please refer to Figure 5, Figure 6A and Figure 6B, Figure 5 is a schematic diagram of other structures of an embodiment of the present invention, Figure 6A is a schematic side view of other structures of an embodiment of the present invention, and Figure 6B is an enlarged schematic side view of other structures of an embodiment of the present invention. As shown in the figure, this embodiment is a second embodiment, which is based on the above-mentioned first embodiment. In this embodiment, the base 10 further includes a accommodating groove 16 and a plate 18, and the probes 20 are respectively mounted with an elastic member 24, and a plurality of gaskets 26 are respectively mounted with one of the probes 20.

Continuing from the above, a portion of the upper surface 11 of the base 10 is recessed to form the receiving groove 16, and the ends of the probes 20 protrude from the upper surface 11, and the ends of the probes 20 extend to the receiving groove 16. The plate 18 is disposed on one of the receiving grooves 16, and the ends of the probes 20 penetrate the plate 18.

Continuing from the above, the plate 18 is used to adjust the positions of the probes 20 to prevent the bending displacement of the probes 20 from affecting the test results.

Continuing from the above, the probes 20 are respectively sleeved with the elastic member 24, one end of the elastic member 24 abuts against one of the lower parts of the plate 18, and the other end of the elastic member 24 abuts against the probes 20. The elastic member 24 is disposed in the receiving groove 16 to provide a downward thrust to the probes 20 to prevent the probes 20 from shifting during testing, resulting in poor contact.

Continuing with the above, the other end of the elastic member 24 can be welded to the probes 20 , or the other end of the elastic member 24 abuts against the limiting grooves of the probes 20 .

Continuing from the above, the gaskets 26 are respectively mounted on the ends of the probes 20, and the bottom of one of the gaskets 26 abuts against the top of one of the plate 18. The gaskets 26 can further prevent the probes 20 from sliding off the plate 18 and the base 10.

Continuing with the above, further, a limiting groove 28 is provided at the end of each of the probes 20, and each of the gaskets 26 is provided in the limiting groove 28 of each of the probes 20 to securely fix the gaskets 26 and the probes 20. The other component relationships of this embodiment are the same as those of the first embodiment, so they will not be described in detail.

Continuing from the above, in FIG. 6A and FIG. 6B, the dotted line portion represents the rear probe.

Referring again to FIG. 2B and FIG. 6A , as shown in the figures, in one embodiment, a plurality of bump structures 222 are further disposed under one of the contact portions 22 of each of the probes 20. The bump structures 222 are used to ensure that the contact portions 22 of each of the probes 20 are electrically connected to the object to be tested 30. The other component relationships of this embodiment are the same as those of the first embodiment described above, and thus will not be described in detail.

In summary, the present invention provides a test socket structure, in which a plurality of probes are slidably mounted on a base, and individual contact portions of the plurality of probes are in contact with each other and are electrically connected. Through the mutually electrically connected contact portions, the impedance of the individual probes is reduced, the difference in current supplied to the object to be tested is reduced, and the temperature generated by the probes is further reduced. This solves the problem that when a higher current is applied to the conventional test socket, the current flowing through each probe is different, which causes some probes to bear a higher current and generate a higher temperature. The probe impedance and current are unevenly distributed, and the high temperature is generated, which directly affects the result of the object to be tested detection and damages the test socket, resulting in inaccurate test results.

Therefore, this invention is novel, progressive and can be used in the industry. It should undoubtedly meet the patent application requirements of the Patent Law of our country. Therefore, we have filed an invention patent application in accordance with the law and pray that the Bureau will approve the patent as soon as possible. I am deeply grateful.

However, the above is only an embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, all equivalent changes and modifications based on the shape, structure, features and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

1         Test seat structure 10         Base 11         Upper surface 12       Lower surface 14       Perforation 16       Receiving groove 18       Plate 20       Probe 22       Contact part 222     Bump structure 24       Elastic part 26       Gasket 28       Limiting groove 30       Object to be tested 32       First conductive part 34       Second conductive part H1      Height H2      Moving distance

Figure 1: It is a schematic diagram of the structure explosion of one embodiment of the present invention; Figure 2A: It is a schematic diagram of the structure side view of one embodiment of the present invention; Figure 2B: It is an enlarged schematic diagram of the structure side view of one embodiment of the present invention; Figures 3A to 3B: They are schematic diagrams of the structure operation of one embodiment of the present invention; Figure 4A: It is a schematic diagram of the contact part structure of one embodiment of the present invention; Figure 4B: It is a schematic diagram of the contact part structure of another embodiment of the present invention; Figure 4C: It is a schematic diagram of the contact part structure of another embodiment of the present invention; Figure 5: It is a schematic diagram of other structures of one embodiment of the present invention; Figure 6A: It is a schematic diagram of other structures side view of one embodiment of the present invention; and Figure 6B: It is an enlarged schematic diagram of the side view of another structure of one embodiment of the present invention.

1: Structure of the test socket

10: Base

11: Upper surface

12: Lower surface

14: Perforation

20: Probe

22: Contact area

Claims (9)

A structure of a test seat, comprising: A base, a plurality of through holes are formed from an upper surface to a lower surface, and the through holes are disposed adjacent to each other; and A plurality of probes, each of which has one end correspondingly slidably disposed in one of the through holes, and each of the other ends of the probes is provided with a contact portion, and the contact portions of the probes are in electrical contact with each other; Wherein, the base and the probes are made of a conductive material. The structure of the test socket as described in claim 1, wherein a portion of the upper surface of the base is recessed to form a receiving groove, and the ends of the individual probes protrude from the upper surface, and the ends of the individual probes extend to the receiving groove. The structure of the test socket as described in claim 2, wherein a plate is provided on top of one of the receiving grooves, and the ends of the respective probes penetrate the plate. The structure of the test socket as described in claim 3, wherein each of the probes is respectively mounted with an elastic member, one end of the elastic member abuts against a lower portion of the plate, and the other end of the elastic member abuts against the probes, and the elastic member is used to provide a downward thrust to the probes. The structure of the test socket as described in claim 3 further includes a plurality of gaskets, each of which corresponds to and is mounted on the end of each of the probes, and a bottom of one of the gaskets abuts against an upper portion of one of the plates. The structure of the test socket as described in claim 5, wherein a limiting groove is provided at the end of each of the probes, and the gaskets are respectively provided in the limiting groove of each of the probes. The structure of the test socket as described in claim 1, wherein the contact portion of each of the probes is a hexagonal column, and the contact portions of each of the probes are in electrical contact with each other. The structure of the test socket as described in claim 1, wherein a plurality of bump structures are arranged under one of the contact portions of each of the probes. A structure of a test socket as described in claim 1, wherein a moving distance of each of the probes is smaller than a height of the contact portion of each of the probes.

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