TWI883002B - Polysilicone composition for die bonding, cured product thereof and optical semiconductor device - Google Patents

Abstract

The present invention provides a polysilicone composition for die bonding that can provide a hardened material with excellent hardness and grain shear strength and suppresses gold pad contamination in optical semiconductor devices. The polysilicone composition for die bonding contains, in a specific ratio, (A) an organic polysiloxane having two or more alkenyl groups in one molecule and a viscosity of 100 mPa·s or less at 25°C, (B) a specific three-dimensional network organic polysiloxane that is waxy or solid at 23°C, (C) a specific organic hydropolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule, (D) a specific polysiloxane containing an epoxy group, and (E) a platinum group metal catalyst.

Description

Polysilicone composition for die bonding, cured product thereof and optical semiconductor device

The present invention relates to a polysilicon composition for die bonding, a cured product thereof, and an optical semiconductor device using the cured product thereof.

Recently, silicone resins with good durability are used as sealing materials and die-bonding materials for light-emitting diode (hereinafter referred to as "LED") components, as the heat generated by the components increases with the brightness of LED components (Patent Documents 1 and 2). In particular, if the resin in the die-bonding material is too soft, the wire bonding step after the die-bonding step will cause the defect of being unable to be bonded, so a die-bonding material with high hardness is required.

In addition, LED devices have been miniaturized in recent years, and require a die-bonding material with higher adhesion. If the adhesion of the die-bonding material is insufficient, the chip will peel off during the wire bonding step in LED manufacturing, which becomes a fatal problem in the manufacturing process. Although the existing polysilicone die-bonding material has excellent durability, its adhesion is insufficient, and a material with higher die shear strength is desired.

In addition to high grain shear strength, there is also the problem that low molecular weight components generated when the die bonding material is heated and hardened may contaminate the gold pad of the chip, which will become the cause of defects in the wire bonding step. Although silane coupling agents with adhesive functional groups are used in polysilicone to improve adhesion, general silane coupling agents are low molecular weight and will evaporate when heat (100~180℃) is applied during the die bonding hardening step, causing pores or reduced grain shear strength, which may cause gold pad contamination. In other words, it is expected that the die bonding material can improve the grain shear strength while not contaminating the gold pad. [Prior technical literature] [Patent literature]

[Patent document 1] Japanese Patent Publication No. 2006-342200 [Patent document 2] Japanese Patent Publication No. 2010-285571

[Problems to be solved by the invention]

The present invention was completed in view of the above situation, and its purpose is to provide a polysilicon composition for die bonding that can provide a hardened material with excellent hardness and grain shear strength and suppress gold pad contamination in optical semiconductor devices. [Means for solving the problem]

In order to achieve the above-mentioned problem, the present invention provides a polysiloxane composition for bonding a die, comprising the following components (A) to (E). (A) an organic polysiloxane having two or more alkenyl groups in one molecule and a viscosity of 100 mPa·s or less at 25°C, (B) a three-dimensional network organic polysiloxane represented by the following formula (1) and in a waxy or solid state at 23°C: 70 to 95 parts by weight relative to 100 parts by weight of the total of components (A) and (B), (In the formula, ^R1 is the same or different, substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl group, ^R2 is the same or different alkenyl group, a, b, c, d, e, f, g and h are numbers satisfying a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h≧0, but are numbers satisfying b+c＞0, f+g+h＞0 and a+b+c+d+e+f+g+h=1) (C) an organohydropolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms bonded to silicon atoms in one molecule: the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to silicon atoms in components (A) and (B), (wherein, ^R1 is the same as above, i and j are numbers satisfying 0.7≦i≦2.1, 0.001≦j≦1.0 and 0.8≦i+j≦3.0) (D) an epoxy group-containing polysiloxane represented by the following formula (3): 1 to 25 parts by weight relative to 100 parts by weight of the total of the components (A), (B) and (C), (wherein, ^R1 is the same as above, ^R3 is the same or different epoxy-containing group, ^R4 is the same or different substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl group, k and m are numbers satisfying k＞0, m≧0 and k+m=1, and n is a number satisfying 0≦n≦2), (E) Platinum metal catalyst: 1-500ppm in terms of mass of platinum metal element relative to the total mass of component (A), component (B), component (C) and component (D).

The polysilicone composition for die bonding according to the present invention can provide a hardened material with excellent hardness and die shear strength and suppress contamination of gold pads in optical semiconductor devices.

The component (A) is preferably an organic polysiloxane represented by the following formula (4): (In the formula, ^R1 and ^R2 are the same as above, o, p, q, r are numbers satisfying q≧0, r≧0, o≧0, p≧0 respectively, but are numbers satisfying q+r＞0, r+o＞0, o+p＞0 and o+p+q+r=1).

If the aforementioned component (A) is an organic polysiloxane having the aforementioned characteristics, the polysilicone composition for die bonding can be a hardened material that can provide better hardness and die shear strength and can further suppress contamination of the gold pad in the optical semiconductor device.

In the above formula (1), preferably b>0 and h>0. If b>0 and h>0 in the above formula (1), the polysilicone composition for die bonding becomes a hardened material that can provide better hardness and grain shear strength, especially can provide bonding strength and suppress gold pad contamination in optical semiconductor devices.

The aforementioned component (C) is preferably one whose mass decreases to less than 1 mass % when heated at 150°C for 30 minutes under 1 atmosphere. If the aforementioned component (C) is the aforementioned, the polysilicone composition for die bonding becomes one in which gold pad contamination in optical semiconductor devices is more suppressed.

The aforementioned component (D) is preferably one whose mass reduction is 5 mass % or less when heated at 150°C for 30 minutes under 1 atmosphere. If the aforementioned component (D) is the aforementioned, the polysilicone composition for die bonding becomes one in which gold pad contamination in optical semiconductor devices is more suppressed.

In the above-mentioned component (D), preferably R ³ is a group represented by the following formula (5): (Where s is an integer from 1 to 6, and the dashed line represents a key bond).

When ^R3 is the aforementioned specific functional group, the polysilicone composition for die attach becomes a hardened material that can be endowed with better hardness and die shear strength and can suppress gold pad contamination in optical semiconductor devices.

In the aforementioned composition, preferably 80 mol% or more of all ^R1s are methyl groups. If 80 mol% or more of all ^R1s in the aforementioned composition are methyl groups, the polysilicone composition for die bonding becomes a cured product that can be endowed with excellent heat resistance, light resistance (ultraviolet resistance), and resistance to deterioration such as discoloration due to stress such as heat and ultraviolet rays.

The composition preferably contains (F) fumed silica having a BET specific surface area of 100 to 400 ^{m 2} /g. If the composition contains the fumed silica, the composition has excellent thixotropic properties and workability.

The present invention also provides a polysilicone hardened material, which is a hardened material of the polysilicone composition for die bonding. According to this polysilicone hardened material, it has excellent hardness and grain shear strength, and has high bonding strength with substrates, LED chips, etc., and can be used as a die bonding material for die bonding of LED components, etc.

Furthermore, the present invention provides an optical semiconductor device in which an optical semiconductor element is bonded with the aforementioned polysilicone cured material. According to this optical semiconductor device, since the aforementioned polysilicone cured material is used as a bonding material with excellent hardness and grain shear strength and high bonding strength with substrates, LEDs, etc., it becomes a highly reliable one. [Effect of the invention]

As described above, the polysilicone composition for die bonding according to the present invention is particularly useful as a die bonding material for die bonding of LED components, etc., because it can provide a hardened material with excellent hardness and grain shear strength and suppresses gold pad contamination in optical semiconductor devices. In addition, in the wire bonding step performed after the die bonding step, it is difficult to cause defects such as chip peeling and inability to bond the die. The reliability of the optical semiconductor device in which the optical semiconductor component is bonded by the polysilicone hardened material is high, and its productivity is also improved.

As mentioned above, it is required to develop a die bonding material for LED components and the like with less gold pad contamination, and to provide a polysilicone composition for die bonding that can provide a polysilicone cured product with excellent hardness and grain shear strength.

As a result of repeated and active research on the above-mentioned subject, the inventors of the present invention have found that a polysilicone composition for die bonding comprising the components (A), (B), (C), (D) and (E) described below can achieve the above-mentioned subject, thereby completing the present invention.

That is, the present invention is a polysiloxane composition for bonding a die containing the following components (A) to (E). (A) an organic polysiloxane having two or more alkenyl groups in one molecule and a viscosity of 100 mPa·s or less at 25°C, (B) a three-dimensional network organic polysiloxane represented by the following formula (1) and in a waxy or solid state at 23°C: 70 to 95 parts by weight relative to 100 parts by weight of the total of components (A) and (B), (wherein, ^R1 is the same or different, substituted or unsubstituted monovalent alkyl group not containing alkenyl, ^R2 is the same or different alkenyl, a, b, c, d, e, f, g and h are numbers satisfying a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h≧0, but are numbers satisfying b+c＞0, f+g+h＞0 and a+ b+c+d+e+f+g+h=1), (C) an organohydropolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms bonded to silicon atoms in one molecule: the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to silicon atoms in components (A) and (B), (wherein, R ¹ is the same as above, i and j are numbers satisfying 0.7≦i≦2.1, 0.001≦j≦1.0 and 0.8≦i+j≦3.0), (D) an epoxy group-containing polysiloxane represented by the following formula (3): 1 to 25 parts by weight relative to 100 parts by weight of the total of the components (A), (B) and (C), (wherein, ^R1 is the same as above, ^R3 is the same or different epoxy-containing group, ^R4 is the same or different substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl group, k and m are numbers satisfying k＞0, m≧0 and k+m=1, and n is a number satisfying 0≦n≦2), (E) Platinum metal catalyst: 1-500ppm in terms of mass of platinum metal element relative to the total mass of component (A), component (B), component (C) and component (D).

The present invention is described in detail below, but the present invention is not limited thereto. [Polysilicone composition for die bonding] The polysilicone composition for die bonding of the present invention contains the following components (A) to (E). The following describes each component in detail.

<Component (A)> Component (A) is an organic polysiloxane having two or more alkenyl groups in one molecule and a viscosity of 100 mPa･s or less at 25°C. The viscosity of component (A) is 100 mPa･s or less, preferably 30 mPa･s or less, as measured by a rotational viscometer at 25°C. When the viscosity exceeds 100 mPa･s, the viscosity of the polysilicone composition for die bonding becomes high, making it difficult to handle the composition in the step of coating the composition on the LED substrate by a die bonding machine. In the following, unless otherwise specified, the viscosity is the value measured by a rotational viscometer at 25°C.

The alkenyl group contained in the component (A) is not particularly limited, but is preferably an alkenyl group having 2 to 10 carbon atoms such as vinyl, allyl, ethynyl, etc., more preferably an alkenyl group having 2 to 6 carbon atoms, and still more preferably vinyl.

The component (A) may be a substituted or unsubstituted monovalent hydrocarbon group not containing an alkenyl group. For example, if it does not have an alkenyl group, it is not particularly limited, but preferably a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms. Examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl and cyclopentyl, aryl groups such as phenyl, tolyl, and xylyl, aralkyl groups such as benzyl and phenylethyl, and halogenated hydrocarbon groups such as chloromethyl, chloropropyl, and chlorocyclohexyl. An alkyl group is preferred, and a methyl group is more preferred.

As the component (A), a branched organic polysiloxane represented by the following average composition formula (4) is exemplified. (wherein, ^R1 is the same or different, substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl, ^R2 is the same or different alkenyl, o, p, q, r are numbers satisfying q≧0, r≧0, o≧0, p≧0, but are numbers satisfying q+r＞0, r+o＞0, o+p＞0 and o+p+q+r=1).

The substituted or unsubstituted monovalent hydrocarbon group not containing an alkenyl group represented by ^R1 is not particularly limited if it does not have an alkenyl group, but is preferably a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms. Examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl and cyclopentyl, aryl groups such as phenyl, tolyl, and xylyl, aralkyl groups such as benzyl and phenylethyl, and halogenated hydrocarbon groups such as chloromethyl, chloropropyl, and chlorocyclohexyl. An alkyl group is preferred, and a methyl group is more preferred.

The alkenyl group represented by R ² is not particularly limited, but is preferably an alkenyl group having 2 to 10 carbon atoms such as vinyl, allyl, ethynyl, etc., more preferably an alkenyl group having 2 to 6 carbon atoms, and even more preferably vinyl.

Specific examples of the branched organopolysiloxane include those represented by the following formula.

As the component (A), an organopolysiloxane having a linear molecular structure may be used. Specific examples of the linear organopolysiloxane include those represented by the following formula. (In the above formula, the arrangement order of the siloxane units in the parentheses may be arbitrary.) The component (A) may be used alone or in combination of two or more.

<Component (B)> Component (B) is a three-dimensional network organopolysiloxane represented by the following average composition formula (1) and is a waxy or solid three-dimensional network organopolysiloxane at 23°C. Component (B) is a component used to maintain the transparency of the cured product and obtain reinforcement, and is a three-dimensional network organopolysiloxane resin containing an olefin group bonded to a silicon atom and at least one of a SiO _3/2 unit or a SiO _4/2 unit in the molecule. Here, the so-called "waxy" means a rubbery (raw rubber) having a viscosity of 10,000,000 mPa·s or more, especially 100,000,000 mPa·s or more at 23°C and showing almost no self-fluidity.

(Wherein, ^R1 and ^R2 are the same as above, a, b, c, d, e, f, g and h are numbers satisfying a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h≧0 respectively, but are numbers satisfying b+c＞0, f+g+h＞0 and a+b+c+d+e+f+ g+h=1).

^R1 is exemplified as the same as those exemplified in component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group. ^R2 is exemplified as the same as those exemplified in component (A), preferably an alkenyl group having 2 to 10 carbon atoms, more preferably an alkenyl group having 2 to 6 carbon atoms, and more preferably a vinyl group. Preferably, a is 0 to 0.65, b is 0.1 to 0.65, c is 0 to 0.65, d is 0 to 0.5, e is 0 to 0.5, f is 0 to 0.8, g is 0 to 0.8, and h is 0 to 0.6. And f+g+h is preferably 0.05 or more, more preferably 0.1 to 0.9, and more preferably 0.2 to 0.6.

In the (B) component, the content of the olefin group bonded to the silicon atom is preferably in the range of 0.01 to 1 mol per 100 g of the (B) component, and more preferably in the range of 0.1 to 0.6 mol. If the above content is in the range of 0.01 to 1 mol, the crosslinking reaction will proceed fully, and a hardened material with higher hardness will be obtained.

The component (B) preferably has R ² ₃ SiO _1/2 units and SiO _4/2 units (i.e., b>0 and h>0), in which case, bonding strength can be imparted to the hardened material obtained from the composition. In addition, the component (B) must have a branched structure consisting of SiO _4/2 units and/or SiO _3/2 units, but may further contain SiO _2/2 (SiO) units such as methylvinylsiloxy units and dimethylsiloxy units, and SiO _1/2 units such as dimethylvinylsiloxy units and trimethylsiloxy units. The content of SiO _4/2 units and/or SiO _3/2 units is preferably 5 mol% or more of all siloxane units in the organopolysiloxane resin of component (B), more preferably 10 mol% to 95 mol%, particularly preferably 20 to 60 mol%.

The content of component (B) is 70-95 parts by mass relative to 100 parts by mass of the total of components (A) and (B), preferably 75-95 parts by mass, and more preferably 80-90 parts by mass. When the amount of component (B) is less than 70 parts by mass, the adhesion is poor and a hardened material with high hardness cannot be obtained. When it exceeds 95 parts by mass, the viscosity of the composition becomes significantly higher, transfer becomes difficult, and handling of the composition when used as a bonding material becomes difficult.

Specific examples of the component (B) include the following. ((CH ₂ =CH) ₃ SiO _1/2 ) _0.1 ((CH ₂ =CH)(CH ₃ ) ₂ SiO _{1/ 2} ) _0.2 ((CH ₃ ) ₃ SiO _1/2 ) _0.35 (SiO _4/2 ) _0.35 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.2 ((CH ₃ ) ₃ SiO _1/2 ) _0.1 (Si O _4/2 ) _0.7 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.07 ((CH ₃ ) ₃ SiO _1/2 ) _0.4 (S iO _4/2 ) _0.53 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.14 ((CH ₃ ) ₃ SiO _1/2 ) _0.32 (SiO _4/2 ) _0.54 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.07 ((CH ₃ ) ₃ SiO _1/2 ) _0.33 (SiO _4/2 ) _0.6 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.1 ((CH ₃ ) ₃ SiO _1/2 ) _0.1 ((CH ₃ ) ₂ SiO) _0.2 ((CH ₃ )SiO _3/2 ) _0.6 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.07 ((CH ₃ ) ₃ SiO _1/2 ) _0.13 ((CH ₃ ) ₂ SiO) _0.2 (SiO _4/2 ) _0.6 , ((CH ₂ =CH) ₃ SiO _1/2 ) _0.3 (SiO _4/2 ) _0.7 、((CH ₂ =CH) ₃ SiO _1/2 ) _0.2 ((CH ₃ )SiO _3/2 ) _0.8 、((CH ₂ =CH) ₃ SiO _1/2 ) _0.2 ((CH ₃ )SiO _3/2 ) _0.6 (SiO _4/2 ) _0.2 、(B) components may be used alone or in combination of two or more.

<(C) Ingredients>

Component (C) acts as a crosslinking agent by crosslinking through a hydrosilylation reaction with alkenyl groups contained in components (A) and (B). Component (C) is an organic hydropolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms (i.e., Si-H groups) bonded to silicon atoms in one molecule.

R ¹ _i H _j SiO _(4-ij)/2 (2)

(wherein, ^R1 is the same as above, and i and j are numbers satisfying 0.7≦i≦2.1, 0.001≦j≦1.0, and 0.8≦i+j≦3.0).

Examples of R ¹ are the same as those exemplified in the component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.

In addition, the ratio of methyl groups to the total number of all monovalent hydrocarbon groups other than the alkenyl groups represented by ^R1 in the composition of the present invention bonded to silicon atoms is preferably 80 mol% or more (i.e., 80 mol% or more of the aforementioned ^R1 are methyl groups), and particularly preferably 90 mol% or more, because the heat resistance, light resistance (ultraviolet resistance) and resistance to deterioration such as discoloration due to stress such as heat and ultraviolet rays are excellent.

The component (C) has at least 2, preferably 2 to 200, more preferably 3 to 100, and even more preferably 4 to 50 hydrogen atoms (Si—H groups) bonded to silicon atoms in one molecule.

The amount of component (C) is such that the number of hydrogen atoms (Si-H groups) bonded to silicon atoms in component (C) is 0.5 to 5.0 times, preferably 0.7 to 3.0 times, relative to the total number of alkenyl groups bonded to silicon atoms in components (A) and (B) from the viewpoint of crosslinking balance. If the number of hydrogen atoms relative to the total number of alkenyl groups is less than 0.5 times, crosslinking is not fully performed and a hardened material with excellent hardness cannot be obtained. If the number of hydrogen atoms relative to the total number of alkenyl groups is more than 5.0 times, the polysilicone hardened material lacks flexibility and becomes brittle.

The viscosity of the component (C) at 25°C is not particularly limited, but is preferably 100 mPa·s or less, more preferably in the range of 5 to 100 mPa·s.

The mass reduction of the component (C) after heating at 150°C for 30 minutes under 1 atmosphere is preferably less than 1 mass % relative to the mass before heating. If it is within this range, the gold pad contamination can be further reduced. The molecular structure of the organohydropolysiloxane of the component (C) can be any of a straight chain, a ring, a branched chain, and a three-dimensional network structure, and the number of silicon atoms in one molecule is preferably 10 to 300, and more preferably 50 to 200. If so, a composition with less volatile matter during hardening and less gold pad contamination can be obtained.

Examples of the organohydropolysiloxane as the component (C) include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tri(hydrogenated dimethylsiloxy)methylsilane, tri(hydrogenated dimethylsiloxy)phenylsilane, methylhydrocyclopolysiloxane, methylhydrocyclopolysiloxane-dimethylsiloxane cyclic copolymer, methylhydrocyclopolysiloxane terminated with trimethylsiloxy groups at both ends, dimethylhydrocyclopolysiloxane-methylhydrocyclopolysiloxane copolymer terminated with trimethylsiloxy groups at both ends, dimethylhydrocyclopolysiloxane terminated with dimethylhydrocyclopolysiloxane at both ends, methylhydrocyclopolysiloxane terminated with dimethylhydrocyclopolysiloxane at both ends, Dimethylhydrosiloxy-terminated dimethylsiloxane・methylhydrosiloxane copolymer, both ends trimethylsiloxy-terminated methylhydrosiloxane・diphenylsiloxane copolymer, both ends trimethylsiloxy-terminated methylhydrosiloxane・diphenylsiloxane・dimethylsiloxane copolymer, both ends trimethylsiloxy-terminated methylhydrosiloxane・methylphenylsiloxane・dimethylsiloxane copolymer, both ends dimethylhydrosiloxy-terminated methylhydrosiloxane・dimethylsiloxane・diphenylsiloxane copolymer, both ends dimethylhydrosiloxy-terminated methylhydrosiloxane・dimethylsiloxane・methylphenylsiloxane copolymer, (CH ₃ ) ₂ HSiO _1/2 unit, a copolymer composed of a (CH ₃ ) ₃ SiO _1/2 unit and a SiO _4/2 unit, a copolymer composed of a (CH ₃ ) ₂ HSiO _1/2 unit, a SiO _4/2 unit and a ₍ C _{6 H 5} ) ₃ SiO _1/2 unit _, and the like. In addition, those represented by the following general formula ( ₆ ) or (7) are also exemplified. (wherein, ^R1 is as described above, t is an integer between 2 and 40, preferably between 8 and 35, and u is an integer between 6 and 8).

A specific example of the component (C) is represented by the following formula (8): (wherein t is as described above, and Me is a methyl group), those represented by the following formula, etc.

(In the above formula, the arrangement order of the siloxane units in the brackets is arbitrary).

The organohydropolysiloxane of the component (C) may be used alone or in combination of two or more.

<Component (D)> The component (D) is an epoxy group-containing polysiloxane represented by the following formula (3). (wherein, ^R1 is the same as described above, ^R3 is the same or different epoxy-containing group, ^R4 is the same or different substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl, k and m are numbers satisfying k＞0, m≧0 and k+m=1, and n is a number satisfying 0≦n≦2).

Since the component (D) of the present invention is a polymer composed of repeated SiO _3/2 units, it can provide a composition with less low molecular weight components, improved adhesion and no gold pad contamination.

Examples of the epoxy group-containing group represented by ^R3 include a group bonded to a silicon atom via a carbon atom, such as an alicyclic epoxy group or a glycidyl group, and preferably a glycidyl group. More preferably, a group represented by the following formula (5) such as a γ-glycidyloxypropyl group or a β-(3,4-epoxycyclohexyl)ethyl group is used. (In the formula, s is an integer of 1 to 6, and the dotted line represents a bond.) Examples of R ¹ are the same as those exemplified in component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.

The substituted or unsubstituted monovalent hydrocarbon group not containing an alkenyl group represented by ^R4 is not particularly limited if it does not have an alkenyl group, but is preferably a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms. Examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl and cyclopentyl, aryl groups such as phenyl, tolyl, and xylyl, aralkyl groups such as benzyl and phenethyl, and halogenated hydrocarbon groups such as chloromethyl, chloropropyl, and chlorocyclohexyl. Alkyl groups are preferred, and methyl and ethyl groups are particularly preferred.

The mass of the component (D) after heating at 150°C for 30 minutes under 1 atmosphere is reduced by preferably 5% by mass or less relative to the mass before heating. If it is within this range, the gold pad contamination can be further reduced. The component (D) is preferably in liquid form, and if it is in the range of molecular weight 500~10,000, it is better from the perspective of workability and prevention of gold pad contamination. In formula (3), k and m are preferably numbers that satisfy 0＜k≦0.9, 0＜m≦0.9 and k+m=1. If the component (D) is within this range, the compatibility of the components (A), (B) and (C) is excellent, and the resulting hardened material has excellent adhesion and grain shear strength. From the viewpoint of storage stability of the composition and prevention of gold pad contamination, n is preferably a number between 0 and 1, more preferably a number between 0 and 0.1, and even more preferably 0.

The amount of component (D) is 1 to 25 parts by mass, preferably 3 to 10 parts by mass, relative to 100 parts by mass of the total of components (A), (B) and (C). If the amount is less than the lower limit, the target grain shear strength may not be obtained. If the amount is more than the upper limit, the components may separate in the composition, and the strength of the obtained hardened material may decrease.

<Component (E)> The platinum metal catalyst of component (E) is used to carry out and promote the hydrosilylation reaction of the aforementioned components (A) to (C).

The platinum group metal catalyst is not particularly limited, and examples thereof include platinum group metals such as platinum, palladium, and rhodium; platinum compounds such as platinum chloride, alcohol-modified platinum chloride, and coordination compounds of platinum chloride with olefins, vinyl siloxanes, or acetylene compounds; platinum group metal compounds such as tetrakis(triphenylphosphine)palladium and tri(triphenylphosphine)rhodium chloride, etc. However, since they have good compatibility with components (A) to (C) and contain almost no chlorine impurities, platinum chloride modified with polysiloxane is preferred. Component (E) may be used alone or in combination of two or more.

The amount of component (E) is 1-500 ppm, preferably 3-100 ppm, and more preferably 5-40 ppm, relative to the total mass of components (A) to (D), calculated as the mass of the platinum group metal element. If the amount of component (E) is less than the lower limit, the obtained polysilicone composition for die bonding is not sufficiently cured. On the other hand, even if the amount of component (E) is more than the upper limit of the above range, the curing speed of the obtained polysilicone composition for die bonding cannot be increased.

<Component (F)> The polysilicone composition for die bonding of the present invention may also contain fumed silicon oxide as the component (F). The component (F) is used to stably coat the polysilicone composition for die bonding of the present invention and to impart appropriate thixotropy. From the viewpoint of thixotropy and workability, the BET specific surface area of the component (F) is preferably in the range of 100 to 400 ^m2 /g.

From the viewpoint of thixotropy and workability, the amount of component (F) is preferably 3 to 10 parts by weight relative to 100 parts by weight of components (A) to (E). Specific examples of component (F) include REOLOSIL DM-30 (manufactured by TOKUYAMA Co., Ltd., BET specific surface area 300 m ² /g).

<Other components> In addition to the above-mentioned components (A) to (F), the composition of the present invention may also contain other components listed below. (Reaction inhibitor) In the polysilicone composition for die bonding of the present invention, a known reaction inhibitor (reaction control agent) having a hardening inhibitory effect on the addition reaction catalyst of component (D) may be used as needed. Examples of the reaction inhibitor include phosphorus-containing compounds such as triphenylphosphine; nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole; sulfur-containing compounds; acetylene compounds; hydrogen peroxide compounds; maleic acid derivatives, etc.

The degree of hardening inhibition effect of the reaction inhibitor varies greatly depending on the chemical structure of the reaction inhibitor, so the amount of the reaction inhibitor is preferably adjusted to the optimal amount for each reaction inhibitor used. Generally, it is preferably 0.001 to 5 parts by weight relative to 100 parts by weight of the total of components (A), (B), (C) and (D).

(Filler) In addition to the fuming silica of component (F), the polysilicone composition for die bonding of the present invention may also be filled with inorganic fillers such as crystalline silica, hollow fillers, silsesquioxane, etc.; and fillers whose surfaces are hydrophobized by organic silicon compounds such as organic alkoxysilane compounds, organic chlorosilane compounds, organic silazane compounds, low molecular weight siloxane compounds, etc.; polysilicone rubber powder; polysilicone resin powder, etc. As this component, based on the workability, it is particularly preferred to use a filler that can impart thixotropic properties. These other components may be used alone or in combination of two or more.

In addition, it is preferred that 80 mol% or more of all R ¹ in the die bonding polysilicone composition of the present invention is a methyl group. In addition, in order to improve the workability of the die bonding (transfer method), the viscosity of the die bonding polysilicone composition of the present invention is preferably 5-100 Pa·s at 25°C, and more preferably 20-50 Pa·s.

[Hardened product] Furthermore, the present invention provides a cured product of a polysilicone composition for die bonding (cured polysilicone). The curing of the polysilicone composition for die bonding of the present invention can be carried out under known conditions. For example, the curing can be carried out at 100-180°C for 10 minutes to 5 hours.

The cured polysilicone composition for die bonding of the present invention has high adhesion to substrates, LED chips, etc., and is particularly useful as a die bonding material for die bonding of LED components, etc. As described above, the cured polysilicone composition of the present invention can be an adhesive with high adhesion to substrates, LED chips, etc.

[Optical semiconductor device] Furthermore, the present invention provides an optical semiconductor device in which an optical semiconductor element is bonded with the aforementioned hardened material. As an example of a method for bonding an optical semiconductor element using the polysilicone composition for die bonding of the present invention, the polysilicone composition for die bonding of the present invention is filled in a syringe, applied to a substrate such as a package using a glue dispenser in a manner such that the composition is dried to a thickness of 1 to 100 μm, and then an optical semiconductor element (e.g., a light-emitting diode) is arranged on the applied composition, and the composition is hardened to bond the optical semiconductor element to the substrate. Alternatively, the composition may be placed on a rubber roller, applied to a substrate in a dry state to a thickness of 1 to 100 μm by squeezing and punching, and then an optical semiconductor element is arranged on the applied composition to cure the composition, thereby bonding the optical semiconductor element to the substrate. The curing conditions of the composition are as described above. In this way, a highly reliable optical semiconductor device can be formed in which the optical semiconductor element is bonded to the substrate using the polysilicone cured material of the present invention. [Example]

The present invention is specifically described below using Examples and Comparative Examples, but the present invention is not limited thereto. In addition, the molecular weight is the weight average molecular weight converted to standard polystyrene by gel permeation chromatography (GPC). The viscosity at 25°C is a value measured using a rotational viscometer. The volatile matter is the mass loss (mass %) when heated at 150°C for 30 minutes under 1 atmosphere. In addition, the abbreviations of each siloxane unit have the following meanings. M: (CH ₃ ) ₃ SiO _1/2 M ^Vi : (CH ₂ =CH)(CH ₃ ) ₂ SiO _1/2 M ^Vi3 : (CH ₂ =CH) ₃ SiO _1/2 D: (CH ₃ ) ₂ SiO _2/2 D ^H : H(CH ₃ )SiO _2/2 T: (CH ₃ )SiO _3/2

^T1 :

^T2 :

^T3 :

^T4 :

^T5 : Q: SiO _4/2

[Synthesis Example 1] Into a 3,000 mL 4-necked flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer, 352.5 g of an organopolysiloxane represented by [(CH ₃ O) ₃ SiO _1/2 ] ₂ [(CH ₃ O) ₂ SiO] ₂ , 45.6 g of hexavinyldisiloxane, 182.3 g of hexamethyldisiloxane, and 58 g of isopropyl alcohol were added, and 6.7 g of methanesulfonic acid was dropped while stirring. Subsequently, 90 g of water was dropped, and the mixture was mixed at 65°C for 2 hours to react. 700 g of xylene and 10.9 g of a 50% potassium hydroxide aqueous solution were added thereto, and the mixture was reacted at 120°C for 5 hours while the temperature was raised to distill off low-boiling components. 3.5 g of methanesulfonic acid was added as an additive, and neutralization treatment was performed at 120°C for 2 hours. After cooling, filtration was performed to obtain a three-dimensional network organopolysiloxane having a composition ratio of M ^Vi3 _0.07 M _0.4 Q _0.53 (B-1: molecular weight 3,350, solid at 23°C, vinyl content relative to solid content 0.287 mol/100g).

[Synthesis Example 2] 234 g of 3-glycidyloxypropyltrimethoxysilane, 136 g of methyltrimethoxysilane, and 37.8 g of methanol were added to a 1,000 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer. A mixed solution of 29 g of 0.04 N hydrochloric acid and 70.3 g of methanol was added dropwise while stirring. After reacting at 25°C for 3 hours while stirring, a 10% sodium acetate/methanol solution was added dropwise to neutralize the mixture, and stirring was continued at 65°C for 2 hours. After cooling and filtering, 500 g of methanol/water (mass ratio 50:50) mixture was added, mixed for 20 minutes, left to stand for 30 minutes, and the washing operation of separating and removing the methanol solvent layer was repeated 3 times to remove low molecular weight, and then reduced pressure concentration was performed at 100°C for 1 hour to remove residual methanol. After cooling to 25°C, filtration was performed to obtain epoxy-containing siloxane (D-1: molecular weight 2,780, viscosity 313mPa･s) with a composition unit ratio of T ¹ _0.49 T _0.51 . The volatile matter was 1.7% by mass.

[Synthesis Example 3] 304 g of 8-glycidyloxyoctyltrimethoxysilane, 136 g of methyltrimethoxysilane, and 37.8 g of methanol were added to a 1,000 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer. A mixed solution of 29 g of 0.04 N hydrochloric acid and 70.3 g of methanol was added dropwise while stirring. After reacting at 25°C for 3 hours while stirring, a 10% sodium acetate/methanol solution was added dropwise to neutralize the mixture, and stirring was continued at 65°C for 2 hours. After cooling to 25°C, filtering, adding 500g of methanol/water (mass ratio 50:50), mixing for 20 minutes, standing for 30 minutes, separating and removing the methanol solvent layer, washing operation was repeated 3 times to remove low molecular weight, and then reduced pressure concentration was performed at 100°C for 1 hour to remove residual methanol. After cooling to 25°C, filtering was performed to obtain epoxy-containing siloxane (D-2: molecular weight 2,570, viscosity 138mPa･s) with a unit ratio of T ² _0.47 T _0.53 . The volatile matter was 1.5 mass%.

[Synthesis Example 4] 246 g of 2-(3,4-epoxycyclohexyl)trimethoxysilane, 136 g of methyltrimethoxysilane, and 37.8 g of methanol were added to a 1,000 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer. A mixed solution of 29 g of 0.04 N hydrochloric acid and 70.3 g of methanol was added dropwise while stirring. After reacting at 25°C for 3 hours while stirring, a 10% sodium acetate/methanol solution was added dropwise to neutralize the mixture, and stirring was performed at 65°C for 2 hours. After cooling to 25°C, filtering, adding 500g of methanol/water (mass ratio 50:50) mixed solution, mixing for 20 minutes, standing for 30 minutes, separating and removing the methanol solvent layer, washing operation was repeated 3 times to remove low molecular weight, and then reduced pressure concentration was performed at 100°C for 1 hour to remove residual methanol. After cooling to 25°C, filtering was performed to obtain epoxy-containing siloxane (D-3: molecular weight 1890, viscosity 137mPa･s) with a unit ratio of T ³ _0.57 T _0.43 . The volatile matter (150°C 30 minutes) was 4.7 mass%.

[Comparative Synthesis Example 1] 248 g of 3-methacryloyloxypropyltrimethoxysilane, 136 g of methyltrimethoxysilane, and 37.8 g of methanol were added to a 1,000 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer. A mixed solution of 29 g of 0.04 N hydrochloric acid and 70.3 g of methanol was added dropwise while stirring. After reacting at 25°C for 3 hours while stirring, a 10% sodium acetate/methanol solution was added dropwise to neutralize the mixture, and stirring was continued at 65°C for 2 hours. After cooling to 25°C, filtering, adding 500g of methanol/water (mass ratio 50:50), mixing for 20 minutes, standing for 30 minutes, separating and removing the methanol solvent layer, washing operation was repeated 3 times to remove low molecular weight, and then reduced pressure concentration was performed at 100°C for 1 hour to remove residual methanol. After cooling to 25°C, filtering was performed to obtain an organopolysiloxane (D-4: molecular weight 2,900, viscosity 261mPa･s) with a composition unit ratio of T ⁴ _0.52 T _0.48 . The volatile matter was 2.7% by mass.

[Comparative Synthesis Example 2] 248 g of 3-acryloyloxypropyltrimethoxysilane, 136 g of methyltrimethoxysilane, and 37.8 g of methanol were added to a 1,000 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer. A mixed solution of 29 g of 0.04 N hydrochloric acid and 70.3 g of methanol was added dropwise while stirring. After reacting at 25°C for 3 hours while stirring, a 10% sodium acetate/methanol solution was added dropwise to neutralize the mixture, and stirring was continued at 65°C for 2 hours. After cooling to 25°C, filtering, adding 500g of methanol/water (mass ratio 50:50), mixing for 20 minutes, standing for 30 minutes, separating and removing the methanol solvent layer, washing operation was repeated 3 times to remove low molecular weight, and then reduced pressure concentration was performed at 100°C for 1 hour to remove residual methanol. After cooling to 25°C, filtering was performed to obtain an organopolysiloxane (D-5: molecular weight 3,350, viscosity 387mPa･s) with a composition unit ratio of T ⁵ _0.49 T _0.51 . The volatile matter was 0.9 mass%.

[Synthesis Example 5] The reaction product of platinum hexachloride and 1,3-divinyltetramethyldisiloxane was diluted with linear dimethylpolysiloxane (viscosity 60 mPa･s) represented by M ^Vi ₂ D ₄₀ so that the platinum content became 0.004 mass % to prepare a platinum catalyst.

[Examples 1 to 4, Comparative Examples 1 to 7] The following components were mixed in the proportions shown in Table 1 to prepare a polysilicone resin composition for die bonding. In addition, the numerical values of the components in Table 1 represent mass fractions. The [Si-H]/[Si-Vi] value represents the ratio (molar ratio) of the hydrogen atoms (Si-H) bonded to the silicon atoms in the (C) component to the total number of all olefin groups bonded to the silicon atoms in the (A) component and the (B) component.

(A) Ingredients: (A-1) Organic polysiloxane represented by a structural unit ratio of M ^Vi _0.47 T _0.53 (viscosity 17mPa･s at 25℃) (A-2) Straight chain dimethyl polysiloxane represented by an average structure of M ^Vi ₂ D ₁₅ (viscosity 8.8mPa･s at 25℃) (A-3) Dimethyl polysiloxane represented by an average structure of M ^Vi ₂ D ₂₀₄ (viscosity 600mPa･s at 25℃)

(B) Components: (B-1) The three-dimensional network organopolysiloxane obtained in Synthesis Example 1 (B-2) A three-dimensional network organopolysiloxane having an average structure of M ^Vi _1.2 M _7.4 Q ₁₀ and a vinyl content of 0.085 mol/100 g in a solid state at 23°C.

(C) Component: Organohydropolysiloxane with an average structure of M ₂ D _14.5 ^DH ₃₈ (volatile content: 0.2 mass%)

(D) Ingredients: (D-1) Organic polysiloxane obtained in Synthesis Example 2 (volatile content: 1.7 mass%) (D-2) Organic polysiloxane obtained in Synthesis Example 3 (volatile content: 1.5 mass%) (D-3) Organic polysiloxane obtained in Synthesis Example 4 (volatile content: 4.7 mass%) (D-4) Organic polysiloxane obtained in Comparative Synthesis Example 1 (volatile content: 2.7 mass%) (D-5) Organic polysiloxane obtained in Comparative Synthesis Example 2 (volatile content: 0.9 mass%) (D-6) 3-Glyceryloxypropyl trimethoxysilane (volatile content: 97 mass%)

The volatile matter of component (D) was determined by applying 1.5 g of each component (D) on a Φ60 mm aluminum plate, heating it in an open oven at 150°C for 30 minutes, and calculating the mass ratio of the reduction after heating.

(E) Component: Platinum catalyst obtained in Synthesis Example 5 (F) Component: Fumed silica [REOLOSIL DM30 (manufactured by TOKUYAMA, BET specific surface area 300 m ² /g)] (G) Reaction inhibitor: 1-ethynylcyclohexanol

The following evaluation was performed on the polysilicone composition for die bonding obtained in Examples 1 to 4 and Comparative Examples 1 to 7, and the results are shown in Table 1. [Hardness] The above composition was poured into a mold in a manner of 2 mm thick and hardened at 150°C for 4 hours. The D-type hardness of the hardened material was measured in accordance with JIS K 6253-3:2012.

[Digit shear strength] The above composition was quantitatively transferred to the silver-plated electrode part of the SMD5730 package (manufactured by I-CHIUN PRECSION INDUSTRY CO., resin part: polyphenylene diamine) using a die bonder (AD-830, manufactured by ASM) by stamping. The case where the resin could not be transferred due to wire drawing during stamping was marked as ×, and the case where the transfer was possible without any problem was marked as ○. Furthermore, an optical semiconductor element (EV-B35A, 35mil, manufactured by SemiLEDs) was mounted on it. The package was heated in an oven at 150°C for 4 hours to harden the composition, and then the die shear strength was measured using an adhesion tester (Dage, 4000 series).

[Gold pad contamination] A PKG with an optical semiconductor component (EV-B35A, 35mil, manufactured by SemiLEDs) was placed on a Φ105mm aluminum plate, and 2g of resin was applied around the PKG. After curing at 150℃ for 4 hours, the gold pad of the semiconductor component was observed under a microscope. The gold pad with silicone components attached was marked as ×, and the gold pad without silicone components attached was marked as ○.

As shown in Table 1, Examples 1 to 4 had no defects during punching, and the hardness and grain shear strength of the hardened material were excellent, and there was no gold pad contamination, which showed that they were excellent as bonding materials. In addition, the results of the gold pad contamination test of Example 1 are shown in Figure 1.

On the other hand, Comparative Example 1 does not contain component (D), and the grain strength becomes insufficient. Comparative Example 2 does not contain an epoxy group in component (D), so the grain shear strength is poor. Comparative Example 4 is a die bonding material that cannot be pressed and has poor workability because the viscosity of component (A) is high. Comparative Example 5 is a die bonding material with less component (D) and lower grain shear strength. Comparative Example 6 is a die bonding material with too much component (D), so the hardening of the hardened material is sufficient, but the composition is separated, and the reliability is poor because the hardening is not preserved as a die bonding material. In Comparative Example 7, although the grain shear strength is slightly improved by the silane coupling agent containing an epoxy group, gold pad contamination occurs as shown in Figure 2, resulting in poor reliability.

As described above, the polysilicone composition for die bonding of the present invention can provide a polysilicone cured product with excellent hardness and grain shear strength, and can effectively suppress the contamination of the gold pad during curing, and is particularly useful as a die bonding material used in die bonding of optical semiconductor components, etc. In particular, due to this advantage, it is difficult to cause the chip to peel off or the defect of being unable to bond in the wire bonding step after the die bonding step, so the reliability of the optical semiconductor device in which the optical semiconductor component is bonded with the polysilicone cured product is improved, and the productivity of the device is also improved. Therefore, the polysilicone composition for die bonding of the present invention and its cured product have high utilization value in the technical field of optical semiconductor devices.

Furthermore, the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments are illustrative only, and any embodiments having substantially the same structure and exerting the same effects as the technical concept described in the patent application scope of the present invention are included in the technical scope of the present invention.

[Figure 1] is a photograph of the appearance of Example 1 after the gold pad contamination test. [Figure 2] is a photograph of the appearance of Comparative Example 7 after the gold pad contamination test.

Claims (10)

A polysiloxane composition for die bonding, characterized by comprising the following components (A) to (E): (A) an organic polysiloxane having two or more alkenyl groups in one molecule and a viscosity of 100 mPa･s or less at 25°C; (B) a three-dimensional network organic polysiloxane represented by the following formula (1) and in a waxy or solid state at 23°C, in an amount of 70 to 95 parts by weight relative to 100 parts by weight of the total of components (A) and (B); (In the formula, ^R1 is the same or different, substituted or unsubstituted monovalent hydrocarbon group without alkenyl group, ^R2 is the same or different alkenyl group, a, b, c, d, e, f, g and h are numbers satisfying a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h≧0, but are numbers satisfying b+c＞0, f+g+h＞0 and a+b+c+d+e+f+g+h=1) (C) an organohydropolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms bonded to silicon atoms in one molecule: the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to silicon atoms in components (A) and (B), (wherein, ^R1 is the same as above, i and j are numbers satisfying 0.7≦i≦2.1, 0.001≦j≦1.0 and 0.8≦i+j≦3.0) (D) an epoxy group-containing polysiloxane represented by the following formula (3): 1 to 25 parts by weight relative to 100 parts by weight of the total of the components (A), (B) and (C), (wherein, ^R1 is the same as above, ^R3 is the same or different epoxy-containing group, ^R4 is the same or different substituted or unsubstituted monovalent hydrocarbon group not containing alkenyl group, k and m are numbers satisfying k＞0, m≧0 and k+m=1, and n is a number satisfying 0≦n≦2), (E) Platinum metal catalyst: 1-500ppm in terms of mass of platinum metal element relative to the total mass of component (A), component (B), component (C) and component (D). The polysilicone composition for die bonding as claimed in claim 1, wherein the component (A) is an organic polysiloxane represented by the following formula (4): (In the formula, ^R1 and ^R2 are the same as above, o, p, q, r are numbers satisfying q≧0, r≧0, o≧0, p≧0 respectively, but are numbers satisfying q+r＞0, r+o＞0, o+p＞0 and o+p+q+r=1). The polysilicone composition for die bonding as claimed in claim 1, wherein in the aforementioned formula (1), b>0 and h>0. The polysilicone composition for die bonding according to any one of claims 1 to 3, wherein the mass of the component (C) is reduced to 1 mass % or less when heated at 150° C. for 30 minutes under 1 atmosphere. The polysilicone composition for die bonding according to any one of claims 1 to 3, wherein the mass of the component (D) is reduced to 5 mass % or less when heated at 150° C. for 30 minutes under 1 atmosphere. The polysilicone composition for die bonding according to any one of claims 1 to 3, wherein in the component (D), R ³ is a group represented by the following formula (5): (Where s is an integer from 1 to 6, and the dashed line represents a key bond). A polysilicone composition for die bonding as claimed in any one of claims 1 to 3, wherein more than 80 mol% of all R ¹ in the composition are methyl groups. The polysilicone composition for die bonding as claimed in any one of claims 1 to 3 further comprises (F) fumed silicon oxide having a BET specific surface area of 100-400 m ² /g. A polysilicone cured product is characterized by being a cured product of the polysilicone composition for die bonding as claimed in any one of claims 1 to 8. An optical semiconductor device, characterized in that an optical semiconductor element is bonded using a polysilicon curing material as described in claim 9.