TWI876661B - A hardware temperature detection device - Google Patents
A hardware temperature detection device Download PDFInfo
- Publication number
- TWI876661B TWI876661B TW112142767A TW112142767A TWI876661B TW I876661 B TWI876661 B TW I876661B TW 112142767 A TW112142767 A TW 112142767A TW 112142767 A TW112142767 A TW 112142767A TW I876661 B TWI876661 B TW I876661B
- Authority
- TW
- Taiwan
- Prior art keywords
- hardware
- temperature sensor
- detection device
- temperature detection
- external hardware
- Prior art date
Links
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
本發明係關於一種硬體溫度檢測裝置,尤其是指一種使用接觸式溫度感測器來檢測外接硬體的溫度之硬體溫度檢測裝置。The present invention relates to a hardware temperature detection device, and more particularly to a hardware temperature detection device which uses a contact temperature sensor to detect the temperature of an external hardware.
一般來說,在現有的技術當中,隨著現今互聯網的不斷發展之下,伺服器(server)的需求量以及相關要求也日益增多,同時對於不同種類的伺服器之針對性的測試要求也越來越高,如果說單獨針對某一伺服器內的硬體配置要進行測試,就需要有能夠更加精確地獲得相關資料的方法。Generally speaking, among existing technologies, with the continuous development of the Internet today, the demand for servers and related requirements are increasing day by day. At the same time, the requirements for targeted testing of different types of servers are also getting higher and higher. If you want to test the hardware configuration of a server alone, you need a method that can obtain relevant data more accurately.
比如說,於存儲類的伺服器之情況下,要想要能夠檢測出伺服器內的硬碟(HDD)之溫度,最好的方式就是要能夠完全的以接觸方式來進行探測,但硬碟和偵測用的溫度感測器(temperature sensor)皆為硬性的產品,不管如何地擺放與設置終究會留有間隙產生,不能夠準確地來獲得硬碟的溫度資料。For example, in the case of storage servers, if you want to detect the temperature of the hard disk (HDD) in the server, the best way is to be able to detect it completely by contact. However, the hard disk and the temperature sensor used for detection are both rigid products. No matter how they are placed and set, there will always be a gap, and it is impossible to accurately obtain the temperature data of the hard disk.
承上所述,為了要能夠解決上述伺服器內的硬碟和溫度感測器間會留有間隙產生的問題,因此,設計出一種可以將硬碟和溫度感測器之間可以更好地進行接觸式檢測的設計就顯得更為重要。As mentioned above, in order to solve the problem caused by the gap between the hard disk and the temperature sensor in the server, it is more important to design a design that can better perform contact detection between the hard disk and the temperature sensor.
有鑒於在先前技術當中,由於硬碟和溫度感測器之間會留有間隙產生,本發明為解決先前技術之問題,所採用的必要技術手段是提供一種硬體溫度檢測裝置,係設置於一背板上,適用於檢測一外接硬體之溫度,且背板具有一連接器,硬體溫度檢測裝置包含:一下層元件,係設置於背板上;一接觸式溫度感測器,係設置於下層元件之一頂面;一傳輸線,係部分設置於下層元件之頂面,並用以連接接觸式溫度感測器與連接器;以及一上層元件,係設置於下層元件之頂面,且覆蓋住部分的傳輸線;其中,當外接硬體與背板相連接時,外接硬體之一底面與接觸式溫度感測器及上層元件相接觸,接觸式溫度感測器用以檢測外接硬體之溫度。In view of the fact that in the prior art, there is a gap between the hard disk and the temperature sensor, the present invention solves the problem of the prior art by adopting a necessary technical means to provide a hardware temperature detection device, which is arranged on a backplane and is suitable for detecting the temperature of an external hardware, and the backplane has a connector. The hardware temperature detection device includes: a lower layer component, which is arranged on the backplane; a contact temperature sensor, which is arranged on a top surface of a lower component; a transmission line, which is partially disposed on the top surface of the lower component and is used to connect the contact temperature sensor and the connector; and an upper component, which is disposed on the top surface of the lower component and covers a portion of the transmission line; wherein, when the external hardware is connected to the backplane, a bottom surface of the external hardware contacts the contact temperature sensor and the upper component, and the contact temperature sensor is used to detect the temperature of the external hardware.
在上述必要技術手段所衍生之一附屬技術手段,其中,上層元件之材質係選自於由橡膠、塑膠、以及泡棉所組成的群組之任一者。In an auxiliary technical means derived from the above necessary technical means, the material of the upper layer element is selected from any one of the group consisting of rubber, plastic, and foam.
在上述必要技術手段所衍生之一附屬技術手段,其中,上層元件之高度係大於接觸式溫度感測器之高度。In an auxiliary technical means derived from the above necessary technical means, the height of the upper component is greater than the height of the contact temperature sensor.
在上述必要技術手段所衍生之一附屬技術手段,其中,當外接硬體與背板相連接時,外接硬體壓縮上層元件,並且底面與接觸式溫度感測器相接觸。In an auxiliary technical means derived from the above necessary technical means, when the external hardware is connected to the backplane, the external hardware compresses the upper layer components and the bottom surface contacts the contact temperature sensor.
如上所述,由於本發明之硬體溫度檢測裝置是利用接觸式溫度感測器與相關元件之搭配設置,藉此,本發明確實可以有效的透過接觸式溫度感測器來檢測出外接硬體之溫度。As described above, since the hardware temperature detection device of the present invention utilizes a contact temperature sensor and related components, the present invention can effectively detect the temperature of external hardware through the contact temperature sensor.
本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following embodiments and drawings.
請綜合參閱第一圖、第三圖以及第四圖所示,第一圖係顯示本發明較佳實施例所提供之硬體溫度檢測裝置於外接硬體與背板相連接時之立體示意圖;第三圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置於背板上之俯視圖;以及第四圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置於外接硬體與背板相連接時之側視圖。Please refer to the first, third and fourth figures in combination. The first figure is a three-dimensional schematic diagram showing the hardware temperature detection device provided by the preferred embodiment of the present invention when the external hardware is connected to the backplane; the third figure is a top view showing the hardware temperature detection device provided by the preferred embodiment of the present invention on the backplane; and the fourth figure is a side view showing the hardware temperature detection device provided by the preferred embodiment of the present invention when the external hardware is connected to the backplane.
如圖中所示,本發明提供了一種硬體溫度檢測裝置1,係設置於伺服器內的一背板2上,適用於檢測一外接硬體3之溫度,此一外接硬體3可以例如是伺服器內所連接的一硬碟模組,背板2上還具有一連接器22、以及一外接硬體連接器21,而硬體溫度檢測裝置1包含:一下層元件11、一接觸式溫度感測器12、一傳輸線13、以及一上層元件14。As shown in the figure, the present invention provides a hardware
如第二A圖所示,係顯示本發明較佳實施例所提供的硬體溫度檢測裝置1之下層元件11的示意圖。下層元件11係設置於背板2上,其具有一頂面111,而圖中所示的下層元件11之幾何形狀外觀僅為一例示,本發明並不侷限於圖中所示的形狀。另外,下層元件11係透過膠合的方式設置於背板2上。As shown in the second figure A, it is a schematic diagram showing the
如第二B圖所示,係顯示本發明較佳實施例所提供的硬體溫度檢測裝置1之接觸式溫度感測器12與傳輸線13之示意圖。接觸式溫度感測器12係設置於下層元件11之頂面111上(請參考第一圖),此一接觸式溫度感測器12係需要透過接觸到物體得以檢測出該物體之溫度。其中,如第二B圖所示的接觸式溫度感測器12之外形係為一半圓柱形狀,然而,如圖中所示的接觸式溫度感測器12之半圓柱形狀僅為一示意形狀,其他可以達到此接觸目的之形狀都可以於本發明加以採用。As shown in the second B figure, it is a schematic diagram showing the
而傳輸線13係部分設置於下層元件11之頂面111上(請參考第一圖),並用以連接接觸式溫度感測器12與連接器22(請參考第三圖),而傳輸線13之外觀形狀可以為一圓形線或一扁排線等皆可以達到其目的。The
另外,接觸式溫度感測器12與傳輸線13係透過膠合的方式設置於下層元件11之頂面111。較佳地,可以將接觸式溫度感測器12與傳輸線13設計成為一體成形之形狀。In addition, the
如第二C圖所示,係顯示本發明較佳實施例所提供的硬體溫度檢測裝置1之上層元件14的示意圖。上層元件14係透過膠合的方式設置於下層元件11之頂面111,且覆蓋住部分的傳輸線13。而圖中所示的上層元件14之幾何形狀外觀僅為一例示,本發明並不侷限於圖中所示的形狀,但可以藉由搭配著下層元件11的幾何形狀外觀來做出設計。As shown in the second figure C, it is a schematic diagram showing the
其中,上層元件14之材質係可以選自於由橡膠、塑膠、以及泡棉所組成的群組中之任一者。而較佳的是可以提供彈性變形,或者是可以具有回彈功能之材質。另外,亦可以採用偏軟性之材質,並且透氣性與散熱性良好,氣孔多的通用材質等皆可以達到其目的。而較佳地,下層元件11與上層元件14係可以選用為相同之前述材質。The material of the
另外,上層元件14之高度係約略地大於接觸式溫度感測器12之高度(請參考第四圖,本圖中傳輸線13僅略示一部分)。其中,當上方的外接硬體3向下與背板2之外接硬體連接器21準備進行相連接時,首先,外接硬體3之一底面31與上層元件14相接觸,再來才會接觸到接觸式溫度感測器12(請參考第四圖從上方看來的第一條虛線之位置),而外接硬體3繼續向下壓時,將會與外接硬體連接器21進行相連接(請參考第四圖的第二條虛線之位置),亦即外接硬體3透過壓縮上層元件14後,其底面31與接觸式溫度感測器12相接觸,則接觸式溫度感測器12可用以檢測出外接硬體3之溫度,接觸式溫度感測器12與外接硬體3之間不會有間隙產生的問題,因此,得以較精準地檢測出外接硬體3,例如是伺服器內的硬碟之溫度。In addition, the height of the
本發明之硬體溫度檢測裝置1的安裝方式具體描述如下:在設計過程當中,首先,需要先確認外接硬體3的正下方要設置接觸式溫度感測器12的位置;其次,將下層元件11貼附於背板2之上;再將接觸式溫度感測器12平面式貼附於下層元件11之頂面111上的一個背膠位置,就可以牢牢地將接觸式溫度感測器12的位置進行固定,相同地,將傳輸線13與接觸式溫度感測器12連接後,也要貼附於下層元件11之頂面111上;然後,將上層元件14壓在傳輸線13上,使傳輸線13不會亂跑,上層元件14亦貼附於下層元件11之頂面111上,將傳輸線13與連接器22相連接;最後,再將外接硬體3插入背板2之外接硬體連接器21的對應位置,由於上層元件14如前所述係屬於偏軟性之材質所製成,故這時外接硬體3之底面31就會先壓迫上層元件14並得以與接觸式溫度感測器12是完全接觸的。The installation method of the hardware
另外,於第四圖之側視圖中可以看出當外接硬體3要與背板2之外接硬體連接器21相連接時,接觸式溫度感測器12與外接硬體3之底面31會是互相干涉的,因此,本發明之上層元件14可採用一軟性材質、或者是泡棉材質,例如是F-2G,因此,隨著外接硬體3的裝配到位,干涉的部分會隨著上層元件14受到上方的壓力發生形變而降低高度,且因為材質是軟性的,並不會存在有應力問題,以此可以達到接觸式溫度感測器12一直與外接硬體3接觸之情況,所得到的溫度資料就得以更加的精確。In addition, it can be seen from the side view of the fourth figure that when the
另外,上層元件14所採用的材質例如是F-2G很軟,且價格便宜,亦可以保證接觸式溫度感測器12在干涉情況的基礎上,雖然受到上方外接硬體3的壓力之下,亦可以保證上層元件14的高度下降時並不會產生有應力的問題。In addition, the material used for the
關於本發明之硬體溫度檢測裝置1的優點如下所述:1. 整體設置簡單,且費用低廉,並且空間使用小;2. 得以透過接觸式溫度感測器12精準地獲得外接硬體3的檢測溫度資料;3. 對於要進行其他類似的檢測時,本發明之設計具有其參考價值。The advantages of the hardware
綜上所述,由於本發明之硬體溫度檢測裝置1是利用接觸式溫度感測器12與相關元件之搭配設置,藉此,本發明確實可以有效的透過接觸式溫度感測器12來檢測出外接硬體3之溫度。In summary, since the hardware
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention.
1:硬體溫度檢測裝置 11:下層元件 111:頂面 12:接觸式溫度感測器 13:傳輸線 14:上層元件 2:背板 21:外接硬體連接器 22:連接器 3:外接硬體 31:底面 1: Hardware temperature detection device 11: Lower layer components 111: Top surface 12: Contact temperature sensor 13: Transmission line 14: Upper layer components 2: Backplane 21: External hardware connector 22: Connector 3: External hardware 31: Bottom surface
第一圖係顯示本發明較佳實施例所提供之硬體溫度檢測裝置於外接硬體與背板相連接時之立體示意圖; 第二A圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置之下層元件示意圖; 第二B圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置之接觸式溫度感測器與傳輸線示意圖; 第二C圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置之上層元件示意圖; 第三圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置於背板上之俯視圖;以及 第四圖係顯示本發明較佳實施例所提供的硬體溫度檢測裝置於外接硬體與背板相連接時之側視圖。 The first figure is a three-dimensional schematic diagram showing the hardware temperature detection device provided by the preferred embodiment of the present invention when the external hardware is connected to the backplane; The second figure A is a schematic diagram showing the lower layer components of the hardware temperature detection device provided by the preferred embodiment of the present invention; The second figure B is a schematic diagram showing the contact temperature sensor and transmission line of the hardware temperature detection device provided by the preferred embodiment of the present invention; The second figure C is a schematic diagram showing the upper layer components of the hardware temperature detection device provided by the preferred embodiment of the present invention; The third figure is a top view showing the hardware temperature detection device provided by the preferred embodiment of the present invention on the backplane; and The fourth figure is a side view showing the hardware temperature detection device provided by the preferred embodiment of the present invention when the external hardware is connected to the backplane.
1:硬體溫度檢測裝置 1: Hardware temperature detection device
11:下層元件 11: Lower layer components
12:接觸式溫度感測器 12: Contact temperature sensor
13:傳輸線 13: Transmission line
14:上層元件 14: Upper layer components
2:背板 2: Back panel
21:外接硬體連接器 21: External hardware connector
22:連接器 22: Connector
3:外接硬體 3: External hardware
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112142767A TWI876661B (en) | 2023-11-07 | 2023-11-07 | A hardware temperature detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112142767A TWI876661B (en) | 2023-11-07 | 2023-11-07 | A hardware temperature detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI876661B true TWI876661B (en) | 2025-03-11 |
| TW202520251A TW202520251A (en) | 2025-05-16 |
Family
ID=95830264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112142767A TWI876661B (en) | 2023-11-07 | 2023-11-07 | A hardware temperature detection device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI876661B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014186423A (en) * | 2013-03-22 | 2014-10-02 | Nec Computertechno Ltd | Monitoring system |
| US20160363972A1 (en) * | 2015-06-12 | 2016-12-15 | HGST Netherlands B.V. | Temperature control of storage arrays with rotating media seek adjustments |
| TW201804165A (en) * | 2016-07-27 | 2018-02-01 | 三星電子股份有限公司 | Test board for semiconductor package, and test system |
| TW201805760A (en) * | 2016-08-05 | 2018-02-16 | 營邦企業股份有限公司 | Chassis structure capable of sensing temperature of storage media |
| US20190049951A1 (en) * | 2016-12-07 | 2019-02-14 | At&T Intellectual Property I, L.P. | Method and apparatus for deploying equipment of a communication system |
| CN110521288A (en) * | 2017-03-28 | 2019-11-29 | 三星电子株式会社 | The printed circuit board of ground connection including connector and with different potentials and electronic equipment with the printed circuit board |
-
2023
- 2023-11-07 TW TW112142767A patent/TWI876661B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014186423A (en) * | 2013-03-22 | 2014-10-02 | Nec Computertechno Ltd | Monitoring system |
| US20160363972A1 (en) * | 2015-06-12 | 2016-12-15 | HGST Netherlands B.V. | Temperature control of storage arrays with rotating media seek adjustments |
| TW201804165A (en) * | 2016-07-27 | 2018-02-01 | 三星電子股份有限公司 | Test board for semiconductor package, and test system |
| TW201805760A (en) * | 2016-08-05 | 2018-02-16 | 營邦企業股份有限公司 | Chassis structure capable of sensing temperature of storage media |
| US20190049951A1 (en) * | 2016-12-07 | 2019-02-14 | At&T Intellectual Property I, L.P. | Method and apparatus for deploying equipment of a communication system |
| CN110521288A (en) * | 2017-03-28 | 2019-11-29 | 三星电子株式会社 | The printed circuit board of ground connection including connector and with different potentials and electronic equipment with the printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202520251A (en) | 2025-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8604372B2 (en) | Push button and electronic device having same | |
| CN103411712B (en) | Contact stress sensor | |
| US7210362B2 (en) | Diaphragm type load detection sensor, load detection unit and electronic scale using same | |
| JPH09179U (en) | Pressure sensor | |
| CN102591527A (en) | Touch sensing device | |
| CN106533415B (en) | Electrostatic capacitance detects formula pressure switch | |
| TWI876661B (en) | A hardware temperature detection device | |
| CN212541357U (en) | Assembly Structure of Ultrasonic Fingerprint Sensing Module | |
| CN113655254B (en) | A test fixture for components to be tested | |
| CN216310082U (en) | Test fixture for components to be tested | |
| JP3343541B2 (en) | Probe card | |
| CN106370325A (en) | Working seat body pressure distribution test sensor | |
| JPH1070346A (en) | Connection component for printed board | |
| CN104932131A (en) | Liquid crystal module and liquid crystal display device including same | |
| JP6793107B2 (en) | Flowmeter | |
| CN203385498U (en) | Contact stress sensor | |
| CN110705514A (en) | Electronic device | |
| JP2000162069A (en) | Semiconductor pressure sensor | |
| CN208721711U (en) | A FPC test socket | |
| CN208889303U (en) | For detecting the mechanism of display panel | |
| TWI604389B (en) | Fingerprint identifying module | |
| JP4663542B2 (en) | Inspection method of diaphragm assembly for condenser microphone | |
| JPS6071970A (en) | Method and device for inspection of printed circuit board | |
| CN209525081U (en) | A kind of automobile interior decoration IML cover board detection jig | |
| CN101482589A (en) | Connector detection system |