TWI875782B - Hot-melt curable organic silicon composition, sealant, film and optical semiconductor device - Google Patents

Abstract

The present invention provides a hot-melt curable organic silicon composition which can exhibit excellent mechanical properties, particularly strength and elongation, even when formed into a film or sheet. The above problems are solved by a solvent-free hot-melt curable organosilicon composition, which comprises: (A) an alkenyl-containing organopolysiloxane having at least two alkenyl groups in one molecule; (B) a branched organohydropolysiloxane having 0.1 to 5 mass % relative to the total mass of the composition and having at least two silicon-atom-bonded hydrogen atoms in one molecule; (C) an additive represented by an average unit formula (C-1); (D) a catalyst for a hydrosilylation reaction; and (E) silicon dioxide.

Description

Hot-melt curable organic silicon composition, sealant, film and optical semiconductor device

The present invention relates to a curable organic silicon composition, and more specifically, to a curable organic silicon composition for sealing, coating or bonding an optical semiconductor element. In addition, the present invention also relates to a sealant composed of such a curable organic silicon composition and an optical semiconductor element containing the sealant. In addition, the present invention also relates to a film obtained by curing the curable organic silicon composition.

Curable organic silicon compositions are cured to form cured products with excellent heat resistance, cold resistance, electrical insulation, weather resistance, water repellency, and transparency, and are therefore widely used in the industry. In particular, compared to other organic materials, these cured products are less likely to change color and have less deterioration in physical properties, making them suitable for use in optical materials.

For example, Patent Documents 1 to 3 describe a resin composition for sealing optical semiconductor elements or for optical lenses using a curable organic silicone resin composition, wherein the curable organic silicone resin composition comprises an organic polysiloxane having two or more non-covalent double bond groups in one molecule, an organic hydropolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, and a catalytic amount of a platinum catalyst. In addition, Patent Documents 4 and 5 describe a hot-melt organic silicone resin composition that is non-flowable at 25°C, has low surface adhesion, and is easily melted by heating. [Prior Art Document] [Patent Document]

[Patent Document 1]: Japanese Patent Publication No. 2006-299099 [Patent Document 2]: Japanese Patent Publication No. 2007-246894 [Patent Document 3]: Japanese Patent Publication No. 2006-324596 [Patent Document 4]: Japanese Patent Publication No. 2013-001794 [Patent Document 5]: International Publication No. 2015/194158

[Problem to be solved by the invention] However, when a hot-melt film is made using a conventional organic silicone resin composition, there is a problem that the mechanical properties of the film, especially the strength and elongation of the film are insufficient. Therefore, for example, when forming a film or sheet sealant or lamination film in the manufacture of semiconductor packages, there is a problem that the obtained film is easily broken and its handling performance is insufficient.

The object of the present invention is to provide a hot-melt curable organic silicon composition that can show excellent mechanical properties, especially strength and elongation, even when formed into a film or sheet. More specifically, to provide a hot-melt curable organic silicon composition that has excellent processing performance and can form a sheet or film sealant and a laminating film that can efficiently manufacture semiconductor packages. [Means for Solving the Problem]

In order to solve the above problems, the inventors of the present invention have conducted in-depth research and found that the above problems can be solved by a solvent-free hot-melt curable organic silicon composition, and realized the present invention. The solvent-free hot-melt curable organic silicon composition includes: (A) an organic polysiloxane having at least two alkenyl groups in one molecule; (B) a resinous organic hydropolysiloxane having 0.1 to 5 mass % relative to the total mass of the composition and having at least two silicon atom-bonded hydrogen atoms in one molecule; (C) an additive represented by the following average unit formula (C-1): (R ¹ ₃ SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b (R ¹ SiO _3/2 ) _c wherein R ^R1 is the same or different organic group containing alkyl, aryl, alkenyl, aralkyl, or epoxide, wherein at least one ^R1 is an alkenyl group, and at least one ^R1 is an organic group containing an epoxide, and a, b, and c are numbers that respectively satisfy the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, and a + b + c = 1; (D) a catalyst for hydrosilylation reaction; and (E) silicon dioxide.

In one embodiment of the present invention, the component (A) comprises a resinous organopolysiloxane containing at least one (Ar ₂ SiO _2/2 ) unit.

In one embodiment of the present invention, the component (B) is represented by the following (B-1) average unit formula: (R ³ ₃ SiO _1/2 ) _a (R ³ ₂ SiO _2/2 ) _b (R ³ SiO _3/2 ) _c (SiO _4/2 ) _d (XO _1/2 ) _e wherein R ³ is a hydrogen atom or a monovalent hydrocarbon group which may be substituted or unsubstituted with the same or different halogens, wherein at least two R ^3s are hydrogen atoms, X is a hydrogen atom or an alkyl group, and a, b, c, d and e are numbers satisfying the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, 0 ≤ d ＜ 0.5, 0 ≤ e ＜ 0.4, a + b + c + d = 1.0, and c + d = 2. ＞ 0.

In the above average unit formula (B-1), a can be in the range of 0.1 ≤ a ≤ 0.9, b can be in the range of 0 ≤ b ≤ 0.8, c can be in the range of 0.1 ≤ c ≤ 0.9, d can be in the range of 0 ≤ d ≤ 0.4, and e can be in the range of 0 ≤ e ≤ 0.3.

In the above average unit formula (C-1), a can be in the range of 0 ≤ a ≤ 0.9, b can be in the range of 0.1 ≤ b ≤ 0.9, and c can be in the range of 0.01 ≤ c ≤ 0.8.

The content of the alkenyl group contained in the component (C) may be 5 mol% or more of the total number of ^R1s .

The content of the epoxy-containing organic group in the component (C) may be 5 mol% or more of the total number of ^R1s .

In one embodiment of the present invention, the component (A) comprises linear, branched, and cyclic organopolysiloxane.

The present invention also relates to a film obtained by curing the hot-melt curable organosilicon composition of the present invention.

The present invention also relates to a sealant composed of the hot-melt curable organic silicon composition of the present invention.

The present invention also relates to an optical semiconductor device comprising the encapsulant of the present invention.

The semiconductor element of the present invention is preferably a light-emitting diode. [Effect of the invention]

The hot-melt curable organosilicon composition of the present invention can show excellent mechanical properties, especially strength and elongation, even when formed into a film or sheet. Therefore, the hot-melt curable organosilicon composition of the present invention has excellent processing performance and can be formed into a sheet or film sealant and a laminating film that can efficiently manufacture semiconductor packages.

Furthermore, the sealant of the present invention is formed of the hot-melt curable organic silicon composition of the present invention, and therefore can exhibit excellent mechanical properties, particularly strength and elongation, resulting in excellent handling performance. Therefore, semiconductor packages can be manufactured efficiently.

The present invention is described in detail below. [Hot-melt curable organic silicon composition]

The present invention relates to a solvent-free hot-melt curable organic silicon composition, which comprises: (A) an organic polysiloxane having at least two alkenyl groups in one molecule; (B) a resinous organic hydropolysiloxane having 0.1 to 5 mass % relative to the total mass of the composition and having at least two silicon atoms bonded to hydrogen atoms in one molecule; and (C) an additive represented by the following average unit formula (C-1): (R ¹ ₃ SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b (R ¹ SiO _3/2 ) _c wherein R ¹ is the same or different organic group containing an alkyl group, an aryl group, an alkenyl group, an aralkyl group, or an epoxide group, wherein at least one R 1 is an alkenyl group, and at least one R ¹ is a ¹ is an organic group containing an epoxy group, a, b and c are numbers satisfying the following conditions respectively: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, and a + b + c = 1; (D) a catalyst for hydrosilylation reaction; and (E) silicon dioxide.

The organosilicon composition of the present invention does not contain a solvent, and exhibits hot melt properties when formed into a film, sheet, or the like by heat treatment. In this specification, "hot melt properties" refers to a property that is non-fluid at 25°C, but easily melts and exhibits fluidity by heating. For example, the melt elastic modulus of the hot melt organosilicon composition of the present invention at 100°C is in the range of 10 Pa to 1 MPa. Here, non-fluidity means that it does not flow under no load, and indicates, for example, a state when the softening point is lower than that measured by the softening point test method of the hot melt adhesive by the global method specified in JIS K 6863-1994 "Test method for softening point of hot melt adhesives". That is, the hot-melt organic silicon composition of the present invention preferably has a softening point higher than 25°C. In addition, the melt elastic modulus at 100°C can be measured by a flat plate viscoelasticity tester capable of controlling temperature. In addition, the organic silicon composition of the present invention is a hot-melt curable organic silicon composition having both hot-melt properties and curability.

The hot-melt curable organosilicon composition of the present invention can show excellent mechanical properties, especially strength and elongation, even when formed into a film or sheet. Therefore, the hot-melt curable organosilicon composition of the present invention has excellent processing performance and can be formed into a sealant and a laminating film that can efficiently manufacture semiconductor packages and is used for manufacturing semiconductor packages.

Each component is described below in detail.

(A) Alkenyl-containing organopolysiloxane Component (A) is an alkenyl-containing organopolysiloxane having at least two silicon-atom-bonded alkenyl groups in one molecule, which is the main agent of the curable organosilicon composition of the present invention.

Examples of the alkenyl group contained in the component (A) include alkenyl groups having 2 to 12 carbon atoms such as vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl and dodecenyl, and vinyl is preferred.

As the molecular structure of component (A), there can be cited linear, partially branched linear, branched, cyclic, and three-dimensional network structures. Component (A) may also be a single organopolysiloxane having such molecular structures, or a mixture of two or more organopolysiloxanes having such molecular structures. The curable organosilicone composition of the present invention preferably contains both a linear organopolysiloxane and a resinous organopolysiloxane as component (A).

In one embodiment of the present invention, component (A) may be: a linear organic polysiloxane represented by the following average unit formula (A-1): R ² ₃ SiO(R ² ₂ SiO) _m SiR ² ₃ wherein R ² is the same or different halogen-substituted or unsubstituted monovalent hydrocarbon group, wherein at least two R ² in one molecule are alkenyl groups, and m is an integer from 4 to 1,000; and/or a branched organic polysiloxane represented by the following average unit formula (A-2): (R ² ₃ SiO _1/2 ) _a (R ² ₂ SiO _2/2 ) _b (R ² SiO _3/2 ) _c (SiO _4/2 ) _d (XO _1/2 ) _e wherein R ² is the same as above, wherein at least two R 2 in one molecule are alkenyl groups. ² is an alkenyl group, X is a hydrogen atom or an alkyl group, a, b, c, d and e are numbers satisfying the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, 0 ≤ d ＜ 0.5, 0 ≤ e ＜ 0.4, a + b + c + d + e = 1.0, and c + d ＞ 0; and/or a cyclic organic polysiloxane represented by the following (A-3) average unit formula: (R ² SiO _2/2 ) _n wherein R ² is the same as above, wherein at least two R ² in one molecule are alkenyl groups, and n is an integer from 3 to 50.

Preferably, the heat-melt curable organosilicon composition of the present invention contains both linear and branched organopolysiloxane as component (A). More preferably, the heat-melt curable organosilicon composition of the present invention contains linear, branched, and cyclic organopolysiloxane as component (A). In addition, the branched organic polysiloxane is a resinous organic polysiloxane, which refers to an organic polysiloxane containing at least one T unit or Q unit among the siloxane unit (M unit) represented by the general formula: R ₃ SiO _1/2 , the siloxane unit (D unit) represented by the general formula: R ₂ SiO _2/2 , the siloxane unit (T unit) represented by the general formula: RSiO _3/2 , and the siloxane unit (Q unit) represented by the formula: SiO _4/2 .

Examples of the halogen-substituted or unsubstituted monovalent alkyl group of ^R2 in the above formula include alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertiary butyl, pentyl, neopentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl; aryl groups having 6 to 20 carbon atoms such as phenyl, tolyl, xylyl and naphthyl; aralkyl groups having 7 to 20 carbon atoms such as benzyl, phenethyl and phenylpropyl; alkenyl groups having 2 to 12 carbon atoms such as vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl and dodecenyl; and groups in which the hydrogen atoms of these groups are partially or completely substituted with halogen atoms such as fluorine, chlorine and bromine atoms. ^R2 may be an alkoxy group having a small amount of hydroxyl group, methoxy group, ethoxy group or the like within the range not impairing the purpose of the present invention.

^R2 is preferably selected from a phenyl group, an alkyl or cycloalkyl group having 1 to 6 carbon atoms, or an alkenyl group having 2 to 6 carbon atoms.

The content of alkenyl groups in component (A) is not particularly limited, but preferably 0.01 to 50 mol%, 0.05 to 40 mol%, or 0.09 to 32 mol% of the total amount of ^R2 is alkenyl groups. The content of alkenyl groups can be determined by analysis such as Fourier transform infrared spectrophotometry (FT-IR) or nuclear magnetic resonance (NMR).

The component (A) preferably comprises a resinous organopolysiloxane containing at least one (Ar ₂ SiO _2/2 ) unit.

The ratio of T units in the molecular structure of the resinous organopolysiloxane containing at least one (Ar ₂ SiO _2/2 ) unit as the component (A) of the present invention is preferably 0.1 or more, more preferably 0.2 or more, and further preferably 0.3 or more. In a preferred embodiment, the ratio of T units in the molecular structure of the resinous organopolysiloxane of the present invention is 0.9 or less, preferably 0.85 or less, and further preferably 0.8 or less. In another preferred embodiment, the ratio of Q units in the molecular structure of the resinous organopolysiloxane of the present invention is 0.2 or less, preferably 0.1 or less, and further preferably contains no Q units. The ratio of the T unit to the Q unit can be calculated from the amounts of the siloxane unit represented by the general formula R ₃ SiO _1/2 (M unit), the siloxane unit represented by the general formula R ₂ SiO _2/2 (D unit), the siloxane unit represented by the general formula RSiO _3/2 (T unit), and the siloxane unit represented by the formula SiO _4/2 (Q unit) of the resinous organopolysiloxane.

In the (Ar ₂ SiO _2/2 ) unit, Ar refers to an aryl group. The aryl group may be unsubstituted or substituted, and preferably an aryl group having 6 to 20 carbon atoms, for example, phenyl, tolyl, xylyl, naphthyl, anthracenyl, phenanthrenyl, pyrenyl, and groups in which the hydrogen atoms of the aryl groups are substituted by alkyl groups such as methyl and ethyl, alkoxy groups such as methoxy and ethoxy, and halogen atoms such as chlorine and bromine atoms. Particularly preferably, the aryl group is a phenyl group.

The ratio of the (Ar ₂ SiO _2/2 ) unit in the molecular structure of the resinous organopolysiloxane as the component (A) of the present invention is preferably 0.05 or more, more preferably 0.1 or more, further preferably 0.15 or more, and most preferably 0.2 or more. In a preferred embodiment, the ratio of the (Ar ₂ SiO _2/2 ) unit in the molecular structure of the resinous organopolysiloxane of the present invention is 0.5 or less, preferably 0.45 or less, and more preferably 0.4 or less.

In the resinous organopolysiloxane as component (A) containing at least one (Ar ₂ SiO _2/2 ) unit, preferably 40 mol % or more of the monovalent hydrocarbon groups bonded to silicon atoms may be aromatic groups, more preferably 50 mol % or more, and particularly preferably 60 mol % or more.

The resinous organopolysiloxane of component (A) is preferably represented by the following average unit formula (A-4): (A-4) (R ² ₃ SiO _1/2 ) _a (R ² ₂ SiO _2/2 ) _b (Ar ₂ SiO _2/2 ) _b' (R ² SiO _3/2 ) _c (SiO _4/2 ) _d (XO _1/2 ) _e wherein R ² and Ar are the same as above, wherein at least two R ² in one molecule are alkenyl groups, X is a hydrogen atom or an alkyl group, R ² ₂ SiO _2/2 represents a unit other than Ar ₂ SiO _2/2 , and a, b, b', c, d and e are numbers satisfying the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ＜ b' ≤ 1.0, 0 ≤ c < 0.9, 0 ≤ d < 0.5, 0 ≤ e < 0.4, a + b + b' + c + d = 1.0, and c + d > 0.

In the average unit formula (A-4), a is preferably in the range of 0 ≤ a ≤ 0.5, more preferably in the range of 0 ≤ a ≤ 0.3, most preferably in the range of 0 ≤ a ≤ 0.2, and particularly in the range of 0 ≤ a ≤ 0.1. In the average unit formula (A-4), b is preferably in the range of 0 ≤ b ≤ 0.8, more preferably in the range of 0.1 ≤ b ≤ 0.7, and particularly in the range of 0.15 ≤ b ≤ 0.6. In the average unit formula (A-4), b' is preferably in the range of 0.1 ≤ b' ≤ 0.7, more preferably in the range of 0.2 ≤ b' ≤ 0.6, and particularly in the range of 0.25 ≤ b' ≤ 0.5. In the average unit formula (A-4), c is preferably in the range of 0.1 ≤ c ≤ 0.9, more preferably in the range of 0.2 ≤ c ≤ 0.85, and particularly in the range of 0.3 ≤ c ≤ 0.8. In the average unit formula (A-4), d is preferably in the range of 0 ≤ d ≤ 0.4, more preferably in the range of 0 ≤ d ≤ 0.3, and particularly in the range of 0 ≤ d ≤ 0.2. In the average unit formula (A-4), e is preferably in the range of 0 ≤ e ≤ 0.3, more preferably in the range of 0 ≤ e ≤ 0.2, and particularly in the range of 0 ≤ e ≤ 0.1.

The curable organosilicon composition of the present invention preferably contains 10% by mass or more, preferably 20% by mass or more, more preferably 30% by mass or more, and further preferably 40% by mass or more of a resinous organopolysiloxane containing at least one (Ar ₂ SiO _2/2 ) unit as component (A), based on the total mass of the composition. In a preferred embodiment, the curable organosilicon composition of the present invention contains 90% by mass or less, preferably 80% by mass or less, and more preferably 70% by mass or less of a resinous organopolysiloxane containing at least one (Ar ₂ SiO _2/2 ) unit, based on the total mass of the composition.

The total mass of the composition of the present invention may preferably contain 30 mass % or more, more preferably 40 mass % or more, further preferably 50 mass % or more, most preferably 60 mass % or more of the component (A), and may preferably contain 90 mass % or less, more preferably 85 mass % or less, particularly 80 mass % or less of the component (A).

(B) Resinous organohydropolysiloxane The resinous organohydropolysiloxane (i.e., branched organohydropolysiloxane) having at least two silicon-bonded hydrogen atoms in one molecule of the component (B) functions as a crosslinking agent for a curable organosilicon composition that is curable by a hydrosilylation reaction. Preferably, the component (B) is a resinous organohydropolysiloxane having silicon-bonded hydrogen atoms at least at both ends of the molecular chain. The component (B) may be a single organopolysiloxane or a combination of two or more organopolysiloxanes.

It is preferred that the silicon atom-bonded hydrogen atoms of the component (B) are contained at least at both ends of the molecular chain. Alternatively, the silicon atom-bonded hydrogen atoms may be contained in the side chains of the molecular chain or only at both ends of the molecular chain. Examples of the group bonded to the silicon atom other than the hydrogen atom in the component (B) include alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertiary butyl, pentyl, neopentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl; aryl groups having 6 to 20 carbon atoms such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups having 7 to 20 carbon atoms such as benzyl, phenethyl, and phenylpropyl; and groups in which the hydrogen atoms of these groups are partially or completely substituted with halogen atoms such as fluorine, chlorine, and bromine. In addition, the silicon atom in the component (B) may have a small amount of hydroxyl, methoxy, and ethoxy alkoxy groups within the scope that does not impair the purpose of the present invention.

In one embodiment of the present invention, the resinous organohydropolysiloxane may be represented by the following average unit formula (B-1): (R ³ ₃ SiO _1/2 ) _a (R ³ ₂ SiO _2/2 ) _b (R ³ SiO _3/2 ) _c (SiO _4/2 ) _d (XO _1/2 ) _e wherein R ³ is a hydrogen atom or a monovalent hydrocarbon group which may be substituted or unsubstituted with the same or different halogens, wherein at least two R ^3s are hydrogen atoms, X is a hydrogen atom or an alkyl group, and a, b, c, d and e are numbers satisfying the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, 0 ≤ d ＜ 0.5, 0 ≤ e ＜ 0.4, a + b + c + d = 1.0, and c + d ＞ 0.

Examples of the halogen-substituted or unsubstituted monovalent alkyl group of ^R3 in the above formula B-1 include alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertiary butyl, pentyl, neopentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl; aryl groups having 6 to 20 carbon atoms such as phenyl, tolyl, xylyl and naphthyl; aralkyl groups having 7 to 20 carbon atoms such as benzyl, phenethyl and phenylpropyl; alkenyl groups having 2 to 12 carbon atoms such as vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl and dodecenyl; and groups in which the hydrogen atoms of these groups are partially or completely substituted with halogen atoms such as fluorine, chlorine and bromine atoms. ^R3 may be an alkoxy group having a small amount of hydroxyl group, methoxy group, ethoxy group or the like within the range not impairing the purpose of the present invention.

In the above formula B-1, a is preferably in the range of 0.1 ≤ a ≤ 0.9, more preferably in the range of 0.2 ≤ a ≤ 0.8, and particularly in the range of 0.4 ≤ a ≤ 0.7. In the above formula B-1, b is preferably in the range of 0 ≤ b ≤ 0.8, more preferably in the range of 0 ≤ b ≤ 0.5, and particularly in the range of 0 ≤ b ≤ 0.2. In the above formula B-1, c is preferably in the range of 0.1 ≤ c ≤ 0.9, more preferably in the range of 0.2 ≤ c ≤ 0.7, and particularly in the range of 0.3 ≤ c ≤ 0.5. In the above formula B-1, d is preferably in the range of 0 ≤ d ≤ 0.4, more preferably in the range of 0 ≤ d ≤ 0.3, and particularly in the range of 0 ≤ d ≤ 0.2. In the above formula B-1, e is preferably in the range of 0 ≤ e ≤ 0.3, more preferably in the range of 0 ≤ e ≤ 0.2, and particularly in the range of 0 ≤ e ≤ 0.1.

The component (B-1) is contained in the hot-melt curable organosilicon composition of the present invention in an amount of 0.1 to 5% by mass based on the total mass of the composition of the present invention. The component (B) is preferably contained in the hot-melt curable organosilicon composition of the present invention in an amount of 0.5% by mass or more, more preferably in an amount of 1% by mass or more, for example, in an amount of 4.5% by mass or less, based on the total mass of the composition of the present invention.

In one embodiment of the present invention, for component (B), the amount of silicon atoms bonded to hydrogen atoms in this component may preferably be 0.001 to 5 moles, more preferably 0.01 to 2 moles, and particularly 0.05 to 1 mole, relative to 1 mole of silicon atoms bonded to alkenyl groups in component (A).

In addition to the above-mentioned component (B), the hot melt curable organosilicon composition may also contain an organohydropolysiloxane as a crosslinking agent for the hydrosilylation reaction curable type curable organosilicon composition as a component (B'). As such a component (B'), a linear organohydropolysiloxane is preferably used. The component (B') may be a single organopolysiloxane or a combination of two or more organopolysiloxanes.

It is preferred that the silicon atom-bonded hydrogen atoms of the component (B') are contained at least at both ends of the molecular chain. In addition, the silicon atom-bonded hydrogen atoms may be contained in the side chains of the molecular chain, or the silicon atom-bonded hydrogen atoms may be contained only at both ends of the molecular chain. Examples of the group bonded to the silicon atom other than the hydrogen atom in the component (B) include alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertiary butyl, pentyl, neopentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl; aryl groups having 6 to 20 carbon atoms such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups having 7 to 20 carbon atoms such as benzyl, phenethyl, and phenylpropyl; and groups in which the hydrogen atoms of these groups are partially or completely substituted with halogen atoms such as fluorine, chlorine, and bromine. In addition, the silicon atom in the component (B') may have a small amount of hydroxyl, methoxy, and ethoxy alkoxy groups within the scope that does not impair the purpose of the present invention.

In one embodiment of the present invention, the component (B') can be a linear organic hydropolysiloxane represented by the average composition formula (B-2): (R ³ ₃ SiO _1/2 ) _a (R ³ ₂ SiO _2/2 ) _b (XO _1/2 ) _e (wherein R ³ and X are the same as above, and a, b and e are numbers that satisfy the following conditions: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ e ＜ 0.4, and a + b = 1.0.

In one embodiment of the present invention, the component (B') can be represented by the following structural formula: [HR ⁴ ₂ SiO _1/2 ] ₂ [R ⁴ ₂ SiO _2/2 ] _y , wherein R ⁴ is the same or different halogen-substituted or unsubstituted monovalent hydrocarbon group, and y is a number in the range of 1 to 100, preferably 1 to 10. As the halogen-substituted or unsubstituted monovalent hydrocarbon group of R ⁴ , the same groups as those described for R ³ can be used.

Based on the total mass of the composition of the present invention, the component (B') may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 1 mass % or more, more preferably 5 mass % or more, most preferably 10 mass % or more, and particularly 15 mass % or more, and may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 50 mass % or less, more preferably 40 mass % or less, and particularly 30 mass % or less.

Regarding the total content of component (B) and (B'), the amount of silicon atoms bonded to hydrogen atoms in this component may preferably be 0.1 to 10 mols, more preferably 0.5 to 5 mols, and particularly 0.5 to 1.5 mols, per 1 mol of silicon atoms bonded to alkenyl groups in component (A). In addition, based on the total mass of the composition of the present invention, the content of the sum of the components (B) and (B') may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 1 mass % or more, more preferably 5 mass % or more, most preferably 10 mass % or more, and particularly 15 mass % or more, and may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 50 mass % or less, more preferably 40 mass % or less, and particularly 30 mass % or less.

(C) Additive The additive serving as the component (C) of the present invention is a siloxane compound represented by the following average unit formula (C-1): (R ¹ ₃ SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b (R ¹ SiO _3/2 ) _c wherein R ¹ is an organic group containing an alkyl group, an aryl group, an alkenyl group, an aralkyl group, or an epoxide group, or an alkoxy group, wherein at least one R ¹ is an alkenyl group, and at least one R ¹ is an organic group containing an epoxide group, and a, b and c are numbers satisfying the following conditions respectively: 0 ≤ a ≤ 1.0, 0 ≤ b ≤ 1.0, 0 ≤ c ＜ 0.9, and a + b + c = 1. That is, the component (C) contains at least one alkenyl group and at least one epoxy-containing organic group bonded to a silicon atom.

In the present specification, the “epoxy-containing group” may be exemplified by glycidoxyalkyl groups such as 2-glycidoxyethyl, 3-glycidoxypropyl, and 4-glycidoxybutyl; glycidoxyalkyl groups such as 2-(3,4-epoxycyclohexyl)-ethyl and 3-(3,4-epoxycyclohexyl)-propyl; and glycidoxyalkyl groups such as 3,4-epoxybutyl and 7,8-epoxyoctyl. Preferably, the glycidoxyalkyl group is used, and 3-glycidoxypropyl is particularly preferred.

In the present specification, the "alkoxy group" is exemplified by methoxy, ethoxy, butoxy, phenoxy, pentyloxy, allyloxy, cyclohexyloxy, benzyloxy, naphthyloxy, acetyloxy and the like, preferably methoxy and ethoxy, and particularly preferably methoxy.

Examples of the alkenyl group contained in the component (C) include alkenyl groups having 2 to 12 carbon atoms such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl and dodecenyl, and vinyl is preferred.

^R1 in the above formula C-1 is preferably selected from an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms. Specifically, R ¹ in the above formula C-1 includes alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl; alkenyl groups such as vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl and dodecenyl; aryl groups such as phenyl, tolyl, xylyl, naphthyl, anthracenyl, phenanthryl and pyrenyl; aralkyl groups such as naphthylethyl, naphthylpropyl, anthracenethyl, phenanthryl and pyreneethyl; and groups in which the hydrogen atoms of the aryl or aralkyl groups are partially or completely substituted with alkyl groups such as methyl and ethyl, alkoxy groups such as methoxy and ethoxy, or halogen atoms such as chlorine and bromine atoms, and preferably methyl, vinyl and phenyl.

In the above formula C-1, a is preferably in the range of 0 ≤ a ≤ 0.9, more preferably in the range of 0 ≤ a ≤ 0.5, and particularly in the range of 0 ≤ a ≤ 0.3. In the above formula C-1, b is preferably in the range of 0.1 ≤ b ≤ 0.9, more preferably in the range of 0.2 ≤ b ≤ 0.8, and particularly in the range of 0.25 ≤ b ≤ 0.7. In the above formula C-1, c is preferably in the range of 0.01 ≤ c ≤ 0.8, more preferably in the range of 0.1 ≤ c ≤ 0.7, and particularly in the range of 0.2 ≤ c ≤ 0.6.

The content of alkenyl groups in component (C) is not particularly limited, and is, for example, 1 mol% or more, preferably 5 mol% or more, more preferably 8 mol% or more, of the total of ^R1, and is, for example, 40 mol% or less, preferably 30 mol% or less, more preferably 30 mol% or less. The content of alkenyl groups can be determined by analysis using, for example, Fourier transform infrared spectrophotometer (FT-IR), nuclear magnetic resonance (NMR), or the like.

The content of the epoxy-containing organic group contained in the component (C) is not particularly limited, and is, for example, 1 mol% or more of the total ^R1 , preferably 5 mol% or more, more preferably 10 mol% or more, and is, for example, 50 mol% or less, preferably 40 mol% or less, more preferably 35 mol% or less. The content of the epoxy-containing organic group can be determined by analysis using, for example, Fourier transform infrared spectrophotometer (FT-IR), nuclear magnetic resonance (NMR), or the like.

Based on the total mass of the composition of the present invention, the component (C) may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 0.01 mass % or more, more preferably 0.1 mass % or more, most preferably 0.3 mass % or more, and particularly 0.5 mass % or more, and may be preferably contained in the hot-melt curable organic silicon composition of the present invention in an amount of 20 mass % or less, more preferably 15 mass % or less, and most preferably 10 mass % or less.

(D) Catalyst for hydrosilylation reaction The catalyst for hydrosilylation reaction (D) is a catalyst used to promote the curing of the hot-melt curable organosilicon composition of the present invention. As such a component (D), for example, platinum-based catalysts such as chloroplatinic acid, an alcohol solution of chloroplatinic acid, a complex of platinum and olefin, a complex of platinum and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, a powder loaded with platinum, palladium-based catalysts such as tetrakis(triphenylphosphine)palladium, palladium black, and a mixture with triphenylphosphine can be listed; rhodium-based catalysts can be listed, and platinum-based catalysts are particularly preferred.

The amount of component (D) is a catalytic amount. When a platinum catalyst is used as component (D), the amount of platinum metal contained in the platinum catalyst is preferably in the range of 0.01 to 1000 ppm by weight in the hot-melt curable organosilicon composition of the present invention, and is particularly preferably in the range of 0.1 to 500 ppm.

(E) Silica Silica as the component (E) may be fumed silica, wet silica, crystalline silica, precipitated silica, etc. In addition, silica may be surface-hydrophobized using organic silicon compounds such as organic alkoxysilane compounds, organic chlorosilane compounds, organic silazane compounds, low molecular weight siloxane compounds, or silane coupling agents, titanium ester coupling agents, etc.

Based on the total mass of the composition of the present invention, the amount of component (E) may be preferably 0.01 mass% or more, more preferably 0.1 mass% or more, preferably 0.5 mass% or more, particularly 1 mass% or more, in the hot-melt curable organic silicon composition of the present invention, and may be preferably 20 mass% or less, more preferably 15 mass% or less, preferably 10 mass% or less, in the hot-melt curable organic silicon composition of the present invention.

The hot-melt curable organosilicon composition of the present invention may contain any components within the range not impairing the purpose of the present invention. Examples of the optional component include acetylene compounds; organophosphorus compounds; vinyl-containing siloxane compounds; hydrosilylation reaction inhibitors; ground quartz, titanium oxide, magnesium carbonate, zinc oxide, iron oxide, diatomaceous earth, and the like (E) inorganic fillers other than silica (also referred to as "inorganic fillers"); inorganic fillers obtained by subjecting the surfaces of such inorganic fillers to a hydrophobic treatment with an organosilicon compound; organopolysiloxanes that do not contain silicon atoms bonded to hydrogen atoms or silicon atoms bonded to alkenyl groups; thickeners; heat-resistant agents; cold-resistant agents; thermally conductive fillers; flame retardants; thixotropic agents; phosphors; coloring components such as carbon black and dyes, and solvents.

The hydrosilylation reaction inhibitor is a component used to inhibit the hydrosilylation reaction of the organosilicon composition. Specifically, for example, there can be mentioned acetylenes such as 1-ethynyl-2-cyclohexanol, amines, carboxylates, phosphites, and the like. The amount of the reaction inhibitor added is usually 0.001 to 5% by mass of the entire organosilicon composition.

(E) Inorganic fillers other than silica include, for example, hollow fillers, silsesquioxane, fumed titanium dioxide, magnesium oxide, zinc oxide, iron oxide, aluminum hydroxide, magnesium carbonate, calcium carbonate, zinc carbonate, layered mica, diatomaceous earth, glass fiber, etc.; fillers obtained by subjecting such fillers to surface hydrophobic treatment with organic silicon compounds such as organic alkoxysilane compounds, organic chlorosilane compounds, organic silazane compounds, and low molecular weight siloxane compounds, etc. In addition, organic silicone rubber powder, organic silicone resin powder, etc. may be added. However, the amount of the inorganic filler blended is preferably 20% by mass or less, and particularly preferably 10% by mass or less, based on the organic silicon composition.

As the phosphor, yellow, red, green, and blue luminescent phosphors composed of oxide-based phosphors, oxynitride-based phosphors, nitride-based phosphors, sulfide-based phosphors, oxysulfide-based phosphors, fluoride-based phosphors, etc., which are widely used in light-emitting diodes (LEDs), and mixtures of at least two of them can be cited. As the oxide-based phosphor, YAG-based green-yellow luminescent phosphors of yttrium, aluminum, and garnet containing tidium ions, TAG-based yellow luminescent phosphors of zirconium, aluminum, and garnet containing tidium ions, and silicate-based green-yellow luminescent phosphors containing tidium and tidium ions can be cited. Examples of oxynitride-based phosphors include SIALON-based red-green luminescent phosphors of silicon, aluminum, oxygen, and nitrogen containing indium ions. Examples of nitride-based phosphors include CASN-based red luminescent phosphors of calcium, strontium, aluminum, silicon, and nitrogen containing indium ions. Examples of sulfide-based phosphors include ZnS-based green luminescent phosphors containing copper ions or aluminum ions. Examples of oxysulfide-based phosphors include Y ₂ O ₂ S-based red luminescent phosphors containing indium ions. Examples of the fluoride-based phosphor include KSF phosphor (K ₂ SiF ₆ :Mn ⁴⁺ ) and the like.

As a coloring component, a single organic or inorganic pigment and dye may be used alone or in combination of two or more thereof. When a fluorescent body is used, the amount of the coloring component may be less than 90% by mass of the organic silicon composition, preferably less than 80% by mass, and particularly preferably less than 70% by mass. In addition, from the viewpoint of preventing interference of light in the display and improving color contrast, a black pigment may also be used. Examples of black pigments include iron oxide, aniline black, activated carbon, graphite, carbon nanotubes, and carbon black. Specifically, the amount of the coloring component is less than 30% by mass of the organic silicon composition, preferably less than 15% by mass, and particularly preferably less than 5% by mass.

The hot-melt curable organosilicon composition of the present invention can be prepared by mixing the components. The mixing method of the components can be a conventionally known method, and is not particularly limited. Usually, a uniform mixture is formed by simple stirring. In addition, when a solid component such as an inorganic filler is contained as an arbitrary component, it is more preferable to use a mixing device for mixing. Such a mixing device is not particularly limited, and examples thereof include a single-shaft or double-shaft continuous mixer, a two-roller mill, a Ross mixer, a Hobart mixer, a dental mixer, a planetary mixer, a kneading mixer, a Henschel mixer, and the like.

The hot-melt curable organosilicon composition of the present invention can show excellent mechanical properties, especially strength and elongation, even when formed into a film or sheet. Therefore, the hot-melt curable organosilicon composition of the present invention has excellent processing performance and can form a sealant and a laminating film that can efficiently manufacture semiconductor packages and is used to manufacture semiconductor packages. Therefore, the hot-melt curable organosilicon composition of the present invention can be applied to the use of sheet or film sealants and laminating films when manufacturing semiconductor packages. [Sealants, Films]

The present invention also relates to a sealant for semiconductors using the hot-melt curable organic silicon composition of the present invention. The shape of the sealant of the present invention is not particularly limited, and preferably a film or sheet shape. Therefore, the present invention also relates to a film obtained by curing the hot-melt curable organic silicon composition of the present invention. The film of the present invention can preferably be used as a film-shaped sealant and a lamination film for sealing semiconductor elements. The semiconductor sealed by the sealant or film of the present invention is not particularly limited, and examples thereof include semiconductors such as SiC and GaN, and in particular optical semiconductors such as power semiconductors or light-emitting diodes.

The sealant or film of the present invention can exhibit excellent mechanical properties, especially strength and elongation, even in the form of a film or sheet, so it has excellent processing performance and can efficiently manufacture semiconductor packages. [Optical semiconductor components]

The present invention also relates to an optical semiconductor element comprising the sealant of the present invention. Examples of the optical semiconductor element include light emitting diodes (LEDs), semiconductor lasers, photodiodes, phototransistors, solid-state cameras, and light emitting bodies and photoreceptors for optical couplers, and particularly preferred are light emitting diodes (LEDs).

Light-emitting diodes (LEDs) emit light from the top, bottom, left, and right of optical semiconductor elements, so the components that make up light-emitting diodes (LEDs) are preferably made of materials with high light transmittance or high reflectance rather than light absorbing materials. Therefore, the substrate on which the optical semiconductor element is mounted is also preferably made of materials with high light transmittance or high reflectance. Examples of substrates on which such optical semiconductor elements are mounted include conductive metals such as silver, gold, and copper; non-conductive metals such as aluminum and nickel; thermoplastic resins mixed with white pigments such as PPA and LCP; thermosetting resins containing white pigments such as epoxy resins, BT resins, polyimide resins, and organic silicone resins; and ceramics such as alumina and aluminum nitride.

The optical semiconductor element of the present invention includes the encapsulant of the present invention, which has excellent processing performance and can efficiently manufacture semiconductor packages, and thus has excellent reliability. [Example]

The hot-melt curable organic silicon composition of the present invention is described in detail by the following examples and comparative examples. [Examples 1 to 22 and Comparative Examples 1 to 5]

The components were mixed in the compositions (parts by weight) shown in Tables 1 to 4 to prepare a hot-melt curable organic silicon composition. In addition, Me represents a methyl group, Vi represents a vinyl group, Ph represents a phenyl group, and Ep represents a 3-glycidoxypropyl group.

Component a-1: Resinous alkenyl-containing organopolysiloxane represented by an average unit formula (ViMeSiO _2/2 ) ₂₅ (Ph ₂ SiO _2/2 ) ₃₀ (PhSiO _3/2 ) ₄₅ Component a-2: Resinous alkenyl-containing organopolysiloxane represented by an average unit formula (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₅ Component a- ₃ : Straight chain alkenyl-containing organopolysiloxane represented by the general formula (ViMe ₂ SiO _1/2 ) (PhMeSiO _2/2 ) ₂₀ (ViMe ₂ SiO _1/2 ) Component a-4: Cyclic alkenyl-containing organopolysiloxane represented by the general formula (ViMeSiO _{2/2 )} 4 Component a-5: _1/2 ) ₃ (PhSiO _3/2 ) Resinous alkenyl-containing organopolysiloxane component b-1: Resinous organohydropolysiloxane represented by average unit formula (HMe ₂ SiO _1/2 ) ₆₀ (PhSiO _3/2 ) ₄₀ Component b-2: Straight-chain organohydropolysiloxane represented by general formula (HMe ₂ SiO _1/2 ) (Ph ₂ SiO _2/2 ) (HMe ₂ SiO _1/2 ) Component c-1: Average unit formula (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₅ (EpMeSiO _2/2 ) ₄₀ Additive component c-2: Structural formula (Me ₂ SiO _2/2 ) (ViMeSiO _2/2 ) (EpSiO _3/2 ) additive component c-3: average unit formula (EpMeSiO _2/2 ) ₄₈ (ViSiO _3/2 ) ₂₁ (PhSiO _3/2 ) ₃₁ additive component c-4: general formula (ViMe ₂ SiO _1/2 ) (Me ₂ SiO _2/2 ) ₃ Si(OMe) ₃ additive component c-5: average unit formula (ViMe ₂ SiO _1/2 ) ₁₅ (Me ₂ SiO _2/2 ) ₃₅ (PhSiO _3/2 ) Additives shown in ₅₀ : Component d: platinum complex with 1,3-divinyl-1,1,3,3-tetramethyldisiloxane having a platinum concentration of 4.0 mass %; Component e: 1-ethynyl-2-cyclohexanol (platinum catalyst inhibitor); Component f: fumed silica; Component g: carbon black [Evaluation]

Based on JIS K 6251, the tensile strength (MPa) and elongation at break (%) of the cured products of the hot-melt curable organosilicon compositions of Examples 1 to 22 and Comparative Examples 1 to 5 were measured. Specifically, the hot-melt curable organosilicon compositions of Examples 1 to 22 and Comparative Examples 1 to 5 were heat aged at 120°C for 5 to 10 minutes to obtain hot-melt cured products. The melt elastic modulus of the hot-melt cured products at 100°C was measured by a viscoelastic meter (MCR302 manufactured by Anton Paar) and was 30 to 300 Pa. A dumb bell-shaped No. 3 test piece with a thickness of 180 μm was prepared. The tensile strength (MPa) and elongation at break (%) of the test piece were measured at a tensile speed of 500 mm/min. The results are shown in Tables 1 to 4. It can be said that the test piece with a tensile strength of 1 MPa or more and an elongation at break of 200% or more has excellent handling performance as a sealant film or a laminating film.

[Table 1] [Table 1] Element Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 a-1 56.9 56.5 58.3 53.1 51.3 55.9 59.7 a-2 4 3.3 3.3 3.4 3.3 3.3 3.3 a-3 14.9 9.1 6.6 11.7 6.6 6.6 6.6 a-4 0.2 0.2 0.2 3.0 0.2 0.2 0.2 a-5 - 3.5 3.7 - 3.7 3.7 3.7 b-1 2.5 2.5 2.5 3.5 2.5 2.5 2.5 b-2 19.0 22.4 22.9 22.8 22.4 22.8 23.0 c-1 2.5 2.5 2.5 2.5 10.0 5.0 1.0 D 0.01 0.01 0.01 0.02 0.01 0.01 0.01 E 0.02 0.02 0.02 0.02 0.02 0.02 0.02 F 3 3 3 3 3 3 3 The sum of components a to c 100 100 100 100 100 100 100 Reviews Tensile strength (MPa) 1.7 1.6 1.9 3.0 1.4 1.2 1.7 Elongation at break (%) 250 250 300 230 205 210 250

[Table 2] [Table 2] Element Embodiment 8 Embodiment 9 Embodiment 10 Embodiment 11 Embodiment 12 Embodiment 13 Embodiment 14 Embodiment 15 Embodiment 16 a-1 58.0 58.2 47.1 47.1 47.1 58.0 53.1 58.2 58.2 a-2 3.3 3.3 - - - - - 3.3 3.3 a-3 6.6 6.6 25.3 25.3 25.3 15.9 25.1 6.6 6.6 a-4 0.2 0.2 2.3 2.3 2.3 1.2 - 0.2 0.2 a-5 3.7 3.7 - - - - - 3.7 3.7 b-1 2.5 2.5 4.2 4.2 4.2 3.0 1.6 1.0 2.0 b-2 23.2 23.0 18.6 18.6 18.6 19.4 17.7 24.5 23.5 c-1 - - 2.5 2.5 2.5 2.5 2.5 2.5 2.5 c-2 2.5 - - - - - - - - c-3 - 2.5 - - - - - - - D 0.01 0.01 0.02 0.02 0.02 0.01 0.01 0.01 0.01 E 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 F 3 3 3 3 3 3 3 3 3 G - - 0.1 0.3 2.0 - - - - The sum of components a to c 100 100 100 100 100 100 100 100 100 Reviews Tensile strength (MPa) 1.1 1.2 2.5 2.6 2.9 2.1 2.0 1.1 1.3 Elongation at break (%) 280 270 250 260 220 230 270 400 450

[Table 3] [Table 3] Element Embodiment 17 Embodiment 18 Embodiment 19 Embodiment 20 Embodiment 21 Embodiment 22 a-1 60.1 59.6 55.4 59.6 55.8 51.0 a-2 3.3 3.3 3.3 3.3 3.3 3.3 a-3 6.6 6.6 6.6 6.6 6.6 6.6 a-4 0.2 0.2 0.2 0.2 0.2 0.2 a-5 3.7 3.7 3.7 3.7 3.7 3.7 b-1 2.5 2.5 2.5 2.5 2.5 2.5 b-2 23.1 23.1 23.3 23.1 22.9 22.7 c-1 - - - - - - c-2 0.5 1.0 5.0 - - - c-3 - - - 1.0 5.0 10.0 d 0.01 0.01 0.01 0.01 0.01 0.01 e 0.02 0.02 0.02 0.02 0.02 0.02 f 3 3 3 3 3 3 The sum of components a to c 100 100 100 100 100 100 Reviews Tensile strength (MPa) 1.6 2.1 1.1 2.0 1.1 1.1 Elongation at break (%) 200 230 280 210 450 450

[Table 4] [Table 4] Element Comparison Example 1 Comparison Example 2 Comparison Example 3 Comparison Example 4 Comparison Example 5 a-1 60.6 58.0 58.2 58.1 58.5 a-2 3.3 3.3 3.3 3.3 3.3 a-3 6.6 6.6 6.6 6.6 6.6 a-4 0.2 0.2 0.2 0.2 0.2 a-5 3.7 3.7 3.7 3.7 3.7 b-1 2.5 2.5 2.5 - 5.7 b-2 23.1 23.2 23.0 25.6 19.5 c-1 - - - 2.5 2.5 c-4 - 2.5 - - - c-5 - - 2.5 - - D 0.01 0.01 0.01 0.01 0.01 E 0.02 0.02 0.02 0.02 0.02 f 3 3 3 3 3 The sum of components a to c 100 100 100 100 100 Reviews Tensile strength (MPa) 1.0 0.9 1.2 0.5 3.0 Elongation at break (%) 110 250 170 630 100 [Industrial Availability]

The hot-melt curable organosilicon composition of the present invention can be formed into a film or sheet having excellent processing performance, and thus can be applied to sheet-shaped or film-shaped sealants and laminating films in the manufacture of semiconductor packages.

without

without

without

Claims (12)

A solvent-free hot-melt curable organic silicon composition comprises: (A) an alkenyl-containing organic polysiloxane having at least two alkenyl groups in one molecule, wherein the alkenyl-containing organic polysiloxane comprises a resinous organic polysiloxane containing alkenyl groups and at least one (Ar ₂ SiO _2/2 ) unit; (B) a resinous organic hydropolysiloxane having 0.1 to 5 mass % relative to the total mass of the composition and having at least two silicon-atom-bonded hydrogen atoms in one molecule; and (C) an additive represented by the following average unit formula (C-1): (R ¹ ₃ SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b (R ¹ SiO _3/2 ) _c wherein R ^R1 is the same or different organic group containing alkyl, aryl, alkenyl, aralkyl, or epoxide, or alkoxy, wherein at least one ^R1 is an alkenyl, and at least one ^R1 is an organic group containing epoxide, and a, b and c are numbers that satisfy the following conditions respectively: 0

a

1.0, 0

b

1.0, 0

c<0.9, and a+b+c=1; (D) a catalyst for hydrosilylation reaction; and (E) silicon dioxide, which is 20% by mass or less relative to the total mass of the composition, wherein the amount of the inorganic filler other than silicon dioxide (E) is 20% by mass or less relative to the total mass of the composition. The hot-melt curable organic silicon composition as described in claim 1, wherein the component (A) further comprises a linear alkenyl-containing organic polysiloxane. The hot-melt curable organosilicon composition as claimed in claim 1 or 2, wherein the component (B) is represented by the following average unit formula (B-1): (R ³ ₃ SiO _1/2 ) _a (R ³ ₂ SiO _2/2 ) _b (R ³ SiO _3/2 ) _c (SiO _4/2 ) _d (XO _1/2 ) _e wherein R ³ is a hydrogen atom or a monovalent hydrocarbon group which may be substituted or unsubstituted with the same or different halogens, wherein at least two R ³ are hydrogen atoms, X is a hydrogen atom or an alkyl group, and a, b, c, d and e are numbers satisfying the following conditions: 0

a

1.0, 0

b

1.0, 0

c<0.9, 0

d<0.5, 0

e<0.4, a+b+c+d=1.0, and c+d>0. The hot-melt curable organic silicon composition as claimed in claim 3, wherein in the average unit formula (B-1), a is 0.1

a

0.9 range, b is 0

b

0.8 range, c is 0.1

c

0.9 range, d is 0

d

0.4 range, e is 0

e

0.3 range. The hot-melt curable organosilicon composition according to any one of claims 1 to 2, wherein in the average unit formula (C-1), a is 0

a

0.9, b is 0.1

b

0.9, c is 0.01

c

0.8 range. The hot-melt curable organosilicon composition as described in any one of claims 1 to 2, wherein the content of alkenyl groups contained in component (C) is 5 mol% or more of the total of ^R1 . The hot-melt curable organosilicon composition as described in any one of claims 1 to 2, wherein the content of the epoxy-containing organic group contained in the component (C) is 5 mol% or more of the total of ^R1 . The curable organic silicon composition as described in claim 1 further comprises linear and cyclic organic polysiloxane as component (A). A film obtained by curing the hot-melt curable organic silicon composition described in any one of claims 1 to 2. A sealant, which is composed of the hot-melt curable organic silicon composition described in any one of claims 1 to 2. An optical semiconductor component comprising the sealant described in claim 10. The optical semiconductor element as described in claim 11, wherein the optical semiconductor is a light-emitting diode.