TWI872792B - Thin embedded antenna structure - Google Patents

Abstract

The present invention discloses a thin embedded antenna structure, comprising a first substrate, a second substrate stacked and embedded in the first substrate, and a third substrate stacked and embedded in the second substrate. A first, a second, and a third radiation metal layer of the first, second, and third substrates extend along the conductive holes in their respective directions toward the ground layer of the first substrate, and are not electrically connected to the ground layer, so that the first substrate and the second and third substrates embedded therein constitute the thin embedded antenna structure, so as to effectively achieve thinness and realize multi-band transmission and reception of different signals.

Description

Thin embedded antenna structure

The present invention relates to a thin embedded antenna structure, and more particularly to a thin embedded antenna structure that can achieve thinness and multi-band transmission and reception.

Traditional portable GPS systems all have a built-in receiving antenna structure for receiving GPS signals. The receiving antenna structure of this GPS system is a pin-type flat antenna structure. This flat antenna structure has a ceramic dielectric substrate, a radiating metal layer on the surface of the substrate, a grounding metal layer on the bottom of the substrate, and a through hole on the substrate. The through hole penetrates the radiating metal layer and the grounding metal layer. The through hole provides a needle-shaped signal feed body to pass through. After the signal feed body passes through the substrate, it is electrically connected to the radiating metal layer, but not to the grounding metal layer, so as to form a flat antenna structure that can be electrically fixed to the motherboard of an electronic device. Since this type of pin-type flat antenna structure is only suitable for receiving signals from a single system, that is, a single flat antenna can only receive a single signal of a single frequency band (such as a GPS signal), and the substrate used is a cubic shape, resulting in a large volume, which makes it impossible to install it on the new generation of thin and short portable electronic devices. When welding with the motherboard of the electronic device, the temperature curve may not be able to satisfy the large ceramic medium substrate to reach a uniform temperature sufficient for welding, causing trouble in the welding process. Moreover, when this type of pin-type flat antenna structure is electrically fixed to the motherboard of an electronic device, the pin-type flat antenna structure needs to be glued and hand-soldered, and cannot be machine-bonded. Therefore, it cannot achieve automated welding assembly, and cannot achieve thinness and small size, and cannot achieve the problem that a single antenna can receive and transmit multiple frequency bands of different signals. Therefore, how to solve the above-mentioned single flat antenna cannot receive and transmit multiple frequency bands of different signals and cannot achieve thinness and automated welding assembly is the direction that the inventor of this case and related industries engaged in this industry are eager to study and improve.

In order to effectively solve the above problems, one purpose of the present invention is to provide a thin embedded antenna structure that can achieve multi-band transmission and reception of different signals and realize thinness. Another purpose of the present invention is to provide a thin embedded antenna structure that can achieve automated welding. To solve the above-mentioned purpose, the present invention provides a thin embedded antenna structure, including a first substrate, a second substrate and a third substrate, the first substrate having a first insulating upper side, a first insulating lower side and a first radiating metal layer, the first insulating lower side having a grounding layer, the first insulating upper side being inwardly concave with a first recess, the first recess being provided with at least three first mounting holes and at least two first conductive holes, the first radiating metal layer being provided on the first insulating upper side and the first recess, and extending along the two first conductive holes to the first insulating lower side, and being connected to the first conductive hole. The grounding layer is not electrically connected. The second substrate is stacked in the first recess. The second substrate has a second insulating upper side, a second insulating lower side and a second radiation metal layer. The second insulating upper side of the second substrate is inwardly concave with a second recess. The second recess is provided with at least one second mounting hole and at least two second conductive holes. The second insulating lower side is provided with two hollow first tubular portions at positions opposite to the two second conductive holes. The two first tubular portions are connected to the two second conductive holes, and the two first tubular portions are combined in the first and second first mounting holes corresponding thereto. The second radiation metal layer is disposed on the second insulating upper side and the second recess, and extends along the two second conductive holes to the outside of the corresponding two first tubular portions, and is not electrically connected to the ground layer. The third substrate is stacked in the second recess of the second substrate. The third substrate has a third insulating upper side, a third insulating lower side, at least one third conductive hole and a third radiation metal layer. The third conductive hole penetrates the third insulating upper and lower sides, and a second hollow tubular portion is provided at the third insulating lower side opposite to the third conductive hole. The second tubular portion is connected to the third conductive hole, and the second tubular portion sequentially penetrates the corresponding second mounting hole and the third first mounting hole. The third radiation metal layer is provided on the third insulating upper side, and extends along the third conductive hole to the outside of the corresponding second tubular portion, and is not electrically connected to the grounding layer. Through the design of the first substrate stacked and embedded with the second and third substrates to form a single thin embedded antenna structure, it is possible to achieve thinness, multi-band transmission and reception of different signals, and effectively achieve the effect of automated welding and assembly.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be explained according to the preferred embodiments of the attached drawings. The present invention provides a thin embedded antenna structure 1, please refer to Figures 1A, 1B, 2A, and 2B. The thin embedded antenna structure 1 includes a first substrate 11, a second substrate 12 and a third substrate 13. The first substrate 11 is made of plastic (insulating) material and is a thin plate or a block. The first substrate 11 has a first insulating upper side 111, a first insulating lower side 116 and a first radiation metal layer 117. The first insulating lower side 116 has a grounding layer 118. The grounding layer 118 is provided with a hollow opening 1181, and the opening 1181 penetrates the center of the grounding layer 118. The first insulating upper side 111 is provided with a first recessed portion 112, which is formed by being recessed inward from the first insulating upper side 111 toward the first insulating lower side 116. The first recessed portion 112 has at least three first mounting holes 113 and at least two first conductive holes 114. The at least three first mounting holes 113 and the at least two first conductive holes 114 respectively penetrate the first insulating lower side 116 from the bottom surface of the first recessed portion 112 of the first insulating upper side 111. In this embodiment, the three first mounting holes 113 and the two first conductive holes 114 respectively penetrate the middle position of the first recessed portion 112, but the present invention is not limited thereto. Specifically, the third first mounting hole 113 is located at the center of the first recess 112, the first and second first mounting holes 113 are located at the periphery of the third mounting hole 113 and are spaced apart from each other, the two first conductive holes 114 are located at the periphery of the third first mounting hole 113 and correspond to the first and second first mounting holes 113 respectively, and the two first conductive holes 114 in FIG. 1A are formed by coating the first radiation metal layer 117 on the inner peripheral walls of the two through holes adjacent to the third first mounting hole 113 on the first recess 112 to form two conductive holes (i.e., first conductive holes 114). The first radiation metal layer 117 is disposed on the first insulating upper side 111 and the first recess 112, and extends along the two first conductive holes 114 to the first insulating lower side 116. In the present embodiment, the first radiation metal layer 117 is formed by coating (covering) the first insulating upper side 111 and the first recess 112 of the first substrate 11, and extends downward along the inner walls of the two first conductive holes 114 of the first recess 112 to the first insulating lower side 116, and passes through the opening 1181 of the grounding layer 118, and the first radiation metal layer 117 is not electrically connected to the grounding layer 118. Referring to FIG. 2B , at least one first insulating gap 115 is defined between each first mounting hole 113 of the first recess 112 and the adjacent first radiating metal layer 117. The first insulating gap 115 is located at the outer periphery of each first mounting hole 113 of the first recess 112. The first insulating upper side 111 not covered by the first radiating metal layer 117 is exposed on the first insulating gap 115, that is, the first radiating metal layer 117 is not disposed at the position of the first insulating gap 115, and the first radiating metal layer 117 is not disposed on the inner walls of the three first mounting holes 113. Continuing to refer to FIGS. 1A, 1B, and 2B, the second substrate 12 is stacked in the first recess 112 of the first substrate 11. The second substrate 12 is made of a plastic (insulating) material and is a plate-shaped body or a block-shaped body. The second substrate 12 has a second insulating upper side 121, a second insulating lower side 125, and a second radiation metal layer 126. The second insulating upper side 121 is provided with a second recess 122. The second recess 122 is formed by being recessed inwardly from the second insulating upper side 121 toward the second insulating lower side 125. The second recess 122 is provided with at least one second mounting hole 123 and at least two second mounting holes 124. The two conductive holes 124, in this embodiment, are one second mounting hole 123 and two second conductive holes 124 respectively penetrating from the bottom surface of the second recess 122 of the second insulating upper side 121 through the second insulating lower side 125, and the second mounting hole 123 of the second recess 122 is located at the center of the second recess 122 and corresponds to the third first mounting hole 113 on the first recess 112, and the two second conductive holes 124 are located at the periphery of the second mounting hole 123 and are spaced apart from each other, and the two second conductive holes 124 respectively correspond to the first and second first mounting holes 113 of the first substrate 11 below. In addition, the second conductive hole 124 in FIG. 1A is formed by coating the second radiation metal layer 126 on the inner peripheral wall of two through holes adjacent to the second mounting hole 123 on the second concave portion 122. The second insulating lower side 125 of the second substrate 12 is provided with two hollow first tubular portions 127 at positions opposite to the two second conductive holes 124. The two first tubular portions 127 are connected to the two second conductive holes 124, and the two first tubular portions 127 protrude downward from the second insulating lower side 125 opposite to the two second conductive holes 124 toward the first substrate 11, and the second substrate 12 passes through the first and second first mounting holes 123 of the first concave portion 112 through the two first tubular portions 127. 13, so that the second substrate 12 is stacked and embedded in the first recess 112 of the first substrate 11 to form a whole, and the second radiation metal layer 126 is separated from the first radiation metal layer 117 coated on the first substrate 11 by the second substrate 12 made of insulating material and is not electrically connected to each other, and the first radiation metal layer 117 of the first substrate 11 is not against the outer side of the second substrate 12, and there is a first gap space 141 between the first radiation metal layer 117 and the second substrate 12. The first insulating gap 115 is separated between the first radiation metal layer 117 coated on the first concave portion 112 of the first substrate 11 and the first tubular portion 127 in each first mounting hole 113, so that the first radiation metal layer 117 coated on the first concave portion 112 and each first tubular portion 127 do not contact each other and are not electrically connected to each other. The second radiation metal layer 126 is disposed on the second insulating upper side 121 and the second recess 122, and extends along the two second conductive holes 124 to the outside of the two first tubular portions 127. In the present embodiment, the second radiation metal layer 126 is formed by coating (covering) the second insulating upper side 121 and the second recess 122 of the second substrate 12, and extends downward along the inner wall of the two second conductive holes 124 of the second recess 122 to the outside of the two first tubular portions 127, and passes through the opening 1181 of the grounding layer 118, and the second radiation metal layer 126 is not electrically connected to the grounding layer 118. Referring to FIG. 1A , at least one second insulating gap 120 is defined between the second mounting hole 123 of the second recess 122 and the adjacent second radiating metal layer 126. The second insulating gap 120 is located at the outer periphery of the second mounting hole 123 of the second recess 122. The second insulating upper side 121 not covered by the second radiating metal layer 126 is exposed on the second insulating gap 120, that is, the second radiating metal layer 126 is not disposed on the second insulating upper side 121, and the second radiating metal layer 126 is not disposed on the inner wall of the second mounting hole 123. Referring to FIGS. 1A, 2A, 2B, and 5, the third substrate 13 is stacked in the second recess 122 of the second substrate 12. The third substrate 13 is made of a plastic (insulating) material and is a plate or a block. The third substrate 13 has a third insulating upper side 131 and a third insulating lower side 132, at least one third conductive hole 133, and a third radiation The third conductive hole 133 passes through the third insulating lower side 132 from the third insulating upper side 131 and is located in the center of the third substrate 13. Referring to FIG. 1A, the third conductive hole 133 is formed by covering the inner peripheral wall of a through hole at the center of the third insulating upper side 131 with the third radiation metal layer 134. The third insulating lower side 132 of the third substrate 13 is provided with a hollow second tubular portion 135 at a position opposite to the third conductive hole 133. The second tubular portion 135 is connected to the third conductive hole 133, and the second tubular portion 135 protrudes downward from the third insulating lower side 132 opposite to the third conductive hole 133 toward the first substrate 11. The third substrate 13 passes through the second tubular portion 135 in sequence through the second mounting hole 123 of the second recess 122 and the third first mounting hole 113 of the first recess 112, so that the third substrate 13 is stacked. The third radiation metal layer 134 is embedded in the second recess 122 of the second substrate 12 and combined into one body, and the third radiation metal layer 134 is separated from the second radiation metal layer 126 coated on the second substrate 12 by the third substrate 13 made of insulating material and is not electrically connected to each other, and the second radiation metal layer 126 of the second substrate 12 is not against the outer side of the third substrate 13, and there is a second gap space 142 between the second radiation metal layer 126 and the third substrate 13, so that the second and third substrates 12, 13 are stacked and embedded in the first substrate 11 at intervals. The first and second radiation metal layers 117 and 126 coated on the first and second insulating upper sides 111 and 121 of the first and second substrates 11 and 12 are separated from the first and second tubular portions 127 and 135 in the corresponding first and second mounting holes 113 and 123 by the first and second insulation gaps 115 and 120, so that the first and second radiation metal layers 117 and 126 coated on the first and second insulating upper sides 111 and 121 are not in contact with each other and are not electrically connected to each other. The third radiation metal layer 134 is disposed on the third insulating upper side 131 and extends along the third conductive hole 133 to the outside of the corresponding second tubular portion 135. In the present embodiment, the third radiation metal layer 134 is coated (covered) on the third insulating upper side 131 of the third substrate 13 and extends downward along the inner wall of the third conductive hole 133 to the outside of the second tubular portion 135 and passes through the opening 1181 of the grounding layer 118. The third radiation metal layer 134 is not electrically connected to the grounding layer 118. Therefore, the second substrate 12 with the third substrate 13 embedded therein is stacked and embedded in the first substrate 11, just like the second and third substrates 12, 13 are stored and accommodated in the first substrate 11, so that the first substrate 11 and the second and third substrates 12, 13 embedded therein constitute a single thin embedded antenna structure 1. In this way, the overall thickness (height) and width of the thin embedded antenna structure 1 are the thickness (height) and width of a single first substrate 11, so as to effectively achieve the effect of thinness and small volume. In addition, after the second and third substrates 12, 13 are stacked and embedded in the first substrate 11, the first radiation metal layer 117 (such as the first antenna) of the first substrate 11 can receive GPS L5/L2 signal frequency of 1100MHZ-1250MHZ. The second radiation metal layer 126 (such as the second antenna) of the second substrate 12 can receive GPS/GNSS/Beidou/QZSS signals with a frequency of 1500MHZ-1650MHZ. The third radiation metal layer 134 (such as the third antenna) of the third substrate 13 can receive SDARS/WLAN signals with a frequency of 2300MHZ-2500MHZ. The thin embedded antenna structure 1 of the present invention can achieve the effect of receiving and transmitting different signals in multiple frequency bands. Furthermore, when the thin embedded antenna structure 1 of the present invention is actually used, a circuit board 2 is provided on the bottom side of the ground layer 118 of the first substrate 11. The circuit board 2 is a printed circuit board (PCB) or a flexible circuit board (FPC). A plurality of electronic components (not shown in the figure) are provided on the circuit board 2. The electronic components are, for example, an RF chip, a baseband chip and a central processing unit (microprocessor). The first, second and third radiation metal layers 117, 126 and 134 of the first, second and third substrates 11, 12 and 13 pass through the opening 1181 of the ground layer 118 to be electrically connected to the circuit board 2. The grounding layer 118 of the first substrate 11 is soldered on one side of the circuit board 2 by surface-mount (SMT). Specifically, the thin embedded antenna structure 1 of the present invention is placed on one side of the circuit board 2, and the circuit board 2 and the thin embedded antenna structure 1 are soldered together in a soldering furnace by reflow soldering, so that the thin embedded antenna structure 1 is directly soldered on the circuit board 2 at one time, thereby effectively achieving the effects of automated soldering assembly and assembly time saving and convenience. In addition, the thin embedded antenna structure 1 of the present invention can be used as a dual-band flat antenna or a multi-band flat antenna to be applied to various electronic devices (such as navigation systems or laptops or tablet computers or GPS antenna receivers) or transportation tools (such as vehicles or ships or airplanes) or other electronic devices (such as mobile phones). In another alternative embodiment, please refer to Figures 3, 4A, and 4B. The first substrate 11 is provided with at least one first docking portion 119, and the first docking portion 119 is a groove provided on the first insulating upper side 111 adjacent to the first recessed portion 112. Specifically, the first docking portion 119 is two grooves formed on the first insulating upper side 111 on opposite sides of the first substrate 11, and the first recessed portion 112 is located between the two opposite first docking portions 119. The second base 12 is provided with at least one first receiving portion 128 and at least one second mating portion 129. The first receiving portion 128 protrudes horizontally outward from the outer side of the second base 12. The first receiving portion 128 is a part of the second base 12. Specifically, two first receiving portions 128 are formed as protrusions by plastic injection molding on two opposite outer sides of the second base 12 to be embedded (clipped) and combined with the first mating portion 119 of the first base 11. The second abutting portion 129 is a groove disposed on the second insulating upper side 121 adjacent to the second recessed portion 122. Specifically, the second abutting portion 129 is two grooves formed on the second insulating upper side 121 on opposite sides of the second substrate 12, and the second recessed portion 122 is located between the two opposite second abutting portions 129. The third substrate 13 is provided with at least one second receiving portion 136, and the second receiving portion 136 protrudes horizontally outward from the outer side of the third substrate 13. The second receiving portion 136 is a part of the third substrate 13 itself. Specifically, the two opposite outer sides of the third substrate 13 are integrally plastic-injected with two second receiving portions. The connecting portion 136 is a convex body, which is engaged (clamped) with the second connecting portion 129 corresponding to the second substrate 12. The first receiving portion 128 and the second connecting portion 129 of the second substrate 12 are respectively connected with the first connecting portion 119 corresponding to the first substrate 11 and the second receiving portion 136 of the third substrate 13, so as to effectively stabilize the connection between the first, second and third substrates 11, 12, 13 to achieve the effect of limiting the position. When the first and second connecting portions 119, 129 are designed as grooves, because the grooves have multiple areas, more areas can be provided for adding the first and second radiation metal layers 117, 126. In the above alternative embodiments, the first and second abutting portions 119 and 129 are grooves and the corresponding first and second receiving portions 128 and 136 are convex bodies, but the present invention is not limited thereto. In other alternative embodiments, the first receiving portion 128 and the first abutting portion 119 are concave and convex matching structures, and the second receiving portion 136 and the second abutting portion 129 are concave and convex matching structures. In some other embodiments, the first radiation metal layer 117 of the first substrate 11 can be supported on the outer side relative to the second substrate 12, and there is no gap between the first radiation metal layer 117 and the second substrate 12 (not shown in the figure), and the second radiation metal layer 126 of the second substrate 12 can be supported on the outer side relative to the third substrate 13, and there is no gap between the second radiation metal layer 126 and the third substrate 13. There is a gap (not shown in the figure), and the first and second radiation metal layers 117 and 126 are separated by a second substrate 12 made of an insulating material to isolate them from being electrically connected, and the second and third radiation metal layers 126 and 134 are separated by a third substrate 13 made of an insulating material to isolate them from being electrically connected, so that the second and third substrates 12 and 13 are directly stacked and accommodated in the first substrate 11. Therefore, by the design of the present invention that the second and third substrates 12 and 13 are stacked and embedded in the first substrate 11 to form a single thin embedded antenna structure 1, it is possible to achieve thinness and small size and achieve multi-band transmission and reception of different signals, and also effectively achieve the effect of automated welding assembly.

1: Thin embedded antenna structure 11: First substrate 111: First insulation upper side 112: First recess 113: First mounting hole 114: First conductive hole 115: First insulation gap 116: First insulation lower side 117: First radiation metal layer 118: Grounding layer 1181: Opening 119: First docking part 12: Second substrate 120: Second insulation gap 121: Second insulation upper side 122: Second recess 123: Second mounting hole 124: Second conductive hole 125: Second insulation lower side 126: Second radiation metal layer 127: First tubular portion 128: First receiving portion 129: Second connecting portion 13: Third substrate 131: Third insulating upper side 132: Third insulating lower side 133: Third conductive hole 134: Third radiation metal layer 135: Second tubular portion 136: Second receiving portion 141: First gap space 142: Second gap space 2: Circuit board

Figure 1A is a schematic diagram of a three-dimensional decomposition of an embodiment of the present invention. Figure 1B is a schematic diagram of another perspective of a three-dimensional decomposition of an embodiment of the present invention. Figure 2A is a schematic diagram of a three-dimensional combination of an embodiment of the present invention. Figure 2B is a schematic diagram of a combined cross-section of an embodiment of the present invention. Figure 3 is a schematic diagram of a three-dimensional decomposition of an alternative embodiment of the present invention. Figure 4A is a schematic diagram of a three-dimensional combination of an alternative embodiment of the present invention. Figure 4B is a schematic diagram of a combined cross-section of an alternative embodiment of the present invention. Figure 5 is a schematic diagram of another form of an embodiment of the present invention.

1: Thin embedded antenna structure

11: First substrate

111: Upper side of the first insulation

112: First concave portion

113: First mounting hole

114: First conductive hole

115: The first insulation gap

116: Lower side of the first insulation

117: The first radiation metal layer

118: Ground layer

1181: Opening

119: First docking part

12: Second substrate

120: Second insulation gap

121: Upper side of the second insulation

122: Second concave portion

123: Second mounting hole

124: Second conductive hole

125: Lower side of the second insulation

126: Second radiation metal layer

13: The third matrix

131: Upper side of the third insulation

132: Lower side of the third insulation

133: The third conductive hole

134: The third radiation metal layer

Claims (10)

A thin embedded antenna structure, comprising: A first substrate, having a first insulating upper side, a first insulating lower side and a first radiating metal layer, the first insulating lower side having a grounding layer, the first insulating upper side having a first recessed portion inwardly concave, the first recess having at least three first mounting holes and at least two first conductive holes, the first radiating metal layer being arranged on the first insulating upper side and the first recessed portion, and extending along the two first conductive holes to the first insulating lower side, and not electrically connected to the grounding layer; A second substrate is stacked in the first recess, the second substrate has a second insulating upper side, a second insulating lower side and a second radiation metal layer, the second insulating upper side of the second substrate is inwardly concave with a second recess, the second recess is penetrated by at least one second mounting hole and at least two second conductive holes, the second insulating lower side is provided with two hollow first tubular portions at positions opposite to the two second conductive holes, the two first tubular portions are combined in the first and second first mounting holes, The second radiation metal layer is disposed on the second insulating upper side and the second recess, and extends along the two second conductive holes to the outside of the corresponding two first tubular portions, and is not electrically connected to the ground layer; and A third substrate is stacked in the second recess. The third substrate has a third insulating upper side, a third insulating lower side, at least one third conductive hole and a third radiation metal layer. The third conductive hole penetrates the third insulating upper side and the third insulating lower side. A second hollow tubular portion is provided on the third insulating lower side at a position opposite to the third conductive hole and connected to the third conductive hole. The second tubular portion sequentially penetrates the corresponding second mounting hole and the third first mounting hole. The third radiation metal layer is provided on the third insulating upper side and extends along the third conductive hole to the outside of the corresponding second tubular portion and is not electrically connected to the grounding layer. As described in the first item of the patent application, the thin embedded antenna structure has a circuit board disposed on the bottom side of the ground layer, and the first, second and third radiation metal layers of the first, second and third substrates are electrically connected to the circuit board. As described in item 2 of the patent application scope, the first radiation metal layer is not disposed in the three first mounting holes, and the second radiation metal layer is not disposed in the second mounting hole. As described in item 1 of the patent application scope, the thin embedded antenna structure, wherein the first, second and third substrates are made of plastic material. As described in item 1 of the patent application scope, the third substrate stack is embedded in the second recess of the second substrate, and the second substrate stack embedded with the third substrate is embedded in the first substrate, so that the first substrate and the second and third substrates embedded therein constitute a single thin embedded antenna structure. As described in item 1 of the patent application, the first substrate is provided with at least one first docking portion, and the first docking portion is provided on the first insulating upper side adjacent to the first recess. As described in item 6 of the patent application, the second substrate is provided with at least one first receiving portion, and the first receiving portion protrudes outward from the outer side of the second substrate to be combined with the first connecting portion corresponding to the first substrate. As described in item 7 of the patent application, the second substrate is provided with at least one second docking portion, and the second docking portion is provided on the second insulating upper side adjacent to the second recess. As described in item 8 of the patent application, the third substrate is provided with at least one second receiving portion, and the second receiving portion protrudes outward from the outer side of the third substrate to be combined with the second docking portion corresponding to the second substrate. As described in item 9 of the patent application scope, the first receiving portion and the first mating portion are concave-convex matching or convex-concave matching structures, and the second receiving portion and the second mating portion are concave-convex matching or convex-concave matching structures.

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