TWI866382B - Driving disk lifting device of the wafer frame driving mechanism of the wafer grinding equipment - Google Patents

Abstract

The present invention provides a driving disk lifting device of a wafer frame driving mechanism of wafer grinding equipment, the driving disk lifting device includes a base, a shift and a bearing seat, wherein the base is provided with two motors, each of the motors drive a linear transmission structure respectively, and the moving seat is connected to each of the linear transmission structures, so that the moving seat moves back and forth along a path parallel to an axis, the bearing seat is connected to the moving seat, and the inner pivot of the bearing seat i.e the first bearing group is used to drive a drive shaft that rotates a first drive disc to pass through the first bearing group, the bearing seat, the first bearing group and the drive shaft are relatively positioned in the direction of the axis, the first driving disk moves back and forth relative to a wafer rack, thereby prolonging the replacement cycle of the first driving disk.

Description

Driving plate lifting device of wafer rack driving mechanism of wafer polishing equipment

The present invention relates to a component of a wafer polishing device; in particular, it discloses an innovative structural form of a driving plate lifting device of a wafer rack driving mechanism of a wafer polishing device.

The wafer grinding equipment includes a wafer rack driving mechanism and two rotatable grinding discs, wherein a plurality of wafers are arranged on a wafer rack, and a robot arm transfers one to a plurality of wafer racks to the wafer rack driving mechanism, and the wafer rack driving mechanism drives each of the wafer racks to operate, and each of the grinding discs performs grinding processing on two surfaces of each of the wafers arranged on each of the wafer racks, and each of the surfaces is located on two opposite sides of the wafer in the thickness direction.

The wafer rack driving mechanism includes a first drive disk in the shape of a disk and a second drive disk in the shape of a ring, wherein the first drive disk is driven to rotate by a power device, a plurality of first protruding teeth are arranged at intervals along the circumferential direction of the first drive disk on the radial outer periphery of the first drive disk, the second drive disk surrounds the radial outer portion of the first drive disk, the radial centers of the first drive disk and the second drive disk are concentric, the second drive disk is driven by the power device to rotate around the first drive disk, and a plurality of first protruding teeth are arranged at intervals along the circumferential direction on the radial inner periphery of the second drive disk The wafer rack has a first drive disk and a second drive disk, and a plurality of third drive teeth are arranged at intervals along the circumferential direction on the radial outer periphery of the wafer rack. The wafer rack is arranged between the radial outer periphery of the first drive disk and the radial inner periphery of the second drive disk. The wafer rack engages the first drive disk and the second drive disk. The first drive disk and the second drive disk jointly drive the wafer rack to circulate around the first disk along a circular path with the radial center of the first drive disk as the center. While the wafer rack circulates around the first drive disk, the wafer rack rotates with its radial center as the center.

The wafer rack drive mechanism has been found to have the following problems and drawbacks in actual application experience: the first drive disk and the second drive disk jointly drive the wafer rack to operate, the first protrusion and the second protrusion are in contact and friction with the third protrusion respectively, and the first protrusion, the second protrusion and the third protrusion gradually form friction wear. The friction wear causes one to several gaps to be formed between the first protrusion, the second protrusion and the third protrusion that are engaged with each other. The gap between the three protruding teeth gradually expands as the wafer rack driving mechanism continues to drive the wafer rack to operate, the clamping density between the wafer rack driving mechanism and the wafer rack gradually decreases, and the friction wear phenomenon gradually intensifies. When the gap expands to a level sufficient to affect the stability of the wafer rack operation, it is not conducive to the wafer rack maintaining its spatial positioning relative to each grinding disc, affecting the flatness of each surface of the wafer being ground.

Timely replacement of the wafer rack with a larger degree of wear of the third cam can eliminate the influence caused by the wear of the third cam, and is easy to implement and low in cost, and the wafer grinding equipment does not need to stop running, but cannot eliminate the influence of the wear of the first cam and the second cam. The wear of the first cam and the second cam easily causes the effectiveness of the first drive disk and the second drive disk driving the wafer rack to operate to gradually decrease. Replacement of the first cam The first drive disk and the second drive disk can solve the aforementioned problems of the stability and effectiveness of the wafer rack operation. However, the wafer polishing equipment needs to stop operating to replace the first drive disk and the second drive disk. The replacement operation of the first drive disk and the second drive disk is complicated and costly. Replacement and post-replacement testing take a long time. If the first drive disk or the second drive disk needs to be replaced frequently, the operating efficiency of the wafer polishing equipment will be affected.

The main purpose of the present invention is to provide a drive plate lifting device for a wafer rack drive mechanism of a wafer polishing device. The technical problem it aims to solve is to explore and innovate a new type of wafer rack drive mechanism that is more ideal and practical.

Based on the above purpose, the technical features of the present invention to solve the problem mainly lie in the driving plate lifting device of the wafer rack driving mechanism of the wafer polishing equipment, which is used to drive a first disc-shaped driving plate and a second ring-shaped driving plate of the wafer rack driving mechanism to reciprocate along a virtual axis, and the second driving plate is arranged around the radial outside of the first driving plate, so that a wafer rack is mounted on the first driving plate. The first drive disk and the second drive disk are respectively disposed between the radial outer periphery of the first drive disk and the radial inner periphery of the second drive disk, so that the two grinding disks grind two opposite surfaces of the wafer disposed on the wafer rack, the radial centers of the first drive disk and the second drive disk are concentric, a power device drives the first drive disk to rotate through a drive shaft, and the power device drives a connecting frame to rotate through a transmission structure, and the connecting frame is connected to the second drive disk;

The radial outer circumference of the first driving disk is provided with a plurality of first protrusions at intervals along the circumferential direction, and the radial inner circumference of the second driving disk is provided with a plurality of second protrusions at intervals along the circumferential direction. The first driving disk and the second driving disk drive the wafer frame to circulate around the first driving disk through the first protrusions and the second protrusions respectively.

The driving plate lifting device comprises:

A base, the base is provided with two motors, each of the motors drives a linear transmission structure respectively;

A moving seat, the moving seat and the base are opposite to each other along the direction of the axis, the moving seat is connected to each of the linear transmission structures, and each of the motors drives the moving seat to reciprocate along a path parallel to the axis through each of the linear transmission structures;

A bearing seat is connected to the moving seat, and the inner shaft of the bearing seat pivots on a first bearing group. The first bearing group is composed of a plurality of first bearings arranged in sequence along the axial direction. The driving shaft axially pivots through the first bearing group. The bearing seat, the first bearing group and the driving shaft are relatively positioned in the direction of the axis, so that the first driving disk reciprocates along the axis.

The main effect and advantage of the present invention is that it can drive the first drive disk to move along the axis relative to the wafer frame, change the part of each first protrusion that contacts and engages the wafer frame, extend the cycle of the first drive disk replacement, and improve the operating efficiency of the wafer polishing equipment.

Please refer to the drawings, which are preferred embodiments of the present invention. However, these embodiments are for illustrative purposes only and are not limited to these structures in patent applications.

The wafer grinding equipment is a grinding equipment specially used for grinding wafers, which has a wafer rack driving mechanism for driving the wafer rack and two grinding discs. The wafer rack is used to place one to several wafers, and each grinding disc is used to grind two opposite surfaces of each wafer along the thickness direction.

As shown in FIG. 1 , the wafer rack driving mechanism of the wafer polishing device includes a first drive disk 11 in the form of a disk and a second drive disk 12 in the form of an annular ring, wherein the second drive disk 12 is disposed around the radial outer portion of the first drive disk 11, so that one or more wafer racks 90 are disposed between the radial outer periphery of the first drive disk 11 and the radial inner periphery of the second drive disk 12, so that each grinding disk (not shown) is disposed on the wafer rack 90. The surfaces 922 of the wafer 92 of the circular frame 90 that are opposite to each other in the thickness direction, the radial centers C of the first drive disk 11 and the second drive disk 12 are concentric, a power device (not shown) drives the first drive disk 11 to rotate through a drive shaft 13 (as shown in Figures 2 and 3), and the power device drives a connecting frame 14 (as shown in Figure 3) to rotate through a transmission structure (not shown), and the connecting frame 14 is connected to the second drive disk 12.

Each of the grinding discs, the power device and the transmission structure are existing technologies familiar to people with ordinary knowledge in the technical field to which the present invention belongs, and each of the grinding discs, the power device and the transmission structure does not involve the technical features of the present invention, and their specific structures will not be described in detail.

The radial outer circumference of the first driving disk 11 is provided with a plurality of first protrusions 112 at intervals along the circumferential direction, the radial inner circumference of the second driving disk 12 is provided with a plurality of second protrusions 122 at intervals along the circumferential direction, and the radial outer circumference of the wafer rack 90 is provided with a plurality of third protrusions 91 at intervals along the circumferential direction. The wafer rack 90 engages the first driving disk 11 and the second driving disk 12, and the first driving disk 11 and the second driving disk 12 respectively drive the wafer rack 90 to circulate around the first driving disk 11 through the first protrusions 112 and the second protrusions 122.

As shown in FIGS. 2 to 6 , the drive plate lifting device of the wafer rack drive mechanism of the wafer polishing equipment of the present invention is specifically used to drive the first drive plate 11 and the second drive plate 12 of the wafer rack drive mechanism to reciprocate along a virtual axis L, and the axis L is selected to pass through the radial center C along the axial direction of the drive axis 13.

The drive plate lifting device includes a base 20, a moving base 30 and a bearing base 40, wherein the base 20 is provided with two motors 21, each of which drives a linear transmission structure 22, the moving base 30 and the base 20 are opposite to each other along the direction of the axis L, the moving base 30 is connected to each of the linear transmission structures 22, and each of the motors 21 drives the moving base 30 along the axis L parallel to the axis L through each of the linear transmission structures 22. The bearing seat 40 is connected to the moving seat 30, and the inner shaft of the bearing seat 40 is pivoted with a first bearing assembly 50. The first bearing assembly 50 is composed of a plurality of first bearings 52 arranged in sequence along the axial direction. The drive shaft 13 axially passes through the first bearing assembly 50. The bearing seat 40, the first bearing assembly 50 and the drive shaft 13 are relatively positioned in the direction of the axis L, so that the first drive disk 11 reciprocates along the axis L.

The number of the first bearings 52 constituting the first bearing assembly 50 can be increased or decreased as needed, but is limited to at least one first bearing 52.

Each of the motors 21 drives each of the linear transmission structures 22 to move synchronously. Each of the linear transmission structures 22 drives the moving seat 30 to move along a path parallel to the axis L. The bearing seat 40 moves along with the moving seat 30. Since the bearing seat 40, the first bearing assembly 50 and the drive shaft 13 are relatively positioned in the direction of the axis L, the drive shaft 13 moves along with the first bearing assembly 50 and the bearing seat 40, so that the first drive plate 11 By moving along the axis L relative to the wafer rack 90, the portion where each of the first teeth 112 contacts and engages with each of the third teeth 91 is changed, and the service life of each of the first teeth 112 until replacement is required due to overall friction wear can be effectively extended, and the replacement cycle of the first drive disk 11 can be extended. The operating time of the wafer polishing equipment between two replacement operations of the first drive disk 11 can be extended, thereby improving the operating efficiency of the wafer polishing equipment.

Specifically, the bearing seat 40 radially forms an annular first stopper 41, and the bearing seat 40 is connected to an annular first limiting member 42, the drive shaft 13 radially forms an annular first annular surface 132, an annular spiral ring 43 is screwed onto the drive shaft 13, the first stopper 41 and the first annular surface 132 jointly abut against one axial end of the first bearing assembly 50, the first limiting member 42 and the spiral ring 43 jointly abut against the other axial end of the first bearing assembly 50, so that the bearing seat 40, the first bearing assembly 50 and the drive shaft 13 are relatively positioned in the direction of the axis L.

A transmission assembly 16 is assembled by a plurality of bolts 15 at one end of the drive shaft 13 away from the first drive plate 11, so that the power device drives the drive shaft 13 to rotate through the transmission assembly 16, thereby driving the first drive plate 11 to rotate.

The preferred embodiment selectively further includes two support members 32, each of which is connected to the moving base 30, and each of which is connected to a circular pivot seat 60 in a direction parallel to the axis L and away from the moving base 30. The radial outer peripheral axis of the pivot seat 60 pivots on a second bearing assembly 70, and the second bearing assembly 70 is composed of a plurality of second bearings 72 arranged in sequence along the axial direction. The second bearing assembly 70 pivots on the connecting frame 14, and the pivot seat 60, the second bearing assembly 70 and the connecting frame 14 are relatively positioned in the direction of the axis L, so that the second drive disk 12 reciprocates along the axis L.

The number of the second bearings 72 constituting the second bearing assembly 70 can be increased or decreased as needed, but is limited to at least one second bearing 72.

When the moving seat 30 is displaced along a path parallel to the axis L, the pivot seat 60 is displaced along with the moving seat 30. Since the pivot seat 60, the second bearing assembly 70 and the connecting frame 14 are relatively positioned in the direction of the axis L, the connecting frame 14 is displaced along with the second bearing assembly 70 and the pivot seat 60, so that the second drive plate 12 is moved along the axis L relative to the wafer rack 90. Changing the portion where each second tooth 122 contacts and engages with each third tooth 91 can effectively extend the service life of each second tooth 122 until it is replaced due to overall friction wear, extend the replacement cycle of the second drive disk 12, and extend the operating time of the wafer polishing equipment between two replacement operations of the second drive disk 12, thereby improving the operating efficiency of the wafer polishing equipment.

The pivot seat 60 forms an annular second stop portion 61, and the pivot seat 60 is connected to an annular second limiting member 62, the connecting frame 14 is connected to an annular abutting member 63, and the connecting frame 14 forms an annular second annular surface 142, the second annular surface 142 and the second limit member 62 jointly abut against one axial end of the second bearing assembly 70, the abutting member 63 and the second stop portion 61 jointly abut against the other axial end of the second bearing assembly 70, so that the pivot seat 60, the second bearing assembly 70 and the connecting frame 14 are relatively positioned in the direction of the axis L.

In accordance with the structure of the preferred embodiment, the length of each of the first protrusions 112 and each of the second protrusions 122 relative to each of the third protrusions 91 in the direction of the axis L can be selectively changed, thereby changing the replacement cycle of the first drive disk 11 and the second drive disk 12.

The base 20 is selectively connected to two guide rails 23, and the axes of the guide rails 23 are respectively parallel to the axis L. The moving seat 30 is connected to two sliding members 34, and each guide rail 23 passes through each sliding member 34. Accordingly, each guide rail 23 cooperates with each sliding member 34 to guide the moving seat 30 to reciprocate along a path parallel to the axis L.

Each of the linear transmission structures 22 includes a screw 222 and a screw tube 224. Each of the screws 222 is pivotally connected to the base 20, and each of the screw tubes 224 is connected to the moving seat 30. Each of the screws 222 is threadedly connected to the corresponding screw tubes 224. Each of the motors 21 drives each of the screws 222 to rotate synchronously, and each of the screws 222 drives the moving seat 30 to linearly move through each of the screw tubes 224.

11: First drive disc

112: First tooth

12: Second drive disc

122: Second tooth

13: Drive shaft

132: First Ring

14:Connection frame

142: Second Ring

15: Bolt

16: Transmission components

20: Base

21: Motor

22: Linear transmission structure

222: Screw

224:Screw

23:Guide rail

30: Mobile seat

32: Support

34: Sliding piece

40: Bearing seat

41: first stopper

42: First stopper

43: Screw ring

50: First bearing assembly

52: First bearing

60: hinge

61: Second stopper

62: Second stopper

63: Abutment

70: Second bearing assembly

72: Second bearing

90: Wafer rack

91: Third tooth

92: Wafer

922: Surface

C: radial center

L:Axis

FIG. 1 is a partial top view schematic diagram of the first drive plate and the second drive plate of the wafer rack drive mechanism driving the wafer rack. FIG. 2 is a three-dimensional schematic diagram of a partial structure of a preferred embodiment of the present invention. FIG. 3 is a cross-sectional view of a preferred embodiment of the present invention. FIG. 4 is a partial enlarged view of FIG. 3, showing a portion of the bearing seat and the first bearing assembly. FIG. 5 is a partial enlarged view of FIG. 3, showing a portion of the pivot seat and the second bearing assembly. FIG. 6 is a partial enlarged view of FIG. 3, showing a portion of the linear transmission structure.

13: Drive shaft

20: Base

21: Motor

22: Linear transmission structure

222: Screw

23:Guide rails

30: Mobile seat

32: Support parts

34: Sliding parts

60: hinged socket

L: axis

Claims (6)

A drive plate lifting device for a wafer rack driving mechanism of a wafer polishing device, the drive plate lifting device is used to drive a first disk-shaped drive plate and a second ring-shaped drive plate of the wafer rack driving mechanism to reciprocate along a virtual axis, the second drive plate is arranged around the radial outer side of the first drive plate, so that a wafer is mounted on the radial outer periphery of the first drive plate. and the radial inner periphery of the second driving disk, so that the two grinding disks respectively grind the two opposite surfaces of the wafer arranged on the wafer rack, the radial centers of the first driving disk and the second driving disk form a concentricity, a power device drives the first driving disk to rotate through a driving shaft, the power device drives a connecting frame to rotate through a transmission structure, and the connecting frame is connected to the second driving disk; The radial outer circumference of the first driving disk is provided with a plurality of first protrusions at intervals along the circumferential direction, and the radial inner circumference of the second driving disk is provided with a plurality of second protrusions at intervals along the circumferential direction. The first driving disk and the second driving disk respectively drive the wafer rack to circulate around the first driving disk through the first protrusions and the second protrusions; The driving disk lifting device comprises: A base, the base is provided with two motors, and each of the motors drives a linear transmission structure respectively; A moving seat, the moving seat and the base are opposite to each other along the direction of the axis, the moving seat is connected to each of the linear transmission structures, and each of the motors drives the moving seat to reciprocate along a path parallel to the axis through each of the linear transmission structures; A bearing seat is connected to the moving seat, the inner shaft of the bearing seat pivots on a first bearing group, the first bearing group is composed of a plurality of first bearings arranged in sequence along the axial direction, the drive shaft axially pivots on the first bearing group, the bearing seat, the first bearing group and the drive shaft are relatively positioned in the direction of the axis, so that the first drive disk reciprocates along the axis. The drive plate lifting device of the wafer rack driving mechanism of the wafer polishing equipment as described in claim 1, wherein two support members are respectively connected to the moving seat, and each support member is connected to a circular pivot seat in a direction parallel to the axis away from the moving seat, and the radial outer peripheral axis of the pivot seat pivots on a second bearing group, and the second bearing group is composed of a plurality of second bearings arranged in sequence along the axial direction, and the second bearing group pivots on the connecting frame, and the pivot seat, the second bearing group and the connecting frame are relatively positioned in the direction of the axis, so that the second drive plate reciprocates along the axis. The drive plate lifting device of the wafer rack driving mechanism of the wafer polishing equipment as described in claim 1, wherein the base is connected to two guide rails, the axes of each guide rail are respectively parallel to the axis, and the moving seat is connected to two sliding parts, and each guide rail passes through each sliding part. The drive plate lifting device of the wafer rack driving mechanism of the wafer polishing equipment as described in claim 1, wherein each of the linear transmission structures includes a screw and a screw tube, each of the screws is respectively pivotally connected to the base, each of the screw tubes is respectively connected to the moving base, and each of the screws is respectively screwed to the corresponding screw tubes. A drive plate lifting device for a wafer rack driving mechanism of a wafer polishing device as described in claim 1, wherein the bearing seat radially forms an annular first stopper, and the bearing seat is connected to an annular first limiting member, the driving shaft radially forms an annular first annular surface, an annular spiral ring is screwed onto the driving shaft, the first stopper and the first annular surface jointly abut against one axial end of the first bearing assembly, the first limiting member and the spiral ring jointly abut against the other axial end of the first bearing assembly, so that the bearing seat, the first bearing assembly and the driving shaft are relatively positioned in the direction of the axis. A drive plate lifting device for a wafer rack driving mechanism of a wafer polishing device as described in claim 2, wherein the pivot seat forms an annular second stop portion, and the pivot seat is connected to an annular second limiting member, the connecting frame is connected to an annular abutting member, and the connecting frame forms an annular second annular surface, the second annular surface and the second limit member jointly abut against one axial end of the second bearing assembly, and the abutting member and the second stop portion jointly abut against the other axial end of the second bearing assembly, so that the pivot seat, the second bearing assembly and the connecting frame are relatively positioned in the direction of the axis.

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