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TWI865823B - Heating tip unit - Google Patents

Heating tip unit Download PDF

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Publication number
TWI865823B
TWI865823B TW110133049A TW110133049A TWI865823B TW I865823 B TWI865823 B TW I865823B TW 110133049 A TW110133049 A TW 110133049A TW 110133049 A TW110133049 A TW 110133049A TW I865823 B TWI865823 B TW I865823B
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Taiwan
Prior art keywords
temperature measuring
heating nozzle
wire
soldering iron
fixing
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TW110133049A
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Chinese (zh)
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TW202211744A (en
Inventor
須賀伸一郎
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日商阿波羅技研股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides a heating tip unit which can make a temperature measuring part of a temperature sensor fully contact a fixing portion of a heating tip. In particular, the present invention provides a heating tip unit 1 in which a thermocouple 3 is installed on a plate-shaped heating tip 2 for thermocompression bonding a terminal wire to a terminal member, wherein the heating tip 2 is provided with: a soldering iron 6 which has a soldering iron front end 13 to be abutted against a terminal wire on a soldering iron body 11; a pair of connecting arms 7which extend upward from the left and right ends of the soldering iron body 11 so as to be separated from each other, and allow a current from a power source to flow in the soldering iron body 11 to raise the temperature of the soldering iron 6; and a temperature-measuring fixing part 35 which is provided on the soldering iron 6 with a temperature measuring contact 3a of the thermocouple 3 being fixed thereon. The temperature-measuring fixing part 35 has a pair of fixing contact surfaces 35a for the temperature measuring contacts 3a to contact, and is set in such a state that the separating distance between the fixing contact surfaces 35a gradually expands from the soldering iron 6 side to the upper side.

Description

加熱嘴單元 Heating nozzle unit

本揭示係關於一種用以將端子用導線予以熱壓接於端子構件的加熱嘴單元。 The present disclosure relates to a heating nozzle unit for hot pressing a terminal wire to a terminal component.

將端子用導線予以熱壓接於端子構件的作業,例如在製造晶片電感器(chip inductor)等電子零件時於將導線予以熱壓接於鐵心之端子部的作業中,係使用熱壓接用的加熱嘴單元。具體而言,係將熱電偶作為溫度感測器安裝於烙鐵部會升溫的加熱嘴上而構成加熱嘴單元,且將此加熱嘴單元予以安裝至熱壓接裝置的工具保持器(tool holder)。再者,使熱壓接裝置作動,將載置於端子構件上的端子用導線藉由加熱嘴的烙鐵部予以加壓同時急速加熱,而將端子用導線予以熱壓接至端子構件(例如參照專利文獻1)。 The operation of hot-pressing the terminal wire to the terminal component, for example, in the operation of hot-pressing the wire to the terminal part of the iron core when manufacturing electronic parts such as chip inductors, uses a hot-pressing nozzle unit. Specifically, a thermocouple is installed as a temperature sensor on a heating nozzle whose soldering part heats up to form a heating nozzle unit, and this heating nozzle unit is installed on a tool holder of a hot-pressing device. Furthermore, the hot-pressing device is activated to pressurize the terminal wire placed on the terminal component by the soldering part of the heating nozzle and heat it rapidly, so that the terminal wire is hot-pressed to the terminal component (for example, refer to patent document 1).

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

專利文獻1:日本特開2001-284781號公報 Patent document 1: Japanese Patent Publication No. 2001-284781

不過,在上述專利文獻所記載的加熱嘴(加熱嘴單元)中,係將熱電偶的芯線穿過加熱嘴的貫通孔,且在此狀態下進行電弧熔接,而與測溫接點(溫度感測器的測溫部)的形成和測溫接點對於加熱嘴的固著(接合)同時地進行。然而,有時亦會有因為熔接不良而無法形成測溫接點而只有芯線接合於加熱嘴,使得良率不佳。因此,較佳為在固著加熱嘴之前預先形成測溫接點,且使此測溫接點(測溫部)充分地接觸加熱嘴,且在此狀態下進行固著。 However, in the heating nozzle (heating nozzle unit) described in the above patent document, the core wire of the thermocouple is passed through the through hole of the heating nozzle, and arc welding is performed in this state, and the formation of the temperature measuring junction (temperature measuring part of the temperature sensor) and the fixing (joining) of the temperature measuring junction to the heating nozzle are performed simultaneously. However, sometimes the temperature measuring junction cannot be formed due to poor welding, and only the core wire is joined to the heating nozzle, resulting in poor yield. Therefore, it is better to form the temperature measuring junction in advance before fixing the heating nozzle, and make this temperature measuring junction (temperature measuring part) fully contact the heating nozzle, and fix it in this state.

本發明係有鑑於上述的情形而研創者,其目的為提供一種可使溫度感測器的測溫部充分地接觸加熱嘴之固著部位的加熱嘴單元。 The present invention was developed in view of the above situation, and its purpose is to provide a heating nozzle unit that allows the temperature measuring part of the temperature sensor to fully contact the fixing part of the heating nozzle.

本發明係為了達成上述目的而提出者,項1所述者係一種加熱嘴單元,該加熱嘴單元係將溫度感測器安裝在用以將端子用導線予以熱壓接於端子構件之板狀的加熱嘴上而成者, The present invention is proposed to achieve the above-mentioned purpose. Item 1 is a heating nozzle unit, which is formed by installing a temperature sensor on a plate-shaped heating nozzle used to heat-press the terminal wire to the terminal component.

前述加熱嘴係具備: The aforementioned heating nozzle is equipped with:

烙鐵部,係在烙鐵本體具備有抵接於前述端子用導線的烙鐵前端部而成者; The soldering iron part is formed by the soldering iron body having a front end of the soldering iron that abuts against the aforementioned terminal wire;

一對連接臂部,係以從前述烙鐵本體的左右端部朝上方彼此離開的狀態延伸,且使來自電源的電流流通於烙鐵本體而使烙鐵部升溫;及 A pair of connecting arms extend upward from the left and right ends of the aforementioned soldering iron body and separate from each other, and allow current from a power source to flow through the soldering iron body to increase the temperature of the soldering iron portion; and

測溫固著部,係設於前述烙鐵部,且供溫度感測器的測溫部固著, The temperature measuring fixing part is arranged on the aforementioned soldering iron part, and is used to fix the temperature measuring part of the temperature sensor.

前述測溫固著部係具備供測溫部接觸的一對固著接觸面,且設定為固著接觸面彼此的離開距離隨著從烙鐵部側朝向上方而逐漸擴開的狀態。 The aforementioned temperature measuring fixed part has a pair of fixed contact surfaces for the temperature measuring part to contact, and the fixed contact surfaces are set to be separated from each other in a state where the distance between them gradually expands from the side of the soldering iron part toward the top.

項2所述者係如項1所述之加熱嘴單元,將前述固著接觸面以平面來構成,且將前述測溫部以球狀體來構成。 Item 2 is a heating nozzle unit as described in Item 1, wherein the aforementioned fixing contact surface is formed as a plane, and the aforementioned temperature measuring part is formed as a sphere.

項3所述者係如項2所述之加熱嘴單元,將前述連接臂部彼此的間隙作為導線收納空部而將溫度感測器的導線收納至導線收納空部, Item 3 is a heating nozzle unit as described in Item 2, wherein the gap between the aforementioned connecting arms is used as a wire storage space and the wires of the temperature sensor are stored in the wire storage space.

且使前述固著接觸面相對向於導線收納空部的端部。 And the aforementioned fixing contact surface is opposite to the end of the wire storage space.

項4所述者係如項1至3中任一項所述之加熱嘴單元,其中,前述加熱嘴係至少在前述烙鐵部和測溫固著部的表面形成有耐氧化性覆膜層。 Item 4 is a heating nozzle unit as described in any one of items 1 to 3, wherein the heating nozzle has an oxidation-resistant coating layer formed on at least the surface of the soldering part and the temperature measuring fixing part.

項5所述者係如項4所述之加熱嘴單元,係在固著於前述測溫固著部之測溫部的表面形成有耐氧化性覆膜層。 Item 5 is a heating nozzle unit as described in Item 4, wherein an oxidation-resistant coating layer is formed on the surface of the temperature measuring portion fixed to the aforementioned temperature measuring fixing portion.

項6所述者係如項4或5所述之加熱嘴單元,其中,前述耐氧化性覆膜層為鎳覆膜。 Item 6 is a heating nozzle unit as described in Item 4 or 5, wherein the oxidation-resistant coating layer is a nickel coating.

依據本發明,可達成下列優異的功效。 According to the present invention, the following excellent effects can be achieved.

依據項1所述之發明,由於前述測溫固著部係具備供測溫部接觸的一對固著接觸面,且設定為固著接觸面彼此的離開距離隨著從烙鐵部側朝向上方而逐漸擴開的狀態,故可使溫度感測器的測溫部充分地接觸測溫固著部。因此,可構成能夠進行測溫部對於加熱嘴之良好的固著,進而可進行良好之測溫的加熱嘴單元。 According to the invention described in item 1, since the aforementioned temperature measuring fixing part has a pair of fixing contact surfaces for the temperature measuring part to contact, and the distance between the fixing contact surfaces is set to gradually expand from the side of the soldering part to the top, the temperature measuring part of the temperature sensor can fully contact the temperature measuring fixing part. Therefore, a heating nozzle unit can be constructed that can perform good fixing of the temperature measuring part to the heating nozzle, and thus can perform good temperature measurement.

依據項2所述之發明,由於將前述固著接觸面以平面來構成,且將前述測溫部以球狀體來構成,故測溫部易於對於固著接觸面進行點接觸。此外,若將測溫部壓抵於固著接觸面,則應力易於集中而使測溫部不易從固著接觸面浮起。藉此,即可更良好地將測溫部固著於加熱嘴,進而更良好地進行加熱嘴的測溫。 According to the invention described in item 2, since the aforementioned fixing contact surface is formed as a plane and the aforementioned temperature measuring part is formed as a sphere, the temperature measuring part is easy to make point contact with the fixing contact surface. In addition, if the temperature measuring part is pressed against the fixing contact surface, the stress is easy to concentrate and the temperature measuring part is not easy to float from the fixing contact surface. In this way, the temperature measuring part can be fixed to the heating nozzle more effectively, and the temperature measurement of the heating nozzle can be performed more effectively.

依據項3所述之發明,由於將前述連接臂部彼此的間隙作為導線收納空部而將溫度感測器的導線收納至導線收納空部,且使前述固著接觸面相對向於導線收納空部的端部,故若在將測溫部作為前頭的狀態下將溫度感測器插入至導線收納空部,即可使測溫部簡單地抵接至固著接觸面。因此,可順暢地進行將溫度感測器的測溫部固著於測溫固著部的準備。 According to the invention described in item 3, since the gap between the aforementioned connecting arms is used as the wire storage space and the wires of the temperature sensor are stored in the wire storage space, and the aforementioned fixing contact surface is made to face the end of the wire storage space, if the temperature sensor is inserted into the wire storage space with the temperature measuring part at the front, the temperature measuring part can be easily abutted against the fixing contact surface. Therefore, preparations for fixing the temperature measuring part of the temperature sensor to the temperature measuring fixing part can be smoothly performed.

依據項4至6所述之發明,即使反復進行升溫與冷卻,亦可抑制表面的氧化,且可使耐久性提升。 According to the invention described in items 4 to 6, even if the temperature is repeatedly raised and cooled, surface oxidation can be suppressed and durability can be improved.

1:加熱嘴單元 1: Heating nozzle unit

2,2’:加熱嘴 2,2’: Heating nozzle

3:熱電偶 3: Thermocouple

3a:測溫接點 3a: Temperature measurement junction

3b:導線 3b: Conductor wire

6,6’:烙鐵部 6,6’: Iron-making department

7:連接臂部 7: Connecting arm

11:烙鐵本體 11: Soldering iron body

13:烙鐵前端部 13: Front end of soldering iron

13a:烙鐵前端面 13a: Front end of soldering iron

15:烙鐵凹部 15: Soldering iron recess

17:裝設孔 17: Mounting hole

20,20’:溝 20,20’: Groove

21:薄壁部 21: Thin wall part

25:芯線 25: Core wire

26:芯線被覆材 26: Core wire coating material

27:外側被覆材 27: External covering material

30:導線收納空部 30: Wire storage space

30a:開放口 30a: Open mouth

31:擋止凹部 31: Stopping recess

32:導線擋止部 32: Wire stopper

35:測溫固著部 35: Temperature measurement and fixing part

35a:固著接觸面 35a: Fixed contact surface

36:凹槽 36: Groove

40:烙鐵空間部 40: Iron space

A:端子用導線 A: Wire for terminal

B:端子構件 B: Terminal components

t1,t2:厚度 t1,t2: thickness

圖1係加熱嘴單元的立體圖。 Figure 1 is a three-dimensional diagram of the heating nozzle unit.

圖2係加熱嘴的說明圖,(a)係俯視圖,(b)係前視圖,(c)係仰視圖,(d)係側視圖。 Figure 2 is an explanatory diagram of the heating nozzle, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.

圖3係加熱嘴之測溫固著部的說明圖,(a)係前視圖,(b)係剖面圖。 Figure 3 is an explanatory diagram of the temperature measuring fixing part of the heating nozzle, (a) is a front view, and (b) is a cross-sectional view.

圖4係將熱電偶安裝於加熱嘴之程序的說明圖,(a)係將熱電偶插入於加熱嘴內之前的狀態,(b)係熱電偶插入於加熱嘴內之後的狀態,(c)係將樹脂作為導線擋止部注入於導線收納空部和擋止凹部後的狀態。 Figure 4 is an explanatory diagram of the procedure for installing a thermocouple in a heating nozzle, (a) is the state before the thermocouple is inserted into the heating nozzle, (b) is the state after the thermocouple is inserted into the heating nozzle, and (c) is the state after resin is injected into the wire storage space and the blocking recess as a wire stopper.

圖5係具備有二個烙鐵部之加熱嘴的立體圖。 Figure 5 is a three-dimensional diagram of a heating nozzle with two soldering parts.

圖6係具備有二個烙鐵部之加熱嘴的說明圖,(a)係俯視圖,(b)係前視圖,(c)係仰視圖,(d)係側視圖。 Figure 6 is an explanatory diagram of a heating nozzle having two soldering parts, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.

以下根據圖式來說明用以實施本發明的型態。 The following is an illustration of the form used to implement the present invention.

如圖1和圖2所示,加熱嘴單元1係具備下列而構成:板狀的加熱嘴2,係用以將端子用導線A予以熱壓接於端子構件B(參照圖2(d));及熱電偶3,係作為溫度感測器而安裝於加熱嘴2。加熱嘴2係藉由線放電加工將導電性材料(鎢、鉬、超硬材等)的板材予以加工而成形的嘴,且如圖2所示具備下列構件而構成:烙鐵部6,係成為該加熱嘴2的下部(位於工件(端子用導線A或端子構件B)側的前端部);及左右一對的連接臂部7,係成為上部(基部)。再者,可使烙鐵部6在經由連接臂部7而通電至烙鐵部6時藉由電阻來發熱,且可藉由熱電偶3來測量烙鐵部6的溫度。 As shown in Fig. 1 and Fig. 2, the heating nozzle unit 1 is composed of the following: a plate-shaped heating nozzle 2 for hot-pressing the terminal wire A to the terminal member B (refer to Fig. 2 (d)); and a thermocouple 3 installed on the heating nozzle 2 as a temperature sensor. The heating nozzle 2 is a nozzle formed by processing a plate of a conductive material (tungsten, molybdenum, superhard material, etc.) by wire discharge machining, and as shown in Fig. 2, it is composed of the following components: a soldering iron part 6, which is the lower part of the heating nozzle 2 (the front end located on the side of the workpiece (terminal wire A or terminal member B)); and a pair of left and right connecting arm parts 7, which are the upper part (base). Furthermore, the soldering part 6 can generate heat through resistance when electricity is supplied to the soldering part 6 via the connecting arm part 7, and the temperature of the soldering part 6 can be measured by the thermocouple 3.

烙鐵部6係具備將連接臂部7之下部彼此予以連接之橫長的烙鐵本體11,且將該烙鐵本體11的橫寬度(沿著一對連接臂部7所排列之橫方向的尺寸)設定為隨著朝向加熱嘴2之下部而逐漸地變窄的狀態。此外,在稍向下方突出之烙鐵本體11的底部,係朝向下方突設有盒狀的烙鐵前端部13,且使該烙鐵前端部13的底面(前端面)作為烙鐵前端面13a而可抵接至端子用導線A。再者,在位於與烙鐵本體11之烙鐵前端部13相反側的上部(連接臂部7側)形成有大致矩形的烙鐵凹部15,且於該烙鐵凹 部15內固著有熱電偶3的測溫接點(測溫部)3a。另外,關於供測溫接點3a固著的構成,將於之後詳細說明。 The soldering part 6 includes a horizontally long soldering body 11 for connecting the lower parts of the connecting arms 7, and the horizontal width (the dimension along the horizontal direction in which the pair of connecting arms 7 are arranged) of the soldering body 11 is set to be gradually narrowed toward the lower part of the heating nozzle 2. In addition, at the bottom of the soldering body 11 protruding slightly downward, a box-shaped soldering front end 13 is protruded downward, and the bottom surface (front end surface) of the soldering front end 13 is made as a soldering front end surface 13a so as to be contactable with the terminal wire A. Furthermore, a substantially rectangular soldering recess 15 is formed at the upper portion (connection arm 7 side) opposite to the soldering front end portion 13 of the soldering body 11, and a temperature measuring junction (temperature measuring portion) 3a of the thermocouple 3 is fixed in the soldering recess 15. In addition, the structure for fixing the temperature measuring junction 3a will be described in detail later.

連接臂部7係從烙鐵本體11的左右端部朝上方延伸之縱長的構成部分,且在將連接臂部7彼此互相離開的狀態下設置。此外,構成為在連接臂部7的上部(延伸端部),將用以裝設至熱壓接裝置之嘴保持器(未圖示)的裝設孔17朝加熱嘴2的板厚方向貫通,且藉由將穿過該裝設孔17的裝設螺栓(未圖示)螺合於嘴保持器,而在使烙鐵前端部13朝向下方的姿勢下將加熱嘴單元1裝設至嘴保持器。 The connecting arm 7 is a longitudinal component extending upward from the left and right ends of the soldering iron body 11, and is provided in a state where the connecting arm 7 is separated from each other. In addition, the upper part (extended end) of the connecting arm 7 is penetrated in the plate thickness direction of the heating nozzle 2 by a mounting hole 17 for mounting to a nozzle holder (not shown) of a hot pressing device, and the mounting bolt (not shown) passing through the mounting hole 17 is screwed into the nozzle holder, and the heating nozzle unit 1 is mounted to the nozzle holder in a posture where the front end 13 of the soldering iron faces downward.

另外,裝設至嘴保持器的加熱嘴單元1中,係一方的連接臂部7電性連接至熱壓接裝置之加熱器用電源(未圖示)的一端,而另一方的連接臂部7則電性連接至加熱器用電源的另一端。再者,構成為當使電流從電源(加熱器用電源)流通至加熱嘴2時,電流即通過連接臂部7而流通於烙鐵本體11內,使烙鐵本體11藉由烙鐵本體11內的電阻而發熱,且使烙鐵前端部13藉由此熱而升溫。此外,烙鐵本體11內的電流雖從一方的連接臂部7側朝向另一方的連接臂部7側流通,但由於電流流通的路徑中,位於烙鐵凹部15之角落部分的縮徑部位的剖面積比起其他部位的剖面積更窄,故在該縮徑部位電流密度變得最高,且會易於以此部分為中心產生電阻所導致的焦耳熱。 In the nozzle unit 1 mounted on the nozzle holder, one connecting arm 7 is electrically connected to one end of a power source (not shown) for a heater of the heat pressing device, and the other connecting arm 7 is electrically connected to the other end of the power source for the heater. Furthermore, when a current is passed from the power source (power source for the heater) to the nozzle 2, the current passes through the connecting arm 7 and flows in the solder body 11, causing the solder body 11 to generate heat through the resistance in the solder body 11, and the solder tip 13 is heated by the heat. In addition, although the current in the solder body 11 flows from one side of the connecting arm 7 to the other side of the connecting arm 7, the cross-sectional area of the reduced diameter portion located at the corner of the solder recess 15 in the current flow path is narrower than the cross-sectional area of other portions, so the current density becomes the highest at the reduced diameter portion, and it is easy to generate Joule heat caused by resistance centered at this portion.

再者,如圖1和圖2(d)所示,構成為加熱嘴2係於在該加熱嘴2的表背雙面中從連接臂部7的下部一直到烙鐵本體11的範圍中,使溝20作為本發明的刨槽部而分別沿著左右方向(從一方的連接臂部7朝向另一方之連接臂部7的方向)延伸,且藉由該表背之溝20的延伸而形成薄壁 部21,而使烙鐵前端部13突設於薄壁部21的下方。換言之,構成為形成於薄壁部21從烙鐵前端部13錯開的位置(詳而言之係比烙鐵前端部13更靠連接臂部7側)上。 Furthermore, as shown in FIG. 1 and FIG. 2(d), the heating nozzle 2 is configured such that the groove 20 as the planing portion of the present invention extends in the left-right direction (from the connecting arm 7 on one side toward the connecting arm 7 on the other side) in the range from the lower part of the connecting arm 7 to the soldering iron body 11 on both the front and back sides of the heating nozzle 2, and the thin-walled portion 21 is formed by the extension of the groove 20 on the front and back sides, and the soldering iron front end portion 13 is protruded below the thin-walled portion 21. In other words, the thin-walled portion 21 is formed at a position offset from the soldering iron front end portion 13 (to be specific, closer to the connecting arm 7 side than the soldering iron front end portion 13).

此外,如圖2(d)所示,構成為將表背之溝20的深度尺寸(加熱嘴2之板厚方向的尺寸)設定為相同,且使連接臂部7、烙鐵本體11(薄壁部21)、烙鐵前端部13之各厚度方向的中央位於相同平面上,且將烙鐵前端部13的板厚設定為與連接臂部7的板厚相同。再者,構成為將成為溝20之底部之薄壁部21的表面設為烙鐵本體11的側面(表背面),且設定為使烙鐵本體11的板厚(薄壁部21的板厚)比連接臂部7的板厚更薄,而且,設定為使烙鐵本體11的剖面積(換言之,作為供電流流通之流路的剖面積)比連接臂部7的剖面積更小。再者,將烙鐵本體11之側面的厚度t1,形成為比連接臂部7的厚度(詳而言之係去除薄壁部21後之連接臂部7的厚度(連接臂部7中之與薄壁部21錯開之部位的厚度))t2更薄(參照圖1和圖2(d))。 2( d ), the depth dimension of the groove 20 on the front and back sides (the dimension of the heating nozzle 2 in the plate thickness direction) is set to be the same, and the centers of the connecting arm portion 7, the soldering iron body 11 (thin-walled portion 21 ), and the soldering iron tip portion 13 in the thickness direction are located on the same plane, and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7. Furthermore, the surface of the thin-walled portion 21 that becomes the bottom of the groove 20 is set as the side surface (front and back) of the solder body 11, and the plate thickness of the solder body 11 (plate thickness of the thin-walled portion 21) is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the solder body 11 (in other words, the cross-sectional area of the flow path for the supply current to flow) is set to be smaller than the cross-sectional area of the connecting arm portion 7. Furthermore, the thickness t1 of the side surface of the solder body 11 is formed to be thinner than the thickness t2 of the connecting arm portion 7 (specifically, the thickness of the connecting arm portion 7 after removing the thin-walled portion 21 (the thickness of the portion of the connecting arm portion 7 that is offset from the thin-walled portion 21)) (refer to Figures 1 and 2 (d)).

接著說明安裝於加熱嘴2的熱電偶3以及用以安裝熱電偶3之加熱嘴2上的構成。 Next, the thermocouple 3 installed on the heating nozzle 2 and the structure of the heating nozzle 2 for installing the thermocouple 3 are described.

如圖1和圖3所示,熱電偶3係將二種芯線25的前端彼此予以熔接而構成球體狀的測溫接點(測溫部)3a,且藉由具有電性絕緣性的芯線被覆材26將各芯線25予以分別覆蓋,更藉由外側被覆材27的覆蓋集束成一條而構成了導線3b。換言之,以包含芯線25之方式構成了導線3b。再者,將測溫接點3a的直徑和導線3b的線徑,分別設定為比加熱嘴2的板厚更小。 As shown in Figures 1 and 3, the thermocouple 3 is a spherical temperature measuring junction (temperature measuring part) 3a formed by welding the front ends of two core wires 25 together, and each core wire 25 is covered by a core wire coating material 26 having electrical insulation, and is further bundled into one by covering with an outer coating material 27 to form a wire 3b. In other words, the wire 3b is formed in a manner that includes the core wire 25. Furthermore, the diameter of the temperature measuring junction 3a and the wire diameter of the wire 3b are set to be smaller than the plate thickness of the heating nozzle 2.

此外,在加熱嘴2中,係於連接臂部7彼此的間隙中具備有導線3b的收納部位,且於烙鐵部6中具備有測溫接點3a的固著部位。茲具體地說明,如圖1和圖2(a)、(b)所示,係將沿著連接臂部7之長邊方向延伸之連接臂部7彼此的間隙,設定為比導線3b之線徑更大一圈的寬度(粗細、幅度)作為上端部分開放的導線收納空部30,且在該導線收納空部30內,以導線3b不會從加熱嘴2之表背各面向外側突出的狀態收納有導線3b(詳而言之,為導線3b中之位於靠近測溫接點3a的部分)。再者,使導線3b從導線收納空部30之上端部分的開放口30a延伸,且擴開導線收納空部30的下端而連通至烙鐵凹部15(參照圖1)。 Furthermore, in the heating nozzle 2, a portion for accommodating the wire 3b is provided in the gap between the connecting arms 7, and a portion for fixing the temperature measuring junction 3a is provided in the soldering iron portion 6. Specifically, as shown in FIG. 1 and FIG. 2 (a) and (b), the gap between the connecting arms 7 extending along the longitudinal direction of the connecting arms 7 is set to have a width (thickness, width) one circle larger than the wire diameter of the wire 3b as a wire accommodating space 30 with an upper end portion opened, and in the wire accommodating space 30, the wire 3b (specifically, the portion of the wire 3b located near the temperature measuring junction 3a) is accommodated in a state where the wire 3b does not protrude outward from the front and back surfaces of the heating nozzle 2. Furthermore, the wire 3b is extended from the opening 30a at the upper end of the wire storage cavity 30, and the lower end of the wire storage cavity 30 is expanded to connect to the soldering iron recess 15 (refer to Figure 1).

再者,在各連接臂部7中,係以將面對導線收納空部30之側面的一部分作出缺口且以連通於導線收納空部30的狀態分別形成有擋止凹部31,且於各擋止凹部31和導線收納空部30的一部分(位於擋止凹部31之間的部分),以在注入紫外線硬化樹脂或熱硬化樹脂等樹脂之後硬化之方式具備導線擋止部32,且藉由此導線擋止部32而阻止導線3b從導線收納空部30錯開而從加熱嘴2突出。 Furthermore, in each connecting arm portion 7, a portion of the side surface facing the wire storage cavity 30 is notched and a stopper recess 31 is formed in a state of being connected to the wire storage cavity 30, and each stopper recess 31 and a portion of the wire storage cavity 30 (a portion located between the stopper recesses 31) are provided with a wire stopper 32 in a manner that is hardened after injecting a resin such as an ultraviolet curing resin or a thermosetting resin, and the wire stopper 32 prevents the wire 3b from deviating from the wire storage cavity 30 and protruding from the heating nozzle 2.

此外,在形成於烙鐵部6之烙鐵凹部15中之面對導線收納空部30之端部(下端部)的部位,係以朝上方之連接臂部7側突出的狀態具備有供熱電偶3之測溫接點3a固著的測溫固著部35。如圖3所示,測溫固著部35係隔著烙鐵本體11而突設於與烙鐵前端部13為相反側的突起部,且形成為比烙鐵前端部13更小一圈。此外,在朝向著導線收納空部30側的部分(該測溫固著部35的上部),係具備有讓測溫接點3a接觸的一對固著接觸面35a且使之相對向於導線收納空部30的端部,且設定為固著接 觸面35a彼此的離開距離隨著從烙鐵部6側朝向上方的導線收納空部30側而逐漸地擴開的狀態。再者,藉由將各固著接觸面35a分別以平面構成而將V字形的凹槽36形成於測溫固著部35的上部(成為導線收納空部30側的上部),且於該凹槽36內承接測溫接點3a而使之接觸固著接觸面35a,且以在此狀態下熔接等方式將測溫接點3a固著於烙鐵部6(測溫固著部35)。 In addition, a temperature measuring fixing portion 35 for fixing the temperature measuring contact 3a of the thermocouple 3 is provided at the end (lower end) of the soldering concave portion 15 formed in the soldering portion 6 facing the wire storage hollow portion 30 in a state of protruding toward the upper connecting arm portion 7 side. As shown in FIG. 3 , the temperature measuring fixing portion 35 is a protrusion protruding from the soldering body 11 on the opposite side to the soldering tip portion 13, and is formed to be smaller than the soldering tip portion 13. In addition, a pair of fixing contact surfaces 35a for the temperature measuring contact point 3a to contact are provided at the portion facing the wire housing hollow portion 30 (the upper portion of the temperature measuring fixing portion 35) and are arranged to face the end of the wire housing hollow portion 30, and the distance between the fixing contact surfaces 35a gradually increases from the soldering iron portion 6 side toward the upper wire housing hollow portion 30 side. Furthermore, by forming each fixing contact surface 35a as a plane, a V-shaped groove 36 is formed on the upper part of the temperature measuring fixing part 35 (becoming the upper part of the wire storage hollow part 30 side), and the temperature measuring contact 3a is received in the groove 36 so as to contact the fixing contact surface 35a, and the temperature measuring contact 3a is fixed to the soldering part 6 (temperature measuring fixing part 35) by welding or the like in this state.

接著說明加熱嘴單元1的製作程序,尤其熱電偶3安裝至加熱嘴2的安裝程序。 Next, the manufacturing process of the heating nozzle unit 1 is explained, especially the installation process of the thermocouple 3 to the heating nozzle 2.

首先,如圖4(a)所示,將預先個別製作的加熱嘴2和熱電偶3,以導線收納空部30之開放口30a與測溫接點3a相對向的狀態配置,且設定加熱嘴2和熱電偶3的姿勢,而依測溫固著部35、導線收納空部30、測溫接點3a、導線3b的順序排列在同一直線上。若設定了加熱嘴2與熱電偶3的姿勢,就以測溫接點3a為前頭將熱電偶3插入於加熱嘴2之導線收納空部30的開放口30a。於是,連接臂部7的側面成為導件(guide)而將熱電偶3引導至烙鐵部6側。 First, as shown in FIG4(a), the heating nozzle 2 and the thermocouple 3, which are separately manufactured in advance, are arranged in a state where the opening 30a of the wire storage space 30 and the temperature measuring junction 3a are opposite to each other, and the posture of the heating nozzle 2 and the thermocouple 3 are set, and arranged on the same straight line in the order of the temperature measuring fixing part 35, the wire storage space 30, the temperature measuring junction 3a, and the wire 3b. If the posture of the heating nozzle 2 and the thermocouple 3 is set, the thermocouple 3 is inserted into the opening 30a of the wire storage space 30 of the heating nozzle 2 with the temperature measuring junction 3a as the front. Then, the side surface of the connecting arm 7 becomes a guide to guide the thermocouple 3 to the side of the soldering iron part 6.

再者,當深插熱電偶3時,如圖4(b)所示,會在測溫接點3a通過了導線收納空部30之後進入烙鐵凹部15內。在此,如圖3(a)所示,在烙鐵部6中,係由於在導線收納空部30的下端部(烙鐵部6側的開放端部)所面對的部位具備有測溫固著部35,且使V字形的固著接觸面35a相對向於導線收納空部30的端部,故進入至烙鐵凹部15內的測溫接點3a會到達測溫固著部35而接觸(抵接)固著接觸面35a。如此一來,即可使測溫 接點3a簡單且確實地抵接於固著接觸面35a(測溫固著部35)。因此,可順暢地進行將測溫接點3a固著於測溫固著部35的準備。 Furthermore, when the thermocouple 3 is deeply inserted, as shown in FIG4(b), the temperature measuring contact 3a enters the soldering iron recess 15 after passing through the wire storage cavity 30. Here, as shown in FIG3(a), in the soldering iron 6, since the temperature measuring fixing portion 35 is provided at the position facing the lower end of the wire storage cavity 30 (the open end of the soldering iron 6 side), and the V-shaped fixing contact surface 35a is made to face the end of the wire storage cavity 30, the temperature measuring contact 3a entering the soldering iron recess 15 reaches the temperature measuring fixing portion 35 and contacts (contacts) the fixing contact surface 35a. In this way, the temperature measuring contact 3a can be easily and reliably contacted with the fixing contact surface 35a (temperature measuring fixing portion 35). Therefore, preparations for fixing the temperature measuring contact 3a to the temperature measuring fixing portion 35 can be smoothly performed.

再者,將導線3b向測溫固著部35側推壓而維持測溫接點3a對於固著接觸面35a的接觸,且在此狀態下將測溫接點3a和固著接觸面35a藉由雷射熔接而固著(熔接)。詳而言之,將雷射照射至固著接觸面35a進行加熱,且藉由此熱熔化測溫接點3a而予以固著(熔接)。此時,如圖3(a)所示,由於在測溫固著部35中設定為固著接觸面35a彼此的離開距離隨著從烙鐵部6側朝向上方而逐漸地擴開的狀態,故可使測溫接點3a充分地接觸測溫固著部35。因此,可構成能夠進行測溫接點3a對於加熱嘴2之良好的固著,進而可進行良好之測溫的加熱嘴單元1。再者,由於將固著接觸面35a以平面構成,且將測溫接點3a以球狀體來構成,故測溫接點3a易於對於固著接觸面35a進行點接觸。此外,通過將測溫接點3a壓抵於固著接觸面35a,從而使應力易於集中而使測溫接點3a不易從固著接觸面35a浮起。藉此,即可更良好地將測溫接點3a固著於加熱嘴2,進而更良好地進行加熱嘴2的測溫。 Furthermore, the lead wire 3b is pushed toward the temperature measuring fixing part 35 to maintain the contact of the temperature measuring contact point 3a with the fixing contact surface 35a, and in this state, the temperature measuring contact point 3a and the fixing contact surface 35a are fixed (fused) by laser welding. Specifically, the laser is irradiated to the fixing contact surface 35a to heat it, and the temperature measuring contact point 3a is fixed (fused) by melting it with this heat. At this time, as shown in FIG. 3(a), since the distance between the fixing contact surfaces 35a in the temperature measuring fixing part 35 is set to gradually expand from the side of the soldering iron part 6 toward the top, the temperature measuring contact point 3a can be fully contacted with the temperature measuring fixing part 35. Therefore, a heater unit 1 can be constructed that can perform good fixation of the temperature measuring contact 3a to the heater 2, and can perform good temperature measurement. Furthermore, since the fixing contact surface 35a is formed as a plane and the temperature measuring contact 3a is formed as a sphere, the temperature measuring contact 3a is easy to perform point contact with the fixing contact surface 35a. In addition, by pressing the temperature measuring contact 3a against the fixing contact surface 35a, stress is easily concentrated and the temperature measuring contact 3a is not easy to float from the fixing contact surface 35a. In this way, the temperature measuring contact 3a can be fixed to the heater 2 more well, and the temperature measurement of the heater 2 can be performed more well.

若已將測溫接點3a固著於測溫固著部35,則如圖4(c)所示,在導線收納空部30的一部分(位於擋止凹部31之間的部分)和擋止凹部31,以硬化前的狀態(流動狀態)注入充填紫外線硬化樹脂或熱硬化樹脂等樹脂,且於之後施行紫外線照射或加熱等樹脂硬化處理將樹脂硬化而作成導線擋止部32。 If the temperature measuring contact 3a has been fixed to the temperature measuring fixing part 35, as shown in FIG4(c), a part of the wire accommodating space 30 (the part between the stopper recesses 31) and the stopper recesses 31 are filled with a resin such as an ultraviolet curing resin or a thermosetting resin in a state before curing (flowing state), and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin to form a wire stopper 32.

在以此方式將熱電偶3安裝於加熱嘴2所構成的加熱嘴單元1中,由於將熱電偶3的導線3b收納於導線收納空部30中,故可避免熱 電偶3的導線3b超出加熱嘴2之板厚的範圍。因此,在進行將加熱嘴單元1裝設至熱壓接裝置的裝設作業等處理時,或在加熱嘴單元進入作業區域時,不容易發生不小心卡住導線3b的缺陷,甚至熱電偶3從加熱嘴脫落的缺陷。此外,當在搬運(出貨)或保存之際要統整複數個加熱嘴單元1的情形下,可無障礙且穩定地重疊加熱嘴單元1,且可順暢地進行搬運作業或保存作業。 In the nozzle unit 1 formed by installing the thermocouple 3 in the nozzle 2 in this way, the wire 3b of the thermocouple 3 is stored in the wire storage space 30, so that the wire 3b of the thermocouple 3 can be prevented from exceeding the thickness range of the nozzle 2. Therefore, when the nozzle unit 1 is installed in the hot press welding device or when the nozzle unit enters the working area, it is not easy to accidentally get the wire 3b stuck or even the thermocouple 3 falls off the nozzle. In addition, when multiple nozzle units 1 are to be integrated during transportation (shipping) or storage, the nozzle units 1 can be stacked stably without obstacles, and the transportation or storage operation can be smoothly performed.

再者,由於在導線收納空部30中具備有導線擋止部32,故可阻止所收納的導線3b從導線收納空部30脫落的缺陷。此外,由於將注入於導線收納空部30內而硬化的樹脂作為導線擋止部32,故易於將樹脂作為導線擋止部32放入連接臂部7與導線3b的間隙,而可充分地擋止導線3b。再者,由於具備連通於導線收納空部30的擋止凹部31,且屬於導線擋止部32的樹脂注入於導線收納空部30和擋止凹部31而硬化,故導線擋止部32不易從導線收納空部30脫落,且可抑制導線3b會隨同導線擋止部32一起從導線收納空部30脫落的缺陷。 Furthermore, since the wire storage cavity 30 is provided with the wire stopper 32, the defect of the stored wire 3b falling out of the wire storage cavity 30 can be prevented. In addition, since the resin injected into the wire storage cavity 30 and hardened is used as the wire stopper 32, it is easy to put the resin as the wire stopper 32 into the gap between the connecting arm portion 7 and the wire 3b, and the wire 3b can be fully stopped. Furthermore, since the stopper recess 31 connected to the wire storage space 30 is provided, and the resin belonging to the wire stopper 32 is injected into the wire storage space 30 and the stopper recess 31 and hardened, the wire stopper 32 is not easy to fall off from the wire storage space 30, and the defect that the wire 3b will fall off from the wire storage space 30 together with the wire stopper 32 can be suppressed.

再者,作為使用加熱嘴單元1而將端子用導線A予以熱壓接於端子構件B的作業來說,首先,將加熱嘴單元1以烙鐵前端部13成為下側的姿勢裝設於熱壓接裝置的嘴保持器,且將熱電偶3的導線3b連接於熱壓接裝置的熱電偶連接端子(未圖示)。之後,將端子構件B和端子用導線A安置在設於嘴保持器之下方的作業區域(均未圖示),且將端子用導線A重疊於端子構件B的上面。若已安置了端子構件B和端子用導線A,則使加熱嘴單元1與嘴保持器一同下降而將烙鐵前端部13朝端子用導線A推壓,更藉由對於加熱嘴2通電而使烙鐵本體11發熱,而將端子用導線A 予以熱壓接於端子構件B。此外,藉由熱電偶3來測量烙鐵部6的溫度,且由熱壓接裝置的控制部(未圖示)根據此測量值來進行對於加熱嘴2的通電控制,進而進行烙鐵前端部13的溫度控制。 Furthermore, as an operation of heat-pressing the terminal wire A to the terminal member B using the heating nozzle unit 1, first, the heating nozzle unit 1 is installed on the nozzle holder of the heat-pressing device with the front end portion 13 of the soldering iron facing downward, and the wire 3b of the thermocouple 3 is connected to the thermocouple connection terminal (not shown) of the heat-pressing device. Thereafter, the terminal member B and the terminal wire A are placed in a working area (not shown) below the nozzle holder, and the terminal wire A is overlapped on the terminal member B. If the terminal member B and the terminal wire A are already installed, the heating nozzle unit 1 is lowered together with the nozzle holder to push the front end 13 of the soldering iron toward the terminal wire A, and the soldering iron body 11 is heated by energizing the heating nozzle 2, so that the terminal wire A is thermally pressed to the terminal member B. In addition, the temperature of the soldering iron part 6 is measured by the thermocouple 3, and the control unit (not shown) of the thermal pressing device controls the power supply of the heating nozzle 2 according to the measured value, thereby controlling the temperature of the front end 13 of the soldering iron.

在此,由於在發熱的加熱嘴2中,係將烙鐵本體11的板厚設定為比連接臂部7的板厚更薄,且將烙鐵本體11的剖面積設定為比連接臂部7的剖面積更小,故即使將加熱嘴2的板厚設定為較厚,亦可抑制在烙鐵本體11的電流密度降低而使發熱變得不充分的缺陷。因此,無論加熱嘴2之板厚的增減都易於實現良好的發熱效率。此外,可避免烙鐵本體11之體積的增加,進而避免熱容量的增加,且易於迅速地進行烙鐵本體11或烙鐵前端部13的冷卻。再者,由於使溝20從連接臂部7的下部延伸一直到烙鐵本體11的範圍而形成薄壁部21,且將成為溝20之底部之薄壁部21的表面設為烙鐵本體11的側面,故可簡單地實現烙鐵本體11之板厚比連接臂部7之板厚更薄之加熱嘴2的構造。 Here, in the heating nozzle 2 that generates heat, the plate thickness of the solder body 11 is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the solder body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. Therefore, even if the plate thickness of the heating nozzle 2 is set to be thick, the defect that the current density in the solder body 11 is reduced and the heating becomes insufficient can be suppressed. Therefore, it is easy to achieve good heating efficiency regardless of the increase or decrease in the plate thickness of the heating nozzle 2. In addition, it is possible to avoid an increase in the volume of the solder body 11, thereby avoiding an increase in heat capacity, and it is easy to quickly cool the solder body 11 or the solder tip 13. Furthermore, since the groove 20 is extended from the lower part of the connecting arm 7 to the range of the soldering iron body 11 to form the thin-walled part 21, and the surface of the thin-walled part 21 which becomes the bottom of the groove 20 is set as the side surface of the soldering iron body 11, the structure of the heating nozzle 2 in which the plate thickness of the soldering iron body 11 is thinner than the plate thickness of the connecting arm 7 can be easily realized.

此外,由於在薄壁部21的下方突設有烙鐵前端部13,故當因為熱壓接作業而使異物(端子用導線A的絕緣覆膜等)附著於烙鐵前端部13的情形下,易於以研磨烙鐵前端部13之前端等之方式將異物去除。再者,可充分地確保烙鐵前端部13之前端的研磨裕度,且可謀求加熱嘴單元之更換週期(使用壽命)的長期化。再者,由於將薄壁部21形成於比烙鐵前端部13更靠連接臂部7側,且將烙鐵本體11之側面的厚度形成為比去除薄壁部21後之連接臂部7的厚度更薄,故可抑制在烙鐵本體11之電流密度的降低,同時可充分地確保在烙鐵前端部13之前端面中之板厚方向的尺寸。藉此,可擴增可供加熱嘴2熱壓接之工件(熱壓接對象)之大小的容許 範圍。此外,由於將薄壁部21形成於與烙鐵前端部13錯開的位置,且將烙鐵前端部13的板厚設定為與連接臂部7的板厚相同,故無須使烙鐵前端部13的板厚相對於連接臂部7的板厚作增減,而易於製造加熱嘴2。 Furthermore, since the solder tip 13 is protrudingly provided below the thin-walled portion 21, when foreign matter (such as the insulation coating of the terminal wire A) is attached to the solder tip 13 due to the hot pressing operation, the foreign matter can be easily removed by grinding the front end of the solder tip 13. Furthermore, the grinding margin of the front end of the solder tip 13 can be sufficiently ensured, and the replacement cycle (service life) of the heater unit can be prolonged. Furthermore, since the thin-walled portion 21 is formed closer to the connecting arm portion 7 than the solder tip portion 13, and the thickness of the side surface of the solder body 11 is formed thinner than the thickness of the connecting arm portion 7 after the thin-walled portion 21 is removed, the reduction of the current density in the solder body 11 can be suppressed, and the dimension in the plate thickness direction in the front end surface of the solder tip portion 13 can be sufficiently ensured. Thereby, the permissible range of the size of the workpiece (hot pressing object) that can be hot-pressed by the heating nozzle 2 can be expanded. In addition, since the thin-walled portion 21 is formed at a position offset from the front end portion 13 of the soldering iron, and the plate thickness of the front end portion 13 of the soldering iron is set to be the same as the plate thickness of the connecting arm portion 7, it is not necessary to increase or decrease the plate thickness of the front end portion 13 of the soldering iron relative to the plate thickness of the connecting arm portion 7, and the heating nozzle 2 is easy to manufacture.

再者,由於連接臂部7、烙鐵本體11、烙鐵前端部13之各厚度方向的中央位於相同平面上,故於熱壓接作業時不易在加熱嘴2內發生彎曲力矩,可抑制對於加熱嘴2施加多餘之負荷的缺陷,進而可抑制加熱嘴2易於損傷的缺陷。再者,由於在加熱嘴2的烙鐵部6安裝有熱電偶3作為溫度感測器,故可取得烙鐵部6之溫度的資訊而運用於加熱嘴2之發熱的控制上。此外,可藉由簡單的構成來實現溫度感測器。 Furthermore, since the centers of the connecting arm 7, the solder body 11, and the solder front end 13 in the thickness direction are located on the same plane, it is not easy to generate a bending moment in the heating nozzle 2 during the hot pressing operation, which can suppress the defect of applying an excess load to the heating nozzle 2, and further suppress the defect of the heating nozzle 2 being easily damaged. Furthermore, since a thermocouple 3 is installed on the solder part 6 of the heating nozzle 2 as a temperature sensor, the temperature information of the solder part 6 can be obtained and used for controlling the heating of the heating nozzle 2. In addition, the temperature sensor can be realized by a simple structure.

不過,在上述實施型態中,雖藉由使溝20分別延伸至加熱嘴2的表背雙面而形成薄壁部21來構成烙鐵本體11,但本發明不限定於此。總之,只要將烙鐵本體11的板厚設定為比連接臂部7的板厚更薄,而且,將烙鐵本體11的剖面積設定為比連接臂部7的剖面積更小,則在加熱嘴2可具備任何態樣的烙鐵本體11。例如,亦可使溝延伸至加熱嘴2的表面或背面的任一面而形成薄壁部21來構成烙鐵本體11。然而,烙鐵本體11將會偏靠位於加熱嘴2的表背任一面,由此,於熱壓接作業時將會於加熱嘴2內發生彎曲力矩,故以採用連接臂部7、烙鐵本體11、烙鐵前端部13之各厚度方向的中央位於相同平面上的構成,亦即上述實施型態的構成為佳。另外,烙鐵本體11只要是包含有電阻最高的部分(成為發熱部的部分)的構成即可。因此,藉由溝等而謀求薄壁化的區域,係可及於連接臂部7內,亦可未必是烙鐵本體11的全域。 However, in the above-mentioned embodiment, the soldering body 11 is configured by extending the groove 20 to both the front and back surfaces of the heating nozzle 2 to form the thin-walled portion 21, but the present invention is not limited thereto. In short, as long as the plate thickness of the soldering body 11 is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the soldering body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, the heating nozzle 2 may have any type of soldering body 11. For example, the soldering body 11 may be configured by extending the groove to either the front or back surface of the heating nozzle 2 to form the thin-walled portion 21. However, the solder body 11 will be biased to be located on either the front or back side of the heating nozzle 2, and thus, a bending moment will occur in the heating nozzle 2 during the hot pressing operation. Therefore, it is better to adopt a structure in which the centers of the thickness directions of the connecting arm 7, the solder body 11, and the solder front end 13 are located on the same plane, that is, the structure of the above-mentioned embodiment. In addition, the solder body 11 can be a structure that includes the part with the highest resistance (the part that becomes the heating part). Therefore, the area that seeks to be thinned by grooves, etc. can be within the connecting arm 7, and may not necessarily be the entire area of the solder body 11.

此外,雖將烙鐵前端部13的板厚與連接臂部7的板厚設定為相同的尺寸,但本發明不限定於此。例如,只要削減烙鐵前端部13的板厚而設定為比連接臂部7的板厚更薄,則可增加烙鐵前端部13之板厚尺寸的自由度,而易於設計對應要施行熱壓接處理之工件(端子構件B、端子用導線A)之大小的加熱嘴2。再者,如圖3所示,雖將測溫固著部35構成為整體小於烙鐵前端部13,但本發明不限定於此。例如,只要設定為使烙鐵前端部13的體積與測溫固著部35的體積一致,以避開烙鐵前端部13的熱容量與測溫固著部35之熱容量的差會極端不同,則可使在測溫固著部35的溫度變化與在烙鐵前端部13的溫度變化同步,且易於根據測溫固著部35的測溫而執行烙鐵前端部13的溫度管理。 In addition, although the plate thickness of the soldering tip 13 and the plate thickness of the connecting arm 7 are set to the same dimension, the present invention is not limited thereto. For example, if the plate thickness of the soldering tip 13 is reduced and set to be thinner than the plate thickness of the connecting arm 7, the degree of freedom of the plate thickness dimension of the soldering tip 13 can be increased, and it is easy to design the heating nozzle 2 corresponding to the size of the workpiece (terminal member B, terminal wire A) to be subjected to the hot pressing process. Furthermore, as shown in FIG. 3, although the temperature measuring fixing portion 35 is configured to be smaller than the soldering tip 13 as a whole, the present invention is not limited thereto. For example, as long as the volume of the soldering iron tip 13 is set to be consistent with the volume of the temperature measuring fixing part 35 to avoid the difference in heat capacity between the soldering iron tip 13 and the temperature measuring fixing part 35 being extremely different, the temperature change at the temperature measuring fixing part 35 can be synchronized with the temperature change at the soldering iron tip 13, and it is easy to perform temperature management of the soldering iron tip 13 based on the temperature measurement of the temperature measuring fixing part 35.

再者,雖將測溫固著部35的固著接觸面35a以平面來構成,但本發明不限定於此。總之,只要設定為固著接觸面35a彼此的離開距離隨著從烙鐵部6側朝向上方而逐漸地擴開的狀態,則亦可將固著接觸面35a以曲面來構成。再者,只要能夠使測溫接點(測溫部)3a充分地接觸固著接觸面35a,則不限定於將該測溫接點3a形成為球狀體,亦可形成為任何形狀。此外,雖將熱電偶3的測溫接點3a與測溫固著部35予以熔接而固著,但本發明不限定於此。總之,只要能夠進行烙鐵部6的測溫,則不限定測溫接點3a與測溫固著部35的固著態樣。例如,亦可使用導熱良好的固著劑(接著劑)來固著測溫接點3a與測溫固著部35。 Furthermore, although the fixing contact surface 35a of the temperature measuring fixing part 35 is formed as a plane, the present invention is not limited to this. In short, as long as the distance between the fixing contact surfaces 35a is set to gradually expand from the side of the soldering iron part 6 toward the top, the fixing contact surface 35a can also be formed as a curved surface. Furthermore, as long as the temperature measuring junction (temperature measuring part) 3a can fully contact the fixing contact surface 35a, it is not limited to forming the temperature measuring junction 3a into a spherical body, and it can be formed into any shape. In addition, although the temperature measuring junction 3a of the thermocouple 3 is fixed to the temperature measuring fixing part 35 by welding, the present invention is not limited to this. In short, as long as the temperature of the soldering iron part 6 can be measured, the fixing method of the temperature measuring contact 3a and the temperature measuring fixing part 35 is not limited. For example, a fixing agent (adhesive) with good thermal conductivity can also be used to fix the temperature measuring contact 3a and the temperature measuring fixing part 35.

再者,在上述實施型態的加熱嘴2中,雖構成為使導線收納空部30沿著連接臂部7的長邊方向而呈直線狀延伸,但本發明不限定於此。總之,只要是能夠收納熱電偶3之導線3b的構成,則可適用任何態樣 的導線收納空部30。例如,可適用呈彎折線狀或彎曲線狀延伸的導線收納空部30。此外,雖例示了紫外線硬化樹脂或熱硬化樹脂等樹脂作為本發明中的導線擋止部32,但本發明不限定於此。總之,只要能夠擋止收納於導線收納空部30內的導線3b而阻止從導線收納空部30脫落,則不限制導線擋止部32的態樣。例如,亦可採用能夠嵌合於導線收納空部30的封蓋(cap)作為導線擋止部,或者,亦可採用一體成形於連接臂部7且朝導線收納空部30側突出的突起作為導線擋止部。 Furthermore, in the heating nozzle 2 of the above-mentioned embodiment, although the wire storage cavity 30 is configured to extend in a straight line along the long side direction of the connecting arm portion 7, the present invention is not limited thereto. In short, as long as the configuration is capable of accommodating the wire 3b of the thermocouple 3, any form of wire storage cavity 30 can be applied. For example, a wire storage cavity 30 extending in a bent line or a curved line can be applied. In addition, although a resin such as an ultraviolet curing resin or a thermosetting resin is exemplified as the wire stopper 32 in the present invention, the present invention is not limited thereto. In short, as long as the wire 3b stored in the wire storage cavity 30 can be stopped from falling out of the wire storage cavity 30, the wire stopper 32 is not limited. For example, a cap that can be fitted into the wire storage cavity 30 can be used as the wire stopper, or a protrusion that is integrally formed on the connecting arm 7 and protrudes toward the wire storage cavity 30 can be used as the wire stopper.

此外,雖藉由導線收納空部30之側面之較淺的缺口而構成了連通於導線收納空部30的擋止凹部31,但本發明不限定於此。總之,只要屬於導線擋止部32的樹脂從導線收納空部30一直注入至擋止凹部31且可硬化,則擋止凹部31的構成可採用任何態樣。例如,亦可構成為在連接臂部7的表背雙面分別形成溝狀的擋止凹部,且使該擋止凹部的端部連通至導線收納空部30而使樹脂(導線擋止部32)從導線收納空部30一直注入至擋止凹部。 In addition, although the stopper recess 31 connected to the wire storage cavity 30 is formed by a shallow notch on the side of the wire storage cavity 30, the present invention is not limited to this. In short, as long as the resin belonging to the wire stopper 32 is injected from the wire storage cavity 30 to the stopper recess 31 and can be hardened, the structure of the stopper recess 31 can be adopted in any form. For example, it is also possible to form a stopper recess with a groove shape on both the front and back surfaces of the connecting arm 7, and connect the end of the stopper recess to the wire storage cavity 30 so that the resin (wire stopper 32) is injected from the wire storage cavity 30 to the stopper recess.

再者,在上述實施型態中,雖例示了熱電偶3作為本發明的溫度感測器,且例示了熱電偶3的測溫接點3a作為本發明的測溫部,但不限定於此。總之,只要是可進行烙鐵部6的測溫,且於導線3b的端部具備有測溫部所構成的溫度感測器,則可採用任何態樣的溫度感測器而安裝至加熱嘴2。 Furthermore, in the above-mentioned embodiment, although the thermocouple 3 is illustrated as the temperature sensor of the present invention, and the temperature measuring junction 3a of the thermocouple 3 is illustrated as the temperature measuring part of the present invention, it is not limited to this. In short, as long as the temperature of the soldering part 6 can be measured and the temperature sensor having a temperature measuring part at the end of the wire 3b, any type of temperature sensor can be used and installed on the heating nozzle 2.

不過,在上述實施型態中,雖例示了溝20作為本發明的刨槽部,但本發明不限定於此。總之,只要藉由使刨槽部沿著從一方的連接臂部朝向另一方之連接臂部的方向延伸而使薄壁部形成為加熱嘴,則可將 刨槽部設定為任何態樣。例如,在圖5和圖6所示之第二實施型態的加熱嘴2”中,基本上雖與上述實施型態(第一實施型態)相同,但其相異之處為:不僅在加熱嘴2”的表背雙面,亦在加熱嘴2’之板厚方向的中間部分形成刨槽部而使加熱嘴2’的下半部分分支成為二分歧,藉此具有二個烙鐵本體。 However, in the above-mentioned embodiment, although the groove 20 is illustrated as the grooved portion of the present invention, the present invention is not limited thereto. In short, as long as the grooved portion is extended in the direction from one connecting arm portion toward the other connecting arm portion to form a thin-walled portion as a heating nozzle, the grooved portion can be set in any form. For example, in the heating nozzle 2" of the second embodiment shown in Figures 5 and 6, although it is basically the same as the above-mentioned embodiment (first embodiment), the difference is that the grooved portion is formed not only on the front and back surfaces of the heating nozzle 2", but also in the middle part of the heating nozzle 2' in the plate thickness direction, so that the lower half of the heating nozzle 2' is branched into two branches, thereby having two soldering iron bodies.

茲具體地說明,加熱嘴2’係在位於該加熱嘴2’之下部之烙鐵部6’中之板厚方向的中間部分,形成沿著左右方向(從一方的連接臂部7朝向另一方之連接臂部7的方向)延伸的烙鐵空間部40作為刨槽部,且將該烙鐵空間部40朝向下方開放。再者,隔著烙鐵空間部40在加熱嘴2’的表背兩側分別具備有烙鐵本體11和烙鐵前端部13。換言之,在加熱嘴2’的烙鐵部6’中,具備有彼此離開的二個烙鐵本體11,以及彼此離開的二個烙鐵前端部13。再者,在各烙鐵本體11中,係在外側的面形成溝20,且於內側的面亦形成溝20’,此外,分別具備突設有測溫固著部35的烙鐵凹部15,且在各測溫固著部35可固著熱電偶3的測溫接點(測溫部)3a,而在各烙鐵前端部13中,係將該烙鐵前端部13的板厚設定為比連接臂部7的板厚更薄。 Specifically, the heating nozzle 2' has a soldering space 40 extending in the left-right direction (from one connecting arm 7 toward the other connecting arm 7) as a groove portion in the middle portion of the soldering portion 6' located at the lower part of the heating nozzle 2' in the plate thickness direction, and the soldering space 40 is opened downward. Furthermore, the soldering body 11 and the soldering tip 13 are provided on both the front and back sides of the heating nozzle 2' via the soldering space 40. In other words, the soldering portion 6' of the heating nozzle 2' has two soldering bodies 11 separated from each other and two soldering tip 13 separated from each other. Furthermore, in each solder body 11, a groove 20 is formed on the outer surface, and a groove 20' is also formed on the inner surface. In addition, each solder recess 15 is provided with a temperature measuring fixing portion 35 protruding therefrom, and the temperature measuring junction (temperature measuring portion) 3a of the thermocouple 3 can be fixed to each temperature measuring fixing portion 35. In each solder tip portion 13, the plate thickness of the solder tip portion 13 is set to be thinner than the plate thickness of the connecting arm portion 7.

只要構成此種具備有烙鐵部6’的加熱嘴2’,即可藉由二個烙鐵前端部13同時地進行二個部位的熱壓接處理,且可謀求熱壓接作業之效率的提升。此外,藉由烙鐵空間部40之板厚方向之尺寸的設定,即可依據工件來調整二個烙鐵前端部13的離開距離(間距)或各烙鐵前端部13之烙鐵前端面13a的大小。 As long as the heating nozzle 2' with the soldering part 6' is constructed, two parts can be heat-pressed by two soldering front ends 13 at the same time, and the efficiency of the heat-pressing operation can be improved. In addition, by setting the size of the soldering space 40 in the plate thickness direction, the distance (spacing) between the two soldering front ends 13 or the size of the soldering front end surface 13a of each soldering front end 13 can be adjusted according to the workpiece.

此外,在前述的實施型態中,亦可在加熱嘴的表面形成耐氧化性覆膜層而提高耐氧化性。 In addition, in the aforementioned embodiment, an oxidation-resistant coating layer may be formed on the surface of the heating nozzle to improve oxidation resistance.

以下說明耐氧化性覆膜層。 The following explains the oxidation-resistant coating layer.

在加熱嘴中,每次熱壓接都會反復升溫、冷卻,故表面易於氧化,尤其在烙鐵部6(發熱部)附近、和熔接有熱電偶3的部分氧化特別顯著。因此,發熱部附近的氧化部分會剝離而使強度降低,而會產生在加壓時破損的缺陷,此外,熱電偶的熔接部分會腐蝕而使得強度降低,終至發生熱電偶脫離而無法使用等的缺陷。 In the heating nozzle, each heat-pressing will repeatedly heat up and cool down, so the surface is easy to oxidize, especially near the soldering part 6 (heating part) and the part where the thermocouple 3 is welded. Therefore, the oxidized part near the heating part will peel off and reduce the strength, which will cause defects such as breakage during pressurization. In addition, the welded part of the thermocouple will corrode and reduce the strength, eventually causing defects such as the thermocouple detaching and becoming unusable.

因此,在本實施型態中,係在加熱嘴的表面形成耐氧化性覆膜層而提高了耐氧化性。以下包含製造步驟在內進行具體的說明。 Therefore, in this embodiment, an oxidation-resistant coating layer is formed on the surface of the heating nozzle to improve oxidation resistance. The following is a specific description including the manufacturing steps.

首先。關於成為素材(基材)的金屬板,具體而言,較佳為使用過去一般所使用的鎢(硬度HV430左右)、耐研磨性比鎢合金(硬度HV200至400左右)更優異之所謂超硬材(硬度HV900至2400)(正式名稱:超硬質合金,將硬質之金屬碳化物之粉末燒結而成的合金),且將此超硬材的板材藉由線切割而切出成預定形狀。接著,對於此切出片施行鍍覆前處理,且於之後浸漬於溶解槽中進行通電,從而在前述切出片的表面形成由鎳所形成的耐氧化性覆膜層,亦即施行鎳鍍覆。之後,從溶解槽拉起而施行洗淨等的後處理。 First. Regarding the metal plate that becomes the material (base material), specifically, it is better to use the tungsten (hardness of about HV430) that is generally used in the past, and the so-called superhard material (hardness of HV900 to 2400) (official name: superhard alloy, an alloy formed by sintering hard metal carbide powder) with better wear resistance than tungsten alloy (hardness of about HV200 to 400), and the plate of this superhard material is cut into a predetermined shape by wire cutting. Then, the cut piece is subjected to pre-plating treatment, and then immersed in a dissolving tank and energized, so that an oxidation-resistant coating layer formed by nickel is formed on the surface of the aforementioned cut piece, that is, nickel plating is performed. After that, it is pulled out from the dissolving tank and subjected to post-treatment such as washing.

再者,與前述之實施型態同樣地,將熱電偶3的測溫接點3a予以雷射熔接於測溫固著部35。在此熔接中,由於在測溫固著部35的表面(固著接觸面35a)形成有鎳層的覆膜,故潤濕性提高,藉此提升熔接的確實性、熔接強度。此外,當熔接時的潤濕性被提高,即可比習知更抑制雷射的輸出,並且抑制對於基材造成的損傷,且可謀求品質提升與能源消耗的節約。 Furthermore, similar to the above-mentioned embodiment, the temperature measuring junction 3a of the thermocouple 3 is laser welded to the temperature measuring fixing part 35. In this welding, since a nickel layer is formed on the surface (fixing contact surface 35a) of the temperature measuring fixing part 35, the wettability is improved, thereby improving the reliability and strength of welding. In addition, when the wettability during welding is improved, the output of the laser can be suppressed more than before, and the damage to the substrate can be suppressed, and the quality improvement and energy consumption saving can be sought.

若熱電偶3的熔接結束,即進一步施行鍍覆前處理,且將裝設有熱電偶3的加熱嘴單元1浸漬於電解液中,且對於包含有熱電偶3之測溫接點3a之整體的表面施行鎳鍍覆。 If the welding of the thermocouple 3 is completed, the pre-plating treatment is further performed, and the heating nozzle unit 1 equipped with the thermocouple 3 is immersed in the electrolyte, and the entire surface including the temperature measuring junction 3a of the thermocouple 3 is nickel plated.

當使用以此方式製作的加熱嘴單元1時,耐氧化性即會提升,故可抑制因為烙鐵部6或熱電偶3之安裝部分之氧化所引起的剝離或強度降低,且可藉此使耐久性提升。尤其是當基材使用超硬材且施行鎳鍍覆時,潤濕性即提升且亦可使熔接性提升,可使耐久性確實地提升。另外,由於熱電偶主成分為鎳,故鎳鍍覆親和性良好。此外,耐氧化性覆膜不限定於鎳鍍覆,例如,亦可為金鍍覆等。 When the heating nozzle unit 1 manufactured in this way is used, the oxidation resistance is improved, so the peeling or strength reduction caused by oxidation of the soldering part 6 or the mounting part of the thermocouple 3 can be suppressed, and the durability can be improved. In particular, when the substrate uses a superhard material and nickel plating is performed, the wettability is improved and the weldability can also be improved, which can reliably improve the durability. In addition, since the main component of the thermocouple is nickel, the affinity of nickel plating is good. In addition, the oxidation-resistant coating is not limited to nickel plating, for example, it can also be gold plating, etc.

再者,前述之實施型態的所有觀點均為例示,不應認定為用以限制本發明。本發明不限定於上述的說明,應為申請專利範圍所示,其包含在與申請專利範圍均等的涵義和範圍內的所有變更。 Furthermore, all viewpoints of the aforementioned implementation forms are illustrative and should not be considered to limit the present invention. The present invention is not limited to the above description, but should be shown in the scope of the patent application, which includes all changes within the meaning and scope equivalent to the scope of the patent application.

1:加熱嘴單元 1: Heating nozzle unit

2:加熱嘴 2: Heating nozzle

3:熱電偶 3: Thermocouple

3a:測溫接點 3a: Temperature measurement junction

3b:導線 3b: Conductor wire

6:烙鐵部 6: Iron-making department

7:連接臂部 7: Connecting arm

11:烙鐵本體 11: Soldering iron body

13:烙鐵前端部 13: Front end of soldering iron

13a:烙鐵前端面 13a: Front end of soldering iron

15:烙鐵凹部 15: Soldering iron recess

20:溝 20: Groove

21:薄壁部 21: Thin wall part

25:芯線 25: Core wire

26:芯線被覆材 26: Core wire coating material

27:外側被覆材 27: External covering material

30:導線收納空部 30: Wire storage space

35:測溫固著部 35: Temperature measurement and fixing part

35a:固著接觸面 35a: Fixed contact surface

36:凹槽 36: Groove

Claims (6)

一種加熱嘴單元,該加熱嘴單元係將溫度感測器安裝在用以將端子用導線予以熱壓接於端子構件之板狀的加熱嘴上而成者,前述加熱嘴係具備:烙鐵部,係在烙鐵本體具備有抵接於前述端子用導線的烙鐵前端部而成者;一對連接臂部,係以從前述烙鐵本體的左右端部朝上方彼此離開的狀態延伸,且使來自電源的電流流通於前述烙鐵本體而使前述烙鐵部升溫;及測溫固著部,係設於前述烙鐵部,且供前述溫度感測器的測溫部固著;前述測溫固著部係具備供與前述測溫部點接觸的一對固著接觸面,且設定為前述固著接觸面彼此的離開距離隨著從前述烙鐵部側朝向上方而逐漸擴開的狀態;將前述連接臂部彼此的間隙作為導線收納空部而將前述溫度感測器的導線收納至前述導線收納空部;且使前述固著接觸面相對向於前述導線收納空部的端部。 A heating nozzle unit is a unit in which a temperature sensor is mounted on a plate-shaped heating nozzle for hot-pressing a terminal wire to a terminal member, wherein the heating nozzle comprises: a soldering part having a soldering iron front end abutting against the terminal wire on a soldering iron body; a pair of connecting arms extending upward from left and right ends of the soldering iron body and separating from each other, and allowing a current from a power source to flow through the soldering iron body to heat the soldering part; and a temperature measuring fixing part. , which is arranged on the aforementioned soldering iron part and is used for fixing the temperature measuring part of the aforementioned temperature sensor; the aforementioned temperature measuring fixing part is provided with a pair of fixing contact surfaces for point contact with the aforementioned temperature measuring part, and is set to a state where the distance between the aforementioned fixing contact surfaces gradually expands from the side of the aforementioned soldering iron part to the upper part; the gap between the aforementioned connecting arm parts is used as a wire storage space to store the wire of the aforementioned temperature sensor in the aforementioned wire storage space; and the aforementioned fixing contact surface is opposite to the end of the aforementioned wire storage space. 如請求項1所述之加熱嘴單元,將前述固著接觸面以平面來構成,且將前述測溫部以球狀體來構成。 In the heating nozzle unit as described in claim 1, the aforementioned fixing contact surface is formed as a plane, and the aforementioned temperature measuring part is formed as a sphere. 如請求項1或2所述之加熱嘴單元,其中,前述加熱嘴係至少在前述烙鐵部和前述測溫固著部的表面形成有耐氧化性覆膜層。 A heating nozzle unit as described in claim 1 or 2, wherein the heating nozzle has an oxidation-resistant coating layer formed on at least the surface of the soldering part and the temperature measuring fixing part. 如請求項3所述之加熱嘴單元,係在固著於前述測溫固著部之前述測溫部的表面形成有耐氧化性覆膜層。 The heating nozzle unit as described in claim 3 is formed with an oxidation-resistant coating layer on the surface of the temperature measuring portion before being fixed to the temperature measuring fixing portion. 如請求項3所述之加熱嘴單元,其中,前述耐氧化性覆膜層為鎳覆膜。 The heating nozzle unit as described in claim 3, wherein the oxidation-resistant coating layer is a nickel coating. 如請求項4所述之加熱嘴單元,其中,前述耐氧化性覆膜層為鎳覆膜。 The heating nozzle unit as described in claim 4, wherein the oxidation-resistant coating layer is a nickel coating.
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