TWI865228B - Immersion cooling type electronic device and assembling method thereof - Google Patents

Abstract

An immersion cooling type electronic device and an assembling method thereof are disclosed in the present invention. In the means to fulfill the present invention, an insulating anti-oxidation film fully covers an internal-component assembly after the internal-component assembly is entirely assembled; a casing has an accommodating space; a circulation cooling pipeline is assembled to the casing to communicate with the accommodating space; and a cooling liquid is filled into the accommodating space to make the electronic assembly fully covered by the insulating anti-oxidation film be immersed into the cooling liquid, so as to finish assembling the immersion cooling type electronic device.

Description

Immersion heat dissipation type electronic device and assembly method thereof

The present invention relates to an electronic device, and more particularly to an immersion cooling electronic device in which the internal component assembly is immersed in a cooling liquid to improve the heat dissipation performance and an assembly method thereof.

As people's requirements for electronic devices become more and more diverse, electronic devices must be equipped with higher and higher performance or more and more electronic components to perform more and more functions. At the same time, higher and higher performance or more and more electronic components will also release more and more heat when they are in operation, so they need to be equipped with heat dissipation components with high heat dissipation performance to dissipate the heat.

The heat dissipation modules used in the prior art mainly include air-cooled and liquid-cooled. For air-cooled heat dissipation modules, since the thermal conductivity of air is poor, a heat sink is required to transfer the heat energy generated by the electronic components to the heat dissipation surface of the heat sink, and then a fan is used to perform forced convection to exchange heat with the heat dissipation surface, and an appropriate air guide structure (such as an air guide plate, an air cover, an air guide channel, an air inlet or an air outlet, etc.) is used to improve the heat dissipation performance. However, this air-cooling method not only requires a considerable amount of internal space in the electronic device to install the heat sink, fan and air guide structure, thereby crowding out the installation space for other components, but also has problems such as low heat dissipation efficiency and uneven performance due to low thermal conductivity of air and uneven flow field.

On the other hand, for liquid-cooled heat dissipation modules, electronic components are usually assembled on the heat sink, and then the heat dissipation pipes are passed through the heat sink. The heat energy is transferred from the electronic components to the heat dissipation working fluid (usually water or refrigerant) in the heat dissipation pipes through multiple heat conduction methods, and the heat dissipation working fluid is cooled before flowing to the heat sink. However, although this air-cooled heat dissipation method can provide higher heat dissipation performance than air-cooled heat dissipation methods, it not only still has the problem of occupying the internal space of the electronic device to install the heat sink, thereby excluding the installation space of other components, but also has the problem of greatly reduced heat dissipation performance due to multiple heat conduction in different media, long heat conduction path, and uneven heat dissipation performance.

In view of the fact that in the prior art, there are common problems such as the heat dissipation module occupying the internal space of the electronic device, poor heat dissipation performance and uneven heat dissipation; the main purpose of the present invention is to provide a new heat dissipation means to achieve the purpose of not occupying the internal space of the electronic device, shortening the heat conduction path and improving the heat dissipation uniformity. Therefore, one of the necessary technical means adopted by the present invention to solve the problems of the prior art is to provide an immersion heat dissipation electronic device, which includes an electronic device housing, a cooling liquid, a circulating heat dissipation pipeline, an internal component assembly and an insulating anti-oxidation film.

The electronic device housing has a storage space. Cooling water is filled in the storage space. The circulating heat dissipation pipeline is connected to the storage space of the electronic device housing, and is used to cyclically draw the cooling water from the storage space for cooling and then introduce it into the storage space. After the internal component assembly is assembled, it is immersed in the cooling liquid in the storage space, so as to utilize the cooling liquid to dissipate the heat energy generated when the internal component assembly is operated. The insulating anti-oxidation film is pre-coated on the internal component assembly before the internal component assembly is immersed in the cooling water after the assembly is completed, so as to isolate the internal component assembly from the cooling liquid.

Another necessary technical means adopted by the present invention to solve the problems of the prior art is to provide an assembling method of an immersion heat dissipation type electronic device. In the assembling method, an internal component assembly is first assembled, and then the assembled internal component assembly is vacuum plated to form an insulating anti-oxidation film covering the internal component assembly.

Next, an electronic device housing with a housing space is prepared, and a circulating heat dissipation pipeline is assembled on the electronic device housing so that the circulating heat dissipation pipeline is connected to the housing space. Then, cooling water is filled in the housing space, and the internal component assembly coated with an insulating anti-oxidation film is placed in the housing space and immersed in the cooling liquid.

Based on the above two necessary technical means, the derived subsidiary technical means are preferably that the circulating heat dissipation pipeline includes a heat exchange component assembly, and the heat exchange component assembly includes a heat exchange module and a filter module. After the cooling liquid absorbs the heat energy generated when the internal component assembly operates and flows into the heat exchange module for cooling, it flows back to the accommodation space. The filter module is used to filter impurities or foreign matter mixed in the cooling liquid.

The insulating anti-oxidation film is a Parylene N (polyparaxylene) coating. The electronic device housing may further include a transparent panel, and the transparent panel can be used to observe a liquid level position of the cooling liquid. The immersion cooling electronic device may also include a cover plate, and the cover plate is covered on the electronic device housing to prevent foreign objects from entering the accommodation space.

Preferably, before placing the internal component assembly coated with the insulating anti-oxidation film in the accommodation space and immersing it in cooling water, the circulating heat dissipation pipeline can be started first to allow cooling water to flow into the circulating heat dissipation pipeline to remove residual air in the circulating heat dissipation pipeline.

In summary, in the immersion cooling electronic device provided by the present invention, the cooling liquid is filled in the accommodation space in the electronic device housing, and the internal component assembly is placed in the cooling liquid after being assembled and covered with an insulating anti-oxidation film. The cooling liquid will automatically fill the gaps in the assembled internal component assembly, thereby achieving the effect of not crowding out the installation space of all components.

At the same time, since the heat capacity of water is much higher than that of air, the heat energy generated by electronic components can be directly transferred to the cooling liquid through the extremely thin insulating antioxidant film, thereby greatly shortening the heat conduction path. Under the dual effects of high heat capacity and greatly shortened heat conduction path, the heat dissipation efficiency can naturally be improved.

Furthermore, since the cooling liquid can flow in the accommodation space to transfer heat energy, the technical means provided by the present invention can also greatly improve the effect of uniform heat dissipation. In addition, in addition to achieving the above-mentioned effects, since the insulating anti-oxidation film covers the internal component assembly, the technical means provided by the present invention can also achieve the effects of avoiding leakage and improving the anti-oxidation (including anti-corrosion) ability of the internal component assembly.

Since the form data input method determination system provided by the present invention can be widely used to determine whether the form data is generated by automatic input or manual input, its application level is quite broad, so it will not be described one by one here, and only a preferred embodiment is listed to be specifically explained, and this embodiment is only used to conveniently and clearly assist in explaining the purpose and effect of the embodiment of the present invention.

Please refer to the first to eighth figures, which are schematic diagrams of a series of assembly processes of an immersion heat dissipation type electronic device assembly method provided by the preferred embodiment of the present invention. The first figure shows the assembly of an internal component assembly; the second figure shows the schematic diagram of the internal component assembly after the assembly is completed; the third figure shows the vacuum coating of the internal component assembly after the assembly is completed to form an insulating anti-oxidation film covering the internal component assembly; the fourth figure shows the preparation of an electronic device housing with a accommodating space; the fifth figure shows the assembly of a circulating heat dissipation pipeline in the electronic device; The housing is placed so that the circulating heat dissipation pipeline is connected to the accommodation space, and a coolant is filled in the accommodation space; the sixth figure shows that the internal component assembly coated with an insulating anti-oxidation film is placed in the accommodation space and immersed in the coolant; the seventh figure shows that a cover plate is covered on the electronic device housing to prevent foreign matter from entering the accommodation space; the eighth figure shows a schematic diagram of the appearance of the immersion cooling electronic device after assembly.

As shown in the first figure, in the assembly method used to assemble an immersion heat dissipation electronic device 100 (indicated in the eighth figure), first, an internal component assembly 1 must be assembled and necessary tests must be completed to confirm that the internal component assembly 1 can operate normally. The internal component assembly 1 includes a plurality of electronic components 11 and a plurality of external wires 12. The electronic components 11 can be functional electronic parts (such as chips, passive components or active components, etc.), connectors (including slots), internal connection wires (such as cables or flat cables, etc.), circuit boards, power supplies, indicator lights or other electronic components.

As shown in the second and third figures, after the internal component assembly 1 is assembled, the internal component assembly 1 may be vacuum plated to form an insulating anti-oxidation film 2 covering the internal component assembly 1. Preferably, the insulating anti-oxidation film 2 may be a Parylene N (polyparaxylene) coating.

Please refer to Table 1, which shows the relevant material properties suitable for use as an insulating anti-oxidation film. As shown in Table 1, when Parylene N (polyparaxylene) coating is selected as the insulating anti-oxidation film 2, its relevant material properties show that it has sufficient mechanical strength, high surface resistance, sufficient dielectric constant, low moisture permeability, sufficiently high melting point temperature and sufficiently high thermal conductivity.

Table 1: Insulation anti-oxidation film related material properties Main component of insulating antioxidant film Parylene Tensile strength(MPa) 45 Yield strength (MPa) 43 Surface resistance 23℃, 50%RH(Ω) Dielectric constant (at 60Hz) 2.65 Dielectric constant (at 1kHz) 2.65 Dielectric constant (at 1MHz) 2.65 Moisture permeability at 37℃, 24hr (g-mil/100 ) 1.59 Melting point temperature (℃) 410 Thermal conductivity ( )． (cal/sec)/( ．℃/cm) 3

Since the necessary electrical connection relationship is maintained between the electronic components 11 in the internal component assembly 1 when the internal component assembly 1 has been assembled, vacuum plating is performed to form the insulating anti-oxidation film 2 when the internal component assembly 1 has been assembled, and the electrical connection relationship between the electronic components 11 in the internal component assembly 1 will not be affected. Only the external end 121 of the external wire 12 is still maintained and covered by the insulating anti-oxidation film 2. Therefore, the external end 121 can be electrically connected to other external electrical devices (such as sockets, power supply devices, switches, gates or other external electrical devices).

As shown in FIG. 4 , after completing the above steps, an electronic device housing 3 and a cover plate 4 can be prepared. The electronic device housing 3 has a containing space AS, and includes a transparent panel 31 and an operation panel 32. The cover plate 4 can be provided with a wire outlet hole H1 and a water supply hole H2, and includes a sealing plug 41 for sealing the water supply hole H2.

As shown in the fifth figure, after completing the above steps, a circulating heat dissipation pipeline 5 can be assembled on the electronic device housing 3, so that the circulating heat dissipation pipeline 5 is connected to the accommodation space AS, and a coolant 6 is filled in the accommodation space AS. The circulating heat dissipation pipeline 5 can include a heat exchange component assembly 51, and the heat exchange component assembly 51 includes a heat exchange module 511 and a filter module 512. After assembling the circulating heat dissipation pipeline 5, the circulating heat dissipation pipeline 5 can be started first to allow the coolant 6 to flow into the circulating heat dissipation pipeline 5 to remove the residual air in the circulating heat dissipation pipeline 5.

As shown in the sixth figure, after completing the above steps, the internal component assembly 1 coated with the insulating anti-oxidation film 2 can be placed in the accommodating space S (marked in the fifth figure) and immersed in the cooling liquid 6, and the external end 121 of the external wire 12 is kept outside the cooling liquid 6 and not immersed in the cooling liquid 6.

As shown in FIG. 7 and FIG. 8, after completing the above steps, the external connection ends 121 of the external connection wires 12 can be passed through the wire outlet hole H1 of the cover plate 4, and the cover plate 4 can be closed on the electronic device housing 3 to prevent foreign objects from entering the accommodating space AS (indicated in FIG. 5). The connection end 121 of at least one of the external connection wires 12 passes through the wire outlet hole H1 and is then electrically connected to the operation panel 32 using an electrical connector (not shown). After completing all the above steps, the immersion heat dissipation type electronic device 100 shown in FIG. 8 can be assembled.

Please refer to the first to eighth figures. The present invention also provides an immersion cooling electronic device 100. Preferably, the immersion cooling electronic device 100 can be assembled by the above-mentioned assembly method. However, it is not excluded that it can also be assembled by other methods. The immersion cooling electronic device 100 can be a server, an industrial computer, a personal computer or other electronic devices with high heat dissipation requirements. In this embodiment, the server is taken as an example. The immersion cooling electronic device 100 can include an internal component assembly 1, an insulating anti-oxidation film 2, an electronic device housing 3, a cover plate 4, a circulating heat dissipation pipeline 5 and a cooling liquid 6.

The internal component assembly 1 includes a plurality of electronic components 11 and a plurality of external wires 12. The electronic components 11 may be functional electronic parts (such as chips, passive components or active components, etc.), connectors (including slots), internal connection wires (such as cables or flat cables, etc.), circuit boards, power supplies, indicator lights or other electronic components. The external wires 12 have external connection ends 121. In addition, when the internal component assembly 1 is in operation, heat energy is generated.

The insulating anti-oxidation film 2 is formed after the internal component assembly 1 is vacuum-plated after assembly. Therefore, the insulating anti-oxidation film 2 will cover the internal component assembly 1 (the surface thereof), leaving only the external end 121 of the external wire 12 exposed and not covered by the insulating anti-oxidation film 2. Usually, the insulating anti-oxidation film 2 can be between 0.05mm and 0.35mm. At this thickness, a certain degree of thermal conductivity must still be maintained, at least its thermal conductivity should still be much better than air or a water-cooled heat dissipation module with a thermal conduction path length greater than 0.35mm.

Therefore, after reading the above disclosure, a person with ordinary knowledge in the relevant technical field should be able to understand that when selecting the material of the insulating anti-oxidation film 2, the main consideration is that the insulating anti-oxidation film 2 must have sufficient mechanical strength, sufficiently high surface resistance and dielectric constant, sufficiently low moisture permeability and sufficiently high melting point temperature.

The insulating anti-oxidation film 2 has sufficient mechanical strength to avoid deformation when subjected to the pressure of the coolant 6. The insulating anti-oxidation film 2 has a sufficiently high surface resistance and dielectric constant to provide better insulation and reduce the leakage current and leakage amount from the electronic component 11 to the coolant 6. The insulating anti-oxidation film 2 has a sufficiently low moisture permeability to reduce or inhibit the coolant from penetrating into the internal component assembly 1 (especially the electronic component 11) and enhance the anti-oxidation ability of the internal component assembly 1. The insulating anti-oxidation film 2 has a sufficiently high melting point temperature to prevent the insulating anti-oxidation film 2 from being melted or partially melted and deformed when the electronic component 11 operates abnormally and generates instantaneous high heat power and releases a large amount of heat energy instantly. Of course, it would be more ideal if it also has higher thermal conductivity on the basis of meeting the above property requirements.

Therefore, after many experiments, the inventors of this case found that the best insulating anti-oxidation film is Parylene N (poly(p-xylene)) coating, as shown in Table 1, which can make the insulating anti-oxidation film 2 have sufficient mechanical strength, high surface resistance, sufficiently high dielectric constant, low moisture permeability, sufficiently high melting point temperature and sufficiently high thermal conductivity (poly(p-xylene dichloride) is a similar material, and it is reasonably estimated that it should also have sufficiently high thermal conductivity).

The electronic device housing 3 has a storage space AS and includes a transparent panel 31 and an operation panel 32. The cooling liquid 6 itself is preferably able to have a sufficiently high heat capacity and remain in a liquid state within the operating temperature range of the immersion heat dissipation electronic device 100. In addition, the cooling liquid 6 should also have a certain stability, cannot dissolve the polyparaxylene film or the electronic device housing 3, and is non-corrosive to polyparaxylene or the electronic device housing 3 and does not produce a chemical reaction. Therefore, under the above requirements, the cooling liquid 6 can be preferably deionized water (preferably pure water), and is filled in the storage space AS, and the internal component assembly 1 coated with the insulating anti-oxidation film 2 is immersed in the cooling liquid 6.

The so-called internal component assembly 1 coated with the insulating anti-oxidation film 2 is immersed in the cooling liquid 6. In a narrow sense, it means that the internal component assembly 1 coated with the insulating anti-oxidation film 2 is completely immersed in and submerged under the water surface of the cooling liquid 6; in a broad sense, it means that in the internal component assembly 1 coated with the insulating anti-oxidation film 2, all electronic components 11 that generate heat energy and have heat dissipation requirements during operation are immersed in and submerged under the water surface of the cooling liquid 6. In this embodiment, the former is taken as an example for explanation.

The transparent panel 31 is used to observe a water level of the cooling liquid 6. The operation panel 32 can be electrically connected to the connection end 121 of at least one of the external wires 12 (via an electrical connector, not shown) to operate the immersion cooling electronic device 100.

The cover plate 4 is covered on the electronic device housing 3 to prevent foreign objects from entering the accommodation space AS. In addition, the cover plate 4 may be provided with a wire outlet hole H1 and a water supply hole H2, and may include a hole sealing plug 41. The wire outlet hole H1 allows the external end 121 of the external wire 12 to pass through and then be electrically connected to other external electrical devices (such as a socket, a power supply device, a switch, a gateway or other external electrical devices). The hole sealing plug 41 is used to seal the water supply hole H2.

When it is observed through the transparent panel 31 that the water level of the cooling liquid 6 is too low, the sealing plug 41 can be taken out from the water replenishing hole H2, and the cooling liquid 6 can be injected into the accommodating space AS through the water replenishing hole H2 to replenish the cooling liquid 6 in the accommodating space AS. When it is observed that the water level of the cooling liquid 6 is high enough, the sealing plug 41 can be plugged into the water replenishing hole H2 again to block the water replenishing hole H2.

The circulating heat dissipation pipe 5 is assembled on the electronic device housing 3 so that the circulating heat dissipation pipe 5 is connected to the accommodation space AS. Preferably, the circulating heat dissipation pipe 5 may include a heat exchange component assembly 51, and the heat exchange component assembly 51 includes a heat exchange module 511 and a filter module 512. After the coolant 6 absorbs the heat energy generated when the internal component assembly 1 operates, it flows into the heat exchange module 511 to cool down, and then flows back to the accommodation space. Therefore, the circulating heat dissipation pipe 5 can be used to cyclically draw the coolant 6 that absorbs the heat energy from the accommodation space AS to cool it down and then introduce it into the accommodation space AS.

The filter module 512 is used to filter impurities or foreign objects mixed in the cooling liquid 6. The so-called impurities or foreign objects may be a small amount of peeled insulating anti-oxidation film 2, particles, debris or dust left when manufacturing the electronic device housing 3, or other small amounts of external dust, particles or other foreign objects dropped from the outlet hole H1 or the water supply hole H2.

In actual application, the cooling water 6 that absorbs heat energy can be selected to flow into the heat exchange module 511 to cool down first, and then flow into the filter module 512 to filter impurities or foreign matter; or the cooling water 6 that absorbs heat energy can be selected to flow into the filter module 512 to filter impurities or foreign matter first, and then flow into the heat exchange module 511 to cool down. Therefore, the internal pipeline of the heat exchange component assembly 51 can be assembled according to the above selection.

It must be emphasized that the internal component assembly 1 described in the present invention refers to the assembly formed by all the components (including the electronic component 11) located inside the electronic device housing 3 after assembly, rather than some of the components located inside the electronic device housing 3. According to the above definition, since the external end 121 of the external wire 12 is located outside the electronic device housing 3, to be precise, the external end 121 of the external wire 12 does not belong to the part of the internal component assembly 1 referred to in the present invention. In addition, the component symbols in Figures 1 to 8 with dotted lines as leads indicate that the component is covered or covered.

In summary, in the immersion cooling electronic device 100 provided by the present invention, the cooling liquid 6 is filled in the accommodation space AS in the electronic device housing 3, and the internal component assembly 1 is immersed in the cooling liquid 6 after being assembled and covered with an insulating anti-oxidation film. The cooling liquid 6 will automatically fill the gaps in the assembled internal component assembly 1, thereby achieving the effect of not crowding out the installation space of all components.

At the same time, since the heat capacity of the cooling liquid 6 is much higher than that of air, the heat energy generated by the electronic components 11 can be directly transferred to the cooling liquid 6 through the extremely thin insulating anti-oxidation film 2, thereby greatly shortening the heat conduction path. Under the dual effects of high heat capacity and greatly shortened heat conduction path, the effect of improving heat dissipation efficiency can naturally be achieved.

Furthermore, since the cooling liquid 6 can flow in the accommodation space AS to transfer heat energy, the technical means provided by the present invention can also greatly improve the effect of uniform heat dissipation. In addition, in addition to achieving the above-mentioned effects, since the insulating anti-oxidation film 2 covers the internal component assembly 1, the technical means provided by the present invention can also achieve the effects of avoiding leakage and improving the anti-oxidation (including anti-corrosion) ability of the internal component assembly 1.

The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention.

100: Immersion cooling electronic device 1: Internal component assembly 11: Electronic components 12: External wire 121: External terminal 2: Insulating anti-oxidation film 3: Electronic device housing 31: Transparent panel 32: Operation panel 4: Cover plate 41: Sealing plug 5: Circulating heat dissipation pipeline 51: Heat exchange component assembly 511: Heat exchange module 512: Filter module 6: Cooling liquid AS: Accommodation space H1: Wire outlet hole H2: Water filling hole

The first figure shows the assembly of an internal component assembly; The second figure shows a schematic diagram of the internal component assembly after assembly; The third figure shows the vacuum coating of the internal component assembly after assembly to form an insulating anti-oxidation film covering the internal component assembly; The fourth figure shows the preparation of an electronic device housing with a storage space; the fifth figure shows the assembly of a circulating heat dissipation pipeline to the electronic device housing, connecting the circulating heat dissipation pipeline to the storage space, and filling the storage space with a cooling liquid; The sixth figure shows the placement of the internal component assembly covered with the insulating anti-oxidation film in the storage space and immersed in the cooling liquid; Figure 7 shows a cover plate being fitted to the housing of the electronic device to prevent foreign matter from entering the storage space; and Figure 8 shows a schematic diagram of the appearance of the immersion cooling electronic device after assembly.

100: Immersion cooling electronic device

1: Internal component assembly

12: Connect external cables

121: even the external end

2: Insulating antioxidant film

3: Electronic device housing

31: Transparent panel

32: Operation panel

4: Cover plate

41: Sealing plug

5: Circulating heat dissipation pipeline

51: Heat exchange component assembly

511: Hot exchange module

512: Filter module

6: Cooling fluid

H1: Wire outlet hole

H2: Water filling hole

Claims (10)

An immersion heat dissipation electronic device comprises: an electronic device housing having a storage space; a cooling liquid filled in the storage space; a circulating heat dissipation pipeline connected to the storage space of the electronic device housing, for cyclically extracting the cooling liquid from the storage space for cooling and then introducing it into the storage space; an internal component assembly, after being assembled, is immersed in the cooling liquid in the storage space, so as to utilize the cooling liquid to dissipate the heat energy generated when the internal component assembly is in operation; and an insulating anti-oxidation film, which is a Parylene N (polyparaxylene) coating is applied, and before the internal component assembly is immersed in the coolant after assembly, the internal component assembly is pre-coated to isolate the internal component assembly from the coolant. As described in claim 1, the immersion cooling electronic device, wherein the circulating heat dissipation pipeline includes a heat exchange component assembly, and the heat exchange component assembly includes a heat exchange module and a filter module, the cooling liquid absorbs the heat energy generated when the internal component assembly is in operation and flows into the heat exchange module for cooling, and then flows back to the accommodation space; and the filter module is used to filter impurities or foreign matter mixed in the cooling liquid. The immersion cooling electronic device as described in claim 1, wherein the insulating anti-oxidation film is formed after the internal component assembly is vacuum-plated after the assembly is completed. An immersion cooling electronic device as described in claim 1, wherein the electronic device housing further comprises a transparent panel, and the transparent panel is used to observe a liquid level position of the cooling liquid. The immersion cooling electronic device as described in claim 1 further includes a cover plate, and the cover plate is covered on the electronic device housing to prevent foreign objects from entering the accommodation space. An immersion cooling electronic device as described in claim 1, wherein the cooling liquid is deionized water. A method for assembling an immersion cooling electronic device comprises the following steps: (a) assembling an internal component assembly; (b) performing a vacuum coating on the assembled internal component assembly to form an insulating anti-oxidation film covering the internal component assembly; (c) preparing an electronic device housing having a housing space, and assembling a circulating heat dissipation pipeline on the electronic device housing so that the circulating heat dissipation pipeline is connected to the housing space; (d) filling the housing space with a cooling liquid; and (e) placing the internal component assembly covered with the insulating anti-oxidation film in the housing space and immersing it in the cooling liquid. The assembly method of an immersion cooling electronic device as described in claim 7, wherein the insulating anti-oxidation film formed in step (b) is a Parylene N (polyparaxylene) coating film. The assembly method of an immersion cooling electronic device as described in claim 7, wherein the step (d) further includes a step (d1), and the step (d1) is to start the circulating cooling pipe before executing the step (e) to allow the cooling water to flow into the circulating cooling pipe, so as to remove the residual air in the circulating cooling pipe. The manufacturing method of the immersion heat dissipation electronic device as described in claim 7, wherein the step (e) further includes a step (f), and the step (f) is to cover a cover plate on the electronic device housing.

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