TWI863665B - Vibration mechanism for grinding wheel - Google Patents
Vibration mechanism for grinding wheel Download PDFInfo
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- TWI863665B TWI863665B TW112141746A TW112141746A TWI863665B TW I863665 B TWI863665 B TW I863665B TW 112141746 A TW112141746 A TW 112141746A TW 112141746 A TW112141746 A TW 112141746A TW I863665 B TWI863665 B TW I863665B
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Abstract
Description
本發明關於一種對研磨輪進行振動的振動構造,特別是一種藉由調整一振盪單元與一研磨輪之間的距離的振動構造。The present invention relates to a vibration structure for vibrating a grinding wheel, and in particular to a vibration structure by adjusting the distance between an oscillation unit and a grinding wheel.
在一輪磨加工過程中,產生的碎屑會附著在研磨輪的表面或孔隙中,因而影響研磨輪的磨削能力及加工精度、光度,為解決碎屑附著在研磨輪的研磨面或孔隙中的問題,會利用鑽石筆修整研磨輪的研磨面,然這也造成研磨輪及鑽石筆的損耗,此外,當以該鑽石筆修整研磨輪時,該研磨輪並無法進行該輪磨加工。During a grinding process, the generated debris will adhere to the surface or pores of the grinding wheel, thus affecting the grinding ability, processing accuracy and brightness of the grinding wheel. In order to solve the problem of debris adhering to the grinding surface or pores of the grinding wheel, a diamond pen is used to trim the grinding surface of the grinding wheel. However, this also causes the wear of the grinding wheel and the diamond pen. In addition, when the diamond pen is used to trim the grinding wheel, the grinding wheel cannot be used for the grinding process.
本發明的主要目的是在提供一種研磨輪的振動構造,其藉由調整一振盪單元的一變幅板與一研磨輪之間的一距離,以使該振動構造以非接觸方式移除附著在一研磨輪的研磨面或孔隙中的碎屑,並藉由調整該變幅板與該研磨輪之間的該距離,以提高該振動構造振動該研磨輪的效能。The main purpose of the present invention is to provide a vibration structure of a grinding wheel, which can remove debris attached to the grinding surface or in the pores of a grinding wheel in a non-contact manner by adjusting a distance between a variable amplitude plate of an oscillation unit and a grinding wheel, and improve the efficiency of the vibration structure in vibrating the grinding wheel by adjusting the distance between the variable amplitude plate and the grinding wheel.
本發明之一種研磨輪的振動構造,用以對一研磨裝置的一研磨輪進行振動,該振動構造包含一調整單元及一振盪單元,該調整單元具有一載台、至少一導桿、一基座及一調整桿,該導桿的一端部結合於該載台,並顯露出該導桿的一桿體,該基座活動地結合於該桿體,該調整桿包含一接合部及一傳動部,該接合部轉動地接合於該載台,該傳動部轉動地穿設於該基座的一穿孔,該傳動部用以帶動該基座朝該載台的方向或反方向移動,該振盪單元具有一變幅板及一振盪器,該變幅板結合於該振盪器,該振盪器結合於該基座,該基座用以帶動該振盪單元,使該變幅板朝該研磨輪的方向或反方向移動,以調整該變幅板與該研磨輪之間的一距離。The present invention discloses a vibration structure of a grinding wheel, which is used to vibrate a grinding wheel of a grinding device. The vibration structure includes an adjustment unit and an oscillation unit. The adjustment unit has a carrier, at least one guide rod, a base and an adjustment rod. One end of the guide rod is connected to the carrier and a rod body of the guide rod is exposed. The base is movably connected to the rod body. The adjustment rod includes a joint part and a transmission part. The joint part is rotatably connected to the carrier. The transmission part is engaged with the carrier, and is rotatably penetrated through a through hole of the base. The transmission part is used to drive the base to move toward or in the opposite direction of the carrier. The oscillation unit has a variable amplitude plate and an oscillator. The variable amplitude plate is combined with the oscillator, and the oscillator is combined with the base. The base is used to drive the oscillation unit to move the variable amplitude plate toward or in the opposite direction of the grinding wheel to adjust a distance between the variable amplitude plate and the grinding wheel.
本發明藉由該調整單元帶動該振盪單元,使該振盪單元的該變幅板朝該研磨輪的方向或反方向移動,以調整該變幅板與該研磨輪之間的一距離,以對該研磨輪進行振動,使得附著在該研磨輪的表面或孔隙中的碎屑被振離該研磨輪。The present invention drives the oscillation unit by the adjustment unit, so that the amplitude change plate of the oscillation unit moves toward or in the opposite direction of the grinding wheel to adjust a distance between the amplitude change plate and the grinding wheel, so as to vibrate the grinding wheel, so that the debris attached to the surface or pores of the grinding wheel is vibrated off the grinding wheel.
請參閱第1至3圖,本發明的一種研磨輪的振動構造100,其用以對一研磨裝置200的一研磨輪210進行非接觸式振動,以移除附著在該研磨輪210的一研磨面或一孔隙中的一碎屑(圖未繪出),在本實施例中,該振動構造100設置於該研磨裝置200的一防護罩220,但不以此為限制,該振動構造100可依據該研磨裝置200的加工空間及環境,設置於不同位置,以利該振動構造100對該研磨輪210進行振動。Please refer to Figures 1 to 3, a
請參閱第3至5圖,該振動構造100包含一調整單元110及一振盪單元120,該調整單元110具有一載台111、至少一導桿112、一基座113及一調整桿114,請參閱第3及5圖,該導桿112具有一端部112a及一桿體112b,該端部112a結合於該載台111,並顯露出該桿體112b,該基座113活動地結合於該桿體112b ,並可朝該載台111的方向或反方向移動,在本實施例中,該基座113具有至少一導孔113b,該桿體112b活動地穿設於該導孔113b中,使該基座113可藉由該桿體112b朝該載台111的方向或反方向移動。Referring to FIGS. 3 to 5, the
請參閱第3及4圖,該調整桿114包含一接合部114a及一傳動部114b,該接合部114a轉動地接合於該載台111,在本實施例中,該接合部114a轉動地接合於該載台111的一接合孔111a中,較佳地,該載台111具有一限位件111b,該接合部114a具有一環溝槽114a1,該限位件111b設置於該接合孔111a中,該限位件111b的一限位部111b1位於該環溝槽114a1中,使該調整桿114轉動地接合於該載台111,並可避免該接合部114a脫離該接合孔111a。Please refer to Figures 3 and 4. The adjusting
請參閱第3至5圖,該傳動部114b轉動地穿設於該基座113的一穿孔113a,在本實施例中,該傳動部114b藉由該穿孔113a帶動該基座113朝該載台111的方向或反方向移動,該傳動部114b可選自於一螺桿,該穿孔113a可選自於一螺孔,該傳動部114b螺合於該穿孔113a,當轉動該調整桿114時,藉由該導桿112的該桿體112b限制該基座113轉動,以及藉由該調整桿114的該接合部114a轉動地接合於該接合孔111a中,使該傳動部114b藉由該穿孔113a帶動該基座113朝該載台111的方向或反方向移動。Referring to FIGS. 3 to 5 , the
請參閱第3至5圖,該振盪單元120具有一變幅板121及一振盪器122,該變幅板121結合於該振盪器122,在本實施例中,該振盪單元120另具有一變幅桿123,該變幅板121以該變幅桿123結合於該振盪器122,該變幅桿123用以傳遞該振盪器122的振動能量,並增加該變幅板121的振幅,較佳地,該變幅板121為一弧形體,以對應該研磨輪210的該研磨面,該振盪器122可選自於超聲波振盪器等振盪元件,該振盪器122結合於該基座113,該基座113用以帶動該振盪單元120,使該變幅板121朝該研磨輪210的方向或反方向移動,以調整該變幅板121與該研磨輪210之間的一距離D1,以利該變幅板121對該研磨輪210進行振動,在一使用該振動構造100的實施例中,該變幅板121與該研磨輪210之間設有一液體(圖未繪出),藉由該振盪器122使該變幅板121振動,使該變幅板121振動該液體,以產生空化作用,以對該研磨輪210進行振動。Referring to FIGS. 3 to 5 , the
請參閱第3至6圖,在本實施例中,該基座113包含一第一夾持部113c、一第二夾持部113d及一夾持空間113e,該夾持空間113e位於該第一夾持部113c與該第二夾持部113d之間,該振盪器122設置於該夾持空間113e,且被該第一夾持部113c與該第二夾持部113d夾持,較佳地,該基座113包含至少一螺桿113f,該第二夾持部113d以該螺桿113f與該第一夾持部113c結合成一體,且該第二夾持部113d以該螺桿113f調整該第一夾持部113c與該第二夾持部113d之間的一間距D2,以利該第一夾持部113c與該第二夾持部113d夾持不同外徑或輪廓的該振盪器122。Referring to FIGS. 3 to 6 , in this embodiment, the
請參閱第3至5圖,在本實施例中,該振動構造100另包含一結合座130,該載台111結合於該結合座130,該載台111以該結合座130結合於該研磨裝置200的該防護罩220,但不以此為限,在不同的實施例中,該載台111可依據該研磨裝置200的加工空間及環境,設置於不同位置,以利該振動構造100對該研磨輪210進行振動,在本實施例中,該振動構造100另包含至少一結合件140,該結合座130另具有至少一導槽131,該結合件140穿設於該導槽131,該結合件140並可在該導槽131移動,該結合件140可選自於螺栓,該載台111以該結合件140結合於結合座130,該載台111藉由該結合件140調整該變幅板121對應於該研磨輪210的位置,以利該變幅板121對該研磨輪210進行振動。Please refer to FIGS. 3 to 5. In this embodiment, the
請參閱第3及6圖,在本實施例中,該調整單元110另具有一定位件115,該定位件115可選自於螺栓或定位梢,但不以此為限,該定位件115設置於該導孔113b中,該定位件115用以抵觸該桿體112b,以在該調整桿114帶動該基座113使該變幅板121移動至對應該研磨輪210的一預定位置時,藉由該定位件115抵觸該桿體112b, 以避免該基座113因振動而產生位移,而造成該變幅板121碰撞或遠離該研磨輪210,較佳地,該桿體112b具有一朝向該定位件115的一平面112c,該平面112c用以供該定位件115抵觸。Please refer to FIGS. 3 and 6 . In this embodiment, the
請參閱第3、5及6圖,該調整單元110另具有一防轉動件116,該導桿112具有一限位槽112d,該防轉動件116設置於該導孔113b中,該防轉動件116的一末端部116a位於該限位槽112d中,以避免該導桿112或該基座113轉動,較佳地,該調整桿114具有一頭部114c,該傳動部114b位於該接合部114a及該頭部114c之間,且該基座113顯露出該頭部114c,藉由轉動該頭部114c,以使該傳動部114b帶動該基座113及該振盪單元120移動,使該變幅板121朝該研磨輪210的方向或反方向移動,更佳地,該頭部114c具有複數個位移刻度114d,該基座113具有一對位標113g,該對位標113g用以對應該些位移刻度114d的其中之一位移刻度114d,當轉動該頭部114c時,藉由該位移刻度114d的位移數量,判斷該變幅板121與該研磨輪210之間的該距離D1。Please refer to Figures 3, 5 and 6. The
請參閱第1至3圖,本發明藉由該調整單元110的該調整桿114帶動該基座113朝該載台111的方向或反方向移動,同時藉由該載台111帶動該振盪單元120朝該研磨輪210的方向或反方向移動,以調整該變幅板121與該研磨輪210之間的該距離D1,以提高該變幅板121對該研磨輪210的振動效率及效能,以將附著在該研磨輪210的表面或孔隙中的碎屑被振離該研磨輪210,尤其在輪磨加工過程中,該研磨輪210因研磨待加工件(圖未繪出),而造成該研磨輪210的一外徑縮小,使得該距離D1變大時,藉由該調整單元110帶動該振盪單元120朝該研磨輪210的方向移動,以調整該距離D1,以提高該變幅板121對該研磨輪210的振動效率及效能。Referring to FIGS. 1 to 3, the present invention drives the base 113 to move toward or in the opposite direction of the
本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of protection of the present invention shall be determined by the scope of the attached patent application. Any changes and modifications made by anyone familiar with this technology without departing from the spirit and scope of the present invention shall fall within the scope of protection of the present invention.
100:振動構造100: Vibration structure
110:調整單元110: Adjustment unit
111:載台111: Carrier
111a:接合孔111a: Engagement hole
111b:限位件111b: Limiting piece
111b1:限位部111b1: Limiting part
112:導桿112: Guide rod
112a:端部112a: End
112b:桿體112b: Rod
112c:平面112c: Plane
112d:限位槽112d: Limiting slot
113:基座113: Base
113a:穿孔113a: Perforation
113b:導孔113b: Guide hole
113c:第一夾持部113c: first clamping portion
113d:第二夾持部113d: Second clamping portion
113e:夾持空間113e: Clamping space
113f:螺桿113f: Screw
113g:對位標113g: Alignment mark
114:調整桿114: Adjustment rod
114a:接合部114a: Joint
114a1:環溝槽114a1: Annular groove
114b:傳動部114b: Transmission
114c:頭部114c: Head
114d:位移刻度114d: Displacement scale
115:定位件115: Positioning piece
116:防轉動件116: Anti-rotation parts
116a:末端部116a: terminal end
120:振盪單元120: Oscillator unit
121:變幅板121: Luffing plate
122:振盪器122: Oscillator
123:變幅桿123: Luffing rod
130:結合座130: Combination seat
131:導槽131:Guide groove
140:結合件140:Joining parts
200:研磨裝置200: Grinding device
210:研磨輪210: Grinding wheel
220:防護罩220: Protective cover
D1:距離D1: Distance
D2:間距D2: Distance
第1圖:本發明的振動構造設置於研磨裝置的立體圖。 第2圖:本發明的振動構造的立體圖。 第3圖:本發明的振動構造的分解立體圖。 第4-6圖:本發明的振動構造的剖視圖。 Figure 1: A three-dimensional view of the vibration structure of the present invention installed in a grinding device. Figure 2: A three-dimensional view of the vibration structure of the present invention. Figure 3: An exploded three-dimensional view of the vibration structure of the present invention. Figures 4-6: Cross-sectional views of the vibration structure of the present invention.
100:振動構造 100: Vibration structure
110:調整單元 110: Adjustment unit
111:載台 111: Carrier
111a:接合孔 111a: Engagement hole
111b:限位件 111b: Limiting parts
111b1:限位部 111b1: Limiting part
113a:穿孔 113a: Perforation
113c:第一夾持部 113c: First clamping part
113d:第二夾持部 113d: Second clamping part
113e:夾持空間 113e: Clamping space
114a:接合部 114a: Joint
114a1:環溝槽 114a1: Annular groove
114b:傳動部 114b: Transmission unit
114c:頭部 114c: Head
120:振盪單元 120: Oscillator unit
121:變幅板 121: Luffing plate
122:振盪器 122: Oscillator
123:變幅桿 123: Luffing rod
130:結合座 130: Combination seat
200:研磨裝置 200: Grinding device
210:研磨輪 210: Grinding wheel
220:防護罩 220: Protective shield
D1:距離 D1: Distance
Claims (13)
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|---|---|---|---|
| TW112141746A TWI863665B (en) | 2023-10-31 | 2023-10-31 | Vibration mechanism for grinding wheel |
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| US6149505A (en) * | 1997-08-29 | 2000-11-21 | Applied Materials, Inc. | Cavitational polishing pad conditioner |
| US6354923B1 (en) * | 1997-12-22 | 2002-03-12 | Micron Technology, Inc. | Apparatus for planarizing microelectronic substrates and conditioning planarizing media |
| JP2002321134A (en) * | 2001-04-25 | 2002-11-05 | Ricoh Co Ltd | Processing tool cleaning device |
| JP2006281419A (en) * | 2005-04-05 | 2006-10-19 | Canon Inc | Processing fluid supply device and processing device |
| TW201819106A (en) * | 2016-11-29 | 2018-06-01 | 財團法人金屬工業研究發展中心 | Apparatus for ultrasonic-assisted grinding |
| TW202015860A (en) * | 2018-10-23 | 2020-05-01 | 財團法人金屬工業研究發展中心 | Apparatus for grinding wheel chip removing and sharpening |
| JP2022529558A (en) * | 2019-01-23 | 2022-06-23 | フェルロボティクス コンプライアント ロボット テクノロジー ゲーエムベーハー | Robot-assisted grinding device with built-in maintenance unit |
| TW202142362A (en) * | 2020-05-07 | 2021-11-16 | 日商迪思科股份有限公司 | Grinding apparatus |
| TW202325478A (en) * | 2022-12-15 | 2023-07-01 | 大陸商西安奕斯偉材料科技有限公司 | Grinding and cleaning equipment |
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| Publication number | Publication date |
|---|---|
| TW202519359A (en) | 2025-05-16 |
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