TWI850825B - Ultrasonic transducer - Google Patents
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Abstract
Description
本發明是有關於一種裝置,且特別是有關於一種超音波換能器。The present invention relates to a device, and more particularly to an ultrasonic transducer.
現行的超音波換能器能夠提供超音波訊號,並接收關聯於超音波訊號的反射訊號。然而,當受測物與超音波換能器之間存在障礙物時,反射訊號會被阻擋。舉例來說,受測物例如是胸腔。障礙物例如是肋骨。大部分的反射訊號會被阻擋。僅有少部分的反射訊號會經由肋間到達胸腔內的內臟。到達受測物的超音波訊號的強度必然是不足的。因此,如何使超音波訊號避開障礙物並維持到達受測物的超音波訊號的強度,是本領域技術人員的研究重點之一。Existing ultrasonic transducers can provide ultrasonic signals and receive reflected signals related to the ultrasonic signals. However, when there is an obstacle between the object under test and the ultrasonic transducer, the reflected signal will be blocked. For example, the object under test is the chest cavity. The obstacle is, for example, the ribs. Most of the reflected signals will be blocked. Only a small part of the reflected signal will reach the internal organs in the chest cavity through the intercostal space. The intensity of the ultrasonic signal reaching the object under test is inevitably insufficient. Therefore, how to make the ultrasonic signal avoid obstacles and maintain the intensity of the ultrasonic signal reaching the object under test is one of the research focuses of technical personnel in this field.
本發明提供一種超音波換能器,能夠使超音波訊號避開障礙物並維持到達受測物的超音波訊號的強度。The present invention provides an ultrasonic transducer which can make ultrasonic signals avoid obstacles and maintain the intensity of the ultrasonic signals reaching the object to be tested.
本發明的超音波換能器包括多個弧形換能陣元以及控制器。所述多個弧形換能陣元沿短軸方向平行排列。控制器耦接於所述多個弧形換能陣元。控制器驅動所述多個弧形換能陣元以使該些弧形換能陣元分別提供超音波訊號。The ultrasonic transducer of the present invention comprises a plurality of arc-shaped transducer array elements and a controller. The plurality of arc-shaped transducer array elements are arranged in parallel along the short axis direction. The controller is coupled to the plurality of arc-shaped transducer array elements. The controller drives the plurality of arc-shaped transducer array elements so that the arc-shaped transducer array elements provide ultrasonic signals respectively.
基於上述,本發明的超音波換能器包括所述多個弧形換能陣元。所述多個弧形換能陣元被驅動以產生感測空間。感測空間能夠避開受測物與超音波換能器之間存在障礙物。因此,到達受測物的超音波訊號的強度能夠被維持。此外,基於弧形換能陣元的弧形設計,超音波換能器在其他偵測方式下可提供更大的感測空間。Based on the above, the ultrasonic transducer of the present invention includes the plurality of arc-shaped transducer array elements. The plurality of arc-shaped transducer array elements are driven to generate a sensing space. The sensing space can avoid obstacles between the object under test and the ultrasonic transducer. Therefore, the intensity of the ultrasonic signal reaching the object under test can be maintained. In addition, based on the arc-shaped design of the arc-shaped transducer array element, the ultrasonic transducer can provide a larger sensing space under other detection modes.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.
本發明的部份實施例接下來將會配合附圖來詳細描述,以下的描述所引用的元件符號,當不同附圖出現相同的元件符號將視為相同或相似的元件。這些實施例只是本發明的一部份,並未揭示所有本發明的可實施方式。更確切的說,這些實施例只是本發明的專利申請範圍中的範例。Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. When the same element symbols appear in different drawings, they will be regarded as the same or similar elements. These embodiments are only part of the present invention and do not disclose all possible implementations of the present invention. More precisely, these embodiments are only examples within the scope of the patent application of the present invention.
請參考圖1,圖1是依據本發明第一實施例所繪示的超音波換能器的示意圖。在本實施例中,超音波換能器100包括弧形換能陣元A1~A6以及控制器120。弧形換能陣元A1~A6沿短軸方向D1平行排列。此外,弧形換能陣元A1~A6分別沿長軸方向D2以弧形方式彎曲。弧形換能陣元A1~A6被配置在超音波探頭110中。控制器120耦接於弧形換能陣元A1~A6。控制器120驅動弧形換能陣元A1~A6以使弧形換能陣元A1~A6分別提供超音波訊號SU。Please refer to FIG. 1, which is a schematic diagram of an ultrasonic transducer according to the first embodiment of the present invention. In this embodiment, the
舉例來說,控制器120提供驅動訊號SC至弧形換能陣元A1~A6。弧形換能陣元A1~A6分別反應於驅動訊號SC的電壓或相位來產生超音波訊號SU。For example, the
在本實施例中,弧形換能陣元A1~A6被驅動以產生感測空間。感測空間能夠避開受測物與超音波換能器100之間存在障礙物(例如是肋骨)。因此,到達受測物(例如是胸腔)的超音波訊號SU的強度能夠被維持。此外,基於弧形換能陣元A1~A6的弧形設計,超音波換能器100在其他偵測方式下可提供更大的感測空間。In this embodiment, the arc-shaped transducer array elements A1-A6 are driven to generate a sensing space. The sensing space can avoid obstacles (such as ribs) between the object under test and the
具體來說明,請同時參考圖1以及圖2,圖2是依據本發明一實施例所繪示的弧形換能陣元的操作示意圖。為了便於示出感測空間SSP1,圖2僅示出弧形換能陣元A1。在本實施例中,超音波換能器100例如以相位陣列(phase array)偵測方式或線性(linear)偵測方式來運行。因此,弧形換能陣元A1~A6的至少其中之一被驅動以產生具有扇形的感測空間SSP1。在本實施例中,感測空間SSP1是超音波訊號SU所能到達的空間。因此,感測空間SSP1加大使訊號擷取得以增加。應注意的是,感測空間SSP1避開了障礙物OB1、OB2(如,肋骨或其他骨骼)。因此,超音波訊號SU並不會被障礙物OB1、OB2所阻擋。到達感測空間SSP1中的目標物OT的超音波訊號SU的強度並不會被降低。除此之外,弧形換能陣元A1~A6中被驅動的弧形換能陣元的數量越多,感測空間SSP1中的訊號強度越大。因此,超音波換能器100可依據弧形換能陣元A1~A6中被驅動的弧形換能陣元的數量來控制超音波訊號SU的強度。如此一來,超音波換能器100具有良好的控制線性度。此外,扇形的感測空間SSP1能夠容易感測到細長的目標物OT(如,針狀物)。因此,超音波換能器100能夠以線性偵測方式來輕易地產生感測空間SSP1以偵測細長的目標物OT。Specifically, please refer to FIG. 1 and FIG. 2 at the same time. FIG. 2 is a schematic diagram of the operation of an arc-shaped transducer array according to an embodiment of the present invention. In order to facilitate the illustration of the sensing space SSP1, FIG. 2 only shows the arc-shaped transducer array A1. In this embodiment, the
另具體來說明,請同時參考圖1以及圖3,圖3是依據本發明一實施例所繪示的弧形換能陣元的另一操作示意圖。為了便於示出感測空間SSP2,圖3僅示出弧形換能陣元A1。在本實施例中,超音波換能器100例如以線性偵測方式來運行。因此,弧形換能陣元A1~A6的至少其中之一被驅動以產生感測空間SSP2。應注意的是,感測空間SSP2沿著弧形換能陣元A1~A6的發射面方向延伸。弧形換能陣元A1~A6的發射面呈弧形凸面。因此,感測空間SSP2被大幅地擴展。如此一來,超音波換能器100在線性偵測方式下可提供更大的感測空間。現行的超音波換能器必須利用凸面(convex)偵測方式來產生感測空間SSP2。因此,超音波換能器100能夠利用較簡單的線性偵測方式來產生感測空間SSP2。For further specific explanation, please refer to FIG. 1 and FIG. 3 simultaneously. FIG. 3 is another operation schematic diagram of the arc-shaped transducer array element according to an embodiment of the present invention. In order to facilitate the illustration of the sensing space SSP2, FIG. 3 only shows the arc-shaped transducer array element A1. In this embodiment, the
請回到圖1的實施例,在本實施例中,弧形換能陣元A1~A6還能夠接收反射訊號SR。反射訊號SR用以產生超音波影像。在本實施例中,弧形換能陣元A1~A6接收來自於感測空間的反射訊號SR。弧形換能陣元A1~A6分別反應於反射訊號SR而發生形變,以產生關連於所接收到的反射訊號SR的電訊號。所述電訊號被提供至控制器120。超音波影像依據所述電訊號被產生。舉例來說,位於超音波換能器100外部的處理電路會透過控制器120接收到電訊號,並將電訊號轉換為超音波影像。Please return to the embodiment of FIG. 1 . In this embodiment, the arc-shaped transducer array elements A1 to A6 can also receive a reflection signal SR. The reflection signal SR is used to generate an ultrasonic image. In this embodiment, the arc-shaped transducer array elements A1 to A6 receive a reflection signal SR from a sensing space. The arc-shaped transducer array elements A1 to A6 respectively react to the reflection signal SR and deform to generate an electrical signal related to the received reflection signal SR. The electrical signal is provided to the
在本實施例中,弧形換能陣元A1~A6的材料包括壓電材料。壓電材料例如是PZT壓電陶瓷(本發明並不以此為限)。舉例來說,弧形換能陣元A1~A6分別包括多個壓電結構或壓電圖案。In this embodiment, the material of the arc-shaped transducer array elements A1-A6 includes piezoelectric material. The piezoelectric material is, for example, PZT piezoelectric ceramic (the present invention is not limited thereto). For example, the arc-shaped transducer array elements A1-A6 include a plurality of piezoelectric structures or piezoelectric patterns.
本實施例的弧形換能陣元A1~A6的數量以6個為例。本發明的弧形換能陣元的數量可以是多個,並不以本實施例的弧形換能陣元的數量為限。The number of arc-shaped transducer array elements A1-A6 in this embodiment is 6. The number of arc-shaped transducer array elements in the present invention can be multiple, and is not limited to the number of arc-shaped transducer array elements in this embodiment.
在本實施例中,弧形換能陣元A1緊鄰於弧形換能陣元A2。弧形換能陣元A2緊鄰於弧形換能陣元A3,依此類推。在一些實施例中,弧形換能陣元A1~A6當中相鄰的兩個弧形換能陣元之間具有間距。間距小於超音波訊號SU的波長的一半以及反射訊號SR的一半。In this embodiment, arc-shaped transducer array A1 is adjacent to arc-shaped transducer array A2. Arc-shaped transducer array A2 is adjacent to arc-shaped transducer array A3, and so on. In some embodiments, there is a distance between two adjacent arc-shaped transducer array elements among arc-shaped transducer array elements A1-A6. The distance is less than half of the wavelength of the ultrasonic signal SU and half of the reflected signal SR.
請參考圖4,圖4是依據本發明第二實施例所繪示的超音波換能器的結構示意圖。在本實施例中,超音波換能器200包括多個弧形換能陣元以及背側結構BK。所述多個弧形換能陣元的實施方式已經在圖1至圖3的多個實施例中清楚說明,故不在此重述。為了明確說明多個弧形換能陣元以及背側結構BK之間的配置,本實施例僅示出背側結構BK以及弧形換能陣元A1的配置。在本實施例中,背側結構BK用以吸收控制器(如圖1所示的控制器120)與弧形換能陣元之間的反射雜訊。背側結構BK具有弧形凸面P1。弧形換能陣元A1被設置於弧形凸面P1。此外,弧形換能陣元A1的弧形凹面PCC與背側結構BK的弧形凸面P1相吻合。因此,弧形換能陣元A1能夠被貼合於背側結構BK的弧形凸面P1上。所述多個弧形換能陣元以及背側結構BK被配置在超音波探頭110中。Please refer to FIG. 4 , which is a schematic diagram of the structure of an ultrasonic transducer according to the second embodiment of the present invention. In this embodiment, the
請參考圖5,圖5是依據本發明第三實施例所繪示的超音波換能器的示意圖。在本實施例中,超音波換能器300包括弧形換能陣元A1~A6、直線形換能陣元L1~L6以及控制器120。弧形換能陣元A1~A6沿短軸方向D1平行排列。弧形換能陣元A1~A6分別沿長軸方向D2以弧形方式彎曲。直線形換能陣元L1~L6分別沿短軸方向D1延伸並且沿長軸方向D2平行排列。弧形換能陣元A1~A6的延伸方向與直線形換能陣元L1~L6的延伸方向彼此交錯。此外,直線形換能陣元L1~L6與弧形換能陣元A1~A6堆疊設置。弧形換能陣元A1~A6以及弧形換能陣元A1~A6被配置在超音波探頭310中。Please refer to FIG. 5, which is a schematic diagram of an ultrasonic transducer according to a third embodiment of the present invention. In this embodiment, the
控制器120耦接於弧形換能陣元A1~A6以及直線形換能陣元L1~L6。控制器120驅動弧形換能陣元A1~A6以使弧形換能陣元A1~A6分別提供超音波訊號SU。直線形換能陣元L1~L6分別接收反射訊號SR。在本實施例中,弧形換能陣元A1~A6的材料包括壓電材料。壓電材料例如是PZT壓電陶瓷(本發明並不以此為限)。舉例來說,弧形換能陣元A1~A6分別包括多個壓電結構或壓電圖案。The
在一些實施例中,直線形換能陣元L1~L6的材料包括壓電材料。壓電材料例如是PZT壓電陶瓷。舉例來說,直線形換能陣元L1~L6分別包括多個壓電結構或壓電圖案。在一些實施例中,直線形換能陣元L1~L6各包括多個電容式微機械超音波換能器(capacitive micromachined ultrasonic transducer,cMUT)。In some embodiments, the material of the linear transducer array L1-L6 includes a piezoelectric material. The piezoelectric material is, for example, PZT piezoelectric ceramic. For example, the linear transducer array L1-L6 includes a plurality of piezoelectric structures or piezoelectric patterns. In some embodiments, the linear transducer array L1-L6 includes a plurality of capacitive micromachined ultrasonic transducers (cMUT).
應注意的是,在本實施例中,弧形換能陣元A1~A6的延伸方向與直線形換能陣元L1~L6的延伸方向彼此交錯。因此,弧形換能陣元A1~A6以及直線形換能陣元L1~L6的堆疊提供了超音波換能器300的感測陣列。感測陣列具有36個等效感測單元。此外,弧形換能陣元A1~A6分別提供超音波訊號SU。直線形換能陣元L1~L6分別接收反射訊號SR。因此,弧形換能陣元A1~A6以及直線形換能陣元L1~L6的分工使得超音波換能器300具有較快的響應速度。因此,直線形換能陣元L1~L6快速接收反射訊號SR。反射訊號SR用以產生立體超音波影像。It should be noted that in this embodiment, the extension direction of the arc-shaped transducer array A1-A6 and the extension direction of the linear transducer array L1-L6 are interlaced with each other. Therefore, the stacking of the arc-shaped transducer array A1-A6 and the linear transducer array L1-L6 provides a sensing array of the
進一步來說,超音波換能器300具有較快的響應速度。這使得弧形換能陣元A1~A6能夠在較短的時間內接收到不同深度的多層反射訊號SR。因此,立體超音波影像在較短的時間內被產生。直線形換能陣元L1~L6分別反應於反射訊號SR而發生形變,以產生關連於所接收到的多層反射訊號SR的多層電訊號。所述多層電訊號被提供至控制器120。超音波影像依據所述多層電訊號被產生。舉例來說,位於超音波換能器300外部的處理電路會透過控制器120接收到多層電訊號,將多層電訊號轉換為多層超音波影像,並將多層超音波影像組合成立體超音波影像。Furthermore, the
本實施例的直線形換能陣元L1~L6的數量以6個為例。本發明的直線形換能陣元的數量可以是多個,並不以本實施例的直線形換能陣元的數量為限。The number of the linear energy conversion array elements L1 to L6 in this embodiment is 6. The number of the linear energy conversion array elements of the present invention can be multiple, and is not limited to the number of the linear energy conversion array elements in this embodiment.
在本實施例中,弧形換能陣元A1緊鄰於弧形換能陣元A2。弧形換能陣元A2緊鄰於弧形換能陣元A3,依此類推。直線形換能陣元L1緊鄰於直線形換能陣元L2。直線形換能陣元L2緊鄰於直線形換能陣元L3,依此類推。在一些實施例中,弧形換能陣元A1~A6當中相鄰的兩個弧形換能陣元之間具有間距。間距小於超音波訊號SU的波長的一半以及反射訊號SR的一半。相似地,直線形換能陣元L1~L6當中相鄰的兩個直線形換能陣元之間具有間距。間距小於超音波訊號SU的波長的一半以及反射訊號SR的一半。In this embodiment, the arc-shaped transducer array A1 is adjacent to the arc-shaped transducer array A2. The arc-shaped transducer array A2 is adjacent to the arc-shaped transducer array A3, and so on. The linear transducer array L1 is adjacent to the linear transducer array L2. The linear transducer array L2 is adjacent to the linear transducer array L3, and so on. In some embodiments, there is a spacing between two adjacent arc-shaped transducer array elements among the arc-shaped transducer array elements A1-A6. The spacing is less than half of the wavelength of the ultrasonic signal SU and half of the reflected signal SR. Similarly, there is a spacing between two adjacent linear transducer array elements among the linear transducer array elements L1-L6. The spacing is less than half the wavelength of the ultrasonic signal SU and half the wavelength of the reflected signal SR.
請參考圖6,圖6是依據本發明第四實施例所繪示的超音波換能器的結構示意圖。在本實施例中,超音波換能器400包括多個弧形換能陣元(本實施例僅示出弧形換能陣元A1)、直線形換能陣元L1~L6、背側結構BK以及參考電位層LVR1、LVR2。所述多個弧形換能陣元、直線形換能陣元L1~L6以及背側結構BK的實施方式已經在圖1至圖5的多個實施例中清楚說明,故不在此重述。參考電位層LVR1被設置於所述多個弧形換能陣元的發射面PCV(即,弧形凸面)。參考電位層LVR1被施加參考電位VR。參考電位VR例如是接地電位(本發明並不以此為限)。在本實施例中,參考電位層LVR2被設置於直線形換能陣元L1~L6的訊號接收面(即,弧形凸面)。參考電位層LVR2被施加參考電位VR。參考電位層LVR1、LVR2用以隔離電磁干擾。因此,所述多個弧形換能陣元以及直線形換能陣元L1~L6因為電磁干擾而發生誤操作的風險能夠被降低。Please refer to FIG. 6 , which is a schematic diagram of the structure of an ultrasonic transducer according to the fourth embodiment of the present invention. In this embodiment, the
請參考同時圖1以及圖7,圖7是依據本發明第一實施例所繪示的結構示意圖。在本實施例中,超音波換能器100還包括匹配層ML以及聲透鏡層AL。匹配層ML具有第一面PM1以及第二面PM2。第一面PM1相對於第二面PM2。匹配層ML對應弧形換能陣元A1~A6的發射面PE(即,弧形凸面)而被設置。在本實施例中,匹配層ML的第一面PM1是弧形凹面。匹配層ML的第一面PM1與弧形換能陣元A1~A6的發射面PE相符合。因此,匹配層ML能夠貼合於弧形換能陣元A1~A6的發射面PE上。匹配層124具有合適的音阻(acoustic impedance)以提供超音波換能器100及受測物之間較佳的音阻匹配,這使得大部分的超音波訊號SU能夠進入到達受測物。Please refer to FIG. 1 and FIG. 7 at the same time. FIG. 7 is a schematic diagram of the structure according to the first embodiment of the present invention. In this embodiment, the
在本實施例中,聲透鏡層AL對應匹配層ML的第二面PM2而被設置。以本實施例為例,聲透鏡層AL具有第一面PA1以及第二面PA2。第一面PA1相對於第二面PA2。匹配層ML的第二面PM2是弧形凸面。聲透鏡層AL的第一面PA1是弧形凹面。匹配層ML的第二面PM2與聲透鏡層AL的第一面PA1相符合。因此,聲透鏡層AL能夠貼合於匹配層ML的第二面PM2上。聲透鏡層AL可以是超音波訊號SU、反射訊號SR可穿透的透鏡。聲透鏡層AL隔絕及保護超音波探頭110。在本實施例中,弧形換能陣元A1~A6、匹配層ML以及聲透鏡層AL被配置在超音波探頭110中。此外,聲透鏡層AL的第二面PA2是弧形凸面。In the present embodiment, the acoustic mirror layer AL is disposed corresponding to the second surface PM2 of the matching layer ML. Taking the present embodiment as an example, the acoustic mirror layer AL has a first surface PA1 and a second surface PA2. The first surface PA1 is opposite to the second surface PA2. The second surface PM2 of the matching layer ML is an arc-shaped convex surface. The first surface PA1 of the acoustic mirror layer AL is an arc-shaped concave surface. The second surface PM2 of the matching layer ML is consistent with the first surface PA1 of the acoustic mirror layer AL. Therefore, the acoustic mirror layer AL can be attached to the second surface PM2 of the matching layer ML. The acoustic mirror layer AL can be a lens that the ultrasonic signal SU and the reflected signal SR can penetrate. The acoustic mirror layer AL isolates and protects the
在一些實施例中,匹配層ML的第二面PM2以及聲透鏡層AL的第一面PA1分別可以是平面。In some embodiments, the second surface PM2 of the matching layer ML and the first surface PA1 of the acoustic mirror layer AL may be planes, respectively.
綜上所述,本發明的超音波換能器包括所述多個弧形換能陣元。所述多個弧形換能陣元被驅動以產生感測空間。感測空間能夠避開受測物與超音波換能器之間存在障礙物。因此,到達受測物的超音波訊號的強度能夠被維持。基於弧形換能陣元的弧形設計,超音波換能器在其他偵測方式下可提供更大的感測空間。此外,在一些實施例中,超音波換能器還包括多個直線形換能陣元。超音波換能器所接收到的反射訊號能夠用於用以產生立體超音波影像。In summary, the ultrasonic transducer of the present invention includes the plurality of arc-shaped transducer array elements. The plurality of arc-shaped transducer array elements are driven to generate a sensing space. The sensing space can avoid obstacles between the object under test and the ultrasonic transducer. Therefore, the intensity of the ultrasonic signal reaching the object under test can be maintained. Based on the arc-shaped design of the arc-shaped transducer array element, the ultrasonic transducer can provide a larger sensing space under other detection modes. In addition, in some embodiments, the ultrasonic transducer further includes a plurality of linear transducer array elements. The reflected signal received by the ultrasonic transducer can be used to generate a stereoscopic ultrasonic image.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.
100、200、300、400:超音波換能器
110、310:超音波探頭
120:控制器
A1~A6:弧形換能陣元
AL:聲透鏡層
BK:背側結構
D1:短軸方向
D2:長軸方向
L1~L6:直線形換能陣元
LVR1、LVR2:參考電位層
ML:匹配層
OT:目標物
P1:背側結構的弧形凸面
PA1:聲透鏡層的第一面
PA2:聲透鏡層的第二面
PCC:弧形換能陣元的弧形凹面
PCV、PE:弧形換能陣元的發射面
PM1:匹配層的第一面
PM2:匹配層的第二面
SC:驅動訊號
SR:反射訊號
SSP1、SSP2:感測空間
SU:超音波訊號
VR:參考電位
100, 200, 300, 400:
圖1是依據本發明第一實施例所繪示的超音波換能器的示意圖。 圖2是依據本發明一實施例所繪示的弧形換能陣元的操作示意圖。 圖3是依據本發明一實施例所繪示的弧形換能陣元的另一操作示意圖。 圖4是依據本發明第二實施例所繪示的超音波換能器的結構示意圖。 圖5是依據本發明第三實施例所繪示的超音波換能器的示意圖。 圖6是依據本發明第四實施例所繪示的超音波換能器的結構示意圖。 圖7是依據本發明第一實施例所繪示的結構示意圖。 FIG. 1 is a schematic diagram of an ultrasonic transducer according to the first embodiment of the present invention. FIG. 2 is an operation schematic diagram of an arc-shaped transducer array element according to an embodiment of the present invention. FIG. 3 is another operation schematic diagram of an arc-shaped transducer array element according to an embodiment of the present invention. FIG. 4 is a structural schematic diagram of an ultrasonic transducer according to the second embodiment of the present invention. FIG. 5 is a schematic diagram of an ultrasonic transducer according to the third embodiment of the present invention. FIG. 6 is a structural schematic diagram of an ultrasonic transducer according to the fourth embodiment of the present invention. FIG. 7 is a structural schematic diagram according to the first embodiment of the present invention.
100:超音波換能器 110:超音波探頭 120:控制器 A1~A6:弧形換能陣元 D1:短軸方向 D2:長軸方向 SC:驅動訊號 SR:反射訊號 SU:超音波訊號 100: Ultrasonic transducer 110: Ultrasonic probe 120: Controller A1~A6: Arc transducer array D1: Short axis direction D2: Long axis direction SC: Drive signal SR: Reflection signal SU: Ultrasonic signal
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| CN215784663U (en) * | 2021-04-28 | 2022-02-11 | 万秀锦 | Ultrasonic transducer |
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| CN104105449A (en) * | 2011-12-01 | 2014-10-15 | 毛伊图像公司 | Motion detection using ping-based and multiple aperture Doppler ultrasound |
| CN104203110A (en) * | 2012-03-26 | 2014-12-10 | 毛伊图像公司 | Systems and methods for improving ultrasound image quality by applying weighting factors |
| US20140031684A1 (en) * | 2012-07-30 | 2014-01-30 | Lidror Troyansky | System for transcranial ultrasound imaging |
| US10107645B2 (en) * | 2014-05-30 | 2018-10-23 | Fujifilm Dimatix, Inc. | Piezoelectric transducer device with flexible substrate |
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