TWI849091B - Resin composition and peripheral sealant for organic EL display element - Google Patents

Abstract

The purpose of the present invention is to provide a resin composition which has excellent coating properties, adhesion properties, and moisture-proof properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance. In addition, the purpose of the present invention is to provide a peripheral sealant for an organic EL display element made using the resin composition. The present invention is a resin composition, which contains polyisobutylene, a curable resin, a polymerization initiator, and fumed silica. The weight average molecular weight of the polyisobutylene is greater than 5,000 and less than 100,000. The curable resin contains urethane (meth) acrylate, and the content of the urethane (meth) acrylate is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene. The content of the fumed silica is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene.

Description

Resin composition and peripheral sealant for organic EL display element

The present invention relates to a resin composition having excellent coating properties, adhesion properties, and moisture-proof properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance. The present invention also relates to a peripheral sealant for an organic EL display element formed by using the resin composition.

An organic electroluminescent display element (organic EL display element) has a thin film structure in which an organic luminescent material layer is sandwiched between a pair of electrodes facing each other. Electrons are injected from one electrode into the organic luminescent material layer, and holes are injected from the other electrode, so that electrons and holes are combined in the organic luminescent material layer to emit light. Compared with liquid crystal display elements that require a backlight, it has the advantages of good visibility, further thinning, and DC low voltage drive.

However, such organic EL display elements have the following problem: if the organic luminescent material layer or the electrode is exposed to the outside air, its luminescent properties will deteriorate rapidly, resulting in a shortened life. Therefore, in order to improve the stability and durability of the organic EL display element, in the organic EL display element, a sealing technology that blocks the organic luminescent material layer or the electrode from moisture or oxygen in the atmosphere is indispensable.

Patent document 1 discloses a method for sealing an organic EL display element by having a structure including an organic filling layer and a moisture absorbing sealing layer (sealing wall), wherein the organic filling layer is sealed by covering a laminate having an organic light-emitting material layer, and the moisture absorbing sealing layer covers the side surface of the organic filling layer. Generally, as a sealant for an organic EL display element, an in-plane sealant is used for the organic filling layer, and a peripheral sealant having a composition different from that of the in-plane sealant is used for the sealing wall. However, even when the organic EL display element is sealed using such an in-plane sealant and a peripheral sealant, there is still a problem that the organic EL display element may have a display defect when exposed to a severe high temperature and high humidity environment. Prior Art Literature Patent Literature

Patent document 1: Japanese Patent Application Publication No. 2014-67598

[The problem that the invention wants to solve]

The purpose of the present invention is to provide a resin composition which has excellent coating properties, adhesion properties, and moisture-proof properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance. In addition, the purpose of the present invention is to provide a peripheral sealant for an organic EL display element made using the resin composition. [Technical means for solving the problem]

The present invention is a resin composition, which contains polyisobutylene, a curable resin, a polymerization initiator, and fumed silica. The weight average molecular weight of the polyisobutylene is greater than 5,000 and less than 100,000. The curable resin contains urethane (meth)acrylate. The content of the urethane (meth)acrylate is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene. The content of the fumed silica is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene. The present invention is described in detail below.

The inventors of the present invention have studied a method of blending polyisobutylene in order to improve the moisture barrier properties of a resin composition used as a peripheral sealant for an organic EL display element. However, the obtained resin composition has the problem of dripping during coating. Therefore, the inventors of the present invention have studied a method of blending fuming silica into the resin composition in order to prevent dripping during coating. However, when a large amount of fuming silica is blended in order to fully prevent dripping during coating, the obtained resin composition has poor adhesion or moisture barrier properties after being exposed to a high temperature and high humidity environment. Therefore, the inventors of the present invention studied a method of blending (meth) acrylate amine and fuming silica in a specific content ratio relative to polyisobutylene. As a result, it was found that a resin composition can be obtained, which has excellent coating properties, adhesion (including adhesion after exposure to a high temperature and high humidity environment), and moisture barrier properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance, thereby completing the present invention. Furthermore, in this specification, the above-mentioned "(meth) acrylate" means acrylate or methacrylate, and the above-mentioned "(meth) acrylate amine" means a compound having an amine ester bond and a (meth) acryloyl group. In addition, the above-mentioned "(meth)acryl group" means an acryl group or a methacryl group.

The resin composition of the present invention contains polyisobutylene. By containing the above-mentioned polyisobutylene, the resin composition of the present invention has excellent moisture barrier properties and becomes incompatible with the in-plane sealant when used as a peripheral sealant for an organic EL display element.

The lower limit of the weight average molecular weight of the polyisobutylene is 5,000 and the upper limit is 100,000. By making the weight average molecular weight of the polyisobutylene within this range, the coating property, adhesion, and moisture barrier of the obtained resin composition become better. The preferred lower limit of the weight average molecular weight of the polyisobutylene is 20,000, the preferred upper limit is 80,000, the more preferred lower limit is 30,000, the more preferred upper limit is 60,000, the further preferred lower limit is 35,000, and the further preferred upper limit is 45,000. In addition, in this specification, the above "weight average molecular weight" is a value obtained by converting to polystyrene using tetrahydrofuran as a solvent and gel permeation chromatography (GPC) for measurement. Examples of columns used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko K.K.).

The preferred lower limit of the content of the polyisobutylene in 100 parts by weight of the total of the polyisobutylene and the curable resin described later is 10 parts by weight, and the preferred upper limit is 80 parts by weight. By making the content of the polyisobutylene above 10 parts by weight or more, the moisture barrier property of the obtained resin composition becomes more excellent. By making the content of the polyisobutylene below 80 parts by weight, the coating property or adhesion of the obtained resin composition becomes more excellent. The preferred lower limit of the content of the polyisobutylene is 20 parts by weight, and the preferred upper limit is 60 parts by weight.

The resin composition of the present invention contains a curable resin. The curable resin contains (meth) acrylate amine. By combining the (meth) acrylate amine and fuming silica and containing them in the following amounts, the dispersibility of fuming silica can be improved, and as a result, the resin composition of the present invention can prevent dripping during coating. In addition, by containing the (meth) acrylate amine, the resin composition of the present invention has excellent adhesion after being exposed to a high temperature and high humidity environment.

It is preferred that the (meth) amine acrylate has a polybutadiene skeleton. When the (meth) amine acrylate has a polybutadiene skeleton, the effect of improving the dispersibility of fumed silica becomes more excellent.

The preferred lower limit of the weight average molecular weight of the (meth) amine acrylate is 2000, and the preferred upper limit is 20,000. By making the weight average molecular weight of the (meth) amine acrylate within this range, its compatibility with the isobutylene is improved, and the effect of improving the dispersibility of the fumed silica is improved. The preferred lower limit of the weight average molecular weight of the (meth) amine acrylate is 5000, and the preferred upper limit is 10,000.

The content of the above-mentioned (meth) amine acrylate is 1 part by weight and 30 parts by weight relative to 100 parts by weight of the above-mentioned polyisobutylene. By making the content of the above-mentioned (meth) amine acrylate more than 1 part by weight, its compatibility with the above-mentioned polyisobutylene is improved, and the effect of improving the dispersibility of the fumed silica is improved. In addition, the adhesion of the obtained resin composition after exposure to a high temperature and high humidity environment is improved. By making the content of the above-mentioned (meth) amine acrylate less than 30 parts by weight, the moisture-proof property of the obtained resin composition is improved. The preferred lower limit of the content of the above-mentioned (meth) amine acrylate is 3 parts by weight, the preferred upper limit is 25 parts by weight, the more preferred lower limit is 5 parts by weight, and the more preferred upper limit is 20 parts by weight.

From the viewpoint of adhesion, the above-mentioned curable resin preferably contains other curable resins other than the above-mentioned (meth)acrylic amine ester. As the above-mentioned other curable resins, there can be listed (meth)acrylic compounds without amine ester bonds, epoxy compounds, cyclobutane compounds, amine ester compounds without (meth)acrylic groups, etc. Among them, the above-mentioned (meth)acrylic compounds without amine ester bonds are preferred. Furthermore, in this specification, the above-mentioned "(meth)acrylic group" means an acrylic group or a methacrylic group, and the above-mentioned "(meth)acrylic compound" means a compound having a (meth)acrylic group.

Examples of the (meth)acrylic acid compound without an amine ester bond include isobornyl (meth)acrylate, adamantyl (meth)acrylate, methylcyclohexyl (meth)acrylate, norbornylmethyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, cyclodecyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, etc. Among them, dicyclopentyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and tricyclodecanedimethanol di(meth)acrylate are preferred.

Examples of the epoxy compounds include glycidyl ether compounds and alicyclic epoxy compounds. Examples of the glycidyl ether compounds include diethylene glycol diglycidyl ether. Examples of the alicyclic epoxy compounds include (3,4-epoxy)cyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl ester, 1,2-epoxy-4-(2-epoxyethylene)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, and the like.

Examples of the cyclohexane compound include 1,4-bis{[(3-ethyl-3-cyclohexyl)methoxy]methyl}benzene, di[2-(3-cyclohexyl)butyl]ether, and 3-ethyl-3-hydroxymethylcyclohexane.

As the above-mentioned amine ester compound without a (meth)acryl group, for example, a reaction product of an isocyanate compound and an arbitrary polyol compound can be listed. As the above-mentioned isocyanate compound, for example, a toluene diisocyanate compound, a diphenylmethane diisocyanate compound can be listed. As the above-mentioned toluene diisocyanate compound, for example, 2,4-toluene diisocyanate (2,4-TDI), 2,6-toluene diisocyanate, or a mixture thereof can be listed. As the above-mentioned diphenylmethane diisocyanate compound, for example, 4,4'-diphenylmethane diisocyanate (4,4'-MDI), 2,4'-diphenylmethane diisocyanate (2,4'-MDI), or a mixture thereof can be listed.

The content of the other curable resin is preferably 20 parts by weight and 150 parts by weight relative to 100 parts by weight of the polyisobutylene. By making the content of the other curable resin within this range, the adhesion and moisture barrier properties of the obtained resin composition become better. The content of the other curable resin is preferably 30 parts by weight, and the upper limit is 120 parts by weight, further preferably 40 parts by weight, and further preferably 100 parts by weight.

The resin composition of the present invention contains a polymerization initiator. As the above-mentioned polymerization initiator, a free radical polymerization initiator or a cationic polymerization initiator can be used. Among them, a free radical polymerization initiator is preferred.

As the radical polymerization initiator, a photoradical polymerization initiator or a thermal radical polymerization initiator can be used.

Examples of the photoradical polymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, 9-oxysulfide compounds, Compounds, etc. Specific examples of the photoradical polymerization initiator include: 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butanone, 1,2-(dimethylamino)-2-((4-methylphenyl)methyl)-1-(4-(4-morpholinyl)phenyl)-1-butanone, 2,2-dimethoxy-2-phenylacetophenone, bis(2,4,6-trimethylbenzyl)phenyl Phosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinylpropane-1-one, 1-(4-(2-hydroxyethoxy)-phenyl)-2-hydroxy-2-methyl-1-propane-1-one, 1-(4-(phenylthio)phenyl)-1,2-octanedione 2-(O-benzoyl oxime), 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, etc. Among them, 2-methyl-1-(4-methylthiophenyl)-2-morpholinylpropane-1-one is preferred.

As the above-mentioned thermal free radical polymerization initiator, for example, those composed of azo compounds, organic peroxides, etc. can be listed. As the above-mentioned azo compound, for example, 2,2'-azobis(2,4-dimethylvaleronitrile), azobisisobutyronitrile, etc. can be listed. As the above-mentioned organic peroxide, for example, benzoyl peroxide, ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, peroxyester, diacyl peroxide, peroxydicarbonate, etc. can be listed.

Examples of commercially available thermal radical polymerization initiators include VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001, and V-501 (all manufactured by Fuji Film and Koshun Chemical Co., Ltd.).

As the above-mentioned cationic polymerization initiator, there can be mentioned a photo-cationic polymerization initiator or a thermal cationic polymerization initiator.

The photocatalytic ion polymerization initiator is not particularly limited if it generates a protonic acid or a Lewis acid by light irradiation, and may be an ionic photoacid generating type or a non-ionic photoacid generating type.

Examples of the anionic part of the above-mentioned ionic photoacid generating type photocatalytic polymerization initiator include BF ₄ ^- , PF ₆ ^- , SbF ₆ ^- , or (BX ₄ ) ^- (wherein X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups). Examples of the above-mentioned ionic photoacid generating type photocatalytic polymerization initiator include aromatic coronium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salts, etc. having the above-mentioned anionic part.

Examples of the aromatic coronium salt include bis(4-(diphenylcoronium)phenyl)sulfide bis(hexafluorophosphate), bis(4-(diphenylcoronium)phenyl)sulfide bis(hexafluoroantimonate), bis(4-(diphenylcoronium)phenyl)sulfide bis(tetrafluoroborate), bis(4-(diphenylcoronium)phenyl)sulfide tetrakis(pentafluorophenyl) borate, diphenyl-4-(phenylthio)phenylcopperium hexafluorophosphate, diphenyl-4-(phenylthio)phenylcopperium hexafluoroantimonylate, diphenyl-4-(phenylthio)phenylcopperium tetrafluoroborate, diphenyl-4-(phenylthio)phenylcopperium tetrakis(pentafluorophenyl)borate, triphenylcopperium hexafluorophosphate, triphenylcopperium hexafluoroantimonylate, Triphenylcopperium tetrafluoroborate, triphenylcopperium tetrakis(pentafluorophenyl)borate, triarylcopperium tetrakis(pentafluorophenyl)borate, bis(4-(bis(4-(2-hydroxyethoxy))phenylcopperium)phenyl)sulfide bis(hexafluorophosphate), bis(4-(bis(4-(2-hydroxyethoxy))phenylcopperium)phenyl)sulfide bis(hexafluoroantimony) acid salt, bis(4-(bis(4-(2-hydroxyethoxy))phenylcopperyl)phenyl)sulfide bistetrafluoroborate, bis(4-(bis(4-(2-hydroxyethoxy))phenylcopperyl)phenyl)sulfide tetrakis(pentafluorophenyl)borate, tris(4-(4-acetylphenyl)thienyl)copperyltetrakis(pentafluorophenyl)borate, and the like.

Examples of the aromatic iodine salts include diphenyliodine hexafluorophosphate, diphenyliodine hexafluoroantimonylate, diphenyliodine tetrafluoroborate, diphenyliodine tetrakis(pentafluorophenyl)borate, bis(dodecylphenyl)iodine hexafluorophosphate, bis(dodecylphenyl)iodine hexafluoroantimonylate, bis(dodecylphenyl)iodine tetrafluoroborate, and bis(dodecylphenyl)iodine tetrakis(pentafluorophenyl)borate. (pentafluorophenyl)borate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluorophosphate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluoroantimonate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrafluoroborate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrakis(pentafluorophenyl)borate, and the like.

Examples of the aromatic diazonium salt include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrakis(pentafluorophenyl)borate.

Examples of the aromatic ammonium salt include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2-cyanopyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetrakis(pentafluorophenyl)borate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluorophosphate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluoroantimonate, 1-(naphthylmethyl)-2-cyanopyridinium tetrakis(pentafluorophenyl)borate, and the like.

Examples of the above-mentioned (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salt include (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) hexafluoroantimonate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) tetrafluoroborate, and (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) tetrakis(pentafluorophenyl)borate.

Examples of the above-mentioned non-ionic photoacid generating type photocatalytic polymerization initiator include nitrobenzyl esters, sulfonic acid derivatives, phosphates, phenolsulfonates, diazonaphthoquinones, N-hydroxyimidesulfonates, and the like.

Examples of commercially available photocatalytic polymerization initiators include: photocatalytic polymerization initiators manufactured by Japan Green Chemicals, photocatalytic polymerization initiators manufactured by Union Carbide Corporation, photocatalytic polymerization initiators manufactured by ADEKA, photocatalytic polymerization initiators manufactured by 3M, photocatalytic polymerization initiators manufactured by BASF, and photocatalytic polymerization initiators manufactured by Rhodia Japan. Ltd. Examples of commercially available photocatalytic polymerization initiators manufactured by Japan Green Chemicals include DTS-200, etc. Examples of the photocatalytic ion polymerization initiator manufactured by the above-mentioned Union Carbide Corporation include UVI6990, UVI6974, etc. Examples of the photocatalytic ion polymerization initiator manufactured by the above-mentioned ADEKA Corporation include SP-150, SP-170, etc. Examples of the photocatalytic ion polymerization initiator manufactured by the above-mentioned 3M Corporation include FC-508, FC-512, etc. Examples of the photocatalytic ion polymerization initiator manufactured by the above-mentioned BASF Corporation include IRGACURE261, IRGACURE290, etc. Examples of the photocatalytic ion polymerization initiator manufactured by the above-mentioned Rhodia Japan. Ltd. include PI2074, etc.

As the above-mentioned thermal cationic polymerization initiator, there can be cited coronium salts, phosphonium salts ^, ammonium salts, etc. whose anion part is composed of _BF4- ^, _PF6- ^, _SbF6- , or ( _BX4 ) ^- (wherein X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups). Among them, coronium salts and ammonium salts are preferred.

Examples of the coronium salt include triphenylcoronium tetrafluoroborate and triphenylcoronium hexafluoroantimonate.

Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantibonate and tetrabutylphosphonium hexafluoroantibonate.

Examples of the ammonium salt include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methylbenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorotetrakis (pentafluorophenyl) borate, methylphenyl dibenzyl ammonium hexafluorophosphate, Methylphenyldibenzylammonium hexafluoroantimonylate, methylphenyldibenzylammonium tetrakis(pentafluorophenyl)borate, phenyltribenzylammonium tetrakis(pentafluorophenyl)borate, dimethylphenyl (3,4-dimethylbenzyl)ammonium tetrakis(pentafluorophenyl)borate, N,N-dimethyl-N-benzylanilinium hexafluoroantimonylate, N,N-diethyl-N-benzylanilinium tetrafluoroborate, N,N-dimethyl-N-benzylpyridinium hexafluoroantimonylate, N,N-diethyl-N-benzylpyridinium trifluoromethanesulfonic acid, etc.

Examples of commercially available thermal cationic polymerization initiators include: thermal cationic polymerization initiators manufactured by Sanshin Chemical Industries, Ltd., thermal cationic polymerization initiators manufactured by King Industries, etc. Examples of thermal cationic polymerization initiators manufactured by Sanshin Chemical Industries, Ltd. include: San-Aid SI-60, San-Aid SI-80, San-Aid SI-B3, San-Aid SI-B3A, San-Aid SI-B4, etc. Examples of thermal cationic polymerization initiators manufactured by King Industries, Ltd. include: CXC-1612, CXC-1821, etc.

The content of the polymerization initiator is preferably 0.05 parts by weight and the upper limit is 10 parts by weight relative to the total of 100 parts by weight of the polyisobutylene and the curable resin. By making the content of the polymerization initiator above 0.05 parts by weight or more, the curability of the obtained resin composition becomes better. By making the content of the polymerization initiator below 10 parts by weight, the curing reaction of the obtained resin composition will not become too fast, the workability becomes better, and the cured product can be made more uniform. The lower limit of the content of the polymerization initiator is preferably 1 part by weight, and the upper limit is preferably 5 parts by weight.

The resin composition of the present invention contains fumed silica. By combining the fumed silica with the (meth) amine ester in the above content and containing the fumed silica in the content described below, the resin composition of the present invention can prevent dripping during coating.

The preferred lower limit of the specific surface area of the fuming silica is 80 m ² /g, and the preferred upper limit is 400 m ² /g. By making the specific surface area of the fuming silica within this range, the obtained resin composition has a better effect of preventing dripping during coating. The preferred lower limit of the specific surface area of the fuming silica is 120 m ² /g, and the preferred upper limit is 350 m ² /g, and the further preferred lower limit is 180 m ² /g, and the further preferred upper limit is 330 m ² /g. In addition, the above-mentioned "specific surface area" can be measured by a specific surface area measuring device using a BET method using nitrogen. Examples of the specific surface area measuring apparatus include ASAP-2000 (manufactured by Shimadzu Corporation).

The preferred lower limit of the average primary particle size of the above-mentioned fuming silica is 2 nm, and the preferred upper limit is 30 nm. By making the average primary particle size of the fuming silica of the present invention within this range, the obtained resin composition has a better effect of preventing dripping during coating. The preferred lower limit of the average primary particle size of the above-mentioned fuming silica is 5 nm, and the preferred upper limit is 10 nm. Furthermore, the above-mentioned "average primary particle size" can be measured by a dynamic light scattering particle size measuring device, etc. As the above-mentioned dynamic light scattering particle size measuring device, for example, ELSZ-1000S (manufactured by Otsuka Electronics Co., Ltd.) can be listed.

The content of the above-mentioned fuming silica is 1 part by weight and 30 parts by weight relative to 100 parts by weight of the above-mentioned polyisobutylene. By making the content of the above-mentioned fuming silica more than 1 part by weight, the obtained resin composition has a better effect of preventing dripping during coating. By making the content of the above-mentioned fuming silica less than 30 parts by weight, the obtained resin composition has better adhesion and moisture-proof properties. The preferred lower limit of the content of the above-mentioned fuming silica is 1.5 parts by weight, the preferred upper limit is 15 parts by weight, the more preferred lower limit is 2 parts by weight, and the more preferred upper limit is 10 parts by weight. In addition, the ratio of the content of the fumed silica to the content of the (meth) amine acrylate is preferably such that the (meth) amine acrylate is greater than or equal to 0.1 parts by weight and less than or equal to 10 parts by weight relative to 1 part by weight of the fumed silica.

The resin composition of the present invention preferably contains a water-absorbent filler. By containing the water-absorbent filler, the moisture-proof property of the resin composition of the present invention becomes more excellent.

As the above-mentioned water-absorbing filler, for example, alkali earth metal oxides, magnesium oxide, molecular sieves, etc. can be listed. As the above-mentioned alkali earth metal oxides, for example, calcium oxide, strontium oxide, barium oxide, etc. can be listed. Among them, from the viewpoint of water absorption, alkali earth metal oxides are preferred, and calcium oxide is more preferred. These water-absorbing fillers can be used alone or in combination of two or more.

The content of the water-absorbing filler is preferably 10 parts by weight and 300 parts by weight relative to 100 parts by weight of the total of the polyisobutylene and the curing resin. By making the content of the water-absorbing filler within this range, the moisture barrier property of the obtained resin composition becomes more excellent. The lower limit of the content of the water-absorbing filler is more preferably 30 parts by weight and the upper limit is more preferably 250 parts by weight.

The resin composition of the present invention may also contain other fillers other than the above-mentioned fumed silica and water-absorbing filler within the scope that does not hinder the purpose of the present invention in order to improve adhesion, etc. As the above-mentioned other fillers, inorganic fillers or organic fillers can be used. As the above-mentioned inorganic fillers, for example, silica other than fumed silica, talc, aluminum oxide, etc. can be listed. As the above-mentioned organic fillers, for example, polyester microparticles, polyurethane microparticles, vinyl polymer microparticles, acrylic polymer microparticles, etc. can be listed. Among them, talc is preferred.

The resin composition of the present invention may also contain a thermosetting agent. Examples of the thermosetting agent include hydrazide compounds, imidazole derivatives, acid anhydrides, cyanamide, guanidine derivatives, modified aliphatic polyamines, and addition products of various amines and epoxy resins.

Examples of the hydrazide compound include 1,3-bis(hydrazinocarbonylethyl)-5-isopropylhydantoin, sebacic acid dihydrazide, isophthalic acid dihydrazide, adipic acid dihydrazide, malonic acid dihydrazide, etc. Examples of the imidazole derivative include 1-cyanoethyl-2-phenylimidazole, N-(2-(2-methyl-1-imidazolyl)ethyl)urea, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-s-triazine. , N,N'-bis(2-methyl-1-imidazolylethyl)urea, N,N'-(2-methyl-1-imidazolylethyl)-hexamethylenediamide, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. Examples of the above-mentioned acid anhydride include tetrahydrophthalic anhydride, ethylene glycol bis(dehydrated trimellitate), etc. These heat curing agents may be used alone or in combination of two or more.

Examples of commercially available thermosetting agents include SDH (manufactured by JAPAN FINECHEM Co., Ltd.), ADH (manufactured by Otsuka Chemical Co., Ltd.), Amicure VDH, Amicure VDH-J, and Amicure UDH (all manufactured by Ajinomoto Fine-Techno. Co., Inc.).

The content of the above-mentioned thermosetting agent is preferably 0.01 parts by weight and preferably 10 parts by weight relative to 100 parts by weight of the total of the above-mentioned polyisobutylene and the above-mentioned curable resin. By making the content of the above-mentioned thermosetting agent more than 0.01 parts by weight, the thermosetting property of the obtained resin composition becomes better. By making the content of the above-mentioned thermosetting agent less than 10 parts by weight, the storage stability of the obtained resin composition becomes better. The better lower limit of the content of the above-mentioned thermosetting agent is 0.5 parts by weight, the better upper limit is 5 parts by weight, the further better lower limit is 1 part by weight, and the further better upper limit is 3 parts by weight.

The resin composition of the present invention may also contain a tackifier resin in order to further improve adhesion, etc. Examples of the tackifier resin include terpene resins, modified terpene resins, coumarone resins, indene resins, petroleum resins, etc. Examples of the modified terpene resins include hydrogenated terpene resins, terpene-phenol copolymer resins, aromatic modified terpene resins, etc. Examples of the petroleum resins include aliphatic petroleum resins, hydrogenated alicyclic petroleum resins, aromatic petroleum resins, aliphatic aromatic copolymer petroleum resins, alicyclic petroleum resins, dicyclopentadiene petroleum resins and hydrogenated products thereof, etc. Among them, as the above-mentioned tackifying resin, from the viewpoints of adhesion, moisture permeation resistance, compatibility, etc. of the resin composition, terpene resins, aromatic modified terpene resins, terpene-phenol copolymer resins, hydrogenated alicyclic petroleum resins, aromatic petroleum resins, aliphatic aromatic copolymer petroleum resins, alicyclic petroleum resins, more preferably alicyclic petroleum resins, further preferably alicyclic saturated hydrocarbon resins, alicyclic unsaturated hydrocarbon resins, particularly preferably cyclohexyl ring-containing saturated hydrocarbon resins, dicyclopentadiene-modified hydrocarbon resins. These tackifying resins may be used alone or in combination of two or more.

The content of the tackifying resin is preferably 0.01 parts by weight and 100 parts by weight relative to the total of the polyisobutylene and the curing resin. By making the content of the tackifying resin within this range, the moisture barrier property can be maintained and the effect of improving the adhesion can be further exerted. The lower limit of the content of the tackifying resin is more preferably 10 parts by weight and the upper limit is more preferably 40 parts by weight.

The resin composition of the present invention may also contain a sensitizer. The sensitizer has the function of further improving the polymerization initiation efficiency of the polymerization initiator and further promoting the curing reaction of the resin composition of the present invention.

Examples of the sensitizer include anthracene compounds, 9-oxosulfuron Anthracene compounds include 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4,4'-bis(dimethylamino)benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, etc. Examples of the anthracene compounds include 9,10-dibutoxyanthracene, etc. Examples of the 9-oxysulfonate compounds include 1,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4,4'-bis(dimethylamino)benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, etc. Series of compounds, for example, 2,4-diethyl 9-oxysulfonium The sensitizers may be used alone or in combination of two or more.

The content of the sensitizer is preferably 0.05 parts by weight and 3 parts by weight relative to 100 parts by weight of the total of the polyisobutylene and the curing resin. By making the content of the sensitizer 0.05 parts by weight or more, the sensitization effect is further exerted. By making the content of the sensitizer 3 parts by weight or less, the absorption will not become too large and the light can be transmitted to the deep part. The more preferable lower limit of the content of the sensitizer is 0.1 parts by weight and the more preferable upper limit is 1 part by weight.

The resin composition of the present invention may also contain a stabilizer. By containing the stabilizer, the storage stability of the resin composition of the present invention becomes more excellent.

Examples of the above-mentioned stabilizer include aromatic amine compounds, 4-hydroxy-2,2,6,6-tetramethylpiperidin-1-oxyl free radical, etc. Examples of the above-mentioned aromatic amine compounds include benzylamine, aminophenol-type epoxy resins, etc. Among them, aromatic amine compounds are preferred, and benzylamine is more preferred. These stabilizers may be used alone or in combination of two or more.

The content of the stabilizer is preferably 0.001 parts by weight and 2 parts by weight relative to 100 parts by weight of the total of the polyisobutylene and the curable resin. By making the content of the stabilizer within this range, the obtained resin composition has better storage stability while maintaining excellent curability. The better lower limit of the content of the stabilizer is 0.005 parts by weight and the better upper limit is 1 part by weight.

The resin composition of the present invention may also contain a silane coupling agent. The silane coupling agent has the function of improving the adhesion between the resin composition of the present invention and a substrate or the like.

Examples of the above-mentioned silane coupling agent include: 3-aminopropyl trimethoxysilane, 3-butylene trimethoxysilane, 3-glyceryloxypropyl trimethoxysilane, 3-isocyanatopropyl trimethoxysilane, 3-acryloxypropyl trimethoxysilane, 3-methacryloxypropyl trimethoxysilane, etc. Among them, 3-acryloxypropyl trimethoxysilane is preferred. The silane coupling agents may be used alone or in combination of two or more.

The content of the silane coupling agent is preferably 0.1 parts by weight and preferably 10 parts by weight relative to 100 parts by weight of the total of the polyisobutylene and the curable resin. By making the content of the silane coupling agent within this range, the excess silane coupling agent is prevented from seeping out, and the adhesion of the obtained resin composition is improved. The more preferred lower limit of the content of the silane coupling agent is 0.5 parts by weight.

The resin composition of the present invention may also contain a surface modifier within the range that does not hinder the purpose of the present invention. By containing the above-mentioned surface modifier, the flatness of the coating film of the resin composition of the present invention can be improved. As the above-mentioned surface modifier, for example, surfactants or leveling agents can be listed.

As the surface modifiers mentioned above, for example, silicone-based, acrylic-based, fluorine-based surface modifiers can be listed. As commercially available products among the surface modifiers mentioned above, for example, surface modifiers manufactured by BYK-Chemie Japan, surface modifiers manufactured by Kusumoto Chemicals, and surface modifiers manufactured by AGC Seimi Chemical can be listed. As surface modifiers manufactured by BYK-Chemie Japan, for example, BYK-300, BYK-302, BYK-331 can be listed. As surface modifiers manufactured by Kusumoto Chemicals, for example, UVX-272 can be listed. As surface modifiers manufactured by AGC Seimi Chemical, for example, Surflon S-611 can be listed.

The resin composition of the present invention may also contain a compound and/or an ion exchange resin that reacts with the acid generated in the resin composition within the range not hindering the purpose of the present invention.

As the compound that reacts with the generated acid, there can be mentioned substances that neutralize with the acid, such as carbonates or bicarbonates of alkali metals, or carbonates or bicarbonates of alkali earth metals, etc. Specifically, for example, calcium carbonate, calcium bicarbonate, sodium carbonate, sodium bicarbonate, etc. can be used.

As the ion exchange resin, any of cation exchange type, anion exchange type and zwitterion exchange type can be used, and a cation exchange type or zwitterion exchange type capable of adsorbing chloride ions is particularly preferred.

The resin composition of the present invention may also contain various known additives such as a hardening retarder, a reinforcing agent, a softener, a plasticizer, a viscosity adjuster, a UV absorber, an antioxidant, etc. as needed within the scope that does not hinder the purpose of the present invention.

From the perspective of further suppressing the generation of outgassing, it is preferred that the resin composition of the present invention does not contain a solvent. Even if the resin composition of the present invention does not contain a solvent, it can still be a resin composition with excellent coating properties. Furthermore, in this specification, the term "does not contain a solvent" means that the content of the solvent does not reach 1000 ppm.

As a method for producing the resin composition of the present invention, for example, the following method can be cited: using a mixer, polyisobutylene, a curable resin, a polymerization initiator, fuming silica, and a water-absorbing filler added as needed are mixed. As the above-mentioned mixer, for example, a homogeneous disperser, a homogenizing mixer, a universal mixer, a planetary mixer, a kneader, a three-roll grinder, etc. can be cited.

The preferred lower limit of the value obtained by dividing the viscosity measured by using an E-type viscometer at 25°C and 0.5 rpm by the viscosity measured by using an E-type viscometer at 25°C and 5 rpm (hereinafter also referred to as the "swing index") of the resin composition of the present invention is 2.0, and the preferred upper limit is 5.0. By making the above-mentioned swing index within this range, the coating property of the resin composition of the present invention becomes more excellent. The more preferred upper limit of the above-mentioned swing index is 3.5.

The resin composition of the present invention is preferably used as a peripheral sealant for an organic EL display element, which is used to form a sealing wall around a laminate having an organic light-emitting material layer. The above-mentioned peripheral sealant for an organic EL display element can usually be used in combination with an in-plane sealant for an organic EL display element that covers the laminate. The peripheral sealant for an organic EL display element formed using the resin composition of the present invention is also one of the present inventions. [Effect of the invention]

According to the present invention, a resin composition can be provided, which has excellent coating properties, adhesion properties, and moisture barrier properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance. In addition, according to the present invention, a peripheral sealant for an organic EL display element using the resin composition can be provided.

The present invention is described in more detail below with reference to the following embodiments, but the present invention is not limited to these embodiments.

(Examples 1 to 10, Comparative Examples 1 to 6) According to the blending ratios listed in Tables 1 and 2, each material was stirred and mixed at a stirring speed of 2000 rpm for 3 minutes to prepare the resin compositions of Examples 1 to 10 and Comparative Examples 1 to 6. The above-mentioned stirring mixer was ARV-310 (manufactured by Thinky). For each of the obtained resin compositions, the viscosity at 25°C and 0.5 rpm and the viscosity at 25°C and 5 rpm were measured using an E-type viscometer, and the value obtained by dividing the viscosity measured at 25°C and 0.5 rpm by the viscosity measured at 25°C and 5 rpm was derived as a sway index. As the E-type viscometer, VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) was used.

<Evaluation> The following evaluation was performed on each resin composition obtained in the Examples and Comparative Examples. The results are shown in Tables 1 and 2.

(1) Coating properties Each resin composition obtained in the embodiment and comparative example was inserted into a syringe, mounted on the discharge adapter of a dispenser, and the resin composition was discharged for 10 seconds by setting the discharge pressure of the dispenser to positive pressure. Then, the dripping from the tip of the syringe was confirmed when the pressure was negative for 1 minute. The syringe used was a 10 mL UV shielding syringe (manufactured by Musashi High-Tech Co., Ltd.), and the dispenser used was a desktop coating robot SHOTMASTER SX series (manufactured by Musashi High-Tech Co., Ltd.). The coating properties were evaluated by marking "◎" when no droplets were produced at the tip of the syringe within 1 minute, "○" when droplets were produced at the tip of the syringe but did not fall off, "△" when 1 droplet fell from the tip of the syringe within 1 minute, and "×" when 2 or more droplets fell from the tip of the syringe within 1 minute.

(2) Adhesion 0.03 g of spacer particles with a diameter of 10 μm were added to 10 g of each resin composition obtained in the examples and comparative examples, and the mixture was uniformly dispersed using a stirring mixer. Micropearl SP-210 (manufactured by Sekisui Chemical Industries, Ltd.) was used as the spacer particles, and ARV-310 (manufactured by Thinky Co., Ltd.) was used as the stirring mixer. The resin composition with the spacer particles dispersed therein was applied to the center of the glass substrate A, and then the glass substrate B was attached by crossing it in a cross shape, and pressurized to make the thickness uniform. The amount of the resin composition dispersed with spacer particles applied was adjusted so that the resin composition dispersed with spacer particles became uniform in thickness after being pressed and became a circle with a diameter of 5.0 to 7.0 mm. The glass substrates A and B were prepared by washing the surface of a glass with a length of 60 mm, a width of 30 mm, and a thickness of 5 mm with acetone and then drying it. Then, the resin composition was cured by irradiating 3000 mJ/ ^cm2 of ultraviolet light with a wavelength of 365 nm using a UV-LED irradiation device, thereby bonding the glass substrates A and B to obtain a test piece for initial adhesion evaluation. In addition, after glass substrate A and glass substrate B were bonded together in the same manner as the initial adhesion evaluation specimen, they were exposed to high temperature and high humidity conditions of 85°C and 85%RH for 500 hours to obtain a specimen for adhesion evaluation after exposure to a high temperature and high humidity environment. For each specimen, the glass substrate B was arranged so that it was located at the bottom, and the two ends of the glass substrate A were fixed from the bottom. The two ends of the glass substrate B were compressed from the top by a precision universal testing machine at 23°C and a speed of 5 mm/minute, thereby measuring the adhesion between the glass substrate A and the glass substrate B. The compressed area was set to a range of 20 mm in length and 5 mm in width, centered at a position 7.25 mm away from the two ends of the glass substrate B. The above-mentioned precision universal testing machine used an Autograph AG-Xplus (manufactured by Shimadzu Corporation). Adhesion force is the value obtained by dividing the maximum load from the start of compression using a precision universal testing machine to the complete separation of glass substrate A and glass substrate B by the area of the resin composition of the test piece. Adhesion force of ³⁰⁰ N/cm2 or more is marked as "◎", adhesion force less than 300 N/ ^cm2 and more than 250 N/ ^cm2 is marked as "○", adhesion force less than 250 N/ ^cm2 and more than 200 N/ ^cm2 is marked as "△", adhesion force less than 200 N/ ^cm2 is marked as "×", and the initial adhesion and adhesion after exposure to high temperature and high humidity environment are evaluated in this way.

(3) Moisture-proof property The following Ca-TEST was performed on each resin composition obtained in the examples and comparative examples. First, 0.03 g of spacer particles with a diameter of 10 μm were added to 10 g of each resin composition obtained in the examples and comparative examples, and the mixture was uniformly dispersed using a stirring mixer. Micropearl SP-210 (manufactured by Sekisui Chemical Industries, Ltd.) was used as the spacer particles, and ARV-310 (manufactured by Thinky Co., Ltd.) was used as the stirring mixer. Next, the resin composition in which the spacer particles were dispersed was applied to the surface of a glass substrate. Next, a mask having a plurality of openings of 2 mm×2 mm was covered on another glass substrate of 30 mm×30 mm in size, and Ca was evaporated using a vacuum evaporator. The conditions for evaporation are as follows: the pressure in the evaporator of the vacuum evaporation device is reduced to 2×10 ^-3 Pa, and Ca is deposited at an evaporation rate of 5.0 Å/s to form a film of 2000 Å. The glass substrate on which Ca is evaporated is moved to a glove box controlled at a dew point (above -60°C), and the glass substrate coated with a resin composition on the surface and the glass substrate on which Ca is evaporated are bonded in such a way that the resin composition is located on the evaporation pattern of Ca. After pressurization is performed to make the thickness of the resin composition layer uniform, the resin composition is cured by irradiating 3000 mJ/cm ² of ultraviolet light with a wavelength of 365 nm using a UV-LED irradiation device to produce a Ca-TEST substrate. The obtained Ca-TEST substrate was exposed to high temperature and high humidity conditions of 85°C and 85%RH, and the penetration distance of water from the end surface of the glass substrate to the layer composed of the cured product of the resin composition was observed based on the disappearance of Ca. As a result, when the exposure time to the high temperature and high humidity conditions was 1000 hours, the case where the penetration distance of water was less than 3.0 mm was recorded as "◎", the case where the penetration distance of water was more than 3.0 mm and less than 3.5 mm was recorded as "○", the case where the penetration distance of water was more than 3.5 mm and less than 4.0 mm was recorded as "△", and the case where the penetration distance of water was more than 4.0 mm was recorded as "×", and the moisture permeation resistance was evaluated in this way.

[Table 1] Embodiment 1 2 3 4 5 6 7 8 9 10 Composition (parts by weight) Polyolefin Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 3T", weight average molecular weight 40,000) 100 - - 100 100 100 100 100 100 100 Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 4T", weight average molecular weight 50,000) - 100 - - - - - - - - Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 5T", weight average molecular weight 60,000) - - 100 - - - - - - - Hardening resin Acrylic amine with a polybutadiene skeleton (manufactured by Negami Industries, "Artresin TFX-301", weight average molecular weight 5500) 10 10 10 1 20 10 10 10 10 - Acrylic amine with a polybutadiene skeleton (manufactured by Negami Industries, "Artresin TFX-303", weight average molecular weight 9000) - - - - - - - - - 10 Dicyclopentyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., "FANCRYL FA-513M") 80 80 80 80 80 80 80 - 80 80 Dicyclopentenyloxyethyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., "FANCRYL FA-512M") - - - - - - - 80 - - Tricyclodecanedimethanol dimethacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., "NK ESTER DCP") 20 20 20 20 20 20 20 20 20 20 Photoradical polymerization initiator 2-Methyl-1-(4-methylthiophenyl)-2-oxolinylpropane-1-one (manufactured by IGM Resins, "Omnirad 907") 5 5 5 5 5 5 5 5 5 5 Fuming Silica Hydrophilic fumed silica (AEROSIL 300, manufactured by Japan Aerosil Co., Ltd., with a specific surface area of 300 ^m2 /g) 5 5 5 5 5 1 20 5 - 5 Hydrophilic fumed silica (AEROSIL 200, manufactured by Japan Aerosil Co., Ltd., with a specific surface area of 200 m ² /g) - - - - - - - - 5 - Water-absorbent filler Calcium oxide (produced by Yoshizawa Lime Industry Co., Ltd., "quicklime J1P") 80 80 80 80 80 80 80 80 80 80 Swing Index 3.0 2.9 2.9 2.6 2.9 2.3 2.6 3.0 3.4 3.0 Reviews Paintability ◎ ○ ○ ◎ ◎ ○ ◎ ◎ ◎ ◎ Adhesion Initial Adhesion ◎ ◎ ◎ ○ ◎ ◎ ○ ○ ◎ ◎ Adhesion after exposure to high temperature and high humidity environment ◎ ◎ ◎ △ ◎ ◎ ○ ◎ ◎ ◎ Moisture-proof ◎ ◎ ◎ ◎ ○ ◎ ○ ◎ ◎ ◎

[Table 2] Comparison Example 1 2 3 4 5 6 Composition (parts by weight) Polyolefin Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 3T", weight average molecular weight 40,000) 100 100 100 100 100 - Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 4T", weight average molecular weight 50,000) - - - - - - Polyisobutylene (produced by JXTG Energy Corporation, "Tetrax 5T", weight average molecular weight 60,000) - - - - - - Hardening resin Acrylic amine with a polybutadiene skeleton (manufactured by Japan Negami Industries, "Artresin TFX-301", weight average molecular weight 5500) - 10 - 50 10 10 Acrylic amine with a polybutadiene skeleton (Artresin TFX-303 manufactured by Japan Negami Industries, weight average molecular weight 9000) - - - - - - Dicyclopentyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., "FANCRYL FA-513M") 80 80 80 80 80 80 Dicyclopentenyloxyethyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., "FANCRYL FA-512M") - - - - - - Tricyclodecanedimethanol dimethacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., "NK ESTER DCP") 20 20 20 20 20 20 Photoradical polymerization initiator 2-Methyl-1-(4-methylthiophenyl)-2-oxolinylpropane-1-one (manufactured by IGM Resins, "Omnirad 907") 5 5 5 5 5 5 Fuming Silica Hydrophilic fumed silica (AEROSIL 300, manufactured by Japan Aerosil Co., Ltd., with a specific surface area of 300 ^m2 /g) - - 5 5 50 5 Hydrophilic fumed silica (AEROSIL 200, manufactured by Japan Aerosil Co., Ltd., with a specific surface area of 200 m ² /g) - - - - - - Water-absorbent filler Calcium oxide (produced by Yoshizawa Lime Industry Co., Ltd., "quicklime J1P") 80 80 80 80 80 80 Swing Index 1.1 1.6 1.9 4.1 2.9 1.2 Reviews Paintability × × △ △ ○ × Adhesion Initial adhesion △ ○ △ ○ × ○ Adhesion after exposure to high temperature and high humidity environment × ○ × ○ × ○ Moisture-proof ○ ○ ○ × × × [Industrial Availability]

According to the present invention, a resin composition can be provided, which has excellent coating properties, adhesion properties, and moisture barrier properties, and can be used as a peripheral sealant for an organic EL display element to obtain an organic EL display element with excellent display performance. In addition, according to the present invention, a peripheral sealant for an organic EL display element using the resin composition can be provided.

without

without

Claims (6)

A resin composition, comprising polyisobutylene, a curable resin, a polymerization initiator, and fumed silica, wherein the weight average molecular weight of the polyisobutylene is greater than 5,000 and less than 100,000, the curable resin comprises urethane (meth) acrylate, the content of the urethane (meth) acrylate is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene, the content of the fumed silica is greater than 1 part by weight and less than 30 parts by weight relative to 100 parts by weight of the polyisobutylene, and the urethane (meth) acrylate has a polybutadiene skeleton. As in the resin composition of claim 1, wherein the weight average molecular weight of the (meth)acrylic amine ester is greater than 2000 and less than 20,000. A resin composition as claimed in claim 1 or 2, wherein the curable resin further comprises a (meth) acrylic compound having no amine ester bond. The resin composition of claim 1 or 2, wherein the specific surface area of the fumed silica is not less than 80 m ² /g and not more than 400 m ² /g. For the resin composition of claim 1 or 2, the value obtained by dividing the viscosity measured by an E-type viscometer at 25°C and 0.5 rpm by the viscosity measured by an E-type viscometer at 25°C and 5 rpm is 2.0 or more and 5.0 or less. A peripheral sealant for an organic EL display element is prepared by using the resin composition of claim 1, 2, 3, 4 or 5.