TWI843210B - Card Connector (Six) - Google Patents
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- TWI843210B TWI843210B TW111136143A TW111136143A TWI843210B TW I843210 B TWI843210 B TW I843210B TW 111136143 A TW111136143 A TW 111136143A TW 111136143 A TW111136143 A TW 111136143A TW I843210 B TWI843210 B TW I843210B
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- 239000004020 conductor Substances 0.000 claims abstract description 401
- 238000003466 welding Methods 0.000 claims abstract description 295
- 230000005540 biological transmission Effects 0.000 claims abstract description 273
- 230000008054 signal transmission Effects 0.000 claims abstract description 132
- 238000004891 communication Methods 0.000 claims abstract description 5
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- 230000005855 radiation Effects 0.000 abstract description 4
- 230000005684 electric field Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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Abstract
本發明為涉及一種卡連接器，主要包括一符合Micro SD記憶卡通訊協定之傳輸導體組，所述傳輸導體組包括有數個訊號傳輸導體對焊接部及數個迴路傳輸導體焊接部，且各個訊號傳輸導體對焊接部乃並排設置，並各個迴路傳輸導體焊接部分別設於各個訊號傳輸導體對焊接部之兩側處，藉此本案卡連接器在運行時，訊號傳輸導體對焊接部可透過位於兩側之迴路傳輸導體焊接部進行屏蔽，使得有效降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射。 The present invention relates to a card connector, which mainly includes a transmission conductor group that complies with the Micro SD memory card communication protocol. The transmission conductor group includes a plurality of signal transmission conductor welding parts and a plurality of loop transmission conductor welding parts, and each signal transmission conductor welding part is arranged side by side, and each loop transmission conductor welding part is respectively arranged at both sides of each signal transmission conductor welding part. When the card connector of the present invention is in operation, the signal transmission conductor welding part can be shielded by the loop transmission conductor welding parts located on both sides, so that the crosstalk interference problem is effectively reduced, and the electric field and magnetic field can be optimized to improve high-frequency noise radiation.
Description
本發明係涉及一種可有效降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射的卡連接器。 The present invention relates to a card connector that can effectively reduce crosstalk interference problems, optimize electric and magnetic fields, and improve high-frequency noise radiation.
隨著電子技術科技日新月異，數位相機、數位攝影機等電子產品之使用已經普及化，同時其功能及使用領域亦隨之不斷增加及擴大，目前上述電子產品之電子卡規格種類非常多，例如：SD卡(Secure Digital Memory Card)、MMC(Multi Media Card)卡、Memory Stick PRO Duo卡、Memory Stick PRO-HG Duo卡及通訊用之SIM卡等，上述不同規格之電子卡已經被廣泛應用於電子產品中。 With the rapid development of electronic technology, the use of electronic products such as digital cameras and digital video cameras has become popular, and their functions and application areas have also been increasing and expanding. Currently, there are many types of electronic card specifications for the above electronic products, such as: SD card (Secure Digital Memory Card), MMC (Multi Media Card) card, Memory Stick PRO Duo card, Memory Stick PRO-HG Duo card and SIM card for communication, etc. The above electronic cards of different specifications have been widely used in electronic products.
由於電子卡之發展為了符合電子產品易於使用攜帶之潮流，因此體積不斷縮小，同時傳輸之速度亦不斷提高，為了與其相互對應並達到電性連接，因此需設計出許多不同之電子卡連接器與其插接。 As electronic cards are developed to meet the trend of easy-to-use and portable electronic products, their size is constantly shrinking, while the transmission speed is also constantly increasing. In order to correspond to them and achieve electrical connection, many different electronic card connectors and plug-ins need to be designed.
在目前已經被廣泛使用之Micro SD卡連接器，是一種體積極小化之快閃記憶體卡，並被應用於行動裝置內，由於具有體積小、速度快之優點，因此幾乎為智慧型手機中所必備。 The Micro SD card connector, which is now widely used, is a very small flash memory card and is used in mobile devices. Due to its small size and high speed, it is almost a must-have in smart phones.
然上述Micro SD卡連接器於使用時，為確實存在下列問題與缺失尚待改進： However, the above-mentioned Micro SD card connector does have the following problems and deficiencies when in use and needs to be improved:
一般的卡連接器在傳輸導體組的排列上，訊號傳輸導體對常常會發生彼此的串音干擾，導致傳輸的訊號不穩定。 In the arrangement of transmission conductor groups in general card connectors, signal transmission conductor pairs often cause crosstalk interference with each other, resulting in unstable transmission signals.
是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and deficiencies in usage is the direction that the inventor of this invention and related manufacturers in this industry are eager to study and improve.
本發明之課題主要在於提供一種Micro SD記憶卡，尤指一種可有效 降低串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射的卡連接器。 The main topic of the present invention is to provide a Micro SD memory card, especially a card connector that can effectively reduce the crosstalk interference problem, optimize the electric field and magnetic field, and improve high-frequency noise radiation.
本發明為達上述優勢，其主要結構包括一符合Micro SD記憶卡通訊協定之傳輸導體組，該傳輸導體組包括有數個訊號傳輸導體對焊接部，各該訊號傳輸導體對焊接部乃並排設置，且各該訊號傳輸導體對焊接部兩側別設有迴路傳輸導體焊接部，藉此以對各該訊號傳輸導體對焊接部進行串音干擾屏蔽，以防訊號傳輸導體對焊接部彼此間的互相干擾，而影響訊號傳輸。 In order to achieve the above advantages, the main structure of the present invention includes a transmission conductor set that complies with the Micro SD memory card communication protocol. The transmission conductor set includes a plurality of signal transmission conductor welding parts. Each of the signal transmission conductor welding parts is arranged side by side, and a loop transmission conductor welding part is provided on both sides of each signal transmission conductor welding part, so as to shield each signal transmission conductor welding part from crosstalk interference, so as to prevent the signal transmission conductor welding parts from interfering with each other and affecting signal transmission.
本發明另一個主要目的之結構包括所述第一電源傳輸導體焊接部、第二電源傳輸導體焊接部、第二接地傳輸導體焊接部、及第四接地傳輸導體焊接部之寬度乃略大於第一接地傳輸導體焊接部、第一高頻訊號傳輸導體對焊接部、第一功能傳輸導體焊接部、第三電源傳輸導體焊接部、第三接地傳輸導體焊接部、第二功能傳輸導體焊接部、第三功能傳輸導體焊接部、第五接地傳輸導體焊接部、第六接地傳輸導體焊接部、及第七接地傳輸導體焊接部之寬度，如此透過增加面積之技術，使其具有較低的溫升，而可達到大電壓大電流之功效。 Another main purpose of the present invention is that the width of the first power transmission conductor welding part, the second power transmission conductor welding part, the second ground transmission conductor welding part, and the fourth ground transmission conductor welding part is slightly larger than the width of the first ground transmission conductor welding part, the first high-frequency signal transmission conductor welding part, the first functional transmission conductor welding part, the third power transmission conductor welding part, the third ground transmission conductor welding part, the second functional transmission conductor welding part, the third functional transmission conductor welding part, the fifth ground transmission conductor welding part, the sixth ground transmission conductor welding part, and the seventh ground transmission conductor welding part. In this way, by increasing the area, it has a lower temperature rise and can achieve the effect of high voltage and high current.
藉由上述技術，可針對習用卡連接器所存在之一般的卡連接器在傳輸導體組的排列上，訊號傳輸導體對常常會發生彼此的串音干擾，導致傳輸訊號不穩定的問題點加以突破，達到本發明如上述優點之實用進步性。 By using the above technology, the problem that the signal transmission conductors often cause crosstalk interference with each other in the arrangement of the transmission conductor group in the common card connectors can be overcome, thereby achieving the practical progress of the above advantages of the present invention.
A:傳輸導體組 A: Transmission conductor set
B:絕緣膠體 B: Insulation colloid
C:屏蔽外殼 C: Shielded housing
D:插置腔 D: Insertion cavity
E:對手對接器 E: Opponent docking device
1:訊號傳輸導體對焊接部 1: Signal transmission conductor welding part
11:第一高頻訊號傳輸導體對焊接部 11: The first high-frequency signal transmission conductor butt welding part
111:第一高頻訊號傳輸導體對接觸部 111: The first high-frequency signal transmission conductor contacts the part
12:第一低頻訊號傳輸導體對焊接部 12: The first low-frequency signal transmission conductor butt welding part
121:第一低頻訊號傳輸導體對接觸部 121: First low-frequency signal transmission conductor to contact part
13:第二低頻訊號傳輸導體對焊接部 13: Welding part of the second low-frequency signal transmission conductor
131:第二低頻訊號傳輸導體對接觸部 131: Second low-frequency signal transmission conductor to contact part
14:第二高頻訊號傳輸導體對焊接部 14: Second high-frequency signal transmission conductor butt welding part
141:第二高頻訊號傳輸導體對接觸部 141: Second high-frequency signal transmission conductor to contact part
2:迴路傳輸導體焊接部 2: Loop transmission conductor welding part
21:第一接地傳輸導體焊接部 21: First ground transmission conductor welding part
22:第一電源傳輸導體焊接部 22: First power transmission conductor welding part
221:第一電源傳輸導體接觸部 221: First power transmission conductor contact part
23:第二電源傳輸導體焊接部 23: Second power transmission conductor welding part
231:第二電源傳輸導體接觸部 231: Second power transmission conductor contact part
24:第三電源傳輸導體焊接部 24: Third power transmission conductor welding part
241:第三電源傳輸導體接觸部 241: Third power transmission conductor contact part
25:第二接地傳輸導體焊接部 25: Second ground transmission conductor welding part
251:第二接地傳輸導體接觸部 251: Second ground transmission conductor contact part
26:第三接地傳輸導體焊接部 26: Third ground transmission conductor welding part
27:第四接地傳輸導體焊接部 27: Fourth ground transmission conductor welding part
271:第四接地傳輸導體接觸部 271: Fourth ground transmission conductor contact part
28:第五接地傳輸導體焊接部 28: Fifth ground transmission conductor welding part
281:第五接地傳輸導體接觸部 281: Fifth ground transmission conductor contact part
29:第六接地傳輸導體焊接部 29: Sixth ground transmission conductor welding part
291:第六接地傳輸導體接觸部 291: Sixth ground transmission conductor contact part
30:第七接地傳輸導體焊接部 30: Seventh ground transmission conductor welding part
40:第一功能傳輸導體焊接部 40: First functional transmission conductor welding part
401:第一功能傳輸導體接觸部 401: First functional transmission conductor contact part
41:第二功能傳輸導體焊接部 41: Second functional transmission conductor welding part
411:第二功能傳輸導體接觸部 411: Second functional transmission conductor contact part
42:第三功能傳輸導體焊接部 42: Third functional transmission conductor welding part
421:第三功能傳輸導體接觸部 421: Third functional transmission conductor contact part
第一圖 為本發明較佳實施例之立體圖。 The first figure is a three-dimensional diagram of a preferred embodiment of the present invention.
第二圖 為本發明較佳實施例之分解圖。 The second figure is a disassembled diagram of a preferred embodiment of the present invention.
第三圖 為本發明較佳實施例之傳輸導體組立體圖。 The third figure is a three-dimensional diagram of the transmission conductor assembly of the preferred embodiment of the present invention.
第四圖 為本發明較佳實施例之傳輸導體組俯視圖。 Figure 4 is a top view of the transmission conductor assembly of a preferred embodiment of the present invention.
第五圖 為本發明較佳實施例之插接示意圖。 Figure 5 is a schematic diagram of the plug-in of a preferred embodiment of the present invention.
請參閱第一圖至第五圖所示，為本發明較佳實施例之立體圖至插接示意圖，由圖中可清楚看出本發明第二圖因訊號傳輸導體對焊接部1與迴路傳
輸導體焊接部2之細部特徵較多，導致無法全部於第二圖中展現所有符號，故本發明分別以第三圖及第四圖展現訊號傳輸導體對焊接部1與迴路傳輸導體焊接部2之細部特徵，其中，本發明主要係包括：一符合Micro SD記憶卡通訊協定之傳輸導體組A，該傳輸導體組A包括有：數個訊號傳輸導體對焊接部1，各該訊號傳輸導體對焊接部1乃並排設置，且所述訊號傳輸導體對焊接部1主要係具有：一第一高頻訊號傳輸導體對焊接部11，該第一高頻訊號傳輸導體對焊接部11乃延伸形成有一第一高頻訊號傳輸導體對接觸部111；一設於該第一高頻訊號傳輸導體對焊接部11一側之第一低頻訊號傳輸導體對焊接部12，該第一低頻訊號傳輸導體對焊接部12乃延伸形成有一第一低頻訊號傳輸導體對接觸部121；一設於該第一低頻訊號傳輸導體對焊接部12背離該第一高頻訊號傳輸導體對焊接部11一側處之第二低頻訊號傳輸導體對焊接部13，該第二低頻訊號傳輸導體對焊接部13乃延伸形成有一第二低頻訊號傳輸導體對接觸部131；一設於該第二低頻訊號傳輸導體對焊接部13背離該第一低頻訊號傳輸導體對焊接部12一側處之第二高頻訊號傳輸導體對焊接部14，該第二高頻訊號傳輸導體對焊接部14乃延伸形成有一第二高頻訊號傳輸導體對接觸部141。
Please refer to the first to fifth figures, which are three-dimensional diagrams and plug-in schematic diagrams of the preferred embodiments of the present invention. It can be clearly seen from the figures that the second figure of the present invention has too many detailed features of the signal transmission
而於各該訊號傳輸導體對焊接部1兩側處乃分別設有一迴路傳輸導體焊接部2，且所述迴路傳輸導體焊接部主要係具有：一第一接地傳輸導體焊接部21；一第一電源傳輸導體焊接部22，該第一電源傳輸導體焊接部22乃延伸形成有一第一電源傳輸導體接觸部221；一第二電源傳輸導體焊接部23，該第二電源傳輸導體焊接部23乃延伸形成有一第二電源傳輸導體接觸部231；一第三電源傳輸導體焊接部24，該第三電源傳輸導體焊接部24乃延伸形成有一第三電源傳輸導體接觸部241；一第二接地傳輸導體焊接部25，該第二接地傳輸導體焊接部25 乃延伸形成有一第二接地傳輸導體接觸部251；一第三接地傳輸導體焊接部26；一第四接地傳輸導體焊接部27，該第四接地傳輸導體焊接部27乃延伸形成有一第四接地傳輸導體接觸部271；一第五接地傳輸導體焊接部28，該第五接地傳輸導體焊接部28乃延伸形成有一第五接地傳輸導體接觸部281；一第六接地傳輸導體焊接部29，該第六接地傳輸導體焊接部29乃延伸形成有一第六接地傳輸導體接觸部291；一第七接地傳輸導體焊接部30；藉此以對各該訊號傳輸導體對焊接部1進行電磁干擾屏蔽。 A loop transmission conductor welding portion 2 is provided at both sides of each signal transmission conductor welding portion 1, and the loop transmission conductor welding portion mainly comprises: a first ground transmission conductor welding portion 21; a first power transmission conductor welding portion 22, the first power transmission conductor welding portion 22 is extended to form a first power transmission conductor contact portion 221; a second power transmission conductor welding portion 23, the second power transmission conductor welding portion 23 is extended to form a second power transmission conductor contact portion 231; a third power transmission conductor welding portion 24, the third power transmission conductor welding portion 24 is extended to form a third power transmission conductor contact portion 241; a second ground transmission conductor welding portion 25, the second ground transmission conductor welding portion 26 is extended to form a third power transmission conductor contact portion 261; The transmission conductor welding part 25 is extended to form a second ground transmission conductor contact part 251; a third ground transmission conductor welding part 26; a fourth ground transmission conductor welding part 27, the fourth ground transmission conductor welding part 27 is extended to form a fourth ground transmission conductor contact part 271; a fifth ground transmission conductor welding part 28, the fifth ground transmission conductor welding part 28 is extended to form a fifth ground transmission conductor contact part 281; a sixth ground transmission conductor welding part 29, the sixth ground transmission conductor welding part 29 is extended to form a sixth ground transmission conductor contact part 291; a seventh ground transmission conductor welding part 30; thereby, the electromagnetic interference shielding is performed on each of the signal transmission conductor welding parts 1.
此外，若將傳輸導體組A由右至左依序排列時，其排列順序為第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一電源傳輸導體焊接部22、第一功能傳輸導體焊接部40、第二電源傳輸導體焊接部23、第三電源傳輸導體焊接部24、第二接地傳輸導體焊接部25、第三接地傳輸導體焊接部26、第一低頻訊號傳輸導體對焊接部12、第二功能傳輸導體焊接部41、第四接地傳輸導體焊接部27、第三功能傳輸導體焊接部42、第二低頻訊號傳輸導體對焊接部13、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、第二高頻訊號傳輸導體對焊接部14、及第七接地傳輸導體焊接部30。
In addition, if the transmission conductor group A is arranged from right to left, the arrangement order is the first ground transmission
其中，該第一功能傳輸導體焊接部40乃延伸形成有一第一功能傳輸導體接觸部401，該第二功能傳輸導體焊接部41乃延伸形成有一第二功能傳輸導體接觸部411，該第三功能傳輸導體焊接部42乃延伸形成有一第三功能傳輸導體接觸部421。
The first functional transmission
因此，以排列方式而言，該第一高頻訊號傳輸導體對接觸部111、該第一功能傳輸導體接觸部401、該第三電源傳輸導體接觸部241、該第二功能傳輸導體接觸部411、該第三功能傳輸導體接觸部421、該第五接地傳輸導體接觸部281、及該第二高頻訊號傳輸導體對接觸部141乃位於同一排上，而該第一電源傳輸導體接觸部221、該第二電源傳輸導體接觸部231、該第二接地傳輸導體接觸部251、該第一低頻訊號傳輸導體對接觸部121、該第四接地傳輸導體接觸部271、該第二低頻訊號傳輸導體對
接觸部131、及該第六接地傳輸導體接觸部291乃位於同一排上。
Therefore, in terms of arrangement, the first high-frequency signal transmission conductor
另外以其焊接部之面積寬度而言，所述第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、及第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度。
In addition, in terms of the area width of the welding parts, the widths of the first power transmission
其中，所述訊號傳輸導體對焊接部1係為高頻訊號傳輸導體對焊接部或低頻傳輸導體對焊接部其中之一者。
Wherein, the signal transmission
其中，所述迴路傳輸導體焊接部2係為接地傳輸導體焊接部或電源傳輸導體焊接部其中之一者。
Wherein, the loop transmission
其中，所述傳輸導體組A乃與一絕緣膠體B結合。 Wherein, the transmission conductor group A is combined with an insulating colloid B.
其中，所述絕緣膠體B乃與一屏蔽外殼C結合，並於結合後之一側處形成一插置腔D。 The insulating colloid B is combined with a shielding shell C, and an insertion cavity D is formed on one side after the combination.
藉此，當使用者將對手對接器E從插置腔D插入本案卡連接器時，對手連接器E之差動部會先接觸到前排的第一電源傳輸導體接觸部221、第二電源傳輸導體接觸部231、第二接地傳輸導體接觸部251、第一低頻訊號傳輸導體對接觸部121、第四接地傳輸導體接觸部271、第二低頻訊號傳輸導體對接觸部131、及第六接地傳輸導體接觸部291，爾後繼續往內插置即會再與第一高頻訊號傳輸導體對接觸部111、第一功能傳輸導體接觸部401、第三電源傳輸導體接觸部241、第二功能傳輸導體接觸部411、第三功能傳輸導體接觸部421、第五接地傳輸導體接觸部281、及第二高頻訊號傳輸導體對接觸部141進行接觸。
Thus, when the user inserts the counterpart connector E from the insertion cavity D into the present card connector, the differential portion of the counterpart connector E will first contact the first power transmission
又於進行資訊傳遞的過程當中時，因每個訊號傳輸導體對焊接部1的旁邊皆必然具有迴路傳輸導體焊接部2，以藉由迴路傳輸導體焊接部2將每個訊號傳輸導體對焊接部1之兩側進行包圍隔離，使每個訊號傳輸導體對焊接部1不會彼此干擾，進而有效抑制串音干擾問題，換言之詳細而論，第一高頻訊號傳輸導體對焊接部11的兩側分別有第一接地傳輸導體焊接部21及第一電源傳輸導體焊接部22的屏蔽隔離，而第一低頻訊號傳輸導體對焊接部12
的兩側分別有第三接地傳輸導體焊接部26及第四接地傳輸導體焊接部27的屏蔽隔離，而第二低頻訊號傳輸導體對焊接部13的兩側分別有第四接地傳輸導體焊接部27及第五接地傳輸導體焊接部28的屏蔽隔離，而第二高頻訊號傳輸導體對焊接部14的兩側分別有第六接地傳輸導體焊接部29及第七接地傳輸導體焊接部30的屏蔽隔離。
In the process of information transmission, each signal transmission conductor
再者，也因第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度，如此透過增加面積之技術，使其具有較低的溫升，而達到具有耐大電壓及大電流之功效。
Furthermore, because the widths of the first power transmission
又者，第一高頻訊號傳輸導體對焊接部11之間的距離乃小於該第一接地傳輸導體焊接部21及該第一電源傳輸導體焊接部22相對於該第一高頻訊號傳輸導體對焊接部11之距離，而該第一低頻訊號傳輸導體對焊接部12之間的距離乃小於該第三接地傳輸導體焊接部26及該第四接地傳輸導體焊接部27相對於該第一低頻訊號傳輸導體對焊接部12之距離，而該第二低頻訊號傳輸導體對焊接部13之間的距離乃小於該第四接地傳輸導體焊接部27及該第五接地傳輸導體焊接部28相對於該第二低頻訊號傳輸導體對焊接部13之距離，而該第二高頻訊號傳輸導體對焊接部14之間的距離乃小於該第六接地傳輸導體焊接部29及該第七接地傳輸導體焊接部30相對於該第二高頻訊號傳輸導體對焊接部14之距離，藉此得以達到降低或減少訊號的損失。
Furthermore, the distance between the first high-frequency signal transmission conductor and the
另者，又因第三電源傳輸導體焊接部24與第二接地傳輸導體焊接部25乃相鄰設置，如此即可達到最小迴路，緩解電磁干擾(EMI)與射頻干擾(RFI)。
In addition, because the third power transmission
是以，本發明之卡連接器為可改善習用之技術關鍵在於： Therefore, the key technology of the card connector of the present invention to improve usage is:
第一，透過每個訊號傳輸導體對焊接部1的旁邊皆設有迴路傳輸導體焊接部2之設計，以藉由迴路傳輸導體焊接部2將每個訊號傳輸導體對焊接部1之兩側進行包圍隔離，使每個訊號傳輸導體對焊接部1不會彼此干擾，進
而有效抑制串音干擾問題，且可使電場與磁場最佳化，改善高頻雜訊輻射。
First, by providing a loop transmission
第二，透過第一電源傳輸導體焊接部22、第二電源傳輸導體焊接部23、第二接地傳輸導體焊接部25、第四接地傳輸導體焊接部27之寬度乃略大於第一接地傳輸導體焊接部21、第一高頻訊號傳輸導體對焊接部11、第一功能傳輸導體焊接部40、第三電源傳輸導體焊接部24、第三接地傳輸導體焊接部26、第二功能傳輸導體焊接部41、第三功能傳輸導體焊接部42、第五接地傳輸導體焊接部28、第六接地傳輸導體焊接部29、及第七接地傳輸導體焊接部30之寬度，如此透過增加面積之技術，使其具有較低的溫升，而達到具有耐大電壓及大電流之功效。
Second, the width of the first power transmission
第三，透過第三電源傳輸導體焊接部24與第二接地傳輸導體焊接部25乃相鄰設置，如此即可達到最小迴路，緩解電磁干擾(EMI)與射頻干擾(RFI)。
Third, the third power transmission
惟，雖然本文中已顯示並敘明本發明之各種實施例，但僅以舉例方式提供此等實施例，本文中所提供之任何操作理論或益處既定僅作為敘明本發明之一輔助；此等理論及解釋不束縛或限制關於藉由實踐本發明而達成之組織重塑之申請專利範圍。熟習此項技術者現在可不背離本發明之情形下構想出諸多變化、改變或替代。應瞭解，可在實踐本發明時採用本文中所敘明之發明之實施例的各種替代方案。本發明之範疇、本發明之範疇內的方法及結構既定包括等效形式。 However, although various embodiments of the present invention have been shown and described herein, such embodiments are provided by way of example only, and any operating theories or benefits provided herein are intended only as an aid to the description of the present invention; such theories and explanations do not restrict or limit the scope of the patent application regarding the organizational remodeling achieved by practicing the present invention. Those skilled in the art can now conceive of many variations, changes or substitutions without departing from the present invention. It should be understood that various alternatives to the embodiments of the invention described herein may be adopted in practicing the present invention. The scope of the present invention, the methods and structures within the scope of the present invention are intended to include equivalent forms.
綜上所述，本發明之卡連接器於使用時，為確實能達到其功效及目的，故本發明誠為一實用性優異之發明，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本發明，以保障發明人之辛苦發明，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感公便。 In summary, the card connector of this invention can truly achieve its efficacy and purpose when used. Therefore, this invention is truly an invention with excellent practicality. In order to meet the application requirements for invention patents, an application is filed in accordance with the law. I hope that the review committee will approve this invention as soon as possible to protect the inventor's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write to instruct. The inventor will do his best to cooperate and feel it is public and convenient.
1:訊號傳輸導體對焊接部 1: Signal transmission conductor welding part
11:第一高頻訊號傳輸導體對焊接部 11: The first high-frequency signal transmission conductor butt welding part
111:第一高頻訊號傳輸導體對接觸部 111: The first high-frequency signal transmission conductor contacts the part
12:第一低頻訊號傳輸導體對焊接部 12: The first low-frequency signal transmission conductor butt welding part
121:第一低頻訊號傳輸導體對接觸部 121: First low-frequency signal transmission conductor to contact part
13:第二低頻訊號傳輸導體對焊接部 13: Welding part of the second low-frequency signal transmission conductor
131:第二低頻訊號傳輸導體對接觸部 131: Second low-frequency signal transmission conductor to contact part
14:第二高頻訊號傳輸導體對焊接部 14: Second high-frequency signal transmission conductor butt welding part
141:第二高頻訊號傳輸導體對接觸部 141: Second high-frequency signal transmission conductor to contact part
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111136143A TWI843210B (en) | 2022-09-23 | 2022-09-23 | Card Connector (Six) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111136143A TWI843210B (en) | 2022-09-23 | 2022-09-23 | Card Connector (Six) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202414922A TW202414922A (en) | 2024-04-01 |
| TWI843210B true TWI843210B (en) | 2024-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111136143A TWI843210B (en) | 2022-09-23 | 2022-09-23 | Card Connector (Six) |
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| Country | Link |
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| TW (1) | TWI843210B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10205277B2 (en) * | 2016-04-14 | 2019-02-12 | Canon Kabushiki Kaisha | Card-type storage device having heat dissipation structure and slot device |
| US10784021B2 (en) * | 2010-08-31 | 2020-09-22 | 3M Innovative Properties Company | Shielded electrical cable |
| CN215870060U (en) * | 2021-07-20 | 2022-02-18 | 维将科技股份有限公司 | Card connector |
| TWI778595B (en) * | 2021-04-23 | 2022-09-21 | 維將科技股份有限公司 | Card Connector (3) |
| TWM643180U (en) * | 2022-09-23 | 2023-07-01 | 維將科技股份有限公司 | Card connector |
-
2022
- 2022-09-23 TW TW111136143A patent/TWI843210B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10784021B2 (en) * | 2010-08-31 | 2020-09-22 | 3M Innovative Properties Company | Shielded electrical cable |
| US10205277B2 (en) * | 2016-04-14 | 2019-02-12 | Canon Kabushiki Kaisha | Card-type storage device having heat dissipation structure and slot device |
| TWI778595B (en) * | 2021-04-23 | 2022-09-21 | 維將科技股份有限公司 | Card Connector (3) |
| CN215870060U (en) * | 2021-07-20 | 2022-02-18 | 维将科技股份有限公司 | Card connector |
| TWM643180U (en) * | 2022-09-23 | 2023-07-01 | 維將科技股份有限公司 | Card connector |
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| Publication number | Publication date |
|---|---|
| TW202414922A (en) | 2024-04-01 |
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