TWI843092B - Liquid cooling system - Google Patents

Abstract

A liquid cooling system is used to solve the problem that the use cost of a conventional immersion cooling device is difficult to reduce. The liquid cooling system includes a sealing groove having an accommodating space, a circulation layer formed by a working liquid filled in the accommodating space, and a cooling module located in the accommodating space. The cooling module has a phase change fluid tank and a pump, and the phase change fluid tank is used for thermally connecting a heat source. The phase change fluid tank is not in contact with the circulation layer, and the phase change fluid tank has an evapotranspiration port communicating with the accommodating space. A liquid inlet of the pump communicates with the circulation layer, and a liquid outlet of the pump communicates with the interior of the phase change fluid tank.

Description

Liquid cooling system

The present invention relates to a heat dissipation device, in particular to a liquid cooling system.

Immersion cooling is to immerse the electrical unit (such as a server or computer motherboard) in a non-conductive liquid so that the high temperature heat energy generated by the electrical unit during operation can be directly absorbed by the non-conductive liquid, allowing the electrical unit to maintain an appropriate operating temperature to achieve the expected working performance and service life.

Common immersion cooling devices generally include a cooling tank and a condenser. The cooling tank is filled with liquid non-conductive liquid, and the condenser is installed in the cooling tank and located above the liquid non-conductive liquid. The electrical unit to be cooled is immersed in the liquid non-conductive liquid. Since the boiling point of the non-conductive liquid is relatively low, after absorbing the working heat energy of the electrical unit, part of the non-conductive liquid can be converted into gas, so that bubbles are formed in the liquid non-conductive liquid and float upward until they leave the surface of the liquid non-conductive liquid, condense back into liquid again when they contact the condenser, and drip downward.

However, in order to allow the non-conductive liquid to fully soak each electrical unit, the above-mentioned known immersion cooling device usually requires a large amount of non-conductive liquid in the cooling tank, and the price of non-conductive liquid is expensive, which makes it difficult to reduce the use cost of the entire immersion cooling device.

In view of this, the conventional immersion cooling device still needs to be improved.

In order to solve the above problems, the purpose of the present invention is to provide a liquid cooling system that can reduce the cost of use.

A second object of the present invention is to provide a liquid cooling system that can increase heat dissipation performance.

Another object of the present invention is to provide a liquid cooling system that is easy to assemble.

The directions or similar terms described in the present invention, such as "front", "rear", "left", "right", "upper", "lower", "inner", "outer", "side", etc., are mainly for reference to the directions of the attached drawings. Each direction or similar terms are only used to assist in the description and understanding of the various embodiments of the present invention, and are not used to limit the present invention.

The quantifiers "one" or "a" used in the components and parts described in the present invention are only for the convenience of use and to provide a general meaning of the scope of the present invention; they should be interpreted in the present invention as including one or at least one, and the single concept also includes the plural case, unless it is obvious that it means otherwise.

The similar terms such as "combination", "assembly" or "assembly" mentioned in the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable, which can be selected by those with ordinary knowledge in the field according to the materials of the components to be connected or the assembly requirements.

The liquid cooling system of the present invention comprises: a sealed tank having a containing space, the sealed tank having a tank cover combined with a tank body, at least one condensing unit of the sealed tank combined with the outer surface of the tank cover, the tank cover having at least one basket empty part connected to the containing space, the at least one condensing unit covering the basket empty part; a circulation layer formed by a working liquid filled in the containing space; and A cooling module is located in the accommodation space. The cooling module has a phase change fluid tank and a pump. The phase change fluid tank is used to thermally connect a heat source. The phase change fluid tank does not contact the circulation layer. The phase change fluid tank has an evaporation port connected to the accommodation space. A liquid inlet of the pump is connected to the circulation layer. A liquid outlet of the pump is connected to the interior of the phase change fluid tank.

Accordingly, in the liquid cooling system of the present invention, the accommodating space only needs to be filled with a small amount of working liquid to form the circulation layer, and the working liquid located in the circulation layer is driven by the pump to enter the interior of the phase change fluid tank. The working liquid inside the phase change fluid tank can absorb heat energy from the liquid state and evaporate into a gaseous state. The gaseous working liquid can evaporate upward through the evaporation port, and then condense back into a liquid state and drip downward into the circulation layer or the interior of the phase change fluid tank, so that the working liquid can absorb the heat energy of the heat source. In this way, the amount of the working liquid can be reduced, which has the effect of reducing the cost of use, and the condensation unit can take away the heat energy in the sealing groove, which has the effect of increasing the heat dissipation efficiency. Furthermore, the liquid surface of the working liquid inside the at least two phase change fluid tanks can be aligned with the at least two heat sources, which has a good heat dissipation efficiency.

The evaporation port can be aligned with the condensation unit. This ensures that the working liquid evaporating upward can directly transfer heat energy to the condensation unit, which has the effect of increasing heat dissipation efficiency.

The cooling module may have a liquid inlet pipe, which may connect the liquid inlet port and the circulation layer. Thus, the structure is simple and easy to assemble, and has the effect of convenient assembly.

The number of the phase change fluid tank and the pump can be several, and the outlet of each pump is connected to the inside of each phase change fluid tank. In this way, each pump drives the working fluid in the circulation layer into the inside of each phase change fluid tank, so that the working fluid in each phase change fluid tank can absorb the heat energy of different heat sources respectively, which has the effect of increasing the heat dissipation efficiency.

The liquid cooling system of the present invention may further include at least one electrical unit, which may have at least one heat source, and the heat source may be located opposite to a heat source connection surface of the phase change fluid tank. In this way, the electrical unit can be cooled down effectively, which has the effect of making the electrical unit operate stably.

The liquid cooling system of the present invention may further include a guide member, which is located under a slot cover of the sealing slot, and the guide member can guide the working liquid condensed back to the liquid state to flow to the electrical unit. In this way, the working liquid condensed back to the liquid state can flush and spray the several electronic components on the electrical unit, thereby cooling the several electronic components, which has the effect of increasing the heat dissipation efficiency.

The sealing groove may have a groove cover combined with a groove body, and the electrical unit may be connected to a carrier board in the groove body. In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

The sealing groove may have a groove cover combined with a groove body, and the number of the electrical units may be several, and the several electrical units may be respectively connected to a series connection board in the groove body. In this way, the several electrical units can be easily configured in the accommodation space, which has the effect of being able to meet the configuration requirements of various installation spaces.

[The present invention]

1: Sealing groove

11: Slot body

111: Open your mouth

12: Slot cover

121: Lukongbu

13: Condensation unit

2: Loop layer

3: Cooling module

31: Phase change fluid tank

31a: Heat source connection surface

32: Pump

32a: Liquid inlet

32b: Liquid outlet

33: Liquid inlet pipe

34: Liquid outlet pipe

34a: Diversion pipe section

4: Extension hood

4a: Upper port

5: Guide piece

B1: Carrier board

B2: Serial board

E:Electrical unit

E1: Electronic parts

H: Heat source

L: Working fluid

S: Storage space

Q: Evaporation outlet

[Figure 1] An exploded perspective view of the first embodiment of the present invention.

[Figure 2] A cross-sectional view of the assembly of the first embodiment of the present invention.

[Figure 3] Sectional view along line A-A of Figure 2.

[Figure 4] The usage diagram as shown in Figure 3.

[Figure 5] A cross-sectional view of the assembly of the second embodiment of the present invention.

[Figure 6] An exploded perspective view of the third embodiment of the present invention.

[Figure 7] A cross-sectional view of the third embodiment of the present invention.

[Figure 8] The usage diagram as shown in Figure 7.

[Figure 9] A cross-sectional view of the fourth embodiment of the present invention.

In order to make the above and other purposes, features and advantages of the present invention more clearly understood, the following specifically cites the preferred embodiments of the present invention and describes them in detail with the accompanying drawings; in addition, the same symbols in different drawings are regarded as the same and their descriptions will be omitted.

Please refer to Figure 2, which is the first embodiment of the liquid cooling system of the present invention, which includes a sealing tank 1, a circulation layer 2 and a cooling module 3. The sealing tank 1 has a containing space S, and the circulation layer 2 and the cooling module 3 are located in the containing space S.

Please refer to FIG. 1 . The present invention does not limit the type of the sealing groove 1. In this embodiment, the sealing groove 1 may have a groove body 11 and a groove cover 12. The accommodating space S is located inside the groove body 11. The groove body 11 may have an opening 111 connected to the accommodating space S. The opening 111 may be used to input liquid into the accommodating space S or to take out objects to be cooled. The groove cover 12 may cover the opening 111. The periphery of the groove cover 12 may be airtight with the groove body 11 by, for example, a rubber ring to ensure that the gas or liquid in the accommodating space S does not leak from the periphery of the groove cover 12 to the outside. The sealing groove 1 of the liquid cooling system of the present invention can be the shell of electronic equipment such as gaming computers, industrial computers, servers or network communication equipment, or the liquid cooling system of the present invention can also be entirely installed inside electronic equipment such as gaming computers, industrial computers, servers or network communication equipment, and the present invention is not limited to this.

Please refer to Figures 1 and 2. In addition, the tank cover 12 may have at least one hollow portion 121, and the hollow portion 121 may be connected to the accommodating space S. The sealing tank 1 may also have at least one condensation unit 13, and the condensation unit 13 may be combined with the outer surface of the tank cover 12 and cover the hollow portion 121. The present invention does not limit the type of the condensation unit 13. The condensation unit 13 may be, for example, at least one heat dissipation fin, and the condensation unit 13 may be made of a metal material with a high thermal conductivity.

The circulation layer 2 is formed by a working liquid L filled in the accommodating space S, and the working liquid L can be selected as a non-conductive liquid.

Please refer to Figures 1 and 3. The cooling module 3 has a phase change fluid tank 31. The phase change fluid tank 31 does not contact the circulation layer 2 (i.e., the tank 31 may be higher than the circulation layer 2). The phase change fluid tank 31 has an evaporation port Q connected to the containing space S. Specifically, the phase change fluid tank 31 does not have an upper cover, so that the evaporation port Q is formed at the opening of the phase change fluid tank 31. The evaporation port Q may face the tank cover 12, and the evaporation port Q may preferably be aligned with the hollow portion 121. The phase change fluid tank 31 may have a heat source connection surface 31a, and the heat source connection surface 31a is used to thermally connect a heat source H. The phase change fluid tank 31 may be made of a metal material with high thermal conductivity such as copper or aluminum, or the phase change fluid tank 31 may only select the part in contact with the heat source H (i.e., the heat source connection surface 31a) to be made of a metal material with high thermal conductivity such as copper or aluminum. The present invention does not limit the formation method of the phase change fluid tank 31. For example, the phase change fluid tank 31 may be stamped, which has the effect of simplifying the process.

The cooling module 3 has a pump 32. The pump 32 may not contact the circulation layer 2, or may be completely immersed in the circulation layer 2, or may partially contact the circulation layer 2, and the present invention is not limited thereto. In this embodiment, the pump 32 does not contact the circulation layer 2, and the pump 32 may be located between the phase change fluid tank 31 and the circulation layer 2. The pump 32 has a liquid inlet 32a and a liquid outlet 32b, wherein the liquid inlet 32a is connected to the circulation layer 2, and the liquid outlet 32b is connected to the interior of the phase change fluid tank 31, so that the pump 32 can drive the working liquid L located in the circulation layer 2 into the interior of the phase change fluid tank 31. Preferably, the cooling module 3 can have a liquid inlet pipe 33 and a liquid outlet pipe 34, wherein the liquid inlet pipe 33 is connected to the liquid inlet 32a and the circulation layer 2, and the liquid outlet pipe 34 is connected to the liquid outlet 32b and the interior of the phase change fluid tank 31.

The liquid cooling system of the present invention may further include at least one electrical unit E, which is an object to be cooled. The electrical unit E may be, for example, a motherboard, a communication interface board, a display card, or a data storage board. The electrical unit E may be connected to a carrier board B1 in the tank body 11. The electrical unit E may have at least one heat source H. The heat source H may be opposite to the heat source connection surface 31a of the phase change fluid tank 31, so that the heat source connection surface 31a may be directly or indirectly thermally connected to the heat source H.

Please refer to Figures 2 and 4. When the liquid cooling system is in operation, the heat source connection surface 31a of the phase change fluid tank 31 can be thermally connected to the heat source H, and the pump 32 can drive the working liquid L located in the circulation layer 2 to flow. The working liquid L can enter the interior of the phase change fluid tank 31 through the liquid inlet pipe 33 and the liquid outlet pipe 34 in sequence. The working liquid L in the phase change fluid tank 31 can absorb heat energy from the liquid state and evaporate into the gas state, so that the working liquid L can be filled with The working liquid L formed into a gas can evaporate upward through the evaporation port Q, and then contact the condensation unit 13 through the hollow portion 121, and after transferring the heat energy to the condensation unit 13, it condenses back into a liquid state and drips downward into the circulation layer 2 or the phase change fluid tank 31. Then, the pump 32 drives the working liquid L into the phase change fluid tank 31 again, and the cycle continues in this way to continuously absorb the heat energy of the heat source H. Therefore, the accommodating space S only needs to be filled with a small amount of working liquid L to form the circulation layer 2, and the working liquid L in the circulation layer 2 is driven by the pump 32 to enter the interior of the phase change fluid tank 31, so that the working liquid L in the phase change fluid tank 31 can absorb the heat energy of the heat source H, thereby reducing the amount of the working liquid L, which has the effect of reducing the use cost.

Please refer to FIG. 5, which is a second embodiment of the liquid cooling system of the present invention. The second embodiment is substantially the same as the first embodiment. In the second embodiment, the number of the phase change fluid tank 31 and the pump 32 can be several, respectively. The heat source connection surface 31a of each phase change fluid tank 31 can be thermally connected to the heat source H of several electrical units E, the liquid inlet 32a of each pump 32 is connected to the circulation layer 2, and the liquid outlet 32b of each pump 32 is connected to the inside of each phase change fluid tank 31. The several electrical units E can be respectively connected to a series connection plate B2 in the tank body 11, so that the several electrical units E can be easily arranged in the accommodating space S, and the several electrical units E can be arranged side by side. Thus, each pump 32 can drive the working liquid L in the circulation layer 2 to enter each phase change fluid tank 31. The working liquid L in each phase change fluid tank 31 can absorb heat energy from the liquid state and evaporate into a gas state, so that the working liquid L can fully absorb the heat energy of the heat source H. The gaseous working liquid L can evaporate upward through the evaporation port Q, thereby Through the hollow part 121 and contacting the condensation unit 13, after transferring the heat energy to the condensation unit 13, it condenses back to liquid state and drips downward into the circulation layer 2 or the phase change fluid tank 31. Then, each pump 32 drives the working liquid L into each phase change fluid tank 31 again, and the cycle continues in this way to continuously absorb the heat energy of the heat source H.

Please refer to FIGS. 6 and 7, which are the third embodiment of the liquid cooling system of the present invention. The third embodiment is substantially the same as the first embodiment. In the third embodiment, the number of the hollow portion 121 and the number of the condensing unit 13 are two, respectively. The two condensing units 13 cover the two hollow portions 121, respectively. The cooling module 3 may have at least two phase change fluid tanks 31, and the at least two phase change fluid tanks 31 may be located at different heights. In this embodiment, the number of the phase change fluid tanks 31 is two for illustration. That is, one of the phase change fluid troughs 31 is closer to the pump 32 than the other phase change fluid trough 31, so that the heat source connecting surface 31a of the two phase change fluid troughs 31 can be thermally connected to the heat source H located at different heights, and the liquid outlet pipe 34 can have at least two branch pipe parts 34a, and the two branch pipe parts 34a can be respectively connected to the two phase change fluid troughs 31, so that the liquid outlet pipe 34 can be connected to the inside of the two phase change fluid troughs 31 respectively. In this embodiment, the liquid outlet pipe 34 can preferably form a Y shape. Furthermore, the pump 32 can be completely immersed in the circulation layer 2, so that the liquid inlet 32a of the pump 32 can be directly connected to the circulation layer 2, and the pump 32 can drive the working liquid L located in the circulation layer 2 to enter the interior of each phase change fluid tank 31 through the two branch pipes 34a.

Please refer to FIGS. 7 and 8 . In addition, the liquid cooling system of the present invention may further include an extension cover 4, the extension cover 4 is combined with the phase change fluid tank 31 located at a lower position, the extension cover 4 is connected to the evaporation port Q, the extension cover 4 may have an upper port 4a, the upper port 4a may preferably be at the same height as the phase change fluid tank 31 located at the highest position, and the upper port 4a may not be lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position, that is, the upper port 4a of the extension cover 4 may be higher than the heat source H located at the highest position, or be at the same height as the heat source H located at a high position. In this way, according to the connecting pipe principle (Evangelista Torricelli, the pressure at any two points of the same liquid and the same horizontal plane is equal), so that the liquid surface of the working liquid L inside the two-phase change fluid tank 31 can be aligned with the two heat sources H to ensure that the two heat sources H can be partially or completely covered by the working liquid L, and the working liquid L inside the two-phase change fluid tank 31 can absorb heat energy from the liquid state and evaporate into a gas state, so that the working liquid L can effectively dissipate heat to the two heat sources H; the gaseous working liquid L can evaporate upward, and then pass through the two hollow parts 121 to contact the two condensation units 13, and after transferring heat energy to the two condensation units 13, it condenses back to the liquid state and drips downward into the circulation layer 2 or the inside of the two-phase change fluid tank 31, thereby achieving the effect of providing good heat dissipation efficiency. It is particularly noted that when the number of the phase-change fluid slots 31 is three or more than four, the upper port 4a of the extension cover 4 is not lower than the heat source H corresponding to the phase-change fluid slot 31 located at the highest point.

Please refer to FIG. 9, which is a fourth embodiment of the liquid cooling system of the present invention. The fourth embodiment is substantially the same as the third embodiment. In the fourth embodiment, the liquid cooling system may further include a guide member 5, the guide member 5 is located below the slot cover 12, and the guide member 5 may preferably be tilted. The guide member 5 is formed by the inner wall of the slot body 11 to tilt downward toward the electrical unit E. The lower part of the guide member 5 may be connected to the electrical unit E. The guide member 5 may It is an inclined plate or a funnel. In this embodiment, the guide member 5 can be an inclined plate. In this way, the working liquid L condensed back to liquid state can drip downward on the guide member 5. The guide member 5 can guide the working liquid L condensed back to liquid state to flow to the electrical unit E, so that the working liquid L condensed back to liquid state can flush and spray the several electronic components E1 on the electrical unit E, thereby cooling the several electronic components E1, which has the effect of increasing the heat dissipation efficiency.

In summary, in the liquid cooling system of the present invention, the accommodation space only needs to be filled with a small amount of working liquid to form the circulation layer, and the working liquid in the circulation layer is driven by the pump to enter the interior of the phase change fluid tank. The working liquid in the phase change fluid tank can absorb heat energy from the liquid state and evaporate into a gaseous state. The gaseous working liquid can evaporate upward through the evaporation port, then condense back into a liquid state and drip downward into the circulation layer or the interior of the phase change fluid tank, thereby allowing the working liquid to absorb the heat energy of the heat source, thereby reducing the amount of the working liquid used, and having the effect of reducing the cost of use.

Although the present invention has been disclosed using the above preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art can make various changes and modifications to the above embodiments within the spirit and scope of the present invention. These changes and modifications are still within the technical scope protected by the present invention. Therefore, the protection scope of the present invention includes all changes within the meaning and equivalent scope recorded in the attached patent application scope. In addition, when the above several embodiments can be combined, the present invention includes any combination of implementations.

1: Sealing groove

11: Slot body

111: Open your mouth

12: Slot cover

121: Lukongbu

13: Condensation unit

2: Loop layer

3: Cooling module

31: Phase change fluid tank

31a: Heat source connection surface

32: Pump

32a: Liquid inlet

32b: Liquid outlet

33: Liquid inlet pipe

34: Liquid outlet pipe

B1: Carrier board

E:Electrical unit

H: Heat source

L: Working fluid

S: Storage space

Q: Evaporation outlet

Claims (8)

A liquid cooling system comprises: a sealed tank having a containing space, the sealed tank having a tank cover combined with a tank body, at least one condensing unit of the sealed tank combined with the outer surface of the tank cover, the tank cover having at least one basket empty portion connected to the containing space, the at least one condensing unit covering the basket empty portion; a circulation layer formed by a working liquid filled in the containing space; and A cooling module is located in the accommodation space. The cooling module has a phase change fluid tank and a pump. The phase change fluid tank is used to thermally connect to a heat source. The phase change fluid tank does not contact the circulation layer. The phase change fluid tank has an evaporation port connected to the accommodation space. A liquid inlet of the pump is connected to the circulation layer. A liquid outlet of the pump is connected to the interior of the phase change fluid tank. A liquid cooling system as claimed in claim 1, wherein the evaporation port is aligned with the condensing unit. As in claim 1, the liquid cooling system, wherein the cooling module has a liquid inlet pipe, and the liquid inlet pipe connects the liquid inlet and the circulation layer. As in claim 1, the liquid cooling system, wherein the number of the phase change fluid tank and the pump is plural, and the liquid outlet of each pump is connected to the interior of each phase change fluid tank. The liquid cooling system of claim 1 further comprises at least one electrical unit having at least one heat source, the heat source being connected to a heat source surface located in the phase change fluid tank. The liquid cooling system of claim 5 further includes a guide member, which is located under a slot cover of the sealing slot and guides the working liquid condensed back into liquid state to flow to the electrical unit. As in claim 5, the liquid cooling system, wherein the sealing tank has a tank cover combined with a tank body, and the electrical unit is connected to a carrier board in the tank body. As in claim 5, the liquid cooling system, wherein the sealing tank has a tank cover combined with a tank body, the number of the electrical units is several, and the several electrical units are respectively connected to a series connection plate in the tank body.