TWI841614B - Multilayer body, conduction inspection method, and method for manufacturing electronic device - Google Patents

Abstract

The present invention provides a laminated body, which has a glass support substrate and a polyimide resin substrate disposed on the support substrate, wherein the polyimide resin substrate has a first main surface on the support substrate side, a second main surface on the opposite side to the first main surface, and an end surface connected to the first main surface and the second main surface, and at least a portion of the end surface is an inclined surface protruding from the second main surface toward the first main surface. By using the laminated body of the present invention, the conduction inspection of the components for electronic devices formed on the polyimide resin substrate can be performed with high precision.

Description

Multilayer body, conduction inspection method, and method for manufacturing electronic device

The present invention relates to a multilayer body, a conduction inspection method, and a manufacturing method of an electronic device.

The following electronic devices are being made thinner and lighter: solar cells (PV); liquid crystal panels (LCD); organic EL panels (OLED, Organic Light-Emitting Diode ) ; receiving sensor panels that sense electromagnetic waves, X-rays, ultraviolet rays, visible rays, infrared rays, etc. Along with this, the thinning of substrates such as polyimide resin substrates used in electronic devices is also being made. If the strength of the substrate is insufficient due to the thinning, the handling of the substrate is reduced, and there is a situation where problems arise in the step of forming components for electronic devices on the substrate (component formation step).

Therefore, in order to improve the handling properties of the substrate, a technology for using a laminate having a polyimide resin substrate disposed on a supporting substrate has recently been proposed (Patent Document 1). In this technology, a component for an electronic device is formed on the polyimide resin substrate of the laminate, and then the polyimide resin substrate on which the component for an electronic device is formed (i.e., the electronic device) is separated. [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2015-104843

[The problem the invention is trying to solve]

The inventors of the present invention conducted a continuity test to confirm whether the components for the electronic device are operating normally during the process of manufacturing an electronic device using a laminate having a polyimide resin substrate disposed on a supporting substrate. More specifically, the wiring extending from the components for the electronic device on the polyimide resin substrate to the outside formed by sputtering was subjected to a continuity test using a tester. As a result, the inventors of the present invention found that the wiring formed by sputtering is easily thinned or broken at the end surface of the polyimide resin substrate, and thus the continuity test cannot be performed correctly and the accuracy is insufficient.

Therefore, the object of the present invention is to provide a multilayer body that can perform a high-precision conductivity inspection of a component for an electronic device formed on a polyimide resin substrate. Furthermore, another object of the present invention is to provide a conductivity inspection method and a method for manufacturing an electronic device using the multilayer body. [Technical means for solving the problem]

After careful research, the inventors found that the above object can be achieved by the following structure.

[1] A laminate comprising a glass support substrate and a polyimide resin substrate disposed on the support substrate, the polyimide resin substrate having a first main surface on the support substrate side, a second main surface on the opposite side to the first main surface, and an end surface connected to the first main surface and the second main surface, at least a portion of the end surface being an inclined surface protruding from the second main surface toward the first main surface. [2] A laminate as described in [1] above, wherein the angle between the inclined surface and the first main surface is 10° or more. [3] A laminate as described in [1] or [2] above, wherein the thickness of the support substrate is 0.3 mm or more. [4] A laminate as described in any one of [1] to [3] above, wherein a silicone resin layer is further provided between the supporting substrate and the polyimide resin substrate. [5] A conduction inspection method comprising the following steps: forming an electronic device component on the second main surface of the polyimide resin substrate of the laminate as described in any one of [1] to [4] above; forming wiring extending from the electronic device component to the outside by sputtering or evaporation; and connecting the wiring to a tester to perform a conduction inspection on the electronic device component; the wiring extends from the electronic device component and is formed along the second main surface of the polyimide resin substrate, the inclined surface of the polyimide resin substrate, and the surface of the supporting substrate. [6] A method for manufacturing an electronic device, comprising: a component forming step of forming an electronic device component on the second main surface of the polyimide resin substrate of the laminate described in any one of [1] to [4] to obtain a laminate with the electronic device component attached; and a separation step of obtaining an electronic device having the polyimide resin substrate and the electronic device component from the laminate with the electronic device component attached. [Effect of the invention]

According to the present invention, a multilayer body can be provided, which can perform a high-precision conduction inspection of a component for an electronic device formed on a polyimide resin substrate. Furthermore, according to the present invention, a conduction inspection method and an electronic device manufacturing method using the multilayer body can also be provided.

Hereinafter, the embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various changes and substitutions may be made to the following embodiments without departing from the scope of the present invention.

<Laminar body> (First embodiment) Figure 1 is a schematic cross-sectional view of a laminate 10 of the first embodiment. The laminate 10 of the first embodiment includes a glass support substrate 12 and a polyimide resin substrate 16 (hereinafter, sometimes simply described as "substrate 16") disposed on the support substrate 12. The substrate 16 has a first main surface 16a on the side of the support substrate 12, a second main surface 16b on the opposite side of the first main surface 16a, and an end surface 16c connected to the first main surface 16a and the second main surface 16b. At least a portion of the end surface 16c of the substrate 16 is an inclined surface 16d protruding from the second main surface 16b toward the first main surface 16a. In the laminate 10 of the first embodiment, the first main surface 16a of the substrate 16 is in contact with the support substrate 12. The support substrate 12 functions as a reinforcing plate for reinforcing the substrate 16. If a stress in a direction of peeling the support substrate 12 and the substrate 16 is applied to the laminate 10 of the first embodiment, the support substrate 12 and the substrate 16 are separated.

As will be described in detail later, the electronic device component is formed on the second main surface 16b of the substrate 16 of the multilayer body 10, and then the substrate 16 (i.e., the electronic device) on which the electronic device component is formed is separated. In this way, the electronic device is manufactured. During the process of manufacturing the electronic device, a conduction test is performed to confirm whether the electronic device component is operating normally.

FIG2 is a cross-sectional view showing an example of a conduction test. First, an electronic device component 20 is formed on the second main surface 16b of the substrate 16. Then, a wiring 40 extending from the electronic device component 20 to the outside is formed by sputtering, CVD (chemical vapor deposition) or other evaporation methods (hereinafter, all of which are collectively referred to as "sputtering, etc."). Sputtering, etc. is preferably sputtering or evaporation. The wiring 40 includes, for example, a conductive metal. In more detail, the wiring 40 extends from the electronic device component 20 as shown in FIG2, and is formed along the second main surface 16b of the substrate 16, the inclined surface 16d, and the surface of the supporting substrate 12. The wiring 40 is connected to a tester (not shown) to perform a continuity test on the electronic device component 20.

However, there is a case where the end face 16c of the substrate 16 is a non-inclined vertical surface, and the wiring 40 is formed along the vertical surface by sputtering or the like. FIG. 3 is a cross-sectional view showing another example of a conduction inspection. As shown in FIG. 3 , there is a case where the wiring 40 is formed along the end face 16c that is a vertical surface by sputtering or the like. In this case, as shown in FIG. 3 , the wiring 40 is difficult to adhere to the end face 16c that is a vertical surface, and the wiring 40 is prone to partially thinning or breaking. In a state where the wiring 40 is partially thinned or broken, there is a case where the conduction inspection of the component 20 for electronic devices cannot be performed correctly, and the accuracy is insufficient.

However, as described based on Fig. 2, in the first embodiment, the wiring 40 is formed along the inclined surface 16d which is not a vertical surface, so it is not easy to be partially thinned or disconnected. Therefore, the continuity inspection of the electronic device component 20 can be performed accurately with good accuracy.

When the shape of the substrate 16 (the shape of the main surface) is rectangular, it is preferred that all four end surfaces 16c are inclined surfaces 16d. Thus, regardless of which inclined surface 16d is used to form the wiring 40, the accuracy of the continuity test is good.

(Second embodiment) Figure 4 is a schematic cross-sectional view of the laminate 10 of the second embodiment. The same symbols are used to represent the same parts as the first embodiment, and the description is omitted (the same below). The laminate 10 of the second embodiment has a supporting substrate 12, a silicone resin layer 14, and a substrate 16 in sequence. In other words, the laminate 10 of the second embodiment further has a silicone resin layer 14 between the supporting substrate 12 and the substrate 16. One surface (the first main surface 14a) of the silicone resin layer 14 is in contact with the supporting substrate 12, and the other surface (the second main surface 14b) is in contact with the first main surface 16a of the substrate 16.

Hereinafter, when the laminated body 10 having the silicone resin layer 14 is mentioned, it refers to the laminated body 10 of the second embodiment unless otherwise specified.

In the laminate 10 of the second embodiment, at least a portion of the end face 16c of the substrate 16 is also along the inclined surface 16d protruding from the second main surface 16b toward the first main surface 16a. As shown in FIG. 4, when the end face of the silicone resin layer 14 is an end face continuous with the inclined surface 16d of the substrate 16, it is also preferably an inclined surface 14d inclined in the same manner as the inclined surface 16d. In the second embodiment, the wiring 40 is also formed along the inclined surface 16d which is not a vertical surface, so it is not easy to partially become thin or disconnected. Therefore, the conduction inspection of the component 20 for electronic devices can be performed correctly with good accuracy.

In the laminate 10 of the second embodiment, the two-layer portion including the support substrate 12 and the silicone resin layer 14 (hereinafter also referred to as the "support substrate 18 with silicone resin layer") functions as a reinforcing plate of the reinforcing substrate 16.

It is preferable to heat-treat the laminate 10 so that the peel strength between the support substrate 12 and the silicone resin layer 14 is greater than the peel strength between the silicone resin layer 14 and the substrate 16. This is because the hydroxyl groups of the support substrate 12 and the hydroxyl groups of the silicone resin layer 14 are bonded by the heat treatment. As a result, if stress is applied in a direction to peel the support substrate 12 and the substrate 16, peeling occurs between the silicone resin layer 14 and the substrate 16.

(Angle of inclined surface) Figure 5 is an enlarged cross-sectional view showing the end of the polyimide resin substrate 16. In the substrate 16, since the inclined surface 16d is not a vertical surface, the angle θ1 formed by the inclined surface 16d and the first main surface 16a is certainly not 90°.

On the other hand, if the angle θ1 of the inclined surface 16d is too sharp, it may be difficult to insert a sharp knife-like object between the supporting substrate 12 and the substrate 16 (between the silicone resin layer 14 and the substrate 16 when the substrate 16 is separated from the supporting substrate 12 (when the substrate 16 is separated from the silicone resin layer 14 when the substrate 16 has a silicone resin layer 14). Therefore, in order to facilitate the insertion of a sharp knife-shaped object between the supporting substrate 12 and the substrate 16 (between the silicone resin layer 14 and the substrate 16 when the silicone resin layer 14 is provided), and to achieve excellent peeling performance, the angle θ1 formed by the inclined surface 16d and the first main surface 16a is preferably 10° or more, more preferably 30° or more, and further preferably 50° or more. Furthermore, it is preferred that the inclined surface 16d of the substrate 16 is a cut surface formed by cutting the substrate 16 using a knife. In this case, it is easier to obtain the above angle than, for example, a surface formed by diffusion of the coating liquid on a flat surface.

The angle θ1 formed by the inclined surface 16d and the first main surface 16a in the substrate 16 is obtained using the non-contact surface property measuring device "PF-60" manufactured by Mitaka Lighting Equipment Co., Ltd. and based on the cross-sectional shape of the substrate 16. More specifically, as shown in FIG5 , based on the cross-sectional view of the substrate 16, the length of the line segment AB and the length of the line segment AC are measured, and the angle θ1 is calculated according to the following formula. θ1 = arctan (AC/AB)

Furthermore, as shown in FIG5 , it is preferred that the inclined surface 14d of the silicone resin layer 14 is continuous with the inclined surface 16d of the substrate 16. At this time, it is preferred that the angle θ2 formed by the inclined surface 14d and the first main surface 14a in the silicone resin layer 14 is the same as the angle θ1 formed by the inclined surface 16d and the first main surface 16a. The method for measuring the angle θ2 is the same as that for the angle θ1.

Hereinafter, each layer constituting the laminate 10 (support substrate 12, base plate 16, silicone resin layer 14) will be described in detail first, and then a method for manufacturing the laminate 10 will be described in detail.

<Supporting substrate> The supporting substrate 12 is a member that supports the reinforcing substrate 16, such as a glass plate. Since the supporting substrate 12 is made of glass, it has a hydroxyl group on the surface. The type of glass is not particularly limited, and preferably alkali-free borosilicate glass, borosilicate glass, sodium calcium glass, high silica glass, and other oxide-based glasses with silicon oxide as the main component. As oxide-based glass, preferably, the content of silicon oxide converted to oxide is 40 to 90 mass%. As a glass plate, more specifically, a glass plate containing alkali-free borosilicate glass (manufactured by AGC Co., Ltd., trade name "AN100") can be cited. The manufacturing method of the glass plate is not particularly limited, and it can usually be obtained by melting glass raw materials and forming the molten glass into a plate shape. Such forming method may be a common method, for example, a floating method, a melting method, a flow hole down-drawing method, etc.

The thickness of the support substrate 12 may be thicker or thinner than the substrate 16. In terms of the operability of the laminate 10, it is preferred that the thickness of the support substrate 12 is thicker than the substrate 16. It is preferred that the support substrate 12 has no flexibility. Therefore, the thickness of the support substrate 12 is preferably greater than 0.3 mm, and more preferably greater than 0.5 mm. On the other hand, the thickness of the support substrate 12 is preferably less than 1.0 mm.

<Substrate (Polyimide resin substrate)> Substrate 16 is a polyimide resin substrate. The polyimide resin substrate is a substrate comprising a polyimide resin, for example, a polyimide film is used, and commercially available products thereof include: "XENOMAX" manufactured by Toyobo Co., Ltd., "UPILEX 25S" manufactured by Ube Industries, Ltd., etc. In order to form high-precision wiring of electronic devices on the polyimide resin substrate, it is preferred that the surface of the polyimide resin substrate is smooth. More specifically, the surface roughness Ra of the polyimide resin substrate is preferably less than 50 nm, more preferably less than 30 nm, and further preferably less than 10 nm. The thickness of the polyimide resin substrate is preferably 1 μm or more, more preferably 5 μm or more, and further preferably 10 μm or more from the viewpoint of handling in the manufacturing step. From the viewpoint of flexibility, it is preferably 1 mm or less, and more preferably 0.2 mm or less. The smaller the difference in thermal expansion coefficient between the polyimide resin substrate and the electronic device or the supporting substrate, the better it is in order to suppress the warping of the laminate after heating or cooling. More specifically, the difference in thermal expansion coefficient between the polyimide resin substrate and the supporting substrate is preferably 0 to 90×10 ^-6 /°C, and more preferably 0 to 30×10 ^-6 /°C.

The area of the substrate 16 (the area of the first main surface 16a and the second main surface 16b) is not particularly limited. In terms of the productivity of the electronic device, it is preferably 300 ^cm2 or more. The shape of the substrate 16 is also not particularly limited. It can be rectangular or circular. An orientation flat (so-called ORIENTATION FLAT. A flat portion formed on the outer periphery of the substrate) or a notch (one or more V-shaped notches formed on the outer periphery of the substrate) may also be formed on the substrate 16.

However, as described above, at least a portion of the end surface 16c of the substrate 16 is an inclined surface 16d protruding from the second main surface 16b toward the first main surface 16a. Preferably, the entire end surface 16c is an inclined surface 16d. In the substrate 16, the angle between the inclined surface 16d and the first main surface 16a is also as described above.

<Silicone resin layer> The silicone resin layer 14 mainly includes silicone resin. The structure of the silicone resin is not particularly limited. Generally, the silicone resin can be obtained by curing (cross-linking) a curable silicone that can be converted into a silicone resin by a curing treatment. Curing silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet curing type silicones, and electron beam curing silicones according to their curing mechanisms, and all of them can be used. The weight average molecular weight (Mw) of the curable silicone is preferably 5,000 to 60,000, and more preferably 5,000 to 30,000.

As a method for manufacturing the silicone resin layer 14, it is preferred to apply a curable composition containing a curable silicone that becomes the above-mentioned silicone resin on the first main surface 16a of the substrate 16, remove the solvent as needed to form a coating, and cure the curable silicone in the coating to form the silicone resin layer 14. The curable composition may contain a solvent, a platinum catalyst (when an addition reaction type silicone is used as the curable silicone), a leveling agent, a metal compound, etc. in addition to the curable silicone. As metal elements containing metal compounds, 3d transition metals, 4d transition metals, iodine metals, bismuth (Bi), aluminum (Al), and tin (Sn) may be listed. The content of the metal compound is not particularly limited and can be appropriately adjusted.

The silicone resin layer 14 preferably has a hydroxyl group. A portion of the Si-O-Si bonds of the silicone resin constituting the silicone resin layer 14 is cut to produce a hydroxyl group. In addition, when a condensation reaction type silicone is used, the hydroxyl group thereof can become a hydroxyl group of the silicone resin layer 14.

The thickness of the silicone resin layer 14 is preferably 100 μm or less, more preferably 50 μm or less, and further preferably 30 μm or less. On the other hand, the thickness of the silicone resin layer 14 is preferably more than 1 μm, more preferably 4 μm or more. The above thickness is obtained by measuring the thickness of the silicone resin layer 14 at any position of more than 5 points using a contact film thickness measuring device and arithmetically averaging the thickness.

Furthermore, as described above, when the end surface of the silicone resin layer 14 is an end surface continuous with the inclined surface 16d of the substrate 16, it is also preferably an inclined surface inclined in the same manner as the inclined surface 16d.

<Method for manufacturing the laminated body of the first embodiment> The method for manufacturing the laminated body 10 of the first embodiment is preferably a method of laminating the substrate 16 on the surface of the supporting substrate 12. In this case, for example, after laminating the substrate 16 on the supporting substrate 12, the end of the substrate 16 on the supporting substrate 12 is cut obliquely (cut with an inclined blade) to form an inclined surface 16d of the substrate 16 (pattern A). In the case of pattern A, since the substrate 16 is cut while being fixed to the supporting substrate 12, good dimensional accuracy is easily obtained. In addition, the inclined surface 16d may be formed on the substrate 16 in advance, and the substrate 16 with the inclined surface 16d formed thereon may be laminated on the surface of the supporting substrate 12 (pattern B). In the case of the embodiment B, since there is no need to set up a step for processing the edge materials (waste materials) of the substrate 16 after cutting, it is not easy to be restricted by time. In addition, whether it is embodiment A or embodiment B, before the substrate 16 is layered on the supporting substrate 12, a known silane coupling agent can be applied on the surface of the supporting substrate 12, and then the substrate 16 is layered on the surface of the supporting substrate 12 coated with the silane coupling agent.

<Method for manufacturing laminated body of the second embodiment> The method for manufacturing laminated body 10 of the second embodiment is preferably a method for forming silicone resin layer 14 on the first main surface 16a of substrate 16. Specifically, it is preferred to apply a curable composition containing curable silicone on the first main surface 16a of substrate 16, perform a curing treatment on the obtained coating to obtain silicone resin layer 14, and then laminate support substrate 12 on the surface of silicone resin layer 14 to manufacture laminated body 10.

In more detail, the method for manufacturing the laminate 10 of the second embodiment at least comprises: forming a layer of curable silicone on the first main surface 16a of the substrate 16, forming a silicone resin layer 14 on the first main surface 16a of the substrate 16 (resin layer forming step); and laminating the support substrate 12 on the surface of the silicone resin layer 14 to obtain the laminate 10 (lamination step). The order of the above steps is described in detail below.

(Resin layer forming step) The resin layer forming step is a step of forming a layer of curable silicone on the first main surface 16a of the substrate 16 and forming a silicone resin layer 14 on the first main surface 16a of the substrate 16. According to this step, a substrate with a silicone resin layer having a substrate 16 and a silicone resin layer 14 in sequence can be obtained. The substrate with a silicone resin layer can be manufactured by a so-called roll-to-roll method in which the silicone resin layer 14 is formed on the first main surface 16a of the substrate 16 rolled into a roll and then rolled into a roll again, and the production efficiency is excellent. In this step, in order to form a layer of curable silicone on the first main surface 16a of the substrate 16, the curable composition is applied to the first main surface 16a of the substrate 16. Then, it is preferred to form a hardened layer by hardening the layer of curable silicone. The method of applying the curable composition to the first main surface 16a of the substrate 16 is not particularly limited, and known methods can be listed. For example, spray coating, die coating, rotary coating, immersion coating, roller coating, rod coating, screen printing, and gravure coating can be listed. Next, the curable silicone in the first main surface 16a of the substrate 16 is cured to form a curing layer (silicone resin layer 14). The curing method is not particularly limited, and the most appropriate treatment is implemented according to the type of curable silicone used. For example, when using condensation reaction type silicone and addition reaction type silicone, the curing treatment is preferably a thermal curing treatment. The conditions of the thermal curing treatment are implemented within the range of the heat resistance of the substrate 16. For example, the temperature conditions of the thermal curing are preferably 50 to 400°C, and more preferably 100 to 300°C. The heating time is generally preferably 10 to 300 minutes, and more preferably 20 to 120 minutes. The state of the formed silicone resin layer 14 is as described above.

(Lamination step) The lamination step is a step of obtaining a laminate 10 by laminating a supporting substrate 12 on the surface of a silicone resin layer 14. The lamination step is a step of forming a laminate 10 using a silicone resin layer-attached substrate and a supporting substrate 12. The method of laminating the supporting substrate 12 on the surface of the silicone resin layer 14 is not particularly limited, and a known method can be cited. For example, a method of laminating the supporting substrate 12 on the surface of the silicone resin layer 14 under normal pressure can be cited. If necessary, after the support substrate 12 is overlapped on the surface of the silicone resin layer 14, the support substrate 12 can also be pressed onto the silicone resin layer 14 using a roller or a press. Pressing with a roller or a press is more preferred because it is easier to remove bubbles mixed between the silicone resin layer 14 and the support substrate 12. If the pressing is performed by vacuum lamination or vacuum pressurization, the mixing of bubbles can be suppressed and good close contact can be achieved, so it is preferred. Pressing under vacuum has the advantage that even if there are tiny bubbles left, the bubbles are not easy to grow due to heat treatment. When laminating the support substrate 12, it is preferred to thoroughly clean the surface of the support substrate 12 in contact with the silicone resin layer 14 and perform the lamination in a highly clean environment.

(Cutting) When manufacturing the laminate 10 of the second embodiment, for example, after laminating the substrate 16 on which the silicone resin layer 14 is formed and the supporting substrate 12, the ends of the substrate 16 and the silicone resin layer 14 on the supporting substrate 12 are cut obliquely (cut with an inclined blade) to form the inclined surface 16d of the substrate 16 and the inclined surface 14d of the silicone resin layer 14. In this case, since the substrate 16 and the silicone resin layer 14 are cut while being fixed to the supporting substrate 12, good dimensional accuracy can be easily obtained. In addition, for the substrate 16 formed with the silicone resin layer 14, the inclined surface 16d of the substrate 16 and the inclined surface 14d of the silicone resin layer 14 may be formed in advance and laminated on the supporting base 12. In this case, since there is no need to set up a step for processing the scrap material (waste material) of the substrate 16 and the silicone resin layer 14 after cutting, it is not easy to be restricted by time.

<Application of the laminate> The laminate 10 can be used for various applications, such as the manufacture of electronic components such as display panels, PV, thin-film secondary batteries, semiconductor wafers with circuits formed on the surface, and receiving sensor panels described later. In these applications, the laminate is exposed to high temperature conditions (e.g., 450°C or above) in the atmosphere (e.g., for more than 20 minutes). Panels for display devices include LCD, OLED, electronic paper, plasma display panels, field emission panels, quantum dot LED (Light Emitting Diode) panels, micro LED display panels, MEMS (Micro Electro Mechanical Systems) shutter panels, etc. The receiving sensor panel includes an electromagnetic wave receiving sensor panel, an X-ray receiving sensor panel, an ultraviolet light receiving sensor panel, a visible light receiving sensor panel, an infrared light receiving sensor panel, etc. The substrate used for the receiving sensor panel can also be reinforced by a reinforcing sheet such as resin.

<Method for manufacturing electronic device> Using the laminate 10, an electronic device including a substrate 16 and an electronic device component 20 is manufactured. The method for manufacturing the electronic device is a method comprising, for example, the following steps: a component forming step, in which the electronic device component 20 is formed on the second main surface 16b of the substrate 16 of the laminate 10 to obtain a laminate with the electronic device component attached; and a separation step, in which an electronic device having the substrate 16 and the electronic device component 20 is obtained from the laminate with the electronic device component attached.

Hereinafter, a more detailed description will be given by taking the case of using the multilayer body 10 of the second embodiment as an example, but the same is true for the case of using the multilayer body 10 of the first embodiment.

The manufacturing method of the electronic device is preferably a method of forming an electronic device component 20 on a substrate 16 of a laminate 10 to obtain a laminate 22 with an electronic device component, and then separating the obtained laminate 22 with an electronic device component into an electronic device (substrate 24 with component attached) and a supporting substrate 18 with a silicone resin layer attached, using the interface between the silicone resin layer 14 and the substrate 16 as a peeling surface. The step of forming the electronic device component 20 is referred to as a "component forming step", and the step of separating into the substrate 24 with component attached and the supporting substrate 18 with a silicone resin layer is referred to as a "separation step".

The continuity test can also be performed on the electronic device component 20 on the substrate 16 during or after the component forming step. Since the wiring 40 for the continuity test is formed along the inclined surface 16d (see FIG. 2), the accuracy of the continuity test is good.

The following is a detailed description of the materials and sequence used in each step.

(Component forming step) The component forming step is a step of forming an electronic device component on the substrate 16 of the laminate 10. More specifically, as shown in FIG6 , an electronic device component 20 is formed on the second main surface 16b (exposed surface) of the substrate 16 to obtain a laminate 22 with an electronic device component. First, the electronic device component 20 used in this step is described in detail, and then the order of the steps is described in detail.

(Component for electronic device) The component for electronic device 20 is a component formed on the substrate 16 in the multilayer body 10 and constituting at least a part of the electronic device. More specifically, as a component 20 for electronic devices, there can be listed components used for display device panels, solar batteries, thin-film secondary batteries, or electronic components such as semiconductor wafers with circuits formed on the surface, receiving sensor panels, etc. (for example, LTPS (Low Temperature Poly-Silicon) components for display devices, components for solar batteries, components for thin-film secondary batteries, circuits for electronic components, components for receiving sensors), for example, the solar battery component described in paragraph [0192] of the specification of U.S. Patent Application Publication No. 2018/0178492, the thin-film secondary battery component described in the same paragraph [0193], and the electronic component circuit described in the same paragraph [0194] can be listed.

(Sequence of steps) The manufacturing method of the laminate 22 with components for electronic devices is not particularly limited. The electronic device component 20 is formed on the second main surface 16b of the substrate 16 of the laminate 10 by a previously known method according to the type of components constituting the electronic device component. The electronic device component 20 is not all of the components finally formed on the second main surface 16b of the substrate 16 (hereinafter referred to as "all components"), but may be a part of all components (hereinafter referred to as "partial components"). The substrate with partial components peeled off from the silicone resin layer 14 may also be used as the substrate with all components in the subsequent steps (equivalent to the electronic device described later). Other components for electronic devices can also be formed on the peeled surface (first main surface 16a) of the substrate with all components peeled off from the silicone resin layer 14. Furthermore, two laminates with all components can be used and assembled, and then two silicone resin layer-attached supporting substrates 18 can be peeled off from the laminate with all components, thereby manufacturing two substrates with components 24.

For example, in the case of manufacturing OLED, in order to form an organic EL structure on the surface (second main surface 16b) on the opposite side of the silicone resin layer 14 of the substrate 16 of the laminate 10, the following various layer formations or processes are performed: forming a transparent electrode, and then evaporating a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, etc. on the surface formed with the transparent electrode, forming a back electrode, and sealing with a sealing plate, etc. As such layer formations or processes, specifically, for example, film formation processing, evaporation processing, and sealing plate bonding processing can be listed.

(Separation step) As shown in FIG. 7, the separation step is a step of separating the laminated body 22 with the component attached to the electronic device obtained in the component forming step into the substrate 16 (substrate 24 with the component attached) with the component 20 for the electronic device laminated thereon and the supporting substrate 18 with the silicone resin layer attached thereon, using the interface between the silicone resin layer 14 and the substrate 16 as a peeling surface, to obtain the substrate 24 (electronic device) with the component attached thereto including the component 20 for the electronic device and the substrate 16.

In the case where the electronic device component 20 on the peeled substrate 16 is part of the formation of all necessary components, the remaining components may also be formed on the substrate 16 after separation.

There is no particular limitation on the method of peeling the substrate 16 from the silicone resin layer 14. For example, a sharp knife-shaped object is inserted into the interface between the substrate 16 and the silicone resin layer 14 to provide an opportunity for peeling, and then a mixed fluid of water and compressed air is blown to achieve peeling. It is preferred to place the laminate 22 with the electronic device component on a press plate in such a manner that the supporting substrate 12 is the upper side and the electronic device component 20 side is the lower side, and vacuum adsorb the electronic device component 20 side on the press plate. In this state, the knife-shaped object is firstly allowed to enter the interface between the substrate 16 and the silicone resin layer 14. Afterwards, the support substrate 12 is adsorbed by a plurality of vacuum adsorption pads, and the vacuum adsorption pads are sequentially raised from the vicinity of the position where the knife-shaped object is inserted. In this way, the support substrate 18 with the silicone resin layer attached can be easily peeled off.

When separating the substrate 24 of the attached component from the laminate 22 of the attached electronic device component, the electrostatic adsorption of the fragments of the silicone resin layer 14 to the substrate 24 of the attached component can be further suppressed by controlling the blowing or humidity using an ionizer. The manufacturing method of the above-mentioned electronic device (substrate 24 of the attached component) is suitable for the manufacture of the display device described in paragraph [0210] of the specification of U.S. Patent Application Publication No. 2018/0178492, and the substrate 24 of the attached component can be listed, for example, in the substrate of the attached component described in the same paragraph [0211]. [Example]

The present invention is specifically described below by way of examples, but the present invention is not limited to these examples.

A glass plate made of alkali-free borosilicate glass (linear expansion coefficient 38×10 ^-7 /°C, manufactured by AGC Co., Ltd., trade name "AN100") was used as a supporting substrate. The presence of hydroxyl groups (OH groups) was confirmed by microscopic infrared spectroscopy analysis of the surface of the glass plate before lamination. In addition, a polyimide film (manufactured by Toyobo Co., Ltd., trade name "XENOMAX") was used as a substrate (polyimide resin substrate). Examples 1 and 2 are implementation examples, and Example 3 is a comparative example.

<Example 1> (Preparation of hardening silicone 1) Hardening silicone 1 is obtained by mixing organic hydrogenated siloxane and alkenyl-containing siloxane. The composition of hardening silicone 1 is: the molar ratio of M unit, D unit, and T unit is 9:59:32, the molar ratio of methyl group and phenyl group of the organic group is 44:56, the molar ratio of all alkenyl groups to hydrogen atoms bonded to all silicon atoms (hydrogen atom/alkenyl group) is 0.7, and the average OX group number is 0.1. The average OX group number indicates the number of OX groups (X is a hydrogen atom or a alkyl group) bonded to one Si atom on average. In addition, the M unit refers to a monofunctional organic silaneoxy unit represented by (R) ₃ SiO _1/2 . The D unit refers to a bifunctional organic siloxy unit represented by (R) ₂ SiO _2/2 (R represents a hydrogen atom or an organic group). The T unit refers to a trifunctional organic siloxy unit represented by RSiO _3/2 (R represents a hydrogen atom or an organic group). The ratio of the number (molar amount) of the M unit, the D unit, and the T unit is calculated based on the value of the peak area ratio obtained by ²⁹ Si-NMR.

(Preparation of curable composition 1) Platum (0)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane (CAS No. 68478-92-2) was added to curable silicone 1 so that the content of platinum element became 60 ppm, and mixture A was obtained. Mixture A (200 g), bismuth 2-ethylhexanoate ("PUCAT 25", manufactured by Nippon Chemical Industry Co., Ltd., metal content 25%) (0.08 g) and diethylene glycol diethyl ether ("Hisolve EDE", manufactured by Toho Chemical Industry Co., Ltd.) (84.7 g) as a solvent were mixed, and the obtained mixed solution was filtered using a filter with a pore size of 0.45 μm to obtain curable composition 1.

(Production of laminated body) The prepared curable composition 1 was applied to a polyimide film (manufactured by Toyobo Co., Ltd., trade name "XENOMAX") with a thickness of 0.038 mm as a polyimide resin substrate, and heated at 140°C for 10 minutes using a heating plate to form a silicone resin layer. The thickness of the silicone resin layer was 10 μm. Next, after cleaning with a water-based glass cleaner (manufactured by Parker Corporation, "PK-LGC213"), a 200×200 mm, 0.5 mm thick glass plate "AN100" (support substrate) washed with deionized water was placed on the silicone resin layer and bonded using a bonding device to produce a laminated body. Furthermore, the presence of hydroxyl groups (OH groups) in the cured silicone resin layer was confirmed by micro-IR spectroscopy analysis.

(Formation of inclined surface) In the manufactured laminate, the ends of the polyimide resin substrate and the silicone resin layer on the supporting substrate (glass plate) are cut obliquely by a tilting cutter to form an inclined surface. The inclined surface of the polyimide resin substrate and the inclined surface of the silicone resin layer are continuous surfaces that are connected to each other. The angle θ1 formed by the inclined surface in the polyimide resin substrate and the first main surface, and the angle θ2 formed by the inclined surface in the silicone resin layer and the first main surface are both 10°.

<Example 2> The angle θ1 formed between the inclined surface in the polyimide resin substrate and the first main surface, and the angle θ2 formed between the inclined surface in the silicone resin layer and the first main surface are both set to 60°. Except for this, a laminate is produced in the same manner as in Example 1.

<Example 3> The angle θ1 formed between the inclined surface in the polyimide resin substrate and the first main surface, and the angle θ2 formed between the inclined surface in the silicone resin layer and the first main surface are both 90°. Except for this, a laminate is produced in the same manner as in Example 1.

＜Evaluation＞ The following evaluation was performed using the prepared multilayer body. The evaluation results are shown in Table 1 below.

(Conductivity test) In the manufactured laminate, a simulation test was conducted on the conductivity test of the components for electronic devices formed on the second main surface of the polyimide resin substrate. Specifically, 100 linear wirings (metal type: Al/Nd alloy, line width: 100 μm, thickness: 50 nm) were formed one by one in each laminate, continuously along the second main surface of the polyimide resin substrate, the inclined surface of the polyimide resin substrate (in Example 3, the end surface is not the inclined surface but the vertical surface), and the surface of the supporting substrate (glass plate). For each wiring, a conductivity test was performed using a commercially available tester. In the case where all wirings are confirmed to be conductive, "A" is recorded in the following Table 1, and in the case where even one wiring is not conductive, "B" is recorded in the following Table 1. If it is "A", it can be evaluated that the continuity test can be performed with high accuracy when a component for an electronic device is actually formed on the second main surface of the polyimide resin substrate, and wiring extending from the component for an electronic device is formed by sputtering or the like to perform a continuity test.

(Releasability) In the manufactured laminate, a stainless steel cutter with a thickness of 0.1 mm was inserted between the polyimide resin substrate and the supporting substrate (glass plate) 10 times. The position of the cutter insertion was made different in each time. In the case where the cutter entered between the polyimide resin substrate and the supporting substrate in all the times, "A" was recorded in the following Table 1, and in the case where the cutter did not enter between the polyimide resin substrate and the supporting substrate even once, "B" was recorded in the following Table 1. If it is "A", when the polyimide resin substrate is separated (stripped) from the supporting substrate, the cutter is easily inserted between the supporting substrate and the polyimide resin substrate, and the releasability can be evaluated as excellent.

[Table 1] Table 1 example 1 Example 2 Example 3 Angle θ1[°] 10 60 90 Angle θ2[°] 10 60 90 Continuity check A A B Separability B A A

<Summary of evaluation results> As shown in Table 1 above, the accuracy of the continuity test is good in Examples 1 and 2, but the accuracy of the continuity test is insufficient in Example 3.

If we compare Examples 1 and 2, the angle θ1 formed by the inclined surface in the polyimide resin substrate and the first main surface, and the angle θ2 formed by the inclined surface in the silicone resin layer and the first main surface are both 60° in Example 2, and the peeling property is better than that of Example 1, which has the same angle of 10°.

The present invention has been described in detail and with reference to specific embodiments, but it is clear to those skilled in the art that various modifications or changes can be made without departing from the scope and spirit of the present invention. This application is based on Japanese Patent Application No. 2018-204918 filed on October 31, 2018, the contents of which are incorporated herein by reference.

10: Laminated body 12: Support substrate 14: Silicone resin layer 14a: First main surface of silicone resin layer 14b: Second main surface of silicone resin layer 14d: Inclined surface of silicone resin layer 16: Substrate (polyimide resin substrate) 16a: First main surface of substrate 16b: Second main surface of substrate 16c: End surface of substrate 16d: Inclined surface of substrate 18: Support substrate with silicone resin layer 20: Component for electronic device 22: Laminated body with component for electronic device 24: Substrate with component (electronic device) 40: Wiring AB: Line segment AC: Line segment θ1: Angle θ2: Angle

FIG. 1 is a cross-sectional view schematically showing a laminate of the first embodiment. FIG. 2 is a cross-sectional view showing an example of a conduction test. FIG. 3 is a cross-sectional view showing another example of a conduction test. FIG. 4 is a cross-sectional view schematically showing a laminate of the second embodiment. FIG. 5 is a cross-sectional view showing an enlarged view of an end of a polyimide resin substrate. FIG. 6 is a cross-sectional view schematically showing a component forming step. FIG. 7 is a cross-sectional view schematically showing a separation step.

10: Layered body

12: Support substrate

16: Substrate (polyimide resin substrate)

16a: The first main surface of the substrate

16b: Second main surface of substrate

16d: Inclined surface of substrate

20: Components for electronic devices

40: Wiring

Claims (7)

A laminated body comprises a glass support substrate, a silicone resin layer disposed on the support substrate, and a polyimide resin substrate disposed on the silicone resin layer, wherein the silicone resin layer has a first main surface on the support substrate side, a second main surface on the polyimide resin substrate side, and an end surface connected to the first main surface and the second main surface, and the polyimide resin substrate has a first main surface on the silicone resin layer side and an end surface connected to the first main surface and the second main surface. The second main surface on the opposite side and the end surface connected to the first main surface and the second main surface, the end surface of the silicone resin layer and the end surface of the polyimide resin substrate form the same plane, and the end surface of the silicone resin layer and the end surface of the polyimide resin substrate forming the same plane are inclined surfaces protruding from the second main surface of the polyimide resin substrate toward the first main surface of the silicone resin layer. The laminated body of claim 1, wherein the angle between the inclined surface and the first main surface of the silicone resin layer is greater than 10°. For the laminate of claim 1 or 2, the thickness of the supporting substrate is greater than 0.3 mm. A multilayer body as claimed in claim 1 or 2, wherein the inclined surface of the substrate is a cut surface formed by cutting the substrate using a tool. For a multilayer body as claimed in claim 1 or 2, when the substrate is rectangular, all four end faces are inclined surfaces. A conduction inspection method comprising the following steps: forming an electronic device component on the second main surface of the polyimide resin substrate of the laminate as in any one of claims 1 to 5; forming wiring extending from the electronic device component to the outside by sputtering or evaporation; and connecting the wiring to a tester to perform a conduction inspection of the electronic device component; the wiring extends from the electronic device component and is formed along the second main surface of the polyimide resin substrate, the inclined surface of the polyimide resin substrate, the inclined surface of the silicone resin layer, and the surface of the supporting substrate. A method for manufacturing an electronic device comprises: a component forming step, in which a component for an electronic device is formed on the above-mentioned second main surface of the above-mentioned polyimide resin substrate of the laminate as any one of claims 1 to 5, to obtain a laminate with the component for an electronic device attached; and a separation step, in which an electronic device having the above-mentioned polyimide resin substrate and the above-mentioned component for an electronic device is obtained from the above-mentioned laminate with the component for an electronic device attached.