TWI840945B - Automatic replacement method for contact module of IC test sorting machine - Google Patents

Abstract

A contact module automatic replacement method for an IC test sorting machine is implemented in a control unit of the IC test sorting machine. The control unit executes an IC test mode and stores test data in a test database. The contact module automatic replacement method includes: reading the test database; judging whether the test data in the test database meets a preset condition; if so, stopping the IC test mode and executing a contact module automatic replacement mode to control a placement device to move a contact module out of a test connector base and place it in a waiting area, then obtain a good contact module from a spare area, move the good contact module into the test connector base, and return to execute the IC test mode; if not, directly return to execute the IC test mode.

Description

Automatic replacement method for contact module of IC test sorting machine

The present invention relates to a control method for an IC test sorting machine, and in particular to an automatic replacement method for a contact module used in an IC test sorting machine.

It is known that an integrated circuit (IC) test handler mainly uses a test connector (IC Test Socket) including a contact module (Contact Module) to provide a medium for signal transmission during the detection of an IC chip to be tested, wherein the test connector is arranged on a test load board (IC Test Load Board) of the test handler, and the contact module has a plurality of electrical connection points for respectively electrically connecting the IC chip to be tested and the test load board, and the contact module can be, for example, a card-type or sheet-type probe assembly, a wire-type conductive film or a gold powder-type conductive film, and the wire-type conductive film and the gold powder-type conductive film are elastic.

Furthermore, the IC test sorting machine has a placement device, which can move an IC chip to be tested from a test area to the test connector including the contact module, and then press down the IC chip to be tested so that the contacts at the bottom of the IC chip to be tested can actually correspond to the electrical connection contacts on the contact module, and the electrical connection contacts at the bottom of the contact module can also correspond to the contacts on the test carrier. In this way, the IC test sorting machine can make the IC chip to be tested transmit signals through the test connector including the contact module and the test carrier, and then perform a test operation on the IC chip to be tested.

The performance of the contact module may deteriorate after repeated or long-term use. For example, when the contact module uses a probe assembly, the probe tip may accumulate debris, wear, oxidized organic pollution, or even form eutectic metal on the tip; when the contact module uses a wire-type conductive film or a gold powder-type conductive film, the parts that are often pressed are also prone to accumulate debris, deformation, collapse, or eutectic metal on its electrical connection points, resulting in the contact points of the IC chip to be tested being unable to effectively connect to the corresponding contacts of the test load board (IC Test Load Board) through the electrical connection points of the contact module during the test. In this way, the deteriorated contact module will inevitably affect the accuracy of the test results of the IC chip to be tested.

The current immediate improvement measures on the production line are to clean the electrical connection points on the contact module of the test connector to deal with its deterioration, or to manually disassemble and replace the test connector. When manually disassembling and replacing the test connector, the IC test sorter must be stopped first, and the test dock responsible for mechanically connecting the IC test sorter and the test machine must be manually separated. Plate), then disassemble and replace the test connector containing the contact module, and then restart the IC test sorting machine. This method of separating the joint plate and disassembling and replacing the test connector is time-consuming under normal temperature testing. If it is to cope with the common high and low temperature tests nowadays, it will greatly affect the already stable test temperature and humidity environment conditions. The long time spent waiting for the temperature and humidity to stabilize after disassembling the test connector will further impact the efficiency of the production line.

In addition, the timing of replacing the test connector containing the contact module also needs to be based on the subjective judgment of the staff, which is not easy to effectively grasp consistently. For example, if it is replaced too late, the inaccurate test situation may have continued for a period of time, which will significantly increase the retest rate of IC chips and reduce test efficiency.

In view of this, the main purpose of the present invention is to provide a contact module automatic replacement method for IC test sorting machines, in order to overcome the shortcomings of the prior art that when manually replacing the test connector containing the contact module, the replacement time is long and the replacement timing is difficult to grasp, which reduces the test efficiency.

The invention is used for an automatic replacement method of a contact module of an IC test sorting machine. The method is implemented in a control unit of the IC test sorting machine. The control unit executes an IC test mode to control a placement device to move an IC chip to be tested to a test connector base, so that the IC chip to be tested is electrically connected to a test carrier through the contact module to perform a test, and a test data of the IC chip to be tested is stored in a test database of a storage unit. The automatic replacement method of the contact module includes: reading Get the test database; determine whether the test data in the test database meets a preset condition; if so, stop the IC test mode and execute a contact module automatic replacement mode to control the placement device to move the contact module out of the test connector base and place it in a waiting area, then obtain a good contact module from a spare area, move the good contact module into the test connector base, and return to execute the IC test mode; if not, directly return to execute the IC test mode.

According to the contact module automatic replacement method of the present invention, the control unit automatically determines the replacement timing of the contact module while executing the IC test mode. Therefore, when the control unit determines that the test data in the test database meets the preset conditions, it is the replacement timing. While the IC test sorting machine is kept powered on, the IC test mode is stopped first, and then the original contact module in the test connector base is automatically replaced with the good contact module. Compared with the existing technology, the present invention is automatically implemented without stopping the IC test sorting machine, and there is no need for the staff to manually replace the test connector containing the contact module. Therefore, the present invention can effectively grasp the replacement timing and improve the test efficiency.

10: Control unit

20: Storage unit

21: Test database

22,22’: three-dimensional space coordinate data

23: Parameter database

30: Carrier

301: Preparation area

302: Testing area

31: Test product placement tray

32: Slide rail

33: Shuttle

34: Test the connector base

340,330: Container

35: Contact module

35’: Contact module to be replaced

36: Contact module placement tray

361: Spare parts area

362: Waiting for the whole area

40: Removal and placement device

400: Remove and place components

401: First placement element

402: Second placement element

50: IC chip to be tested

60: Objects

70:Qualified contact module

80: Sample

d0,d1,d2: estimated distance

D: Default distance

Figure 1: Block diagram of a system for implementing the contact module automatic replacement method of the present invention.

Figure 2: A schematic diagram (top view) of the carrier of the IC test sorting machine used in the present invention.

Figure 3A: A schematic diagram of the IC test sorting machine used in the present invention, where the pick-and-place component is moved above the object.

Figure 3B: A schematic diagram of the pick-up and placement element shown in Figure 3A extending downward to pick up an object.

Figure 3C: A schematic diagram of the placement element shown in Figure 3B retracting upward and simultaneously sucking an object.

Figure 4: A schematic plan view (from above) of the carrier of the IC test sorting machine used in the present invention.

Figure 5: Flowchart of the contact module automatic replacement method of the present invention.

Figure 6: A schematic diagram of the contact module automatic replacement method of the present invention, in which the placement element moves a preset distance to place the contact module.

Figure 7: A schematic diagram showing that the preset distance shown in Figure 6 is selected from one of a plurality of estimated distances in the contact module automatic replacement method of the present invention.

The present invention is an automatic replacement method for contact modules of an integrated circuit test sorter (IC Test Handler). The complete mechanism and operating principle of the IC test sorter are not the focus of the present invention and are not described in detail. They are briefly described as follows. Please refer to Figures 1 and 2. The IC test sorter can basically include a control unit 10, a storage unit 20, a carrier 30 and a placement device 40.

The control unit 10 is electrically connected to the carrier 30 and the placement device 40, and serves as the core for implementing control and testing functions. The control unit 10 is also electrically connected to the storage unit 20 to access the data of the storage unit 20. The control unit 10 may include a central processing unit chip, and the storage unit 20 may include a traditional hard disk (HDD), a solid state hard disk (SSD), a memory or a memory card.

The carrier 30 defines a preparation area 301 and a test area 302 located next to the preparation area 301 along a horizontal plane (i.e., an X-Y plane). The carrier 30 can be configured with a DUT placement tray 31 (or a DUT tray), a slide rail 32, a shuttle 33, and a test connector base 34. The DUT placement tray 31 is located in the preparation area 301 for placing a plurality of DUT IC chips 50. The test connector base 34 is located in the test area 302 and is disposed on a test load board. The test connector base 34 may have at least one cavity 340 with an opening facing upward. Each cavity 340 is provided for placing a contact module 35. The size of the contact module 35 is smaller than the size of the opening of the cavity 340, so that the contact module 35 can pass through the opening of the cavity 340. The top and bottom surfaces of the contact module 35 have a plurality of electrical connection points. The contact module 35 can be a card-type or sheet-like probe assembly, a wire-type conductive film, or a gold powder-type conductive film. The wire-type conductive film and the gold powder-type conductive film are elastic. When the contact module 35 is a probe assembly, its electrical connection point is the tip of the probe; when the contact module 35 is a wire-type conductive film, its electrical connection point is the wire end point; when the contact module 35 is a gold powder-type conductive film, its electrical connection point is the gold powder particle. The slide rail 32 is distributed in the preparation area 301 and the test area 302 along a straight line at the same time. The shuttle 33 is disposed on the slide rail 32 and is controlled by the control unit 10 to move back and forth between the preparation area 301 and the test area 302 along the slide rail 32. The shuttle 33 has at least one receiving groove 330.

The placement device 40 is disposed above the carrier 30. The placement device 40 may have a plurality of placement elements. Each of the placement elements is controlled by the control unit 10 and can move along the X, Y, and Z axes in space, and can obtain an object, carry the object to move, and release the object. The placement element may be a suction nozzle, but is not limited to this, as long as the functions of obtaining, carrying, moving, and releasing the object can be implemented. The object may be an IC chip or a contact module to be tested. For example, please refer to Figure 3A, the placement component 400 is controlled to move along the X-Y plane to above an object 60; please refer to Figure 3B, the placement component 400 is controlled to extend downward along the Z axis to absorb the object 60; please refer to Figure 3C, the placement component 400 is controlled to retract upward along the Z axis and absorb the object 60 at the same time; then, the placement component 400 can carry the object 60 to move in three-dimensional space; similarly, after the placement component 400 carries the object 60 to another fixed point, it is controlled to extend downward to place the object 60 at the fixed point, and then release the object 60. For ease of explanation, please refer to FIG. 1. In an embodiment of the present invention, the plurality of placement elements include a first placement element 401 and a second placement element 402. The first placement element 401 operates in the preparation area 301, and the second placement element 402 operates in the test area 302.

When the IC test sorting machine is running, the control unit 10 executes an IC test mode to control the placement device 40 to move an IC chip 50 to be tested onto the contact module 35 of the test connector base 34, so that the IC chip 50 to be tested is electrically connected to the test carrier through the contact module 35 to perform the test. In detail, the IC test mode is a program data stored in the storage unit 20 for the control unit 10 to execute. When executing the IC test mode, please refer to FIG. 2. The shuttle 33 is located in the preparation area 301. The first placement element 401 is controlled by the control unit 10 to take out the IC chip 50 to be tested from the test product placement tray 31 and place it in a preset container 330 of the shuttle 33. Then, please refer to FIG. 4. The shuttle 33 is controlled by the control unit 10 to move to the test area 302. The second placement element 402 is controlled by the control unit 10 to take out the IC chip 50 to be tested from the shuttle 33. The IC chip 50 to be tested is placed on the preset contact module 35 in the test connector base 34, or the IC chip 50 to be tested can be further pressed down so that the contacts at the bottom of the IC chip 50 to be tested correspond to and actually contact the electrical connection contacts on the contact module 35, and the electrical connection contacts at the bottom of the contact module 35 actually contact the contacts on the test carrier, thereby making the IC chip 50 to be tested form a substantial signal connection with the test carrier through the contact module 35, and then performing a test operation on the IC chip 50 to be tested, and storing the test data of the IC chip 50 to be tested in a test database 21 of the storage unit 20. After the IC chip 50 to be tested is tested, the second placement element 402 is controlled by the control unit 10 to take the IC chip 50 to be tested out of the test connector base 34 and the contact module 35, and then implement the subsequent displacement, classification, and testing process of the next IC chip 50 to be tested.

It should be noted that the storage unit 20 stores the three-dimensional space (space formed by the X-Y-Z axes) coordinate data 22 of the carrier 30 and the placement device 40 (as shown in FIG. 1 ). Therefore, when the control unit 10 executes the program data of the IC test mode, the positions of the first placement component 401, the second placement component 402 and the shuttle 33 can be accurately grasped and controlled according to the three-dimensional space coordinate data 22.

The basic structure and IC test mode of the IC test sorting machine have been briefly described above. The embodiment of the contact module automatic replacement method of the present invention is described as follows. Please refer to Figures 2 and 4. The present invention is to further provide a contact module placement tray 36 (or contact module tray) on the carrier 30. The contact module placement tray 36 is located in the preparation area 301. The contact module placement tray 36 and the test product placement tray 31 can be located on the opposite side of the slide rail 32. The contact module placement tray 36 can be divided into a spare area 361 and a waiting area 362. The spare area 361 is provided with at least one functional and good contact module 70. It should be noted that the storage unit 20 further stores the three-dimensional spatial coordinate data 22' (as shown in FIG1 ) of the position of the contact module placement tray 36, the spare area 361, the waiting area 362 and the good contact module 70, so the control unit 10 can implement the contact module automatic replacement method of the present invention according to the three-dimensional spatial coordinate data 22'.

Please refer to Figure 5. The contact module automatic replacement method of the present invention is to store the program data in the storage unit 20 for the control unit 10 to execute, including the following steps:

Step S01: Read the test database 21. As mentioned above, when the control unit 10 implements the IC test mode, the test data of the IC chip 50 to be tested is stored in the test database 21 of the storage unit 20. In an embodiment of the present invention, the test data may include a test serial number and a test time point corresponding to the test serial number, a good product code and/or a bad product code, wherein the data format of the test serial number may be a cumulative digital code, for example, the test serial numbers of two IC chips to be tested successively may be N and N+1, N is a positive integer; the data format of the test time point may include hours, minutes and seconds (for example: hh:mm:ss); the data formats of the good product code and the bad product code may be different codes from each other, for example, the good product code may be "PASS" or "1", and the bad product code may be "NG" or "0". Therefore, when the control unit 10 executes the IC test mode and completes the test of multiple IC chips to be tested, the test database 21 of the storage unit 20 can accumulate the test data of multiple IC chips to be tested.

Step S02: Determine whether the test data in the test database 21 meets a preset condition. The preset condition may involve at least one of the test sequence number, the test time point, the good product code and the bad product code, and the preset condition is the program data stored in the storage unit 20. Before entering step S02, the control unit 10 may first determine the timing of entering step S02 according to a yield monitoring setting value, and the yield monitoring setting value is an adjustable preset value stored in a parameter database 23 (as shown in FIG. 1 ) of the storage unit 20. For example, if the yield monitoring setting value is a positive integer, such as 500, the control unit 10 can enter step S02 after testing 500 IC chips 50 according to the test sequence number of the test database 21.

The implementation examples of the default conditions are described below.

1. The default condition is that a measured quantity is equal to or greater than a quantity threshold value

Because the test data stored in the test database 21 of the storage unit 20 includes the test serial numbers of a plurality of IC chips to be tested that have completed the test in sequence, the control unit 10 can define a test serial number starting value therefrom. For example, the control unit 10 can set the first test serial number recorded after the contact module 35 is replaced as the test serial number starting value. The control unit 10 can calculate a difference between the latest test serial number and the test serial number starting value, and use the difference as the measured quantity, which represents the number of IC chips 50 to be tested that have completed the test after the contact module 35 is replaced. When the control unit 10 determines that the measured quantity is equal to or greater than the quantity threshold, the test data is in a state that meets the preset condition. The quantity threshold value is an adjustable default value stored in the parameter database 23.

2. The default condition is that a measured yield is lower than or equal to a yield threshold value

The control unit 10 can calculate the ratio of the quantity corresponding to the good product code from the latest test serial number to the starting value of the test serial number to the measured quantity as the measured yield. When the control unit 10 determines that the measured yield is lower than or equal to the yield threshold, the test data is in a state that meets the preset condition; wherein the yield threshold is an adjustable preset value stored in the parameter database 23. For example, the yield threshold value can be set to 90%, the tested quantity can be 1000, and the quantity corresponding to the good product code from the latest test serial number to the test serial number starting value is 890. Then the control unit 10 can calculate that the tested yield is 89%. Because it is lower than the yield threshold value of 90%, the control unit 10 can determine that the test data meets the preset condition.

3. The default condition is that the yield difference is lower than or equal to a comparison threshold value

The control unit 10 can calculate a difference between a current yield and a historical yield as the yield difference, wherein the current yield and the historical yield are yields calculated in different test intervals. For example, the comparison threshold value can be set to -3%, the current yield corresponds to the yield of a first test interval, the first test interval includes M test numbers calculated from the latest test number, M is a positive integer, the historical yield corresponds to the yield of a second test interval, for example, the second test interval may include another M test numbers that follow the first test interval, for example, the latest test number may be 3499, M may be 1000, then the test numbers of the first test interval include 3499 to 2500, and the test numbers of the second test interval include 2499 to 1500, that is, each test interval corresponds to 1000 test data. When the number of good product codes corresponding to the second test interval is 950, the control unit 10 can calculate the historical yield as 95%; when the number of good product codes corresponding to the first test interval is 910, the control unit 10 can calculate the current yield as 91%; because the difference between the current yield (91%) and the historical yield (95%) is -4%, which is lower than the comparison threshold value of -3%, the control unit 10 can determine that the test data meets the preset condition. Among them, the comparison threshold value and the range of the test intervals (i.e., M value) are adjustable preset values stored in the parameter database 23.

In step S02, if the control unit 10 determines "no", that is, the test data does not meet the preset condition, it means that there is no need to replace the contact module 35 at the moment, so the control unit 10 can directly return to execute the IC test mode.

In step S02, if the control unit 10 determines "yes", that is, the test data meets the preset condition, the control unit 10 stops the IC test mode and executes a contact module automatic replacement mode, and the contact module automatic replacement mode is the program data stored in the storage unit 20 for the control unit 10 to execute. Among them, the contact module 35 currently located in the test connector base 34 can be defined as a contact module 35' to be replaced. When the control unit 10 executes the contact module automatic replacement mode, the following steps are implemented (which can be cross-referenced with Figures 2 and 4): a. Control the shuttle 33 to move to the test area 302; b. Control the second placement element 402 to take out the contact module 35' to be replaced from the test connector base 34, place the contact module 35' to be replaced in a preset receiving slot 330 of the shuttle 33, and then release the contact module 35' to be replaced; c. Control the shuttle 33 to move to the preparation area 301; d. Control the first placement element 401 to take out the contact module to be replaced from the shuttle 33 35', after placing the contact module 35' to be replaced in the waiting area 362 of the contact module placement tray 36, release the contact module 35' to be replaced; e, control the first placement element 401 to take out a good contact module 70 from the spare area 361 of the contact module placement tray 36, and place the good contact module 70 in a preset receiving slot of the shuttle 33; 330, release the good contact module 70; f, control the shuttle 33 to move to the test area 302; and g, control the second placement element 402 to take out the good contact module 70 from the shuttle 33, place the good contact module 70 on the test connector base 34, and then release the good contact module 70 to complete the automatic replacement operation of the contact module. At this time, the good contact module 70 has been set on the test connector base 34 for continuing to implement the IC test mode.

Summarizing the above steps a to g, the control unit 10 controls the placement device 40 to move the contact module 35 out of the test connector base 34 and place it in a waiting area 362, then obtain a good contact module 70 from the spare area 361, and then move the good contact module 70 into the test connector base 34, and return to execute the IC test mode.

Please refer to FIG. 6 for the method of placing the contact module (i.e., the good contact module 70 or the contact module to be replaced 35') by the placing element 400 (i.e., the first placing element 401 or the second placing element 402 as described above). When the placing element 400 is controlled by the control unit 10 and moves to the top of the good contact module 70 or the contact module to be replaced 35', it can move downward (along the Z axis) to extend a preset distance D. The preset distance D is an adjustable preset value stored in the parameter database 23. For example, when the placing element 400 is controlled by the control unit 10 and moves to the top of the good contact module 70 or the contact module to be replaced 35', it can move downward (along the Z axis) to extend a preset distance D. The preset distance D is an adjustable preset value stored in the parameter database 23. For example, when the placing element 400 is moved to the top of the good contact module 70 or the contact module to be replaced 35', it can move downward (along the Z axis) to extend a preset distance D. The placement component 400 is a suction nozzle. After the placement component 400 moves downward by the preset distance D, the suction force generated can directly absorb the good contact module 70 or the contact module 35' to be replaced, and stably carry the good contact module 70 or the contact module 35' to be replaced to move; similarly, when the placement component 400 carries the good contact module 70 or the contact module 35' to be replaced to a position, it moves downward (along the Z axis) to extend the preset distance D to release the good contact module 70 or the contact module 35' to be replaced, completing the release action.

In the above, the default distance D is the value set when the IC test sorting machine is installed (pre-installation operation). When installing the machine, the staff can first place a sample of a contact module on the shuttle 33 or the test connector base 34, and move the placement component 400 (i.e., the first placement component 401 or the second placement component 402 as described above) to the top of the sample 80 as shown in FIG7. Then, for the placement component 400, a plurality of estimated distances of downward movement (such as d0, d1, and d2 shown in FIG7) can be tried first, and a better one is selected from the plurality of estimated distances and set as the default distance D. In other words, the present invention can tailor the default distance D for contact modules of different specifications.

For example, the placement element 400 is a nozzle, and the sample 80 of the contact module is an elastic conductive film. The control unit 10 can measure an air pressure value of the nozzle through a barometer. When the control unit 10 determines that the air pressure value is greater than an air pressure threshold value, it can be determined that the current estimated distance (such as d0 shown in FIG. 7 ) has not yet been sucked to the sample 80; when the control unit 10 determines that the air pressure value is less than the air pressure threshold value, it can be determined that the current estimated distance has been sucked to the sample 80. In the above, the air pressure threshold is an adjustable preset value stored in the parameter database 23; and, as the air pressure measurement value is lower, the suction nozzle has a greater force to adsorb the sample 80. Therefore, due to the different structural characteristics (such as thickness, weight, surface flatness) of different conductive films, the staff can select a better estimated distance (such as one of d1 and d2) and set it as the preset distance D (such as d1=D, or d2=D), so that the sample 80 can be adsorbed with a more appropriate force. Therefore, when the present invention is actually performing the contact module automatic replacement mode, the first placement component 401 and the second placement component 402 can stably place and move the good contact module 70 and the contact module to be replaced 35'.

In summary, the present invention automatically determines the replacement timing of the contact module when the control unit 10 executes the IC test mode. When the test data in the test database 21 meets the preset condition, the contact module 35' to be replaced is automatically replaced with a good contact module 70 while the IC test sorting machine remains powered on, thereby ensuring the accuracy of the IC test. On the other hand, in the storage unit 20, the preset condition and the preset value in the parameter database 23 can be tailored for different specifications of the IC chip 50 and the contact module to be tested to meet their test requirements.

Claims (5)

A contact module automatic replacement method for an IC test sorting machine is implemented in a control unit of the IC test sorting machine. The control unit executes an IC test mode to control a placement device to move an IC chip to be tested to a test connector base, so that the IC chip to be tested is electrically connected to a test carrier through the contact module to perform a test, and a test data of the IC chip to be tested is stored in a test database of a storage unit; the contact module automatic replacement method includes: reading the test database; judging whether the test data in the test database meets a preset condition; if so, stopping the IC test mode and executing a contact module automatic replacement mode to control the placement device to move the contact chip to a test connector base. The module is removed from the test connector base and placed in a waiting area, and then a good contact module is obtained from a spare area, the good contact module is moved to the test connector base, and the IC test mode is returned to be executed; if not, the IC test mode is returned to be executed directly; wherein, in the IC test mode, the stored test data includes a test serial number corresponding to each IC chip to be tested; in the step of "determining whether the test data in the test database meets a preset condition", the preset condition is that a measured quantity is equal to or greater than a quantity threshold value; wherein, the measured quantity is a difference between the latest test serial number and a test serial number starting value, and the quantity threshold value is an adjustable preset value. As described in claim 1, in the IC test mode, the stored test data includes a good product code corresponding to the test serial number of each IC chip to be tested; In the step of "determining whether the test data in the test database meets a preset condition", the preset condition is that a measured yield is lower than or equal to a yield threshold value; wherein the measured yield is the ratio of the number of good product codes corresponding to the latest test serial number to the starting value of the test serial number to the measured number, and the yield threshold value is an adjustable preset value. As described in claim 1, in the IC test mode, the stored test data includes a good product code corresponding to the test serial number of each IC chip to be tested; in the step of "determining whether the test data in the test database meets a preset condition", the preset condition is that a yield difference is lower than or equal to a comparison threshold value; wherein the yield difference value is the difference between a current yield and a historical yield, and the current yield and the historical yield are respectively the yields calculated according to the number of the good product codes in different test intervals, and the comparison threshold value is an adjustable preset value. As described in any one of claim items 1 to 3, the contact module automatic replacement method for an IC test sorting machine first determines whether to enter the step of "determining whether the test data in the test database meets a preset condition" based on a yield monitoring setting value after reading the test database, and the yield monitoring setting value is an adjustable preset value. The contact module automatic replacement method for an IC test sorting machine as described in claim 4, wherein the contact module automatic replacement mode includes: a. controlling a shuttle of the IC test sorting machine to move to a test area; b. controlling a second placement component of the placement device to move the contact module out of the test connector base and place it on the shuttle; c. controlling the shuttle to move to a preparation area; d. controlling a first placement component of the placement device to move the contact module out of the test connector base and place it on the shuttle; The pick-and-place component takes out the contact module from the shuttle and places the contact module in the waiting area; e. Control the first pick-and-place component to obtain the good contact module from the spare area and place the good contact module in the shuttle; f. Control the shuttle to move to the test area; and g. Control the second pick-and-place component to take out the good contact module from the shuttle and place the good contact module in the test connector base.