TWI738770B - Method for manufacturing optical member with separate film - Google Patents
Method for manufacturing optical member with separate film Download PDFInfo
- Publication number
- TWI738770B TWI738770B TW106113270A TW106113270A TWI738770B TW I738770 B TWI738770 B TW I738770B TW 106113270 A TW106113270 A TW 106113270A TW 106113270 A TW106113270 A TW 106113270A TW I738770 B TWI738770 B TW I738770B
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- adhesive layer
- active energy
- film
- energy ray
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 92
- 239000000853 adhesive Substances 0.000 claims abstract description 67
- 230000001070 adhesive effect Effects 0.000 claims abstract description 67
- 239000000203 mixture Substances 0.000 claims abstract description 44
- 239000011247 coating layer Substances 0.000 claims abstract description 43
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 28
- 230000004913 activation Effects 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 9
- 238000000059 patterning Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 146
- -1 polypropylene Polymers 0.000 description 101
- 229920001577 copolymer Polymers 0.000 description 59
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 58
- 239000000178 monomer Substances 0.000 description 56
- 229920005989 resin Polymers 0.000 description 45
- 239000011347 resin Substances 0.000 description 45
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 34
- 150000001875 compounds Chemical class 0.000 description 28
- 238000011282 treatment Methods 0.000 description 24
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- 238000001035 drying Methods 0.000 description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 17
- 150000002466 imines Chemical class 0.000 description 16
- 125000000217 alkyl group Chemical group 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
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- 238000001723 curing Methods 0.000 description 10
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- 238000004804 winding Methods 0.000 description 10
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- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 8
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
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- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
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- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 4
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- 230000032683 aging Effects 0.000 description 4
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- SOWBFZRMHSNYGE-UHFFFAOYSA-N Monoamide-Oxalic acid Natural products NC(=O)C(O)=O SOWBFZRMHSNYGE-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
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- 125000003118 aryl group Chemical group 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001767 cationic compounds Chemical class 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 229910001411 inorganic cation Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
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- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- PXELHGDYRQLRQO-UHFFFAOYSA-N 1-butyl-1-methylpyrrolidin-1-ium Chemical compound CCCC[N+]1(C)CCCC1 PXELHGDYRQLRQO-UHFFFAOYSA-N 0.000 description 2
- NJMWOUFKYKNWDW-UHFFFAOYSA-N 1-ethyl-3-methylimidazolium Chemical compound CCN1C=C[N+](C)=C1 NJMWOUFKYKNWDW-UHFFFAOYSA-N 0.000 description 2
- ARGCQEVBJHPOGB-UHFFFAOYSA-N 2,5-dihydrofuran Chemical compound C1OCC=C1 ARGCQEVBJHPOGB-UHFFFAOYSA-N 0.000 description 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920001747 Cellulose diacetate Polymers 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
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- 239000007864 aqueous solution Substances 0.000 description 2
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- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
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- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
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- LNALLRZKLIWXLH-UHFFFAOYSA-N 1-dodecyl-4-methylpyridin-1-ium Chemical compound CCCCCCCCCCCC[N+]1=CC=C(C)C=C1 LNALLRZKLIWXLH-UHFFFAOYSA-N 0.000 description 1
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- HXMUPILCYSJMLQ-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;4-methylbenzenesulfonate Chemical compound CC[N+]=1C=CN(C)C=1.CC1=CC=C(S([O-])(=O)=O)C=C1 HXMUPILCYSJMLQ-UHFFFAOYSA-M 0.000 description 1
- PFAUBIHDAOTBBK-UHFFFAOYSA-N 1-hexadecyl-4-methylpyridin-1-ium Chemical compound CCCCCCCCCCCCCCCC[N+]1=CC=C(C)C=C1 PFAUBIHDAOTBBK-UHFFFAOYSA-N 0.000 description 1
- QZKVUSSYPPWURQ-UHFFFAOYSA-N 1-methylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C QZKVUSSYPPWURQ-UHFFFAOYSA-N 0.000 description 1
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- DYPVADKXJPHQCY-UHFFFAOYSA-N dimethoxymethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound COC(OC)[SiH2]CCCOCC1CO1 DYPVADKXJPHQCY-UHFFFAOYSA-N 0.000 description 1
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- WMAFNLQQGPUKCM-UHFFFAOYSA-N ethoxymethyl 2-methylprop-2-enoate Chemical compound CCOCOC(=O)C(C)=C WMAFNLQQGPUKCM-UHFFFAOYSA-N 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
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Images
Classifications
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
- B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- G—PHYSICS
- G02—OPTICS
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- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Abstract
Description
本發明係有關一種依序包含剝離膜與黏著劑層與光學組件之附有剝離膜的光學組件之製造方法。 The present invention relates to a method for manufacturing an optical component with a release film including a release film, an adhesive layer, and an optical component in sequence.
以偏光板等為代表之各種光學組件,係有隔著黏著劑層貼合在例如圖像顯示單元之其它組件而使用的情形(例如專利文獻1)。因此,光學組件係以其一面預先設有黏著劑層之附有黏著劑層光學組件之型態在市面上流通。一般係在該黏著劑層的外表面,暫時設置用以保護該表面之可剝離的剝離膜(亦稱為「分離膜」)。 Various optical components typified by polarizers etc. are sometimes used by bonding them to other components such as image display units via an adhesive layer (for example, Patent Document 1). Therefore, optical components are circulated in the market in the form of optical components with an adhesive layer preliminarily provided with an adhesive layer on one side. Generally, a peelable release film (also called a "separation film") is temporarily installed on the outer surface of the adhesive layer to protect the surface.
[專利文獻1]日本特開2008-275722號公報 [Patent Document 1] JP 2008-275722 A
作為兼具如上述之光學組件與圖像顯示單元的顯示器,具有可撓性之可撓式顯示器係可設置在非為 平面之面及彎折面,而且在攜帶時可摺疊成捲物狀而可提高攜帶性。因此期待在攜帶用機器作為裝配用途。可撓式顯示器中使用的附有黏著劑層之光學組件方面,即使使可撓式顯示器彎折(例如折彎、彎曲等)或重複彎折,亦要求黏著劑層與於此相鄰之組件不會剝離的密接性。 As a display with both the above-mentioned optical components and image display unit, a flexible display can be set on a non-planar surface and a bending surface, and can be folded into a roll shape when carried. Can improve portability. Therefore, it is expected to be used for assembly purposes in portable devices. For optical components with adhesive layers used in flexible displays, even if the flexible displays are bent (for example, bends, bends, etc.) or bends repeatedly, the adhesive layer is required to be adjacent to the components Adhesion without peeling.
本發明之目的係提供一種用以製造附有剝離膜之光學組件的方法,其中,附有剝離膜之光學組件係附有黏著劑層之剝離膜與光學組件的積層體,即使對可撓式顯示器之彎折,亦可維持黏著劑層與於此相鄰的組件之間良好的密接性。 The object of the present invention is to provide a method for manufacturing an optical component with a release film, wherein the optical component with a release film is a laminate of a release film with an adhesive layer and an optical component, even for a flexible type The bending of the display can also maintain good adhesion between the adhesive layer and the adjacent components.
本發明係提供以下所示之附有剝離膜之光學組件之製造方法。 The present invention provides a method for manufacturing an optical component with a release film as shown below.
[1]一種附有剝離膜之光學組件之製造方法,係包含下述步驟,塗佈步驟:將活性能量射線硬化型黏著劑組成物塗佈在長條狀之剝離膜上而形成塗佈層之步驟;曝光步驟:一面連續地運送上述具有塗佈層之剝離膜,一面經由活性能量射線之照射將塗佈層進行圖案曝光,得到具有包含已曝光之第1區域、與曝光量小於該第1區域之第2區域的黏著劑層之剝離膜的步驟;貼合步驟:接著一面連續地運送上述曝光步驟後之膜,一面將長條的光學組件積層在該黏著劑層之外表面,再將該積層體從上下方進行擠壓之步驟。 [1] A method of manufacturing an optical component with a release film, which includes the following steps, a coating step: coating an active energy ray-curable adhesive composition on a strip of release film to form a coating layer The step; the exposure step: one side of the release film with the coating layer is continuously transported, and the coating layer is patterned through the irradiation of active energy rays to obtain a first region containing the exposed first area and the exposure amount less than the first The step of peeling off the film of the adhesive layer in the second area of the first area; the laminating step: the film after the above-mentioned exposure step is continuously transported, while the long optical components are laminated on the outer surface of the adhesive layer, and then The step of squeezing the laminate from above and below.
[2]如[1]記載之製造方法,在上述曝光步驟中,隔著遮罩經由上述活性能量射線之照射進行圖案曝光。 [2] The manufacturing method as described in [1], in the exposure step, pattern exposure is performed by irradiation with the active energy ray through a mask.
[3]如[2]記載之製造方法,其中,上述遮罩係具有沿著上述具有塗佈層之剝離膜的運送方向之方向延伸的貫穿部,而該貫穿部係沿著上述具有塗佈層之剝離膜的寬度方向排列。 [3] The manufacturing method according to [2], wherein the mask has a penetration portion extending along the direction of the conveying direction of the release film with the coating layer, and the penetration portion is along the direction with the coating layer. The layers of the release film are arranged in the width direction.
[4]如[2]記載之製造方法,其中,上述遮罩係漸層遮罩。 [4] The manufacturing method according to [2], wherein the mask is a gradation mask.
[5]如[1]至[4]中任一項記載之製造方法,其中,進一步包含熟化步驟,該步驟係將藉由上述貼合步驟所得之附有剝離膜的光學組件捲繞成卷狀,再以卷狀態進行上述黏著劑層的熟化之步驟。 [5] The manufacturing method according to any one of [1] to [4], which further includes an aging step of winding the optical component with a release film obtained in the above bonding step into a roll Then, the step of curing the adhesive layer is carried out in a roll state.
[6]如[1]至[5]中任一項記載之製造方法,於上述曝光步驟中,上述活性能量射線係對上述塗佈層進行複數次的照射。 [6] The manufacturing method according to any one of [1] to [5], in the exposure step, the active energy ray system irradiates the coating layer multiple times.
[7]如[1]至[6]中任一項記載之製造方法,其中,進一步包含表面活化步驟,該步驟係在上述貼合步驟之前,在上述光學組件中與上述黏著劑層的貼合面及上述黏著劑層中與上述光學組件的貼合面之至少一者,進行能量照射之步驟。 [7] The manufacturing method according to any one of [1] to [6], further comprising a surface activation step, which is a step of bonding with the adhesive layer in the optical component before the bonding step. At least one of the bonding surface and the bonding surface of the above-mentioned adhesive layer with the above-mentioned optical component is subjected to a step of energy irradiation.
[8]如[1]至[7]中任一項記載之製造方法,其中,上述光學組件為偏光板。 [8] The manufacturing method according to any one of [1] to [7], wherein the optical component is a polarizing plate.
依據本發明之製造方法,可提供一種附有 剝離膜之光學組件,而該附有剝離膜之光學組件,對於所使用之可撓式顯示器中的彎折,在黏著劑層與於此相鄰的組件之間亦可維持良好的密接性。 According to the manufacturing method of the present invention, it is possible to provide an optical component with a release film, and the optical component with a release film, for the bending in the flexible display used, is adjacent to the adhesive layer The components can also maintain good adhesion.
1‧‧‧第1進料輥 1‧‧‧The first feed roller
2‧‧‧第2進料輥 2‧‧‧The second feed roller
3‧‧‧捲繞輥 3‧‧‧Winding roller
10‧‧‧剝離膜 10‧‧‧Peeling film
11‧‧‧塗佈層 11‧‧‧Coating layer
12‧‧‧黏著劑層 12‧‧‧Adhesive layer
12a‧‧‧第1區域 12a‧‧‧
12b‧‧‧第2區域 12b‧‧‧
15‧‧‧具有塗佈層之剝離膜 15‧‧‧Release film with coating layer
20‧‧‧附有黏著劑層之剝離膜 20‧‧‧Release film with adhesive layer
30‧‧‧光學組件 30‧‧‧Optical components
40‧‧‧附有剝離膜之光學組件 40‧‧‧Optical components with peeling film
50‧‧‧塗佈裝置 50‧‧‧Coating device
60‧‧‧塗佈用輥 60‧‧‧Coating roller
70‧‧‧乾燥手段 70‧‧‧Drying means
80‧‧‧曝光裝置(活性能量射線照射裝置) 80‧‧‧Exposure device (active energy ray irradiation device)
81‧‧‧遮罩 81‧‧‧Mask
81a‧‧‧遮光罩 81a‧‧‧ Lens Hood
81b‧‧‧半色調遮罩 81b‧‧‧Halftone mask
82、83‧‧‧半色調遮罩之區域 82, 83‧‧‧Halftone masked area
85‧‧‧狹縫 85‧‧‧Slit
90‧‧‧貼合輥 90‧‧‧Laminating roller
第1圖係呈示本發明之附有剝離膜的光學組件之製造方法及其中使用的製造裝置之一例的示意圖。 Fig. 1 is a schematic diagram showing an example of the manufacturing method of the release film-attached optical component of the present invention and the manufacturing apparatus used in it.
第2圖係呈示具有塗佈層之剝離膜的一例之示意性剖面圖。 Fig. 2 is a schematic cross-sectional view showing an example of a release film having a coating layer.
第3圖係呈示附有黏著劑層之剝離膜的一例之示意性剖面圖。 Fig. 3 is a schematic cross-sectional view showing an example of a release film with an adhesive layer.
第4圖係呈示可撓式顯示器之彎折態樣的一例之示意圖。 Fig. 4 is a schematic diagram showing an example of the bending state of the flexible display.
第5圖係呈示隔著遮罩在塗佈層上照射活性能量射線之狀態的示意俯視圖。 Fig. 5 is a schematic plan view showing a state in which active energy rays are irradiated on the coating layer through the mask.
第6圖係呈示黏著劑層中第1區域與第2區域之配置圖案之例的示意俯視圖。 Fig. 6 is a schematic plan view showing an example of the arrangement pattern of the first area and the second area in the adhesive layer.
第7圖係呈示使用遮罩之活性能量射線的照射方法之一例的示意剖面圖。 Fig. 7 is a schematic cross-sectional view showing an example of an active energy ray irradiation method using a mask.
第8圖係呈示使用遮罩之活性能量射線的照射方法之其它例的示意剖面圖。 Fig. 8 is a schematic cross-sectional view showing another example of an active energy ray irradiation method using a mask.
第9圖係呈示黏著劑層中第1區域與第2區域之配置圖案的其它例之示意俯視圖。 Fig. 9 is a schematic plan view showing another example of the arrangement pattern of the first area and the second area in the adhesive layer.
第10圖係呈示黏著劑層中第1區域與第2區域之配置 圖案的其它例之示意俯視圖。 Fig. 10 is a schematic plan view showing another example of the arrangement pattern of the first area and the second area in the adhesive layer.
第11圖係呈示黏著劑層中第1區域與第2區域之配置圖案的其它例之示意俯視圖。 Fig. 11 is a schematic plan view showing another example of the arrangement pattern of the first area and the second area in the adhesive layer.
第12圖係呈示黏著劑層中第1區域與第2區域之配置圖案的其它例之示意俯視圖。 Fig. 12 is a schematic plan view showing another example of the arrangement pattern of the first area and the second area in the adhesive layer.
第13圖係呈示附有剝離膜的光學組件之一例的示意剖面圖。 Fig. 13 is a schematic cross-sectional view showing an example of an optical module with a release film.
本發明之附有剝離膜的光學組件之製造方法係包含下述步驟:塗佈步驟:將活性能量射線硬化型黏著劑組成物塗佈在長條狀之剝離膜上而形成塗佈層的步驟;曝光步驟:一面連續地運送具有塗佈層之剝離膜,一面經由活性能量射線之照射將上述塗佈層進行圖案曝光,得到具有包含已曝光之第1區域、與曝光量小於該第1區域之第2區域的黏著劑層之剝離膜的步驟;貼合步驟:接著一面連續地運送曝光步驟後之膜,一面將長條的光學組件積層在該黏著劑層之外表面,再將該積層體從上下方進行擠壓的步驟。 The method of manufacturing an optical component with a release film of the present invention includes the following steps: a coating step: a step of coating an active energy ray-curable adhesive composition on a strip of release film to form a coating layer ; Exposure step: one side continuously conveys the release film with the coating layer, while the above-mentioned coating layer is patterned through the irradiation of active energy rays to obtain a first area including the exposed first area, and the exposure amount is less than the first area The step of peeling off the film of the adhesive layer in the second area; laminating step: then continuously transport the film after the exposure step, while laminating long optical components on the outer surface of the adhesive layer, and then laminating The body is squeezed from above and below.
本發明之附有剝離膜的光學組件之製造方法可進一步包含上述以外之其它步驟。以下,一面參照圖式同時對各個步驟進行說明。而且,下述中,具有貼合在光學組件之膜中間體的黏著劑層之剝離膜亦稱為「附有黏著劑層之剝離膜」。 The method of manufacturing an optical component with a release film of the present invention may further include other steps than the above. Hereinafter, each step will be described with reference to the drawings. In addition, in the following, the release film having the adhesive layer bonded to the film intermediate of the optical component is also referred to as "the release film with the adhesive layer".
[塗佈步驟] [Coating Step]
本步驟係藉由將活性能量射線硬化型黏著劑組成物塗佈在剝離膜10上形成塗佈層11,得到具有塗佈層11之剝離膜15的步驟(參照第1圖及第2圖)。活性能量射線硬化型黏著劑組成物之塗佈係可使用塗佈裝置50進行。 This step is a step of forming the
(1)剝離膜 (1) Peeling film
剝離膜10一般係熱塑性樹脂膜,以具有透光性(以光學透明者更佳)之熱塑性樹脂膜為佳。熱塑性樹脂之具體例係包含:如鏈狀聚烯烴系樹脂(聚乙烯系樹脂、聚丙烯系樹脂等)、環狀聚烯烴系樹脂(降莰烯系樹脂等)之聚烯烴系樹脂;如聚氟乙烯、聚偏二氟乙烯、聚四氟乙烯(polyfluorinated ethylene)之含氟聚烯烴系樹脂;如聚對苯二甲酸乙二酯系樹脂、聚萘二甲酸乙二酯系樹脂之聚酯系樹脂;如甲基丙烯酸甲酯系樹脂之(甲基)丙烯酸系樹脂;如三乙酸纖維素[TAC]、二乙酸纖維素之乙酸纖維素系樹脂之纖維素系樹脂;聚碳酸酯系樹脂;聚乙烯醇系樹脂;聚乙酸乙烯酯系樹脂;聚芳酯系樹脂;聚醯亞胺系樹脂;聚苯乙烯系樹脂;聚醯胺系樹脂;聚醚碸系樹脂;聚碸系樹脂;以及該等之混合物、共聚物。本說明書中,「(甲基)丙烯酸」係丙烯酸及/或甲基丙烯酸之意,稱為(甲基)丙烯酸酯等時的「(甲基)」亦為相同意義。 The
剝離膜10方面,係可使用對積層有黏著劑層之側的表面經施行脫模處理者。脫模處理之例係聚矽氧處理、長鏈烷基處理、氟處理等。剝離膜10之厚度係例如 5至200μm左右,以10至150μm為佳,以15至100μm更佳。 As for the
(2)活性能量射線硬化型黏著劑組成物 (2) Active energy ray hardening adhesive composition
活性能量射線硬化型黏著劑組成物係經由紫外線、可見光、電子束、X射線等之活性能量射線的照射進行硬化反應之黏著劑組成物。活性能量射線硬化型黏著劑組成物係以紫外線硬化型黏著劑組成物為佳。紫外線硬化型黏著劑組成物之較佳例係以(甲基)丙烯酸系化合物為主成分之(甲基)丙烯酸系紫外線硬化型黏著劑組成物。本發明中,以往習知的活性能量射線硬化型黏著劑組成物之任一者均可使用。活性能量射線硬化型黏著劑組成物可為溶劑型、無溶劑型、水分散型等。 The active energy ray-curable adhesive composition is an adhesive composition that undergoes a curing reaction by irradiation with active energy rays such as ultraviolet rays, visible light, electron beams, and X-rays. The active energy ray-curable adhesive composition is preferably an ultraviolet-curable adhesive composition. A preferable example of the ultraviolet curable adhesive composition is a (meth)acrylic ultraviolet curable adhesive composition mainly composed of a (meth)acrylic compound. In the present invention, any of conventionally known active energy ray-curable adhesive compositions can be used. The active energy ray-curable adhesive composition may be solvent-based, solvent-free, water-dispersible, and the like.
活性能量射線硬化型黏著劑組成物之一例係包含1種或2種以上之分子內至少具有1個活性能量射線硬化性部位的聚合性單體(以下,亦簡稱為「聚合性單體」)之黏著劑組成物。活性能量射線硬化性部位係例如乙烯性雙鍵。活性能量射線硬化型黏著劑組成物之較佳者係以(甲基)丙烯酸系化合物為主成分的(甲基)丙烯酸系黏著劑組成物,在此情況下,聚合性單體之較佳者係活性能量射線硬化性的(甲基)丙烯酸系單體。活性能量射線硬化性的(甲基)丙烯酸系單體之一較佳例係具有(甲基)丙烯醯基之(甲基)丙烯酸系單體,其具體例係下述式(I)所示之(甲基)丙烯酸酯。 An example of an active energy ray-curable adhesive composition includes one or more types of polymerizable monomers having at least one active energy ray-curable site in the molecule (hereinafter, also referred to as "polymerizable monomers") The adhesive composition. The active energy ray-curable site is, for example, an ethylenic double bond. A preferable active energy ray-curable adhesive composition is a (meth)acrylic adhesive composition mainly composed of a (meth)acrylic compound. In this case, a polymerizable monomer is preferable It is an active energy ray-curable (meth)acrylic monomer. A preferred example of the active energy ray-curable (meth)acrylic monomer is a (meth)acrylic monomer having a (meth)acryloyl group, and its specific example is represented by the following formula (I) The (meth)acrylate.
上述式(I)中,R1表示氫原子或甲基、R2表示可經碳數1至10之烷氧基取代的碳數1至14之烷基、或可經碳數1至10之烷氧基取代的碳數7至21之芳烷基。R2係以可經碳數1至10之烷氧基取代的碳數1至14之烷基者為佳。式(I)所示之(甲基)丙烯酸酯係可單獨使用1種,亦可併用2種以上。 In the above formula (I), R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group with 1 to 14 carbons which may be substituted by an alkoxy group with 1 to 10 carbons, or an alkyl group with 1 to 10 carbons which may be substituted with an alkoxy group having 1 to 10 carbons. Alkoxy substituted aralkyl with 7 to 21 carbons. R 2 is preferably an alkyl group having 1 to 14 carbons which may be substituted by an alkoxy group having 1 to 10 carbons. The (meth)acrylate type represented by the formula (I) may be used singly, or two or more types may be used in combination.
式(I)所示之(甲基)丙烯酸酯的具體例係包含:如丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸正丁酯、丙烯酸正辛酯、丙烯酸月桂酯之烷基部分為直鏈狀的丙烯酸烷酯;如丙烯酸異丁酯、丙烯酸2-乙基己酯、丙烯酸異辛酯之烷基部分為分枝狀的丙烯酸烷酯;如甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸正丁酯、甲基丙烯酸正辛酯、甲基丙烯酸月桂酯之烷基部分為直鏈狀的甲基丙烯酸烷酯;如甲基丙烯酸異丁酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸異辛酯之烷基部分為分枝狀的甲基丙烯酸烷酯等。 Specific examples of the (meth)acrylate represented by formula (I) include: for example, methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate, n-octyl acrylate, and lauryl acrylate. Linear alkyl acrylate; such as isobutyl acrylate, 2-ethylhexyl acrylate, and isooctyl acrylate whose alkyl part is branched alkyl acrylate; such as methyl methacrylate, ethyl methacrylate Ester, propyl methacrylate, n-butyl methacrylate, n-octyl methacrylate, lauryl methacrylate, the alkyl part of which is linear alkyl methacrylate; such as isobutyl methacrylate, The alkyl part of 2-ethylhexyl methacrylate and isooctyl methacrylate is branched alkyl methacrylate.
R2為經烷氧基取代之烷基時,亦即,R2為烷氧基烷基時的式(I)所示之(甲基)丙烯酸酯的具體例係包含:丙烯酸2-甲氧基乙酯、丙烯酸乙氧基甲酯、甲基丙烯酸2-甲氧基乙酯、甲基丙烯酸乙氧基甲酯等。R2為碳數7至21之芳烷基時的式(I)所示之(甲基)丙烯酸酯的具體例係 包含:丙烯酸苯甲酯、甲基丙烯酸苯甲酯等。 When R 2 is an alkyl group substituted with an alkoxy group, that is, when R 2 is an alkoxy alkyl group, specific examples of the (meth)acrylate represented by formula (I) include: 2-methoxy acrylate Ethyl ethyl, ethoxy methyl acrylate, 2-methoxy ethyl methacrylate, ethoxy methyl methacrylate, etc. Specific examples of the (meth)acrylate represented by formula (I) when R 2 is an aralkyl group having 7 to 21 carbon atoms include benzyl acrylate, benzyl methacrylate, and the like.
上述具有(甲基)丙烯醯基之(甲基)丙烯酸系單體係可包含分子內具有脂環式構造的甲基丙烯酸酯。脂環式構造之碳數一般為5以上,以5至7左右為佳。具有脂環式構造之(甲基)丙烯酸酯的具體例係包含:(甲基)丙烯酸異莰酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸環十二烷酯、(甲基)丙烯酸甲基環己酯、(甲基)丙烯酸三甲基環己酯、(甲基)丙烯酸三級丁基環己酯、(甲基)丙烯酸環己基苯酯、α-乙氧基丙烯酸環己酯等。 The (meth)acrylic mono-system having a (meth)acryloyl group may include a methacrylate having an alicyclic structure in the molecule. The carbon number of the alicyclic structure is generally 5 or more, preferably about 5 to 7. Specific examples of (meth)acrylates having an alicyclic structure include: isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentyl (meth)acrylate, and (meth)acrylate Cyclododecyl acrylate, methylcyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, tributylcyclohexyl (meth)acrylate, cyclohexyl (meth)acrylate Phenyl ester, α-ethoxycyclohexyl acrylate, etc.
上述聚合性單體係可包含具有極性官能基之聚合性單體。具有極性官能基之聚合性單體係以(甲基)丙烯酸系單體為佳。極性官能基方面,除了游離羧基、羥基、胺基以外,可列舉如乙氧基等之雜環基等。 The above-mentioned polymerizable single system may include a polymerizable monomer having a polar functional group. The polymerizable single system with polar functional group is preferably a (meth)acrylic monomer. In terms of polar functional groups, in addition to free carboxyl groups, hydroxyl groups, and amino groups, heterocyclic groups such as ethoxy groups can be exemplified.
具有極性官能基之聚合性單體之具體例係包含:如(甲基)丙烯酸、β-羧基乙基(甲基)丙烯酸酯之具有游離羧基的聚合性單體;如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-(2-羥基乙氧基)乙酯、(甲基)丙烯酸2-或3-氯-2-羥基丙酯、二乙二醇單(甲基)丙烯酸酯之具有羥基的聚合性單體;如丙烯醯基嗎福林、乙烯基己內醯胺、N-乙烯基-2-吡咯啶酮、乙烯基吡啶、(甲基)丙烯酸四氫呋喃甲酯、己內酯改質的丙烯酸四氫呋喃甲酯、甲基(甲基)丙烯酸3,4-環氧基環己酯、(甲基)丙烯酸環氧丙酯、2,5-二氫呋喃之具有雜環基的聚合性單體;如(甲基)丙烯酸胺基乙酯、(甲基) 丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸二甲基胺基丙酯之與雜環不同的具有胺基之聚合性單體等。具有極性官能基之聚合性單體係可單獨使用1種,亦可併用2種以上。 Specific examples of polymerizable monomers with polar functional groups include: polymerizable monomers with free carboxyl groups such as (meth)acrylic acid and β-carboxyethyl (meth)acrylate; such as (meth)acrylic acid 2 -Hydroxyethyl, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-(2-hydroxyethoxy)ethyl (meth)acrylate, (meth)acrylic acid 2- or 3-chloro-2-hydroxypropyl ester, diethylene glycol mono(meth)acrylate polymerizable monomers with hydroxyl groups; such as acryloyl mopholin, vinyl caprolactam, N- Vinyl-2-pyrrolidone, vinyl pyridine, methyl tetrahydrofuran (meth)acrylate, methyl tetrahydrofuran acrylate modified by caprolactone, 3,4-epoxycyclohexyl methyl (meth)acrylate , (Meth) glycidyl acrylate, 2,5-dihydrofuran is a polymerizable monomer with a heterocyclic group; such as (meth) acrylate, N,N-di A polymerizable monomer having an amino group which is different from a heterocyclic ring such as methylamino ethyl and dimethylaminopropyl (meth)acrylate. The polymerizable single system having a polar functional group may be used singly, or two or more of them may be used in combination.
上述之中,具有極性官能基之聚合性單體係以包含具有羥基之聚合性單體及/或具有游離羧基之聚合性單體者為佳。 Among the above, the polymerizable monomer system having a polar functional group preferably contains a polymerizable monomer having a hydroxyl group and/or a polymerizable monomer having a free carboxyl group.
上述聚合性單體除了以上所例示之聚合性單體以外,可包含例如:如下述式(II)所示之含有苯氧基乙基的(甲基)丙烯酸酯之具有芳基氧基烷基的(甲基)丙烯酸酯,
上述(II)中,R3表示氫原子或甲基,n表示1至8之整數,R4表示氫原子、烷基、芳烷基或芳基。R4為烷基時,其碳數可為1至9左右,如為芳烷基時,其碳數可為7至11左右,如為芳基時,其碳數可為6至10左右。 In the above (II), R 3 represents a hydrogen atom or a methyl group, n represents an integer of 1 to 8, and R 4 represents a hydrogen atom, an alkyl group, an aralkyl group, or an aryl group. When R 4 is an alkyl group, its carbon number can be about 1 to 9; if it is an aralkyl group, its carbon number can be about 7 to 11; if it is an aryl group, its carbon number can be about 6 to 10.
式(II)中構成R4之碳數1至9之烷基係可列舉如:甲基、丁基、壬基等;碳數7至11之芳烷基係可列舉如:苯甲基、苯乙基、萘基甲基等;碳數6至10之芳基係可列舉如:苯基、甲苯基、萘基等。 In the formula (II), the alkyl group having 1 to 9 carbon atoms constituting R 4 may include methyl, butyl, nonyl, etc.; the aralkyl group having 7 to 11 carbon atoms may include such as benzyl, Phenylethyl, naphthylmethyl, etc.; aryl groups with 6 to 10 carbon atoms include, for example, phenyl, tolyl, naphthyl and the like.
式(II)所示之含有苯氧基乙基的(甲基)丙烯酸酯之具體例係包含:(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸2-(2-苯氧基乙氧基)乙酯、環氧乙烷改質的壬基酚 之(甲基)丙烯酸酯、(甲基)丙烯酸2-(鄰-苯基苯氧基)乙酯等。含有苯氧基乙基之(甲基)丙烯酸酯係可單獨使用1種,亦可併用2種以上。其中,含有苯氧基乙基之(甲基)丙烯酸酯係以包含(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸2-(鄰-苯基苯氧基)乙酯及/或(甲基)丙烯酸2-(2-苯氧基乙氧基)乙酯者為佳。 Specific examples of the phenoxyethyl-containing (meth)acrylate represented by formula (II) include: 2-phenoxyethyl (meth)acrylate, 2-(2-benzene) (meth)acrylate Oxyethoxy) ethyl ester, nonylphenol (meth)acrylate modified by ethylene oxide, 2-(o-phenylphenoxy)ethyl (meth)acrylate, etc. The phenoxyethyl-containing (meth)acrylate system may be used individually by 1 type, and may use 2 or more types together. Among them, the (meth)acrylates containing phenoxyethyl groups include 2-phenoxyethyl (meth)acrylate, 2-(o-phenylphenoxy)ethyl (meth)acrylate, and / Or 2-(2-phenoxyethoxy)ethyl (meth)acrylate is preferred.
(甲基)丙烯酸系單體的聚合性單體之一其它例為(甲基)丙烯醯胺系單體。(甲基)丙烯醯胺系單體之具體例係包含:N-羥甲基(甲基)丙烯醯胺、N-(2-羥基乙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺、N-(5-羥基戊基)(甲基)丙烯醯胺、N-(6-羥基己基)(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-(3-二甲基胺基丙基)(甲基)丙烯醯胺、N-(1,1-二甲基-3-側氧基丁基)(甲基)丙烯醯胺、N-[2-(2-側氧基-1-咪唑啶基)乙基](甲基)丙烯醯胺、2-丙烯醯基胺基-2-甲基-1-丙磺酸、N-(甲氧基甲基)丙烯醯胺、N-(乙氧基甲基)(甲基)丙烯醯胺、N-(丙氧基甲基)(甲基)丙烯醯胺、N-(1-甲基乙氧基甲基)(甲基)丙烯醯胺、N-(1-甲基丙氧基甲基)(甲基)丙烯醯胺、N-(2-甲基丙氧基甲基)(甲基)丙烯醯胺[別名:N-(異丁氧基甲基)(甲基)丙烯醯胺]、N-(丁氧基甲基)(甲基)丙烯醯胺、N-(1,1-二甲基乙氧基甲基)(甲基)丙烯醯胺、N-(2-甲氧基乙基)(甲基)丙烯醯胺、N-(2-乙氧基乙基)(甲基)丙烯醯胺、N-(2-丙氧基乙基)(甲基)丙烯醯胺、N-[2-(1-甲基乙氧 基)乙基](甲基)丙烯醯胺、N-[2-(1-甲基丙氧基)乙基](甲基)丙烯醯胺、N-[2-(2-甲基丙氧基)乙基](甲基)丙烯醯胺[別名:N-(2-異丁氧基乙基)(甲基)丙烯醯胺]、N-(2-丁氧基乙基)(甲基)丙烯醯胺、N-[2-(1,1-二甲基乙氧基)乙基](甲基)丙烯醯胺等。 Another example of the polymerizable monomer of the (meth)acrylic monomer is a (meth)acrylamide-based monomer. Specific examples of (meth)acrylamide-based monomers include: N-methylol(meth)acrylamide, N-(2-hydroxyethyl)(meth)acrylamide, N-(3 -Hydroxypropyl)(meth)acrylamide, N-(4-hydroxybutyl)(meth)acrylamide, N-(5-hydroxypentyl)(meth)acrylamide, N-( 6-Hydroxyhexyl)(meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, Yl)acrylamide, N-(3-dimethylaminopropyl)(meth)acrylamide, N-(1,1-dimethyl-3-oxobutyl)(methyl) Allylamide, N-[2-(2-Pendant oxy-1-imidazolidinyl)ethyl](meth)acrylamide, 2-propenylamino-2-methyl-1-propanesulfon Acid, N-(methoxymethyl)acrylamide, N-(ethoxymethyl)(meth)acrylamide, N-(propoxymethyl)(meth)acrylamide, N -(1-Methylethoxymethyl)(meth)acrylamide, N-(1-methylpropoxymethyl)(meth)acrylamide, N-(2-methylpropoxy) (Methyl)(meth)acrylamide [alias: N-(isobutoxymethyl)(meth)acrylamide], N-(butoxymethyl)(meth)acrylamide, N-(1,1-Dimethylethoxymethyl)(meth)acrylamide, N-(2-methoxyethyl)(meth)acrylamide, N-(2-ethoxy Ethyl)(meth)acrylamide, N-(2-propoxyethyl)(meth)acrylamide, N-[2-(1-methylethoxy)ethyl](former Base) acrylamide, N-[2-(1-methylpropoxy)ethyl](meth)acrylamide, N-[2-(2-methylpropoxy)ethyl](formula Yl)acrylamide [alias: N-(2-isobutoxyethyl)(meth)acrylamide], N-(2-butoxyethyl)(meth)acrylamide, N- [2-(1,1-Dimethylethoxy)ethyl](meth)acrylamide and the like.
(甲基)丙烯醯胺系單體係可單獨使用1種,亦可併用2種以上。 The (meth)acrylamide-based single system may be used singly, or two or more of them may be used in combination.
上述聚合性單體係可包含(甲基)丙烯酸系單體以外之其它聚合性單體。其它聚合性單體方面,可列舉例如:苯乙烯系單體、乙烯系單體等。聚合性單體係可包含1種或2種以上之其它聚合性單體。 The above-mentioned polymerizable single system may contain other polymerizable monomers other than the (meth)acrylic monomer. With regard to other polymerizable monomers, for example, styrene-based monomers, vinyl-based monomers, and the like can be mentioned. The polymerizable single system may contain one or more other polymerizable monomers.
苯乙烯系單體之具體例係包含:苯乙烯;如甲基苯乙烯、二甲基苯乙烯、三甲基苯乙烯、乙基苯乙烯、二乙基苯乙烯、三乙基苯乙烯、丙基苯乙烯、丁基苯乙烯、己基苯乙烯、庚基苯乙烯、辛基苯乙烯之烷基苯乙烯;如氟苯乙烯、氯苯乙烯、溴苯乙烯、二溴苯乙烯、碘苯乙烯之鹵苯乙烯;硝基苯乙烯、乙醯基苯乙烯、甲氧基苯乙烯、二乙烯基苯等。 Specific examples of styrene monomers include: styrene; such as methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, triethyl styrene, propylene Alkyl styrene, butyl styrene, hexyl styrene, heptyl styrene, octyl styrene; such as fluorostyrene, chlorostyrene, bromostyrene, dibromostyrene, iodostyrene Halostyrene; Nitrostyrene, Acetylstyrene, Methoxystyrene, Divinylbenzene, etc.
乙烯系單體之具體例係包含:如乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、2-乙基己酸乙烯酯、月桂酸乙烯酯之脂肪酸乙烯酯;如氯乙烯、溴乙烯之鹵乙烯;如偏二氯乙烯之偏二鹵乙烯;如乙烯基吡啶、乙烯基吡咯啶酮、乙烯基咔唑之含氮芳香族乙烯;如丁二烯、異戊二烯、氯丁二烯之共役二烯單體;丙烯腈、甲基丙烯腈等。 Specific examples of vinyl monomers include: fatty acid vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate, vinyl 2-ethylhexanoate, and vinyl laurate; such as vinyl chloride and vinyl bromide. Vinyl halide; vinylidene halides such as vinylidene chloride; nitrogen-containing aromatic vinyl such as vinyl pyridine, vinyl pyrrolidone, and vinyl carbazole; such as butadiene, isoprene, and chloroprene The co-active diene monomer; acrylonitrile, methacrylonitrile, etc.
上述聚合性單體係可包含分子內具有2個以上之乙烯性雙鍵等經活性能量射線硬化性部位之單體。該多官能單體之一例係分子內具有2個以上之(甲基)丙烯醯基的(甲基)丙烯酸系單體。 The above-mentioned polymerizable single system may include a monomer having two or more ethylenic double bonds in the molecule, such as active energy ray-curable sites. An example of this multifunctional monomer is a (meth)acrylic monomer having two or more (meth)acrylic groups in the molecule.
分子內具有2個以上之(甲基)丙烯醯基的(甲基)丙烯酸系單體之具體例係包含:如1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、三環癸烷二基二甲醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、雙酚A二環氧丙基醚之兩末端(甲基)丙烯酸加成物、聚酯二(甲基)丙烯酸酯、雙酚A之環氧乙烷或環氧丙烷之加成物的二元醇之二(甲基)丙烯酸酯、氫化雙酚A之環氧乙烷或環氧丙烷之加成物的二元醇之二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、 環己烷二甲醇二(甲基)丙烯酸酯之分子內具有2個(甲基)丙烯醯基之單體;如三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷三氧基乙基(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、三(2-羥基乙基)三聚異氰酸酯二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯之分子內具有3個(甲基)丙烯醯基之單體;如新戊四醇四(甲基)丙烯酸酯之分子內具有4個(甲基)丙烯醯基之單體;使雙酚A之二環氧丙基醚加成(甲基)丙烯酸酯之環氧基(甲基)丙烯酸酯等。 Specific examples of (meth)acrylic monomers having two or more (meth)acrylic groups in the molecule include: 1,4-butanediol di(meth)acrylate, 1,6-hexane Glycol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethyl Glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tricyclodecanediyl dimethanol di(meth)acrylate, polyethylene Glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, bisphenol A diglycidyl ether (meth)acrylic acid adduct, polyester di(meth) Acrylate, ethylene oxide or propylene oxide adduct of bisphenol A, dihydric alcohol di(meth)acrylate, hydrogenated bisphenol A, ethylene oxide or propylene oxide adduct Dihydric alcohol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, cyclohexane dimethanol di(meth)acrylate have 2 (meth)acrylic acid in the molecule Group monomers; such as trimethylolpropane tri(meth)acrylate, trimethylolpropane trioxyethyl (meth)acrylate, neopentylerythritol tri(meth)acrylate, tri(meth)acrylate 2-Hydroxyethyl) trimeric isocyanate di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, monomers with 3 (meth)acrylic groups in the molecule; such as neopentyl Tetraol tetra(meth)acrylate is a monomer with 4 (meth)acrylic acid groups in the molecule; adding the diglycidyl ether of bisphenol A to the epoxy group of (meth)acrylate ( Meth) acrylate and the like.
(甲基)丙烯酸系之活性能量射線硬化型黏著劑組成物其活性能量射線硬化成分可為僅由上述聚合性單體構成者,然較佳係除了聚合性單體之外,亦含有1種或2種以上之(甲基)丙烯酸系聚合物及/或低聚物。 (Meth) acrylic active energy ray curable adhesive composition. The active energy ray curable component may be composed only of the above-mentioned polymerizable monomers, but preferably contains one type in addition to the polymerizable monomers Or two or more (meth)acrylic polymers and/or oligomers.
(甲基)丙烯酸系聚合物及/或低聚物可為使上述聚合性單體之1種或2種以上共聚而成之(共)聚合物。(甲基)丙烯酸系聚合物及/或低聚物係以將源自上述式(I)所示之(甲基)丙烯酸酯之1種或2種以上的構成單元作為主成分者為佳,在全部構成單元100重量份中,以包含該構成單元50重量份以上者更佳,以包含60重量份以上者又更佳,以包含70重量份以上者為特佳。其中,上述式(I)所示之(甲基)丙烯酸酯係以包含丙烯酸正丁酯者為佳。 The (meth)acrylic polymer and/or oligomer may be a (co)polymer obtained by copolymerizing one or two or more of the above-mentioned polymerizable monomers. The (meth)acrylic polymer and/or oligomer preferably has one or two or more structural units derived from the (meth)acrylate represented by the above formula (I) as the main component, Among 100 parts by weight of all the structural units, it is more preferable to include 50 parts by weight or more of the structural unit, more preferably 60 parts by weight or more, and particularly preferably 70 parts by weight or more. Among them, the (meth)acrylate represented by the above formula (I) preferably contains n-butyl acrylate.
(甲基)丙烯酸系聚合物及/或低聚物係以包含源自上述具有極性官能基之聚合性單體的構成單元者為佳。該構成單元之含量在全部構成單元100重量份中,一般為0.1至20重量份,以0.4至10重量份為佳。(甲基)丙烯酸系聚合物及/或低聚物本身可具有乙烯性雙鍵等之活性能量射線硬化性部位。 The (meth)acrylic polymer and/or oligomer system preferably contains a structural unit derived from the above-mentioned polymerizable monomer having a polar functional group. The content of the structural unit is generally 0.1 to 20 parts by weight, preferably 0.4 to 10 parts by weight in 100 parts by weight of all the structural units. The (meth)acrylic polymer and/or oligomer itself may have active energy ray-curable sites such as ethylenic double bonds.
(甲基)丙烯酸系聚合物通過凝膠滲透層析儀(GPC)以標準聚苯乙烯換算之重量平均分子量Mw可為例如5萬至80萬。活性能量射線硬化型黏著劑組成物係可包含1種或2種以上的Mw為5萬至80萬之(甲基)丙烯酸系聚合物。活性能量射線硬化型黏著劑組成物亦可進一步包含Mw未達5萬之(甲基)丙烯酸系聚合物或低聚物。 The weight average molecular weight Mw of the (meth)acrylic polymer in terms of standard polystyrene by gel permeation chromatography (GPC) can be, for example, 50,000 to 800,000. The active energy ray-curable adhesive composition system may include one or more (meth)acrylic polymers with Mw of 50,000 to 800,000. The active energy ray-curable adhesive composition may further include a (meth)acrylic polymer or oligomer with a Mw of less than 50,000.
活性能量射線硬化型黏著劑組成物在包含上述聚合性單體、與(甲基)丙烯酸系聚合物及/或低聚物時,該等可被包含作為上述聚合性單體之部分聚合物。 When the active energy ray-curable adhesive composition contains the above-mentioned polymerizable monomer, and a (meth)acrylic polymer and/or oligomer, these may be included as a partial polymer of the above-mentioned polymerizable monomer.
活性能量射線硬化型黏著劑組成物一般係包含光聚合起始劑。光聚合起始劑之具體例係包含:苯乙酮、2,2-二乙氧基苯乙酮、對-二甲基胺基苯乙酮、甲氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2-羥基-2-環己基苯乙酮等之苯乙酮類;二苯基酮、2-氯二苯基酮、p,p’-二氯二苯基酮、p,p’-雙(二乙基胺基)二苯基酮、N,N’-四甲基-4,4’-二胺基二苯基酮、4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮等之酮類;苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻異丙基醚、苯 偶姻異丁基醚等之苯偶姻醚類;噻噸酮(thioxanthone)、2-氯噻噸酮、2-甲基噻噸酮等之噻噸酮類;雙醯基膦氧化物、苯甲醯基膦氧化物等之膦氧化物;二苯乙二酮二甲基縮酮等之縮酮類;莰烷-2,3-二酮、菲醌等之醌類等。光聚合起始劑係可單獨使用1種,亦可併用2種以上。 The active energy ray-curable adhesive composition generally contains a photopolymerization initiator. Specific examples of the photopolymerization initiator include: acetophenone, 2,2-diethoxyacetophenone, p-dimethylaminoacetophenone, methoxyacetophenone, 2,2-di Acetophenones such as methoxy-2-phenylacetophenone and 2-hydroxy-2-cyclohexylacetophenone; diphenyl ketone, 2-chlorodiphenyl ketone, p,p'-dichloro Diphenyl ketone, p,p'-bis(diethylamino)diphenyl ketone, N,N'-tetramethyl-4,4'-diaminodiphenyl ketone, 4-(2- Hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one and other ketones; benzoin, benzoin Benzoin ethers such as methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, etc.; thioxanthone, 2-chlorothioxanthone, 2- Thioxanthones such as methyl thioxanthone; Phosphine oxides such as bis-phosphonyl phosphine oxide and benzyl phosphine oxide; Ketals such as benzophenone dimethyl ketal; Camphor -2,3-dione, phenanthrenequinone and other quinones. A photopolymerization initiator system may be used individually by 1 type, and may use 2 or more types together.
光聚合起始劑之含量,相對於上述聚合性單體等之活性能量射線硬化性成分100重量份,一般為0.01至10重量份,以0.05至5重量份為佳。 The content of the photopolymerization initiator is generally 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, relative to 100 parts by weight of active energy ray curable components such as the above-mentioned polymerizable monomers.
活性能量射線硬化型黏著劑組成物可進一步含有交聯劑。交聯劑係分子內具有2個以上如上述極性官能基之可與活性能量射線硬化性成分所具有的反應性官能基反應之官能基的化合物等,而使活性能量射線硬化性成分交聯的化合物。具體上可例示如:異氰酸酯系化合物、環氧系化合物、氮丙啶系化合物、金屬螯合物系化合物等。該等之中,異氰酸酯系化合物、環氧系化合物及氮丙啶系化合物係分子內具有2個以上之可與活性能量射線硬化性成分中的極性官能基反應之官能基。交聯劑係可單獨使用1種,亦可併用2種以上。 The active energy ray-curable adhesive composition may further contain a crosslinking agent. The crosslinking agent is a compound having two or more polar functional groups in the molecule that can react with the reactive functional group possessed by the active energy ray curable component, etc., to crosslink the active energy ray curable component Compound. Specific examples include isocyanate-based compounds, epoxy-based compounds, aziridine-based compounds, and metal chelate-based compounds. Among these, isocyanate-based compounds, epoxy-based compounds, and aziridine-based compounds have two or more functional groups that can react with the polar functional groups in the active energy ray-curable component in the molecule. A crosslinking agent system may be used individually by 1 type, and may use 2 or more types together.
異氰酸酯系化合物係分子內具有至少2個異氰酸基(-NCO)之化合物。異氰酸酯系化合物之具體例係包含:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛酮二異氰酸酯、苯二甲基二異氰酸酯、氫化苯二甲基二異氰酸酯、二苯基甲烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、萘二異氰酸酯、三苯基甲烷三異氰酸酯、氫化二苯基甲烷 二異氰酸酯;該等異氰酸酯化合物之縮二脲體、三聚異氰酸酯體;在該等異氰酸酯化合物中使與如乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、蓖麻油、甘油及三羥甲基丙烷之多元醇反應而得之加成物;該等異氰酸酯化合物成為二聚物、三聚物者等。 The isocyanate compound is a compound having at least two isocyanate groups (-NCO) in the molecule. Specific examples of isocyanate compounds include: toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diisocyanate Phenylmethane diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, hydrogenated diphenylmethane diisocyanate; biuret and trimer isocyanate of these isocyanate compounds; in these isocyanate compounds, such as ethyl Adducts derived from the reaction of glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, glycerin and trimethylolpropane polyol; these isocyanate compounds become dimers and trimers Wait.
環氧系化合物係分子內具有至少2個環氧基之化合物。環氧系化合物之具體例係包含:雙酚A型之環氧樹脂、乙二醇二環氧丙基醚、聚乙二醇二環氧丙基醚、甘油二環氧丙基醚、甘油三環氧丙基醚、1,6-己二醇二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、N,N-二環氧丙基苯胺、N,N,N’,N’-四環氧丙基-間-二甲苯二胺、1,3-雙(N,N’-二環氧丙基胺基甲基)環己烷等。 The epoxy compound is a compound having at least two epoxy groups in the molecule. Specific examples of epoxy compounds include: bisphenol A type epoxy resin, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, triglyceride Glycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, N,N-diglycidyl aniline, N,N,N', N'-tetraepoxypropyl-m-xylenediamine, 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane, etc.
氮丙啶系化合物亦稱為次乙亞胺,係分子內具有至少2個之由1個氮原子與2個碳原子所構成的3員環之骨架的化合物。氮丙啶系化合物之具體例係包含:二苯基甲烷-4,4’-雙(1-氮丙啶羧醯胺)、甲苯-2,4-雙(1-氮丙啶羧醯胺)、曲他胺(triethylenemelamine)、間苯二甲醯基雙-1-(2-甲基氮丙啶)、三-1-氮丙啶基膦氧化物、六亞甲基-1,6-雙(1-氮丙啶羧醯胺)、三羥甲基丙烷-三-β-氮丙啶基丙酸酯、四羥甲基甲烷-三-β-氮丙啶基丙酸酯等。 The aziridine-based compound is also called ethyleneimine, and is a compound having at least two 3-membered ring skeletons composed of one nitrogen atom and two carbon atoms in the molecule. Specific examples of aziridine compounds include: diphenylmethane-4,4'-bis(1-aziridine carboxyamide), toluene-2,4-bis(1-aziridine carboxyamide) , Triethylenemelamine, m-phthaloyl bis-1-(2-methylaziridine), tri-1-aziridinyl phosphine oxide, hexamethylene-1,6-bis (1-aziridine carboxyamide), trimethylolpropane-tris-β-aziridinyl propionate, tetramethylolmethane-tris-β-aziridinyl propionate, etc.
金屬螯合物化合物之具體例係包含:鋁、鐵、銅、鋅、錫、鈦、鎳、銻、鎂、釩,鉻及鋯等之多價金屬經乙醯丙酮、乙醯乙酸乙酯配位之化合物等。 Specific examples of metal chelate compounds include: aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, zirconium and other polyvalent metals mixed with acetone and ethyl acetate. Position of the compound and so on.
相對於活性能量射線硬化性成分100重量 份,交聯劑一般之含有比率係0.05至10重量份,以0.1至5重量份為佳。 Relative to 100 parts by weight of the active energy ray-curable component, the crosslinking agent is generally contained in a ratio of 0.05 to 10 parts by weight, preferably 0.1 to 5 parts by weight.
活性能量射線硬化型黏著劑組成物係可進一步含有作為抗靜電劑之離子性化合物。離子性化合物係例如:具有無機陽離子或有機陽離子、與無機陰離子或有機陰離子之化合物。離子性化合物係可單獨使用1種,亦可併用2種以上。 The active energy ray-curable adhesive composition system may further contain an ionic compound as an antistatic agent. The ionic compound is, for example, a compound having an inorganic cation or an organic cation, and an inorganic anion or an organic anion. An ionic compound system may be used individually by 1 type, and may use 2 or more types together.
無機陽離子方面,可列舉例如:如鋰陽離子[Li+]、鈉陽離子[Na+]、鉀陽離子[K+]之鹼金屬離子,及如鈹陽離子[Be2+]、鎂陽離子[Mg2+]、鈣陽離子[Ca2+]之鹼土金屬離子等。 Regarding inorganic cations, for example , alkali metal ions such as lithium cation [Li + ], sodium cation [Na + ], potassium cation [K + ], and beryllium cation [Be 2+ ], magnesium cation [Mg 2+ ], calcium cation [Ca 2+ ] alkaline earth metal ions, etc.
有機陽離子方面,可列舉例如:咪唑鎓陽離子、吡啶鎓陽離子、吡咯啶鎓陽離子、銨陽離子、鋶陽離子、鏻陽離子等。 Organic cations include, for example, imidazolium cations, pyridinium cations, pyrrolidinium cations, ammonium cations, sulfonium cations, and phosphonium cations.
上述陽離子成分之中,有機陽離子成分在黏著劑組成物中之相溶性優異。有機陽離子成分之中,吡咯啶鎓陽離子及咪唑鎓陽離子在抗靜電性之觀點上為有利。 Among the above-mentioned cationic components, the organic cationic components have excellent compatibility in the adhesive composition. Among the organic cation components, pyrrolidinium cations and imidazolium cations are advantageous from the viewpoint of antistatic properties.
無機陰離子方面,可列舉例如:氯陰離子[Cl-]、溴陰離子[Br-]、碘陰離子[I-]、四氯鋁酸根陰離子[AlCl4 -]、七氯二鋁酸根陰離子[Al2Cl7 -]、四氟硼酸根陰離子[BF4 -]、六氟磷酸根陰離子[PF6 -]、高氯酸根陰離子[ClO4 -]、硝酸根陰離子[NO3 -]、六氟砷酸根陰離子[AsF6 -]、六氟銻酸根陰離子[SbF6 -]、六氟鈮酸根陰離子[NbF6 -]、六 氟鉭酸根陰離子[TaF6 -]、二氰亞胺離子[(CN)2N-]等。 Inorganic anions aspect, for example, include: chlorine anions [Cl -], bromine anion [Br -], iodide anion [I -], tetrachloroaluminate anion [AlCl 4 -], heptachlor aluminum anions [Al 2 Cl 7--], tetrafluoroborate anion [BF 4 -], hexafluorophosphate anions [PF 6 -], perchlorate anion [ClO 4 -], nitrate anions [NO 3 -], hexafluoroarsenate anion [AsF 6 -], hexafluoroantimonate anion [SbF 6 -], niobium hexafluorophosphate anion [NbF 6 -], six tantalum fluoride anion [TaF 6 -], dicyanimide ion [(CN) 2 N - ] Wait.
有機陰離子方面,可列舉例如:乙酸根陰離子[CH3COO-]、三氟乙酸根陰離子[CF3COO-]、甲磺酸根陰離子[CH3SO3 -]、三氟甲磺酸根陰離子[CF3SO3 -]、對-甲苯磺酸根陰離子[p-CH3C6H4SO3 -]、雙(氟磺醯基)亞胺陰離子[(FSO2)2N-]、雙(三氟甲磺醯基)亞胺陰離子[(CF3SO2)2N-]、三(三氟甲磺醯基)甲基化物陰離子[(CF3SO2)3C-]、二甲基次膦酸根陰離子[(CH3)2POO-]、(聚)氫氟氟化物陰離子[F(HF)n -](n為1至3左右)、硫氰酸根陰離子[SCN-]、全氟丁磺酸根陰離子[C4F9SO3 -]、雙(五氟乙磺醯基)亞胺陰離子[(C2F5SO2)2N-]、全氟丁酸根陰離子[C3F7COO-]、(三氟甲磺醯基)(三氟甲烷羰基)亞胺陰離子[(CF3SO2)(CF3CO)N-]、全氟丙烷-1,3-二磺酸根陰離子[-O3S(CF2)3SO3 -]、碳酸根陰離子[CO3 2-]等。上述陰離子成分中,包含氟原子之陰離子成分在抗靜電性之觀點上為有利。 Organic anion regard include, for example: acetate anion [CH 3 COO -], trifluoroacetate anion [CF 3 COO -], methanesulfonate anion [CH 3 SO 3 -], triflate anion [CF 3 SO 3 -], - toluenesulfonic acid anion [p-CH 3 C 6 H 4 SO 3 -], bis (sulfo-fluoro-acyl) imide anion [(FSO 2) 2 N - ], bis (trifluoromethyl methanesulfonamide acyl) imide anion [(CF 3 SO 2) 2 N -], tris (trifluoromethanesulfonyl acyl) methide anion [(CF 3 SO 2) 3 C -], dimethylphosphinic anion [(CH 3) 2 POO - ], ( poly) hydrogen fluoride anion [F (HF) n -] (n is about 1 to 3), thiocyanate anion [SCN -], perfluoro butane sulfonate anion [C 4 F 9 SO 3 - ], bis (pentafluoroethane sulfonyl acyl) imide anion [(C 2 F 5 SO 2 ) 2 N -], perfluoro butyrate anion [C 3 F 7 COO -], (trifluoromethanesulfonyl acyl) (carbonyl trifluoromethanesulfonyl) imide anion [(CF 3 SO 2) ( CF 3 CO) N -], -1,3- perfluoropropane disulfonate anion [- O 3 S (CF 2) 3 SO 3 -], carbonate anion [CO 3 2-] and the like. Among the above-mentioned anion components, an anion component containing a fluorine atom is advantageous from the viewpoint of antistatic properties.
離子性化合物之具體例係可適當地選自上述陽離子成分與陰離子成分之組合。由有機陽離子之構造中分類列出具有有機陽離子之離子性化合物之例時,可列舉如下述者。 Specific examples of the ionic compound can be appropriately selected from the combination of the above-mentioned cationic components and anionic components. When classifying examples of ionic compounds having organic cations from the structure of organic cations, the following can be cited.
吡啶鎓鹽:N-己基吡啶鎓 六氟磷酸鹽、N-辛基吡啶鎓 六氟磷酸鹽、N-辛基-4-甲基吡啶鎓 六氟磷酸鹽、N-丁基-4-甲基吡啶鎓 六氟磷酸鹽、 N-癸基吡啶鎓 雙(氟磺醯基)亞胺、N-十二烷基吡啶鎓 雙(氟磺醯基)亞胺、N-十四烷基吡啶鎓 雙(氟磺醯基)亞胺、N-十六烷基吡啶鎓 雙(氟磺醯基)亞胺、N-十二烷基-4-甲基吡啶鎓 雙(氟磺醯基)亞胺、N-十四烷基-4-甲基吡啶鎓 雙(氟磺醯基)亞胺、N-十六烷基-4-甲基吡啶鎓 雙(氟磺醯基)亞胺、N-苯甲基-2-甲基吡啶鎓 雙(氟磺醯基)亞胺、N-苯甲基-4-甲基吡啶鎓 雙(氟磺醯基)亞胺、N-己基吡啶鎓 雙(三氟甲磺醯基)亞胺、N-辛基吡啶鎓 雙(三氟甲磺醯基)亞胺、N-辛基-4-甲基吡啶鎓 雙(三氟甲磺醯基)亞胺、N-丁基-4-甲基吡啶鎓 雙(三氟甲磺醯基)亞胺。 Pyridinium salt: N-hexylpyridinium hexafluorophosphate, N-octylpyridinium hexafluorophosphate, N-octyl-4-methylpyridinium hexafluorophosphate, N-butyl-4-methyl Pyridinium hexafluorophosphate, N-decylpyridinium bis(fluorosulfonyl)imine, N-dodecylpyridinium bis(fluorosulfonyl)imine, N-tetradecylpyridinium bis(fluorosulfonyl)imide (Fluorosulfonyl)imine, N-hexadecylpyridinium bis(fluorosulfonyl)imine, N-dodecyl-4-methylpyridinium bis(fluorosulfonyl)imine, N-tetradecyl-4-methylpyridinium bis(fluorosulfonyl)imine, N-hexadecyl-4-methylpyridinium bis(fluorosulfonyl)imine, N-benzyl 2-methylpyridinium bis(fluorosulfonyl)imine, N-benzyl-4-methylpyridinium bis(fluorosulfonyl)imine, N-hexylpyridinium bis(trifluoromethyl) Sulfonyl)imine, N-octylpyridinium bis(trifluoromethanesulfonyl)imine, N-octyl-4-methylpyridinium bis(trifluoromethanesulfonyl)imine, N- Butyl-4-methylpyridinium bis(trifluoromethanesulfonyl)imide.
咪唑鎓鹽:1-乙基-3-甲基咪唑鎓 六氟磷酸鹽、1-乙基-3-甲基咪唑鎓 對-甲苯磺酸鹽、1-乙基-3-甲基咪唑鎓 雙(氟磺醯基)亞胺、1-乙基-3-甲基咪唑鎓 雙(三氟甲磺醯基)亞胺、1-丁基-3-甲基咪唑鎓 甲磺酸鹽、1-丁基-3-甲基咪唑鎓 雙(氟磺醯基)亞胺。 Imidazolium salt: 1-ethyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium p-toluenesulfonate, 1-ethyl-3-methylimidazolium bis (Fluorosulfonyl)imine, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imine, 1-butyl-3-methylimidazolium methanesulfonate, 1- Butyl-3-methylimidazolium bis(fluorosulfonyl)imine.
吡咯啶鎓鹽:N-丁基-N-甲基吡咯啶鎓 六氟磷酸鹽、N-丁基-N-甲基吡咯啶鎓 雙(氟磺醯基)亞胺、N-丁基-N-甲基吡咯啶鎓 雙(三氟甲磺醯基)亞胺。 Pyrrolidinium salt: N-butyl-N-methylpyrrolidinium hexafluorophosphate, N-butyl-N-methylpyrrolidinium bis(fluorosulfonyl)imide, N-butyl-N -Methylpyrrolidinium bis(trifluoromethanesulfonyl)imine.
四級銨鹽:四丁基銨 六氟磷酸鹽、四丁基銨 對-甲苯磺酸鹽、(2-羥基乙基)三甲基銨 雙(三氟甲磺醯基)亞胺、(2-羥基乙基)三甲基銨 二甲基亞膦酸鹽。 Quaternary ammonium salt: tetrabutylammonium hexafluorophosphate, tetrabutylammonium p-toluenesulfonate, (2-hydroxyethyl)trimethylammonium bis(trifluoromethanesulfonyl)imide, (2 -Hydroxyethyl)trimethylammonium dimethylphosphonite.
列舉具有無機陽離子之離子性化合物之例時,係如下述者。 When an example of an ionic compound having an inorganic cation is given, it is as follows.
溴化鋰、碘化鋰、四氟硼酸鋰、六氟磷酸鋰、硫氰酸鋰、高氯酸鋰、三氟甲磺酸鋰、雙(氟磺醯基)亞胺鋰、雙(三氟甲磺醯基)亞胺鋰、雙(五氟乙磺醯基)亞胺鋰、三(三氟甲磺醯基)甲基化鋰、對-甲苯磺酸鋰、六氟磷酸鈉、雙(氟磺醯基)亞胺鈉、雙(三氟甲磺醯基)亞胺鈉、對-甲苯磺酸鈉、六氟磷酸鉀、 雙(氟磺醯基)亞胺鉀、雙(三氟甲磺醯基)亞胺鉀、對-甲苯磺酸鉀。 Lithium bromide, lithium iodide, lithium tetrafluoroborate, lithium hexafluorophosphate, lithium thiocyanate, lithium perchlorate, lithium trifluoromethanesulfonate, lithium bis(fluorosulfonyl)imide, bis(trifluoromethanesulfonyl) Lithium imide, lithium bis(pentafluoroethanesulfonyl)imide, lithium tris(trifluoromethanesulfonyl)methide, lithium p-toluenesulfonate, sodium hexafluorophosphate, bis(fluorosulfonyl) Sodium imide, sodium bis(trifluoromethanesulfonyl)imide, sodium p-toluenesulfonate, potassium hexafluorophosphate, potassium bis(fluorosulfonyl)imide, bis(trifluoromethanesulfonyl) sodium Potassium amine, potassium p-toluenesulfonate.
從抗靜電性的持續性之觀點,離子性化合物係以具有30℃以上,甚至35℃以上之融點者為佳。另一方面,從與活性能量射線硬化性成分之相溶性的觀點,離子性化合物係以具有90℃以下之融點為佳,以70℃以下更佳,以未達50℃又更佳。 From the standpoint of the continuity of antistatic properties, the ionic compound preferably has a melting point above 30°C, or even above 35°C. On the other hand, from the viewpoint of compatibility with active energy ray-curable components, the ionic compound preferably has a melting point below 90°C, more preferably below 70°C, and even more preferably below 50°C.
相對於活性能量射線硬化性成分100重量份,離子性化合物之調配比例係以0.2至8重量份為佳,以0.2至5重量份更佳。離子性化合物之含量為0.2重量份以上者,對提高抗靜電性有利,含量為8重量份以下者,對提高黏著劑層之耐久性有利。 Relative to 100 parts by weight of the active energy ray hardening component, the blending ratio of the ionic compound is preferably 0.2 to 8 parts by weight, more preferably 0.2 to 5 parts by weight. The content of the ionic compound is 0.2 parts by weight or more, which is beneficial to improve the antistatic property, and the content of the ionic compound is less than 8 parts by weight, which is beneficial to improve the durability of the adhesive layer.
當附有黏著劑層之剝離膜20的黏著劑層12係貼附在玻璃構成之光學組件30時,為了提高黏著劑層12與玻璃之密接性,活性能量射線硬化型黏著劑組成物可進一步含有矽烷化合物。矽烷化合物係可單獨使用1種,亦可併用2種以上。 When the
矽烷化合物方面,可列舉例如:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲 氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-甲基丙烯醯基氧基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基二甲氧基甲基矽烷、3-環氧丙氧基丙基乙氧基二甲基矽烷等。 As for the silane compound, for example, vinyl trimethoxy silane, vinyl triethoxy silane, methacryloxy propyl trimethoxy silane, vinyl tris(2-methoxyethoxy) silane , N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3- Aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxy Cyclohexyl) ethyl trimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-Mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyldimethyl Oxymethyl silane, 3-glycidoxy propyl ethoxy dimethyl silane, etc.
矽烷化合物可為聚矽氧低聚物型者。聚矽氧低聚物方面可列舉例如以下者。 The silane compound may be a polysiloxane oligomer type. Examples of the polysiloxane oligomer include the following.
3-巰基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-巰基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-巰基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-巰基丙基三乙氧基矽烷-四乙氧基矽烷共聚物等之含巰基丙基的共聚物;巰基甲基三甲氧基矽烷-四甲氧基矽烷共聚物、巰基甲基三甲氧基矽烷-四乙氧基矽烷共聚物、巰基甲基三乙氧基矽烷-四甲氧基矽烷共聚物、巰基甲基三乙氧基矽烷-四乙氧基矽烷共聚物等之含巰基甲基的共聚物;3-環氧丙氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚 物、3-環氧丙氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等之含3-環氧丙氧基丙基的共聚物;3-甲基丙烯醯基氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二乙氧基矽烷-四甲氧 基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等之含甲基丙烯醯基氧基丙基的共聚物;3-丙烯醯基氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等之含丙烯醯基氧基丙基的共聚物;乙烯基三甲氧基矽烷-四甲氧基矽烷共聚物、乙烯基三甲氧基矽烷-四乙氧基矽烷共聚物、乙烯基三乙氧基矽烷-四甲氧基矽烷共聚物、乙烯基三乙氧基矽烷-四乙氧基矽烷共聚物、乙烯基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、 乙烯基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、乙烯基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、乙烯基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等之含乙烯基的共聚物;3-胺基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等之含胺基的共聚物等。 3-Mercaptopropyltrimethoxysilane-tetramethoxysilane copolymer, 3-mercaptopropyltrimethoxysilane-tetraethoxysilane copolymer, 3-mercaptopropyltriethoxysilane-tetramethoxysilane Mercapto propyl-containing copolymers such as 3-mercaptopropyl triethoxysilane-tetraethoxysilane copolymer; mercaptomethyltrimethoxysilane-tetramethoxysilane copolymer, mercapto group Methyltrimethoxysilane-tetraethoxysilane copolymer, mercaptomethyltriethoxysilane-tetramethoxysilane copolymer, mercaptomethyltriethoxysilane-tetraethoxysilane copolymer, etc. Mercaptomethyl-containing copolymer; 3-glycidoxypropyltrimethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropyltrimethoxysilane-tetraethoxysilane copolymer , 3-glycidoxypropyltriethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropyltriethoxysilane-tetraethoxysilane copolymer, 3- Glycidoxypropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropylmethyldimethoxysilane-tetraethoxysilane copolymer, 3- Containing glycidoxypropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropylmethyldiethoxysilane-tetraethoxysilane copolymer, etc. Copolymer of 3-glycidoxypropyl; 3-methacryloxypropyl trimethoxysilane-tetramethoxysilane copolymer, 3-methacryloxypropyl trimethoxy Silane-tetraethoxysilane copolymer, 3-methacryloxypropyl triethoxysilane-tetramethoxysilane copolymer, 3-methacryloxypropyl triethoxy Silane-tetraethoxysilane copolymer, 3-methacryloxypropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3-methacryloxypropylmethyl Dimethoxysilane-tetraethoxysilane copolymer, 3-methacryloxypropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3-methacryloxysilane Methacryloxypropyl-containing copolymers such as propylmethyldiethoxysilane-tetraethoxysilane copolymers, etc.; 3-propenyloxypropyl trimethoxysilane-tetramethyl Oxysilane copolymer, 3-propenyloxypropyltrimethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropyltriethoxysilane-tetramethoxysilane copolymer , 3-propenyloxypropyltriethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3 -Acrylicoxypropylmethyldimethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3 -Acrylicoxypropylmethyldiethoxysilane-tetraethoxysilane copolymer and other acryloxypropyl-containing copolymers; vinyltrimethoxysilane-tetramethoxysilane copolymer Compounds, vinyl trimethoxysilane-tetraethoxysilane copolymer, vinyl triethoxysilane-tetramethoxysilane copolymer, vinyl triethoxysilane-tetraethyl Oxysilane copolymer, vinylmethyldimethoxysilane-tetramethoxysilane copolymer, vinylmethyldimethoxysilane-tetraethoxysilane copolymer, vinylmethyldiethoxy Silane-tetramethoxysilane copolymer, vinyl methyl diethoxysilane-tetraethoxysilane copolymer and other vinyl-containing copolymers; 3-aminopropyltrimethoxysilane-tetramethoxysilane Silane copolymer, 3-aminopropyltrimethoxysilane-tetraethoxysilane copolymer, 3-aminopropyltriethoxysilane-tetramethoxysilane copolymer, 3-aminopropyl Triethoxysilane-tetraethoxysilane copolymer, 3-aminopropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3-aminopropylmethyldimethoxysilane- Tetraethoxysilane copolymer, 3-aminopropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3-aminopropylmethyldiethoxysilane-tetraethoxysilane copolymer Amine group-containing copolymers, etc.
相對於活性能量射線硬化性成分100重量份,矽烷化合物之含有比例一般為0.01至10重量份,以0.05至5重量份為佳。矽烷化合物之含量為0.01重量份以上時,可容易得到提高黏著劑層12與玻璃之密接性的效果。而且,含量為10重量份以下時,可抑制矽烷化合物自黏著劑層12的滲出。 The content ratio of the silane compound is generally 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, relative to 100 parts by weight of the active energy ray curable component. When the content of the silane compound is 0.01 parts by weight or more, the effect of improving the adhesion between the
活性能量射線硬化型黏著劑組成物係可含有1種或2種以上之溶劑(芳香族系烴、脂肪族系烴、酮類、酯類等)、交聯觸媒、耐候穩定劑、增黏劑、塑化劑、軟化劑、染料、顏料、無機填料、光散射性微粒、賦黏劑等之其它的添加劑。 The active energy ray-curable adhesive composition system may contain one or more solvents (aromatic hydrocarbons, aliphatic hydrocarbons, ketones, esters, etc.), crosslinking catalysts, weathering stabilizers, and thickening Other additives such as agents, plasticizers, softeners, dyes, pigments, inorganic fillers, light-scattering particles, tackifiers, etc.
(3)活性能量射線硬化型黏著劑組成物之塗佈 (3) Coating of active energy ray hardening adhesive composition
使用塗佈裝置50對剝離膜10塗佈活性能量射線硬化型黏著劑組成物之方法並無特別限制,可使用例如:狹縫模法、反向凹版塗佈法、微凹版法、浸漬法、輥塗法、柔版印刷法等。由活性能量射線硬化型黏著劑組成物所構成之塗佈層11之厚度,係使附有黏著劑層的剝離膜20之黏著劑層12之厚度成為下述範圍之方式而調整。 The method of applying the active energy ray-curable adhesive composition to the
如第1圖所示,塗佈步驟,更具體而言,可為在自第1進料輥1連續捲出之長條的剝離膜10之一面連續塗佈活性能量射線硬化型黏著劑組成物之步驟。此時,如第1圖所示,可將剝離膜10一面纏繞在塗佈用輥60,且同時塗佈活性能量射線硬化型黏著劑組成物。 As shown in Figure 1, the coating step, more specifically, can be continuous coating of the active energy ray-curable adhesive composition on one side of the
[曝光步驟] [Exposure Step]
本步驟係一面連續地運送具有塗佈層11之剝離膜15,且同時對該塗佈層11照射活性能量射線,藉此施行圖案曝光,得到具有黏著劑層12之附有黏著劑層之剝離膜20的步驟(參照第1圖及第3圖)。通過本步驟而連續地製造具有黏著劑層12之附有黏著劑層的剝離膜20作為附有剝離膜之光學組件的中間體。活性能量射線係以紫外線為佳。 In this step, the peeling
在經由活性能量射線照射並經由圖案曝光的黏著劑層12,形成已曝光之第1區域12a、與曝光量小於該第1區域12a之第2區域12b(第3圖)。第2區域12b 可為未曝光之區域,然較佳者係只要曝光量小於第1區域12a的一定程度的曝光,並經由活性能量射線的照射使硬化反應有一定程度的進行之區域。 In the
黏著劑層12中之第1區域12a與第2區域12b之配置圖案係可依據所使用之可撓式顯示器的彎折樣態而選擇。可撓式顯示器的彎折樣態之例呈示於第4圖。第4圖(a)係可捲繞之可撓式顯示器,第4圖(b)係可折疊的可撓式顯示器。 The arrangement pattern of the
包含第1區域12a與第2區域12b之黏著劑層12如第1圖所示,可藉由隔著遮罩81而從曝光裝置(活性能量射線照射裝置)80將活性能量射線照射於塗佈層11之方法所形成。可將活性能量射線對塗佈層11進行複數次之照射。藉由適當地選擇所使用之遮罩81的狹縫形狀及特性、隔著遮罩81之活性能量射線的照射方法等,即可得到第1區域12a與第2區域12b之配置圖案為所期望的圖案。如欲呈示有關第1區域12a與第2區域12b之配置圖案、及隔著遮罩81之活性能量射線的照射方法等之具體例,係如以下所示者。 The
a)第5圖係呈示隔著遮光罩81a在塗佈層11照射活性能量射線的狀態之概略俯視圖。箭頭係顯示具有塗佈層11之剝離膜15的運送方向。遮光罩81a係具有沿著具塗佈層11之剝離膜15的長度方向(運送方向)之方向延伸的複數個狹縫(貫穿部)85,該等複數個狹縫85係沿著膜寬度方向排列。曝光裝置(活性能量射線照射裝置)80係對著遮光罩81a而固定。如將來自曝光裝置80之活性能量射線隔著遮光罩81a照射在具有塗佈層11之剝離膜15時,可得到第1區域12a與第2區域12b係如第6圖(a)所配置的黏著劑層12。該配置圖案有利於第4圖(a)所示之可捲繞的可撓式顯示器,藉由如第6圖(a)所示之略垂直於捲繞方向之方向延伸的第1區域12a與第2區域12b的交替配置,即可緩和捲繞時的應力,藉此,可良好地維持黏著劑層12與於其相鄰的組件之間的密接性。
a) Fig. 5 is a schematic plan view showing a state where the
b)如使用留著寬度方向的中央部而將其它部分作為貫穿部(狹縫)之遮罩81時,即可得到第1區域12a與第2區域12b之例如第6圖(b)所配置之黏著劑層12。該配置圖案有利於第4圖(b)所示之可折疊的可撓式顯示器,藉由在對應折疊部的位置設置第2區域12b,即可緩和折疊時的應力,藉此,可在黏著劑層12與於此相鄰的組件之間良好地維持密接性。
b) If a
c)使用如第5圖所示之遮光罩81a之具有狹縫的遮光罩照射1次的活性能量射線時,遮光的區域即成為未曝光(曝光量為0)之第2區域12b。另一方面,如第7圖所示,隔著具有狹縫85之遮光罩81a照射活性能量射線後(第7圖(a))、未隔著遮罩而在塗佈層11全面照射活性能量射線(第7圖(b))之複數次照射法,依此,即可作成第2區域12b經曝光的區域。第7圖(b)之步驟與第7圖(a)之步驟的順序可顛倒。
c) When an active energy ray is irradiated once with the
d)如第8圖所示,隔著半色調遮罩81b照射活性能量射線時,即可在1次的照射下形成經曝光的第2區域12b。半色調遮罩81b係指具有活性能量射線之透過量較大的區域82與更小(不為0)的區域83之遮罩。 d) As shown in Fig. 8, when the active energy ray is irradiated through the
e)第9圖至第12圖係呈示第1區域12a及第2區域12b之配置圖案的其它例。第1區域12a及第2區域12b之延伸方向可為對膜的運送方向(或是將附有剝離膜之光學組件40作成片狀體時,例如為短邊方向)為平行者(第9圖)。 e) Figures 9 to 12 show other examples of the arrangement patterns of the
第1區域12a及第2區域12b之寬度並無特別限制,該等有複數個存在時,可互為相同(第10圖(a))或不同(第10圖(b))。黏著劑層12之表面所佔的第1區域12a之比例並無特別限制,可將相鄰的第1區域12a間的距離縮短(第11圖(a))、或增長(第11圖(b))。又如第12圖所示,第1區域12a及/或第2區域12b可沿著一定方向使曝光量逐漸地變化。若具有如此的漸層(gradation),即可減少第1區域12a與第2區域12b之邊界處的黏著劑層12之儲存模數的變化(差),由此而可得到黏著劑層12對彎折的耐久性。曝光量逐次地發生變化之第1區域12a及/或第2區域12b係可藉由隔著漸層遮罩照射活性能量射線而形成。漸層遮罩係沿著一定方向使活性能量射線之透過量逐次地發生變化之遮罩。 The widths of the
照射在塗佈層11之活性能量射線的光源並無特別限定,以在波長400nm以下具有發光分佈的紫外線為佳,具體上係可使用低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、化學燈、黑光燈、微波激發水銀燈、金屬鹵素燈、LED型紫外線燈等。
The light source of the active energy rays irradiated on the
活性能量射線在塗佈層11的照射強度例如為1至1000mW/cm2。而且,作為光照射強度與光照射時間之積所表示的累積光量例如為10至5000mJ/cm2。
The irradiation intensity of the active energy ray on the
經由曝光步驟所得到的附有黏著劑層之剝離膜20所具有的黏著劑層12之厚度,例如為1至200μm,以5至35μm為佳。黏著劑層12之厚度在200μm以下者,從顯示器的薄型化及活性能量射線的照射效率之點為有利。又該厚度在5μm以上者,將其作為可撓式顯示器而彎折時應力緩和之點為有利,與相鄰的光學組件之密接性變佳。
The thickness of the
[貼合步驟] [Fitting Steps]
本步驟係在附有黏著劑層之剝離膜20之黏著劑層12的外表面貼合光學組件30,得到附有剝離膜之光學組件40的步驟(參照第1圖及第13圖)。如第13圖所示,附有剝離膜之光學組件40係將附有黏著劑層之剝離膜20經由該黏著劑層12積層貼合在光學組件30之表面者。根據本發明所得的附有剝離膜之光學組件40,將剝離膜10剝離去除,經由露出之黏著劑層12貼合在圖像顯示單元等其它光學組件而成的可撓式顯示器即使彎折,在黏著劑層與於其相鄰的組件(光學組件30、及圖像顯示單元等其它的光學組件)之間亦可維持良好的密接性。因此,使用本發明所得的附有剝離膜之光學組件40的可撓式顯示器,可成為耐久性及信賴性優異者。 This step is a step of attaching the
貼合步驟具體上係可如以下方式進行。接著將經曝光步驟所得之長條的附有黏著劑層之剝離膜20連續地運送,同時從第2進料輥2捲出長條的光學組件30並連續地運送,將光學組件積層在附有黏著劑層之剝離膜20的黏著劑層12之外表面而作成積層體。藉由將該積層體使用一對貼合輥90等自上下擠壓而連續地製造附有剝離膜之光學組件40。從黏著劑層12與光學組件30之密接性的觀點上,經曝光步驟而得的附有黏著劑層之剝離膜20,係以不會一度捲成卷狀而供給至與光學組件30的貼合步驟者為佳,亦可依所需而施行表面活化處理等之後供給至與光學組件30的貼合步驟。 The bonding step can be specifically carried out in the following manner. Next, the long strip of adhesive layer-attached
第1圖係呈示在光學組件30之單面貼合附有黏著劑層的剝離膜20之例,然亦可在光學組件30之兩面貼合附有黏著劑層的剝離膜20。 FIG. 1 shows an example in which the
在光學組件30之兩面貼合附有黏著劑層的剝離膜20時,兩面之附有黏著劑層的剝離膜20可同時貼合,亦可階段性地貼合。 When the adhesive layer-attached
光學組件30係可併入可撓式顯示器的光學組件,例如可為單層或多層構造的光學膜等。光學膜之具體例係包含:偏光膜;光學補償膜(相位差膜等)、抗反射膜(片)、光擴散膜(片)、反射膜(片)等之光學機能性膜;偏光膜用保護膜;偏光板;玻璃膜(包含玻璃片及玻璃基板)等。光學組件30係以偏光板為佳。 The
偏光板係可為在偏光膜之至少一面經由接著劑層貼合保護膜者。該保護膜可兼具如相位差膜之作為光學補償膜的機能。偏光板可為在偏光膜之至少一面積層有由硬化性樹脂所形成的硬化性樹脂層者。而且,亦可在偏光膜上、保護膜或硬化樹脂層上,經由接著劑層或黏著劑層,積層有例如:如相位差膜、增亮膜之其它的光學機能性膜。 The polarizing plate may be one where a protective film is attached to at least one side of the polarizing film via an adhesive layer. The protective film can have the function of a retardation film as an optical compensation film. The polarizing plate may have a curable resin layer formed of a curable resin layered on at least one area of the polarizing film. Moreover, it is also possible to laminate other optically functional films such as retardation film and brightness enhancement film via an adhesive layer or an adhesive layer on a polarizing film, a protective film, or a cured resin layer.
亦可在偏光膜上、保護膜或硬化樹脂層上積層保護膜。保護膜係以保護光學組件而防止表面的刮傷及灰塵之目的而暫時附著於光學組件的可剝離之膜,一般係由包含熱塑性樹脂之基材膜與積層在其上之黏著劑層所構成。 It is also possible to laminate a protective film on a polarizing film, a protective film, or a cured resin layer. The protective film is a peelable film temporarily attached to the optical component for the purpose of protecting the optical component from scratches and dust on the surface. It is generally composed of a base film containing a thermoplastic resin and an adhesive layer laminated on it. .
偏光膜係具有從射入的天然光取出直線偏光的機能之膜,較佳之例係在經單軸延伸之聚乙烯醇系樹脂膜吸附定向碘或二色性染料等之二色性色素者。偏光膜之厚度並無特別限制,惟一般為2至35μm。 The polarizing film is a film having the function of extracting linearly polarized light from incident natural light, and a preferred example is one that adsorbs dichroic pigments such as directional iodine or dichroic dyes on a uniaxially stretched polyvinyl alcohol resin film. The thickness of the polarizing film is not particularly limited, but is generally 2 to 35 μm.
保護膜可為具有透光性(以光學透明者為佳)之熱塑性樹脂膜。熱塑性樹脂之具體例係包含:如鏈狀聚烯烴系樹脂(聚丙烯系樹脂等)、環狀聚烯烴系樹脂(降莰烯系樹脂等)之聚烯烴系樹脂;聚酯系樹脂(聚對苯二甲酸乙二酯系樹脂等);(甲基)丙烯酸系樹脂(甲基丙烯酸甲酯系樹脂等);纖維素系樹脂(如三乙酸纖維素、二乙酸纖維素之乙酸纖維素系樹脂等);聚碳酸酯系樹脂;聚乙烯醇系樹脂;聚乙酸乙烯酯系樹脂;聚芳酯系樹脂;聚苯乙烯系樹 脂;聚醚碸系樹脂;聚碸系樹脂;聚醯胺系樹脂;聚醯亞胺系樹脂;以及該等之混合物、共聚物。保護膜之厚度例如為5至200μm左右,以10至150μm為佳,以15至100μm更佳。 The protective film may be a thermoplastic resin film with light transmittance (optically transparent is preferred). Specific examples of thermoplastic resins include: polyolefin resins such as chain polyolefin resins (polypropylene resins, etc.), cyclic polyolefin resins (norbornene resins, etc.); polyester resins (poly Ethylene phthalate resins, etc.); (meth)acrylic resins (methyl methacrylate resins, etc.); cellulose resins (such as cellulose acetate resins such as cellulose triacetate and cellulose diacetate) Etc.); polycarbonate resins; polyvinyl alcohol resins; polyvinyl acetate resins; polyarylate resins; polystyrene resins; polyether turquoise resins; poly turquoise resins; polyamide resins ; Polyimide resins; and mixtures and copolymers of these. The thickness of the protective film is, for example, about 5 to 200 μm, preferably 10 to 150 μm, and more preferably 15 to 100 μm.
硬化樹脂層係由熱硬化性樹脂或活性能量射線硬化性樹脂等之硬化性樹脂所形成。硬化性樹脂可為包含熱聚合性化合物者、可為包含陽離子聚合性化合物者、可為包含自由基聚合性化合物者,亦可為包含該等複數種類者。硬化樹脂層之厚度例如為0.1至10μm左右,以1至5μm為佳。 The curable resin layer is formed of curable resin such as thermosetting resin or active energy ray curable resin. The curable resin may include a thermopolymerizable compound, may include a cation polymerizable compound, may include a radical polymerizable compound, or may include a plurality of these types. The thickness of the hardened resin layer is, for example, about 0.1 to 10 μm, preferably 1 to 5 μm.
偏光膜之兩面貼合有保護膜的情況時,該等保護膜係可由相同種類之熱塑性樹脂所構成,亦可由不同種類之熱塑性樹脂所構成。而且,厚度可為相同或不同。偏光膜之兩面積層有硬化樹脂層時,該等硬化樹脂層可由相同種類之硬化性樹脂層所構成,亦可由不同種類之硬化性樹脂層所構成。而且,厚度可為相同或不同。保護膜或硬化樹脂層可具有如硬塗層、防眩層、抗反射層、光擴散層、抗靜電層、防污層、導電層之表面處理層(塗佈層)。偏光膜之單面貼合有保護膜時或積層有硬化樹脂層時,附有黏著劑層之剝離膜20之黏著劑層12可直接貼合在偏光膜面。 When protective films are laminated on both sides of the polarizing film, the protective films may be composed of the same type of thermoplastic resin, or may be composed of different types of thermoplastic resins. Moreover, the thickness may be the same or different. When the two area layers of the polarizing film have hardened resin layers, the hardened resin layers may be composed of the same type of curable resin layers, or may be composed of different types of curable resin layers. Moreover, the thickness may be the same or different. The protective film or the hardened resin layer may have a surface treatment layer (coating layer) such as a hard coat layer, an anti-glare layer, an anti-reflection layer, a light diffusion layer, an antistatic layer, an antifouling layer, and a conductive layer. When a protective film is attached to one side of the polarizing film or a hardened resin layer is laminated, the
相位差膜係顯示光學各向異性之光學膜,可為:由上述保護膜中可使用之樹脂等所構成的熱塑性樹脂膜之單軸或雙軸延伸膜、藉由在熱塑性樹脂膜塗佈液晶 性化合物並定向而顯示光學各向異性之膜、藉由在熱塑性樹脂膜塗佈無機層狀化合物而顯示光學各向異性之膜等。 The retardation film is an optical film showing optical anisotropy. It can be a uniaxially or biaxially stretched film of a thermoplastic resin film composed of resins that can be used in the protective film, etc., by coating liquid crystal on the thermoplastic resin film A film that shows optical anisotropy by aligning a sex compound, a film that shows optical anisotropy by coating an inorganic layered compound on a thermoplastic resin film, and the like.
保護膜(或相位差膜等)可隔著接著劑層貼合在偏光膜。形成接著劑層之接著劑方面,可使用水系接著劑、活性能量射線硬化性接著劑或熱硬化性接著劑,以水系接著劑、活性能量射線硬化性接著劑為佳。 The protective film (or retardation film, etc.) can be bonded to the polarizing film via an adhesive layer. Regarding the adhesive for forming the adhesive layer, a water-based adhesive, an active energy ray-curable adhesive, or a thermosetting adhesive can be used, and a water-based adhesive or an active energy ray-curable adhesive is preferable.
水系接著劑方面,係可列舉如:包含聚乙烯醇系樹脂水溶液之接著劑、水系二液型聚胺酯系乳液接著劑等。其中以包含聚乙烯醇系樹脂水溶液之水系接著劑為適用。聚乙烯醇系樹脂方面,除了為乙酸乙烯酯均聚物的聚乙酸乙烯酯經皂化處理而得的乙烯醇均聚物以外,亦可使用乙酸乙烯酯及可與其共聚之其它單體的共聚物經皂化處理而得的聚乙烯醇系共聚物、或該等之羥基經部分改質的改質聚乙烯醇系聚合物等。水系接著劑可包含:醛化合物(乙二醛等)、環氧化合物、三聚氰胺系化合物、羥甲基化合物、異氰酸酯化合物、胺化合物、多價金屬鹽等之交聯劑。 With regard to the water-based adhesive, for example, an adhesive containing a polyvinyl alcohol-based resin aqueous solution, an aqueous two-component polyurethane-based emulsion adhesive, and the like can be cited. Among them, an aqueous adhesive containing a polyvinyl alcohol-based resin aqueous solution is suitable. For polyvinyl alcohol resins, in addition to vinyl alcohol homopolymers obtained by saponification of polyvinyl acetate, which is a homopolymer of vinyl acetate, copolymers of vinyl acetate and other monomers copolymerizable with it can also be used. Polyvinyl alcohol-based copolymers obtained by saponification treatment, or modified polyvinyl alcohol-based polymers in which the hydroxyl groups are partially modified. The aqueous adhesive may include crosslinking agents such as aldehyde compounds (glyoxal, etc.), epoxy compounds, melamine compounds, methylol compounds, isocyanate compounds, amine compounds, and polyvalent metal salts.
使用水系接著劑時,將偏光膜與保護膜貼合之後,以實施用以去除水系接著劑中所含之水的乾燥步驟者為佳。乾燥步驟後,可設置例如在20至45℃左右之溫度進行熟化之熟化步驟。 When using a water-based adhesive, it is preferable to perform a drying step for removing water contained in the water-based adhesive after bonding the polarizing film and the protective film. After the drying step, a aging step for aging at a temperature of about 20 to 45° C. can be set.
上述活性能量射線硬化性接著劑係指照射如紫外線、可見光、X射線、電子束之活性能量射線而硬化之接著劑,可列舉例如:包含聚合性化合物及光聚合起 始劑之硬化性組成物、包含光反應性樹脂之硬化性組成物、包含黏合劑樹脂及光反應性交聯劑之硬化性組成物等。以紫外線硬化性接著劑為佳。聚合性化合物方面,可列舉如:如光硬化性環氧系單體、光硬化性(甲基)丙烯酸系單體、光硬化性聚胺酯系單體之光聚合性單體;源自光聚合性單體之低聚物。光聚合起始劑方面,可列舉如:包含經活性能量射線之照射而產生如中性自由基、陰離子自由基、陽離子自由基之活性物種的物質者。作為包含聚合性化合物及光聚合起始劑之活性能量射線硬化性接著劑,較佳可使用:包含光硬化性環氧系單體及光陽離子聚合起始劑之硬化性組成物;包含光硬化性(甲基)丙烯酸系單體及光自由基聚合起始劑之硬化性組成物;包含光硬化性環氧系單體、光硬化性(甲基)丙烯酸系單體、光陽離子聚合起始劑及光自由基聚合起始劑之硬化性組成物。 The active energy ray curable adhesive refers to an adhesive that is cured by irradiating active energy rays such as ultraviolet rays, visible light, X-rays, and electron beams. Examples include: curable compositions containing polymerizable compounds and photopolymerization initiators. , Curable composition containing photoreactive resin, curable composition containing binder resin and photoreactive crosslinking agent, etc. UV curable adhesive is preferred. In terms of polymerizable compounds, for example, photopolymerizable monomers such as photocurable epoxy monomers, photocurable (meth)acrylic monomers, and photocurable polyurethane monomers; derived from photopolymerizable monomers Monomer oligomers. As for the photopolymerization initiator, for example, a substance containing active species such as neutral radicals, anionic radicals, and cationic radicals generated by irradiation with active energy rays can be cited. As an active energy ray curable adhesive containing a polymerizable compound and a photopolymerization initiator, it is preferable to use: a curable composition containing a photocurable epoxy-based monomer and a photocationic polymerization initiator; including photocuring Curable composition of (meth)acrylic monomers and photo-radical polymerization initiators; including photo-curing epoxy monomers, photo-curing (meth)acrylic monomers, photo-cationic polymerization initiators It is a curable composition of an initiator and a photo-radical polymerization initiator.
在使用活性能量射線硬化性接著劑時,將偏光膜與保護膜貼合之後,可依所需進行乾燥步驟(惟活性能量射線硬化性接著劑可為實質上不含溶劑成分之無溶劑型接著劑),接著實施藉由照射活性能量射線使活性能量射線硬化性接著劑硬化之硬化步驟。活性能量射線之光源並無特別限定,以在波長400nm以下具有發光分佈之紫外線為佳,具體上係可使用低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、化學燈、黑光燈、微波激發水銀燈、金屬鹵素燈等。 When using an active energy ray curable adhesive, after bonding the polarizing film and the protective film, a drying step can be carried out as needed (but the active energy ray curable adhesive can be a solvent-free adhesive that contains substantially no solvent components. Agent), followed by a curing step of curing the active energy ray-curable adhesive by irradiating active energy rays. The light source of active energy rays is not particularly limited. Ultraviolet rays with a luminous distribution below 400nm wavelength are preferred. Specifically, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, chemical lamps, black light lamps, and microwave excitation can be used. Mercury lamps, metal halide lamps, etc.
在保護膜的貼合之前,為了提高接著性, 可在偏光膜及保護膜之至少任一者的貼合面施行如電暈處理、電漿處理、紫外線照射處理、火焰處理、皂化處理、底漆層形成處理之表面活化處理。 Before lamination of the protective film, in order to improve the adhesion, corona treatment, plasma treatment, ultraviolet irradiation treatment, flame treatment, saponification treatment, and bottoming can be applied to the bonding surface of at least any one of the polarizing film and the protective film. Surface activation treatment of lacquer layer formation treatment.
偏光膜之兩面貼合有保護膜時,用以貼合該等保護膜之接著劑可為相同種類之接著劑,亦可為不同種類之接著劑。 When protective films are attached to both sides of the polarizing film, the adhesive used to attach the protective films may be the same type of adhesive or different types of adhesives.
[其它步驟] [Other steps]
(1)乾燥步驟 (1) Drying step
本發明之製造方法在塗佈步驟與曝光步驟之間,可具有使附有塗佈層11之剝離膜15的塗佈層11乾燥(溶劑揮發)之乾燥步驟。該乾燥步驟一般係在塗佈層11(活性能量射線硬化型黏著劑組成物)包含溶劑時實施。乾燥步驟係參照第1圖,可將具有經塗佈步驟而得之塗佈層11的長條剝離膜15連續地持續運送,並通過(導入)乾燥手段70而實施。 The manufacturing method of the present invention may include a drying step of drying (solvent volatilization) the
乾燥手段70如為可使溶劑揮發之手段者,則無特別限制,例如為乾燥爐(加熱爐)。乾燥爐除了加熱手段,可進一步包含減壓手段。供給至乾燥爐內的熱風之風量、乾燥爐內之溫度及壓力等的乾燥條件係考量塗佈層11中所含的溶劑種類、平滑度、結露等之乾燥後的面狀態而適當地設定。乾燥溫度(例如乾燥爐內的溫度)一般為50至120℃,以60至110℃為佳。 The drying means 70 is not particularly limited as long as it can volatilize the solvent, and it is, for example, a drying furnace (heating furnace). In addition to heating means, the drying furnace may further include pressure reduction means. Drying conditions such as the amount of hot air supplied into the drying furnace, the temperature and pressure in the drying furnace, and the like are appropriately set in consideration of the type of solvent contained in the
(2)表面活化步驟 (2) Surface activation step
本發明之製造方法係在貼合步驟之前,可進一步包含 表面活化步驟,更具體言之,係在曝光步驟與貼合步驟之間,在光學組件30與黏著劑層12之貼合面及黏著劑層12與光學組件30之貼合面的至少一面進行能量照射。表面活化步驟中之表面活化處理可為電暈處理、電漿處理、紫外線照射處理、火焰處理、皂化處理等。 The manufacturing method of the present invention may further include a surface activation step before the bonding step, more specifically, between the exposure step and the bonding step, on the bonding surface of the
在光學組件30與黏著劑層12之貼合面及黏著劑層12與光學組件30之貼合面的兩者施行表面活化處理時,該等之表面活化處理,由黏著劑層12與光學組件30之密接性之觀點,較佳係在曝光步驟後,附有黏著劑層的剝離膜20到達貼合步驟為止的時間、與表面活化處理後之光學組件30到達貼合步驟為止的時間為相同、或大致相同之時機點實施。而且,由黏著劑層12與光學組件30之密接性之觀點,從在表面活化步驟進行能量照射,直到在貼合步驟將上述積層體使用一對貼合輥90等進行擠壓為止之時間,係以5秒以下為佳。表面活化處理可在上述貼合面進行複數次。 When both the bonding surface of the
(3)捲繞步驟及熟化步驟 (3) Winding step and curing step
本發明之製造方法係可包含藉由將經由貼合步驟而得的長條之附有剝離膜的光學組件40纏繞在捲繞輥3捲繞成卷狀而成為膜卷之捲繞步驟(參照第1圖)。而且,本發明之製造方法亦可包含在捲繞步驟後以卷狀態進行黏著劑層12之熟化(熟成)之熟化步驟。藉由實施熟化步驟而促進黏著劑層12之硬化反應,可提高黏著劑層12之黏著力。而且,藉由使黏著劑層12於密接光學組件30之狀態下進行 熟化(黏著劑之硬化反應)而改善與光學組件30之相互作用(包含化學反應)及黏著劑對光學組件30之浸濕性,因此,可進一步提高黏著劑層12與光學組件30之密接性。熟化溫度例如為20至45℃。 The manufacturing method of the present invention may include a winding step of winding the long strip of release film-attached
(4)與其它光學組件之貼合步驟 (4) Bonding steps with other optical components
本發明之製造方法係可包含由附有剝離膜之光學組件40剝離去除剝離膜10之剝離步驟、以及在經由剝離步驟而露出之黏著劑層12的表面貼合光學組件以外之其它光學組件的貼合步驟(第2貼合步驟)。在剝離步驟後,第2貼合步驟之前,可在黏著劑層12及上述其它光學組件的貼合面之至少任一面施行電暈處理、電漿處理、紫外線照射處理、火焰處理、皂化處理、底漆層形成處理等表面處理。 The manufacturing method of the present invention may include a peeling step of removing the peeling
上述其它光學組件係可納入可撓式顯示器的光學組件,例示如圖像顯示單元。圖像顯示單元係例如:具有可撓性之液晶單元、有機EL顯示元件等。經由貼合步驟(第2貼合步驟)而得之光學積層體係,當上述其它光學組件為圖像顯示單元時,具有依序包含圖像顯示單元/黏著劑層12/光學組件30(例如偏光板)之層構成。包含該構成之光學積層體的可撓式顯示器中,可將於彎折狀態在黏著劑層12所生成之應力加以緩和,因此,即使該顯示器受到彎折,在黏著劑層與於其相鄰之組件(光學組件30、及上述其它光學組件)之間亦可維持良好的密接性。 The above-mentioned other optical components can be incorporated into the optical components of the flexible display, for example, an image display unit. The image display unit is, for example, a flexible liquid crystal unit, an organic EL display element, etc. The optical laminate system obtained through the bonding step (the second bonding step), when the above-mentioned other optical component is an image display unit, has an image display unit/
1‧‧‧第1進料輥 1‧‧‧The first feed roller
2‧‧‧第2進料輥 2‧‧‧The second feed roller
3‧‧‧捲繞輥 3‧‧‧Winding roller
10‧‧‧剝離膜 10‧‧‧Peeling film
15‧‧‧具有塗佈層之剝離膜 15‧‧‧Release film with coating layer
20‧‧‧附有黏著劑層之剝離膜 20‧‧‧Release film with adhesive layer
30‧‧‧光學組件 30‧‧‧Optical components
40‧‧‧附有剝離膜之光學組件 40‧‧‧Optical components with peeling film
50‧‧‧塗佈裝置 50‧‧‧Coating device
60‧‧‧塗佈用輥 60‧‧‧Coating roller
70‧‧‧乾燥手段 70‧‧‧Drying means
80‧‧‧曝光裝置(活性能量射線照射裝置) 80‧‧‧Exposure device (active energy ray irradiation device)
81‧‧‧遮罩 81‧‧‧Mask
90‧‧‧貼合輥 90‧‧‧Laminating roller
Claims (8)
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| JP2016-086193 | 2016-04-22 | ||
| JP2016086193A JP6649167B2 (en) | 2016-04-22 | 2016-04-22 | Method for manufacturing optical member with separate film |
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| TW201811568A TW201811568A (en) | 2018-04-01 |
| TWI738770B true TWI738770B (en) | 2021-09-11 |
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| JP (1) | JP6649167B2 (en) |
| KR (1) | KR102328550B1 (en) |
| CN (1) | CN107304335A (en) |
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| KR102418578B1 (en) * | 2017-12-20 | 2022-07-07 | 엘지디스플레이 주식회사 | Adhesive and Flexible Display Using the Same |
| CN113678033A (en) * | 2019-03-29 | 2021-11-19 | 日东电工株式会社 | Optical film |
| US20220332989A1 (en) | 2019-12-10 | 2022-10-20 | Lg Chem, Ltd. | Multi-region foldable adhesive film and fabrication method therefor |
| CN113980171B (en) * | 2021-12-01 | 2022-10-11 | 香港中文大学(深圳) | Polymer material hardened in wet and preparation method and application thereof |
| CN118135891A (en) * | 2022-12-02 | 2024-06-04 | 华为技术有限公司 | Optical adhesive layer and preparation method thereof, flexible display module and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050269020A1 (en) * | 2004-05-25 | 2005-12-08 | Sumitomo Chemical Company, Limited | Method for producing a laminate polarizing plate and an optical member using thereof |
| US20090130607A1 (en) * | 2004-01-21 | 2009-05-21 | Microcontinuum, Inc | Roll-to-roll patterning of transparent and metallic layers |
| US20140093650A1 (en) * | 2012-09-28 | 2014-04-03 | Skc Haas Display Films Co., Ltd. | Method of manufacturing a composite light guide |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4830258B2 (en) * | 2004-01-28 | 2011-12-07 | 住友化学株式会社 | Method for pasting the pressure-sensitive adhesive layer. |
| JP2006047741A (en) * | 2004-08-05 | 2006-02-16 | Konica Minolta Opto Inc | Polarizing plate, polarizing plate manufacturing method and display apparatus |
| JP4557166B2 (en) * | 2005-08-01 | 2010-10-06 | ソニーケミカル&インフォメーションデバイス株式会社 | Method and apparatus for producing adhesive tape |
| JP2007219022A (en) * | 2006-02-14 | 2007-08-30 | Toagosei Co Ltd | Roll-type retardation film, elliptically polarizing plate, and production method thereof |
| JP2008275722A (en) | 2007-04-26 | 2008-11-13 | Sumitomo Chemical Co Ltd | Packing method for polarizing plate products |
| JP2009086452A (en) * | 2007-10-01 | 2009-04-23 | Nitto Denko Corp | Method for producing adhesive optical film, adhesive optical film, and image display device |
| JP5660631B2 (en) * | 2008-08-20 | 2015-01-28 | エルジー・ケム・リミテッド | Adhesive |
| JP2011057882A (en) * | 2009-09-11 | 2011-03-24 | Toray Ind Inc | Method of manufacturing single pressure-sensitive adhesive layer laminated sheet |
| KR20110106599A (en) * | 2010-03-23 | 2011-09-29 | 동우 화인켐 주식회사 | Method of forming alignment film pattern and optical laminate manufactured therefrom |
| TWI423307B (en) * | 2010-11-05 | 2014-01-11 | Far Eastern New Century Corp | Method for making microstructures |
| KR101955059B1 (en) * | 2012-01-13 | 2019-03-06 | 타이카 코포레이션 | Method for Producing Transparent Adhesive Sheet for Optical Applications, Transparent Adhesive Sheet for Optical Applications, and Display Device Using Same |
| CN105765643B (en) * | 2013-11-26 | 2018-09-11 | 住友化学株式会社 | Manufacturing equipment of optical member bonding body |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090130607A1 (en) * | 2004-01-21 | 2009-05-21 | Microcontinuum, Inc | Roll-to-roll patterning of transparent and metallic layers |
| US20050269020A1 (en) * | 2004-05-25 | 2005-12-08 | Sumitomo Chemical Company, Limited | Method for producing a laminate polarizing plate and an optical member using thereof |
| US20140093650A1 (en) * | 2012-09-28 | 2014-04-03 | Skc Haas Display Films Co., Ltd. | Method of manufacturing a composite light guide |
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| TW201811568A (en) | 2018-04-01 |
| JP6649167B2 (en) | 2020-02-19 |
| JP2017193678A (en) | 2017-10-26 |
| KR102328550B1 (en) | 2021-11-17 |
| KR20170121072A (en) | 2017-11-01 |
| CN107304335A (en) | 2017-10-31 |
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