TWI732995B - 屏蔽印刷配線板及屏蔽印刷配線板之製造方法 - Google Patents
屏蔽印刷配線板及屏蔽印刷配線板之製造方法 Download PDFInfo
- Publication number
- TWI732995B TWI732995B TW107105004A TW107105004A TWI732995B TW I732995 B TWI732995 B TW I732995B TW 107105004 A TW107105004 A TW 107105004A TW 107105004 A TW107105004 A TW 107105004A TW I732995 B TWI732995 B TW I732995B
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- layer
- shielding
- film
- shielding film
- point metal
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- 238000004519 manufacturing process Methods 0.000 title claims description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 253
- 239000002184 metal Substances 0.000 claims abstract description 253
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- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims description 512
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- 239000012790 adhesive layer Substances 0.000 claims description 107
- 239000011231 conductive filler Substances 0.000 claims description 86
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 56
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 239000004840 adhesive resin Substances 0.000 claims description 10
- 229920006223 adhesive resin Polymers 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 5
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- 239000010408 film Substances 0.000 description 426
- 229920005989 resin Polymers 0.000 description 41
- 239000011347 resin Substances 0.000 description 41
- 239000000463 material Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 15
- 239000010419 fine particle Substances 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- 239000010931 gold Substances 0.000 description 14
- 239000000843 powder Substances 0.000 description 14
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- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 9
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- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
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- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
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- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017024500 | 2017-02-13 | ||
| JP2017-024500 | 2017-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201841742A TW201841742A (zh) | 2018-12-01 |
| TWI732995B true TWI732995B (zh) | 2021-07-11 |
Family
ID=63106921
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109107254A TWI771659B (zh) | 2017-02-13 | 2018-02-12 | 屏蔽膜及屏蔽印刷配線板 |
| TW107105004A TWI732995B (zh) | 2017-02-13 | 2018-02-12 | 屏蔽印刷配線板及屏蔽印刷配線板之製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109107254A TWI771659B (zh) | 2017-02-13 | 2018-02-12 | 屏蔽膜及屏蔽印刷配線板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP6959948B2 (ja) |
| TW (2) | TWI771659B (ja) |
| WO (1) | WO2018147426A1 (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068555B (zh) * | 2018-09-18 | 2024-07-26 | 北京梦之墨科技有限公司 | 一种电磁屏蔽箱 |
| CN110784993B (zh) * | 2018-11-26 | 2025-04-29 | 广州方邦电子股份有限公司 | 自由接地膜、线路板及自由接地膜的制备方法 |
| US12150239B2 (en) | 2018-12-11 | 2024-11-19 | Tatsuta Electric Wire & Cable Co., Ltd. | Method for manufacturing shielded printed wiring board and shielded printed wiring board |
| JP7307095B2 (ja) * | 2018-12-12 | 2023-07-11 | タツタ電線株式会社 | シールドプリント配線板及びシールドプリント配線板の製造方法 |
| CN113545181B (zh) * | 2019-03-19 | 2024-10-11 | 拓自达电线株式会社 | 屏蔽印制线路板、屏蔽印制线路板的制造方法以及连接构件 |
| CN110461086B (zh) * | 2019-08-30 | 2021-01-08 | 维沃移动通信有限公司 | 一种电路板、电路板制作方法及终端 |
| TWI829973B (zh) * | 2020-02-25 | 2024-01-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
| TWI873369B (zh) * | 2020-09-18 | 2025-02-21 | 日商拓自達電線股份有限公司 | 附接地構件之屏蔽印刷配線板及接地構件 |
| TW202241251A (zh) * | 2021-03-31 | 2022-10-16 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
| TW202241250A (zh) * | 2021-03-31 | 2022-10-16 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
| TWI814357B (zh) * | 2022-04-22 | 2023-09-01 | 大陸商鴻通科技（廈門）有限公司 | 電子裝置 |
| KR102597064B1 (ko) * | 2022-04-28 | 2023-10-31 | 주식회사 현대케피코 | 전자파 차폐재 및 그 제조방법 |
| US12144106B2 (en) | 2022-05-06 | 2024-11-12 | Tpk Auto Tech (Xiamen) Limited | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1639290A (zh) * | 2000-09-08 | 2005-07-13 | 3M创新有限公司 | 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 |
| JP4201548B2 (ja) * | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
| CN102047777A (zh) * | 2008-05-30 | 2011-05-04 | 大自达电线股份有限公司 | 电磁波屏蔽材料及印刷电路板 |
| CN102585719A (zh) * | 2010-12-22 | 2012-07-18 | 日东电工株式会社 | 导电性粘接带 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03257769A (ja) * | 1990-03-08 | 1991-11-18 | Yazaki Corp | 貫通端子及びその接続方法 |
| JPH08293214A (ja) * | 1995-04-25 | 1996-11-05 | Sumitomo Electric Ind Ltd | フラットケーブル及び導体の部分金メッキ方法 |
| JPH09246775A (ja) * | 1996-03-13 | 1997-09-19 | Makoto Okuda | シールドされた印刷配線基板及びその製造方法 |
| US6090728A (en) * | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
| JP4828151B2 (ja) * | 2005-04-15 | 2011-11-30 | タツタ電線株式会社 | 導電性接着シート及び回路基板 |
| JP2008210584A (ja) * | 2007-02-23 | 2008-09-11 | Fujikura Ltd | フレキシブルフラットケーブル端子部 |
| JP4974803B2 (ja) * | 2007-08-03 | 2012-07-11 | タツタ電線株式会社 | プリント配線板用シールドフィルム及びプリント配線板 |
| JP5234487B2 (ja) * | 2007-09-20 | 2013-07-10 | 住友電気工業株式会社 | フレキシブルフラットケーブルおよびその製造方法 |
| CN105358741B (zh) * | 2013-06-10 | 2018-04-20 | 东方镀金株式会社 | 镀敷叠层体的制造方法及镀敷叠层体 |
| KR20160125344A (ko) * | 2014-02-24 | 2016-10-31 | 세키스이가가쿠 고교가부시키가이샤 | 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법 |
| JP6351330B2 (ja) * | 2014-03-28 | 2018-07-04 | タツタ電線株式会社 | 電磁波シールドフィルム、シールドプリント配線板及び電磁波シールドフィルムの製造方法 |
| JP6349250B2 (ja) * | 2014-12-24 | 2018-06-27 | タツタ電線株式会社 | シールドプリント配線板 |
| WO2016190278A1 (ja) * | 2015-05-26 | 2016-12-01 | タツタ電線株式会社 | シールドフィルムおよびシールドプリント配線板 |
| JP2016029748A (ja) * | 2015-12-02 | 2016-03-03 | タツタ電線株式会社 | シールドプリント配線板の製造方法 |
-
2018
- 2018-02-09 WO PCT/JP2018/004662 patent/WO2018147426A1/ja not_active Ceased
- 2018-02-09 JP JP2018567517A patent/JP6959948B2/ja active Active
- 2018-02-12 TW TW109107254A patent/TWI771659B/zh active
- 2018-02-12 TW TW107105004A patent/TWI732995B/zh active
-
2020
- 2020-02-10 JP JP2020020497A patent/JP2020092279A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1639290A (zh) * | 2000-09-08 | 2005-07-13 | 3M创新有限公司 | 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 |
| JP4201548B2 (ja) * | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
| CN102047777A (zh) * | 2008-05-30 | 2011-05-04 | 大自达电线股份有限公司 | 电磁波屏蔽材料及印刷电路板 |
| CN102585719A (zh) * | 2010-12-22 | 2012-07-18 | 日东电工株式会社 | 导电性粘接带 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202025868A (zh) | 2020-07-01 |
| TW201841742A (zh) | 2018-12-01 |
| JP6959948B2 (ja) | 2021-11-05 |
| WO2018147426A1 (ja) | 2018-08-16 |
| JPWO2018147426A1 (ja) | 2019-12-12 |
| TWI771659B (zh) | 2022-07-21 |
| JP2020092279A (ja) | 2020-06-11 |
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