TWI720766B - Support pedestal having gimbal assembly and electronic device testing apparatus provided with the same - Google Patents

Abstract

The present invention relates to a support stage with a force-balanced component and an electronic component testing equipment with the support stage, which mainly includes an upper substrate, a lower substrate, a stressed ball, a plurality of positioning pins, and a plurality of elastic parts; among them, The force-bearing ball is accommodated in the spherical groove of the lower substrate, and is partly located between the upper substrate and the lower substrate; the plurality of positioning pins respectively pass through the plurality of through holes of the upper substrate and are connected to the lower substrate, and the diameter of the positioning pins Smaller than the hole diameter of the through hole; a plurality of elastic members are arranged between the upper substrate and the lower substrate; accordingly, when the upper substrate is pressed down by force, the lower surface of the upper substrate contacts the force-bearing ball and is guided by the plurality of positioning pins However, any side of the upper substrate is allowed to tilt relative to the lower substrate to balance the force of the upper substrate.

Description

Support stage with force-balanced components and electronic component test equipment with the support stage

The present invention relates to a supporting stage with a force-balanced component and an electronic component testing equipment with the supporting stage, in particular to an electronic component testing equipment that can balance the lower pressure channel and is suitable for detecting the quality of electronic components.

During or after the manufacturing process of the wafer, the wafer is usually tested to ensure that the wafer can operate normally. Moreover, as the semiconductor manufacturing process continues to evolve, the internal integrated circuits of the chip have become more and more complex, and the functions of the chip have become more and more powerful. However, the test time is getting longer and longer, and the heat generated by the wafer during the test process is also increasing, so the test equipment is more important for the temperature control of the wafer.

Please also refer to Figure 1, which is a conventional electronic component testing equipment; as shown in the figure, a chip IC to be tested is placed in a test socket 91, and the bottom surface of the test socket 91 includes a plurality of probes P, It is used to contact the contacts on the lower surface of the IC under test. During the test, the pressing arm 81 presses the chip IC to be tested to ensure that its contacts can completely and electrically contact the probe P of the test socket 91.

Furthermore, before the test equipment leaves the factory, or even in the process of installing the equipment at the client, the levelness will be corrected. Generally, the pressure test is performed on the lower pressing arm 81 to ensure that the lower pressing arm 81 and the equipment base 11 are connected. The flatness. However, components including a test board CB and a test socket (Socket) 91 must be installed on the base 11 before the equipment is officially launched. This can easily cause a gap between the pressing arm 81 and the IC to be tested. The flatness of the contact ran away. In addition, when changing the test object, it is also necessary to replace the test circuit board CB and the test socket 91. This is also likely to cause the pressing arm 81 to no longer be in smooth contact with the chip IC to be tested after the replacement.

In addition, generally, a heating or cooling module is usually provided on the lower pressing arm 81 to heat or cool the chip IC to be tested. However, once the above-mentioned situation where the lower pressing arm 81 and the IC of the chip under test cannot be smoothly contacted, it will cause uneven heating or uneven cooling, causing local areas of the IC under test to overheat or fail to reach the predetermined temperature, in addition to affecting the test results In addition, severe cases are more likely to cause the IC to be tested to burn.

The main purpose of the present invention is to provide a support stage with a force-balanced component and an electronic component test equipment with the support stage, so that the electronic components under test can be uniformly stressed so that their contacts can completely contact the test equipment In addition to the probe; it can also make the electronic component under test completely contact the lower pressing arm, so that the lower pressing arm can perform comprehensive temperature control of the entire electronic component.

In order to achieve the above-mentioned object, the present invention is a support stage with a force-balanced component, which mainly includes an upper substrate, a lower substrate, a force-bearing liquid bead, a plurality of positioning pins, and a plurality of elastic parts; wherein, the upper substrate includes a plurality of Through holes; the upper surface of the lower substrate includes a spherical groove; the force-bearing ball is accommodated in the spherical groove, and at least a part of it is located between the upper substrate and the lower substrate; the plurality of positioning pins respectively pass through the plurality of through holes of the upper substrate, And connected to the lower substrate, and the diameter of the plurality of positioning pins is smaller than the diameter of the plurality of through holes; the plurality of elastic members are arranged between the upper substrate and the lower substrate; accordingly, when the upper substrate is pressed down by force, the lower surface of the upper substrate Contacting the force-bearing ball, and being guided by a plurality of positioning pins, allows any side of the upper substrate to be inclined relative to the lower substrate, so as to balance the force of the upper substrate.

Based on the above, the present invention sets up a stressed ball, a plurality of positioning pins, and a plurality of elastic parts between the upper and lower substrates. When the upper substrate receives an uneven downward pressure, or the configuration of the upper and lower substrates is not In the horizontal plane, through the coordinated action of the above-mentioned components, the force-receiving surface of the electronic component under test can be fine-tuned. In addition to allowing the contact of the electronic component to completely contact the probe of the test equipment, the electronic component can also be flatly contacted with the lower pressing arm. And make the temperature everywhere on the electronic component meet the test specifications.

In order to achieve the foregoing objective, an electronic component testing equipment of the present invention mainly includes a base, a support platform equipped with a force-balanced component as described in the previous paragraph, and a support platform coupled to the support platform The upper and lower test seat is used to house the electronic components, and a lower pressing arm arranged above the test seat; wherein, when the test is performed, the lower pressing arm applies a pressure to the electronic components in the test seat, and the lower pressure is transmitted to the support The carrier, the supporting carrier promotes the complete contact of the upper surface of the electronic component with the lower pressing arm.

In other words, when the lower pressing arm exerts a downward force on the electronic component, the support stage can fine-tune the angle of the force, so that the force-receiving plane of the electronic component and the test seat can conform to the force surface of the lower pressing arm, and the electronic component The upper surface of the component is in smooth contact with the lower surface of the lower pressing arm, and the lower pressing arm can control the temperature of the entire electronic component, and can make the contact on the lower surface of the electronic component completely contact the probe in the test socket to avoid poor contact And the test fails.

Before being described in detail in this embodiment, the supporting stage with the force-balanced assembly and the electronic component testing equipment with the supporting stage of the present invention, it should be noted that in the following description, similar components will be the same Component symbol to indicate. Furthermore, the drawings of the present invention are merely illustrative, and they are not necessarily drawn to scale, and all details are not necessarily presented in the drawings.

Please refer to FIG. 2, which is a schematic diagram of a preferred embodiment of the electronic component testing equipment of the present invention. As shown in the figure, the electronic component testing equipment of this embodiment mainly includes a base 1, which is a machine base (T-bar); and the base 1 is provided with a supporting stage SC with a force-balanced component; Furthermore, a test circuit board CB and a test socket 9 are sequentially coupled to the support carrier SC.

Furthermore, the test circuit board CB is a printed circuit board, and the test socket 9 is electrically connected to it, and the test circuit board CB and the test socket 9 are for corresponding test objects (electronic components), that is, different test objects will use Different test circuit boards CB and test sockets 9. In other words, the test socket 9 is used to house an electronic component C; and a plurality of probes (not shown in the figure) are arranged on the bottom of the socket of the test socket 9 to electrically contact the electronic component C. The contact on the surface.

In addition, a lower pressing arm 8 is provided above the test base 9, which is used to provide down force to the electronic component C so that the contacts of the electronic component C can completely contact the probes in the test base 9 to ensure smooth and smooth testing. Proceed correctly. In addition, a temperature control module TCM is provided in the lower pressing arm 8 of this embodiment, which is used to heat or cool the electronic component C in the test base 9. In other words, the test equipment of this embodiment can perform high-temperature or low-temperature testing, that is, the electronic component C is heated or cooled to a specific temperature before testing, or in other test patterns, the electronic component C under test can also be directly tested. Perform heat dissipation.

Please refer to FIGS. 3A, 3B, and 4 at the same time. FIG. 3A is a perspective view of a preferred embodiment of a support stage SC with a force-balanced component of the present invention, and FIG. 3B is a support stage with a force-balanced component of the present invention An exploded view of a preferred embodiment of SC. FIG. 4 is a cross-sectional view of a preferred embodiment of a supporting stage SC equipped with a force-balanced component of the present invention.

As shown in the figure, the support stage SC of this embodiment with a force-balanced component mainly includes an upper substrate 3, a lower substrate 2, a force-bearing ball 4, four positioning pins 5, four elastic members 6, and an intermediate transfer接板7。 Connection board 7. Wherein, the upper surface 20 of the lower substrate 2 includes a spherical groove 21, four screw holes 22, and four annular grooves 23, and one annular groove 23 and one screw hole 22 are arranged concentrically. In addition, the stressed ball 4 is accommodated in the spherical groove 21, and at least a part of it is located between the upper substrate 3 and the lower substrate 2, that is, part of the stressed ball 4 protrudes from the spherical groove 21. In principle, the spherical groove 21 corresponds to the centroid position of the electronic component C to be tested and the lower pressing arm 8 located on the test seat 9.

Furthermore, the upper substrate 3 is provided with four through holes 31, and each through hole 31 is provided with an engaging portion 32, a neck portion 33, and an inner ring inclined surface 311, and the engaging portion 32 is located on the lower end surface of the neck portion 33 , And the inner ring slope 311 is located above the neck 33. In addition, a top plate 34 is embedded on the lower surface 30 of the upper substrate 3, and the position of the top plate 34 is corresponding to the forced ball 4, and the hardness of the top plate 34 is greater than that of the upper substrate 3. In this embodiment, the top plate 34 and the force ball 4 are made of high-hardness materials, such as high-carbon steel, tungsten steel, or high-speed steel, etc., so they can withstand high down pressure without deformation, and can retain wear resistance. characteristic.

In addition, four elastic elements 6 are arranged between the upper substrate 3 and the lower substrate 2, and the elastic element 6 of this embodiment is a spring, one end of which is received in the annular groove 23 and the other end is pressed against the engaging portion 32. On the other hand, each positioning pin 5 of this embodiment includes a head 51 and a rod portion 52. The head 51 is adjacent to the rod portion 52 with an outer ring inclined surface 511; moreover, four positioning pins 5 The four through holes 31 of the upper substrate 3 are respectively passed through, and they are screwed into the four screw holes 22 of the lower substrate 2 respectively. Among them, the diameter of each positioning pin 5 is smaller than the hole diameter of the through hole 31, especially smaller than the hole diameter formed by the neck 33 of the through hole 31.

As for the intermediate transfer board 7 is coupled to the upper substrate 3 by two fasteners 71, and the test circuit board CB is fixed on the intermediate transfer board 7, please refer to FIG. 2. Accordingly, the purpose of using the fastener 71 in this embodiment is that when the test object (electronic component C) is changed, the fastener 71 can be easily unlocked, and the intermediary adapter plate 7 can be directly replaced or the intermediary can be removed. The test circuit board CB can be easily replaced after the adapter board 7.

The operation mode of this embodiment will be described in detail below. When the upper base plate 3 has not been pressed down, because of the elastic expansion of the elastic member 6, the outer ring inclined surface 511 of each positioning pin 5 is attached to the inner ring inclined surface 311 of the through hole 31, and the upper base plate 3 is under The top plate 34 of the surface 30 does not contact the forced ball 4. In addition, it is particularly worth mentioning that the distance between the lower surface 30 of the upper substrate 3 and the upper surface 20 of the lower substrate 2 at this time is smaller than the diameter of the forced ball 4; that is, the forced ball 4 will always be positioned In the spherical groove 21, the spherical groove 21 will not escape.

However, when the upper substrate 3 is pressed downward under a force, the downward force will overcome the elastic force of the elastic member 6 and the upper substrate 3 will drop slightly, causing its lower surface 30 to contact the forced ball 4. At this time, the upper substrate 3 will be guided by the positioning pins 5 to allow any side of the upper substrate 3 to be inclined relative to the lower substrate 2 to balance the force of the upper substrate 3. To further illustrate, when the upper substrate 3 is pressed down by force and either side of the upper substrate 3 is inclined relative to the lower substrate 2, the neck 33 of the through hole 31 will engage the positioning pin 5, so that the inclination angle of the upper substrate 3 is less than 3 degrees , This embodiment is set to +/-1.1 degrees.

Please refer to the following >Table 1>, which shows the temperature measured at the six positions on the electronic component C before and after the supporting stage SC with the force balance component of this embodiment is configured during the test of the electronic component C . Among them, the simulated condition is that a single-sided pad height of 0.2mm on the abutment 1 is used to simulate the height difference.

As shown in >Table 1>, the second test was carried out without the supporting platform of this embodiment, and the results showed that the temperatures at positions 4, 5, and 6 were significantly higher than those at positions 1, 2, and 3. , Especially position 4. It can be seen that these three positions should be in poor contact, so the heat generated by the electronic component C during the test cannot be conducted to the lower pressing arm 8 through contact; that is, the temperature control module TCM of the lower pressing arm 8 cannot Cooling is performed on position 4 and its vicinity, but the difference between the temperature here and position 1, which is the lowest temperature, is as high as 18.5°C.

On the other hand, when the supporting stage of this embodiment is configured, the temperature at all positions is between 55°C and 58°C, and the maximum temperature difference is only about 3°C, which shows the effect of the present invention Excellent, it is true that the electronic component C under test can completely contact the lower pressing arm 8 so that the lower pressing arm 8 can perform comprehensive temperature control of the entire electronic component C. >Table 1> Measuring temperature (℃) Without configuration support stage Equipped with support stage Position 1 55 54.6 57.2 56.7 Position 2 55.3 55.8 55.9 56.1 Position 3 55.4 56.1 55.5 55.4 Position 4 73.5 71.8 56.5 55.1 Position 5 61.8 61.1 57.4 57.3 Position 6 58.2 59 58.7 58.4 Maximum temperature T _max 73.5 71.8 58.7 58.4 Minimum temperature T _min 55 54.6 55.5 55.1 Maximum temperature difference△T 18.5 17.2 3.2 3.3

The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.

1: Abutment 2: Lower substrate 3: Upper substrate 4: Forced ball 5: positioning pin 6: Elastic parts 7: Intermediary adapter board 8: Lower pressure arm 9: Test seat 20: upper surface 21: spherical groove 22: screw hole 23: Annular groove 30: lower surface 31: Through hole 32: Card Arrival Department 33: neck 34: top plate 51: head 52: Rod body 71: Buckle 311: inner ring bevel 511: Outer ring bevel C: Electronic components CB: Test circuit board SC: support stage TCM: Temperature Control Module

Figure 1 is a conventional electronic component testing equipment. FIG. 2 is a schematic diagram of a preferred embodiment of the electronic component testing equipment of the present invention. Fig. 3A is a perspective view of a preferred embodiment of a supporting platform with a force-balanced component according to the present invention. Fig. 3B is an exploded view of a preferred embodiment of a supporting platform with a force-balanced component according to the present invention. Fig. 4 is a cross-sectional view of a preferred embodiment of a supporting platform with a force balance component according to the present invention.

1: Abutment

2: Lower substrate

3: Upper substrate

4: Forced ball

5: positioning pin

6: Elastic parts

7: Intermediary adapter board

8: Lower pressure arm

9: Test seat

21: spherical groove

34: top plate

C: Electronic components

CB: Test circuit board

SC: support stage

TCM: Temperature Control Module

Claims (10)

A supporting platform with force-balanced components, including: An upper substrate, which includes a plurality of through holes; The lower substrate, the upper surface of which includes a spherical groove; A forced ball, which is accommodated in the spherical groove, and at least a part is located between the upper substrate and the lower substrate; A plurality of positioning pins respectively pass through the plurality of through holes of the upper substrate and are connected to the lower substrate; the diameter of the plurality of positioning pins is smaller than the aperture of the plurality of through holes; and A plurality of elastic members are arranged between the upper substrate and the lower substrate; Wherein, when the upper substrate is pressed down under a force, the lower surface of the upper substrate contacts the stressed ball, and is guided by the plurality of positioning pins to allow any side of the upper substrate to tilt relative to the lower substrate. For example, the support stage with a force-balanced component of claim 1, wherein, when the upper substrate is not pressed down by force, the lower surface of the upper substrate does not contact the stressed ball. For example, the support stage with a force-balanced component of claim 2, wherein when the upper substrate is not pressed down by force, the distance between the lower surface of the upper substrate and the upper surface of the lower substrate is less than the force The diameter of the ball. For example, the supporting stage with the force-balanced component of claim 1, which further includes an intermediate adapter plate, which is coupled to the upper substrate by a plurality of fasteners. For example, the support stage with force-balanced components of claim 1, wherein the upper surface of the lower substrate further includes a plurality of screw holes and a plurality of annular grooves, and the plurality of annular grooves are arranged in concentric circles with the plurality of screw holes; Each through hole further includes an engaging portion; the plurality of positioning pins respectively pass through the plurality of through holes of the upper substrate, and are respectively screwed to the plurality of screw holes of the lower substrate; the plurality of elastic members include a plurality of springs, which One end is accommodated in the annular groove, and the other end is pushed against the engaging portion. For example, the support stage with a force-balanced component of claim 5, wherein each through hole further includes a neck; when the upper substrate is pressed down by a force and any side thereof is inclined relative to the lower substrate, the neck The part is clamped against the positioning pin, so that the inclination angle of the upper substrate is less than 3 degrees. For example, the support platform with force balance components of claim 5, wherein each through hole includes an inner ring slope; each positioning pin includes a head and a rod body, and the head is adjacent to the rod The body is provided with an outer ring inclined surface; when the upper base plate is not pressed down by force, the outer ring inclined surface of the positioning pin is attached to the inner ring inclined surface of the through hole. For example, the support stage with a force-balanced component of claim 1, which further includes a top plate, which is embedded on the lower surface of the upper substrate and corresponds to the stressed ball; the hardness of the top plate is greater than that of the upper substrate hardness. An electronic component testing equipment, including: A base station A supporting platform with a force balance component as described in any one of claims 1 to 8, which is assembled on the base; A test socket, which is coupled to the supporting stage and used to house an electronic component; and The lower pressing arm is set above the test seat; Wherein, when the test is performed, the lower pressing arm applies a pressure to the electronic component in the test seat, and the downward pressure is transmitted to the support stage, and the support stage causes the upper surface of the electronic component to completely contact the downward pressure arm. For example, the electronic component testing equipment of claim 9, wherein the pressing arm further includes a temperature control module for heating or cooling the electronic component in the test seat.

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