TWI715475B - Light carrier and operation equipment using the same - Google Patents
Light carrier and operation equipment using the same Download PDFInfo
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- TWI715475B TWI715475B TW109110043A TW109110043A TWI715475B TW I715475 B TWI715475 B TW I715475B TW 109110043 A TW109110043 A TW 109110043A TW 109110043 A TW109110043 A TW 109110043A TW I715475 B TWI715475 B TW I715475B
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- 230000003287 optical effect Effects 0.000 claims description 113
- 230000005540 biological transmission Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 description 14
- 238000007731 hot pressing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000000034 method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
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Abstract
Description
本發明係提供一種可徑向配置光傳輸件以供照明,並於照明作業時防止高溫,進而提高使用效能之薄型化光具載座。 The present invention provides a thin optical tool carrier capable of radially arranging light transmission elements for illumination and preventing high temperature during illumination operation, thereby improving the use efficiency.
在現今,電子元件作業設備於執行複數個不同電子元件(如晶片及軟性電路板)之結合組裝作業時,係以不同裝置(如作業裝置及輸送裝置)移載不同待作業之電子元件;以熱壓合作業設備為例,係以熱壓合裝置之熱壓合器移載晶片,並以輸送裝置之移料器移載軟性電路板,由於晶片具有複數個接腳,軟性電路板具有複數個電性接點,為使晶片之接腳準確對接於軟性電路板之電性接點,熱壓合作業設備係設有取像裝置取像軟性電路板之電性接點,以供中央控制裝置控制熱壓合器調整校正晶片之擺置位置,使得晶片之接腳及軟性電路板之電性接點準確對位壓合。 Nowadays, when the electronic component working equipment performs the combined assembly operation of a plurality of different electronic components (such as chips and flexible circuit boards), different devices (such as working devices and conveying devices) are used to transfer different electronic components to be operated; For example, the hot-pressing cooperative industry equipment uses the hot-pressing device of the hot-pressing device to transfer the chip, and the transfer device of the conveying device to transfer the flexible circuit board. Since the chip has multiple pins, the flexible circuit board has multiple In order to make the pins of the chip accurately connect to the electrical contacts of the flexible circuit board, the hot-press cooperation equipment is equipped with an imaging device to capture the electrical contacts of the flexible circuit board for central control The device controls the thermal press to adjust and calibrate the placement of the chip, so that the pins of the chip and the electrical contacts of the flexible circuit board are accurately aligned and pressed.
然,取像裝置為使取像器(如CCD)可清晰取像軟性電路板,即於取像器裝配照明器,以輔助照明,照明器包含光源座及複數個LED光源,光源座係裝配於取像器,並開設通孔,以供取像器經由通孔而取像軟性電路板,複數個LED光源係採立式排列貼置於光源座之通孔內面,以於通孔內發光而照明軟性電路板,以利取像器取像軟性電路板。 Of course, the imaging device is to enable the imaging device (such as CCD) to clearly capture the flexible circuit board, that is, a illuminator is installed on the imaging device to assist lighting. The illuminator includes a light source base and a plurality of LED light sources. The light source base is assembled In the viewfinder, a through hole is opened for the viewfinder to take the flexible circuit board through the through hole. A plurality of LED light sources are arranged vertically and placed on the inner surface of the through hole of the light source base to fit inside the through hole. Light and illuminate the flexible circuit board to facilitate the image capture of the flexible circuit board.
惟,照明器之LED光源因本身為發光源,於發光時會產生高溫,當複數個高溫之LED光源將高溫直接傳導至光源座時,即會導致光源座因高溫而受損。又,當取像裝置於取像過程中發生當機,而導致高溫之光源座停置於軟性電路板上方時,因軟性電路板為一軟質薄型塑片,在光源座及LED光源均具有高溫的情況下,軟性電路板易受光源座及LED光源的高溫影響,不僅發生軟性電路板變形受損之問題,更會影響軟性電路板之電性接點與晶片之接腳的對位精度及熱壓品質。 However, because the LED light source of the illuminator is a light source, it will generate high temperature when it emits light. When multiple high-temperature LED light sources directly transmit the high temperature to the light source base, the light source base will be damaged due to the high temperature. In addition, when the imaging device crashes during the imaging process, and the high-temperature light source base is parked on the flexible circuit board, the flexible circuit board is a soft thin plastic sheet, and both the light source base and the LED light source have high temperature. In the case of, the flexible circuit board is susceptible to the high temperature of the light source base and the LED light source, which not only causes the problem of deformation and damage of the flexible circuit board, but also affects the alignment accuracy of the electrical contacts of the flexible circuit board and the pins of the chip. Hot pressing quality.
再者,LED光源因受限於本身作側向發光的要件,而必須直立排列於光源座之通孔內面,不僅增加光源座之高度,於高度較高之光源座裝配於取像器時,亦增加整組取像裝置之高度,當取像裝置應用於熱壓合器與移料器之間執行取像作業,業者為使熱壓合器迴避取像裝置,即必須拉高熱壓合器之裝配位置,換言之,此將增長熱壓合器的熱壓位移路徑,但位置過高的熱壓合器不僅容易造成位移時間增長而降低作業效率,更會發生熱壓作業效果不穩定的問題。 Furthermore, because the LED light source is limited to its side-lighting requirements, it must be arranged upright on the inner surface of the through hole of the light source base, which not only increases the height of the light source base, but also when the taller light source base is mounted on the imager , It also increases the height of the entire set of image capturing devices. When the image capturing device is used between the thermocompression device and the material shifter to perform image capturing operations, the industry must raise the heat pressure in order to make the thermocompression device avoid the image capturing device. The assembly position of the combiner, in other words, this will increase the heat-pressing displacement path of the heat-compressor, but a heat-compressor with an excessively high position will not only increase the displacement time and reduce the working efficiency, but also cause unstable heat-pressing operation effects. The problem.
本發明之目的一,係提供一種薄型化光具載座,以供裝配光傳輸件,該光具載座係於第一端沿軸線開設一貫通至第二端之穿孔,並於第二端且位於穿孔外部周圍設有光槽,光槽係具有至少一反射面,以供反射及漫射光線,另於光具載座之外環面徑向設有至少一相通光槽之承置部,而供徑向配置光傳輸件,藉以於光傳輸件將光源之光線傳送至光具載座,利用光具載座之光槽作全方向性均勻照明,並可防止光具載座高溫,進而提高光具載座之使用效能。 The first object of the present invention is to provide a thin optical tool carrier for assembling light transmission components. The optical tool carrier is provided with a through hole extending from the first end to the second end along the axis, and the second end A light groove is provided around the periphery of the perforation. The light groove has at least one reflective surface for reflecting and diffusing light. In addition, at least one supporting part of the light groove is provided radially on the outer ring surface of the optical tool carrier , And provide a radial configuration of the light transmission member, through which the light transmission member transmits the light of the light source to the optical tool carrier, the light groove of the optical tool carrier is used for omnidirectional uniform illumination, and the high temperature of the optical tool carrier can be prevented. Furthermore, the use efficiency of the optical bench is improved.
本發明之目的二,係提供一種薄型化光具載座,其供徑向裝配光傳輸件,以於光傳輸件不會產生高溫的要件下,使得光具載座可保持預設溫度,當光具載座因取像時序或異常時序而停置於待取像物件上方時,即可防止待取像物件受損,達到確保物件品質及物件作業精準性之實用效益。 The second objective of the present invention is to provide a thin optical tool carrier for radially assembling light transmission components, so that the optical tool carrier can maintain a preset temperature under the condition that the light transmission components do not generate high temperature. When the optical bench is parked above the object to be taken due to the acquisition timing or abnormal timing, the object to be acquired can be prevented from being damaged, and the practical benefits of ensuring the quality of the object and the accuracy of the operation of the object can be achieved.
本發明之目的三,係提供一種薄型化光具載座,其係徑向設有承置部以供裝配光傳輸件,而可有效縮減光具載座之高度,使光具載座作一薄型化設計,以於光具載座裝配於取像裝置之取像器時,不僅可有效縮減取像裝置之高度,更可便利取像裝置應用於作業空間有限之設備,毋須調高相關裝置之裝配高度及增長作業位移路徑,達到提升作業品質之實用效益。 The third objective of the present invention is to provide a thin optical tool carrier, which is provided with a supporting part in the radial direction for assembling the optical transmission member, and can effectively reduce the height of the optical tool carrier, making the optical tool carrier a The slim design not only effectively reduces the height of the imaging device when the optical bench is mounted on the imaging device of the imaging device, but also facilitates the imaging device to be used in equipment with limited working space, without the need to adjust the height of the related device The assembly height and increase the displacement path of the operation, to achieve the practical benefit of improving the quality of the operation.
本發明之目的四,係提供一種電子元件作業設備,包含機台、供料裝置、作業裝置、輸送裝置、取像裝置及中央控制裝置,供料裝置係配置於機台,並設有至少一供料承置器,以承置待作業之電子元件;作業裝置係配置於機台,並設有至少一作業器,以對電子元件執行預設作業;輸送裝置係配置於機台,並設有至少一移料器,以移載電子元件;取像裝置係配置於機台,包含驅動單元及取像單元,驅動單元係驅動取像單元作至少一方向位移,取像單元係設有取像器及照明器,取像器係供取像電子元件,照明器包含薄型化光具載座、光傳輸件及光源,並裝配於取像器以供照明電子元件;中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 The fourth object of the present invention is to provide an electronic component working equipment, including a machine, a feeding device, a working device, a conveying device, an imaging device, and a central control device. The feeding device is arranged on the machine and is provided with at least one The feeding holder is used to hold the electronic components to be operated; the working device is arranged on the machine and is equipped with at least one working device to perform preset operations on the electronic components; the conveying device is arranged on the machine and is provided There is at least one moving device to transfer electronic components; the image capturing device is arranged on the machine and includes a driving unit and an image capturing unit. The driving unit drives the image capturing unit to move in at least one direction. Imager and illuminator. The imager is used for capturing electronic components. The illuminator includes a thin optical bench, light transmission member and light source, and is mounted on the imager for lighting electronic components; the central control device is used for Control and integrate the actions of various devices to perform automated operations to achieve practical benefits of enhancing operational performance.
10:光具載座 10: Optical carrier
11:第一端 11: first end
12:第二端 12: second end
13:穿孔 13: Piercing
14:光槽 14: light slot
141:第一反射面 141: first reflecting surface
142:第二反射面 142: second reflective surface
143:光線通道 143: Light Channel
15:外環面 15: Outer ring surface
16:環槽 16: ring groove
17、17A:承置部 17, 17A: Housing Department
18:凹槽 18: Groove
19:連接部 19: Connection part
X:軸線 X: axis
20:取像裝置 20: Capture device
21:光傳輸件 21: Optical transmission parts
211:投光部 211: Projection Department
22:燈箱 22: light box
23、23A:取像器 23, 23A: Viewer
231:取像件 231: Capture
24:驅動單元 24: drive unit
30:機台 30: Machine
40:供料裝置 40: Feeding device
41:供料承置器 41: Feeder
50:輸送裝置 50: Conveying device
51:移框器 51: Frame shifter
52:承載台 52: Carrier
53:第一移料器 53: The first shifter
54:第二移料器 54: second shifter
60:熱壓合裝置 60: Hot pressing device
61:熱壓合器 61: hot press
71:載框模組 71: Frame loading module
72:晶片 72: chip
73:軟性電路板 73: flexible circuit board
第1圖:本發明薄型化光具載座第一實施例之剖視圖。 Figure 1: A cross-sectional view of the first embodiment of the thin optical tool carrier of the present invention.
第2圖:本發明薄型化光具載座第一實施例之俯視圖。 Figure 2: The top view of the first embodiment of the thinned optical bench of the present invention.
第3圖:本發明薄型化光具載座裝配於取像器之示意圖。 Figure 3: A schematic diagram of the thinned optical bench of the present invention assembling the imager.
第4圖:本發明薄型化光具載座之使用示意圖。 Figure 4: A schematic diagram of the use of the thin optical bench of the present invention.
第5圖:本發明薄型化光具載座第二實施例之示意圖。 Figure 5: A schematic diagram of the second embodiment of the thinned optical tool carrier of the present invention.
第6圖:本發明薄型化光具載座第三實施例之示意圖。 Fig. 6: A schematic diagram of the third embodiment of the thin optical bench of the present invention.
第7圖:本發明薄型化光具載座第四實施例之示意圖。 Fig. 7: A schematic diagram of the fourth embodiment of the thin optical bench of the present invention.
第8圖:本發明薄型化光具載座應用於電子元件作業設備之示意圖。 Figure 8: A schematic diagram of the application of the thinned optical bench of the present invention to an electronic component operation equipment.
第9圖:係第8圖之局部使用示意圖。 Figure 9: is a partial schematic diagram of Figure 8.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第1、2圖,本發明第一實施例之薄型化光具載座10,其具有第一端11,並沿軸線X設有相對第一端11之第二端12,於本實施例中,光具載座10係為金屬製,並概呈圓形,然光具載座10可依作業需求而設計成不同形狀或以不同材質製作,而不受限於本實施例;更進一步,光具載座10係於第一端11沿軸線X朝向第二端12設有至少一穿孔13,穿孔13可作為取像孔,或供裝配取像器(圖未示出),於本實施例中,光具載座10之穿孔13係作為取像孔,以供取像器經由穿孔13而取像待取像物件。
In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given in conjunction with the drawings. The details are as follows: Please refer to Figures 1 and 2, the thinned optical carrier of the first embodiment of the present invention The
又該光具載座10係於第二端12設有至少一光槽,光槽具有至少一反射面,以供反射光線;更進一步,光槽可為斜槽或方槽等不同型式,光具載座10可於第二端12設有環狀式光槽,亦或設有複數個呈環形排列且不相通之光
槽;於本實施例中,光具載座10係於第二端12且位於穿孔13之外部周圍設有一呈環狀式之光槽14,光槽14係呈斜槽設計,而設有具斜度之第一反射面141及第二反射面142,第一反射面141及第二反射面142之斜度可依照明使用需求而設計,第一反射面141及第二反射面142可作相互平行或不平行設計,於本實施例中,光槽14之第一反射面141及第二反射面142係作相互平行設計,並令第一反射面141與第二反射面142間形成一光線通道143,第一反射面141及第二反射面142可反射光線或反射及漫射光線;又光具載座10可視作業需求,於第一反射面141或第一反射面141及第二反射面142增設反射層,例如反射層可為反射貼片而貼覆於第一反射面141及第二反射面142,例如於第一反射面141及第二反射面142塗覆可為硫酸鋇材質之反射塗層,均可提升第一反射面141及第二反射面142之反射及漫射光線的效果。
In addition, the
再者,光具載座10係設有至少一承置部,以供配置光傳輸件(圖未示出);更進一步,承置部可為孔或平面,例如於光具載座10開設呈徑向配置且相通光槽14之承孔,以供穿置光傳輸件,例如於光具載座10設有相通光槽14之平面,以供徑向配置光傳輸件;於本實施例中,光具載座10係於外環面15凹設有環槽16,並於環槽16之內面開設有複數個呈徑向配置且為承孔之承置部17,以供承置複數個光傳輸件,承置部17相通至光槽14之光線通道143,且相對於光槽14之第一反射面141,使光傳輸件之投光部朝向第一反射面141;從而,有效縮減光具載座10之軸向高度,進而提供一薄型化之光具載座10。
Furthermore, the
請參閱第3圖,光傳輸件21可為光纖,並以一端連接一為燈箱22之光源,光具載座10係以複數個承置部17供徑向配置複數個光傳輸件21,並使光傳輸件21之投光部211穿伸至光槽14之光線通道143,由於光具載座10並非直
接裝配光源,而可有效縮減光具載座10之軸向高度,使得光具載座10薄型化;再將薄型化光具載座10的第一端11裝配於一取像器23(如CCD),並使取像器23之取像件231相對於光具載座10之穿孔13,藉以薄型化光具載座10搭配取像器23即可組成一體積較小之取像單元,並使取像器23之取像件231透過光具載座10之穿孔13而取像待取像物件(如軟質電路板)。
Please refer to Figure 3, the
請參閱第4圖,於取像時,燈箱22係對複數個光傳輸件21投射光線,光傳輸件21將光線傳送至投光部211,令投光部211對光具載座10之光槽14的第一反射面141投射光線,第一反射面141會將一部分光線反射至光槽14之外部而照明待取像物件,並將另一部分光線反射至第二反射面142,再由第二反射面142漫射至光槽14之外部,進而利用光具載座10之光槽14設計,而可提高光傳輸件21的光線均勻擴散效果及照明範圍,以利取像器23清晰取像待取像物件;然由於光傳輸件21為一傳送光線的元件,並非光源,於傳送光線的使用上,光傳輸件21不會產生高溫,亦即可防止光具載座10產生高溫,進而提高光具載座10之使用壽命。
Please refer to Figure 4, when capturing images, the
請參閱第5圖,係本發明第二實施例之薄型化光具載座10,其相同具有光槽14及承置部17等設計,第二實施例與第一實施例之差別在於光具載座10係於第二端12設有凹槽18,凹槽18可供裝配取像器23A,於光傳輸件21作徑向傳送光線至光具載座10之光槽14時,光槽14即可反射及漫射光線而照明待取像物件,以利取像器23A清晰取像待取像物件。
Please refer to FIG. 5, which is a thin
請參閱第6圖,係本發明第三實施例之薄型化光具載座10,其相同具有光槽14及承置部17等設計,第三實施例與第一實施例之差別在於光具載座10係以第二端12之局部部位作為連接部19,連接部19可供裝配取像器23A,於
光傳輸件21作徑向傳送光線至光具載座10之光槽14時,光槽14即可反射及漫射光線而照明待取像物件,以利取像器23A清晰取像待取像物件。
Please refer to FIG. 6, which is a thin
請參閱第7圖,係本發明第四實施例之薄型化光具載座10,其相同具有光槽14及承置部,第四實施例與第一實施例之差別在於光具載座10之光槽14係具有第一反射面141,並以光槽14之徑向面的一部分作為承置部17A,以供徑向裝配光傳輸件21,使光傳輸21作徑向傳輸光線投射至第一反射面141,再以第一反射面141將光線反射至待取像物件,以供取像器清晰取像待取像物件。
Please refer to FIG. 7, which is a thin
請參閱第1、2、8、9圖,本發明薄型化光具載座10應用於電子元件作業設備,電子元件作業設備包含機台30、供料裝置40、輸送裝置50、作業裝置、取像裝置20及中央控制裝置(圖未示出);於本實施例中,電子元件作業設備係為熱壓合作業設備。該供料裝置40係配置於機台30,並設有至少一供料承置器41,以承置待作業之電子元件,於本實施例中,供料承置器41係承置至少一載框模組71,載框模組71承置至少一為晶片72之電子元件;該輸送裝置50係配置於機台30,並設有至少一移料器,以移載電子元件,於本實施例中,輸送裝置50係以移框器51於供料裝置40之供料承置器41取出一具有晶片72之載框模組71,並將載框模組71載送至一承載台52,一第一移料器53係於承載台52處之載框模組71取出晶片72,並將晶片72移載至換料位置,輸送裝置50另以第二移料器54輸送一為軟性電路板73之電子元件至熱壓合位置;該作業裝置係配置於機台30,並設有至少一作業器,以對電子元件執行預設作業,於本實施例中,作業裝置係為熱壓合裝置60,熱壓合裝置60係以熱壓合器61於第一移料器53取出晶片72,並將晶片72移載至熱壓合位置;該取像裝置20係配置於機台30,包含驅動單元24及取像單元,驅動單元24係驅動取像單元作至少一方向位移,
取像單元係設有取像器23及照明器,取像器23係供取像電子元件,照明器包含本發明之薄型化光具載座10、光傳輸件21及光源(如燈箱),並以光具載座10裝配於取像器23以供照明電子元件;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to Figures 1, 2, 8, and 9, the thin
取像裝置20係以驅動單元24驅動取像單元位移至晶片72及軟性電路板73之間,由於照明器係以本發明之薄型化光具載座10裝配於取像器23,不僅可有效縮減整組取像單元之應用高度,更可便利取像單元應用於作業空間有限之設備,毋須調高熱壓合器61之裝配高度及增長熱壓合器61之熱壓位移路徑,以利提高熱壓作業品質,取像單元即以燈箱經光傳輸件21將光線傳輸至光具載座10之光槽14,利用光槽14之設計可作反射及漫射光線而均勻照明軟性電路板73,以供取像器23清晰取像軟性電路板73;然由於光具載座10裝配之光傳輸件21並不會產生高溫,相對地,光具載座10也不會產生高溫,不論於取像時序或異常時序,當光具載座10停置於軟性電路板73之上方時,均可有效防止軟性電路板73在未承置晶片72之前受熱變形,以確保軟性電路板73於平整狀態下精準承置晶片72執行熱壓作業,進而提高熱壓品質;於完成熱壓合作業後,輸送裝置50之第二移料器54輸出具晶片72之軟性電路板73以供收料。
The
10:光具載座 10: Optical carrier
14:光槽 14: light slot
141:第一反射面 141: first reflecting surface
142:第二反射面 142: second reflective surface
21:光傳輸件 21: Optical transmission parts
211:投光部 211: Projection Department
23:取像器 23: Viewer
Claims (10)
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| TW109110043A TWI715475B (en) | 2020-03-25 | 2020-03-25 | Light carrier and operation equipment using the same |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM287473U (en) * | 2005-03-02 | 2006-02-11 | Maxemil Photonics Corp | Image-taking apparatus |
| CN200952936Y (en) * | 2006-06-12 | 2007-09-26 | 苏钿仁 | Stereo cutter blade detecting device |
| US9557473B2 (en) * | 2010-04-16 | 2017-01-31 | Flex Lighting Ii, Llc | Reflective spatial light modulator display with stacked light guides and method |
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- 2020-03-25 TW TW109110043A patent/TWI715475B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM287473U (en) * | 2005-03-02 | 2006-02-11 | Maxemil Photonics Corp | Image-taking apparatus |
| CN200952936Y (en) * | 2006-06-12 | 2007-09-26 | 苏钿仁 | Stereo cutter blade detecting device |
| US9557473B2 (en) * | 2010-04-16 | 2017-01-31 | Flex Lighting Ii, Llc | Reflective spatial light modulator display with stacked light guides and method |
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