TWI712800B - Probe card and switch module - Google Patents

Abstract

A probe card and a switch module are disclosed. The probe card includes a test PCB, a stiffener, a switch module, and a test head. The test PCB includes an upper surface, a bottom surface, and a central hole. The stiffener is disposed on the upper surface of the test PCB and includes a central carrier whose position is relative to the central hole. The transformer includes a base, a micropore plate, and a switch plate. The base includes a hollow portion. The micropore plate is disposed at the bottom of the base. The switch plate is disposed on the top of the base. The micropore plate includes a plurality of first micropores which face the hollow portion of the base. The switch plate includes a top surface and a bottom surface. The bottom surface faces the base. The upper surface includes a plurality of upper contacts. The test head is electrically connected to the micropore plate.

Description

Probe card and switch module

The invention relates to a probe card and a switching module.

The traditional method for manufacturing integrated circuit chips is to first form multiple dies on the wafer, then dicing the wafer to form multiple independent dies, and each independent die is packaged separately. The crystal grains themselves can have different sizes depending on their functions. The size of the crystal grains with complex functions is usually larger, and the number of contact points on the crystal grains is also large, so the distance between the contact points is usually very narrow. Although there are fewer contact points on the die with simpler functions, the size of the die is also relatively small, so the distance between the contact points is also very narrow. Therefore, it is difficult for the general die to directly electrically connect with the circuit board.

In order for the circuit in the die to be electrically connected to the circuit board, the spatial distribution of the contact points on the die must be enlarged. This step is called space transform. Space conversion is usually achieved by soldering the die to the integrated circuit carrier. The integrated circuit carrier board has an upper surface and a lower surface. The spatial distribution of the contact points on the upper surface is the same as the spatial distribution of the contact points of the corresponding die, and the distribution of the contact points under the lower surface is more generous. There is a circuit layout between the surfaces to electrically connect the contact points above the upper surface and the contact points below the lower surface. In this way, the spatial distribution of the contact points on the die can be enlarged through the integrated circuit carrier.

Before the die is combined with the integrated circuit carrier board, it usually has to go through a testing procedure, such as a probe test through a probe card. In order to be able to detect the die on the wafer, the distribution of the probes on the probe card must be the same as the distribution of the contact points on the die, so the probes will also have a compact distribution. As mentioned above, the contact points on the die are compactly distributed, so it is difficult to directly electrically connect to the circuit board. Similarly, the compactly distributed probes will also have the problem of being difficult to directly electrically connect to the test circuit board. The needle must also go through a "space converter" for space conversion before it can be electrically connected to the test circuit board.

The space converter has an upper surface and a lower surface like an integrated circuit carrier. The lower surface connected to the probe has the same compact contact point distribution as the probe, and the upper surface facing the test circuit board has a relatively small Ample distribution of contact points.

When the traditional space converter is electrically connected with the corresponding test circuit board, it directly pulls the wire from the microporous board to the test circuit board, which causes the wiring to be staggered and messy, and it is easy to cause the problem of signal interference; in addition, the wiring Varying lengths of traces will also cause inconsistent signal timing, which will affect the accuracy of electrical test results.

In view of this, the present invention provides a probe card, which includes a test circuit board, a reinforcement, a switch module, and a test head. The test circuit board includes an upper surface, a lower surface and a central perforation. The reinforcement is arranged on the upper surface of the test circuit board and includes a central carrier corresponding to the central perforation. The switching module includes a base, a microplate, a transfer board, a plurality of circuits, and a plurality of external circuit wiring. The base includes a hollow area, the micro-well plate is arranged under the base, and the adapter plate is arranged above the base. The microwell plate includes a plurality of first microwells facing the hollow area of the base. The adapter plate includes an upper surface, a lower surface and a plurality of through holes. The lower surface of the adapter plate faces the base, the upper surface includes a plurality of upper contact points, and each through hole extends from the upper surface of the adapter plate to the lower surface of the adapter plate. The lines individually pass through the first micro-holes of the micro-hole plate and the through holes of the adapter plate, and electrically connect the micro-hole plate to the contact points on the upper surface of the adapter plate. The external circuit traces individually electrically connect the contact points on the transfer board to the contact points on the upper surface of the test circuit board. The test head is electrically connected to the microplate.

The present invention also provides a switching module suitable for the above-mentioned probe card, which is electrically connected to the corresponding test circuit board through the adapter board, so the lines are not staggered, and the lengths tend to be the same, which solves the line signal of the prior art Mutual interference and inconsistent timing of test signals.

Please refer to FIG. 1 and FIG. 2, which are respectively an exploded cross-sectional schematic diagram and a cross-sectional schematic diagram of an exemplary switching module of the present invention, which illustrate a switching module 10. The switching module 10 includes a base 11, a microplate 12 and an adapter plate 13. The material of the base 11 is generally stainless steel, and the center includes a hollow area 111. The material of the microporous plate 12 is generally a ceramic material, which is disposed under the base 11. The transfer board 13 itself can be a single-layer or multi-layer circuit board, which is arranged above the base 11. The microplate 12 includes a plurality of first microholes 121 facing the hollow area 111 of the base 11. The adapter plate 13 includes an upper surface 13U and a lower surface 13B, the lower surface 13B faces the base 11, and the upper surface 13U includes a plurality of upper contact points 131.

In some embodiments, the adapter plate 13 itself is not directly arranged on the base 11 but is heightened by the steel column 139, thereby reducing the angle between the line 18 and the adapter plate 13, so as to reduce the line 18 The bending angle increases the reliability and life of the electrical connection between the circuit 18 and the adapter plate 13. In some embodiments, the transfer board 13 includes a central area 13C and a peripheral area 13E surrounding the central area 13C, and the upper contact point 131 is located in the peripheral area 13E. In some embodiments, the peripheral area 13E is defined as an area where the projection of the adapter plate 13 along its normal direction does not overlap with the hollow area 111 of the base 11. In some embodiments, the adapter plate 13 is circular and has a radius, the central area 13C is defined as a circular area from the center of the circle to the radius *0.7, and the peripheral area 13E is defined as an annular area outside the circular area. . In some embodiments, the projection of the central area 13C along the normal direction of the surface of the adapter plate 13 exactly overlaps the hollow area 111. It should be noted that the arrangement of the upper contact point 131 in the peripheral area 13E of the adapter board 13, that is, the location closer to the periphery of the adapter board 13, will help the upper contact point 131 and the following test circuit board. Electrical connection between.

As shown in FIG. 3, in some embodiments, the switching module 10 further includes a positioning film 19. The positioning film 19 is used to guide the circuit 18 passing through the microplate 12 to make it neatly arranged and convenient for operation. The personnel judge the order of each line 18. The positioning film 19 can be made of a polymer material and has flexibility. The positioning film 19 is disposed between the microwell plate 12 and the adapter plate 13 and above the first microwell 121 of the microwell plate 12. In some embodiments, the interposer board 13 further includes an inner circuit layout 13L located between the upper surface 13U and the lower surface 13B. The inner circuit layout 13L is used to allow the circuit 18 to be electrically connected through the inner circuit layout 13L. The multiple upper contact points 131 of the upper surface 13U are sexually connected. The positioning film 19 includes second microholes 191 that correspond to the first microholes 121 individually, and the spacing between the second microholes 191 is equal to the spacing between the first microholes 121, that is, the positioning film 19 and the microwell plate The line 18 between 12 has not been fan-out layout, but the fan-out layout is started between the positioning film 19 and the lower surface 13B of the adapter plate 13.

In conclusion, after the circuit 18 of this embodiment passes through the positioning film 19, the distance between the circuits 18 will gradually expand as they approach the adapter plate 13 until it reaches the lower surface 13B of the adapter plate 13. Then, the circuit 18 will further pass through the through holes 132 of the adapter plate 13 and be welded to the upper surface 13U of the adapter plate 13, wherein the spacing between the through holes 132 is fixed. In other words, if the distance between two adjacent first microholes 121 of the microwell plate 12 is defined as P1, the distance between two adjacent second microholes 191 of the positioning film 19 is defined as P2, and the adjacent distance between the adapter plate 13 The distance between the two through holes 132 is P3, then P1=P2>P3, and the distance between the lines 18 will gradually approach P3 from the positioning film 19 as they approach the adapter plate 13 gradually.

When the circuit 18 is installed, the positioning film 19 is first set on the microporous plate 12, and the second microholes 191 and the first microholes 121 are aligned one to one with each other. Then, each circuit 18 is passed through the second microhole 191 and the first microhole 121 sequentially from top to bottom. At this time, the section of each circuit 18 between the positioning film 19 and the microporous plate 12 is in a vertical state, that is, each circuit 18 is in a straight line without bending, so that the circuits 18 are kept at a certain interval without interfering with each other. , Thereby eliminating the electrical abnormalities caused by the line interleaving. In addition, the circuit 18 can be regulated through the positioning film 19, and the operator can conveniently perform subsequent electrical connection operations. After the alignment of the circuit is completed, the positioning film 19 and the microporous plate 12 can be further filled with glue (for example, epoxy resin), so that the glue can fill the gap between the positioning film 19 and the microporous plate 12. In this way, the distance between the positioning film 19 and the microporous plate 12 is fixed, and at the same time, the part of the circuit 18 between the positioning film 19 and the microporous plate 12 will also be separated by the glue material, which ensures that The part of the line 18 between the positioning film 19 and the microplate 12 will not be staggered.

As shown in FIG. 4, in some embodiments, the adapter board 23 includes a plurality of first upper contact points 231C and a plurality of second upper contact points 231E that are electrically connected to each other individually. The first upper contact point 231C is located in the central area 23C, and the second upper contact point 231E is located in the peripheral area 23E. In some embodiments, the interposer board 23 further includes an intermediate circuit wiring 27, and the function of the intermediate circuit wiring 27 is to electrically connect the first upper contact point 231C to the second upper contact point 231E individually. Similarly, the circuit 18 between the positioning film 19 and the microplate 12 is also not in a fan-out layout as shown in FIG. 4, but under the positioning film 19 and the adapter plate 13. Fan-out layout begins between surfaces 13B.

In some embodiments, as shown in FIGS. 1 and 2, the distance L between the lower surface 13B of the adapter plate 13 and the upper surface of the microplate 12 is greater than 4 mm. This is because the thickness of the test circuit board is usually greater than 4 mm. In order to allow the switch module 10 to be assembled with the test circuit board, the upper surface 13U of the adapter board 13 can protrude from the upper surface of the test circuit board. Protrude the lower surface of the test circuit board. In addition, in some embodiments, the set of positions where the circuit 18 contacts the lower surface 13B of the adapter plate 13 will form a circular welding area with a radius R or a rectangular area with a length and width of 2R. The distance between the lower surface 13B and the upper surface of the microplate 12 is defined as L, where R/L is in the range of 0.1 to 7.5. In some embodiments, the distance L between the lower surface 13B of the adapter plate 13 and the upper surface of the microplate 12 is in the range of 4 mm to 40 mm, and the radius R of the circular welding area is in the range of 4 mm to 30 mm. The range between.

Please refer to FIGS. 5 to 8, which are respectively an exploded cross-sectional schematic diagram, a cross-sectional schematic diagram, a schematic diagram of electrical connections, and a schematic top view of an exemplary probe card of the present invention, which illustrate a probe card 30. The probe card 30 includes a test circuit board 31, a reinforcing member 32, a switching module 20 and a test head 35. The test circuit board 31 includes an upper surface 31U, a lower surface 31B and a central through hole 311. The upper surface 31U is defined as the tester side, that is, the surface connected to the test device, and the lower surface 31B is defined as the wafer side, that is, the surface facing the wafer to be tested. The reinforcing member 32 may be a frame made of aluminum or aluminum alloy, which is disposed on the upper surface 31U of the test circuit board 31 to reinforce the rigidity of the test circuit board 31. A central carrier 321 corresponding to the central through hole 311 of the test circuit board 31 is provided in the center of the reinforcing member 32, and the central carrier 321 is connected to the body of the reinforcing member 32 through four bridge members 329. In some embodiments, based on the different models of the test circuit board 31, the central carrier 321 can also be connected to the main body of the reinforcing member 32 only through two bridges 329, or even to the main body of the reinforcing member 32 through other bridges. Connected.

When assembling, the switch module 20 is inserted into the central carrier 321 on the upper surface 32U of the self-reinforcing member 32, and the microplate 12 of the switch module 20 protrudes from the lower surface 32B of the reinforcement member 32 and the test circuit board 31 The lower surface 31B is electrically connected to the test head 35. In some embodiments, a flange 323 is formed on the inner surface of the central carrier 321, as shown in FIG. 5. When the switch module 20 is accommodated in the central carrier 321, the flange 323 abuts the outer periphery 119 of the base 11, restricting the switch module 20 from being able to pass through the reinforcing member 32 from top to bottom in the vertical direction.

In some embodiments, the outer diameter of the adapter board 23 can be as large as possible, for example, can be larger than the aperture of the central through hole 311 of the test circuit board 31.

In some embodiments, the material of the aforementioned circuit 18 is different from the material of the intermediate circuit wiring 27 and the external circuit wiring 37. Since the wire diameter of the circuit 18 is not greater than 50 microns, for example, 35 microns, the general metal wire is easily broken. The material of the circuit 18 can be selected from a metal material that will not break under this wire diameter requirement, such as copper, tungsten alloy or copper-silver alloy, or the above alloy is further doped with rhenium, palladium or beryllium. Because the wire diameter of the line 18 is quite small and the arrangement is compact, by providing the positioning film 19, the line 18 can be assisted to regularize and comb the line 18, which is convenient for the staff to work. In some embodiments, the length ratio of the longest line to the shortest line among the lines 18 is less than 1.1. That is to say, the lengths of the multiple lines 18 are substantially the same as possible. Even if there are differences, the length of the longest line cannot be compared. The shortest line is more than 10% long. In addition, a sealant (for example, epoxy resin) can be further injected into the space between the microporous plate 12 and the adapter plate 13 to seal the circuit 18 to protect the circuit 18 and improve the overall weather resistance of the switching module 10.

It should be particularly noted that, in order to facilitate the description of the structure of the switch module and the probe card, in the drawings attached to this application, the various components are not drawn in full scale.

Although the present invention has been disclosed by the embodiments as above, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be subject to the scope of the attached patent application.

10: Switch module 11: Pedestal 111: hollow area 119: Outer periphery 12: Microplate 121: The first micro hole 13: adapter board 131: upper contact point 132: Through hole 139: Steel Column 13U: upper surface 13B: Lower surface 13E: Peripheral area 13C: Central area 13L: inner circuit layout 18: Line 19: positioning film 191: second microhole 20: Switch module 23: adapter board 23E: Peripheral area 23C: Central area 231C: The first upper contact point 231E: The second upper contact point 27: Intermediary circuit routing 30: Probe card 31: Test circuit board 31U: upper surface 31B: lower surface 311: central perforation 32: Reinforcement 32U: upper surface 32B: bottom surface 321: Central carrier 323: Flange 329: Bridge 35: Test head 37: External circuit routing

[Figure 1] is a schematic cross-sectional exploded view of an exemplary switching module of the present invention; [Figure 2] is a schematic cross-sectional view of an exemplary switching module of the present invention; [Figure 3] is a schematic cross-sectional view of the switching module with positioning film and internal circuit layout of the present invention; [Figure 4] is a schematic cross-sectional view of the switching module with positioning film and external circuit wiring of the present invention; [Figure 5] is a schematic cross-sectional exploded view of an exemplary probe card of the present invention; [Figure 6] is a schematic cross-sectional view of an exemplary probe card of the present invention; [Figure 7] is a schematic diagram of the electrical connection of an exemplary probe card of the present invention; and [Figure 8] is a schematic top view of an exemplary probe card of the present invention.

10: Switch module

11: Pedestal

111: hollow area

119: Perimeter

12: Microplate

121: The first micro hole

13: adapter board

131: upper contact point

132: Through hole

139: Steel Column

13U: upper surface

13B: Lower surface

13E: Peripheral area

13C: Central area

13L: inner circuit layout

Claims (17)

A probe card including: A test circuit board, including an upper surface, a lower surface and a central perforation; A reinforcing piece arranged on the upper surface of the test circuit board, the reinforcing piece including a central carrier corresponding to the central perforation; A switching module is housed in the central carrier of the reinforcement, and the switching module includes: A base, including a hollow area; A micro-well plate, arranged under the base, containing a plurality of first micro-holes, the first micro-holes facing the hollow area; An adapter plate is arranged above the base and includes an upper surface, a lower surface and a plurality of through holes. The lower surface of the adapter plate faces the base, and the upper surface of the adapter plate includes a plurality of upper contact points, Each of the through holes extends from the upper surface of the adapter plate to the lower surface of the adapter plate; A plurality of circuits respectively pass through the first microholes of the microplate and the through holes of the adapter plate, and the circuits electrically connect the microplate to the upper surface of the adapter plate. Upper contact point; and A plurality of external circuit traces electrically connect the upper contact points of the adapter board to the upper surface of the test circuit board individually; and A test head, electrically connected to the microplate; The distance between two adjacent through holes of the adapter plate is greater than the distance between two adjacent first microholes of the microporous plate. According to the probe card according to claim 1, the switch module further includes a positioning film, the positioning film is disposed between the microplate and the adapter plate and is located in the first microwells of the microplate Above the positioning film, the positioning film includes a plurality of second microholes individually corresponding to the first microholes, the lines pass through the second microholes of the positioning film individually, and two adjacent ones of the positioning film The distance between the second microholes is equal to the distance between two adjacent first microholes of the microwell plate. The probe card according to claim 2, wherein the riser board includes a central area and a peripheral area surrounding the central area, and the upper contact points are located in the peripheral area. The probe card according to claim 3, wherein the projection of the peripheral area and the hollow area of the base do not overlap. The probe card according to claim 4, wherein the adapter board further includes an inner layer circuit layout located between the upper surface and the lower surface, and the lines are electrically connected to the inner layer circuit layout through the inner layer circuit layout. The upper contact points of the adapter board. The probe card according to claim 2, wherein the switch module further includes a plurality of intermediary circuit traces, the adapter board further includes a central area and a peripheral area surrounding the central area, and the adapter board The upper contact points are divided into a plurality of first upper contact points and a plurality of second upper contact points, the first upper contact points are located in the central area, the second upper contact points are located in the peripheral area, and the lines are electrically connected The first upper contact points of the microporous plate to the transfer board, and the intermediate circuit traces are electrically connected to the first upper contact points to the second upper contact points. The probe card according to claim 6, wherein the projection of the peripheral area and the hollow area of the base do not overlap. The probe card according to claim 6, wherein the materials of the circuits are different from the materials of the external circuit wiring and the intermediate circuit wiring. The probe card according to claim 1, wherein a flange is formed on the inner surface of the central carrier, and the flange abuts against the periphery of the base. The probe card according to claim 1, wherein the microplate is exposed on the lower surface of the test circuit board. The probe card according to claim 1, wherein the outer diameter of the adapter board is larger than the aperture of the central through hole of the test circuit board. A switch module suitable for electrically connecting a plurality of probes of a test head to a plurality of upper contact points on the upper surface of a test circuit board, the switch module includes: A base, including a hollow area; A micro-well plate, arranged under the base, containing a plurality of first micro-holes, the first micro-holes facing the hollow area; An adapter plate is arranged above the base, and the outer diameter of the adapter plate is larger than the aperture of the hollow area. The adapter plate includes an upper surface, a lower surface and a plurality of through holes, and the adapter plate is under The surface faces the base, the upper surface of the adapter plate includes a plurality of upper contact points, and each through hole extends from the upper surface of the adapter plate to the lower surface of the adapter plate; A plurality of circuits respectively pass through the first microholes of the microplate and the through holes of the adapter plate, and the circuits electrically connect the microplate to the upper surface of the adapter plate. Upper contact point; and A plurality of external circuit traces electrically connect the upper contact points of the adapter board to the upper contact points of the upper surface of the test circuit board individually; The distance between two adjacent through holes of the adapter plate is greater than the distance between two adjacent first microholes of the microporous plate. The switching module according to claim 12, wherein the distance between the lower surface of the adapter plate and the upper surface of the microplate is greater than 4 mm. The switching module according to claim 12, wherein the length ratio of the longest line to the shortest line among the lines is less than 1.1. The switching module according to claim 12, wherein the set of positions where the lines contact the lower surface of the adapter plate constitutes a circular welding area, the radius of the circular welding area is defined as R, and the adapter plate The distance between the lower surface and the upper surface of the microplate is defined as L, where R/L is in the range of 0.1 to 7.5. The switching module according to claim 12, wherein the set of positions where the lines contact the lower surface of the adapter plate constitutes a rectangular welding area, and the side length of the rectangular welding area is defined as 2R. The distance between the lower surface and the upper surface of the microplate is defined as L, where R/L is in the range of 0.1 to 7.5. The switching module according to claim 12, further comprising a positioning film disposed between the microplate and the adapter plate and located above the first microwells of the microplate, the The positioning film includes a plurality of second microholes individually corresponding to the first microholes, and the lines individually pass through the second microholes of the positioning film; wherein two adjacent through holes of the adapter plate The distance is greater than the distance between two adjacent second microholes of the positioning film, and the distance between two adjacent second microholes of the positioning film is equal to the distance between two adjacent first microholes of the microporous plate.

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