TWI708803B - Curable composition and optical member - Google Patents
Curable composition and optical member Download PDFInfo
- Publication number
- TWI708803B TWI708803B TW106105180A TW106105180A TWI708803B TW I708803 B TWI708803 B TW I708803B TW 106105180 A TW106105180 A TW 106105180A TW 106105180 A TW106105180 A TW 106105180A TW I708803 B TWI708803 B TW I708803B
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- acrylate
- curable composition
- mentioned
- phenylbenzyl
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 66
- 230000003287 optical effect Effects 0.000 title claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 94
- 150000001875 compounds Chemical class 0.000 claims abstract description 47
- 239000002245 particle Substances 0.000 claims abstract description 46
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 42
- 125000006187 phenyl benzyl group Chemical group 0.000 claims abstract description 30
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 22
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 18
- -1 o-phenylbenzyl Chemical group 0.000 claims description 80
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 41
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 23
- 239000004305 biphenyl Substances 0.000 description 23
- 235000010290 biphenyl Nutrition 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- 239000006185 dispersion Substances 0.000 description 16
- 239000006087 Silane Coupling Agent Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- 150000002596 lactones Chemical group 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000002609 medium Substances 0.000 description 6
- 229920000193 polymethacrylate Polymers 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 239000000543 intermediate Substances 0.000 description 5
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 4
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000012527 feed solution Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- ALLIZEAXNXSFGD-UHFFFAOYSA-N 1-methyl-2-phenylbenzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1 ALLIZEAXNXSFGD-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 241000237509 Patinopecten sp. Species 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910000039 hydrogen halide Inorganic materials 0.000 description 2
- 239000012433 hydrogen halide Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 235000020637 scallop Nutrition 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VKTQADPEPIVMHK-UHFFFAOYSA-N (2-phenylphenyl)methanol Chemical compound OCC1=CC=CC=C1C1=CC=CC=C1 VKTQADPEPIVMHK-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- QSZIMZZZMGTENC-UHFFFAOYSA-N (3-phenylphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(C=2C=CC=CC=2)=C1 QSZIMZZZMGTENC-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- QBECDXJGYFRACA-UHFFFAOYSA-N (4-phenylphenyl)methyl prop-2-enoate Chemical compound C1=CC(COC(=O)C=C)=CC=C1C1=CC=CC=C1 QBECDXJGYFRACA-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- QEFMDEFYYCMJPY-UHFFFAOYSA-N 1-(chloromethyl)-2-phenylbenzene Chemical group ClCC1=CC=CC=C1C1=CC=CC=C1 QEFMDEFYYCMJPY-UHFFFAOYSA-N 0.000 description 1
- OQOANOQNIDTIHS-UHFFFAOYSA-N 1-[(2,7-dihydroxynaphthalen-1-yl)methyl]naphthalene-2,7-diol Chemical compound C1=C(O)C=C2C(CC3=C(O)C=CC4=CC=C(C=C43)O)=C(O)C=CC2=C1 OQOANOQNIDTIHS-UHFFFAOYSA-N 0.000 description 1
- CRXWFDHIWZFCTR-UHFFFAOYSA-N 1-[2-[2-(2-oxobut-3-enyl)phenyl]phenyl]but-3-en-2-one Chemical group C=CC(=O)CC1=CC=CC=C1C1=CC=CC=C1CC(=O)C=C CRXWFDHIWZFCTR-UHFFFAOYSA-N 0.000 description 1
- CPNDWRWNUGOQGV-UHFFFAOYSA-N 1-[3-(2-oxobut-3-enyl)-2-phenylphenyl]but-3-en-2-one Chemical group C=CC(=O)CC1=CC=CC(CC(=O)C=C)=C1C1=CC=CC=C1 CPNDWRWNUGOQGV-UHFFFAOYSA-N 0.000 description 1
- OUAJRXVRWXOIOM-UHFFFAOYSA-N 1-[3-(2-oxobut-3-enyl)-4-phenylphenyl]but-3-en-2-one Chemical group C=CC(=O)CC1=CC(CC(=O)C=C)=CC=C1C1=CC=CC=C1 OUAJRXVRWXOIOM-UHFFFAOYSA-N 0.000 description 1
- LFEMFMZQXOVTPX-UHFFFAOYSA-N 1-[3-[3-(2-oxobut-3-enyl)phenyl]phenyl]but-3-en-2-one Chemical group C=CC(=O)CC1=CC=CC(C=2C=C(CC(=O)C=C)C=CC=2)=C1 LFEMFMZQXOVTPX-UHFFFAOYSA-N 0.000 description 1
- QFIROYAYCOLNFE-UHFFFAOYSA-N 1-[4-[2-(2-oxobut-3-enyl)phenyl]phenyl]but-3-en-2-one Chemical group C1=CC(CC(=O)C=C)=CC=C1C1=CC=CC=C1CC(=O)C=C QFIROYAYCOLNFE-UHFFFAOYSA-N 0.000 description 1
- MSTBNCRDGMNFOU-UHFFFAOYSA-N 1-[4-[4-(2-oxobut-3-enyl)phenyl]phenyl]but-3-en-2-one Chemical group C1=CC(CC(=O)C=C)=CC=C1C1=CC=C(CC(=O)C=C)C=C1 MSTBNCRDGMNFOU-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- DVWQNBIUTWDZMW-UHFFFAOYSA-N 1-naphthalen-1-ylnaphthalen-2-ol Chemical compound C1=CC=C2C(C3=C4C=CC=CC4=CC=C3O)=CC=CC2=C1 DVWQNBIUTWDZMW-UHFFFAOYSA-N 0.000 description 1
- JHGGYGMFCRSWIZ-UHFFFAOYSA-N 2,2-dichloro-1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C(Cl)Cl)=CC=C1OC1=CC=CC=C1 JHGGYGMFCRSWIZ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- JMVZGKVGQDHWOI-UHFFFAOYSA-N 2-(2-methylpropoxy)-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC(C)C)C(=O)C1=CC=CC=C1 JMVZGKVGQDHWOI-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- CWNOEVURTVLUNV-UHFFFAOYSA-N 2-(propoxymethyl)oxirane Chemical compound CCCOCC1CO1 CWNOEVURTVLUNV-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- FIOCEWASVZHBTK-UHFFFAOYSA-N 2-[2-(2-oxo-2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)C(=O)C1=CC=CC=C1 FIOCEWASVZHBTK-UHFFFAOYSA-N 0.000 description 1
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 1
- SVIQBUBNVYWIDV-UHFFFAOYSA-N 2-methoxy-2-(2-methoxyphenyl)-1-phenylethanone Chemical compound C=1C=CC=C(OC)C=1C(OC)C(=O)C1=CC=CC=C1 SVIQBUBNVYWIDV-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- VZQSBJKDSWXLKX-UHFFFAOYSA-N 3-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C=C(O)C=CC=2)=C1 VZQSBJKDSWXLKX-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- DTOOTUYZFDDTBD-UHFFFAOYSA-N 3-chloropropylsilane Chemical compound [SiH3]CCCCl DTOOTUYZFDDTBD-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical compound C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005047 Allyltrichlorosilane Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- MUGBFCWZTSISOC-UHFFFAOYSA-N CCC[Si](OC)(OC)OCCCCOCC1CO1 Chemical compound CCC[Si](OC)(OC)OCCCCOCC1CO1 MUGBFCWZTSISOC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- JMMSLMMJRMCXPW-UHFFFAOYSA-N OC.OC.C1CC2CCC1C2 Chemical compound OC.OC.C1CC2CCC1C2 JMMSLMMJRMCXPW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical class [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- TUOBEAZXHLTYLF-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CC)COC(=O)C=C TUOBEAZXHLTYLF-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- HJFUUQISSHZQRS-UHFFFAOYSA-M acetyloxyaluminum(2+);propan-2-olate Chemical compound CC(C)[O-].CC(C)[O-].CC(=O)O[Al+2] HJFUUQISSHZQRS-UHFFFAOYSA-M 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- IJVHTTITHMXYTG-UHFFFAOYSA-N benzhydryl prop-2-enoate Chemical compound C=1C=CC=CC=1C(OC(=O)C=C)C1=CC=CC=C1 IJVHTTITHMXYTG-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical class NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- ATNHDLDRLWWWCB-AENOIHSZSA-M chlorophyll a Chemical group C1([C@@H](C(=O)OC)C(=O)C2=C3C)=C2N2C3=CC(C(CC)=C3C)=[N+]4C3=CC3=C(C=C)C(C)=C5N3[Mg-2]42[N+]2=C1[C@@H](CCC(=O)OC\C=C(/C)CCC[C@H](C)CCC[C@H](C)CCCC(C)C)[C@H](C)C2=C5 ATNHDLDRLWWWCB-AENOIHSZSA-M 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 238000004895 liquid chromatography mass spectrometry Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002557 polyglycidol polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- MOVRCMBPGBESLI-UHFFFAOYSA-N prop-2-enoyloxysilicon Chemical compound [Si]OC(=O)C=C MOVRCMBPGBESLI-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 125000005581 pyrene group Chemical group 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010898 silica gel chromatography Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- HKFSBKQQYCMCKO-UHFFFAOYSA-N trichloro(prop-2-enyl)silane Chemical compound Cl[Si](Cl)(Cl)CC=C HKFSBKQQYCMCKO-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- IWZLBIVZPIDURM-UHFFFAOYSA-N trimethoxy(3-prop-1-enoxypropyl)silane Chemical compound CO[Si](OC)(OC)CCCOC=CC IWZLBIVZPIDURM-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 150000007971 urates Chemical class 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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Abstract
本發明提供一種高折射率且黏度較低之硬化性組成物及其硬化物、及使用上述硬化性組成物而成之光學構件。本發明係一種硬化性組成物、其硬化物、及使用上述硬化性組成物而成之光學構件,該硬化性組成物之特徵在於含有:氧化鋯粒子(A)與含(甲基)丙烯醯基之化合物(B),且上述含(甲基)丙烯醯基之化合物(B)以(甲基)丙烯酸苯基苄酯(B1)作為必須成分。上述硬化性組成物具有即便含有氧化鋯粒子(A)而黏度亦較低之特徵。 The present invention provides a curable composition with a high refractive index and a low viscosity, a cured product thereof, and an optical member using the curable composition. The present invention is a curable composition, a cured product thereof, and an optical member using the curable composition. The curable composition is characterized by containing: zirconia particles (A) and (meth)acrylic acid (B), and the above-mentioned (meth)acryloyl group-containing compound (B) contains phenyl benzyl (meth)acrylate (B1) as an essential component. The above-mentioned curable composition has a characteristic of low viscosity even if it contains zirconia particles (A).
Description
本發明係關於一種高折射率且低黏度之硬化性組成物及其硬化物、及光學構件。 The present invention relates to a curable composition with high refractive index and low viscosity, its cured product, and an optical component.
於液晶顯示裝置等背光裝置設置有用於提高亮度之稜鏡膜或微透鏡膜等亮度提高片材。亮度提高膜主要係藉由利用模具對樹脂材料賦形之方法而製造,因此亮度提高膜用樹脂材料必須不含溶劑,且為適於賦形之低黏度。又,為了增強亮度提高效果,硬化物之折射率較高且透明性較高、不易受傷等亦成為重要之要求性能。 The backlight device such as the liquid crystal display device is provided with a brightness-enhancing sheet such as a thin film or a micro-lens film for enhancing the brightness. The brightness-enhancing film is mainly manufactured by shaping the resin material with a mold. Therefore, the resin material for the brightness-enhancing film must contain no solvent and have a low viscosity suitable for shaping. In addition, in order to enhance the brightness improvement effect, the cured product has a high refractive index, high transparency, and resistance to damage.
作為亮度提高膜用樹脂材料,已知有含有氧化鋯微粒子及苯基苯酚聚乙氧基丙烯酸酯等之硬化性組成物(參照專利文獻1)。此種無機微粒子摻合型樹脂材料具有折射率較高之特徵,另一方面由於摻合無機微粒子而有高黏度化之傾向,從而要求開發出雖含有無機微粒子但黏度較低之樹脂材料。 As a resin material for a brightness enhancement film, a curable composition containing zirconia fine particles, phenylphenol polyethoxyacrylate, and the like is known (see Patent Document 1). This type of inorganic fine particle blended resin material has the characteristic of high refractive index. On the other hand, due to the blending of inorganic fine particles, there is a tendency to increase the viscosity. Therefore, it is required to develop a resin material that contains inorganic fine particles but has a lower viscosity.
[先前技術文獻] [Prior Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2013-249439號公報 [Patent Document 1] JP 2013-249439 A
因此,本發明所欲解決之課題在於提供一種高折射率且低黏度之硬化性組成物及其硬化物、及光學構件。 Therefore, the problem to be solved by the present invention is to provide a curable composition with a high refractive index and low viscosity, a cured product thereof, and an optical member.
本發明人等為了解決上述課題而進行銳意研究,結果發現,藉由將氧化鋯粒子與(甲基)丙烯酸苯基苄酯組合,可獲得黏度與折射率之平衡性非常優異之硬化性組成物,從而完成了本發明。 The inventors of the present invention conducted intensive research to solve the above-mentioned problems and found that by combining zirconia particles with phenylbenzyl (meth)acrylate, a curable composition with a very good balance of viscosity and refractive index can be obtained. , Thereby completing the present invention.
即,本發明係關於一種硬化性組成物,其特徵在於含有:氧化鋯粒子(A)與含(甲基)丙烯醯基之化合物(B),且上述含(甲基)丙烯醯基之化合物(B)以(甲基)丙烯酸苯基苄酯(B1)作為必須成分。 That is, the present invention relates to a curable composition characterized by containing: zirconium oxide particles (A) and a (meth)acryloyl group-containing compound (B), and the (meth)acryloyl group-containing compound (B) Phenyl benzyl (meth)acrylate (B1) is used as an essential component.
本發明進而係關於一種使上述硬化性組成物硬化而獲得之硬化物、及光學構件。 The present invention further relates to a cured product obtained by curing the above-mentioned curable composition, and an optical member.
根據本發明,能夠提供一種高折射率且低黏度之硬化性組成物及其硬化物、及光學構件。 According to the present invention, it is possible to provide a curable composition having a high refractive index and a low viscosity, a cured product thereof, and an optical member.
以下,對本發明進行詳細說明。 Hereinafter, the present invention will be described in detail.
本發明之硬化性組成物之特徵在於含有:氧化鋯粒子(A)與含(甲基)丙烯醯基之化合物(B),且上述含(甲基)丙烯醯基之化合物(B)以(甲基)丙烯酸苯基苄酯(B1)作為必須成分。 The curable composition of the present invention is characterized by containing zirconium oxide particles (A) and a (meth)acryloyl group-containing compound (B), and the (meth)acryloyl group-containing compound (B) is Phenyl benzyl meth)acrylate (B1) is an essential component.
本發明之硬化性組成物所含有之氧化鋯粒子(A)係將原料之氧化鋯粒子(a)分散於以含(甲基)丙烯醯基之化合物(B)作為必須成分之分散介質中而獲得。就成為折射率較高且透光性亦優異之硬化物之方面而言,硬化性組成物中之氧化鋯粒子(A)之平均粒徑較佳為20~100nm之範圍。 The zirconia particles (A) contained in the curable composition of the present invention are obtained by dispersing the raw material zirconia particles (a) in a dispersion medium containing a (meth)acryloyl group-containing compound (B) as an essential component obtain. In terms of becoming a cured product with a high refractive index and excellent light transmittance, the average particle diameter of the zirconia particles (A) in the curable composition is preferably in the range of 20 to 100 nm.
再者,於本案發明中,上述氧化鋯粒子(A)之平均粒徑為於以下之條件下測定硬化性組成物中之粒徑所得之值。 Furthermore, in the present invention, the average particle diameter of the zirconia particles (A) is a value obtained by measuring the particle diameter in the curable composition under the following conditions.
粒徑測定裝置:大塚電子股份有限公司製造之「ELSZ-2」 Particle size measuring device: "ELSZ-2" manufactured by Otsuka Electronics Co., Ltd.
粒徑測定樣品:將硬化性組成物製成不揮發分0.6質量%之甲基異丁基酮溶液者。 Particle size measurement sample: The curable composition is made into a non-volatile 0.6 mass% methyl isobutyl ketone solution.
用作原料之氧化鋯粒子(a)可使用通常市售者等公知者。粒子形狀並無特別限定,例如為球狀、中空狀、多孔狀、棒狀、板狀、纖維狀、或不定形均可。其中,就獲得分散穩定性優異、且折射率較高之硬化物之方面而言,較佳為球狀。就獲得分散穩定性優異、且透光率及折射率較高之硬化物之方面而言,上述氧化鋯粒子(a)之平均一次粒徑較佳為1~50nm,尤佳為1~30nm。上述氧化鋯粒子(a)之結晶結構亦並無特別限定,就獲得分散穩定性優異、折射率較高之硬化物之方面而言,較佳為單斜晶系。又,於本發明中,亦可使用各種矽烷偶合劑(C)等而將官能基 導入至上述氧化鋯粒子(a)之微粒子表面。 The zirconium oxide particles (a) used as a raw material can be generally known ones such as commercially available ones. The particle shape is not particularly limited, and may be, for example, a spherical shape, a hollow shape, a porous shape, a rod shape, a plate shape, a fiber shape, or an amorphous shape. Among them, in terms of obtaining a cured product having excellent dispersion stability and a high refractive index, a spherical shape is preferred. In terms of obtaining a cured product having excellent dispersion stability and relatively high light transmittance and refractive index, the average primary particle size of the above-mentioned zirconia particles (a) is preferably 1 to 50 nm, particularly preferably 1 to 30 nm. The crystal structure of the zirconium oxide particles (a) is also not particularly limited. In terms of obtaining a cured product having excellent dispersion stability and a high refractive index, a monoclinic system is preferred. Moreover, in the present invention, various silane coupling agents (C) and the like can also be used to remove the functional group It is introduced to the surface of the fine particles of the zirconia particles (a).
上述矽烷偶合劑(C)例如可列舉如下所述者。 Examples of the above-mentioned silane coupling agent (C) include the following.
作為(甲基)丙烯醯氧基系矽烷偶合劑,可例示:3-(甲基)丙烯醯氧基丙基三甲基矽烷、3-(甲基)丙烯醯氧基丙基甲基二甲氧基矽烷、3-(甲基)丙烯醯氧基丙基三甲氧基矽烷、3-(甲基)丙烯醯氧基丙基甲基二乙氧基矽烷、3-(甲基)丙烯醯氧基丙基三乙氧基矽烷。作為丙烯醯氧基系矽烷偶合劑,可例示3-丙烯醯氧基丙基三甲氧基矽烷。 Examples of the (meth)acryloxy silane coupling agent include: 3-(meth)acryloxypropyltrimethylsilane, 3-(meth)acryloxypropylmethyldimethyldimethyl Oxysilane, 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropylmethyldiethoxysilane, 3-(meth)acryloxypropyltrimethoxysilane Group propyl triethoxy silane. As the acryloxy-based silane coupling agent, 3-propenoxypropyltrimethoxysilane can be exemplified.
作為乙烯基系矽烷偶合劑,可例示:烯丙基三氯矽烷、烯丙基三乙氧基矽烷、烯丙基三甲氧基矽烷、二乙氧基甲基乙烯基矽烷、三氯乙烯基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷。 Examples of the vinyl silane coupling agent include: allyl trichlorosilane, allyl triethoxy silane, allyl trimethoxy silane, diethoxy methyl vinyl silane, trichloro vinyl silane , Vinyl trichlorosilane, vinyl trimethoxy silane, vinyl triethoxy silane, vinyl tris (2-methoxyethoxy) silane.
作為環氧系矽烷偶合劑,可例示:二乙氧基(縮水甘油氧基丙基)甲基矽烷、2-(3,4環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷。作為苯乙烯系矽烷偶合劑,可例示:對苯乙烯基三甲氧基矽烷。 Examples of epoxy-based silane coupling agents include diethoxy (glycidoxypropyl) methyl silane, 2-(3,4 epoxycyclohexyl) ethyl trimethoxy silane, 3-glycidoxy Propyl propyl trimethoxy silane, 3-glycidoxy propyl methyl diethoxy silane, 3-glycidoxy propyl triethoxy silane. As the styrene-based silane coupling agent, p-styryltrimethoxysilane can be exemplified.
作為胺基系矽烷偶合劑,可例示:N-2(胺基乙基)3-胺基丙基甲基二甲氧基矽烷、N-2(胺基乙基)3-胺基丙基三甲氧基矽烷、N-2(胺基乙基)3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽基-N-(1,3-二甲基亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷。 Examples of the amino-based silane coupling agent include: N-2 (aminoethyl) 3-aminopropylmethyl dimethoxy silane, N-2 (aminoethyl) 3-aminopropyl trimethyl Oxysilane, N-2 (aminoethyl) 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Triethoxysilyl-N-(1,3-dimethylbutylene) propylamine, N-phenyl-3-aminopropyl trimethoxysilane.
作為脲基系矽烷偶合劑,可例示3-脲基丙基三乙氧基矽烷。 作為氯丙基系矽烷偶合劑,可例示:3-氯丙基三甲氧基矽烷。作為巰基系矽烷偶合劑,可例示:3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷。作為硫基系矽烷偶合劑,可例示雙(三乙氧基矽基丙基)四硫醚。作為異氰酸基系矽烷偶合劑,可例示3-異氰酸基丙基三乙氧基矽烷。作為鋁系偶合劑,可例示乙醯烷氧基二異丙醇鋁。 As the ureido silane coupling agent, 3-ureidopropyl triethoxy silane can be exemplified. As the chloropropyl silane coupling agent, 3-chloropropyltrimethoxysilane can be exemplified. As the mercapto-based silane coupling agent, 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane can be exemplified. As the sulfur-based silane coupling agent, bis(triethoxysilylpropyl) tetrasulfide can be exemplified. As the isocyanato-based silane coupling agent, 3-isocyanatopropyltriethoxysilane can be exemplified. As the aluminum-based coupling agent, acetoxy aluminum diisopropoxide can be exemplified.
該等矽烷偶合劑(C)可單獨使用1種,亦可將2種以上併用。其中,較佳為具有(甲基)丙烯醯氧基、縮水甘油基、環氧環己基者,尤佳為3-(甲基)丙烯醯氧基丙基三甲氧基矽烷。 These silane coupling agents (C) may be used individually by 1 type, and may use 2 or more types together. Among them, those having a (meth)acryloxy group, glycidyl group, and epoxycyclohexyl group are preferred, and 3-(meth)acryloxypropyltrimethoxysilane is particularly preferred.
於本發明中,為了進一步提高上述氧化鋯粒子(A)之分散穩定性,亦可使用分散劑(D)。上述分散劑(D)只要為含有與上述氧化鋯粒子(A)具有親和性之官能基的化合物,則並無特別限定,例如可列舉:羧酸、硫酸、磺酸、磷酸、該等酸化合物之鹽等具有酸基之陰離子系分散劑。其中,就成為分散穩定性更高之硬化性組成物之方面而言,較佳為磷酸酯系分散劑,更佳為具有源自內酯化合物之結構部位者。又,更佳為其酸值為100~300mgKOH/g之範圍,且更佳為重量平均分子量(Mw)為1,000~3,000之範圍。 In the present invention, in order to further improve the dispersion stability of the zirconia particles (A), a dispersant (D) may also be used. The dispersant (D) is not particularly limited as long as it is a compound containing a functional group having affinity with the zirconia particles (A), and examples thereof include carboxylic acid, sulfuric acid, sulfonic acid, phosphoric acid, and these acid compounds Anionic dispersing agents with acid groups such as salts. Among them, in terms of becoming a curable composition with higher dispersion stability, a phosphate ester-based dispersant is preferred, and one having a structural part derived from a lactone compound is more preferred. Moreover, the acid value is more preferably in the range of 100 to 300 mgKOH/g, and the weight average molecular weight (Mw) is more preferably in the range of 1,000 to 3,000.
再者,於本發明中,重量平均分子量(Mw)係使用凝膠滲透層析儀(GPC),於下述條件下進行測定之值。 Furthermore, in the present invention, the weight average molecular weight (Mw) is a value measured using a gel permeation chromatography (GPC) under the following conditions.
測定裝置:Tosoh股份有限公司製造之HLC-8220 Measuring device: HLC-8220 manufactured by Tosoh Co., Ltd.
管柱:Tosoh股份有限公司製造之保護管柱HXL-H Column: protection column HXL-H manufactured by Tosoh Co., Ltd.
+Tosoh股份有限公司製造之TSkgel G5000HXL +TSkgel G5000HXL manufactured by Tosoh Co., Ltd.
+Tosoh股份有限公司製造之TSkgel G4000HXL +TSkgel G4000HXL manufactured by Tosoh Co., Ltd.
+Tosoh股份有限公司製造之TSkgel G3000HXL +TSkgel G3000HXL manufactured by Tosoh Co., Ltd.
+Tosoh股份有限公司製造之TSkgel G2000HXL +TSkgel G2000HXL manufactured by Tosoh Co., Ltd.
檢測器:RI(示差折射計) Detector: RI (differential refractometer)
資料處理:Tosoh股份有限公司製造之SC-8010 Data processing: SC-8010 manufactured by Tosoh Co., Ltd.
測定條件:管柱溫度40℃ Measurement conditions: column temperature 40℃
溶劑:四氫呋喃 Solvent: Tetrahydrofuran
流速:1.0ml/分鐘 Flow rate: 1.0ml/min
標準:聚苯乙烯 Standard: Polystyrene
試樣:使用微型過濾器,將以樹脂固形物成分換算為0.4質量%之四氫呋喃溶液過濾後所得者(100μl) Sample: Use a micro filter to filter a 0.4% by mass tetrahydrofuran solution converted to resin solid content (100μl)
於本發明之硬化性組成物之製備中,上述分散劑(D)之使用量並無特別限定,較佳為相對於上述氧化鋯粒子(a)之總質量為0.1~30質量%之範圍,更佳為0.5~15質量%之範圍。 In the preparation of the curable composition of the present invention, the amount of the dispersant (D) used is not particularly limited, and it is preferably in the range of 0.1-30% by mass relative to the total mass of the zirconia particles (a), More preferably, it is the range of 0.5-15 mass %.
本發明之硬化性組成物所含有之含(甲基)丙烯醯基之化合物(B)以(甲基)丙烯酸苯基苄酯(B1)作為必須成分。(甲基)丙烯酸苯基苄酯(B1)為(甲基)丙烯酸鄰苯基苄酯、(甲基)丙烯酸間苯基苄酯、(甲基)丙烯酸對苯基苄酯均可,可單獨使用,亦可使用2種以上之混合物。其中,(甲基)丙烯酸鄰苯基苄酯及(甲基)丙烯酸間苯基苄酯於如下方面較佳,即,於25℃之液體之折射率為1.57以上,且黏度為30mPa‧s以下,為相對較高之折射率,並且亦表現出低黏度。又,丙烯酸對苯基苄酯於如下方面較佳,即,雖然於常溫下為固體,但顯示出於40℃時之液體之折射率為1.59 以上之非常高之值。 The (meth)acryloyl group-containing compound (B) contained in the curable composition of the present invention contains phenylbenzyl (meth)acrylate (B1) as an essential component. Phenyl benzyl (meth)acrylate (B1) can be o-phenylbenzyl (meth)acrylate, m-phenylbenzyl (meth)acrylate, or p-phenylbenzyl (meth)acrylate. It can also be used as a mixture of two or more kinds. Among them, o-phenylbenzyl (meth)acrylate and m-phenylbenzyl (meth)acrylate are preferred in the following aspects, that is, the refractive index of the liquid at 25°C is 1.57 or more, and the viscosity is 30mPa‧s or less , Is a relatively high refractive index, and also exhibits low viscosity. In addition, p-phenylbenzyl acrylate is preferable in that although it is a solid at room temperature, the refractive index of a liquid at 40°C is 1.59 The above is a very high value.
尤其是,就成為高折射率且低黏度之硬化性組成物之方面而言,較佳為將(甲基)丙烯酸鄰苯基苄酯、(甲基)丙烯酸間苯基苄酯及(甲基)丙烯酸對苯基苄酯併用,此時之摻合比較佳為以(甲基)丙烯酸鄰苯基苄酯及(甲基)丙烯酸間苯基苄酯之合計與(甲基)丙烯酸對苯基苄酯之莫耳比[{[(甲基)丙烯酸鄰苯基苄酯]+[(甲基)丙烯酸間苯基苄酯]}/[(甲基)丙烯酸對苯基苄酯]]成為55/45~10/90之範圍之方式使用。 In particular, it is preferable to combine ortho-phenylbenzyl (meth)acrylate, m-phenylbenzyl (meth)acrylate, and (methyl) ) P-phenylbenzyl acrylate is used in combination, and the blending ratio at this time is preferably the sum of o-phenylbenzyl (meth)acrylate and m-phenylbenzyl (meth)acrylate and p-phenyl(meth)acrylate The molar ratio of benzyl ester [{[(meth) phenyl benzyl acrylate] + [(meth) phenyl benzyl acrylate])/[(meth) phenyl benzyl acrylate]] becomes 55 Use in the range of /45~10/90.
又,(甲基)丙烯酸鄰苯基苄酯與(甲基)丙烯酸對苯基苄酯就製造簡便之方面而言亦較佳。於使用該等2種成分之情形時之摻合比就成為高折射率且低黏度之硬化性組成物之方面而言,較佳為(甲基)丙烯酸鄰苯基苄酯與(甲基)丙烯酸對苯基苄酯之莫耳比[[(甲基)丙烯酸鄰苯基苄酯]/[(甲基)丙烯酸對苯基苄酯]]為55/45~10/90之範圍。 In addition, o-phenylbenzyl (meth)acrylate and p-phenylbenzyl (meth)acrylate are also preferable in terms of ease of production. In the case of using these two components, the blending ratio becomes a curable composition with high refractive index and low viscosity, preferably o-phenylbenzyl (meth)acrylate and (methyl) The molar ratio of p-phenyl benzyl acrylate [[(meth) phenyl benzyl acrylate]/[(meth) phenyl benzyl acrylate]] is in the range of 55/45 to 10/90.
上述(甲基)丙烯酸苯基苄酯(B1)之製造方法例如可列舉:使聯苯甲醇與(甲基)丙烯酸發生酯化反應之方法(方法1),使如氯甲基聯苯、溴甲基聯苯般之鹵化甲基聯苯與(甲基)丙烯酸之鉀、鈉、鋰等之鹼金屬鹽發生反應之方法(方法2),及使由聯苯、鹵化氫、及甲醛衍生物反應而獲得之反應混合物進而與丙烯酸或丙烯酸鹼金屬鹽發生反應之方法(方法3)等。 The method for producing the above-mentioned phenyl benzyl (meth)acrylate (B1) includes, for example, a method of esterifying biphenylmethanol and (meth)acrylic acid (method 1), using chloromethyl biphenyl, bromine The method of reacting the halogenated methyl biphenyl like methyl biphenyl with the alkali metal salt of (meth)acrylic acid such as potassium, sodium, lithium (method 2), and using biphenyl, hydrogen halide, and formaldehyde derivatives The method of reacting the reaction mixture obtained by the reaction with acrylic acid or acrylic acid alkali metal salt (method 3), etc.
對於上述方法3,聯苯與甲醛之反應比率較佳為相對於1莫耳之聯苯,於1~25莫耳之範圍內使用甲醛。甲醛能夠以福馬林水溶液、多聚甲醛、三烷等任一形態而使用。上述鹵化氫可列舉濃鹽酸或氯化氫氣體等,且較佳為以相對於聯苯為過量之莫耳比而使用。反應較佳為於酸 觸媒條件下進行,所使用之酸觸媒例如可列舉:硫酸、磷酸、多磷酸、三氯乙酸、二氯乙酸、單氯乙酸、甲磺酸、對甲苯磺酸、氯化鋅等路易斯酸等。亦可視需要於二甲氧基乙烷、二烷、環戊基甲醚、乙酸等有機溶劑中進行反應,且反應溫度較佳為60~180℃之範圍。 For the above method 3, the reaction ratio of biphenyl to formaldehyde is preferably to use formaldehyde in the range of 1-25 mol relative to 1 mol of biphenyl. Formaldehyde can be used as formalin aqueous solution, paraformaldehyde, three Any form such as alkane is used. Examples of the above-mentioned hydrogen halide include concentrated hydrochloric acid, hydrogen chloride gas, and the like, and are preferably used in an excess molar ratio relative to biphenyl. The reaction is preferably carried out under acid catalyst conditions. Examples of acid catalysts used include: sulfuric acid, phosphoric acid, polyphosphoric acid, trichloroacetic acid, dichloroacetic acid, monochloroacetic acid, methanesulfonic acid, p-toluenesulfonic acid, Lewis acids such as zinc chloride, etc. It can also be used in dimethoxyethane, two The reaction is carried out in organic solvents such as alkane, cyclopentyl methyl ether, and acetic acid, and the reaction temperature is preferably in the range of 60 to 180°C.
於藉由此種方法製造上述(甲基)丙烯酸苯基苄酯(B1)之情形時,除(甲基)丙烯酸苯基苄酯(B1)以外,有時會副生成雙[(甲基)丙烯醯基甲基]聯苯(B1')及具有經由亞甲基鍵結有聯苯結構之分子結構之聯苯化合物(B1")等。於此情形時,反應生成物100質量份中之(甲基)丙烯酸苯基苄酯(B1)之含量較佳為30~95質量份之範圍,更佳為35~85質量份之範圍。又,反應生成物100質量份中之雙[(甲基)丙烯醯基甲基]聯苯(B1')之含量較佳為5~70質量份之範圍,更佳為15~65質量份之範圍。進而,反應生成物100質量份中之上述具有經由亞甲基鍵結有聯苯結構之分子結構之聯苯化合物(B1")之含量較佳為0.5~30質量份之範圍,更佳為1~25質量份之範圍。 When the above-mentioned phenylbenzyl (meth)acrylate (B1) is produced by this method, in addition to the phenylbenzyl (meth)acrylate (B1), bis[(methyl) Acrylic methyl] biphenyl (B1') and a biphenyl compound (B1") having a molecular structure in which a biphenyl structure is bonded via a methylene group. In this case, 100 parts by mass of the reaction product The content of phenyl benzyl (meth)acrylate (B1) is preferably in the range of 30 to 95 parts by mass, more preferably in the range of 35 to 85 parts by mass. In addition, the double [(former) in 100 parts by mass of the reaction product The content of (yl)acryloylmethyl]biphenyl (B1') is preferably in the range of 5 to 70 parts by mass, more preferably in the range of 15 to 65 parts by mass. Furthermore, the above-mentioned in 100 parts by mass of the reaction product The content of the biphenyl compound (B1") of a molecular structure having a biphenyl structure bonded via a methylene group is preferably in the range of 0.5 to 30 parts by mass, more preferably in the range of 1 to 25 parts by mass.
又,於藉由此種方法製造上述(甲基)丙烯酸苯基苄酯(B1)之情形時,有於反應生成物中殘留未反應原料之聯苯之情形。於此情形時,就本案發明所需之效果、即獲得高折射率且低黏度之組成物之方面而言,反應生成物100質量份中之聯苯之含量較佳為0.5~15質量份之範圍,更佳為1~10質量份之範圍。 In addition, when the above-mentioned phenylbenzyl (meth)acrylate (B1) is produced by such a method, the unreacted biphenyl may remain in the reaction product. In this case, the content of biphenyl in 100 parts by mass of the reaction product is preferably 0.5-15 parts by mass in terms of the effect required by the present invention, that is, obtaining a composition with high refractive index and low viscosity. The range is more preferably a range of 1-10 parts by mass.
關於測定反應生成物中各成分之含有率之方法,例如可列舉:氣相層析法、液相層析法、凝膠滲透層析法等。 As a method of measuring the content rate of each component in the reaction product, for example, gas chromatography, liquid chromatography, gel permeation chromatography, etc. can be cited.
上述雙[(甲基)丙烯醯基甲基]聯苯(B1')例如可列舉:2,2'- 雙(丙烯醯基甲基)-1,1'-聯苯、3,3'-雙(丙烯醯基甲基)-1,1'-聯苯、4,4'-雙(丙烯醯基甲基)-1,1'-聯苯、2,4'-雙(丙烯醯基甲基)-1,1'-聯苯、2,4-雙(丙烯醯基甲基)-1,1'-聯苯、2,6-雙(丙烯醯基甲基)-1,1'-聯苯等。 Examples of the above-mentioned bis[(meth)acryloylmethyl]biphenyl (B1') include: 2,2'- Bis(acryloylmethyl)-1,1'-biphenyl, 3,3'-bis(acryloylmethyl)-1,1'-biphenyl, 4,4'-bis(acryloylmethyl) Base)-1,1'-biphenyl, 2,4'-bis(acryloylmethyl)-1,1'-biphenyl, 2,4-bis(acryloylmethyl)-1,1' -Biphenyl, 2,6-bis(acryloylmethyl)-1,1'-biphenyl, etc.
上述具有經由亞甲基鍵結有聯苯結構之分子結構之聯苯化合物(B1")較佳為分子結構中所包含之聯苯結構單元之個數為2~5之範圍。鑑定聯苯化合物(B1")之聚合度之方法例如可列舉如下方法:使用氣相層析質譜儀(GC-MS)或高速液相層析質譜儀(LC-MS),對利用矽膠管柱層析法自反應生成物中去除上述(甲基)丙烯酸苯基苄酯(B1)或上述雙(丙烯醯基甲基)聯苯(B1')後之成分進行分析。 The above-mentioned biphenyl compound (B1") having a molecular structure in which a biphenyl structure is bonded via a methylene group is preferably in the range of 2 to 5 in the number of biphenyl structural units contained in the molecular structure. Identification of the biphenyl compound The method for the degree of polymerization of (B1") can be, for example, the following methods: using gas chromatography mass spectrometry (GC-MS) or high-speed liquid chromatography mass spectrometry (LC-MS), and using silica gel column chromatography The reaction product was analyzed by removing the above-mentioned phenylbenzyl (meth)acrylate (B1) or the above-mentioned bis(acryloylmethyl)biphenyl (B1').
於本發明中,亦可併用上述(甲基)丙烯酸苯基苄酯(B1)以外之其他含(甲基)丙烯醯基之化合物(B2)作為上述含(甲基)丙烯醯基之化合物(B)。上述其他含(甲基)丙烯醯基之化合物(B2)例如可列舉:環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺酯、含茀骨架(甲基)丙烯酸酯、該等以外之單官能型或多官能型(甲基)丙烯酸酯化合物等。 In the present invention, other (meth)acrylic acid group-containing compounds (B2) other than the above-mentioned phenyl benzyl (meth)acrylate (B1) may also be used in combination as the (meth)acrylic acid group-containing compound ( B). The above-mentioned other (meth)acrylic acid group-containing compounds (B2) include, for example, epoxy (meth)acrylate, (meth)acrylate amine ester, pyrene skeleton-containing (meth)acrylate, etc. Monofunctional or polyfunctional (meth)acrylate compounds, etc.
上述環氧(甲基)丙烯酸酯具體而言係使(甲基)丙烯酸或其酸酐與環氧樹脂發生反應而獲得者,上述環氧樹脂例如可列舉:對苯二酚、鄰苯二酚等二酚之二縮水甘油醚;3,3'-聯苯二醇、4,4'-聯苯二醇等聯苯酚化合物之二縮水甘油醚;雙酚A型環氧樹脂、雙酚B型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂等雙酚型環氧樹脂;1,4-萘二醇、1,5-萘二醇、1,6-萘二醇、2,6-萘二醇、2,7-萘二醇、聯萘酚、雙(2,7-二羥基萘基)甲烷等萘酚化合物之聚縮水甘油醚;4,4',4"-次甲基三苯酚等三縮水甘油醚;酚系酚醛清漆型環氧樹脂、甲酚酚醛清漆樹脂等酚醛清漆型環氧樹脂; 藉由上述聯苯酚化合物、雙酚A、雙酚B、雙酚F、雙酚S、萘酚化合物與環氧乙烷、環氧丙烷、四氫呋喃、乙基縮水甘油醚、丙基縮水甘油醚、丁基縮水甘油醚、苯基縮水甘油醚、烯丙基縮水甘油醚等各種環狀醚化合物之開環聚合而獲得之聚醚改質芳香族多元醇之聚縮水甘油醚;藉由上述聯苯二酚化合物、雙酚A、雙酚B、雙酚F、雙酚S、萘酚化合物與ε-己內酯等內酯化合物之縮聚而獲得之內酯改質芳香族多元醇之聚縮水甘油醚等。 The epoxy (meth)acrylate is specifically obtained by reacting (meth)acrylic acid or its anhydride with an epoxy resin. Examples of the epoxy resin include hydroquinone, catechol, etc. Diglycidyl ether of diphenol; Diglycidyl ether of biphenol compounds such as 3,3'-biphenyldiol and 4,4'-biphenyldiol; bisphenol A type epoxy resin, bisphenol B type ring Oxygen resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin and other bisphenol type epoxy resins; 1,4-naphthalenediol, 1,5-naphthalenediol, 1,6-naphthalenediol, Polyglycidyl ether of naphthol compounds such as 2,6-naphthalenediol, 2,7-naphthalenediol, binaphthol, bis(2,7-dihydroxynaphthyl)methane; 4,4',4"- Triglycidyl ethers such as methine triphenol; Novolac epoxy resins such as phenol novolac type epoxy resins and cresol novolac resins; By the above-mentioned biphenol compound, bisphenol A, bisphenol B, bisphenol F, bisphenol S, naphthol compound and ethylene oxide, propylene oxide, tetrahydrofuran, ethyl glycidyl ether, propyl glycidyl ether, The polyether obtained by the ring-opening polymerization of various cyclic ether compounds such as butyl glycidyl ether, phenyl glycidyl ether, and allyl glycidyl ether is modified polyglycidyl ether of aromatic polyols; by the above-mentioned biphenyl Polyglycidol which is obtained by polycondensation of diphenol compound, bisphenol A, bisphenol B, bisphenol F, bisphenol S, naphthol compound and lactone compounds such as ε-caprolactone, etc. Ether etc.
該等之中,就最終獲得之組成物成為高折射率者之方面而言,較佳為分子結構中具有芳香環骨架者。尤其是,就獲得顯示出更高之折射率,且即便於高溫高濕條件下,對塑膠膜基材亦顯示出較高附著性之硬化塗膜之方面而言,尤佳為上述雙酚型環氧樹脂。 Among these, in terms that the finally obtained composition has a high refractive index, one having an aromatic ring skeleton in the molecular structure is preferable. In particular, in terms of obtaining a cured coating film that exhibits a higher refractive index and exhibits higher adhesion to the plastic film substrate even under high temperature and high humidity conditions, the above-mentioned bisphenol type is particularly preferred Epoxy resin.
又,雙酚型環氧樹脂中,就獲得更高折射率且高硬度之硬化物之方面而言,較佳為環氧當量為160~1000g/eq之範圍者,更佳為165~600g/eq之範圍者。 Furthermore, in the bisphenol type epoxy resin, in terms of obtaining a cured product with a higher refractive index and high hardness, the epoxy equivalent is preferably in the range of 160 to 1000 g/eq, more preferably 165 to 600 g/ Those in the range of eq.
上述(甲基)丙烯酸胺酯例如可列舉:使各種聚異氰酸酯化合物、含羥基(甲基)丙烯酸酯化合物、及視需要之各種多元醇化合物反應而獲得者。上述聚異氰酸酯化合物例如可列舉:六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、甲苯二異氰酸酯、苯二甲基二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯等二異氰酸酯化合物或其脲酸酯改質物、加成物改質物、縮二脲改質物。上述含羥基(甲基)丙烯酸酯化合物例如可列舉:(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、三羥甲基丙烷二丙烯酸酯、新戊四醇三(甲 基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、及該等之聚氧伸烷基改質物、聚內酯改質物等。上述多元醇化合物例如可列舉:乙二醇、丙二醇、丁二醇、己二醇、聚氧乙二醇、聚氧丙二醇、甘油、三羥甲基丙烷、新戊四醇、聯苯酚、雙酚等。 Examples of the (meth)acrylate amine ester include those obtained by reacting various polyisocyanate compounds, hydroxyl group-containing (meth)acrylate compounds, and optionally various polyol compounds. Examples of the polyisocyanate compound include: diisocyanate compounds such as hexamethylene diisocyanate, isophorone diisocyanate, toluene diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, or the like Modified urate, modified adduct, and modified biuret. Examples of the above-mentioned hydroxyl-containing (meth)acrylate compound include: hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, trimethylolpropane diacrylate, neopenteritol tris(methyl) Base) acrylate, dineopentyl erythritol penta(meth)acrylate, and polyoxyalkylene modified products, polylactone modified products, etc. Examples of the above-mentioned polyol compounds include ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, polyoxyethylene glycol, polyoxypropylene glycol, glycerin, trimethylolpropane, neopenteritol, biphenol, and bisphenol Wait.
上述含茀骨架(甲基)丙烯酸酯具有折射率尤其高之特徵。具體而言,可列舉下述結構式1~4之任一式所表示之化合物等。 The above-mentioned (meth)acrylic acid ester containing a stilbene skeleton has a particularly high refractive index. Specifically, the compound etc. which are represented by any one of following structural formula 1-4 are mentioned.
[式中X為氫原子或羥基,R1及R4分別獨立為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,R3為直接鍵結或亞甲基,m為0或1以上之整數] [In the formula, X is a hydrogen atom or a hydroxyl group, R 1 and R 4 are each independently a hydrogen atom or an alkyl group with 1 to 3 carbon atoms, R 2 is a hydrogen atom or a methyl group, and R 3 is a direct bond or methylene Base, m is an integer of 0 or more]
[式中,2個X分別獨立為氫原子或羥基,2個R1分別獨立為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,m及n分別獨立為0或1以上之整數] [In the formula, two Xs are each independently a hydrogen atom or a hydroxyl group, two R 1s are each independently a hydrogen atom or an alkyl group with 1 to 3 carbon atoms, R 2 is a hydrogen atom or a methyl group, m and n are each independently Is an integer of 0 or more]
[式中,X分別獨立為氫原子或羥基,R1分別獨立為氫原子或碳原子數為1~3之烷基,R2分別獨立為氫原子或甲基,R3分別獨立為直接鍵結或亞甲基,m及n分別獨立為0或1以上之整數] [In the formula, X is a hydrogen atom or a hydroxyl group, R 1 is a hydrogen atom or an alkyl group with 1 to 3 carbon atoms, R 2 is a hydrogen atom or a methyl group, and R 3 is a direct bond. Junction or methylene, m and n are each independently an integer of 0 or 1 or more]
[式中,2個X分別獨立為氫原子或羥基,2個R1分別獨立為氫原子或碳原子數為1~3之烷基,2個R2分別獨立為氫原子或甲基,m及n分別獨立為0或1以上之整數]。 [In the formula, two Xs are each independently a hydrogen atom or a hydroxyl group, two R 1 are each independently a hydrogen atom or an alkyl group with 1 to 3 carbon atoms, and two R 2 are each independently a hydrogen atom or a methyl group, m And n are each independently an integer of 0 or 1 or more].
其他單官能型或多官能型(甲基)丙烯酸酯化合物例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯等脂肪族單(甲基)丙烯酸酯化合物;(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰基酯、單(甲基)丙烯酸金剛烷基酯等脂環型單(甲基)丙烯酸酯化合物;(甲基)丙烯酸縮水甘油酯、丙烯酸四氫糠酯等雜環型單(甲基)丙烯酸酯化合物;(甲基)丙烯酸苄酯、(甲基)丙烯酸苯酯、苯氧基(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯氧基乙氧基乙酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸苯氧基苄酯、(甲基)丙烯酸苄基苄酯、
(甲基)丙烯酸苯基苯氧基乙酯等芳香族單(甲基)丙烯酸酯化合物;(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯等含羥基單(甲基)丙烯酸酯化合物;下述結構式(5)
所表示之化合物等單(甲基)丙烯酸酯化合物:將聚氧乙烯鏈、聚氧丙烯鏈、聚氧四亞甲基鏈等聚氧伸烷基鏈導入上述各種單(甲基)丙烯酸酯單體之分子結構中而成之聚氧伸烷基改質單(甲基)丙烯酸酯化合物;將(聚)內酯結構導入上述各種單(甲基)丙烯酸酯化合物之分子結構中而成之內酯改質單(甲基)丙烯酸酯化合物;乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯等脂肪族二(甲基)丙烯酸酯化合物;1,4-環己烷二甲醇二(甲基)丙烯酸酯、降莰烷二(甲基)丙烯酸酯、降莰烷二甲醇二(甲基)丙烯酸酯、二(甲基)丙烯酸雙環戊酯、三環癸烷二甲醇二(甲基)丙烯酸酯等脂環型二(甲基)丙烯酸酯化合物;聯苯酚二(甲基)丙烯酸酯、雙酚二(甲基)丙烯酸酯等芳香族二(甲基)丙烯酸酯化合物;甘油二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯等含羥基二(甲基)丙烯酸酯化合物;將聚氧乙烯鏈、聚氧丙烯鏈、聚氧四亞甲基鏈等聚氧伸烷基鏈導入上述各種二(甲基)丙烯酸酯化合物之分子結構中而成之聚氧伸烷基改質二(甲基)丙烯酸酯化合物;將(聚)內酯結構導入上述各
種二(甲基)丙烯酸酯化合物之分子結構中而成之內酯改質二(甲基)丙烯酸酯化合物;三羥甲基丙烷三(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯等脂肪族三(甲基)丙烯酸酯化合物;新戊四醇三(甲基)丙烯酸酯、二-三羥甲基丙烷三(甲基)丙烯酸酯、二新戊四醇三(甲基)丙烯酸酯等含羥基三(甲基)丙烯酸酯化合物;將聚氧乙烯鏈、聚氧丙烯鏈、聚氧四亞甲基鏈等聚氧伸烷基鏈導入上述各種三(甲基)丙烯酸酯化合物之分子結構中而成之聚氧伸烷基改質三(甲基)丙烯酸酯化合物;將(聚)內酯結構導入上述各種三(甲基)丙烯酸酯化合物之分子結構中而成之內酯改質三(甲基)丙烯酸酯化合物;新戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等四官能以上之脂肪族聚(甲基)丙烯酸酯化合物;二新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯等四官能以上之含羥基聚(甲基)丙烯酸酯化合物;將聚氧乙烯鏈、聚氧丙烯鏈、聚氧四亞甲基鏈等聚氧伸烷基鏈導入上述各種聚(甲基)丙烯酸酯化合物之分子結構中而成之四官能以上之聚氧伸烷基改質聚(甲基)丙烯酸酯化合物;將(聚)內酯結構導入上述各種聚(甲基)丙烯酸酯化合物之分子結構中而成之四官能以上之內酯改質聚(甲基)丙烯酸酯化合物:下述結構式(6)
(式中X1及X2分別獨立為氫原子或(甲基)丙烯醯基)所表示之聯咔唑化合物等。 (Where X 1 and X 2 are each independently a hydrogen atom or a (meth)acryloyl group) bicarbazole compound and the like represented by the formula.
上述其他含(甲基)丙烯醯基之化合物(B2)中,就獲得折射率較高之硬化性組成物之方面而言,較佳為分子結構中具有芳香環之化合物,更佳為分子結構中具有雙酚結構之化合物。 Among the above-mentioned other (meth)acrylic acid group-containing compounds (B2), in terms of obtaining a curable composition with a higher refractive index, a compound having an aromatic ring in the molecular structure is preferable, and a molecular structure is more preferable Compounds with bisphenol structure.
於使用上述其他含(甲基)丙烯醯基之化合物(B2)之情形時,關於含(甲基)丙烯醯基之化合物(B)中之上述(甲基)丙烯酸苯基苄酯(B1)之比率,就成為折射率與黏度之平衡性優異之硬化性組成物之方面而言,較佳為20質量份以上,更佳為40質量份以上,尤佳為50質量份以上。另一方面,於重視硬化物之柔軟性,而相對較多地使用分子結構中具有聚氧伸烷基結構之(甲基)丙烯酸酯等之情形時,含(甲基)丙烯醯基之化合物(B)中之上述(甲基)丙烯酸苯基苄酯(B1)亦可未達20質量份。即便於此情形時,亦藉由含有(甲基)丙烯酸苯基苄酯(B1),而獲得黏度不會過高且折射率較高之硬化性組成物。 In the case of using the above-mentioned other (meth)acryloyl group-containing compound (B2), regarding the (meth)acryloyl group-containing compound (B), the above-mentioned phenyl benzyl (meth)acrylate (B1) The ratio is preferably 20 parts by mass or more, more preferably 40 parts by mass or more, and particularly preferably 50 parts by mass or more in terms of a curable composition having an excellent balance of refractive index and viscosity. On the other hand, when attaching importance to the flexibility of the hardened material and relatively more use of (meth)acrylates having a polyoxyalkylene structure in the molecular structure, compounds containing (meth)acryloyl groups The above-mentioned phenyl benzyl (meth)acrylate (B1) in (B) may be less than 20 parts by mass. Even in this case, by containing phenyl benzyl (meth)acrylate (B1), a curable composition with a high refractive index and a viscosity that is not too high can be obtained.
於使用上述環氧(甲基)丙烯酸酯作為上述其他含(甲基)丙烯醯基之化合物(B2)之情形時,較佳為於含(甲基)丙烯醯基之化合物(B)中5~35質量份之範圍內使用。於使用上述(甲基)丙烯酸胺酯作為上述其他含(甲基)丙烯醯基之化合物(B2)之情形時,較佳為於含(甲基)丙烯醯基之化合物(B)中5~35質量份之範圍內使用。於使用上述含茀骨架(甲基)丙烯酸酯作為上述其他含(甲基)丙烯醯基之化合物(B2)之情形時,較佳為於含(甲基)丙烯醯基之化合物(B)中5~45質量份之範圍內使用。於使用上述單官能型或多官能型(甲基)丙烯酸酯化合作為上述含(甲基)丙烯醯基之化 合物(B2)之情形時,較佳為於含(甲基)丙烯醯基之化合物(B)中5~60質量份之範圍內使用。 When using the above-mentioned epoxy (meth)acrylate as the above-mentioned other (meth)acryloyl group-containing compound (B2), it is preferably in the (meth)acryloyl group-containing compound (B). Use within the range of ~35 parts by mass. In the case of using the above-mentioned (meth)acrylic amine ester as the above-mentioned other (meth)acryloyl group-containing compound (B2), it is preferably 5~ in the (meth)acryloyl group-containing compound (B). Use within 35 parts by mass. In the case of using the above-mentioned (meth)acrylic acid ester containing a chlorophyll skeleton as the above-mentioned other (meth)acryloyl group-containing compound (B2), it is preferably in the (meth)acryloyl group-containing compound (B) Use within the range of 5~45 parts by mass. In the use of the above-mentioned monofunctional or multifunctional (meth)acrylic ester compound, the compound containing the (meth)acrylic acid group In the case of the compound (B2), it is preferably used in the range of 5 to 60 parts by mass in the (meth)acrylic acid group-containing compound (B).
於使用分子結構中具有聚氧伸烷基結構之(甲基)丙烯酸酯作為上述含(甲基)丙烯醯基之化合物(B2)之情形時,較佳為於含(甲基)丙烯醯基之化合物(B)中5~45質量份之範圍內使用。又,分子結構中具有聚氧伸烷基結構之(甲基)丙烯酸酯所具有之氧伸烷基結構之重複單位數較佳為一分子中10~30之範圍。藉由使用分子結構中具有聚氧伸烷基結構之(甲基)丙烯酸酯作為上述含(甲基)丙烯醯基之化合物(B2),能夠獲得靈活性較高且恢復性等優異之硬化物。 When a (meth)acrylate having a polyoxyalkylene structure in the molecular structure is used as the (meth)acrylic acid group-containing compound (B2), it is preferably a (meth)acrylic acid group-containing compound (B2). Use within the range of 5 to 45 parts by mass in the compound (B). In addition, the number of repeating units of the oxyalkylene structure of the (meth)acrylate having a polyoxyalkylene structure in the molecular structure is preferably in the range of 10-30 per molecule. By using a (meth)acrylate having a polyoxyalkylene structure in the molecular structure as the above-mentioned (meth)acrylic acid group-containing compound (B2), a cured product with high flexibility and excellent recovery properties can be obtained .
於本發明之硬化性組成物中,上述氧化鋯粒子(A)與上述含(甲基)丙烯醯基之化合物(B)之摻合比率可根據所需之黏度及折射率進行適當調整,就成為分散穩定性優異、且折射率充分高之硬化性組成物之方面而言,較佳為兩者之質量比[(A)/(B)]為25/75~75/25之範圍,更佳為40/60~70/30之範圍。 In the curable composition of the present invention, the blending ratio of the above-mentioned zirconia particles (A) and the above-mentioned (meth)acryloyl group-containing compound (B) can be appropriately adjusted according to the required viscosity and refractive index. In terms of a curable composition having excellent dispersion stability and sufficiently high refractive index, it is preferable that the mass ratio [(A)/(B)] of the two is in the range of 25/75 to 75/25, and more Preferably, it is in the range of 40/60~70/30.
本發明之硬化性組成物亦可含有自由基聚合起始劑。該自由基聚合起始劑例如可列舉:1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、9-氧硫及9-氧硫衍生物、2,2'-二甲氧基-1,2-二苯乙烷-1-酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)-丁烷-1-酮等。 The curable composition of the present invention may also contain a radical polymerization initiator. Examples of the radical polymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-[4-(2-hydroxyethoxy (Yl)phenyl)-2-hydroxy-2-methyl-1-propane-1-one, 9-oxysulfur And 9-oxysulfur Derivatives, 2,2'-dimethoxy-1,2-diphenylethane-1-one, 2,4,6-trimethylbenzyldiphenylphosphine oxide, bis(2,4 ,6-Trimethylbenzyl)phenylphosphine oxide, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-propanone, 2-benzyl- 2-Dimethylamino-1-(4-morpholinylphenyl)-butan-1-one and the like.
該等自由基聚合起始劑之市售品例如可列舉: 「Irgacure-184」、「Irgacure-149」、「Irgacure-261」、「Irgacure-369」、「Irgacure-500」、「Irgacure-651」、「Irgacure-754」、「Irgacure-784」、「Irgacure-819」、「Irgacure-907」、「Irgacure-1116」、「Irgacure-1664」、「Irgacure-1700」、「Irgacure-1800」、「Irgacure-1850」、「Irgacure-2959」、「Irgacure-4043」、「Darocure-1173」(Ciba Specialty Chemicals公司製造)、「Lucirin TPO」(BASF公司製造)、「kayacure-DETX」、「kayacure-MBP」、「kayacure-DMBI」、「kayacure-EPA」、「kayacure-OA」(日本化藥股份有限公司製造)、「Vicure-10」、「Vicure-55」(Stouffer Chemical公司製造)、「Tri gonal P1」(Akzo公司製造)、「Sandoray 1000」(Sandoz公司製造)、「Deap」(Apjohn公司製造)、「Quantacure-PDO」、「Quantacure-ITX」、「Quantacure-EPD」(Ward Blenkinsop公司製造)等。 Examples of commercially available products of these radical polymerization initiators include: "Irgacure-184", "Irgacure-149", "Irgacure-261", "Irgacure-369", "Irgacure-500", "Irgacure-651", "Irgacure-754", "Irgacure-784", "Irgacure" -819", "Irgacure-907", "Irgacure-1116", "Irgacure-1664", "Irgacure-1700", "Irgacure-1800", "Irgacure-1850", "Irgacure-2959", "Irgacure-4043" ", "Darocure-1173" (manufactured by Ciba Specialty Chemicals), "Lucirin TPO" (manufactured by BASF), "kayacure-DETX", "kayacure-MBP", "kayacure-DMBI", "kayacure-EPA", " kayacure-OA" (manufactured by Nippon Kayaku Co., Ltd.), "Vicure-10", "Vicure-55" (manufactured by Stouffer Chemical), "Tri gonal P1" (manufactured by Akzo), "Sandoray 1000" (manufactured by Sandoz) Manufacturing), "Deap" (manufactured by Apjohn), "Quantacure-PDO", "Quantacure-ITX", "Quantacure-EPD" (manufactured by Ward Blenkinsop), etc.
為了表現出充分之硬化性,上述自由基聚合起始劑之添加量較佳為相對於本案發明之硬化性組成物100質量份為0.05~20質量份之範圍,更佳為0.1~10質量份之範圍。 In order to exhibit sufficient curability, the addition amount of the above radical polymerization initiator is preferably in the range of 0.05 to 20 parts by mass relative to 100 parts by mass of the curable composition of the present invention, more preferably 0.1 to 10 parts by mass The scope.
於利用光聚合使本發明之硬化性組成物硬化之情形時,亦可於上述自由基聚合起始劑中一併添加各種光敏劑。上述光敏劑例如可列舉:胺類、脲類、含硫化合物、含磷化合物、含氯化合物或腈類或者其他含氮化合物等,該等可單獨使用,亦可將兩種以上併用。於添加該等光敏劑之情形時之添加量較佳為相對於本案發明之硬化性組成物100質量份為0.01~10質量份之範圍。 When curing the curable composition of the present invention by photopolymerization, various photosensitizers may be added to the above-mentioned radical polymerization initiator. Examples of the aforementioned photosensitizer include amines, ureas, sulfur-containing compounds, phosphorus-containing compounds, chlorine-containing compounds, nitriles, or other nitrogen-containing compounds. These may be used alone or in combination of two or more. When adding these photosensitizers, the addition amount is preferably in the range of 0.01 to 10 parts by mass relative to 100 parts by mass of the curable composition of the present invention.
本發明之硬化性組成物亦可視需要含有其他各種添加劑。作為各種添加劑,可列舉:紫外線吸收劑、抗氧化劑、矽酮系添加劑、氟系 添加劑、流變控制劑、消泡劑、抗靜電劑、防霧劑等。關於在添加該等添加劑之情形時之添加量,於充分發揮添加劑之效果又不妨礙紫外線硬化之範圍內,較佳為相對於本發明之硬化性組成物100質量份為0.01~40質量份之範圍。 The curable composition of the present invention may also contain other various additives as needed. Examples of various additives include: ultraviolet absorbers, antioxidants, silicone-based additives, fluorine-based Additives, rheology control agents, defoamers, antistatic agents, antifogging agents, etc. Regarding the addition amount in the case of adding these additives, within the range where the effect of the additives is fully exerted without hindering the ultraviolet curing, it is preferably 0.01-40 parts by mass relative to 100 parts by mass of the curable composition of the present invention range.
本發明之硬化性組成物之黏度例如用於使用模具之賦形用途之情形時,就即便於高速塗佈條件下亦能夠成為無缺陷地遍佈模具之細節部之方面而言,較佳為6000mPa‧s以下。 The viscosity of the curable composition of the present invention is preferably 6000 mPa in terms of being able to spread over the details of the mold without defects even under high-speed coating conditions when it is used for shaping purposes using a mold, for example. ‧S below.
本發明之硬化性組成物之折射率較佳為1.57以上,更佳為1.60以上。 The refractive index of the curable composition of the present invention is preferably 1.57 or more, more preferably 1.60 or more.
本發明之硬化性組成物之製造方法並無特別限定,例如可藉由如下方法等製備:將上述氧化鋯粒子(a)、上述含(甲基)丙烯醯基之化合物(B)、以及上述分散劑(D)或含有其他添加劑等之原料一次性分散之方法(方法1);或將上述氧化鋯粒子(a)分散至有機溶劑中,且向其中添加其他成分並混合之後,視需要減壓去除有機溶劑之方法(方法2)等。 The production method of the curable composition of the present invention is not particularly limited. For example, it can be produced by the following method: the above-mentioned zirconia particles (a), the above-mentioned (meth)acryloyl group-containing compound (B), and the above Dispersant (D) or a method of dispersing raw materials containing other additives at one time (Method 1); or disperse the above-mentioned zirconia particles (a) in an organic solvent, and add other ingredients to it and mix, and then reduce as needed Method to remove organic solvents (Method 2), etc.
上述方法1或2所使用之分散機可無限制地使用介質式濕式分散機等通常公知者,例如可列舉:珠磨機(Ashizawa Finetech股份有限公司製造之Star Mill LMZ-015、壽工業(股)製造之Ultra Apex Mill UAM-015等)。 The dispersing machine used in the above-mentioned method 1 or 2 can be used without limitation, such as a medium-type wet dispersing machine and other commonly known ones, for example, a bead mill (Star Mill LMZ-015 manufactured by Ashizawa Finetech Co., Ltd., Stock) manufactured by Ultra Apex Mill UAM-015, etc.).
分散機所使用之介質只要為通常公知之顆粒,則並無特別限定,較佳為可列舉:氧化鋯、氧化鋁、二氧化矽(silica)、玻璃、碳化矽、氮化矽。介質之平均粒徑較佳為50~500μm,更佳為100~200μm之介質。若粒徑為50μm以上,則對原料粉之衝擊力適當,分散無需過多時間。 另一方面,若介質之粒徑為500μm以下,則對原料粉之衝擊力適當,因此能夠抑制分散之粒子之表面能之增大,可防止再凝集。 The medium used in the dispersing machine is not particularly limited as long as it is generally known particles, but preferably includes zirconia, alumina, silica, glass, silicon carbide, and silicon nitride. The average particle size of the medium is preferably 50 to 500 μm, more preferably 100 to 200 μm. If the particle size is 50μm or more, the impact force on the raw material powder is appropriate, and the dispersion does not require much time. On the other hand, if the particle size of the medium is 500 μm or less, the impact force on the raw material powder is appropriate, so the increase in the surface energy of the dispersed particles can be suppressed, and re-aggregation can be prevented.
又,藉由於分散之初始步驟中使用衝擊力較大之大粒徑之介質而使分散之粒子之粒徑變小之後,再使用不易產生再凝集之小粒徑之介質的2個階段之方法,亦能夠縮短分散步驟時間。 In addition, after the particle size of the dispersed particles becomes smaller due to the use of a medium with a large impact force in the initial step of the dispersion, a two-stage method is used to use a medium with a small particle size that is not easy to reagglomerate , It can also shorten the dispersion step time.
本發明之硬化性組成物例如可藉由照射活性能量射線、加熱等使之硬化。於利用上述活性能量射線使之硬化之情形時,該活性能量射線例如可列舉:電子束、紫外線、可見光線等。於使用電子束作為活性能量射線之情形時,可使用Cockcroft Walton型加速器、Van de Graaff型電子加速器、共振變壓器型加速器、絕緣芯變壓器型、高頻高壓加速器型、Linear Filament型及高頻型等之電子束產生裝置使本發明之硬化性組成物硬化。又,於使用紫外線作為活性能量射線之情形時,可使用超高壓水銀燈、高壓水銀燈、低壓水銀燈等水銀燈,氙氣燈、碳弧、金屬鹵素燈等進行照射而使之硬化。此時之紫外線之曝光量較佳為0.1~1000mJ/cm2之範圍。 The curable composition of the present invention can be cured by irradiation with active energy rays, heating, etc., for example. In the case of curing by the above-mentioned active energy rays, examples of the active energy rays include electron beams, ultraviolet rays, and visible rays. When using electron beams as active energy rays, Cockcroft Walton type accelerator, Van de Graaff type electron accelerator, resonance transformer type accelerator, insulated core transformer type, high-frequency high-voltage accelerator type, Linear Filament type and high-frequency type can be used The electron beam generating device hardens the curable composition of the present invention. In addition, when ultraviolet rays are used as the active energy rays, mercury lamps such as ultra-high pressure mercury lamps, high pressure mercury lamps, low pressure mercury lamps, xenon lamps, carbon arc lamps, metal halide lamps, etc. can be used for curing. At this time, the exposure amount of ultraviolet rays is preferably in the range of 0.1 to 1000 mJ/cm 2 .
另一方面,於藉由加熱使之硬化之情形時,可藉由加熱至60~250℃之溫度範圍而使之硬化。 On the other hand, when it is hardened by heating, it can be hardened by heating to a temperature range of 60~250℃.
本發明之硬化性組成物就顯示出迄今尚無之較高之折射、且黏度亦非常低之方面而言,例如能夠較好地使用於眼鏡片、數位相機用透鏡、菲涅耳透鏡、及稜鏡透鏡等塑膠透鏡,及光學用保護層劑、硬塗劑、抗反射膜、光纖、光波導、全像圖、稜鏡透鏡、LED密封材料、太陽電池用太陽電池塗敷材料等各種光學構件用途,該等中尤其是適於液晶基板用稜鏡透鏡等塑膠透鏡用。 The curable composition of the present invention exhibits high refraction and very low viscosity, which has not yet been seen. For example, it can be better used in spectacle lenses, digital camera lenses, Fresnel lenses, and Plastic lenses such as optical lenses, and optical protective coating agents, hard coating agents, anti-reflection coatings, optical fibers, optical waveguides, holographic images, optical lenses, LED sealing materials, solar cell coating materials for solar cells, etc. For component applications, among these, it is especially suitable for plastic lenses such as prism lenses for liquid crystal substrates.
上述所謂液晶基板用稜鏡透鏡係於片材狀成形體之單面具有多個微細之稜鏡形狀部者,通常係以稜鏡面朝向該元件側之方式配設於液晶顯示元件之背面(光源側),進而,係用以於其背面配設有導光片材之片狀透鏡、或係上述稜鏡透鏡兼具該導光片材之功能之片狀透鏡。 The above-mentioned so-called liquid crystal substrate lens is a sheet-like molded body having a plurality of fine ridge shape parts on one side, and is usually arranged on the back surface of the liquid crystal display element (light source) with the ridge surface facing the element side. Side), and further, a sheet lens for arranging a light guide sheet on its back surface, or a sheet lens with the above-mentioned prism lens having the function of the light guide sheet.
於此,該稜鏡透鏡之稜鏡部之形狀就聚光性優異且亮度提高之方面而言,較佳為稜鏡頂角之角度θ為70~110°之範圍,尤其是75~100°之範圍,其中尤佳為80~95°之範圍。 Here, the shape of the ridge portion of the ridge lens is preferably in the range of 70~110°, especially 75~100°, in terms of excellent light-gathering performance and increased brightness. The range of 80~95° is particularly preferred.
又,稜鏡之間距較佳為100μm以下,尤其是就防止畫面之疊紋之產生及進一步提高畫面之清晰度之方面而言,尤佳為70μm以下之範圍。又,稜鏡之凹凸高度係根據稜鏡頂角之角度θ與稜鏡之間距之值而決定,較佳為50μm以下之範圍。進而,稜鏡透鏡之片材厚度就強度方面而言較佳為較厚者,但為了於光學上抑制光之吸收,較佳為較薄者,因此就該等之平衡性之方面而言,較佳為50μm~1000μm之範圍。 In addition, the distance between the ridges is preferably 100 μm or less, especially in terms of preventing the occurrence of moiré on the screen and further improving the clarity of the screen, it is particularly preferably within the range of 70 μm. In addition, the height of the unevenness of the ridge is determined based on the value of the angle θ of the apex angle of the ridge and the distance between the ridge, and is preferably within a range of 50 μm or less. Furthermore, the thickness of the sheet of the prism lens is preferably thicker in terms of strength, but in order to suppress light absorption optically, it is preferably thinner. Therefore, in terms of the balance of these, It is preferably in the range of 50 μm to 1000 μm.
使用本發明之硬化性組成物製造上述稜鏡透鏡之方法例如可列舉如下方法:將該組成物塗佈於形成有稜鏡圖案之模具或樹脂模具等成形模具,使組成物之表面平滑化之後,將透明基材疊合,並自該透明基材側照射活性能量射線而使之硬化。 The method of manufacturing the above-mentioned scallop lens using the curable composition of the present invention may be, for example, the following method: apply the composition to a mold with scallop pattern or a resin mold, etc., to smooth the surface of the composition , Laminating the transparent substrates, and irradiating active energy rays from the transparent substrate side to harden them.
於此所使用之透明基材可列舉:由丙烯酸樹脂、聚碳酸酯樹脂、聚酯樹脂、聚苯乙烯樹脂、氟樹脂、聚醯亞胺樹脂所構成之塑膠基材或玻璃等。 The transparent substrate used here may include: a plastic substrate composed of acrylic resin, polycarbonate resin, polyester resin, polystyrene resin, fluororesin, polyimide resin, or glass.
利用上述方法獲得之稜鏡片材可直接使用,亦可將透明基材剝離而以單獨之稜鏡透鏡之狀態使用。於直接在透明基材上形成稜鏡部而 使用之情形時,為了提高稜鏡透鏡與透明基材之接著性,較佳為預先對透明基材表面實施底塗劑處理等接著性提高處理。 The prism sheet obtained by the above method can be used directly, or the transparent substrate can be peeled off and used as a separate prism lens. To form the stubble part directly on the transparent substrate and In the case of use, in order to improve the adhesion between the lens and the transparent substrate, it is preferable to perform an adhesion improvement treatment such as primer treatment on the surface of the transparent substrate in advance.
另一方面,於將透明基材剝離而使用之情形時,為了使該透明基材可容易地剝離,較佳為預先使用矽酮或氟系剝離劑對透明基材之表面進行處理。 On the other hand, when the transparent substrate is peeled off and used, in order to make the transparent substrate easily peelable, it is preferable to treat the surface of the transparent substrate with a silicone or a fluorine-based release agent in advance.
[實施例] [Example]
以下藉由實施例及比較例對本發明進行更詳細說明。 Hereinafter, the present invention will be described in more detail with examples and comparative examples.
製造例或實施例所使用之各成分及分散機之詳細內容如下所述。 The details of each component and dispersing machine used in production examples or examples are as follows.
製造例1 鋯分散液(1)之製造 Production Example 1 Production of zirconium dispersion (1)
將氧化鋯粒子(a1)50g、矽烷偶合劑(C1)7.5g、甲基乙基酮183.0g混合,並利用分散攪拌機攪拌30分鐘,進行粗分散。利用介質式濕式分散機且使用粒徑100μm之氧化鋯顆粒對所獲得之混合液進行分散處理。一面確認過程中之粒徑,一面進行滯留時間100分鐘之分散處理之後,添加並混合分散劑(D1)5g,進而藉由20分鐘之分散處理而獲得鋯分散液(1)。 50 g of zirconium oxide particles (a1), 7.5 g of silane coupling agent (C1), and 183.0 g of methyl ethyl ketone were mixed and stirred with a dispersion mixer for 30 minutes to perform coarse dispersion. Disperse the obtained mixed liquid using a medium type wet disperser using zirconia particles with a particle size of 100 μm. While confirming the particle size in the process, after performing the dispersion treatment for a residence time of 100 minutes, 5 g of the dispersant (D1) was added and mixed, and the zirconium dispersion liquid (1) was obtained by the dispersion treatment for 20 minutes.
製造例2 丙烯酸苯基苄酯組成物之製造 Production Example 2 Production of phenyl benzyl acrylate composition
‧氯中間物之合成 ‧Synthesis of chlorine intermediates
向具備攪拌機、冷卻管、溫度計、氯化氫氣體導入裝置之5L之四口燒瓶中加入聯苯709g、多聚甲醛276g、乙酸1381g、濃鹽酸958g,且升溫至80℃。確認投料溶液為80℃之後,使用木下式玻璃波爾濾器將氯化氫氣體以20g/hr之速度導入投料溶液。確認氯化氫氣體於投料溶液中之溶解為飽和之後,耗時1小時滴加磷酸1061g,進一步反應30小時。反應結束之後,立即自反應溶液中除去下層,於有機層中添加甲苯2.3kg,並使用400g之12.5%氫氧化鈉水溶液、飽和碳酸氫鈉水溶液、蒸餾水將有機層洗淨。將有機層蒸餾去除後,以白色固體之形式獲得氯中間物908g。 709 g of biphenyl, 276 g of paraformaldehyde, 1381 g of acetic acid, and 958 g of concentrated hydrochloric acid were added to a 5L four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a hydrogen chloride gas introduction device, and the temperature was raised to 80°C. After confirming that the feed solution is 80°C, use a Kinoshita glass Bohr filter to introduce hydrogen chloride gas into the feed solution at a rate of 20 g/hr. After confirming that the hydrogen chloride gas is saturated in the feed solution, 1061 g of phosphoric acid was added dropwise for 1 hour, and the reaction was continued for 30 hours. After the reaction, the lower layer was immediately removed from the reaction solution, 2.3 kg of toluene was added to the organic layer, and 400 g of 12.5% sodium hydroxide aqueous solution, saturated sodium bicarbonate aqueous solution, and distilled water were used to wash the organic layer. After distilling off the organic layer, 908 g of the chlorine intermediate was obtained as a white solid.
‧丙烯酸酯化 ‧Acrylation
將上述獲得之中間物908g溶解於作為反應溶劑之二甲基甲醯胺1603g,且以相對於總量達到300ppm之方式添加碳酸鉀372g及對甲氧基苯酚。將中間物溶液升溫至40℃之後,耗時1.5小時向中間物溶液中滴加丙烯酸323g。滴加結束之後,耗時2小時升溫至80℃,且於80℃加熱攪拌3小時。於在所獲得之溶液中添加水3.4kg及甲苯1.8kg並進行萃取之後,將有機層洗淨直至水層成為中性。將有機層濃縮而獲得液狀之丙烯酸苯基苄酯組成 物995g。 908 g of the intermediate obtained above was dissolved in 1603 g of dimethylformamide as a reaction solvent, and 372 g of potassium carbonate and p-methoxyphenol were added so that the total amount reached 300 ppm. After the intermediate solution was heated to 40°C, 323 g of acrylic acid was added dropwise to the intermediate solution over 1.5 hours. After the dropwise addition, the temperature was raised to 80°C over 2 hours, and the mixture was heated and stirred at 80°C for 3 hours. After adding 3.4 kg of water and 1.8 kg of toluene to the obtained solution and performing extraction, the organic layer was washed until the water layer became neutral. Concentrate the organic layer to obtain liquid phenyl benzyl acrylate composition 物995g.
‧丙烯酸苯基苄酯組成物之分析 ‧Analysis of phenyl benzyl acrylate composition
所獲得之丙烯酸苯基苄酯組成物於25℃之液體折射率為1.592,黏度為30mPa‧s。使用氣相層析圖測定丙烯酸苯基苄酯組成物100質量份中所包含之各成分之含量,結果得知,包含丙烯酸苯基苄酯為65.2質量份、雙(丙烯醯基甲基)聯苯為18.6質量份、具有經由亞甲基鍵結有聯苯結構之分子結構之聯苯化合物為2.3質量份、及聯苯5.8質量份,且剩餘之8.1質量份中包含聯苯以外之未反應原料等。又,丙烯酸苯基苄酯之異構物之質量比(莫耳比亦相同)[[丙烯酸鄰苯基苄酯]/[丙烯酸間苯基苄酯]/[丙烯酸對苯基苄酯]]為20/1/79。 The liquid refractive index of the obtained phenyl benzyl acrylate composition at 25°C is 1.592, and the viscosity is 30 mPa·s. The content of each component contained in 100 parts by mass of the phenyl benzyl acrylate composition was measured using gas chromatograms. As a result, it was found that 65.2 parts by mass of phenyl benzyl acrylate was contained, and bis(acryloylmethyl) 18.6 parts by mass of benzene, 2.3 parts by mass of biphenyl compound having a biphenyl structure bonded via a methylene group, and 5.8 parts by mass of biphenyl, and the remaining 8.1 parts by mass contains unreacted other than biphenyl Raw materials, etc. In addition, the mass ratio of isomers of phenyl benzyl acrylate (the molar ratio is also the same) [[o-phenylbenzyl acrylate]/[m-phenylbenzyl acrylate]/[p-phenylbenzyl acrylate]] is 20/1/79.
丙烯酸苯基苄酯組成物之氣相層析圖分析條件如下所述。 The gas chromatogram analysis conditions of the phenylbenzyl acrylate composition are as follows.
機器:島津公司製造之「GC-2010」 Machine: "GC-2010" manufactured by Shimadzu Corporation
管柱:島津公司製造之「Zebron ZB-5」 Pillar: "Zebron ZB-5" manufactured by Shimadzu Corporation
條件:He載氣、流量1.47mL/min、管柱烘箱50℃、氣化室300℃、升溫範圍50℃至300℃(25℃/min) Conditions: He carrier gas, flow rate 1.47mL/min, column oven 50℃, gasification chamber 300℃, heating range 50℃ to 300℃ (25℃/min)
實施例1 Example 1
◆硬化性組成物(1)之製備 ◆Preparation of hardening composition (1)
以表2所顯示之比率將(甲基)丙烯酸酯化合物添加至製造例1所獲得之鋯分散液(1)中,並利用蒸發器將揮發成分減壓去除。進而添加聚合起始劑,製備硬化性組成物(1)。 The (meth)acrylate compound was added to the zirconium dispersion (1) obtained in Production Example 1 at the ratio shown in Table 2, and the volatile components were removed under reduced pressure using an evaporator. Furthermore, a polymerization initiator was added to prepare a curable composition (1).
◆氧化鋯粒子之粒徑測定 ◆Measurement of particle size of zirconia particles
於下述條件下測定先前所獲得之硬化性組成物(1)中之氧化鋯粒子之 平均粒徑。 The zirconia particles in the curable composition (1) obtained previously were measured under the following conditions: The average particle size.
粒徑測定裝置:大塚電子股份有限公司製造之「ELSZ-2」 Particle size measuring device: "ELSZ-2" manufactured by Otsuka Electronics Co., Ltd.
粒徑測定樣品:將硬化性組成物製成不揮發分0.6質量%之甲基異丁基酮溶液者。 Particle size measurement sample: The curable composition is made into a non-volatile 0.6 mass% methyl isobutyl ketone solution.
◆折射率之測定 ◆Measurement of refractive index
使用阿貝折射計對先前所獲得之硬化性組成物測定折射率。將結果示於表2。 An Abbe refractometer was used to measure the refractive index of the curable composition obtained previously. The results are shown in Table 2.
◆黏度之測定 ◆Measurement of viscosity
使用E型旋轉黏度計(東機產業股份有限公司製造之「RE80U」),於25℃條件下測定硬化性組成物之黏度。 Using an E-type rotary viscometer ("RE80U" manufactured by Toki Sangyo Co., Ltd.), the viscosity of the curable composition was measured at 25°C.
實施例2~8及比較例1~4 Examples 2 to 8 and Comparative Examples 1 to 4
以與實施例1相同之要點製作硬化性組成物及硬化物,並進行各種評價。將結果示於表2或3。 The curable composition and the cured product were produced with the same points as in Example 1, and various evaluations were performed. The results are shown in Table 2 or 3.
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