TWI704045B - Mold cleaning device and method, resin molding device, and resin molded product manufacturing method - Google Patents

Abstract

The present invention provides a molding die cleaning device and method, a resin molding device, and a resin molding product manufacturing method that can suppress the influence of heat and use it even in a state where the molding die has been heated to a temperature at which resin molding can be performed . The forming mold cleaning device is a device that removes attachments on the surface of at least one of the upper mold constituting the forming mold and the lower mold facing the upper mold, and includes: a laser light source, which is set between the upper mold and the lower mold The laser beam is emitted outside the space between the two; the laser beam reflection mechanism has a reflector and an XY platform that moves the reflector between a first position in the space and a second position outside the space to When the reflector is in the first position, the laser beam reflected by the reflector is irradiated on the surface of the upper mold or the lower mold, and the direction of the reflector is set; and the laser beam moving part is arranged outside the space so that The laser beam moves relative to the mirror when it is in the first position.

Description

Mold cleaning device and method, resin molding device, and resin molded product manufacturing method

The present invention relates to a molding die cleaning device and method, a resin molding device, and a resin molded product manufacturing method.

If a molding die is used for resin molding in a resin molding device, the resin slightly adheres to the surface of the molding die and remains after the molded product is taken out. The deposits gradually increase while the resin molding is repeated with the same molding die. . If resin molding is performed in a state where such an attached matter has adhered to the surface of the molding die, there is a possibility that the shape of the attached matter will be transferred to the resin molded product.

Therefore, the production of the resin molded product is temporarily stopped at regular intervals, and the cleaning is performed to remove the adhesion of the molding die. Patent Document 1 describes a device in which a laser light source is arranged in the space between the upper mold and the lower mold constituting the forming mold, and the laser light source is aligned along the upper surface of the lower mold (or the lower surface of the upper mold). ) While moving, the lower mold (upper mold) is irradiated with a laser beam to peel off the attached matter from the lower mold (upper mold). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-149705

[The problem to be solved by the invention]

During resin molding, in order to melt the resin or the like, the temperature of the molding die must be raised to a temperature of, for example, about 180°C. In the device described in Patent Document 1, if cleaning is performed in a state where the temperature of the forming mold has been raised, the laser light source or the moving device for moving it is arranged near the forming mold (for example, the upper and lower molds The middle) is used. Therefore, there is a concern that the accuracy of the irradiation position of the laser light will deteriorate due to heat such as heat in the space where the laser light source or moving device is arranged, or radiant heat from the molding die. If the mold is temporarily cooled and then cleaned in order to avoid such inconveniences, there is a concern that there will be a waiting time including the time until the mold is heated again for resin molding after cleaning to reach a stable temperature. , The takt time in the resin molding step is prolonged, and the manufacturing efficiency of resin molded products decreases.

The problem to be solved by the present invention is to provide a molding die cleaning device and method, a resin molding device, and a resin molding device that can suppress the influence of heat and use it even in a state where the molding die has been heated to a temperature at which resin molding can be performed. And the method of manufacturing resin molded products. [Technical means to solve the problem]

The forming mold cleaning device of the present invention is a device that removes adherents attached to the surface of at least any one of the first mold constituting the forming mold and the second mold facing the first mold, and is characterized in that it includes: a) A laser light source, which is arranged outside the space between the first mold and the second mold to emit the laser beam; b) The laser beam reflecting mechanism has a reflecting mirror and a reflecting mirror moving mechanism. The reflecting mirror moving mechanism moves the reflecting mirror between a first position in the space and a second position outside the space, so The laser beam reflection mechanism sets the reflection in such a manner that the laser beam reflected by the mirror irradiates the surface of the first mold or the second mold when the mirror is located at the first position The direction of the mirror; and c) The laser beam moving mechanism is arranged outside the space to move the laser beam relative to the reflector when it is at the first position.

The forming mold cleaning method of the present invention is a method for removing the adherents attached to the surface of at least one of the first mold constituting the forming mold and the second mold facing the first mold, and is characterized in that: Disposing a mirror in the space between the first mold and the second mold, A laser beam is emitted from a laser light source installed outside the space, and the laser beam is moved relative to the mirror by a laser beam moving mechanism installed outside the space while the laser beam The light beam irradiates the mirror, and The laser beam reflected by the mirror is irradiated onto the first mold or the second mold.

The resin molding apparatus of the present invention is characterized by including the molding die and the molding die cleaning device.

The method for manufacturing a resin molded product of the present invention is characterized in that after the molding die cleaning method is implemented, the molding die is used to manufacture a resin molded product. [Effects of the invention]

According to the present invention, even in a state where the temperature of the forming mold has been raised to a temperature at which resin molding can be performed, the influence of heat can be suppressed and used.

In the molding die cleaning device of the present invention, when the molding die is processed by irradiating a laser beam (cleaning in the molding die cleaning device) after the resin molding is temporarily stopped, the mirror moving mechanism is used to make the reflection After the mirror is moved to the first position in the space between the first mold and the second mold, a laser light source arranged outside the space is used to irradiate the mirror with a laser beam. Thus, the laser beam is reflected by the mirror and irradiated on the surface of the first mold or the second mold. Here, the laser beam is moved relative to the reflector by the laser beam moving mechanism provided outside the space, so that the spot of the laser beam irradiated on the surface of the first mold or the second mold is at all Move on the surface. Thus, the laser beam is irradiated within a fixed range of the surface of the first mold or the second mold. As a result, the first mold or the second mold is subjected to treatments such as removing (cleaning) deposits attached to the surfaces of these molds. After the processing of the molding die is completed, the mirror is moved to the second position outside the space, and then the resin molding is restarted.

According to the forming mold cleaning device of the present invention, even in a state where the first mold or the second mold is heated, the laser light source and the laser beam moving mechanism are arranged outside the space, so that the laser light source and the laser beam moving mechanism can be suppressed. The laser beam moving mechanism is affected by heat in the space or radiant heat from the first or second mode. On the other hand, although the reflecting mirror is arranged in the space, it is less affected by heat than the laser light source and the laser beam moving mechanism. For these reasons, the molding die cleaning device of the present invention can be used while suppressing the influence of heat even in a state where the temperature of the molding die has been raised to a temperature at which resin molding can be performed.

In the forming mold cleaning device of the present invention, it is preferable that the laser beam moving mechanism is a galvano scan head. The galvanometer scanning head is a device that moves the laser beam in one direction or two different directions by using a mirror that rotates by a rotating shaft or a combination of two mirrors with different inclination of the rotating shaft. Thereby, the spot of the laser beam irradiated on the surface of the first mold or the second mold can be moved one-dimensionally or two-dimensionally. The galvanometer scanning head can move the spot of the laser beam at high speed, thus shortening the processing time. In addition, there is no need to move the galvanometer scan head itself relative to the forming mold when moving the spot of the laser beam, so the installation space can be reduced.

The molding die cleaning device of the present invention can be configured to further include a reflection direction changing mechanism that changes the direction of the mirror. Alternatively, the forming mold cleaning device of the present invention may also adopt the following structure: the reflecting mirror includes a first reflecting mirror and a second reflecting mirror having different directions, and the laser beam reflecting mechanism further includes A mirror switching mechanism that switches the mirror of the laser beam. In either case, the angle at which the laser beam enters the first or second mode can be changed. For example, when the laser beam is irradiated into the first mold in a certain direction, when the wall surface of the cavity constituting the first mold is parallel to the laser beam, the wall surface of the laser beam can be easily irradiated by changing the angle of incidence. Shot beam.

The forming mold cleaning device of the present invention may adopt the following structure, the structure further comprising: a pair of first rotating shafts and second rotating shafts connected to both sides of the reflecting mirror; and rotating shaft holding tools , Movably holding at least one of the first rotating shaft body and the second rotating shaft body in the axial direction. As a result, even if the heat generated during resin molding causes the mirror to thermally expand during the processing of the molding die, or the temperature drops when the mirror is moved to the second position, the mirror shrinks and is rotated. The rotating shaft held by the shaft holding tool moves in the axial direction, and allows the mirror to expand or contract in the axial direction, so that the deformation of the mirror can also be suppressed. In addition, both the first rotating shaft and the second rotating shaft may be held on the rotating shaft holding tool movably in the axial direction, or the other of the first rotating shaft and the second rotating shaft may be Those (allowing rotation around the axis of rotation) are fixed in the direction of the axis.

The forming mold cleaning device of the present invention is a device that removes the attachments attached to the forming mold coated on at least a part of the surface. It is desirable that the laser light source and the laser beam moving mechanism are The following irradiation intensity irradiates the laser beam to the forming mold, and the irradiation intensity is such that after plasma is generated on the attachment, the plasma can be heated to a temperature above the vaporization temperature of the attachment The irradiation intensity of temperature is lower than the irradiation intensity that damages the coating.

As a result, at least a part of the attached matter is heated to a temperature higher than the temperature at which the attached matter is vaporized and vaporized, and is removed from the surface of the forming mold. On the other hand, in most cases, a coating containing chromium or the like is applied to the surface of the forming mold (in addition, in the present invention, the material of the coating of the forming mold is not particularly limited), and it is necessary to suppress the removal of deposits. This coating is damaged. In order to obtain knowledge about the damage caused by the laser beam to the coating of the forming mold, the inventors observed the surface of the forming mold to investigate the formation process of the deposits. It was found that the deposits first adhered in dots, and then Gradually approach the film-like shape covering almost the entire surface of the cavity surface of the molding die (in Figure 1(a), Figure 1(b), Figure 1(c), Figure 1(d)) and Figure 1(e) In the electron micrograph of, the symbol A is added to indicate attachment). Therefore, when the laser beam is irradiated at the stage where the attachment is dotted, there is a gap (the part where the attachment is not attached) of the dot or the area is not sufficiently enlarged, so the laser beam is directly irradiated to the coating. On the layer, there is therefore a concern about damage to the coating. Therefore, by irradiating the laser beam to the forming mold with an irradiation intensity lower than the irradiation intensity that causes damage to the coating, damage to the coating can be suppressed.

Here, the intensity of the laser beam irradiated on the forming mold can be adjusted to adjust the intensity of the laser beam emitted from the laser light source and the moving speed of the laser beam using the laser beam moving mechanism, for example, every second The power density of the scanning laser becomes 2 W/cm2～15 W/cm2. "Scanning laser light power density per second" is defined by the energy (unit: J (joule) = Wsec (watts) of laser light irradiated to a unit area (unit: cm2) in a unit time (unit: sec (second)) Second)), and the unit is represented by J/(cm2sec)=Wsec/(cm2sec), that is, W/cm2. The scanning laser light power density per second can be obtained by the following method: dividing the average output power of the irradiated laser beam by the relative movement of the laser beam spot relative to the forming mold in one second The sum of the area derived from the distance and the width of the light spot and the area of a single light spot (the part irradiated to the initial position before movement) (in other words, the power density of the scanning laser light per second is the laser light power density in one second). The output power per unit area in the part irradiated while the beam is moving).

When the power density of the scanning laser light per second is set to 2 W/cm2～15 W/cm2, it is ideal that the laser light energy density (laser fluence) of each pulse emitted by the laser light source is 0.04 J/cm2 ~0.7 J/cm2 pulsed laser beam. In addition, when the power density of the scanning laser light per second is 2 W/cm 2 to 15 W/cm 2, it is desirable to set the overlap rate of adjacent pulsed laser beams (described later) to 85% or more. By adopting either or both of the above-mentioned structures, plasma can be generated on the deposits that have adhered to the surface of the forming mold, and the plasma can be heated to a temperature higher than the temperature at which various kinds of deposits are vaporized.

Here, the "overlap ratio" is defined by the ratio of the volume of the portion of the space where the plasma is generated that overlaps with the adjacently generated pulsed laser beam among the volume occupied by one pulsed laser beam. If two adjacent pulsed laser beams are parallel, the overlap ratio can be determined by a pulsed laser beam at an arbitrary position in the plasma generating space and a cross-section perpendicular to the pulsed laser beam. The ratio of the area of the overlapped part of the vertical cross-section is calculated. The reciprocal of the overlap ratio corresponds to the number of pulse laser beams irradiated to the same part. In addition, if the pulse laser beam is not moved, the overlap rate becomes 100%, but in the present invention, the pulse laser beam is moved, so the overlap rate is less than 100%.

In the forming mold cleaning device of the present invention, it is desirable that the laser beam moving mechanism is a mechanism that makes the laser beam move back and forth in the first direction relative to the forming mold, and whenever the laser beam is moved When the laser beam moves in a single pass in the first direction, in a second direction perpendicular to the first direction, the laser beam is only moved by the laser beam irradiated to the light spot on the forming mold A single range; and between the laser beam moving mechanism and the forming die, it further includes a shielding portion that shields a portion of the single range of the light spot at both ends of the reciprocating movement in the first direction. Thus, in the two ends, when the laser beam moves in the second direction, the shielding section shields the laser beam that is excessively irradiated compared to the positions other than the two ends, so that it can be more uniform It can clean the surface of the forming mold.

Up to this point, the molding die cleaning device of the present invention has been described, but the molding die cleaning method, the resin molding apparatus, and the resin molded product manufacturing method also achieve the same actions and effects.

Hereinafter, with reference to FIGS. 2 to 23(d), more specific embodiments of the molding die cleaning apparatus and method, the resin molding apparatus, and the resin molded product manufacturing method of the present invention will be described.

(1) The structure of the mold cleaning device and the resin molding device of this embodiment As shown in FIG. 2, the molding die cleaning device 10 of this embodiment is a part of the constituent elements of the resin molding device 1 of this embodiment. The resin molding apparatus 1 has a molding die cleaning device 10 and a resin molding part 20 at the same time.

First, the structure of the resin molded part 20 is demonstrated. In this embodiment, the resin molding part 20 is a device for transferring (transferring) molding, and includes: a base 211; four (only two are shown in FIG. 2) tie bars 212, which are erected on the base The movable platen 221 is held on the tie rod 212 in a movable manner up and down; the fixed platen 222 is fixed on the upper end of the tie rod 212; and the toggle link 213 is set on the base 211 Up, the movable table 221 is moved up and down. Between the upper surface of the movable platen 221 and the lower surface of the fixed platen 222, there is arranged a forming mold 25 in which an upper mold (first mold) 251 and a lower mold (second mold) 252 are opposed to each other.

In FIG. 3, the molding die 25 and its vicinity are enlarged and shown. On the lower surface of the upper mold 251, two cavities C are formed side by side upward, and on the upper surface of the lower mold 252, two cavities C are formed side by side downward. Coating CT made of chromium nitride is applied to the lower surface of the upper mold 251, the upper surface of the lower mold 252, and the surfaces of the upper mold 251 and the lower mold 252 surrounding each cavity C. In coating CT, other materials such as hard chromium can also be used instead of chromium nitride. In the present embodiment, the cavity is made into a rectangular parallelepiped shape, but it may be made into a shape such as a column according to the shape of the resin molded product to be manufactured.

The upper surface of the lower mold 252 located around the two cavities C of the lower mold 252 can respectively mount the lead frame L. In addition, instead of the lead frame L, a substrate or the like may be placed on the upper surface of the lower mold 252.

Between the two cavities C of the lower mold 252, a cylinder 2521 for accommodating a resin material and a plunger 2522 for extruding the resin material from the cylinder 2521 are provided. In addition, the two cavities C of the lower mold 252 are respectively connected to the cylinder 2521 through runners 2523 as passages through which the softened or melted resin material passes as described later. A cull block 2511 is provided between the two cavities C of the upper mold 251 and at a position opposite to the barrel 2521. The two cavities C of the upper mold 251 are connected to the space directly below the rejection block 2511 through the runner 2513 respectively.

In addition, the resin molding unit 20 has a heating plate 253 that raises the temperature of the upper mold 251 and the lower mold 252 to maintain the lead frame L and the resin material at a predetermined temperature during resin molding. A heater 2531 is built in the heating plate 253. For the heater 2531, a cartridge heater can be used, for example.

The molding die cleaning device 10 includes a laser light source 11, a laser beam moving part (laser beam moving mechanism) 12, a mirror 13, an XY stage 14, and an XY stage driver 15.

The laser light source 11 is a light source that emits pulsed laser light. In this embodiment, the pulsed laser light emitted by the laser light source 11 has the energy density of the laser light per pulse within the range of 0.04 J/cm2 to 0.7 J/cm2 for reasons described later, and the The power density of the scanning laser is set in the range of 2 W/cm2 to 15 W/cm2, the pulse width is set in the range of 1 nsec to 200 nsec, and the pulse repetition frequency is set in the range of 300 kHz to 10 MHz. In addition, in this embodiment, the laser light source 11 is shaped such that the shape (beam spot) in the cross section perpendicular to the beam becomes square, and the laser light source 11 emits light from the center to the end of the cross section. A pulsed laser beam with an approximately equal top hat-type irradiation intensity distribution. In addition, the shape of the beam spot may be a shape other than a square such as a rectangle, a circle, and an annular shape. Here, the range (size) of the beam spot is defined by the 1/e2 method (86% method). The spot size can be measured by a camera-type beam profiler manufactured by Ophir Company or Coherent Company. In addition, you can use a power meter manufactured by Orpheus or Coherent to obtain the average output power of the laser beam, and obtain the scanning laser light per second based on the spot size and the average output power of the laser beam Power density. The laser light energy density of each pulse is the value obtained by dividing the average output power of the laser beam by the pulse repetition frequency. The pulse width can be measured using an oscilloscope manufactured by Agilent Technologies. In addition, the average output power of the laser beam can be calculated by the formula "average output power of the laser beam [W] = pulse energy [J] × pulse repetition frequency [Hz]".

The laser beam moving unit 12 has a galvanometer scanning head 121 and a lens 122 (refer to FIGS. 4(a) and 4(b)). The galvanometer scanning head 121 causes the pulsed laser beam B introduced from the laser light source 11 to repeatedly move back and forth in the X direction (the direction perpendicular to the paper surface in FIG. 2) (FIG. 4(a)), and also in the Z direction ( The longitudinal direction of Fig. 2) moves upwards (Fig. 4(b)). In this embodiment, the moving speed of the pulsed laser beam by the laser beam moving part 12 is set so that the overlap ratio becomes 85% or more. During the movement, there is a possibility that the spot size changes in the vicinity of the center position and the vicinity of the end depending on the size of the movement range of the pulsed laser beam B. If this changes, the irradiation intensity changes depending on the position. Therefore, it is desirable to use a telecentric lens or a lens with a sufficiently long irradiation depth as the lens 122 to suppress the change in the spot size caused by the position. In addition, in the example shown in Figs. 4(a) and 4(b), the lens 122 is arranged at the rear stage of the galvanometer scanning head 121, but a motorized lens with multiple lenses may be arranged at the front stage of the galvanometer scanning head 121. A variable beam diameter lens (not shown) may be used in combination with the lens 122 and a motorized variable beam diameter lens. In the case of using a motorized variable beam diameter lens, by changing the beam diameter according to the repeated reciprocating movement, the spot size on the surface of the forming mold 25 can be made substantially constant.

The mirror 13 is a mirror that reflects the pulsed laser beam B, and has a wider width in the X direction than the range in which the laser beam moving unit 12 moves the pulsed laser beam B back and forth. For example, a mirror containing synthetic quartz glass (fused silica) can be used for the mirror 13. In addition, a coating containing a metal film may be applied on the surface of the mirror 13. As such a coating, the most suitable one may be selected from among gold coatings, silver coatings, aluminum coatings, and dielectric multilayer films.

As shown in FIG. 5, one end of the mirror 13 in the X direction is held by the first holding tool 131L, and the other end is held by the second holding tool 131R. The first holding tool 131L and the second holding tool 131R are respectively provided with a first rotating shaft body 132L and a second rotating shaft body 132R extending in the X direction. The first rotating shaft body 132L is inserted through the bearing 133L. In addition, the second rotating shaft body 132R is inserted into the rotating shaft body movable holding tool 133R. The movable shaft holding tool 133R may be a bearing. In addition, in FIG. 5, in the perspective view, a cross section in the Z direction passing through the first rotation shaft 132L and the second rotation shaft 132R is combined and shown, and the mirror 13 is shown with a solid line as the cross section. Compared to the back side in the Y direction, the front side is indicated by a dotted line (that is, the mirror 13 is also present in the dotted line).

As shown in enlargement in FIG. 6(a), on the surface of the first rotation shaft body 132L on the outer side of the rotation axis direction (opposite side of the mirror 13 in the X direction) than the bearing 133L, a rotation axis A circle of grooves 1321L. The first fixing tool 135L is inserted into the groove 1321L. In addition, the first fixing tool 135L only needs to extend from the groove 1321L, and the outer diameter is smaller than that of the bearing 133L. The bearing 133L is clamped in the axial direction of the first fixed tool 135L by the step difference formed by the diameter of the first rotating shaft 132L, and allows the first rotating shaft 132L to rotate around the axis of rotation in the X direction. , And via the bearing 133L, the first rotating shaft body 132L is restricted so as to hardly move in the direction parallel to the rotating shaft. The bearing 133L is clamped and fixed by the bearing holding portion 134L and a bearing fixing tool 137L provided on the outside of the bearing holding portion 134L as viewed from the mirror 13.

In addition, as shown in an enlarged view in FIG. 6( b ), a groove 1321R is provided on the surface of the second rotating shaft 132R on the outer side of the rotating shaft direction than the rotating shaft movable holding tool 133R. The second fixing tool 135R is inserted into the groove 1321R. In addition, the second fixing tool 135R does not need to be provided throughout the entire groove 1321R. The rotating shaft movable holding tool 133R is clamped in the axial direction by the second rotating shaft 132R with the second fixed tool 135R formed by the difference in its diameter, and fixed to the second rotating shaft in the axial direction. The positional relationship of the body 132R is maintained in a manner that allows the second rotation shaft 132R to rotate around the rotation axis in the X direction. The rotating shaft movable holding tool 133R is held by the outer holding tool 134R, and can move in the axial direction together with the second rotating shaft 132R relative to the outer holding tool 134R. Fig. 6(c) shows that the mirror 13 expands compared to the case of Fig. 6(b). Accompanying this, the second rotating shaft 132R and the rotating shaft movable holding tool 133R have moved to the opposite side of the mirror 13 Examples of status. By moving the second rotation shaft 132R and the movable holding tool 133R of the rotation shaft as described above, the load applied to the mirror 13 can be suppressed, and the deformation of the mirror 13 can be suppressed. When the mirror 13 shrinks, the second rotation shaft 132R and the rotation shaft movable holding tool 133R move in opposite directions, thereby suppressing the deformation of the mirror 13. In addition, a combination of the rotating shaft movable holding tool 133R, the outer holding tool 134R, and the second fixed tool 135R may be regarded as the rotating shaft movable holding tool.

Here, by the first fixing tool 135L and the bearing 133L fixed by the bearing holding portion 134L and the bearing fixing tool 137L, one of the pair of rotating shaft bodies is restricted so as to hardly move in the direction parallel to the rotating shaft ( The first rotating shaft body 132L), but it is also possible to move the tools and jigs through the rotating shaft body, so that the two rotating shaft bodies are movable within a fixed range in a direction parallel to the rotating shaft.

As shown in Fig. 7(a), the first holding tool 131L and the second holding tool 131R are on the back side of the mirror 13 (the back side of the mirror 13 shown in Fig. 5) and pass through two shafts 138 ( (Illustration omitted in Figure 5) to link. The shaft 138 is fixed to the first holding tool 131L, and on the other hand, is mounted to the second holding tool 131R via a sliding bearing (bush) 139. The shaft 138 has the function of reducing the load such as torsion generated in the mirror 13 when the mirror 13 rotates, and has the function of aligning the rotation axis centers of the first rotating shaft body 132L and the second rotating shaft body 132R during assembly. effect. FIG. 7( b) shows an example of a state in which the mirror 13 expands compared to the case of FIG. 7( a ), and accompanying this, the second holding tool 131R has moved to the opposite side of the mirror 13. By moving the second holding tool 131R as described above, it is possible to suppress the load applied to the mirror 13 and suppress the deformation of the mirror 13. When the mirror 13 shrinks, the second holding tool 131R moves in the opposite direction, thereby suppressing the deformation of the mirror 13.

The mirror 13 is further connected to a motor (reflection direction changing mechanism) 136 that rotates the mirror 13 around the axis of rotation via a power transmission mechanism (not shown) such as gears, pulleys, and conveyor belts (see FIG. 2 ). The power transmission mechanism normally acts on at least one of the bearing holding portion 134L or the outer holding tool 134R. The power transmitted from the power transmission mechanism to one of the bearing holder 134L and the outer holding tool 134R is transmitted to the other through the mirror 13. At this time, the shaft 138 operates to reduce the load such as torsion applied to the mirror 13, so even if the thickness of the mirror 13 is not sufficiently thick, deformation can be suppressed. When the reflecting surface of the mirror 13 is tilted by 45° with respect to the Y axis by the motor 136, the pulsed laser beam B is vertically irradiated on the surface of the lower mold 252. In addition, when the reflecting surface of the reflecting mirror 13 is upward and inclined by 45° with respect to the Y axis, the pulsed laser beam B is irradiated on the surface of the upper mold 251 vertically. On the other hand, when the reflecting surface of the mirror 13 is downward or upward and is inclined with respect to the Y axis at an angle other than 45°, the pulse laser beam B is inclined at an angle relative to the surface of the lower mold 252 or the upper mold 251 Perform irradiation.

The laser light source 11, the laser beam moving part 12 and the reflecting mirror 13 are installed on the XY platform 14. The XY stage 14 is controlled by the XY stage driver 15 so that the laser light source 11, the laser beam moving part 12, and the mirror 13 maintain the relative positional relationship of the three constituent elements while moving in the X direction and Y direction. Move in the direction. During cleaning, the mirror 13 and the like pass through the XY stage 14 to move in the X direction and the Y direction in a range slightly larger than the widths of the upper mold 251 and the lower mold 252 in the X direction and Y direction, respectively. At the same time, the XY stage 14 also has a function of moving the position of the forming mold cleaning device 10 in the Y direction as follows: the mirror 13 is arranged in the space between the upper mold 251 and the lower mold 252 during cleaning In the use position (FIG. 8(a)), the entire mold cleaning device 10 including the mirror 13 is arranged in the standby position (FIG. 8(b)) which is a position outside the space during resin molding.

In order to maintain the relative positional relationship of the laser light source 11, the laser beam moving part 12, and the reflecting mirror 13, the XY stage 14 moves the laser light source 11, the laser beam moving part 12, and the reflecting mirror 13 in the X direction. As shown in FIG. 9, the laser light source 11 and the laser beam moving part 12 may be connected to the reflecting mirror 13 by a connecting rod 141 extending in the Y direction. Here, the laser light source 11 and the laser beam moving part 12 are placed on the base 112, and the connecting rod 141 is fixed on the base 112. On the mirror 13 side, the connecting rod 141 is fixed to the bearing holding portion 134L and the outer holding tool 134R. In the bearing holding portion 134L and the outer holding tool 134R, there are provided holes (not shown) extending in the same direction as the first rotating shaft body 132L and the second rotating shaft body 132R, the mirror 13 and its accessories. The bearing holding portion 134L or the outer holding tool 134R of the product moves in the Y direction along the guide rod 142 inserted in this hole. With this structure, the laser light source 11, the laser beam moving part 12, and the mirror 13 that are separately arranged in the Y direction can be moved in the X direction by only one power source (not shown). By reducing the number of power sources as described above, the influence of heat that the power sources receive from the forming die is suppressed, and therefore the number of cooling mechanisms (not shown) for cooling the power sources can also be reduced.

In addition, when the width of the upper mold 251 and the lower mold 252 in the X direction is smaller than the range of the reciprocating movement of the pulsed laser beam B by the laser beam moving part 12, it is also possible to use only the three components in the Y direction. The upward movement mechanism replaces the XY stage 14 and the XY stage driver 15. Alternatively, it is not necessary to maintain the relative positional relationship between the laser light source 11 and the laser beam moving portion 12 and the reflecting mirror 13 in the Y direction, and only the reflecting mirror 13 may be moved in the Y direction. In addition, as shown in FIG. 10, when using a mirror 13W whose width in the X direction is larger than the irradiation range of the laser beam in the X direction of the molding die 25, only the laser light source 11 and the laser beam moving part 12 are required. It is sufficient to move in the Y direction, and there is no need to move the mirror 13W in the X direction.

In addition to the above-mentioned components, the molding die cleaning device 10 may also have a vaporized deposit removing portion (illustration omitted) that sucks gas in the space between the upper mold 251 and the lower mold 252 and discharges it to the outside of the resin molding device 1 Show). In this case, a vaporization deposit capture filter (not shown) may be further provided in the vaporization deposit removal part.

(2) The actions of the molding die cleaning device and resin molding apparatus of this embodiment, and the actions of the molding die cleaning method and resin molded product manufacturing method of this embodiment to the molding die cleaning device 10 and resin molding device 1 of this embodiment, And the mold cleaning method and the resin molded product manufacturing method of this embodiment are demonstrated. Hereinafter, first, the operation of the resin molding unit 20 in the resin molding apparatus 1 (except for the cleaning of the molding die) during resin molding will be described, and secondly, the operation of the molding die cleaning device 10 in the resin molding apparatus 1 will be described. The action is explained. The operation of the forming mold cleaning device 10 corresponds to the embodiment of the forming mold cleaning method of the present invention. In addition, the combination of the operation of the resin molding part 20 and the operation of the mold cleaning device 10 corresponds to an embodiment of the resin molded product manufacturing method of the present invention.

(2-1) Actions during resin molding by the resin molding section 20 Using FIGS. 11( a) and 11 (b ), the operation when a resin molded product is manufactured by the resin molding part 20 will be described. When manufacturing a resin molded product, the entire mold cleaning device 10 is moved to the standby position (FIG. 8( b )) by the XY stage 14 in advance. As described above, the standby position is a position outside the space between the upper mold 251 and the lower mold 252, and the mold cleaning device 10 does not interfere with the operation of the resin molded part 20 when the resin molded product is manufactured.

First, by lowering the movable platen 221, the upper mold 251 and the lower mold 252 are separated from the upper and lower molds in an open state (FIG. 11(a)). In this state, the lead frame L with electronic components mounted on the upper and lower surfaces is placed on the upper surface of the lower mold 252 in such a manner that the electronic components are aligned with the lateral position of the cavity C. In addition, the plate-shaped resin material P is supplied into the cylinder 2521 by a resin material supply mechanism not shown. The resin material P is a composite material containing thermosetting resin (epoxy resin etc.), for example. The resin material P may also contain wax (higher fatty acid esters, etc.), hardening accelerators (phosphorus-based catalysts, amino-based catalysts, etc.), coupling agents, colorants, flame retardants, flame retardant auxiliary agents, and the like. The resin material supply mechanism is widely used in conventional resin molding apparatuses, and detailed description is omitted. The thermosetting resin in the resin material P is softened or melted in the cylinder 2521 by the heat supplied from the heating plate 253. The upper mold 251 is also heated to a predetermined temperature by the heating plate 253.

After the thermosetting resin in the cylinder 2521 is softened or melted, the movable platen 221 is raised by the crank connecting rod 213 (FIG. 11( b )). Thereby, the lower mold 252 on the movable platen 221 abuts against the upper mold 251 via the lead frame L and presses the upper mold 251. Since the upper mold 251 is fixed to the fixed platen 222, the forming mold 25 is Clamping. By raising the plunger 2522 in this state, the resin material P in the cylinder 2521 is supplied to the cavities C of the upper mold 251 and the lower mold 252 via the runner 2513 and the runner 2523. After a predetermined time has elapsed, the thermosetting resin in the resin material P is cured, and a resin molded product after resin molding on the lead frame L can be obtained. After that, the movable platen 221 is lowered by the crank connecting rod 213 to open the mold 25 and remove the resin molded product from the mold 25.

By repeating the operations so far, many resin molded products can be manufactured. However, during the repeated production of the resin molded product, a part of the thermosetting resin or filler contained in the resin material P gradually adheres to the surface of the molding die 25. Therefore, every time a predetermined number of resin molded products are manufactured or every predetermined time, the molding die cleaning device 10 is operated as described below, thereby cleaning the surface of the molding die 25.

(2-2) Action of the forming mold cleaning device 10 First, in the state that the forming mold 25 has been opened, the XY stage 14 is used to move the forming mold cleaning device 10 to the use position (Figure 8(a)), that is, the mirror 13 is arranged on the upper mold 251 and the lower mold. The pattern between the molds 252 moves the forming mold cleaning device 10 (refer to FIG. 2 ). At this time, the reflecting surface of the reflecting mirror 13 can be either upward or downward. In the former case, the upper mold 251 is cleaned first, and in the latter case, the lower mold 252 is cleaned first. Hereinafter, a case where the reflecting mirror 13 at this time point has the reflecting surface downward as indicated by the solid line in FIGS. 2 and 4(b) will be described as an example. The deposit attached to the mold 25 contains any one of the materials and components contained in the resin material P, the substrate, or the lead frame. In addition, deposits may also adhere to the parting surface (the lower surface of the upper mold 251 and the upper surface of the lower mold 252) or resin channels such as runners, and these deposits may hinder continuous molding.

In this state, the laser light source 11 emits a pulsed laser beam B having the laser light energy density and pulse width of each pulse at the pulse repetition frequency. Thus, the pulsed laser beam B is reflected by the reflector 13 by 90° and irradiated on the surface of the lower mold 252. At this time, the laser beam moving unit 12, as conceptually shown in the plan view of FIG. 4(a) and the side view of FIG. 4(b), causes the pulsed laser beam B to be within a predetermined range in the X direction (FIG. 4 (A) The range between XL and XR) repeats the reciprocating movement, and every time a one-way movement is performed in the X direction, the spot BS of the pulsed laser beam B is individually specified in the Z direction Move within the range (the range between ZT and ZB in Figure 4(b)). Thus, on the surface of the lower mold 252, first, the spot of the pulsed laser beam B moves only the predetermined range in the X direction (FIG. 4(a)). Thereafter, if the pulsed laser beam B moves only a single range of the spot BS in the Z direction, the pulsed laser beam B is reflected by the mirror 13 by 90°, and the spot BS generated on the surface of the lower mold 252 is in the Y direction Only a single range of light spots are moved on (Figure 4(b)). Thus, the light spot BS on the surface of the lower mold 252 repeats the following zigzag movement: a single-pass movement is performed in the X direction, and then only a single range of the light spot BS is moved in the Y direction, and then in the X direction toward and Move in the opposite direction just now (Figure 12).

As the light spot BS moves in a zigzag shape as described above, the pulsed laser beam B is irradiated to a part or all of the surface of the lower mold 252. Here, in the case where the pulse laser beam B only irradiates a part of the surface of the lower mold 252, after the irradiation of the pulse laser beam B with one zigzag movement is completed, the XY stage 14 moves the mirror 13 To the area of the surface of the lower mold 252 that has not yet been irradiated with the pulse laser beam B. In addition, when a motorized variable beam diameter lens with a sufficient movable distance is installed, the spot size can be adjusted by the internal lens. Therefore, the laser beam moving part 12 can also be set to include only the XY stage 14 structure. Furthermore, by the same method as described above, the pulsed laser beam B is irradiated to the area while moving in a zigzag shape. By repeating the above operation, the entire surface of the lower mold 252 is irradiated with the pulsed laser beam B. In FIG. 13, a thin solid line is used to illustrate the zigzag trajectory of the pulse laser beam B on the surface of the lower mold 252, and a thick dashed line is used to illustrate the irradiation area of the pulse laser beam B using one zigzag movement. Borders.

Thereafter, the reflecting mirror 13 is rotated, thereby switching the reflecting surface from downward to upward. Furthermore, as in the case of the lower mold 252, the surface of the upper mold 251 is also irradiated with the pulsed laser beam B.

In the forming mold cleaning device 10 of this embodiment, the pulsed laser beam B with the laser light energy density per pulse in the range of 0.04 J/cm2 to 0.7 J/cm2 is irradiated to the forming mold 25 (upper mold 251 and On the surface of the lower mold 252), plasma PL is thereby generated on the surface of the forming mold 25 (FIG. 14(a)). The source of the plasma PL is not particularly limited, but by irradiating the pulsed laser beam B on the deposit, the vicinity of the surface of the deposit AG becomes a high temperature and high pressure state, and the plasma PL can be generated. Furthermore, the pulsed laser beam B having the same laser light energy density as described above is moved so that the overlap ratio becomes 85% or more, whereby the pulsed laser beam B irradiates the same part in the plasma PL six times As described above, the plasma PL is thereby heated to a temperature at which the resin contained in the deposit A adhered to the surface of the mold 25 during normal resin molding can be vaporized (FIG. 14( b )). As a result, at least a part of the deposit A on the surface of the forming mold 25 is vaporized and removed from the surface. At this time, heat transfer from the coating CT heated by the plasma PL and heat generated by radiation (radiation) may also act on the deposit AG from the coating CT side. In addition, the both ends in the X direction in the range where the pulse laser beam B moves, that is, the width of less than one pulse laser beam B in the X direction (for example, the width when the overlap rate is 85%) 17/20), the pulse laser beam B may be irradiated less than six times, but usually the width is small enough that the plasma PL heated around it flows into the part, so it will not Become a problem. When the molding die cleaning device 10 has a vaporized deposit removing device, the vaporized deposits AG are sucked and removed from the vicinity of the surface of the molding die 25.

In the state where the upper mold 251 and the lower mold 252 are heated by the heating plate 253 as described above, the space between the upper mold 251 and the lower mold 252 may become high temperature. However, in the molding die cleaning device 10 of this embodiment, the laser light source 11 and the laser beam moving part 12, which are easily affected by heat, are arranged outside the space, and the mirror 13 is arranged in the In the space, it is less likely to be affected by heat than the laser light source 11 and the laser beam moving part 12. Therefore, the molding die cleaning device 10 of this embodiment can be used even at a high temperature as described above.

The reflecting mirror 13 undergoes thermal expansion due to being arranged in the space. However, since the second rotating shaft 132R is allowed to move in a direction parallel to the rotating shaft until the second holding tool 131R abuts on the outer holding tool 134R, it is possible to suppress deformation of the mirror 13 due to thermal expansion. In addition, the shaft 138 slides in the sliding bearing 139 in accordance with the thermal expansion of the mirror 13 and thus moves in the axial direction. Therefore, a force can be applied to the mirror 13 to suppress deformation of the mirror 13. Furthermore, when the mirror 13 is retracted out of the space after the molding die cleaning device 10 is completed, the mirror 13 shrinks as the temperature drops, but at this time, the second rotating shaft 132R is allowed to rotate Since the axis moves in a direction parallel to the axis, the deformation of the mirror 13 can also be suppressed.

Furthermore, in the forming mold cleaning device 10 of the present embodiment, after the plasma PL is generated, as described above, the plasma PL is heated, and the heat is used to vaporize at least a part of the deposit A Process to remove the attachment A, which can suppress the damage compared to the case where the attachment A is removed by directly irradiating the laser beam with a higher irradiation intensity (laser energy density, laser power density) to the attachment A. Damage caused by the coating CT of the forming mold 25.

In the case of using the laser light source 11 and the laser beam moving part 12 that oscillate a pulsed laser beam, in order to more reliably remove the deposits from the surface of the forming mold 25, and to further suppress the inclusion of chromium nitride, hard chromium, etc. The coating is damaged. Ideally, the pulse width is 50 nsec～120 nsec, the laser energy density of each pulse is 0.1 J/cm2～0.6 J/cm2, the overlap rate is more than 90%, and every second scan The laser power density is 3 W/cm2～11 W/cm2.

In addition, in the case of using the laser light source 11 and the laser beam moving part 12 that oscillate the pulsed laser beam, in order to more reliably remove the deposits from the surface of the mold, and to further suppress the inclusion of chromium nitride or hard chromium The following structure can also be adopted for the damage of coatings such as: the pulse width is 50 nsec～120 nsec, the laser energy density of each pulse is 0.04 J/cm2～0.1 J/cm2, and the overlap The rate is above 98%, and the scanning laser optical power density per second is 5 W/cm2～11 W/cm2.

(3) Another embodiment of forming mold cleaning device Hereinafter, another embodiment of the mold cleaning device of the present invention will be described. The structure shown in FIGS. 15(a) and 15(b) is that the spot BS of the pulsed laser beam B is on the lower surface of the upper mold 251 or the upper surface of the lower mold 252 along the path shown in FIG. 12 In the case of upward movement, at both ends of the path in the X direction (that is, the direction in which the light spot BS moves back and forth. This corresponds to the first direction), that is, between the laser beam moving part 12 and the upper mold 251 or the lower mold 252 , A shielding portion 17 (shown by a thick solid line in FIG. 15(a)) that shields the pulse laser beam B only with the width of a single range of the light spot BS can be provided. In addition, the shielding part 17 may be provided between the laser beam moving part 12 and the upper mold 251 and between the laser beam moving part 12 and the lower mold 252 at the same time.

If the shielding portion 17 is not provided as in the above-mentioned embodiment, and the light spot BS is in the Y direction (corresponding to the second direction) while the emission of the pulsed laser beam B from the laser light source 11 is continued When moving, according to the moving speed of the light spot BS, the portion where the shielding portion 17 is provided is irradiated with the pulsed laser beam B with a larger number of pulses than other portions. For example, the part that becomes the starting point of the irradiation or the part where the movement in the X direction and the movement in the Y direction are switched may have parts where the pulse laser beam B is irradiated with a different number of times than other parts. In addition, the portion where the shielding portion 17 is provided may be a position where the pulse laser beam B may be irradiated with less than six times as described above. On the other hand, the single range of the light spots BS at both ends of the X direction is shielded by the shielding portion 17 for the pulsed laser beam B, and cleaned by the pulsed laser beam B passing through the portion not shielded, This can further improve the uniformity of the cleaning process.

Instead of using the shielding unit 17, the emission of the pulsed laser beam B from the laser light source 11 may be stopped while the light spot BS is moved in the Y direction. In addition, the moving speed of the pulsed laser beam may be changed, and the laser light energy density and/or repetition frequency of each pulse may be changed accordingly. For example, to make the laser beam move faster, corresponding to this, the energy density of the laser light per pulse is increased and/or the repetition frequency is increased, thereby expanding the amount of pulsed laser beam that can be irradiated in the same time. area.

In addition to moving the light spot BS in a zigzag pattern as shown in Fig. 12 or Fig. 13, for example, as shown in Fig. 16(a), the following action may be repeated: one-way movement in the X direction (fine solid in the figure) Line path), stop the emission of the pulsed laser beam B from the laser light source 11, and then move only a single range of the light spot BS in the Y direction while returning to the original position in the X direction (in the figure Thin dashed path), and then make a one-way movement in the X direction. Or, as shown in Figure 16(b), one zigzag movement (or one-way repetitive movement in Figure 16(a)) can be used (not divided into multiple irradiation areas as described) to irradiate the entire cleaning target with pulses Laser beam B.

In order to move the mirror 13 in the X direction, as shown in FIG. 17, an X-direction guide rail 181, an X-direction conveyor belt 182, a conveyor belt mounting member 183, an X-direction motor 184, an X-direction pulley 185, a motor block 186, The pulley block 187 and the X-direction moving mechanism 18 of the Y-direction guide 188. The X-direction guide rail 181 is a guide rail that is directly below the upper mold 251 or directly above the lower mold 252, and extends in the X direction so as to traverse these molds. The X-direction conveyor belt 182 extends substantially parallel to the X-direction guide rail 181, and the bearing holding portion 134L of the mirror 13 or the outer holding tool 134R is attached by the conveyor attaching member 183. The bearing holding portion 134L or the outer holding tool 134R attached to the X-direction belt 182 is supported by the X-direction guide rail 181. The X-direction motor 184 is housed in a motor block 186, and the motor block 186 is fixed to one end of the X-direction guide rail 181. In addition, the X-direction pulley 185 is housed in the pulley block 187, and the pulley block 187 is fixed to the other end of the X-direction guide rail 181. The X direction conveyor belt 182 is hung on the X direction motor 184 and the X direction pulley 185. The motor block 186 is placed on the Y-direction guide rail 188, and each component of the X-direction moving mechanism 18 other than the Y-direction guide rail 188 can move in the Y direction along the Y-direction guide rail 188.

In this X-direction moving mechanism 18, the X-direction pulley 185 rotates in accordance with the rotation of the X-direction motor 184, whereby the X-direction conveyor belt 182 moves in the X direction, thereby being mounted on the bearing holder 134L or the outer holding tool 134R. The mirror 13 on the X-direction conveyor belt 182 moves in the X direction. According to the X-direction moving mechanism 18, the X-direction motor 184 is arranged outside the upper mold 251 and the lower mold 252 in the X direction, so the influence of the heat from the upper mold 251 and the lower mold 252 on the X-direction motor 184 can be suppressed . In addition, in order to move the laser light source 11 and the laser beam moving part 12 in the X direction, the same one as the X direction moving mechanism 18 may be used.

Fig. 18 shows another embodiment of the mold cleaning device of the present invention. The forming mold cleaning device 10A of this embodiment has the same laser light source 11, laser beam moving part 12, XY stage 14, and XY stage driver 15 as the forming mold cleaning device 10. In FIG. 18, illustration of the XY stage 14 and the XY stage driver 15 are omitted. In addition, the forming mold cleaning device 10A has a first reflection mirror 13X and a second reflection mirror 13Y instead of the reflection mirror 13 in the forming mold cleaning device 10. Furthermore, the molding die cleaning device 10A includes a mirror switching part (mirror switching mechanism) 16 including an optical path switching mirror 161 and an optical path switching mirror moving part 162.

The first reflecting mirror 13X is rotatable by a rotation axis extending in the X direction, and is arranged on the optical path of the pulsed laser beam B emitted from the laser beam moving part 12. The second reflecting mirror 13Y has a structure in which the first reflecting mirror 13X is rotated by 90° around the Z axis, can be rotated by a rotating shaft extended in the Y direction, and is arranged in the pulsed laser emitted from the laser beam moving part 12 The side of the optical path of the light beam B.

The reflection surface of the optical path switching mirror 161 is parallel to the Z axis and faces a direction inclined by 45° with respect to the pulsed laser beam B emitted from the laser beam moving part 12. The optical path switching mirror moving part 162 is a device that moves the optical path switching mirror 161 between the outside (side) and inside the optical path of the pulsed laser beam B emitted from the laser beam moving part 12.

The operation of the mold cleaning device 10A will be described. First, in a state where the optical path switching mirror 161 has been arranged outside the optical path of the pulsed laser beam B by the optical path switching mirror moving part 162, the reflection surface of the first mirror 13X is tilted downward and only 45° with respect to the XZ plane. In addition, as in the case of the molding die cleaning device 10, the pulsed laser beam B is emitted from the laser light source 11 and then moved back and forth in the X direction and in the Y direction by the laser beam moving part 12 mobile. Thus, the pulsed laser beam B is reflected by the first mirror 13X and then irradiated on the surface of the lower mold 252. Here, the reflecting surface of the first reflecting mirror 13X is inclined at 45° with respect to the XZ plane, so the pulsed laser beam B is vertically incident into the upper surface of the lower mold 252. However, if it is incident in this way, it is difficult to irradiate the pulse laser beam B to the surface perpendicular to the upper surface of the lower mold 252, such as the side surface facing the cavity C. Therefore, after the operation up to this point is completed, the angle of the reflecting surface of the first mirror 13X can be changed from 45° to another size, and the side surface of the lower mold 252 parallel to the X direction can be irradiated with a pulsed laser beam B.

Then, after making the reflection surface of the first mirror 13X upward and tilting only 45° with respect to the XZ plane, the pulse laser beam B is moved back and forth in the X direction and in the Y direction by the laser beam moving part 12 By moving, the pulsed laser beam B is irradiated on the surface of the upper mold 251. At this time, after the angle of the reflecting surface of the first reflecting mirror 13X is set to 45° and the operation is performed, the angle may be changed to a size other than 45°, so that the upper mold 251 is parallel to the X direction. The pulse laser beam B is irradiated from the side.

However, even through the operations so far, the side surfaces parallel to the Y direction of the lower mold 252 and the upper mold 251 cannot be irradiated with the pulsed laser beam B. Therefore, the optical path switching mirror moving part 162 moves the optical path switching mirror 161 into the optical path of the pulsed laser beam B emitted from the laser beam moving part 12. Furthermore, with the reflection surface of the second mirror 13Y facing downward and the angle formed with the XZ plane at a size other than 45°, the pulsed laser beam B is emitted from the laser light source 11 and then passed through the laser beam moving part 12 It moves back and forth in the X direction and in the Y direction, so that the side surface of the lower mold 252 parallel to the Y direction can be irradiated with the pulsed laser beam B. Furthermore, when an electric variable beam diameter lens is mounted, the built-in lens is moved by electric power, so that the angle of the second mirror 13Y can be aligned to adjust the spot size. The operations described here can also be performed on the upper mold 251.

As described above, according to the molding die cleaning device 10A, the side surfaces parallel to the X direction and the Y direction of the lower mold 252 and the upper mold 251 can be irradiated with the pulsed laser beam B, and the lower mold 252 and the upper mold 252 can be irradiated more reliably. The mold 251 is cleaned.

In Figs. 19(a-1) to 19(b), a forming mold cleaning device 10B as another embodiment of the forming mold cleaning device of the present invention is shown. The molding die cleaning device 10B of this embodiment has a laser light source 11, a laser beam moving part 12, an XY stage 14, and an XY stage driver 15 that are the same as those of the molding mold cleaning device 10 described above. In FIGS. 19(a-1) to 19(b), illustration of the XY stage 14 and the XY stage driver 15 are omitted. In addition, the forming mold cleaning device 10B has a first reflection mirror 13A and a second reflection mirror 13B instead of the reflection mirror 13 in the forming mold cleaning device 10. Furthermore, the forming mold cleaning device 10B includes a mirror switching unit (mirror switching mechanism) 16A.

The first mirror 13A is rotated around the axis in the Z direction by the mirror switching unit 16A as described above, and can also be rotated by the axis of rotation on the XY plane, and is arranged in the laser beam moving unit 12 Optical path of pulse laser beam B. The second mirror 13B is rotatable by a rotation axis extended in the Y direction, and is arranged on the side of the optical path of the pulsed laser beam B emitted from the laser beam moving part 12. The mirror switching unit 16A is provided on the lower side of the first mirror 13A, and is configured along an annular guide rail such that the first mirror 13A rotates around an axis in the Z direction.

The operation of the mold cleaning device 10B will be described. First, the mirror switching unit 16A sets the direction of the first mirror 13A so that the intersection of the reflection surface of the first mirror 13A and the XY plane becomes parallel to the X axis (FIG. 19( a )). In this state, similar to the first mirror 13X in the forming mold cleaning device 10A, the first mirror 13A is rotated by the axis of rotation extended in the X direction, and the reflection of the first mirror 13A is Face down and tilt only 45° with respect to the XZ plane, make the reflective surface of the first mirror 13A downward and tilt with respect to the XZ plane at an angle other than 45°, make the reflective surface of the first mirror 13A upward and In the state of tilting only 45° with respect to the XZ plane, the reflecting surface of the first mirror 13A is upward, and the state of tilting with respect to the XZ plane at an angle other than 45°, pulses are applied to the first mirror 13A. Laser beam B. In this way, the pulsed laser beam B can be reflected by the first mirror 13A and irradiated onto the surface of the lower mold 252 or the upper mold 251 including a side surface substantially parallel to the XZ plane. When the reflecting surface is turned down and the pulse laser beam B is irradiated onto the lower mold 252, the pulse laser beam B reflected by the first mirror 13A passes through the hollow part of the mirror switching part 16A that is more inside than the annular guide rail .

Then, the first mirror 13A is erected so that the reflecting surface becomes perpendicular to the XY plane, and the mirror switching section 16A makes the first reflecting mirror 13A surround the Z axis so that the reflecting surface faces 45° with respect to the XZ plane. Turn it (Figure 19(b)). In this state, the pulsed laser beam B irradiated into the first mirror 13A is reflected by the first mirror 13A and then enters the second mirror 13B. Furthermore, with the reflection surface of the second mirror 13B facing downward and the angle formed with the XZ plane at a size other than 45°, the pulsed laser beam B is emitted from the laser light source 11 and then passed through the laser beam moving part 12 The pulse laser beam B moves back and forth in the X direction and in the Y direction, so that the side surface of the lower mold 252 parallel to the Y direction can be irradiated with the pulse laser beam B. Furthermore, when a motorized variable beam diameter lens is mounted, the built-in lens can be moved by motoring, so that it can be aligned with the first mirror so that it has the same spot size as when reflected by the first mirror 13A. The light path during reflection by the second mirror 13B and the angle of the second mirror 13B are used to adjust the spot size. The operations described here can also be performed on the upper mold 251.

As described above, the forming mold cleaning device 10B, similar to the forming mold cleaning device 10A, can also irradiate the pulse laser beam B on the XZ plane and the side surfaces substantially parallel to the XZ plane in the lower mold 252 and the upper mold 251. The lower mold 252 and the upper mold 251 are cleaned more reliably.

FIG. 20 shows the structure of a resin molding unit 30 including a plurality of sets of resin molding parts 20 and a set of mold cleaning devices 10. The resin molding unit 30 has a material receiving unit 31, a plurality of molding units 32, a discharge unit 33, and a molding die cleaning device standby unit 34. The material receiving unit 31 is a device for receiving the plate-shaped resin material P and the lead frame L from the outside and sending it out to the molding unit 32, and has a lead frame receiving part 311 and a resin sheet supply part 312. One molding unit 32 has one resin molding part 20 in the resin molding apparatus 1 of the embodiment. In FIG. 20, three molding units 32 are shown, but any number of molding units 32 can be installed in the resin molding unit 30. In addition, even after the resin molding unit 30 is assembled and used, the molding unit 32 can be increased or decreased. The ejection unit 33 carries in the resin molded product manufactured by the molding unit 32 from the molding unit 32 and holds it, and has a resin molded product holding portion 331. The mold cleaning device standby assembly 34 is for storing the mold cleaning device 10 when the mold cleaning device 10 is not used.

The conveying device 35 moves the substrate or resin material from the material receiving unit 31 into the molding unit 32 along the conveying rail provided in the resin molding unit 30, and conveys the molded resin molded product from the molding unit 32 to the discharge unit 33 In the device. In addition, the conveying device 35 also has the following function: when cleaning the forming mold in a certain forming assembly 32, the forming mold cleaning device 10 is carried into the forming assembly 32 (FIG. 21), and in the forming assembly 32 After the cleaning of the mold is completed, the forming mold cleaning device 10 is taken out of the forming assembly 32.

This resin molding unit 30 can simultaneously manufacture resin molded products in a plurality of molding modules 32, and is therefore suitable for mass production of resin molded products. In this case, it takes a certain amount of time from when the substrate is mounted on the mold to when the resin molded product is produced and then transported out. Therefore, the molded object is mounted within the time required to manufacture the resin molded product using a certain molding unit 32 By unloading the resin molded product on another molding unit 32 or from another molding die, the production efficiency of the resin molded product can be improved, and the cost required for the conveying device can be suppressed. Furthermore, the molding die cleaning device 10 may be shared among a plurality of molding units 32.

In the resin molding unit 30, the molding die cleaning device standby module 34 arranged side by side with other components in the same row may be used. However, the resin molding unit 30A shown in FIG. The mold cleaning device accommodating/moving unit 34A with the extended row of the column replaces the mold cleaning device standby unit 34. The structure of the material receiving unit 31, the molding unit 32, and the discharge unit 33 in the resin molding unit 30A is the same as that of the resin molding unit 30. The molding die cleaning device accommodation/moving unit 34A accommodates the molding die cleaning device 10, and has a molding die cleaning device moving part 35A inside which moves the molding die cleaning device 10 in the direction of the row in which other components are arranged. From the perspective of the resin molding part 20 of each molding unit 32, the molding die cleaning device housing and moving unit 34A and the molding die cleaning device moving unit 35A inside are provided on the opposite side of the conveying device 35. The operation of the resin molding unit 30A is the same as that of the resin molding unit 30 except that the molding die cleaning device moving part 35A is used when carrying the molding die cleaning device 10 into and out of the molding assembly 32.

The present invention is not limited to the above-mentioned embodiments, and various further modifications can be made within the scope of the gist of the present invention.

For example, in the described embodiment, the energy density of the laser light used for each pulse is in the range of 0.04 J/cm2 to 0.7 J/cm2, and the power density of the scanning laser light per second is in the range of 2 W/cm2 to 15 W/cm2. In the range of cm2, the pulse width is in the range of 1 nsec to 200 nsec, and the pulse repetition frequency is in the range of 300 kHz to 10 MHz. However, these values are not limited to the range. In addition, a beam of laser light that oscillates continuously may be used instead of a pulsed laser beam. Furthermore, in the above-mentioned embodiment, a (pulsed) laser beam that is shaped so that the shape in a cross section perpendicular to the beam becomes square and has a top hat-shaped irradiation intensity distribution is used, but it can also be used in the cross section. Laser beams with other shapes such as circles, rings (circular, concave), or laser beams with other irradiated intensity distributions such as Gaussian. In Figs. 23(a) and 23(b), the spot of the laser beam with a circular cross-section and the movement of the spot are shown, and in Figs. 23(c) and 23(d), The spot of the laser beam with a circular cross section and the movement of the spot.

In the above-mentioned embodiment, the pulsed laser beam is moved so that the overlap ratio becomes 85% or more. However, the moving speed of the pulsed laser beam is not limited to this. In the case of using a continuously oscillating laser beam , As long as the moving speed is set appropriately. In addition, in the above-mentioned embodiment, the (pulsed) laser beam is moved so that the spot moves in a zigzag pattern on the surface of the upper mold 251 or the lower mold 252, but the movement path of the spot is not limited to this. . For example, you can repeat the following actions: after performing a one-way movement in the X direction, stop the laser beam, and then move only a single range of the spot in the Y direction while returning to the original position in the X direction, and then in the X direction Make a one-way move on.

In the embodiment, the galvanometer scanning head 121 is used to move the pulsed laser beam B back and forth in the X direction and in the Z direction (the light spot is moved in the Y direction on the surface of the upper mold 251 or the lower mold 252) However, as an alternative, only the X-direction reciprocating movement can be performed by the galvanometer scanning head 121, and the mirror 13 can be moved in the Y-direction, so that the light spot on the surface of the upper mold 251 or the lower mold 252 can be in Y Move in direction.

1‧‧‧Resin molding device 10, 10A, 10B‧‧‧forming mold cleaning device 11‧‧‧Laser light source 112‧‧‧Base 12‧‧‧Laser beam moving part 121‧‧‧ Galvanometer Scan Head 122‧‧‧Lens 13, 13W‧‧‧Mirror 13A、13X‧‧‧First reflector 13B, 13Y‧‧‧Second mirror 131L‧‧‧First holding tool 131R‧‧‧Second holding tool 132L‧‧‧The first rotating shaft 132R‧‧‧Second rotating shaft 1321L, 1321R‧‧‧slot 133L‧‧‧Bearing 133R‧‧‧Rotating shaft movable holding tool 134L‧‧‧Bearing retaining part 134R‧‧‧Outside holding tool 135L‧‧‧First fixing tool 135R‧‧‧Second fixing tool 136‧‧‧Motor 137L‧‧‧Bearing fixing tool 138‧‧‧Axis 139‧‧‧Sliding bearing 14‧‧‧XY platform 141‧‧‧Connecting rod 142‧‧‧Guide rod 15‧‧‧XY platform driver 16, 16A‧‧‧Mirror switching part 161‧‧‧Optical Path Switching Mirror 162‧‧‧Optical path switching mirror moving part 17‧‧‧Shield 18‧‧‧X direction moving mechanism 181‧‧‧X direction guide 182‧‧‧X direction conveyor belt 183‧‧‧Conveyor belt installation components 184‧‧‧X direction motor 185‧‧‧X direction pulley 186‧‧‧Motor block 187‧‧‧Pulley block 188‧‧‧Y direction guide 20‧‧‧Resin molding department 211‧‧‧Base 212‧‧‧Tie Rod 213‧‧‧Crank connecting rod 221‧‧‧movable platen 222‧‧‧Fixed platen 25‧‧‧Forming die 251‧‧‧Upper die 2511‧‧‧Remove block 2513、2523‧‧‧Runner 252‧‧‧Die 2521‧‧‧Barrel 2522‧‧‧Plunger 253‧‧‧heating plate 2531‧‧‧Heater 30, 30A‧‧‧Resin molding unit 31‧‧‧Material receiving assembly 311‧‧‧Lead frame receiving part 312‧‧‧Resin sheet supply department 32‧‧‧Forming components 33‧‧‧Discharge assembly 331‧‧‧Resin molded product holding part 34‧‧‧Forming die cleaning device standby component 34A‧‧‧Forming mold cleaning device containing and moving assembly 35‧‧‧Conveying device 35A‧‧‧Moving part of mold cleaning device A‧‧‧Attachment AG‧‧‧ Vaporized attachments B‧‧‧Pulse laser beam BS‧‧‧Spot of pulsed laser beam C‧‧‧Mold cavity CT‧‧‧Coating L‧‧‧Lead frame P‧‧‧Resin material PL‧‧‧plasma X, Y, Z‧‧‧direction

Figure 1 (a), Figure 1 (b), Figure 1 (c), Figure 1 (d) and Figure 1 (e) are the molds that have not been resin molded after cleaning, and 200 times after cleaning. , 400 times, 600 times, and 800 times of resin molding after taking the surface electron micrographs of the molding die. 2 is a schematic configuration diagram showing an embodiment of the molding die cleaning device of the present invention and a resin molding device having the same. Fig. 3 is an enlarged view of a molding die and its vicinity in the resin molding apparatus of the present embodiment. 4(a) and 4(b) are respectively a plan view and a side view showing how the laser beam is moved by the laser beam moving part. FIG. 5 is a perspective and partial cross-sectional view of the reflecting mirror and its accessory parts in the molding die cleaning device of this embodiment. Figure 6 (a) is a partial cross-sectional enlarged view of the appendage of the mirror, and is a diagram showing the vicinity of the rotating shaft on one side, and Figure 6 (b) is a diagram showing the vicinity of the rotating shaft on the other side, and a diagram 6(c) is a diagram showing a state where the rotation shaft on the other side has moved to the opposite side of the mirror compared to the case of FIG. 6(b). Fig. 7(a) is a diagram showing a state in which a pair of holding tools for holding the mirror have been connected by a shaft, and Fig. 7(b) is a diagram showing the situation of the holding tool on one side and Fig. 7(a) It is a diagram showing a state that has moved to the opposite side of the mirror. FIGS. 8(a) and 8(b) are schematic diagrams showing a state in which the mold cleaning device of the present embodiment is located at the use position and the standby position, respectively. FIG. 9 is a diagram showing a structure in which a laser light source and a laser beam moving part and a reflecting mirror are connected by a connecting rod extending in the Y direction. 10 is a diagram showing an example of using a mirror whose width in the X direction is larger than the irradiation range of the laser beam in the X direction. Fig. 11(a) is the operation during resin molding in the resin molding apparatus of this embodiment, and is a diagram showing a state where the lead frame is placed on the lower mold and the resin material has been supplied to the barrel of the lower mold, and Fig. 11(b) is a diagram showing a state where the molding die is closed and the resin material has been supplied into the cavity. FIG. 12 is a diagram showing a state where the spot of the pulse laser beam moves in a zigzag shape. Fig. 13 is a diagram showing the trajectory of the laser beam on the surface of the lower mold or the upper mold (thin solid line) and the boundary (thick broken line) of the area where the laser beam is irradiated by the zigzag movement of the laser beam once . Fig. 14(a) is a schematic diagram showing a state in which plasma is generated near the surface of the forming mold by irradiating a pulsed laser beam to the forming mold, and Fig. 14(b) is a state in which plasma is repeatedly irradiated with a pulsed laser beam A schematic diagram of the state where the plasma is heated and the deposits are vaporized. 15(a) and 15(b) are respectively a plan view and a vertical sectional view showing an example in which the shielding portion is used. Figure 16(a) shows another example of the trajectory of the laser beam on the surface of the lower mold or the upper mold, which is an example of repeated one-way movement in the irradiation area, and Fig. 16(b) is in the lower mold or the upper mold A diagram showing an example of zigzag movement on the entire surface. FIG. 17 is a schematic diagram showing an example of an X-direction moving mechanism that moves a mirror in the X direction. Fig. 18 is a plan view showing another embodiment of the mold cleaning device of the present invention. 19 (a-1) and FIG. 19 (a-2) are diagrams showing still another embodiment of the molding die cleaning device of the present invention, and are a plan view and a side view showing a state in which the first mirror is used, and Fig. 19(b) is a plan view showing a state where the second mirror is used. FIG. 20 is a schematic configuration diagram showing an example of a resin molding unit including a plurality of components such as molding components. Fig. 21 is a schematic configuration diagram showing a state in which the mold cleaning device has been carried into one molding assembly in the resin molding unit. Fig. 22 is a schematic configuration diagram showing another example of a resin molding unit including a plurality of components. Figures 23(a) and 23(b) respectively show the spot of a laser beam with a circular cross-section and the movement of the spot, and Figure 23(c) and Figure 23(d) respectively show the cross-section of a circular ring The spot of the laser beam and the movement of the spot.

1‧‧‧Resin molding device

10‧‧‧Forming die cleaning device

11‧‧‧Laser light source

12‧‧‧Laser beam moving part

13‧‧‧Mirror

136‧‧‧Motor

14‧‧‧XY platform

15‧‧‧XY platform driver

20‧‧‧Resin molding department

211‧‧‧Base

212‧‧‧Tie Rod

213‧‧‧Crank connecting rod

221‧‧‧movable platen

222‧‧‧Fixed platen

25‧‧‧Forming die

251‧‧‧Upper die

252‧‧‧Die

253‧‧‧heating plate

2531‧‧‧Heater

B‧‧‧Pulse laser beam

X, Y, Z‧‧‧direction

Claims (11)

A forming mold cleaning device is a device for removing attachments attached to the surface of at least any one of an upper mold constituting a forming mold and a lower mold facing the upper mold, and is characterized in that it comprises: a laser light source, It is arranged outside the space between the upper mold and the lower mold to emit a laser beam; the laser beam reflecting mechanism has a reflecting mirror and a reflecting mirror moving mechanism. The reflecting mirror moving mechanism makes the reflecting mirror in the Moving between a first position in the space and a second position outside the space, and the laser beam reflecting mechanism uses the reflector reflected by the reflecting mirror when the reflecting mirror is in the first position The way the laser beam is irradiated on the surface of the upper mold or the lower mold sets the direction of the reflector; and the laser beam moving mechanism is arranged outside the space to make the laser beam relative to The mirror moves when located at the first position, and the laser beam moving mechanism is a galvanometer scanning head; the mirror includes a first mirror and a second mirror with different directions, so The laser beam reflection mechanism further includes a mirror switching mechanism for switching the mirror irradiated with the laser beam, the first mirror and the second mirror irradiate the laser beam to The upper surface of the cavity of the lower mold, the lower surface of the cavity of the upper mold, the side surface of the cavity of the lower mold, and the side surface of the cavity of the upper mold. The forming mold cleaning device described in the first item of the patent application is characterized in that the laser beam reflection mechanism further has a reflection direction changing mechanism that changes the direction of the reflecting mirror. The forming mold cleaning device according to item 1 of the scope of patent application is characterized in that it further comprises: a pair of first rotating shaft bodies and second rotating shaft bodies connected to both sides of the reflecting mirror; and a rotating shaft The body holding tool movably holds at least one of the first rotating shaft body and the second rotating shaft body in the axial direction. The forming mold cleaning device described in the first item of the scope of the patent application is a device that removes the attachments attached to the forming mold coated with at least a part of the surface, and is characterized in that the laser light source and The laser beam moving mechanism irradiates the laser beam to the forming mold with an irradiation intensity that can heat the plasma to a temperature after generating plasma on the attachment The irradiation intensity at a temperature equal to or higher than the temperature at which the attached matter vaporizes is lower than the irradiation intensity at which the coating is damaged. The forming mold cleaning device according to the first item of the scope of patent application, wherein the laser beam moving mechanism is a mechanism that makes the laser beam move back and forth in a first direction relative to the forming mold , And whenever the laser beam is moved in the first direction in a single way, in a second direction perpendicular to the first direction, the laser beam is moved only to irradiate the laser beam to The single range of the light spot on the forming mold; and between the laser beam moving mechanism and the forming mold, it also includes a single spot that shields the light spots at both ends of the reciprocating movement in the first direction Shading part of the range. A method for cleaning a forming mold is a method of removing adherents on the surface of at least any one of an upper mold constituting a forming mold and a lower mold facing the upper mold, characterized in that the upper mold A mirror is arranged in the space between the lower mold and the laser beam is emitted from a laser light source arranged outside the space, and the laser beam is moved by a laser beam moving mechanism arranged outside the space. The laser beam moves relative to the reflector while irradiating the laser beam onto the reflector. The laser beam moving mechanism is a galvanometer scanning head, and the reflector includes a second mirror with different directions. A reflector and a second reflector, and switch the reflector irradiated with the laser beam, the first reflector and the second reflector irradiate the laser beam to the laser beam by changing the angle The upper surface of the cavity of the lower mold, the lower surface of the cavity of the upper mold, the side of the cavity of the lower mold, and the side of the cavity of the upper mold. The forming mold cleaning method as described in item 6 of the scope of patent application is characterized in that: Change the direction of the mirror. The cleaning method of the forming mold as described in item 6 of the scope of patent application, characterized in that a pair of first and second rotating shafts connected to both sides of the reflector are used, and in the axial direction A rotating shaft holding tool for movably holding at least one of the first rotating shaft and the second rotating shaft. The cleaning method for forming molds as described in item 6 of the scope of the patent application is a method of removing adherents attached to the forming mold on which at least a part of the surface is coated, and is characterized in that the irradiation intensity is as follows The laser beam is irradiated to the forming mold, and the irradiation intensity is such that after plasma is generated on the attachment, the plasma can be heated to a temperature higher than the temperature at which the attachment is vaporized The irradiation intensity is lower than the irradiation intensity that damages the coating. A resin molding device, characterized by comprising: a molding die, and the molding die cleaning device according to any one of items 1 to 5 in the scope of the patent application. A method for manufacturing a resin molded product, which is characterized in that the molding die is used to manufacture a resin molded product after the molding die cleaning method described in any one of the 6th to 9th patent applications is implemented.

Images