TWI799573B - 包含具有三曲聯體柱的構件之電子產品及對應的製造方法 - Google Patents
包含具有三曲聯體柱的構件之電子產品及對應的製造方法 Download PDFInfo
- Publication number
- TWI799573B TWI799573B TW108114489A TW108114489A TWI799573B TW I799573 B TWI799573 B TW I799573B TW 108114489 A TW108114489 A TW 108114489A TW 108114489 A TW108114489 A TW 108114489A TW I799573 B TWI799573 B TW I799573B
- Authority
- TW
- Taiwan
- Prior art keywords
- triskelion
- pillars
- component
- electronic product
- fabrication method
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/041—Manufacture or treatment of capacitors having no potential barriers
- H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/66—Conductor-insulator-semiconductor capacitors, e.g. MOS capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/714—Electrodes having non-planar surfaces, e.g. formed by texturisation having horizontal extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/045—Manufacture or treatment of capacitors having potential barriers, e.g. varactors
- H10D1/047—Manufacture or treatment of capacitors having potential barriers, e.g. varactors of conductor-insulator-semiconductor capacitors, e.g. trench capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18305520.1A EP3561859B1 (en) | 2018-04-26 | 2018-04-26 | Electronic product comprising a component having triskelion-pillars, and corresponding fabrication method |
| EP18305520.1 | 2018-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201946248A TW201946248A (zh) | 2019-12-01 |
| TWI799573B true TWI799573B (zh) | 2023-04-21 |
Family
ID=62165505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108114489A TWI799573B (zh) | 2018-04-26 | 2019-04-25 | 包含具有三曲聯體柱的構件之電子產品及對應的製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11309382B2 (zh) |
| EP (1) | EP3561859B1 (zh) |
| TW (1) | TWI799573B (zh) |
| WO (1) | WO2019207354A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11784216B2 (en) * | 2020-09-10 | 2023-10-10 | Changxin Memory Technologies, Inc. | Manufacturing method of capacitive structure, and capacitor |
| KR102695083B1 (ko) * | 2021-07-16 | 2024-08-16 | 에스케이키파운드리 주식회사 | 반도체 소자의 mim 커패시터 및 그 제조 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060202250A1 (en) * | 2005-03-10 | 2006-09-14 | Thomas Hecht | Storage capacitor, array of storage capacitors and memory cell array |
| US20100230787A1 (en) * | 2006-05-02 | 2010-09-16 | Nxp B.V. | Electric device comprising an improved electrode |
| US20110180931A1 (en) * | 2008-09-30 | 2011-07-28 | Nxp B.V. | Robust high aspect ratio semiconductor device |
| US20130084495A1 (en) * | 2011-09-30 | 2013-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393924B2 (en) * | 2004-01-06 | 2008-07-01 | Franco Vitaliano | Smart bio-nanoparticle elements |
| EP2395523A4 (en) * | 2009-02-05 | 2017-06-21 | Nichicon Corporation | Metalized film capacitor |
| US8395880B2 (en) * | 2010-03-30 | 2013-03-12 | Medtronic, Inc. | High density capacitor array patterns |
| CN103164093A (zh) * | 2011-12-19 | 2013-06-19 | 禾瑞亚科技股份有限公司 | 一种电容式触摸屏 |
| EP3297024A1 (en) * | 2016-09-20 | 2018-03-21 | Ipdia | 3d-capacitor structure |
-
2018
- 2018-04-26 EP EP18305520.1A patent/EP3561859B1/en active Active
-
2019
- 2019-04-25 TW TW108114489A patent/TWI799573B/zh active
- 2019-04-26 WO PCT/IB2019/000294 patent/WO2019207354A1/en not_active Ceased
-
2020
- 2020-10-16 US US17/072,410 patent/US11309382B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060202250A1 (en) * | 2005-03-10 | 2006-09-14 | Thomas Hecht | Storage capacitor, array of storage capacitors and memory cell array |
| US20100230787A1 (en) * | 2006-05-02 | 2010-09-16 | Nxp B.V. | Electric device comprising an improved electrode |
| US20110180931A1 (en) * | 2008-09-30 | 2011-07-28 | Nxp B.V. | Robust high aspect ratio semiconductor device |
| US20130084495A1 (en) * | 2011-09-30 | 2013-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3561859A1 (en) | 2019-10-30 |
| WO2019207354A1 (en) | 2019-10-31 |
| TW201946248A (zh) | 2019-12-01 |
| EP3561859B1 (en) | 2020-11-25 |
| US20210036099A1 (en) | 2021-02-04 |
| US11309382B2 (en) | 2022-04-19 |
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