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TWI794397B - 積層片及使用其而成形之電子零件包裝容器 - Google Patents

積層片及使用其而成形之電子零件包裝容器 Download PDF

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Publication number
TWI794397B
TWI794397B TW108102669A TW108102669A TWI794397B TW I794397 B TWI794397 B TW I794397B TW 108102669 A TW108102669 A TW 108102669A TW 108102669 A TW108102669 A TW 108102669A TW I794397 B TWI794397 B TW I794397B
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TW
Taiwan
Prior art keywords
component
laminated sheet
mass
conjugated diene
vinyl aromatic
Prior art date
Application number
TW108102669A
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English (en)
Other versions
TW201940341A (zh
Inventor
谷中亮輔
升田優亮
Original Assignee
日商電化股份有限公司
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Publication of TW201940341A publication Critical patent/TW201940341A/zh
Application granted granted Critical
Publication of TWI794397B publication Critical patent/TWI794397B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
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    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
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    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
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Abstract

提供成形性佳、與蓋材(特別是黏著蓋帶)的密封性優異的積層片；及使用其而成形之電子零件包裝容器。
一種積層片，其係在基材層的兩面具有表面層的積層片，其中，前述表面層包含下述(A)成分，前述基材層含有相對於前述基材層的總質量而言為30~70質量%的下述(B)成分、70~30質量%的下述(C)成分、及0~30質量%的前述積層片的再生材。
(A)成分：共軛二烯橡膠成分的含量為5~15質量%的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物。
(B)成分：含有15~30質量%源自共軛二烯的單體單元的乙烯基芳烴-共軛二烯嵌段共聚物。
(C)成分：從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物。

Description

積層片及使用其而成形之電子零件包裝容器
本發明係關於積層片及使用其而成形之電子零件包裝容器，特別是載帶(carrier tape)、托盤(tray)。
供將IC、LSI等電子零件封裝在電子機器用的載帶，係使用：將由氯乙烯樹脂、乙烯基芳烴系樹脂、聚碳酸酯系樹脂、聚對苯二甲酸乙二酯系樹脂等熱塑性樹脂所構成的片予以熱成形成壓紋形狀者。這些載帶，基於對收納於壓紋部(也稱為袋(pocket))的電子零件採取防止靜電障礙的對策之目的，係使用例如：使熱塑性樹脂含有碳黑等導電性填料以使其導電化而成的不透明片。另一方面，將電子零件當中例如電容器般之因靜電障礙而遭破壞的可能性小者加以收納的載帶，從有利於由外面目視內容物的電子零件、偵測記載於前述電子零件的文字之觀點來看，係使用：以前述的樹脂當中透明性較佳的熱塑性樹脂為基材的透明型的載帶。
作為透明型的載帶用的片，有人提出了例如：混合有乙烯基芳烴聚合物和乙烯基芳烴-共軛二烯嵌段共聚物的片(參照專利文獻1及2)、使用有橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物的片(專利文獻3)等。
因為使用這些片的載帶具有透明性，因此能夠由外面目視收納的電子零件、能夠偵測記載於前述電子零件的文字等，故而近年來其用途逐漸擴大。
然而，在混合有乙烯基芳烴聚合物和乙烯基芳烴-共軛二烯嵌段共聚物的片方面，載帶的與為蓋材的丙烯酸系黏著蓋帶(cover tape)的密封性不佳，有產生密封後的剝離強度差大這樣的問題的情形。此外，在使用有橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物的片方面，在熱成形為載帶等之際，若欲成形拉伸比較大的袋，則袋的總厚度明顯變薄，難以得到足夠強度的袋。因此，要求如下的片：即使成形拉伸比較大的袋，袋的總厚度也不會明顯變薄，而且成形性佳。
[先前技術文獻] [專利文獻]
專利文獻1：日本特開2003-055526號公報
專利文獻2：日本特開2002-332392號公報
專利文獻3：日本特開2003-253069號公報
本發明的課題在於提供一種積層片、及使用其而成形之電子零件包裝容器，該積層片係用於電子零件包裝容器，特別是載帶、托盤的積層片，其成形性佳，與蓋材(特別是黏著蓋帶)的密封性優異。
本發明人等，針對這些課題銳意檢討，結果發現藉由作成在如下的基材層的兩面具有如下的表面層的積層片，可得到解決全部前述課題的積層片，進而完成本發明，該基材層係以特定的比例包含：源自共軛二烯的單體單元的含量於特定範圍的乙烯基芳烴-共軛二烯嵌段共聚物、和從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物，該表面層係由共軛二烯橡膠成分的含量於特定範圍的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物形成。
即，本發明係一種積層片，其係在基材層的兩面具有表面層的積層片，其中，前述表面層包含下述(A)成分，前述基材層含有相對於前述基材層的總質量而言為30~70質量%的下述(B)成分、70~30質量%的下述(C)成分、及0~30質量%的前述積層片的再生材。
(A)成分：共軛二烯橡膠成分的含量為5~15質量%的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物。
(B)成分：含有15~30質量%源自共軛二烯的單體單元的乙烯基芳烴-共軛二烯嵌段共聚物。
(C)成分：從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物。
上述(A)成分的重量平均分子量(Mw)較佳為110,000~170,000，上述(B)成分的重量平均分子量(Mw)較佳為80,000~220,000，及上述(C)成分的重量平均分子量(Mw)較佳為150,000~400,000。
本發明的積層片，用準據JIS-K-7127的評價 方法測定的拉伸彈性模數較佳為1000~2500MPa，用準據JIS-P-8115的評價方法測定的耐折強度較佳為30次以上。
另外，本發明的積層片，用準據JIS-K-7105的評價方法測定的總光線透射率較佳為80~100%，表面層和基材層的折射率差較佳為0~0.05。
此外，本發明包括使用本發明積層片的電子零件包裝容器，特別是載帶、電子零件搬送用托盤，再者，也包括使用這些電子零件包裝容器的電子零件包裝體。
根據本發明，能夠提供成形性佳、與蓋材(特別是黏著蓋帶)的密封性優異的積層片；及使用其的電子零件包裝容器，特別是載帶、托盤。
[實施發明之形態]
以下，針對本發明詳細地說明。
本發明的積層片的表面層中所含的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物((A)成分)，係在橡膠成分的存在下將(甲基)丙烯酸酯系單體和乙烯基芳烴系單體進行共聚合而得到，且(甲基)丙烯酸酯系單體和乙烯基芳烴系單體所接枝聚合的橡膠成分島狀地分散在包含(甲基)丙烯酸酯系單體和乙烯基芳烴系單體的共聚物 的樹脂相中。作為橡膠成分，例如，可使用以1,3-丁二烯(丁二烯)、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、1,3-己二烯、2-甲基戊二烯等為單體的共軛二烯系橡膠，其中適合為丁二烯、異戊二烯。這些共軛二烯系單體能夠使用一種或二種以上。(甲基)丙烯酸酯系單體係丙烯酸酯、甲基丙烯酸酯的衍生物，例如，可舉出：甲基丙烯酸甲酯、甲基丙烯酸乙酯、丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸2-甲基己酯、丙烯酸2-乙基己酯等。(甲基)丙烯酸酯單體可以是單獨的，也可以併用2種以上。此外，乙烯基芳烴系單體係指苯乙烯、或者是其衍生物。作為衍生物，例如，能舉出：α-甲基苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、對三級丁基苯乙烯等。較佳為苯乙烯。乙烯基芳烴系單體可以是單獨的，也可以併用2種以上。橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物能夠藉由乳化聚合、溶液聚合等以往習知的聚合方法製造。
表面層中所含的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物，從本發明的積層片的強度、成形性、透明性等均衡的觀點來看，共軛二烯橡膠成分的含量係相對於橡膠改性(甲基)丙烯酸酯-乙烯基芳烴.共聚物的總質量而言為5~15質量%，較佳為7~13質量%。橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物中的共軛二烯橡膠成分的含量能夠在橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物的製造階段藉由以往習知的方法進行調整。此外，也能夠直接使用含有上述範圍的共軛二烯橡膠成分 的市售橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物。在本發明中，能夠使用一種或者是二種以上含有上述範圍的共軛二烯橡膠成分的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物。
在本發明的一個態樣中，表面層較佳為僅以(A)成分構成。此外，設置在基材層的兩面的表面層較佳為皆僅以(A)成分構成。
本發明的積層片，由於具備有這樣的表面層，因此例如作為載帶來使用時，不僅對於為蓋材的熱封蓋帶的剝離強度的變異(剝離強度的最大值與最小值的差)能夠變小，對於黏著蓋帶的剝離強度的變異也能夠變小，可得到穩定的密封性。
本發明的積層片的基材層中所含的乙烯基芳烴-共軛二烯嵌段共聚物((B)成分)係指在其構造中含有以乙烯基芳烴系單體為主體的嵌段、和以共軛二烯系單體為主體的嵌段的聚合物。作為乙烯基芳烴系單體，例如有：苯乙烯、鄰甲基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯基萘、乙烯基蒽、1,1-二苯基乙烯等，其中適合為苯乙烯。能夠使用一種或者是二種以上乙烯基芳烴系單體。作為共軛二烯系單體，例如有：1,3-丁二烯(丁二烯)、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、1,3-己二烯、2-甲基戊二烯等，其中適合為丁二烯、異戊二烯。能夠使用一種或者是二種以上共軛二烯系單體。以乙烯基芳烴系單體為主體的嵌段意指如下的任一 者皆可：僅包含源自乙烯基芳烴系單體的構造的嵌段、含有50質量%以上的源自乙烯基芳烴系單體的構造的嵌段。以共軛二烯系單體為主體的嵌段意指如下的任一者皆可：僅包含源自共軛二烯系單體的構造的嵌段、含有50質量%以上的源自共軛二烯系單體的構造的嵌段。乙烯基芳烴-共軛二烯嵌段共聚物能夠藉由乳化聚合、溶液聚合等以往習知的聚合方法製造。
基材層中所含的乙烯基芳烴-共軛二烯嵌段共聚物，從本發明的積層片的強度、成形性等均衡的觀點來看，源自共軛二烯的單體單元的含量係相對於乙烯基芳烴-共軛二烯嵌段共聚物的總質量而言為15~30質量%，較佳為20~25質量%。乙烯基芳烴-共軛二烯嵌段共聚物中的源自共軛二烯的單體單元的含量能夠在乙烯基芳烴-共軛二烯嵌段共聚物的製造階段藉由以往習知的方法進行調整。此外，也能夠直接使用含有上述範圍的源自共軛二烯的單體單元的市售乙烯基芳烴-共軛二烯嵌段共聚物。在本發明中，能夠使用一種或者是二種以上含有上述範圍的源自共軛二烯的單體單元的乙烯基芳烴-共軛二烯嵌段共聚物。
作為本發明的積層片的基材層中所含的(C)成分中的乙烯基芳烴聚合物，最常見的是屬苯乙烯均聚物的所謂的泛用聚苯乙烯(GPPS)，也可以是含有鄰甲基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯基萘、乙烯基蒽、1,1-二苯基乙烯等芳香族乙烯基單體中的一種以上作為微量 成分者。
作為(C)成分中的橡膠改性乙烯基芳烴聚合物，最常見的是在橡膠成分的存在下將苯乙烯單體進行聚合而得到，且苯乙烯單體所接枝聚合的橡膠成分島狀地分散在包含聚苯乙烯的樹脂相中的所謂的耐衝擊性聚苯乙烯(HIPS)，也可以是含有鄰甲基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯基萘、乙烯基蒽、1,1-二苯基乙烯等芳香族乙烯基單體中的一種以上作為微量成分者。作為橡膠成分，例如，可使用以1,3-丁二烯(丁二烯)、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、1,3-己二烯、2-甲基戊二烯等為單體的共軛二烯系橡膠，其中適合為丁二烯、異戊二烯。能夠使用一種或者是二種以上這些共軛二烯系單體。乙烯基芳烴聚合物和橡膠改性乙烯基芳烴聚合物能夠混合使用。
在本發明的一個態樣中，基材層中所含的(C)成分較佳為至少包含乙烯基芳烴聚合物，較佳為包含乙烯基芳烴聚合物和橡膠改性乙烯基芳烴聚合物兩者。在包含乙烯基芳烴聚合物和橡膠改性乙烯基芳烴聚合物兩者的情況下，相對於(C)成分總質量的乙烯基芳烴聚合物含量較佳為60~80質量%。
在基材層中，含有相對於基材層的總質量而言為30~70質量%(較佳為35~60質量%)的前述乙烯基芳烴-共軛二烯嵌段共聚物((B)成分)。若比此範圍低，則本發明的積層片的耐折強度降低，若比此範圍高，則拉 伸彈性模數降低。此外，在基材層中，含有相對於基材層的總質量而言為70~30質量%(較佳為60~35質量%)的從包含前述的乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物((C)成分)。若比此範圍低，則本發明的積層片的拉伸彈性模數降低，若比此範圍高，則耐折強度降低。
另外，在基材層中，能夠含有相對於基材層的總質量而言為0~30質量%的再生材。再生材係指將如下的部分加以粉碎並進行再粒料化者：在藉由擠出成形來製造積層片之際因修剪從模所擠出的片的兩端部所產生的稱為「耳」的部分、和在將片進行捲取之際的開始部分等，無法直接成為製品的部分。再生材一般是添加於基材層原料以進行再利用。即使像這樣添加再生材，該積層片的特性仍為良好，在積層片的生產性這點上是極為重要的。若本發明的積層片的基材層中含有的再生材超過30質量%，則透明性降低。
在本發明的一個態樣中，作為前述再生材，能夠使用源自本發明的積層片者。即，本發明的基材層可以含有將本發明的具有基材層和表面層的積層片粉碎並進行粒料化所得到的再生原料。
本發明的積層片的表面層中所含的(A)成分：橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物；基材層中所含的(B)成分：乙烯基芳烴-共軛二烯嵌段共聚物；及(C)成分：從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物的重 量平均分子量(Mw)較佳為在下述的範圍。
(A)成分：Mw=110,000~170,000
(B)成分：Mw=80,000~220,000
(C)成分：Mw=150,000~400,000
藉由使用分別為此範圍的重量平均分子量(Mw)的樹脂，容易得到透明性、成形性、耐折性優異的積層片。
又，各成分的重量平均分子量(Mw)係指使用GPC(凝膠滲透層析)，以標準聚苯乙烯換算求出的值。
積層片的片流動方向的拉伸彈性模數較佳為在1000~2500MPa的範圍。此處，流動方向意指製作積層片之際的積層片的生產方向(MD方向)。若拉伸彈性模數比此範圍低，則成形為載帶時的袋所需的剛性變得容易降低，很難得到良好的成形品。若拉伸彈性模數比此範圍高，則積層片變脆而耐折強度容易降低。
積層片的耐折強度較佳為30次以上。若耐折強度小於30次，則積層片變得容易破裂。
積層片的總光線透射率較佳為在80~100%的範圍。若總光線透射率小於80%，則積層片的透明性變得容易惡化，在用作載帶的情況下，有收納於袋的零件的可視性變差的情形。為了得到具有良好的透明性的積層片，表面層和基材層的折射率差較佳為0~0.05。
又，前述折射率差係指用準據JIS-K-7142的評價方法測定所得到的各層的折射率的差。
在本發明的一個態樣中，用準據JIS-K-7105的評價方法測定的積層片的霧度較佳為小於50。
製造本發明的積層片的方法沒有特別的限定，能夠用一般的方法製造。例如，適合藉由使用具有多歧管(multi-rmanifold)的多層T字模的擠出成形、使用分流器(feed block)的T字模法擠出成形，來加以製造。
本發明的積層片的總厚度、表面層的厚度沒有特別的限定，總厚度一般是100~700μm，表面層的厚度較佳為在總厚度的3~20%的範圍。
藉由利用真空成形、空壓成形、加壓成形等公知的片的成形方法(熱成形)，能夠由本發明的積層片而得到載帶、托盤等形狀自由的電子零件包裝容器。對於製造特別是透明性、和耐折強度、及耐衝擊強度均佳的透明型的載帶而言是極為有用的。
電子零件包裝容器係作為電子零件包裝體而收納電子零件，用於電子零件的保管及搬送。例如，載帶，其係在將電子零件收納於用前述的成形方法所形成的袋後，利用蓋帶進行覆蓋並捲取成捲盤(reel)狀而作為載帶體，用於電子零件的保管和搬運。
作為包裝於電子零件包裝體中的電子零件沒有特別的限定，例如有IC、LED(發光二極體)、電阻、液晶、電容器、電晶體、壓電元件電阻器、濾波器、水晶振盪器、水晶振動器、二極體、連接器、開關、電位器、繼電器、感應器等。此外，也可以是使用了這些電子零件的中間製品、最終製品。
本發明的其他態樣如下。
[1]一種積層片，其係由基材層、和設置在前述基材 層的兩面的表面層所構成的積層片，其中，前述表面層係用下述(A)成分構成，前述基材層含有相對於前述基材層的總質量而言為30~70質量%的下述(B)成分、30~70質量%的下述(C)成分、及0~30質量%的前述積層片的再生材，前述基材層中的(B)成分、(C)成分、及再生材的含量的合計不超過100質量%。
(A)成分：共軛二烯橡膠成分的含量為5~15質量%的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物。
(B)成分：含有15~30質量%源自共軛二烯的單體單元的乙烯基芳烴-共軛二烯嵌段共聚物。
(C)成分：從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物。
[2]如[1]的積層片，其中前述(A)成分的共軛二烯橡膠成分係由從包含丁二烯、及異戊二烯的群組所選出的至少一個共軛二烯所得到的橡膠成分。
[3]如[1]或[2]的積層片，其中前述(B)成分的共軛二烯係從包含丁二烯、及異戊二烯的群組所選出的至少一個共軛二烯。
[4]如[1]至[3]中任一項的積層片，其中前述(C)成分至少包含乙烯基芳烴聚合物。
[5]如[1]至[4]中任一項的積層片，其中前述(A)成分的重量平均分子量(Mw)為110,000~170,000，前述(B)成分的重量平均分子量(Mw)為80,000~220,000，前述(C)成分的重量平均分子量(Mw)為150,000~400,000。
[實施例] [原料樹脂]
為了用於實施例及比較例，藉由公知方法調整並準備表1所示的原料樹脂。
Figure 108102669-A0202-12-0013-4
此處，橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物((A)成分)的MBS1~4及橡膠改性乙烯基芳烴聚合物((C)成分)的PS3的共軛二烯橡膠成分的含量、以及乙烯基芳烴-共軛二烯嵌段共聚物((B)成分)的SBC1~6的源自共軛二烯的單體單元的含量，係從利用日本分光(股)公司製的傅立葉轉換紅外分光光度計(FT-IR)得到的各原料樹脂的IR光譜所算出。
此外，各原料樹脂的重量平均分子量(Mw)係藉由使用GPC(凝膠滲透層析)以常用方法求出的標準聚苯乙烯換算的分子量分布曲線所求出。又，在GPC測定之前，使原料樹脂分散於四氫呋喃，在23℃下攪拌24小時後使用注射過濾器(WHATMAN GD/X=過濾器直徑：25mm，薄膜過濾器的材質：PTFE，孔徑：0.45μm)除去不溶成分作成GPC測定用試料。GPC的測定係在以下的條件下進行。
管柱溫度：40℃
檢測方法：示差折射法
移動相：四氫呋喃
樣品濃度：0.2質量%
檢量線：使用標準聚苯乙烯(Polymer Laboratories公司製)來製作
[評價方法]
針對在各實施例、比較例製作的片，藉由以下所示的方法進行評價。
(1)透明性評價
準據JIS-K-7105，使用霧度計，測定霧度及總光線透射率。
(2)拉伸彈性模數評價
準據JIS-K-7127，使用東洋精機製作所(股)製的Strograph VE-1D，以將片的流動方向設為長度方向而進行抽樣的試驗片類型5進行測定。
(3)耐折強度評價
準據JIS-P-8115(2001年)，製作將片的流動方向設為長度方向而進行抽樣的長度150mm、寬度15mm、厚度0.3mm的試驗片，使用東洋精機製作所(股)製的MIT耐折疲勞試驗機進行MIT耐折強度的測定。此時，以彎折角度135度、彎折速度每分鐘175次、測定荷重250g進行試驗。
(4)成形性評價
在加熱器溫度210℃的條件下，利用空壓成形機進行成形而作成寬度24mm的載帶。載帶的袋尺寸係流動方向15mm、寬度方向11mm、深度方向5mm。分別切出此載帶的袋底面、側面，使用Keyence(股)公司製的形狀測定雷射顯微鏡來進行基於厚度測定的成形性評價。將測定的袋底面和側面片的厚度差為±10%以上20%以下者標記為「可」，將小於±10%者標記為「良」，將超過±20%者標記為「不良」。
(5)剝離強度評價
使用Bolian公司製的PT-2012，以密封壓力0.4MPa，將寬度13mm的黏著蓋帶(瑞泰公司製，黏著蓋帶)對寬度24mm的片樣品進行密封。另一方面，使用永田精機(股)製的NK600，以密封時間0.3sec、饋送間距12mm(2次密封)、密封壓力0.5MPa，調整熱烙鐵的溫度使以剝離角度180°進行剝離時的平均剝離強度成為0.4N，來將寬度21.5mm的熱封蓋帶(Denka(股)公司製的ALS-TB100)對寬度24mm的片樣品進行熱封。針對各個 試驗體，使用Vanguard Systems公司製的VG-35剝離試驗機，將蓋帶以剝離角度180°、剝離速度600mm/分鐘剝離100mm的量，算出剝離強度的最大值和最小值的差。
(6)層厚精度
將進行片的製膜時的片的表面層、基材層的目標厚度和實測厚度的差為±10%以上20%以下者標記為「可」，將小於±10%者標記為「良」，將超過±20%者標記為「不良」。厚度係測定片的與流動方向正交的方向(TD方向)的截面的兩端、中央。
(7)折射率
針對在各實施例、比較例中用於表面層及基材層的原料樹脂或原料樹脂的均勻混合物，用準據JIS-K-7142的方法測定折射率，作為表面層及基材層的折射率。此外，將其差作為表面層和基材層的折射率差。
(實施例1~12)
如表2所示設定用於表面層及基材層的原料樹脂及掺合比例，藉由使用表面層用的φ40mm擠出機(L/D=26)、基材層用的φ65mm擠出機(L/D=28)及寬度500mm的T字模的分流器法，得到如下的積層片：厚度比率為表面層/基材層/表面層=7/86/7(表面層的目標厚度：21μm，基材層的目標厚度：258μm)，整體的身厚(總厚度)成為0.3mm。
(比較例1~3、8~12)
如表3所示設定用於表面層及基材層的原料樹脂及 掺合比例，與實施例1同樣地操作而得到積層片。
(比較例4~7)
如表3所示設定原料樹脂及掺合比例，藉由使用φ65mm擠出機(L/D=28)及寬度500mm的T字模的分流器法，得到總厚度成為0.3mm的單層片。又，比較例5因片在製膜中斷裂，因此無法得到片。
將在各實施例、比較例製作的片的評價結果分別整理並顯示於表2、表3。
Figure 108102669-A0202-12-0018-2
Figure 108102669-A0202-12-0019-3
各實施例的積層片係如表2所示，可確認到：具有充分的透明性、強度，且表面層和基材層的厚度精度佳，因此成形性佳，不僅與熱封蓋帶的密封性優異，與黏著蓋帶的密封性也優異，因此適合作為載帶用途。

Claims (10)

  1. 一種積層片，其係在基材層的兩面具有表面層的積層片，其中，該表面層包含下述(A)成分，該基材層含有相對於該基材層的總質量而言為30~70質量%的下述(B)成分、30~70質量%的下述(C)成分、及0~30質量%的該積層片的再生材，(A)成分：共軛二烯橡膠成分的含量為5~15質量%的橡膠改性(甲基)丙烯酸酯-乙烯基芳烴共聚物，(B)成分：含有15~30質量%源自共軛二烯的單體單元的乙烯基芳烴-共軛二烯嵌段共聚物，(C)成分：從包含乙烯基芳烴聚合物、及橡膠改性乙烯基芳烴聚合物的群組所選出的至少一個聚合物。
  2. 如請求項1的積層片，其中(A)成分的重量平均分子量(Mw)為110,000~170,000，(B)成分的重量平均分子量(Mw)為80,000~220,000，(C)成分的重量平均分子量(Mw)為150,000~400,000。
  3. 如請求項1或請求項2的積層片，其中用準據JIS-K-7127的評價方法測定的該積層片的拉伸彈性模數為1000~2500MPa。
  4. 如請求項1或2的積層片，其中用準據JIS-P-8115的評價方法測定的該積層片的耐折強度為30次以上。
  5. 如請求項1或2的積層片，其中用準據JIS-K-7105的評價方法測定的該積層片的總光線透射率為80~100%。
  6. 如請求項1或2的積層片，其中該表面層和該基材層 的折射率差為0~0.05。
  7. 一種電子零件包裝容器，其使用如請求項1至6中任一項的積層片。
  8. 如請求項7的電子零件包裝容器，其為載帶。
  9. 如請求項7的電子零件包裝容器，其為托盤。
  10. 一種電子零件包裝體，其使用如請求項7至9中任一項的電子零件包裝容器。
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