TWI789660B - Fabrication method of flexible electronic package device - Google Patents

Abstract

A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable curving radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable curving radius smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.

Description

Method for manufacturing flexible electronic packaging device

The present invention relates to a manufacturing method of an electronic device, and in particular to a manufacturing method of a flexible electronic packaging device.

With the continuous evolution of electronic technology, the application of electronic devices in daily life is becoming more and more extensive. The technology of flexible packaging is getting more and more attention. However, the use of flexible packaging technology must face the problem that electronic components are easily damaged or fall off, resulting in poor yield and short service life.

The invention provides a method for manufacturing a flexible electronic packaging device, which helps to ensure the normal operation of the flexible electronic packaging device and prolong the service life.

The manufacturing method of the flexible electronic packaging device of the present invention includes the following steps, but is not limited thereto. Obtain the allowable bending radius of the flexible electronic packaging device. Finds the minimum surface radius of curvature for the selected portion of the application carrier. It is determined that the allowable bending radius is less than or equal to the minimum surface curvature radius. The flexible electronic packaging device is disposed on the selected portion.

Another method for manufacturing a flexible electronic packaging device of the present invention includes the following steps, but is not limited thereto. Finds the minimum surface radius of curvature for the selected portion of the application carrier. The flexible electronic packaging device disposed on the selected portion is determined according to the minimum surface curvature radius, wherein the flexible electronic packaging device includes a plurality of components. The method for determining the flexible electronic packaging device includes: setting an initial bending radius, and calculating the bending stress value of each member in the flexible electronic packaging device under the bending radius, wherein the bending radius is smaller than the minimum surface curvature radius; determine the allowable maximum stress value of each of the components; and determine the flexible electronic packaging device if the bending stress value of each of the components is less than the allowable maximum stress value. Next, disposing the flexible electronic packaging device on the selected portion.

Based on the above, the method of the disclosed embodiment considers the curvature radius of the selected part of the application carrier and the allowable bending radius of the flexible electronic packaging device to determine whether the flexible electronic packaging device can be placed on the application carrier, thereby ensuring that the flexible electronic packaging device can be placed on the application carrier. The service life on the application carrier.

FIG. 1 shows a method for manufacturing a flexible electronic packaging device according to an embodiment of the present disclosure. As shown in FIG. 1 , in step S110 , the allowable bending radius (R _tol — _Sip ) of the flexible electronic packaging device is obtained. The flexible electronic packaging device has the property of being flexible, but the flexible electronic packaging device may still be damaged when the stress caused by bending is too large. Therefore, the resistance of flexible electronic packaging devices to bending is a necessary consideration.

In this embodiment, the flexible electronic packaging device is intended to be disposed on an application carrier for use. In other words, the application carrier mentioned herein refers to the object on which the flexible electronic packaging device is intended to be installed. For example, the application carrier may be a wearable article or other three-dimensional objects. In order to determine the normal operation of the flexible electronic packaging device after it is installed on the application carrier, the characteristics of the application carrier can be used as parameters to be considered when manufacturing the flexible electronic packaging device. Therefore, in step S120, the minimum surface curvature radius (R _min _ _C ) of the selected portion of the application carrier is calculated. In some embodiments, when the application carrier itself is a three-dimensional object, step 120 may include scanning the selected part of the application carrier where the flexible electronic packaging device is scheduled to be placed, so as to obtain the surface curvature radii of individual surfaces in the selected part, and from these surface curvatures Select the smallest radius as the minimum surface curvature radius (R _min _ _C ) of the selected part. In some other embodiments, when the application carrier itself is a fabric or a wearable article, the application carrier can be positioned in the worn state first, and then the individual surface of the selected part of the application carrier in the worn state can be scanned to obtain individual Select the smallest surface radius of curvature of the surface as the minimum surface radius of curvature (R _min _ _C ) of the selected part. For example, when the application carrier is clothing covering the torso of the human body, such as T-shirts, shirts, sports leggings, etc., the application carrier can be worn behind the mold of the human body, and then the selected part of the application carrier can be scanned to obtain the selected part. Minimum surface radius of curvature (R _min _ _C ).

Next, step S130 may be performed to determine whether the allowable bending radius (R _tol — _Sip ) of the flexible electronic packaging device is smaller than the minimum surface curvature radius (R _min — _C ) of the selected portion of the application carrier. The allowable bending radius (R _tol _ _Sip ) of the flexible electronic packaging device is smaller than the minimum surface curvature radius (R _min _ _C ) of the selected part of the application carrier, which means that the flexible electronic packaging device is subjected to flexure when it is placed on the surface of the selected part The stress can be less than the tolerance of the flexible electronic packaging device itself. In other words, the flexible electronic packaging device disposed on the selected portion of the application carrier is less likely to be damaged due to uneven surface curvature of the selected portion. Therefore, after step S130 judges that the allowable bending radius (R _tol _ _Sip ) of the flexible electronic packaging device is smaller than the minimum surface curvature radius (R _min _ _C ) of the selected part of the application carrier, step S140 can be performed to place the flexible electronic packaging The device is arranged on the above-mentioned selected part. In this way, although the application carrier provided with the flexible electronic packaging device is bent during use or the application carrier itself has a curved surface, the flexible electronic packaging device is not easily damaged, thereby achieving a higher manufacturing yield and better usage life.

In addition, step S130 judges as NO, that is, the allowable bending radius (R _{tol_Sip} ) of the flexible electronic packaging device is greater than the minimum surface curvature radius (R _min _ _C ) of _the selected part of the application carrier, indicating that the selected part of the application carrier The degree of surface curvature may be equal to or greater than the tolerance of flexible electronic packaging devices. At this point, step S150 can be performed to redesign the flexible electronic packaging device. In some embodiments, the method for redesigning a flexible electronic packaging device includes _the method shown in FIG. 2 , so that the redesigned flexible electronic packaging device can meet the allowable bending radius (R _{tol_Sip} ) less than or equal to the minimum of the selected part. Radius of surface curvature (R _min _ _C ). The redesigned flexible electronic packaging device can be viewed through step S110 to step S130 in FIG. 1 until step S140 can be entered to place the flexible electronic packaging device on the selected part. In this way, although the application carrier provided with the flexible electronic packaging device is bent during use or the application carrier itself has a curved surface, the flexible electronic packaging device is not easily damaged, thereby achieving a higher manufacturing yield and better usage life.

FIG. 2 schematically illustrates a method for obtaining the allowable minimum bending radius of a flexible electronic packaging device according to some embodiments. In general, a flexible electronic packaging device may include a plurality of components, and the material properties of each component, the arrangement position, and the stacking relationship between the components will affect the tolerance of the flexible electronic packaging device to flexural stress. Therefore, the allowable minimum bending radius (R _tol — _Sip ) of the flexible electronic packaging device can be obtained by using the method shown in FIG. 2 . Specifically, in step S112, an initial bending radius (R _i ) can be set, and the bending stress value (S _max ) suffered by each component in the flexible electronic packaging device can be calculated. Furthermore, in step S114, the failure criterion of each component is determined to determine the allowable maximum stress value (S _limit + FS) of each component. Here, S _limit is, for example, the yield strength or ultimate strength of individual components, and FS is, for example, a factor of safety. In some embodiments, the safety factor can be defined as S _limit ×safety percentage, wherein the safety percentage can be set to be greater than 0% and up to 100%. Taking the safety percentage as 100% as an example, the allowable maximum stress value of each component can be about S _limit + S _limit × 100%, which is twice the yield strength of individual components. Taking the safety percentage as 50% as an example, the allowable maximum stress value of each component can be about S _limit + S _limit × 50%, which is 1.5 times the yield strength of individual components.

In step S116, it may be determined whether the bending stress values (S _max ) of each member are less than or equal to the allowable maximum stress value. If the bending stress value (S _max ) of each member at the initial bending radius (R _i ) is less than or equal to the allowable maximum stress value, it means that the stress on the member at the bending degree of the initial bending radius (R _i ) has not reached its tolerable level. At this time, the member is not easily damaged by bending. Therefore, when all components of the flexible electronic packaging device meet the bending stress value (S _max ) less than or equal to the allowable maximum stress value under the initial bending radius (R _i ), that is, step S116 judges yes, and step S118 can be performed to determine The set initial bending radius R _i is used as the allowable minimum bending radius (R _tol — _SiP ) of the flexible electronic packaging device. The determined allowable bending radius (R _tol — _SiP ) can be applied to step S110 in FIG. 1 . In step S130 of FIG. 1, if the allowable minimum bending radius (R _tol _ _SiP ) of the determined flexible electronic packaging device is less than or equal to the minimum surface curvature radius (R _min _ _C ), the flexible electronic packaging device can be set In the selected part of the application vector. In step S130 of FIG. 1 , if the determined allowable minimum bending radius (R _tol _ _SiP ) is greater than the minimum surface curvature radius (R _min _ _C ), it is necessary to change the design of the flexible electronic packaging device and re-according to the figure 2 to obtain the minimum surface curvature radius (R _min _ _C ) after the updated design, and then proceed to the judgment process in Figure 1.

In addition, if the bending stress value S _max of any component at the initial bending radius (R _i ) is greater than the allowable maximum stress value, that is, the judgment of step S116 is no, it means that the state of the initial bending radius (R _i ) may cause some components The stress received is greater than its allowable level, and the possibility of component damage due to bending is prone to occur. Therefore, if it is determined that the bending stress value (S _max ) of the component at the initial bending radius (R _i ) is greater than the allowable maximum stress value, step S112 can be continued to reset another bending radius (R _i '). Another newly set bending radius may be larger than the previously set initial bending radius (R _i ) to find a condition that the bending stress value (S _max ) is smaller than the allowable maximum stress value.

In some embodiments, the initial bending radius (Ri) in step S112 can be set according to the minimum surface curvature radius (R _min — _C ) of the selected part of the application carrier obtained in step S120 of FIG. 1 . For example, the location where the flexible electronic packaging device is intended to be disposed on the application carrier is selected in advance. At this time, step S120 in FIG. 1 can be used to scan the selected portion of the application carrier to obtain the minimum surface curvature radius (R _min — _C ) of the selected portion. Afterwards, the initial bending radius (Ri) of step S112 can be set according to the minimum surface curvature radius (R _min — _C ) of the selected portion of the application carrier, so as to determine the electronic packaging device that is flexibly mounted on the selected portion of the carrier. Specifically, the method for determining an electronic package device suitable for installation on a selected portion of the carrier includes: according to step S112, setting an initial bending radius (Ri), so that the set initial bending radius (Ri) is smaller than the minimum surface of the selected portion of the carrier surface Radius of curvature (R _min _ _C ), and calculate the bending stress value of each component in the flexible electronic packaging device under the above initial bending radius (Ri). Next, as described in step S114, the allowable maximum stress value of each of the components is determined, and the determination is made according to the steps in step S116. If the step S116 of FIG. 2 determines that the individual bending stress values (S _max ) of all components are less than or equal to the individual allowable maximum stress values, then it is determined that the electronic packaging device is suitable for mounting on the selected portion of the carrier. Since the initial bending radius (Ri) is set so that the initial bending radius (Ri) is smaller than the minimum surface curvature radius (R _min _ _C ), step S140 can be entered after the judgment of step S116 is passed. Thus, this flexible electronic packaging device can be placed on selected parts of the application carrier.

Fig. 3 schematically illustrates the calculation method of the bending stress value of each component. In other words, FIG. 3 illustrates the specific manner of step S112, but not limited thereto. In FIG. 3 , the flexible electronic packaging device 200 is, for example, in a bent state and has a neutral plane 202 , wherein the neutral plane 202 refers to a plane formed by points subjected to zero bending stress in the bent state. In addition, in this embodiment, the radius of curvature ρ is defined as the distance from the center of curvature O to the neutral plane 202 . The member 210 in the flexible electronic packaging device 200 is separated from the neutral plane 202 by a distance d in the Y direction, and the neutral plane 202 is located between the center of curvature O and the member 210, then the value of the bending stress σ _x received by the member 210 in the X direction It can be calculated by the formula: σ _x =-E×d/ρ, where E is the Young's modulus of the component 210 . It can be known that the bending stress on the member 210 is proportional to the distance d from the neutral plane 202 and the Young's modulus E, and inversely proportional to the radius of curvature ρ.

4 and 5 are schematic diagrams of flexible electronic packaging devices according to some embodiments of the present disclosure. In FIG. 4 , the flexible electronic packaging device 300 may include a plurality of components 310 - 380 . Specifically, the component 310 is, for example, an electronic component, which includes, for example, an integrated circuit chip, a passive component, a sensing component, and the like. The component 320 is, for example, a first flexible carrier, which is, for example, a substrate that is flexible and has sufficient support to stably carry the electronic component 310 . The component 330 is, for example, a second flexible carrier for carrying the first flexible carrier, and the size of the second flexible carrier may be larger than that of the first flexible carrier. The component 310 can be bonded to the component 320 , and the component 320 can be bonded to the component 330 to form a stack structure in which the first flexible carrier is located between the second flexible carrier and the electronic components. In addition, the component 310 can be electrically connected with the component 320 and the component 320 can be electrically connected with the component 330 . That is to say, the electronic components, the first flexible carrier and the second flexible carrier may be electrically connected to each other.

Additionally, member 340 may be an electrically conductive joint used to join member 310 to member 320 . In some embodiments, member 340 may be a conductive bump, solder, conductive ball, or the like. The member 350 may be disposed between the member 310 and the member 320 and used to fill a gap between the members 340 . In some embodiments, the component 350 is, for example, a filler, such as epoxy resin, polyimide and other materials. Member 340 may electrically connect member 310 to member 320 . In some embodiments, the component 320 has, for example, a conductive through hole, and the component 360 is, for example, a conductive pad disposed on the surface of the component 320 . The member 340 can be electrically connected to the opposite member 360 by using the conductive vias in the member 320 . The component 370 is, for example, a conductive pad disposed on the component 330 , and the component 370 and the component 360 face each other. The component 380 , for example, has a conductive particle joint and is disposed between the component 360 and the component 370 to electrically connect the structure of the component 360 to the component 370 . In this way, the component 310 can be electrically connected to the conductive circuit in the component 330 through the component 340 , the conductive through hole of the component 320 , the component 360 , the component 380 and the component 370 . The member 380 can be anisotropic conductive adhesive, but not limited thereto.

In FIG. 5 , a flexible electronic packaging device 400 includes all components 310 - 380 of the flexible electronic packaging device 300 in FIG. 4 , and further includes a component 390 . The member 390 is, for example, a sensing electrode. The component 390 (sensing electrode) is disposed on the component 330 (second flexible carrier), and is located on a side of the component 330 (second flexible carrier) away from the component 320 (first flexible carrier). The material of the sensing electrodes includes biocompatible materials. When the flexible electronic packaging device 400 is placed on the surface of the application carrier, the member 390 can face the user and be placed in contact with the user. For example, when the application carrier is a wearable article, the flexible electronic packaging device 400 is disposed on the wearable article in such a way that the component 390 is located on a side close to the wearer.

The flexible electronic packaging device 300 in FIG. 4 can be designed by using the method in FIG. 1 and FIG. 2 . Taking the flexible electronic packaging device 300 in FIG. 4 as an example, according to step S112 in FIG. 2, the bending stress value (S _max ) at the set initial bending radius (Ri) can be obtained for the components 310-380 respectively, and as in step As described in step S116 and step S118, the allowable bending radius (R _tol — _Sip ) of the flexible electronic packaging device is determined. After that, it can be determined whether the flexible electronic packaging device 300 is properly installed on the selected part of the application carrier according to the method of FIG. 1 . Of course, the flexible electronic packaging device 400 in FIG. 5 can also be designed by the above method.

FIG. 6 is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present disclosure. In FIG. 6 , the flexible electronic packaging device 500 includes all the components 310 - 390 of the aforementioned flexible electronic packaging device 400 , and also includes a component 312 , a component 342 and a component 352 . The component 312 is, for example, an electronic component, which includes an integrated circuit, a passive component, a sensing component, and the like. The member 342 may be a conductive joint for joining the member 312 to the member 320 and electrically connecting the member 342 to the member 320 . Member 352 may be disposed between member 312 and member 320 and serve to fill the gap between members 342 . In some embodiments, component 310 is the same electronic component as component 312, but can be used to perform different functional operations. The member 342 and the member 340 are also conductive joints, and may have the same or different structures and/or materials. The member 352 is the same filler as the member 350, but may have the same or different materials. The flexible electronic packaging device 500 in FIG. 6 can be designed and manufactured using the method in FIG. 1 and FIG. 2 , so that the flexible electronic packaging device 500 can have an ideal service life after being placed on an application carrier.

FIG. 7 is a schematic diagram of a flexible electronic packaging device disposed on an application carrier according to an embodiment of the present disclosure. In FIG. 7 , the flexible electronic packaging device 600 is to be disposed on an application carrier 700 , for example. Specifically, the application carrier 700 has a selected portion 710 and a selected portion 720 with different surface curvatures in actual use, wherein FIG. 7 schematically illustrates that the minimum surface curvature of the selected portion 710 is greater than the minimum surface curvature of the selected portion 720 , and the flexible electronic packaging device 600 is predetermined to be disposed on the application carrier 700 in a manner of crossing the selected portion 710 and the selected portion 720 . In other words, the first portion 610 of the flexible electronic packaging device 600 is to be disposed on the selected portion 710 and the second portion 620 of the flexible electronic packaging device 600 is to be disposed on the selected portion 720 , for example.

When manufacturing the flexible electronic packaging device 600, it can be determined whether the first part 610 of the flexible electronic packaging device 600 is properly arranged in the selected part 710 according to the method shown in FIG. Whether the second portion 620 is properly configured in the selected portion 720 . After both the first part 610 and the second part 620 are judged to be yes by the step S130 of FIG. 1 , the flexible electronic packaging device 600 can be disposed on the application carrier 700 . That is to say, different parts of the flexible electronic packaging device 600 can be designed according to the surface shape of the selected part of the predetermined configuration.

For example, the allowable bending radius (R _tol — _Sip ) of the first portion 610 of the flexible electronic packaging device 600 can be obtained according to step S110 of FIG. 1 and the method of FIG. 2 . And, according to step S120 of FIG. 1 , the minimum surface curvature radius (R _min _ _C ) of the selected portion 710 is obtained. Next, determine the allowable bending radius (R _tol — _Sip ) of the first portion 610 and the minimum surface curvature radius (R _min — _C ) of the selected portion 710 in step S130 of FIG. 1 . If it is judged that the allowable bending radius (R _tol — _Sip ) is greater than the minimum surface curvature radius (R _min — _C ), it is necessary to change the design of the first portion 610 of the electronic packaging device 600 . For example, it is necessary to change the structure, material or both of the first part 610, and after the change, perform the above steps again until the determination result of step S130 is yes.

In addition, the second part 620 and the selected part 720 of the flexible electronic packaging device 600 are also analyzed, judged, and even redesigned according to the above steps, until the allowable bending radius (R _{tol_Sip} ) of the second part ₆₂₀ is less than or equal to the selected part 720 until the minimum surface curvature radius (R _min _ _C ) (by the judgment of step S130 and can enter step S140). After both the first part 610 and the second part 620 are judged as "Yes" by step 130 in FIG. The second portion 620 is correspondingly disposed on the selected portion 720 . In this way, although the selected portion 710 and the selected portion 720 of the application carrier 700 are non-planar in use and/or wearing state, the flexible electronic packaging device 600 is not easily damaged due to bending stress. Therefore, the flexible electronic packaging device 600 can have an ideal service life.

8 to 11 schematically illustrate the implementation of the flexible electronic packaging device disposed on the application carrier. In FIG. 8 , the flexible electronic packaging device 810 is, for example, disposed on an application carrier 820 , wherein the application carrier 820 is, for example, a headband. When the application carrier 820 is worn, the application carrier 820 will bend along the curve of the wearer's head, for example. Therefore, the minimum surface curvature radius of the portion where the flexible electronic packaging device 810 is disposed approximately corresponds to the curve of the user's head, for example. The flexible electronic packaging device 810 can be manufactured according to the method shown in FIG. 1 and FIG. 2 , wherein, when performing step S120 in FIG. 1 , the application carrier 820 can be set on the mold 830 in the shape of a human head, and then the surface of the selected part can be scanned. Radius of curvature to obtain the minimum surface radius of curvature (R _min _ _C ).

In FIG. 9 , the flexible electronic packaging device 910 is, for example, disposed on an application carrier 920 , wherein the application carrier 920 is, for example, upper torso clothing, and the flexible electronic packaging device 910 is, for example, to be disposed on the chest portion (selected portion) of the clothing. When the application carrier 920 is worn, the application carrier 920 bends, for example, following the curve of the wearer's upper torso. Thus, the minimum surface radius of curvature of the selected portion where the flexible electronic packaging device 910 is to be disposed approximately corresponds to, for example, the curve of the user's chest. In some embodiments, the flexible electronic packaging device 910 can be manufactured according to the method shown in FIG. 1 and FIG. 2 , wherein the application carrier 920 can be stretched into a wearable state using a mold 930 in the shape of a human body, and then the flexible electronic packaging device 910 is scanned. Select the surface of the part (breast part) to perform step S120 of FIG. 1 to obtain the minimum surface curvature radius (R _min _ _C ).

In FIG. 10 , the flexible electronic packaging device 1010 is, for example, disposed on an application carrier 1020 , wherein the application carrier 1020 is, for example, sports pants, and the flexible electronic packaging device 1010 is, for example, to be disposed on the hip portion of the sports pants. When the application carrier 1020 is worn, the application carrier 1020 will bend along the curves of the wearer's hips and legs, for example. Thus, the minimum surface radius of curvature of the selected portion on which the flexible electronic packaging device 1010 is to be disposed, for example, approximately corresponds to the curve of the user's hip portion. In some embodiments, the flexible electronic packaging device 1010 can be manufactured according to the method shown in FIG. 1 and FIG. 2 , wherein the application carrier 1020 can be stretched into a wearable state using a human body-shaped mold 1030 , and then the flexible electronic packaging device 1010 is scanned. Part of the surface is selected to perform step S120 in FIG. 1 to obtain the minimum surface curvature radius (R _min _ _C ).

In FIG. 11, the flexible electronic packaging device 1110 and the flexible electronic packaging device 1120 are, for example, disposed on an application carrier 1130, wherein the application carrier 1130 is, for example, a shoe, and the flexible electronic packaging device 1110 is, for example, to be disposed on the heel part of the shoe and the flexible electronic The packaging device 1120 is, for example, to be disposed on the arch portion of the shoe. The application carrier 1130 itself is a three-dimensional object, which has curved surfaces at the heel part and the arch part. Therefore, the flexible electronic packaging device 1110 may correspond to the curved surface design of the heel portion and the flexible electronic packaging device 1120 may correspond to the curved surface design of the arch portion. In other words, when performing the method of FIG. 1 , the heel portion and the arch portion of the shoe can be scanned to obtain the corresponding minimum surface curvature radius (R _min — _C ).

To sum up, the manufacturing method of the flexible electronic packaging device according to the disclosed embodiment judges whether the flexible electronic packaging device is properly arranged on the selected part of the application carrier according to the characteristics of the flexible electronic packaging device and the surface state of the application carrier, and makes the flexible electronic packaging device The packaging device is not easy to be damaged due to the bending state of the application carrier in the use state, so it has an ideal service life.

200, 300, 400, 500, 600, 810, 910, 1010, 1110, 1120: flexible electronic packaging device 202: Neutral surface 210, 310~390, 312, 342, 352: components 610: Part 1 620: Part Two 700, 820, 920, 1020, 1130: application carrier 710, 720: selected part 830, 930, 1030: Mold d: distance O: Center of curvature S110~S150, S112~S118: steps X, Y: direction ρ: radius of curvature

FIG. 1 shows a method for manufacturing a flexible electronic packaging device according to an embodiment of the present disclosure. FIG. 2 schematically illustrates a method for obtaining the allowable minimum bending radius of a flexible electronic packaging device according to some embodiments. Fig. 3 schematically illustrates the calculation method of the bending stress value of each component. 4 and 5 are schematic diagrams of flexible electronic packaging devices according to some embodiments of the present disclosure. FIG. 6 is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present disclosure. FIG. 7 is a schematic diagram of a flexible electronic packaging device disposed on an application carrier according to an embodiment of the present disclosure. 8 to 11 schematically illustrate the implementation of the flexible electronic packaging device disposed on the application carrier.

S110~S150: steps

Claims (19)

A method for manufacturing a flexible electronic packaging device, comprising: calculating the allowable bending radius of the flexible electronic packaging device; calculating the minimum surface curvature radius of a selected part of the application carrier; determining that the allowable bending radius is less than or equal to the minimum surface curvature radius; and disposing the flexible electronic packaging device on the selected portion, wherein the flexible electronic packaging device includes a plurality of components, and the method of obtaining the allowable bending radius of the flexible electronic packaging device includes: Set the initial bending radius, and calculate the bending stress value of each of the components in the flexible electronic packaging device under the initial bending radius; determine the allowable maximum stress value of each of the components; the bending of each of the components If the stress values are all less than or equal to the allowable maximum stress value, the initial bending radius is determined to be the allowable bending radius of the flexible electronic packaging device. The method for manufacturing a flexible electronic packaging device according to claim 1, wherein the application carrier is a three-dimensional object. The method for manufacturing a flexible electronic packaging device according to claim 1, wherein the flexible electronic packaging device is redesigned so that the allowable bending radius is smaller than the minimum surface curvature radius if the allowable bending radius is greater than the minimum surface curvature radius Surface radius of curvature. The method for manufacturing a flexible electronic packaging device according to claim 1, wherein the component includes a first flexible carrier and an electronic component bonded to the first flexible carrier. The method for manufacturing a flexible electronic packaging device according to claim 4, wherein the component further includes a second flexible carrier, and the first flexible carrier is bonded to the second flexible carrier. The method for manufacturing a flexible electronic packaging device according to claim 5, wherein the member further includes a sensing electrode, the sensing electrode is arranged on the second flexible carrier, and the material of the sensing electrode includes biocompatible material. The method for manufacturing a flexible electronic packaging device according to claim 6, wherein the sensing electrode is located on a side of the second flexible carrier away from the first flexible carrier. The method for manufacturing a flexible electronic packaging device according to claim 1, wherein the application carrier includes a wearable article. The method of manufacturing a flexible electronic packaging device as claimed in claim 8, wherein the wearable items include headbands, jackets, pants or shoes. The method for manufacturing a flexible electronic packaging device as claimed in claim 1, wherein the method for obtaining the minimum surface radius of curvature of the selected part of the application carrier includes scanning the surface of the application carrier in the worn state Selecting a portion to obtain surface radii of curvature of individual surfaces in the selected portion, and selecting the smallest of the surface radii of curvature as the minimum surface radius of curvature. A method of manufacturing a flexible electronic packaging device, comprising: Obtain the minimum surface radius of curvature of the selected part of the application carrier; determine the flexible electronic packaging device disposed on the selected part according to the minimum surface curvature radius, wherein the flexible electronic packaging device includes a plurality of components, and determine the The method for the flexible electronic packaging device includes: setting an initial bending radius, and calculating the bending stress value of each member in the flexible electronic packaging device under the initial bending radius, wherein the initial bending radius is smaller than the minimum surface Radius of curvature; determine the allowable maximum stress value of each of the members; the bending stress value of each of the members is less than or equal to the allowable maximum stress value, which is determined as the flexible electronic set on the selected part a packaging device; and disposing the flexible electronic packaging device on the selected portion. The method for manufacturing a flexible electronic packaging device according to claim 11, wherein the application carrier is a three-dimensional object. The method for manufacturing a flexible electronic packaging device according to claim 11, wherein the component includes a first flexible carrier and electronic components bonded to the first flexible carrier. The method for manufacturing a flexible electronic packaging device according to claim 13, wherein the component further includes a second flexible carrier, the first flexible carrier is bonded to the second flexible carrier, and the second The size of the flexible carrier is larger than the first flexible carrier. The method for manufacturing a flexible electronic packaging device according to claim 14, wherein the member further includes a sensing electrode, the sensing electrode is arranged on the second flexible carrier, and the material of the sensing electrode includes biocompatible material. The method for manufacturing a flexible electronic packaging device as claimed in claim 15, wherein the sensing electrodes are located on the outer side of the second flexible carrier away from the first flexible carrier. The method for manufacturing a flexible electronic packaging device as claimed in claim 11, wherein the application carrier includes a wearable item. The method for manufacturing a flexible electronic packaging device as claimed in claim 17, wherein the wearable items include headbands, jackets, trousers or shoes. The method for manufacturing a flexible electronic packaging device according to claim 17, wherein the method for obtaining the minimum surface radius of curvature of the selected part of the application carrier includes scanning the surface of the application carrier in the worn state Selecting a portion to obtain surface radii of curvature of individual surfaces in the selected portion, and selecting the smallest of the surface radii of curvature as the minimum surface radius of curvature.

Images