TWI780093B - Ring structures and systems for use in a plasma chamber - Google Patents

Abstract

Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

Description

Ring structures and systems for plasma chambers

Embodiments of the invention relate to rings, systems, methods, and structures for securing rings in plasma chambers.

Plasma chambers are used to perform many processes on wafers. For example, plasma chambers are used to clean wafers, deposit materials on wafers, or etch wafers. The plasma chamber contains many elements, such as various rings, which are used to process different parts of the wafer.

The embodiments described in this disclosure are presented herein.

In the described embodiment, the plasma chamber is provided with an edge ring and a support ring. In one embodiment, the edge ring is coupled to a support ring disposed below the edge ring. The edge ring is coupled to the support ring, for example by a plurality of screws attached to the bottom side of the edge ring. To secure the support ring, a plurality of pull down structures are coupled to the underside of the support ring, the pull down structures pulling down to hold the edge ring in place during handling. If the edge ring is not properly fixed during handling, the adhesive used to fix the edge ring is not sufficient. One reason why adhesive alone is not sufficient is that the adhesion provided by the adhesive colloid formed between the support ring and the edge ring is reduced due to the high temperature cycles within the plasma chamber. Furthermore, there is a constant force applied to the colloid, so the colloid may disintegrate over time. Therefore, it is expected that even when the adhesion provided by the colloid is reduced and/or the colloid collapses, the When detached, the edge ring and support ring remain in place during processing of the substrate. For example, it may be desirable for the edge ring to be fixed relative to the support ring during processing of the substrate. Otherwise, any displacement of the edge ring during processing of the substrate may result in undesired processes being performed on the substrate, or certain undesired portions of the substrate being processed. In one embodiment, the bottom surface of the edge ring has grooves for receiving a plurality of fasteners, such as screw holes, to connect the edge ring to the support ring during processing of the substrate. This helps prevent movement of the edge ring relative to the support ring.

In one embodiment, it is desirable for the edge ring to have one or more curved edges to reduce the possibility of arcing when the plasma is formed within the plasma chamber.

In another embodiment, it may be desirable to provide a cover ring to surround the edge ring. The cover ring is further configured to have one or more curved edges to reduce the possibility of arcing when the plasma is formed within the plasma chamber. Furthermore, the width of the cover ring is selected such that the trace distance along the width helps to achieve a stand-off voltage at the vertically oriented inner surface of the cover ring. For example, if the radio frequency (RF) voltage dissipated in the cover ring ranges from about 7 volts (V) per thousandth of an inch of the cover ring (inclusive) to 10 volts, then vertical A predetermined isolation voltage of 5000 volts (V) is achieved at the oriented inner surface, and the width of the cover ring corresponds to the tracking distance. The trace distance is a multiple of the isolation voltage (such as two or three) and the ratio of the voltage dissipation per unit length of the cover ring (such as thousandths of an inch). In some embodiments, the width of the cover ring is the tracking distance provided by this ratio. In another embodiment, the length of the surface between the edge ring and ground (eg, along several stepped surfaces) defines the tracking distance.

In one embodiment, it is desirable that the support ring and the edge ring are fixed relative to the insulator ring below the support ring. Otherwise, any moment of the support ring relative to the insulator ring moves the edge ring on top of the support ring. Movement of the edge ring is undesirable during processing of the substrate. Any displacement of the support ring during processing of the substrate may result in undesired processes being performed on the substrate, or portions of the substrate being processed that are not intended to be processed. Furthermore, it is desirable for the support ring and the edge ring to be easily removed for repair or replacement of the support ring or the edge ring or both.

In some embodiments, an edge ring for a plasma processing chamber is described. The edge ring has an annular body surrounding the substrate support of the plasma processing chamber. The annular body has a bottom side, a top side, an inner side, and an outer side. The edge ring has a plurality of fastener holes disposed within the ring body along the bottom side. Each fastener hole has a threaded inner surface for receiving a fastener for attaching the annular body to the support ring. The edge ring further includes a step disposed inside the ring body. The step has a lower surface separated from the top surface by an angled surface. The edge ring has curved edges formed on the upper surface of the top side and the side surface of the outer side.

In several embodiments, a cover ring for a plasma processing chamber is described. The cover ring has an annular body surrounding the edge ring and adjacent to the ground ring. The annular body has an upper body portion, a middle body portion, and a lower body portion. The intermediate body portion defines a stepped reduction from the upper body portion such that the intermediate body portion has a first annular width. The lower body portion defines a stepped reduction from the intermediate body portion such that the lower body portion has a second annular width that is less than the first annular width.

In various embodiments, a system for securing an edge ring of a plasma chamber is described. The system includes a support ring over which the edge ring is oriented. The system further includes a gel layer disposed between the bottom surface of the edge ring and the top surface of the support ring. The system also includes a plurality of screws configured to secure the edge ring to the support ring. Each of the plurality of screws is attached to a screw hole disposed within the bottom surface of the edge ring and through the support ring. The system also includes a plurality of compression rods attached to the bottom surface of the support ring. The system consists of a plurality of pneumatic pistons. Each of the plurality of pneumatic pistons is coupled to an individual one of the plurality of compression rods.

Some advantages of the systems and methods described herein include providing edge rings with one or more non-sharp curved edges. When a plasma is formed within a plasma chamber, sharp edges, such as edges with a 90° angle, are often responsible for arcing of RF power. One or more curved edges reduce the likelihood of such arcing.

Further advantages of the system and method include providing the edge ring with one or more slots, such as screw holes, for receiving fasteners, such as screws, for coupling the edge ring to the support ring. The coupling of the edge ring and the support ring keeps the edge ring relative to the support ring even when the adhesion provided by the glue between the edge ring and the support ring decreases or the glue wears out or disintegrates due to the forces applied to the glue during the processing of the substrate. fixed. Furthermore, the support ring is fixed relative to the insulator ring by one or more compression rods. Thus, the edge ring is fixed relative to the insulator ring by the support ring and thus cannot be displaced during processing of the substrate. Such lack of displacement reduces, such as avoids, the likelihood of performing any undesired processes on the substrate, or reduces the likelihood of undesired areas of the substrate being processed.

Additional advantages of the system and method include providing one or more mechanisms, such as one or more pneumatic mechanisms, for pulling down or pushing up the support ring by one or more compression rods. Pull down is performed during processing of the substrate to reduce the possibility of displacement of the support ring relative to the insulator ring. Thus, due to the pull down, the edge ring and support ring remain stationary within the plasma chamber during multiple processing operations, such as from processing operation to another, until replaced or removed from the plasma chamber for maintenance. Push up is performed to remove the edge ring or support ring for replacement or repair, such as cleaning.

Other advantages of the systems and methods described herein include providing the cover ring with one or more curved edges to reduce the possibility of arcing when the plasma is formed within the plasma chamber. Furthermore, the cover ring has an annular width to achieve an isolation voltage at the vertically oriented inner surface of the cover ring as described above.

Other implementation aspects will become apparent from the following detailed description in conjunction with the accompanying drawings.

100: system

104: Chuck

106: insulator ring

108: edge ring

110A: colloidal layer

110B: colloidal layer

110C: Colloidal layer

112: support ring

114: Grounding ring

116: base ring

118: cover ring

122: Fasteners

124A: Fastener holes

124B: Fastener holes

124C: Fastener holes

125: slot

132A: Through hole

200: system

201: cover ring

202: cover ring

203: inner surface

204: O-ring

206: Power pin feedthrough

208: Power pin

210: base ring

212: Grounding ring

213: Trackable distance

214: O-ring

216A: Mounting seat

218: Bowl

224:Equipment board

228: edge ring

230: insulator wall

300: system

302A: Compression rod

302B: Compression rod

308: bottom surface

330: slot

332: Receiver

604A: Mounting seat

900: system

902: Shoulder screw

906: Press connector

908: threaded adapter

910: screw

912: Cylinder

914:Air fittings

914A: Air Fittings

914B: Air Fittings

916: piston body

918: piston rod

920A: fastening mechanism

920B: fastening mechanism

920C: fastening mechanism

922: Piston

924: edge ring

930: center opening

931: slot

932: Thread

934: Thread

1100: system

1102A: Air route

1102B: Air route

1104A: upper part

1104B: lower part

1104C: upper part

1104D: lower part

1104E: upper part

1104F: lower part

1106A: tube

1106B: tube

1106C: tube

1106D: tube

1106E: tube

1106F: tube

1106G: tube

1106H: tube

1106I: tube

1106J: tube

1150: system

1200: system

1202A: Air compressor

1202B: Air compressor

1204A: regulator

1204B: regulator

1206A: Orifice

1206B: Orifice

1604: top surface

1606: inner surface

1608: inner surface

1610: inner surface

1612: bottom surface

1614: outer surface

1616: curved edge

1618: inner surface

1620: inner surface

1622: steps

1650: system

1652: Thread

1654: Thread

1658: subject

1660: head

1704: top surface

1705: bottom surface

1706: curved edge

1710: Outer surface

1712: Outer surface

1714: outer surface

1716: Outer surface

1718: bottom surface

1719: External surface

1720: inner surface

1722: inner surface

1724: inner surface

1726: Stepped reduction department

1728: Stepped reduction department

1729: Stepped reduction department

1730: Upper main body

1732: Middle body part

1734: Lower body part

1735: Trackable distance

1736: inner surface

1746: ring width

1754: ring width

1761: Upper body

1762: Depth

1763: Middle body part

1764: Depth

1765: lower body

1766: top surface

1768: External surface

1770: External surface

1772: External surface

1774: External surface

1776: bottom surface

1778: inner surface

1780: inner surface

1781: inner surface

1782: inner surface

1783: Step-down reduction department

1784: Stepped reduction department

1786: ring width

1788: ring width

1790: Depth

1792: Depth

1794: Traceable distance

A1: angle

A2: Angle

C1: Connector

C2: Connector

C3: Connector

C4: Connector

D1: diameter

D2: diameter

D3: diameter

d1: distance

d2: length

d3: distance

dA: distance

dB: distance

dC: distance

dD: distance

EL: electrode

ID: inner diameter

ID1: inner diameter

ID2: (inner) diameter

L1: position

L2: position

L11: width

L12: Length

L13: width

L14: Length

L15: width

L21: Depth

L22: width

L23: Depth

L24: width

MD: middle diameter

OD: Outer diameter

OD1: Outer diameter

OD2: (outer) diameter

P1: part

P2: part

P3: part

P4: part

P5: part

P6: part

PR1: top part

PR2: middle part

PRTN1: top part

R1: Radius

R2: Radius

R3: Radius

R4: Radius

R5: Radius

R6: Radius

R7: Radius

RA: Radius

RB: Radius

RC: Radius

RD: Radius

RE: Radius

RF: Radius

RG: Radius

RH: Radius

RJ: Radius

RK: Radius

SS: side surface

TS: top surface

W1: width

The embodiments can be best understood by referring to the following description in conjunction with the accompanying drawings.

Figure 1 is a diagram of an embodiment of a system to illustrate the manner in which an edge ring is secured to a support ring.

Figure 2 is a diagram of an embodiment of a system to illustrate the coupling of power pins to a support ring.

Figure 3A is a diagram of an embodiment of a system to illustrate multiple locations where multiple hold down rods are connected to a support ring.

Figure 3B is an isometric view illustrating the coupling of the compression rod to the bottom surface of the support ring.

4 is a side view of an embodiment of a system for securing an edge ring and a support ring to an insulator ring.

Figure 5 is an isometric view of an embodiment of the fastening mechanism.

Figure 6A is a diagram of an embodiment of a system illustrating synchronized pull-down of compression rods.

Figure 6B is a diagram of an embodiment of a system illustrating synchronized push-up of compression rods.

7 is a block diagram of an embodiment of a system to illustrate supplying air to multiple fastening mechanisms.

Figure 8A is an isometric view of an embodiment of an edge ring.

8B is a top view of an embodiment of the edge ring of FIG. 8A.

Figure 8C is a cross-sectional view of the edge ring of Figure 8B.

8D is a diagram of an embodiment of a system to illustrate the coupling of fasteners to the edge ring of FIG. 8A.

Figure 9A is an isometric view of an embodiment of a cover ring.

Figure 9B is a bottom view of the embodiment of the cover ring of Figure 9A.

Figure 9C is a top view of the embodiment of the cover ring of Figure 9A.

9D is a cross-sectional view of an embodiment of the cover ring of FIG. 9C.

9E is a cross-sectional view of an embodiment of the cover ring of FIG. 9A.

9F is a cross-sectional view of an embodiment of the cover ring of FIG. 9A.

Figure 9G is a cross-sectional view of an embodiment of a cover ring.

The following examples describe systems and methods for securing edge rings within plasma chambers. Obviously, embodiments of the invention may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail so as not to unnecessarily obscure embodiments of the invention.

1 is a diagram of an embodiment of a system 100 to illustrate the manner in which an edge ring 108 is secured to a support ring 112, sometimes referred to herein as a adjustable edge sheath (TES) ring. System 100 includes edge ring 108 , ground ring 114 , base ring 116 (shown in FIG. 9G below), insulator ring 106 , cover ring 118 (shown in FIG. 9G below), and chuck 104 . Edge ring 108 is made of a conductive material such as silicon, boron doped single crystal silicon, aluminum oxide, silicon carbide, or a silicon carbide layer on top of an aluminum oxide layer, or an alloy of silicon, or a combination thereof. It should be noted that the edge ring 108 has an annular body, such as a circular body, or an annular body, or a disc-shaped body. Furthermore, the support ring 112 is made of a dielectric material, such as quartz, or ceramic, or aluminum oxide (Al ₂ O ₃ ), or polymer. As an example, support ring 112 has an inner diameter of about 12.5 inches, an outer diameter of about 13.5 inches, and a thickness along the y-axis of about 0.5 inches. To illustrate, support ring 112 has an inner diameter ranging from about 12.7 inches (inclusive) to about 13 inches, an outer diameter from about 13.3 inches (inclusive) to about 14 inches, and an outer diameter ranging from about 0.5 inches (inclusive). ) to a thickness of about 0.7 inches. These are just example dimensions of a plasma chamber for processing 300 mm wafers.

Furthermore, the insulator ring 106 is made of an insulator material, such as a dielectric material, and the base ring 116 is also made of a dielectric material. The ground ring 114 is made of conductive material. The ground ring 114 is coupled to ground potential. Examples of chuck 104 include electrostatic chucks. Each ring, such as edge ring 108 , support ring 112 , ground ring 114 , base ring 116 , and insulator ring 106 has an annular shape, such as a ring or a disk. Cover ring 118 is made of a dielectric material such as fused silica quartz, or a ceramic material such as aluminum oxide (Al ₂ O ₃ ) or yttrium oxide (Y ₂ O ₃ ). The cover ring 118 has an annular body, such as a disk-shaped or ring-shaped annular body.

The bottom surface of the edge ring 108 has a portion P1 coupled to the upper surface of the support ring 112 via the thermally conductive adhesive layer 110A to dissipate heat from the support ring 112 to the edge ring 108 . Examples of thermally conductive gels as used herein include polyimides, polyketones, polyetherketones, polyethersulfones, polyethylene terephthalate, fluorinated ethylene-propylene copolymers, cellulose, triacetate ( triacetates), and silicone. Furthermore, The bottom surface of the edge ring 108 has another portion P2 coupled to the upper surface of the chuck 104 via the thermally conductive adhesive layer 110B. In addition, the bottom surface of the edge ring 108 still has another portion P3 located above and adjacent to the base ring 116 .

Edge ring 108 is positioned over base ring 116 , support ring 112 , and chuck 104 . The bottom surface of edge ring 108 faces base ring 116 , support ring 112 , and a portion of chuck 104 . The edge ring 108 also surrounds a portion of the chuck 104, such as the top portion PRTN1. A support ring 112 surrounds a portion of the chuck 104 and an insulator ring 106 surrounds another portion of the chuck 104 . Base ring 116 surrounds a portion of insulator ring 106 and support ring 112 . A cover ring 118 surrounds the edge ring 108 and the base ring 116 . The ground ring 114 surrounds a portion of the cover ring 118 and the base ring 116 . A portion of the cover ring 118 is positioned above the ground ring 114 and the cover ring 118 is disposed adjacent to the side of the ground ring 114 .

Edge ring 108 has a plurality of edges, such as edge 1 , edge 2 , edge 3 , edge 4 , edge 5 , and edge 6 . Edges 1 to 6 are each curved, such as arcuate. To illustrate, edges 1-6 each have no sharp angles, have radii, and have smooth curves. It should be noted that in many embodiments, the radius of each of edges 1-6 is greater than the range from about 0.01 inches (inclusive) to about 0.03 inches. A radius of the edge from about 0.01 inches (inclusive) to about 0.03 inches reduces the likelihood of edge chipping during semiconductor wafer fabrication. Fragmentation produces particles during the processing of semiconductor wafers.

In one embodiment, the edge ring 108 has a plurality of edges. In one embodiment, the edges defining edge ring 108 are rounded. For example, edge 1 of edge ring 108 is rounded to a radius of about 0.03 inches or greater, and preferably greater than 0.07 inches. For illustration, edge 1 is rounded to have a radius ranging from about 0.03 inches (inclusive) to about 0.1 inches. As another example, edge 1 is rounded to have a radius ranging from about 0.07 inches (inclusive) to about 0.1 inches. Edge 1 of edge ring 108 is particularly susceptible to arcing due to its proximity to ground ring 114 . Due to the increased power levels used in plasma processing operations, high electric fields will be generated between the edge ring 108 and the ground ring 114 . The rounding of the edge 1 reduces the possibility of such arcing. It has been determined that when the plasma chamber is in operation, the lower The degree of rounding may not be sufficient to prevent or reduce the possibility of arcing from RF power. Due to the sharper feature edges within the plasma chamber, the reduced likelihood of arcing can be detrimental to manufacturing processes performed on and above the semiconductor wafer. Slight edge rounding (eg, Edge 1 ranging from about 0.01 inches inclusive to about 0.03 inches inclusive) helps reduce particle generation during semiconductor wafer fabrication, or the likelihood of edge chipping during fabrication. Thus, although some rounding is performed on the surface of features (such as edge 1) disposed within the plasma chamber, this degree of rounding is less than that used for Rounding to prevent or reduce arcing.

The curved edges 1-6 reduce the possibility of fragmentation or arcing when the plasma is formed within the plasma chamber in which the system 100 is located. It should be noted that edge 5 is less rounded than edge 1 to reduce the possibility of plasma ions of the plasma entering the gap between edge 5 and chuck 104 . For example, the radius of edge 5 is lower than the radius of edge 1 . As an example, edge ring 108 has an outer diameter along the x-axis ranging from about 13.6 inches inclusive to about 15 inches. As another example, edge ring 108 has an outer diameter ranging from about 13 inches (inclusive) to about 15 inches. As yet another example, edge ring 108 has a thickness measured along the y-axis of about 0.248 inches. To illustrate, the thickness of the edge ring 108 ranges from about 0.24 inches (inclusive) to about 0.256 inches. The x-axis is perpendicular to the y-axis. As the outer diameter of the edge ring 108 increases, the distance between the outer surface of the edge 1 adjoining the edge ring 108 and the cover ring 118 decreases. The reduction in distance reduces the likelihood of arcing of the RF power between the edge ring 108 and the cover ring 118 when the plasma is formed within the plasma chamber.

Edge ring 108 includes a plurality of grooves, such as groove 125 , formed in a bottom surface of edge ring 108 . An example of a groove in the edge ring is a screw hole. Each slot surrounds a fastener hole, such as fastener hole 124A. The fastener holes do not extend completely along the y-axis, along the length of the edge ring 108 , to form through-holes within the edge ring 108 . A plurality of fastener holes are formed in the bottom surface of the edge ring 108 . An example of a fastener hole is a screw hole with helical threads for receiving a screw. The groove 125 has a top surface TS and a side surface SS. The top surface TS and the side surface SS are surfaces formed by drilling into the bottom surface of the edge ring 108 . The side surface SS is substantially perpendicular to the top surface TS. For example, the side surface SS is at an angle with respect to the top surface TS, such as forming a range Angles between 85 and 95 degrees. As another example, the side surface SS is perpendicular to the top surface TS. The top surface TS partially surrounds the fastener hole 124A and the side surface SS partially surrounds the fastener hole 124A.

Additionally, through holes 132A are formed in the support ring 112 for receiving fasteners 122, such as screws or bolts or pins. Similarly, additional through-holes, such as through-hole 132A, are formed elsewhere within support ring 112 to accommodate a plurality of fasteners, such as fasteners 122, for coupling support ring 112 to the edge ring as described herein. . For example, three through holes are formed within the support ring 112 at the vertices of an equilateral triangle in the horizontal plane along the x-axis. As another example, six or nine through-holes are formed in support ring 112, and the distance between one set of adjacent through-holes is substantially equal (such as equal to or within predetermined limits) of another set of adjacent through-holes. distance between vias. It should be noted that the set of adjacent vias has at least one via different from at least one of the other set of adjacent vias.

Fastener 122 is made of metal such as steel, aluminum, steel alloys, or aluminum alloys. The through hole 132A is formed to conform to the shape of the fastener 122 . For example, the fastener 122 has a head with a larger diameter than the body of the fastener 122 . The lower portion of the through hole 132A is fabricated with a diameter that is slightly larger (such as a fraction of a millimeter (mm)) than the head of the fastener 122 . Again, the upper portion of the through hole 132A is fabricated with a slightly larger diameter (such as a fraction of a millimeter) than the body of the fastener 122 . Furthermore, the diameter of the fastener hole 124A is made slightly larger, such as a fraction of a millimeter, compared to the threaded portion of the fastener 122 . In addition, a space is formed between the top surface TS of the slot 125 and the tip of the fastener 122 along the y-axis. An example of a space is a gap 1 ranging from about 0 mm inclusive to about 1 mm. Another example of gap 1 is a space ranging from about 0 mm (inclusive) to about 0.5 mm. Yet another example of gap 1 is a space ranging from about 0 mm (inclusive) to about 0.25 mm. The space of gap 1 is in the vertical direction along the y-axis. The space between the top surface TS of the slot 125 and the threaded portion of the fastener 122 ranges from about 0 mm inclusive to about 0.5 mm to reduce the possibility of arcing from RF power in the space. If arcing occurs, fastener 122 may melt due to heat generated by the arcing.

Fastener 122 is inserted into through hole 132A such that the head and body of fastener 122 are seated within support ring 112 and the threaded portion of fastener 122 is inserted into fastener hole 124A formed in edge ring 108 . The space (such as gap 2 ) formed between the side surface of the fastener 122 and the inner side surface of the support ring 112 ranges from about 0 mm (inclusive) to about 0.2 mm.

The support ring 112 has electrodes EL embedded therein for receiving radio frequency (RF) power of an RF signal received from an auxiliary RF generator via auxiliary matching, such as an impedance matching circuit.

In some embodiments, support ring 112 is a coupling ring.

In many embodiments, the fastener 122 is made of plastic.

In some embodiments, instead of the conductive gel layer, a double-sided conductive tape with conductive gel on both sides is used. In many embodiments, instead of a layer of conductive gel, interstitial beads with conductive gel are used.

In some embodiments, instead of fastener holes having multiple threads, the fastener holes described herein in the bottom surface of the edge ring are fitted with inserts, such as metal sleeves. For illustration, a metal sleeve is screwed into a groove formed in the bottom surface of the edge ring. The insert has threads in its inner surface. The fastener is then threaded to the threads of the insert rather than to the threaded fastener hole.

FIG. 2 is a diagram of an embodiment of a system 200 to illustrate the coupling of power pins 208 to support ring 112 . System 200 includes edge ring 228 , cover ring 201 , ground ring 114 , insulator ring 106 , base ring 210 , device plate 224 , chuck 104 , support ring 112 , bowl 218 , and insulator wall 230 . The insulator wall 230, as described herein, is the wall of the bias enclosure of the plasma chamber. The insulator ring 106 is fixed, such as non-movable, relative to the insulator wall 230 . Ground ring 114 is uncoated. Edge ring 228 is sometimes referred to herein as a hot edge ring (HER). Edge ring 228 is made of the same material as edge ring 108 of FIG. 1 , except that edge ring 228 has a different shape than edge ring 108 . As an example, edge ring 228 has an outer diameter along the x-axis ranging from about 13.6 inches inclusive to about 15 inches. As another example, edge ring 228 has an outer diameter ranging from about 13 inches (inclusive) to about 15 inches. As yet another example, edge ring 228 has an approximate diameter of 0.248 inches measured along the y-axis. inch thickness. To illustrate, the thickness of the edge ring 228 ranges from about 0.24 inches (inclusive) to about 0.256 inches. A plurality of fastener holes of FIG. 1 , such as fastener holes 124A, are formed in edge ring 228 to secure edge ring 228 to support ring 112 .

Furthermore, the cover ring 201 is made of the same material as the cover ring 118 of FIG. 1 except that the cover ring 201 has a different shape than the cover ring 118 . The cover ring 201 has a ring body, such as a disk-shaped or ring-shaped ring body. A portion of the cover ring 201 is located above and adjacent to the ground ring 114 , while another portion of the cover ring 201 is located adjacent to and above the base ring 210 . Similarly, base ring 210 is made of the same material as base ring 116 of FIG. 1 , except that base ring 210 has a different shape than base ring 116 .

The portion P5 of the edge ring 228 is coupled to the support ring 112 through the glue layer 110C, so that the support ring 112 dissipates heat to the edge ring 228 . Similarly, another portion P4 of the edge ring 228 is coupled to a portion of the chuck 104 via the glue layer 110C. The edge ring 228 surrounds the top portion PRTN1 of the chuck 104 . In addition, another portion P6 of the edge ring 228 is adjacent to a portion of the top surface of the base ring 210 . Furthermore, cover ring 201 surrounds edge ring 228 . The support ring 112 is positioned below the edge ring 228 and surrounds a portion of the chuck 104 . An insulator ring 106 is positioned below the support ring 112 and surrounds the bottom portion of the chuck 104 . Base ring 210 is positioned below cover ring 201 and surrounds a portion of insulator ring 106 . Ground ring 114 surrounds a portion of insulator ring 106 and base ring 210 . Bowl 218 is positioned below insulator ring 106 . The insulator wall 230 is positioned below a portion of the insulator ring 106 and the ground ring 114 . The insulator wall 230 is made of an insulator material.

Power pin feedthroughs 206 are inserted through through holes in insulator ring 106 and holes formed in support ring 112 . The power pin feedthrough 206 is a sleeve made of an insulator such as plastic or ceramic to protect the power pin 208 . The power pin 208 is located within the power pin feedthrough 206 . The power pins 208 are conductive rods made of metal such as aluminum or steel for conducting RF power to the support ring 112 or to the electrodes EL within the support ring 112 . The tip of the power pin 208 is in contact with the electrode EL to provide RF power to the electrode EL. The middle portion of the power pin feedthrough 206 is encased within a mount 216A made of an insulator material.

An O-ring 214 is positioned over and adjacent to the mount 216A to seal the mount 216A against the power pin feedthrough 206 . O-ring 214 surrounds the bottom portion of power pin feedthrough 206 . Examples of O-rings described here are rings made of metal such as aluminum or steel. Additionally, another O-ring 204 is positioned at the top portion of the power pin feedthrough 206 to prevent air between the power pin 208 and the power pin feedthrough 206 from entering the plasma within the plasma chamber containing the system 200 therein. . There is no vacuum between the power pin 208 and the power pin feedthrough 206 . O-ring 204 surrounds the top portion of power pin feedthrough 206 .

It should be noted that in some embodiments, multiple power pins are used. For example, two power pins are used to provide power to the electrode EL at multiple locations, the power pins can be connected to the power pin feedthrough, the O-ring around each bottom portion of the power pin feedthrough, and the surrounding O-rings are used with each top portion of the power pin feedthrough.

The stand-off RF voltage is generated from the RF power of the RF signal received from the auxiliary RF generator through auxiliary matching. The isolated RF voltage has a traceable distance 213 from the vertically oriented inner surface 203 of the cover ring 201 to the ground ring 114 . The isolated RF voltage is generated via the traceable distance 213 from the vertically oriented inner surface 203 to the ground ring 114 . It should be noted that in some embodiments, the annular width of the cover ring 201 is selected such that the traceable distance 213 between the edge ring 228 and the ground ring 114 is sufficient to lose less than a predetermined amount of RF voltage from the edge ring 228 to the ground ring 114 . For example, if the predetermined amount of isolation voltage to be achieved at the vertically oriented inner surface 203 of the cover ring 201 is 5000 volts (V), and the cover ring 201 dissipates 7 and 10 volts per thousandth of an inch Between voltages, the ring width of the cover ring 201 is selected such that the traceable distance 213 or the ring width is a multiple (such as two or three times) of 5000 volts and a ratio of 10 volts. For illustration, the ratio is (2*5000)/10 volts. The traceable distance 213 is in the x-y plane of the cross-section of the cover ring 201 . The x-y plane is formed by the x-axis and the y-axis and is located between the x-axis and the y-axis.

In some embodiments, a plurality of power pin feedthroughs are coupled to the support ring 112 to provide RF power. Each power pin feedthrough has a power pin.

In some embodiments, the ground ring 114 is coated with a conductive material such as alumina to increase the conductivity of the ground ring 114 .

In many embodiments, the gel layer 110C is placed at various locations along the lower surface of the edge ring 228 and along the upper surface of the support ring 112 and the chuck 104, so as to be between the edge ring 228 and the support ring 112 and Electrical and thermal conductivity is provided between the edge ring 228 and the chuck 104 .

FIG. 3A is a diagram of an embodiment of a system 300 . Each hold down rod 302A and 302B is inserted through a respective slot in the bottom surface 308 of the support ring 112 . For example, compression rod 302A is inserted into a first slot in bottom surface 308 at location L1 to secure support ring 112 to insulator ring 106 at location L1 . Similarly, compression rod 302B is inserted into a second slot in bottom surface 308 at location L2 to secure support ring 112 to insulator ring 106 at location L2. As another example, each compression rod 302A and 302B has threads on its top portion, and the threads match the threads of the respective grooves formed in the bottom surface 308 . As yet another example, each compression rod 302A and 302B has a spring-based retractable and extendable mechanism that retracts prior to insertion into the respective slot in bottom surface 308 and extends after insertion.

It should be noted that the size of each through-hole formed along the length measured along the y-axis of the support ring 112 varies with the outer diameter (OD) and inner diameter (ID) of the support ring 112 . The inner diameter of the support ring 112 varies with the diameter of the chuck 104 of FIGS. 1 and 2 .

In various embodiments, any number of compression rods, such as two or more than two, are used to couple to the support ring 112 .

FIG. 3B is an isometric view illustrating the coupling of the compression rod 302A to the bottom surface 308 of the support ring 112 . Formed in the bottom surface is a slot 330 that extends partially along the length of the support ring 112 . The length of the support ring 112 is along the y-axis. The tank 330 is fitted with a receptacle 332 made of a metal such as aluminum or steel or titanium or an alloy of aluminum or an alloy of steel or an alloy of titanium. For example, receiver 332 is attached to the surface of slot 330 via an attachment mechanism such as threads. For further illustration, slot 330 has a receiver 332 with The threads engaged by the threads. The tip of the compression rod 302A is inserted into the receptacle 332 to engage the receptacle 332 to connect the compression rod 302A to the support ring 112 .

4 is a side view of an embodiment of a system 900 for securing edge ring 924 and support ring 112 to insulator ring 106 . Examples of edge ring 924 include edge ring 108 of FIG. 1 and edge ring 228 of FIG. 2 . System 900 includes fastening mechanism 920A, insulator ring 106 , support ring 112 , and edge ring 924 . Clasp mechanism 920A includes air cylinder 912 , pneumatic piston 922 , threaded adapter 908 , press connector 906 , and mount 604A for mounting compression rod 302A to insulator wall 230 . Mount 604A is mounted to insulator wall 230 by a plurality of shoulder screws 902 . The clasp mechanism 920A is coupled to a plurality of air fittings 914 including an air fitting 914A and an air fitting 914B at one side of the clasp mechanism 920A. The fastening mechanisms described herein are made of metals such as steel, aluminum, steel alloys, or aluminum alloys. In addition, the air fitting 914 is also made of metal such as steel, aluminum, an alloy of steel, or an alloy of aluminum.

The piston 922 has a piston body 916 and a piston rod 918 . Piston body 916 is tied within cylinder 912 . Piston body 916 has a larger diameter than piston rod 918 . Piston body 916 is integral with or attached to piston rod 918 . The mount 604A is attached to the cylinder 912 by a plurality of screws 910 at the top surface of the cylinder 912 . Threaded adapter 908 is inserted into central opening 930 of mount 604A. Threaded adapter 908 fits into a groove formed in the top surface of piston rod 918 . Additionally, the threaded adapter 908 has a groove for fitting the press connector 906 within the groove. The press connector 906 is fitted with a compression rod 302A which is inserted through the central opening 930 of the mount 604A. The press connector 906 is attached to, such as screwed onto, the bottom portion of the press bar 302A.

Similarly, another compression rod 302B (FIG. 3A) is coupled to another pneumatic mechanism of clasp mechanism 920B, which is described below. For example, clasping mechanism 920B includes a piston, such as piston 922, that is coupled to compression rod 302B to move compression rod 302B up and down in a vertical direction along the y-axis. The compression rod 302A has threads 932 at its tip for mating with corresponding threads 934 of a groove 931 formed in the bottom surface 308 of the support ring 112 . The top portion PR1 of the compression rod 302A passes through the bottom surface of the support ring 112 Extends into a slot in the support ring 112 , while the middle portion PR2 of the compression rod 302A extends through a through hole in the insulator ring 106 . Similarly, the top portion of compression rod 302B extends into a groove in the bottom surface of support ring 112 , while the middle portion of compression rod 302B extends into a through hole in insulator ring 106 .

As noted above, support ring 112 is physically connected to edge ring 924 via one or more fasteners. Pressure is created by the air below the lower surface of the piston body 916 when air is supplied to the lower portion of the cylinder 912 via the air fitting 914B. Due to the pressure generated below the lower surface of the piston body 916, the piston 922 moves in a vertically upward direction along the y-axis to push the compression rod 302A upward. When the compression rod 302A is pushed upward, the support ring 112 is lifted in a vertically upward direction relative to the insulator ring 106 . Concurrently with support ring 112 , edge ring 924 is also lifted in a vertically upward direction away from insulator ring 106 . The support ring 112 and the edge ring 924 are pushed away from the insulator ring 106 in a vertically upward direction for removal of the support ring 112 and the edge ring 924 from the plasma chamber. Support ring 112 and edge ring 924 are removed for replacement or repair of support ring 112, or edge ring 924, or a combination thereof.

On the other hand, when air is supplied to the upper portion of the cylinder 912 via the air fitting 914A, pressure is generated by the air above the upper surface of the piston body 916 . Due to the pressure developed above the upper surface of the piston body 916, the piston 922 moves in a vertically downward direction along the y-axis to pull the compression rod 302A downward. When the compression rod 302A is pulled downward, the support ring 112 is pulled downward in a vertically downward direction relative to the insulator ring 106 . Simultaneously with the support ring 112, the edge ring 924 is also pulled down towards the insulator ring 106 in a vertically downward direction. During processing of a substrate placed on chuck 104 , support ring 112 and edge ring 924 are pulled down toward insulator ring 106 for processing of the substrate placed on chuck 104 .

Figure 5 is an isometric view of an embodiment of a fastening mechanism 920A. Shown in FIG. 5 is one of the screws 910 and the mount 604A.

FIG. 6A is a diagram of an embodiment of a system 1100 illustrating the simultaneous pulldown of multiple compression rods 302A and 302B (FIG. 3A). System 1100 includes air route 1102A, fastening mechanism 920A, fastening mechanism 920B, and fastening mechanism 920C. Fastening mechanisms 920B and 920C have the same structure and function. As an example, clasping mechanisms 920A- 920C each have a double-acting cylinder. The clasp mechanism 920B is connected to the compression rod 302B by a mount, and the clasp mechanism 920C is connected to the compression rod by a mount.

The air route has multiple tubes as described herein, each of which is made of an insulator material, such as a combination of plastic and plasticizer, or plastic. The air lines are flexible and can be connected to upper or lower portions of the clasping mechanisms 920A-920C.

Air route 1102A includes a plurality of tubes 1106A, 1106B, 1106C, 1106D, and 1106E. Tubes 1106A and 1106D are connected to tube 1106B by connector C1 , and tubes 1106B and 1106E are connected to tube 1106C by connector C2. Each of the connectors described herein connecting multiple tubes has a hollow space to allow the passage of air through the hollow space. As an example, each connector connecting the plurality of tubes is made of insulator material.

Tube 1106D is connected to upper portion 1104A of clasp mechanism 920A by air fitting 914A (FIG. 4). Similarly, tube 1106E is connected to upper portion 1104C of clasping mechanism 920B by an air fitting, such as air fitting 914A, and tube 1106C is connected to upper portion 1104E of clasping mechanism 920C by an air fitting, such as air fitting 914A.

Air is supplied to the upper portion 1104A of the clasping mechanism 920A via tube 1106A, connector C1 , and tube 1106D. Similarly, air is supplied to upper portion 1104C of clasping mechanism 920B via tube 1106A, connector C1 , tube 1106B, connector C2, and tube 1106E. In addition, air is supplied to the upper portion 1104E of the clasping mechanism 920C via tube 1106A, connector C1 , tube 1106B, connector C2, and tube 1106C. When air is supplied to upper portions 1104A, 1104C, and 1104E, the pistons of clasping mechanisms 920A-920C are synchronously (such as simultaneously) pulled down along the y-axis to move support ring 112 ( FIG. 4 ) and edge ring 924 ( FIG. 4 ) toward The insulator ring 106 (FIG. 4) moves.

As described below, there are multiple cartridge seals around the power pin 208, the compression rods 302A and 302B, and the temperature probe shaft. These cartridge seals apply pressure to support ring 112 in a vertically upward direction along the y-axis. Afterburner. The clasp mechanisms 920A-920C overcome an upward force in a vertically upward direction to prevent the support ring 112 from lifting upwardly relative to the chuck in the vertical direction. Additionally, the clasping mechanisms 920A- 920C apply a clamping force to the gel layers 110B and 110C ( FIGS. 1 and 2 ) between the edge ring 924 and the chuck 104 . The double-acting cylinder exerts a constant force on the support ring 112 in a vertically upward direction or in a vertically downward direction independent of the temperature of the support ring 112 .

6B is a diagram of an embodiment of a system 1150 illustrating the simultaneous push-up of multiple compression rods 302A and 302B (FIG. 3A). System 1150 includes air route 1102B, fastening mechanism 920A, fastening mechanism 920B, and fastening mechanism 920C.

Air route 1102B includes a plurality of tubes 1106F, 1106G, 1106H, 1106I, and 1106J. Tubes 1106F and 1106I are connected to tube 1106G by connector C3, and tubes 1106G and 1106J are connected to tube 1106H by connector C4. Tube 11061 is connected to lower portion 1104B of clasping mechanism 920A by air fitting 914B (FIG. 4). Similarly, tube 1106J is connected to lower portion 1104D of clasping mechanism 920B by an air fitting, such as air fitting 914B, and tube 1106H is connected to lower portion 1104F of clasping mechanism 920C by an air fitting, such as air fitting 914B.

Air is supplied to the lower portion 1104B of the clasping mechanism 920A via tube 1106F, connector C3, and tube 1106I. Similarly, air is supplied to the lower portion 1104D of the clasping mechanism 920B via tube 1106F, connector C3, tube 1106G, connector C4, and tube 1106J. In addition, air is supplied to the lower portion 1104F of the clasping mechanism 920C via tube 1106F, connector C3, tube 1106G, connector C4, and tube 1106H. When air is supplied to lower portions 1104B, 1104D, and 1104F, the pistons of clasping mechanisms 920A-920C are pushed up synchronously (such as simultaneously) along the y-axis to support ring 112 ( FIG. 4 ) and edge ring 924 ( FIG. 4 ). Movement away from insulator ring 106 (FIG. 4).

FIG. 7 is a block diagram of an embodiment of a system 1200 to illustrate the supply of air to the fastening mechanisms 920A-920C. System 1200 includes a plurality of air compressors 1202A and 1202B, a plurality of air pressure regulators 1204A and 1204B, a plurality of orifices 1206A and 1206B, air routes 1102A and 1102B, and fastening Mechanisms 920A to 920C. Air compressor 1202A is coupled to the upper portion of clasp mechanisms 920A-920C by regulator 1204A and orifice 1206A and air line 1102A. Similarly, air compressor 1202B is coupled to the lower portion of clasp mechanisms 920A-920C via regulator 1204B and orifice 1206B and air line 1102B.

Air compressor 1202A compresses air to produce compressed air. Compressed air is supplied to air pressure regulator 1204A. The air pressure regulator 1204A controls (such as varies) the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air having the predetermined air pressure to the upper portion of the clasp mechanism 920A via the orifice 1206A and the air route 1102A . An example of a predetermined air pressure described herein is an air pressure of 28 pounds per square inch (psi). Other examples of predetermined air pressures as described herein are air pressures ranging between 25 psi and 31 psi.

Similarly, air compressor 1202B compresses air to produce compressed air. Compressed air is supplied to air pressure regulator 1204B. The air pressure regulator 1204B controls (such as varies) the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air having the predetermined air pressure to the lower portion of the fastening mechanism 920B through the orifice 1206B and the air route 1102B .

FIG. 8A is an isometric view of an embodiment of an edge ring 228 . The edge ring 228 has a top surface 1604 . FIG. 8A illustrates a perspective view of a plurality of fastener holes 124A, 124B, and 124C formed within the bottom surface 1612 of the edge ring 228 .

In some embodiments, any other number of fastener holes, such as six or nine fastener holes, are formed in bottom surface 1612 for fitting the same number of fasteners within each hole. For example, the distance between two adjacent holes of one set formed in the bottom surface 1612 of the edge ring 228 is the distance between two adjacent holes of another set formed in the bottom surface 1612 of the edge ring 228. The distance is the same. For purposes of illustration, any one of the two adjacent holes of the set may or may not be the same as one of the other set of two adjacent holes.

FIG. 8B is a top view of an embodiment of edge ring 228 . Edge ring 228 has an inner diameter ID1 and an outer diameter OD1 . The outside diameter OD1 ranges from about 13.6 inches inclusive to about 15 inches. As another example, the outer diameter OD1 ranges from about 13.6 inches inclusive to about 16 inches. As yet another example, the outer diameter OD1 ranges from about 12 inches inclusive to about 18 inches. When the outer diameter OD1 exceeds 13.6 inches, such as greater than 14 inches or closer to 15 inches, the likelihood of arcing from RF power between the edge ring 228 and the cover ring 118 is reduced. The inner diameter ID1 is the diameter of the inner periphery of the edge ring 228 and the outer diameter OD1 is the diameter of the outer periphery of the edge ring 228 . Top surface 1604 is visible in a top view of edge ring 228 .

Figure 8C is a cross-sectional view of the edge ring 228 along the A-A cross-section depicted in Figure 8B. The edge ring 228 has a top surface 1604 (sometimes referred to herein as the top side) and a bottom surface 1612 (which is sometimes referred to herein as the bottom side). Each of the top surface 1604 and the bottom surface 1612 are horizontally oriented surfaces. Top surface 1604 is sometimes referred to herein as the top side. The edge ring 228 further has an inner surface 1620 (sometimes referred to herein as the inner side) and an outer surface 1614 (which is sometimes referred to herein as the outer side). Outer surface 1614 is a vertically oriented surface. It should be noted that the edge ring 228 has an annular body, such as a circular body, or an annular body, or a disc-shaped body.

Edge ring 228 has a step 1622 that includes an angled inner surface 1606 and a horizontally oriented inner surface 1608 . The angled inner surface 1606 forms an angle A2 that is about 15° or about 50° relative to the vertically oriented inner surface 1610 . In one embodiment, angle A2 ranges between about 5° and about 55°. In another embodiment, angle A2 ranges between about 12° and about 20°. In yet another embodiment, angle A2 ranges between about 10° and about 20°. The angled inner surface 1606 adjoins the top surface 1604 . For example, angled inner surface 1606 forms a radius R3 relative to top surface 1604 . For purposes of illustration, radius R3 is at most about 0.01 inches. For example, a curve having a radius R3 is formed between the angled inner surface 1606 and the top surface 1604 . As an example, radius R3 ranges from about 0.009 inches (inclusive) to about 0.011 inches.

Horizontally oriented inner surface 1608 adjoins angled inner surface 1606 . For example, horizontally oriented inner surface 1608 forms a radius R4 relative to angled inner surface 1606 . To illustrate, Radius R4 is approximately 0.032 inches. For example, a curved line having radius R4 is formed between horizontally oriented inner surface 1608 and angled inner surface 1606 . As an example, radius R4 ranges from about 0.003 inches (inclusive) to about 0.0034 inches. The median diameter (MD) of edge ring 228 where radius R4 is formed is about 11.858 inches. For example, the median diameter ranges from about 11.856 inches inclusive to about 11.86 inches.

A horizontally oriented surface as described herein is substantially parallel to the x-axis, and a vertically oriented surface as described herein is substantially parallel to the y-axis. For example, horizontally oriented surfaces form an angle ranging from -5° to +5° relative to the x-axis, while vertically oriented surfaces form an angle ranging from -5° to +5° relative to the y-axis. To illustrate, a horizontally oriented surface is parallel to the x-axis and perpendicular to the y-axis, while a vertically-oriented surface is parallel to the y-axis and perpendicular to the x-axis. An angled surface as described herein is a surface that is neither vertically oriented nor horizontally oriented.

Horizontally oriented inner surface 1608 is separated from top surface 1604 by angled inner surface 1606 . For example, angled inner surface 1606 is adjacent to top surface 1604 and horizontally oriented inner surface 1608 , but horizontally oriented inner surface 1608 is not adjacent to top surface 1604 .

Additionally, inner surface 1620 has a vertically oriented inner surface 1610 that adjoins horizontally oriented inner surface 1608 . For example, vertically oriented inner surface 1610 forms a radius R5 relative to horizontally oriented inner surface 1608 . To illustrate, a curved line having radius R5 is formed between vertically oriented inner surface 1610 and horizontally oriented inner surface 1608 . As an example, radius R5 is about 0.012 inches. To illustrate, radius R5 ranges from about 0.007 inches (inclusive) to about 0.017 inches. The distance d3 of the vertically oriented inner surface 1610 along the y-axis is about 0.0169 inches. For example, distance d3 ranges from about 0.0164 inches (inclusive) to about 0.0174 inches. The distance of the vertically oriented surface is the length along the y-axis in a direction perpendicular to the vertically oriented surface. In addition, the distance of the horizontally oriented surface is the width of the horizontally oriented surface along the x-axis in the horizontal direction. In addition, the distance of the angled surfaces is measured in the vertical direction along the y-axis. Vertically oriented inner surface 1610 has an inner diameter ID1 of approximately 11.7 inches. For example, the inner diameter ID1 ranges from about 11 inches (inclusive) to about 12.4 inches.

Additionally, inner surface 1620 has an angled inner surface 1618 that is angled relative to vertically oriented inner surface 1610 and bottom surface 1612 . The angled inner surface 1618 adjoins the vertically oriented inner surface 1610 . For example, angled inner surface 1618 forms a radius R6 relative to vertically oriented inner surface 1610 . To illustrate, a curved line having a radius R6 is formed between the angled inner surface 1618 and the vertically oriented inner surface 1610 . As an example, radius R6 is about 0.015 inches. To illustrate, radius R6 ranges from about 0.0149 inches (inclusive) to about 0.0151 inches. Additionally, an angled inner surface 1618 adjoins bottom surface 1612 . For example, angled inner surface 1618 forms a radius R7 relative to bottom surface 1612 . To illustrate, a curved line having a radius R7 is formed between the angled inner surface 1618 and the bottom surface 1612 . As an example, radius R7 is about twice radius R6. To illustrate, radius R6 ranges from about 2 x 0.0149 inches inclusive to about 2 x 0.0151 inches.

Angled inner surface 1618 has a length d2 of about 0.035 inches. For example, length d2 ranges from about 0.0345 inches (inclusive) to about 0.0355 inches. Angled inner surface 1618 forms an angle A1 of about 30° relative to vertically oriented inner surface 1610 . For example, angle A1 ranges from about 28° (inclusive) to about 32°. It should be noted that the combination of angled inner surface 1606 , horizontally oriented inner surface 1608 , vertically oriented inner surface 1610 , and angled inner surface 1618 is sometimes referred to herein as the inner side of edge ring 228 .

Outer surface 1614 is contiguous with bottom surface 1612 , such as adjacent to or continuous with bottom surface 1612 . For example, outer surface 1614 forms a radius R2 relative to bottom surface 1612 . To illustrate, a curve having radius R2 is formed between outer surface 1614 and bottom surface 1612 . As an example, radius R2 is about 0.012 inches. To illustrate, radius R2 ranges between 0.0119 inches and 0.0121 inches.

Edge ring 228 includes a curved edge 1616 formed between top surface 1604 and outer surface 1614 of edge ring 228 . For example, curved edge 1616 is adjacent to top surface 1604 and outer surface 1614 , such as beside top surface 1604 and outer surface 1614 . Curved edge 1616 has a radius R1. For example, radius R1 is about 0.1 inches. For purposes of illustration, radius R1 ranges between 0.8 inches and 0.12 inches. The curvature of the curved edge 1616 reduces the risk of arcing of RF power between the edge ring 228 and the cover ring 201. possibility. Arcing occurs when a plasma is formed and maintained within a plasma chamber. Sharp edges increase the possibility of arcing. The distance d1 of the sum of the height of the curved edge 1616 along the y-axis and the perpendicular distance along the length of the outer surface 1614 along the y-axis is about 0.23 inches. As an example, distance d1 ranges from about 0.229 inches (inclusive) to about 0.231 inches. As an example, outer surface 1614 has an outer diameter OD1 of about 14.06 inches, with outer diameter OD1 ranging between 13.5 inches and 14.5 inches. It should be noted that the inner diameter or outer diameter or intermediate diameter of the edge ring described herein is formed relative to a central axis passing through the centroid of the edge ring.

It should be noted that the edge loops described here are consumable. For example, after multiple uses of an edge ring for processing substrates, the edge ring may wear out. To illustrate, the residual material was output after the plasma used to process the substrate, and the residual material etched the edge ring. In addition, the plasma corrodes the edge rings.

Furthermore, the edge rings are replaceable. For example, after the edge ring is reused, the edge ring is replaced. To illustrate, the edge ring is pushed vertically up and away from the insulator ring 106 ( FIG. 2 ) using the compression bars 302A and 302B of FIG. 3A to release from the insulator ring 106 of FIGS. 1 and 2 . The edge ring is then replaced with another edge ring. The other edge rings are then pulled vertically down toward the insulator ring 106 using the compression rods 302A and 302B for processing the substrate or another substrate.

In some embodiments, each radius R1-R7 of the edge of edge ring 228 is greater than about 0.03 inches to reduce the possibility of arcing from RF power toward or away from the edge. To further illustrate, each radius R1-R7 of the edge of edge ring 228 ranges from about 0.03 inches inclusive to about 0.1 inches to reduce the possibility of arcing from RF power toward or away from the edge. It should be noted that in many embodiments, each radius R1 to R7 is greater than a range from about 0.01 inches (inclusive) to about 0.03 inches. A radius from about 0.01 inches (inclusive) to about 0.03 inches reduces the likelihood of edge chipping of the radii during fabrication of semiconductor wafers.

In one embodiment, the edge ring 228 has a plurality of edges. In one embodiment, the edges defining edge ring 228 are rounded. For example, the edges of edge ring 228 having radii RA and RC (shown in FIG. 9E below) are rounded to a radius of about 0.03 inches or greater. determined when the plasma chamber is operating When moderate, the lower degree of rounding of these edges may not be sufficient to prevent or reduce the possibility of arcing from RF power. Due to the sharper feature edges within the plasma chamber, the reduced likelihood of arcing can be detrimental to manufacturing processes performed on and above the semiconductor wafer. Slight edge rounding (e.g. less than about 0.03 inches each of radii RA and RC (as shown below in Figure 9E), each of radii RA and RC (as shown below in Figure 9E) ranging from about 0.01 inches inclusive to about 0.03 inches), which helps reduce particle generation during the fabrication of semiconductor wafers, or the possibility of edge chipping during fabrication. Thus, although some rounding is performed on the surface of features disposed within the plasma chamber, such as radii RA and RC (as shown below in FIG. 9E ), given the increased power levels used in plasma processing operations To be precise, this degree of rounding is less than the degree of rounding used to prevent or reduce arcing.

FIG. 8D is a diagram of an embodiment of a system 1650 to illustrate the coupling of fastener 122 to edge ring 228 . The cross-sectional view of the edge ring 228 is taken along the cross-section a-a shown in FIG. 8A. Grooves 125 are drilled into bottom surface 1612 of edge ring 228 . In addition to drilling the slot 125, threads 1652 are formed on the side surface SS of the slot 125. Side surface SS is substantially vertical, such as vertical or ranging between 85° and 95° relative to top surface TS of slot 125 . Slot 125 surrounds fastener hole 124A.

The fastener 122 has threads 1654 formed at the tip of the fastener 122 . Additionally, fastener 122 has a body 1658 underlying threads 1654 . The head 1660 of the fastener 122 is tied below the body 1658 .

Fastener 122 is inserted into fastener hole 124A and turned in a clockwise direction to engage threads 1654 with threads 1652 to connect support ring 112 ( FIG. 1 ) with edge ring 228 . Similarly, additional fasteners, such as fastener 122 , are inserted into fastener holes 124B and 124C to connect support ring 112 with edge ring 228 . A plurality of fastener holes 124B and 124C are formed in respective slots in bottom surface 1612 of edge ring 228 . For example, fastener holes 124A- 124C form the vertices of an equilateral triangle in the horizontal plane of bottom surface 1612 of edge ring 228 . Where more than three fastener holes are formed in the bottom surface 1612, the fastener holes are located at substantially equal, such as equal, distances. For example, on the bottom surface The distance between one set of two adjacent fastener holes in 1612 is the same as the distance between the other set of two adjacent fastener holes in bottom surface 1612 . When at least one of the fastener holes of the set is not identical to one of the fastener holes of the other set, the two fastener holes of one set are different from the two fastener holes of the other set. To illustrate, two different sets of fastener holes have at least one unusual fastener hole. As another example, within the bottom surface 1612, the distance between the set of two adjacent fastener holes is within a predetermined limit from the distance between the other set of two adjacent fastener holes. When support ring 112 is connected to edge ring 228 and either edge ring 228 or support ring 112 is moved, edge ring 228 and support ring 112 move simultaneously either vertically along the y-axis or horizontally along the x-axis.

FIG. 9A is an isometric view of an embodiment of a cover ring 202 . In some embodiments, cover ring 202 is used instead of cover ring 201 of FIG. 2 . The cover ring 202 has a top surface 1704 . It should be noted that the cover rings described here are consumable. For example, after multiple uses of the cover ring during processing of the substrate, the cover ring may wear out. To illustrate, since the substrate is processed by the plasma, residual material is generated and corrodes the cover ring. Additionally, the plasma corrodes the cover ring.

Furthermore, the cover ring is replaceable. For example, after reusing the cover ring, the cover ring is replaced. For illustration, the cover ring is removed from the plasma chamber for replacement with another cover ring.

FIG. 9B is a bottom view of an embodiment of the cover ring 202 . The cover ring has a bottom surface 1705 .

FIG. 9C is a top view of an embodiment of cover ring 202 . Cover ring 202 has an inner diameter ID2 and a width W1. The inner diameter ID2 is the diameter of the inner periphery of the cover ring 202 . The width W1 is the width of the annular body of the cover ring 202 between the inner diameter ID2 and the outer diameter of the cover ring 202 .

Figure 9D is a cross-sectional view of an embodiment of the cover ring 202 taken along cross-section A-A of Figure 9C. The cover ring 202 has a vertically oriented inner surface 1724 , another vertically oriented inner surface 1720 , a vertically oriented outer surface 1716 , another vertically oriented outer surface 1714 , and a vertically oriented outer surface 1710 . The diameter of the vertically oriented inner surface 1724 is ID2. Diameter ID2 is approximately 13.615 inches. For example, diameter ID2 ranges from about 13.4 inches inclusive to about 13.8 inches. In addition, the diameter of the vertically oriented inner surface 1720 Department D1. Diameter D1 is about 13.91 inches. For example, diameter D1 ranges from about 13.8 inches (inclusive) to about 14 inches. Additionally, the diameter of the vertically oriented outer surface 1716 is D2. Diameter D2 is approximately 14.21 inches. For example, diameter D2 ranges from about 14 inches (inclusive) to about 14.5 inches. The diameter of vertically oriented outer surface 1714 is D3 and the diameter of vertically oriented outer surface 1710 is OD2. Diameter D3 is about 14.38 inches. For example, diameter D3 ranges from about 14.2 inches inclusive to about 14.5 inches. The diameter OD2 is about 14.7 inches. For example, the diameter OD2 ranges from about 14 inches inclusive to about 15 inches.

Diameter D1 is larger than diameter ID2. Furthermore, diameter D2 is larger than diameter D1, and diameter D3 is larger than diameter D2. The diameter OD2 is larger than the diameter D3.

FIG. 9E is a cross-sectional view of an embodiment of the cover ring 202 . Cover ring 202 includes upper body portion 1730 , middle body portion 1732 , and lower body portion 1734 . Upper body portion 1730 has a vertically oriented outer surface 1710 , a horizontally oriented outer surface 1712 , another horizontally oriented inner surface 1722 , a vertically oriented inner surface 1724 , and a horizontally oriented top surface 1704 . A curved edge 1706 is formed between vertically oriented outer surface 1710 and top surface 1704 . Curved edge 1706 has a radius RC of about 0.06 inches. For example, radius RC ranges from about 0.059 inches (inclusive) to about 0.061 inches. Curved edge 1706 is contiguous, such as contiguous with or adjacent to top surface 1704 and vertically oriented outer surface 1710 .

Vertically oriented outer surface 1710 is adjoined by horizontally oriented outer surface 1712 . For example, a curve having a radius RD is formed between the vertically oriented outer surface 1710 and the horizontally oriented outer surface 1712 . Radius RD is about 0.015 inches. For example, radius RD ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Additionally, the horizontally-oriented inner surface 1722 adjoins the vertically-oriented inner surface 1724 . For example, a curved line having a radius RK is formed between the vertically oriented inner surface 1724 and the horizontally oriented inner surface 1722 . For purposes of illustration, the radius RK is about 0.015 inches. As an example, radius RK ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Additionally, the top surface 1704 is adjoined by a vertically oriented inner surface 1724 . For example, a curve having a radius RA is formed between the vertically oriented inner surface 1724 and the top surface 1704 . For purposes of illustration, radius RA is about 0.015 inches. As an example, radius RA ranges from about 0.0145 inches (inclusive) to about 0.0155 inches. Radius RA reduces the likelihood of arcing of RF power between cover ring 202 and edge ring 228 . Arcing occurs during the formation of plasma within the plasma chamber.

Intermediate body portion 1732 includes a vertically oriented inner surface 1720 , a vertically oriented outer surface 1714 , and a horizontally oriented outer surface 1719 . Vertically-oriented outer surface 1714 is contiguous with horizontally-oriented outer surface 1712 of upper body portion 1730 . For example, a curved line having a radius RE is formed between the vertically oriented outer surface 1714 and the horizontally oriented outer surface 1712 . As an example, the radius RE is about 0.03 inches. To illustrate, radius RE ranges from about 0.029 inches (inclusive) to about 0.31 inches.

Additionally, the vertically oriented inner surface 1720 is contiguous with the horizontally oriented inner surface 1722 of the upper body portion 1730 . For example, a curve having a radius RB is formed between the horizontally oriented inner surface 1722 and the vertically oriented inner surface 1720 . As an example, the radius RB is about 0.01 inches. To illustrate, radius RB ranges from about 0.09 inches (inclusive) to about 0.011 inches.

Horizontally oriented outer surface 1719 adjoins vertically oriented outer surface 1714 . For example, a curve having a radius RF is formed between the horizontally oriented outer surface 1719 and the vertically oriented outer surface 1714 . As an example, the radius RF is about 0.015 inches. To illustrate, radius RF ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Lower body portion 1734 includes a vertically oriented inner surface 1736 , a bottom surface 1718 , and the vertically oriented outer surface 1716 . Vertically-oriented inner surface 1736 is contiguous with vertically-oriented inner surface 1720 of intermediate body portion 1732 . For example, vertically oriented inner surfaces 1720 and 1736 are integrated as one surface and have the same diameter Dl (FIG. 9D). Vertically oriented inner surface 1736 is adjacent to bottom surface 1718 . For example, a curve having radius RJ is between vertically oriented inner surface 1736 and bottom surface 1718 form. As an example, radius RJ is about 0.02 inches. To illustrate, radius RJ ranges from about 0.019 inches (inclusive) to about 0.021 inches.

Vertically oriented outer surface 1716 is adjacent to bottom surface 1718 . For example, a curved line having a radius RH is formed between bottom surface 1718 and vertically oriented outer surface 1716 . As an example, radius RH is about 0.02 inches. To illustrate, radius RH ranges from about 0.019 inches (inclusive) to about 0.021 inches.

Vertically-oriented outer surface 1716 is contiguous with horizontally-oriented outer surface 1719 of intermediate body portion 1732 . For example, a curve having a radius RG is formed between the vertically oriented outer surface 1716 and the horizontally oriented outer surface 1719 . For example, radius RG is about 0.01 inches. To illustrate, radius RG ranges from about 0.09 inches (inclusive) to about 0.011 inches.

A vertical distance dB (such as a distance along the y-axis) is formed between the horizontally oriented inner surface 1722 and the top surface 1704 . As an example, the vertical distance dB is about 0.27 inches. To illustrate, the vertical distance dB ranges from about 0.25 inches (inclusive) to about 0.29 inches.

Additionally, a vertical distance dA is formed between the horizontally-oriented outer surface 1712 and the horizontally-oriented inner surface 1722 . As an example, distance dA is about 0.011 inches. To illustrate, distance dA ranges from about 0.009 inches (inclusive) to about 0.013 inches.

Additionally, the vertical distance between the horizontally-oriented inner surface 1722 and the horizontally-oriented outer surface 1719 is dD. As an example, distance dD is approximately 0.172 inches. To illustrate, distance dD ranges from about 0.17 inches (inclusive) to about 0.174 inches.

Additionally, the vertical distance between the horizontally-oriented inner surface 1722 and the horizontally-oriented bottom surface 1718 is denoted as dC. As an example, the distance dC is about 0.267 inches. To illustrate, distance dC ranges from about 0.265 inches (inclusive) to about 0.269 inches.

It should be noted that bottom surface 1705 of cover ring 202 includes horizontally oriented inner surface 1722, vertically oriented inner surfaces 1720 and 1736, bottom surface 1718, vertically oriented outer surface 1716, horizontally oriented outer surface 1719, vertically oriented outer surface 1714 , and a horizontally oriented outer surface 1712.

It should further be noted that all edges of cover ring 202 are arcuate, such as curved. For example, radii RA, RB, RC, RD, RE, RF, RG, RH, RJ, and RK define the edges of arcs.

9F is a cross-sectional view of an embodiment of a system including edge ring 228 , cover ring 202 , base ring 210 , and ground ring 212 . A stepped reduction 1726 is formed that includes a change in direction from the vertically oriented inner surface 1724 to the vertically oriented inner surface 1720 . The stepped reduction 1726 is in a horizontal direction along the x-axis, such as the +x or x-direction. The stepped reduction 1726 is tied between the upper body portion 1730 and the middle body portion 1732 . The stepped reduction 1726 is tied in the +x direction away from the edge ring 228 .

In addition, another stepped reduction 1729 is formed, which occurs from the vertically oriented outer surface 1710 to the vertically oriented outer surface 1714 . Again, stepped reduction 1729 is oriented in a horizontal direction, such as the -x direction of the x-axis, except that stepped reduction 1729 is oriented in the opposite direction to stepped reduction 1726 . The stepped reduction 1729 is in a direction towards the edge ring 228 .

A depth 1762 is formed, which is the distance from the horizontally-oriented inner surface 1722 to the horizontally-oriented outer surface 1719 of the intermediate body portion 1732 . Depth as used herein refers to the direction of the y-axis, such as the -y direction.

Additionally, another stepped reduction 1728 is formed from vertically oriented outer surface 1714 to vertically oriented outer surface 1716 . The stepped reduction 1728 is tied in the -x direction.

Another depth 1764 is formed between the horizontally oriented outer surface 1719 and the bottom surface 1718 of the lower body portion 1734 . Depth 1764 is the depth of lower body portion 1734 . It should be noted that depth 1764 is less than depth 1762. Additionally, the depth of vertically oriented inner surface 1724 is greater than depth 1762 .

Annular width 1746 is created between vertically oriented inner surface 1720 and vertically oriented outer surface 1714 . Annular width as used herein is along the x-axis. In addition, another annular width 1754 is tied at A vertically oriented inner surface 1736 is created between a vertically oriented outer surface 1716 . Annular width 1754 is less than annular width 1746 .

Traceable distance 1735 is tied between edge ring 228 and ground ring 212 . Trackable distance 1735 is along width L11 of horizontally oriented inner surface 1722, combined length L12 of vertically oriented inner surfaces 1720 and 1736, width L13 of bottom surface 1718, length L14 of vertically oriented outer surface 1716, and horizontally oriented Width L15 of outer surface 1719 . Combined length L12 is the sum of the length of vertically oriented inner surface 1720 and the length of vertically oriented inner surface 1736 . Traceable distance 1735 is the path along which the voltage received from RF power pin 208 is dissipated along cover ring 202 . The edge ring 228 acts as one capacitor plate of the capacitor and the electrode EL (FIG. 2) acts as the other capacitor plate of the capacitor with the dielectric material of the support ring 112 between the two capacitor plates. Distance 1 is the horizontal distance along the x-axis between edge ring 228 and ground ring 212 for dissipating the voltage provided by RF power pin 208 .

Traceable distance 1735 or distance 1 defines the annular width of cover ring 202 . Furthermore, the voltage dissipation along traceable distance 1735 or distance 1 defines the annular width of cover ring 202 . The annular width of the cover ring 202 is the difference between the inner diameter ID2 of the cover ring 202 and the outer diameter OD2 of the cover ring 202 . The annular width of the cover ring 202 is defined such that a predetermined amount of isolation voltage is achieved at the vertically oriented inner surface 1724 . For example, with 7-10 volts dissipated along a thousandth of an inch of the cover ring 202 and an isolation voltage of 5000 volts at the vertically oriented inner surface 1724, the annular width of the cover ring 202 is equal to A ratio of a multiple of 5000 volts, such as two or three times, to a dissipation of 7-10 volts per thousandth of an inch of cover ring 202 .

In some embodiments, depth 1764 is greater than depth 1762 . Furthermore, in many embodiments, the depth of vertically oriented inner surface 1724 is less than depth 1762 .

9G is a cross-sectional view of an embodiment of a system including edge ring 108 , cover ring 118 , base ring 116 , and ground ring 114 . Cover ring 118 includes an upper body portion 1761 , a middle body portion 1763 , and a lower body portion 1765 .

Upper body portion 1761 includes a vertically oriented inner surface 1782 , a horizontally oriented top surface 1766 , a vertically oriented outer surface 1768 , and a horizontally oriented outer surface 1770 . Vertically oriented outer surface 1768 adjoins top surface 1766 , while horizontally oriented outer surface 1770 adjoins vertically oriented outer surface 1768 . For example, a curved line with a radius is formed between vertically oriented outer surface 1768 and top surface 1766 , while a curved line with a radius is formed between horizontally oriented outer surface 1770 and vertically oriented outer surface 1768 . Additionally, a vertically oriented inner surface 1782 adjoins top surface 1766 . For example, a curved line with a radius is formed between vertically oriented inner surface 1782 and top surface 1766 .

Intermediate body portion 1763 includes a vertically oriented outer surface 1772 , a vertically oriented inner surface 1780 , and a horizontally oriented inner surface 1781 . Vertically oriented outer surface 1772 is contiguous with horizontally oriented outer surface 1770 of upper body portion 1761 . For example, a curved line with a radius is formed between the vertically oriented outer surface 1772 and the horizontally oriented outer surface 1770 .

Additionally, vertically-oriented inner surface 1780 is contiguous with, such as adjacent to, vertically-oriented inner surface 1782 . To illustrate, vertically oriented inner surface 1782 lies in the same vertical plane as vertically oriented inner surface 1780 .

Horizontally oriented inner surface 1781 adjoins vertically oriented inner surface 1780 . For example, a curved line with a radius is formed between the horizontally oriented inner surface 1781 and the vertically oriented inner surface 1780 .

Lower body portion 1765 includes a vertically oriented outer surface 1774 , a horizontally oriented bottom surface 1776 , and a vertically oriented inner surface 1778 . Vertically-oriented inner surface 1778 is contiguous with horizontally-oriented inner surface 1781 of intermediate body portion 1763 . For example, a curved line with a radius is formed between the vertically oriented inner surface 1778 and the horizontally oriented inner surface 1781 .

Additionally, bottom surface 1776 is adjoined by vertically oriented inner surface 1778 . For example, a curved line with a radius is formed between bottom surface 1776 and vertically oriented inner surface 1778 .

Additionally, bottom surface 1776 is adjacent to vertically oriented outer surface 1774 . For example, a curved line with a radius is formed between bottom surface 1776 and vertically oriented outer surface 1774 . Vertically oriented outer surface 1774 lies in the same vertical plane as vertically oriented outer surface 1772 of intermediate body portion 1763 .

A stepped reduction 1783 is formed between the vertically oriented outer surface 1768 of the upper body portion 1761 and the vertically oriented outer surface 1772 of the middle body portion 1763 . The stepped reduction 1783 is tied in the −x direction towards the edge ring 108 .

In addition, another stepped reduction 1784 is formed from the vertically oriented inner surface 1780 of the intermediate body portion 1763 to the horizontally oriented inner surface 1781 of the intermediate body portion 1763 . The stepped reduction 1784 from the vertically oriented inner surface 1780 occurs in the +x direction away from the x-axis of the edge ring 108 .

An annular width 1786 is formed between the vertically oriented inner surface 1780 and the vertically oriented outer surface 1772 of the intermediate body portion 1763 . Ring width 1786 is along the x-axis. Additionally, another annular width 1788 is formed between the vertically oriented inner surface 1778 and the vertically oriented outer surface 1774 of the lower body portion 1765 . Ring width 1788 is along the x-axis. Annular width 1788 is less than annular width 1786 .

The depth 1790 of the intermediate body portion 1763 along the y-axis is formed from the horizontally oriented outer surface 1770 to the horizontally oriented inner surface 1781 . Additionally, another depth 1792 of lower body portion 1765 along the y-axis is formed from horizontally oriented inner surface 1781 to bottom surface 1776 . Depth 1792 is less than depth 1790.

Note that the bottom surface of cover ring 118 includes surfaces 1781 , 1778 , 1776 , 1774 , 1772 , and 1770 .

The traceable distance 1794 is formed between the edge ring 108 and the ground ring 114 . The trackable distance 1794 is along the following: the depth L21 of the vertically oriented inner surface 1780 along the y-axis, the width L22 of the horizontally oriented inner surface 1781 along the x-axis, the depth L23 of the vertically oriented inner surface 1778, and the bottom Surface 1776 has width L24. Depth L23 is the same as depth 1792. The traceable distance 1794 is the path along which the voltage received by the edge ring 108 reaches the ground ring 114 through the support ring 112 . The edge ring 108 acts as a capacitor for the electrical The container plate, while the electrode EL ( FIG. 2 ) acts as the other capacitor plate of the capacitor with the dielectric material of the support ring 112 between the two capacitor plates.

A distance 2 along the x-axis is formed between the edge ring 108 and the ground ring 114 . Distance 2 is smaller than distance 1 in FIG. 9F . Because the outer diameter of edge ring 228 of FIG. 9F is smaller than the outer diameter of edge ring 108 , upper body portion 1730 of cover ring 202 of FIG. 9F has a greater width than upper body portion 1761 of cover ring 118 . The increase in the width of upper body portion 1730 compared to the width of upper body portion 1761 increases Distance 1 compared to Distance 2 . The larger distance 1 compensates for the reduced width of edge ring 228 compared to edge ring 108 to provide a predetermined amount of distance for the RF voltage of the RF signal supplied by power pin 208 ( FIG. 2 ) to pass traceable distance 213 ( FIG. 2 ) or 1735 ( FIG. 9F ) through to ground ring 212 . For example, there is a loss of about 7 to about 10 volts per thousandth of an inch of the cover ring. If the predetermined isolation voltage of 5000V is to be achieved at the vertically oriented inner surface of the body portion above the cover ring, the annular width of the body portion above the cover ring is calculated as (positive real number X 5000)/(per thousandth Volt loss for a one-inch cover ring), where "positive real numbers" are multiples, such as 2 or 3 or 4.

In some embodiments, depth 1792 is greater than depth 1790 .

The embodiments described herein can be implemented using numerous computer system configurations including handheld hardware units, microprocessor systems, microprocessor-based or programmable consumer electronics, mini-computers, mainframe computers, etc. . The embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing hardware units that are linked through a network.

In some embodiments, the controller described herein is part of a system, which may be part of the examples described above. Such systems include semiconductor processing equipment that includes a processing tool or tools, a chamber or chambers, a platform or platforms for processing, and/or specific processing elements (wafer susceptors, gas flow systems, etc.). These systems are integrated with electronics used to control the operation of these systems before, during, and after semiconductor wafer or substrate processing. An electronic device is referred to as a "controller" which controls elements or subsections of a system or systems. According to the processing requirements of the system and And/or type, the controller is programmed to control any of the processes disclosed herein, including: delivery of process gases, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, RF generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfers to and from a tool and other transfer tools and/or load locks coupled or interfaced with the system.

Broadly speaking, in many embodiments, a controller is defined as having integrated circuits, logic, memory, and/or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. electronic equipment. An integrated circuit includes a chip in the form of firmware storing program instructions, a digital signal processor (DSP), a chip defined as an ASIC, a PLD, and/or one or more microprocessors or microprocessors that execute program instructions (such as software) controller. These program instructions are instructions communicated with the controller in the form of many individual settings (or program files), which define parameters, factors, variables, etc. for executing special processes for semiconductor wafers or systems. In some embodiments, the programming instructions are part of a recipe defined by a process engineer to create a pattern on one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or wafers One or more processing steps are completed during the fabrication of the die.

In some embodiments, the controller is part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller is part or all of the "cloud" or fab's mainframe computer system, allowing remote access for wafer processing. The computer may allow remote access to the system to monitor the current progress of a manufacturing operation, examine the history of past manufacturing operations, examine trends or performance metrics from a plurality of manufacturing operations, to change parameters of a current process, to set parameters after a current operation Process step or new process.

In some embodiments, a remote computer (such as a server) provides the recipe to the system via a network, which includes a local area network or the Internet. The remote computer includes a user interface that allows the input or programming of parameters and/or settings that are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specifically specifies one or more Parameters, factors, and/or variables for various processing steps to be performed during operation. It should be understood that parameters, factors, and/or variables are specific to the type of process to be performed and the type of tool the controller is configured to interface or control. Thus, as noted above, the controller is decentralized, such as by including one or more decentralized controllers that are networked together and work toward a common purpose, such as the process and control described herein. . An example of a decentralized controller for these purposes consists of one or more integrated circuits in a housing that communicates with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) circuits, combined to control the process in the chamber.

Without limitation, in various embodiments, example systems for applying the methods include plasma etch chambers or modules, deposition chambers or modules, spin-rinse chambers or modules, metal plating chambers or Module, Clean Chamber or Module, Bevel Etch Chamber or Module, Physical Vapor Deposition (PVD) Chamber or Module, Chemical Vapor Deposition (CVD) Chamber or Module, Atomic Layer Deposition (ALD) ) chamber or module, atomic layer etching (ALE) chamber or module, plasma enhanced chemical vapor deposition (PECVD) chamber or module, clean type chamber or module, ion implantation chamber or module Groups, orbital chambers or modules, and any other semiconductor processing systems associated with or used in the fabrication and/or production of semiconductor wafers.

Note further that in some embodiments, the above operations can be applied to some types of plasma chambers, for example: plasmas including inductively coupled plasma (ICP) reactors, transformer coupled plasma reactors, conductive tools, dielectric tools Chambers; plasma chambers containing electron cyclotron resonance (ECR) reactors, etc. For example, one or more RF generators are coupled to an inductor within the ICP reactor. Examples of the shape of the inductor include a solenoid, a dome-shaped coil, a flat-shaped coil, and the like.

As noted above, depending on the process step or steps to be performed by the tool, the host computer communicates with one or more of the following: other tool circuits or modules, other tool components, group tools, other tool interfaces, adjacent tools, adjacent tool, a tool located throughout the fab, a host computer, another controller, or a tool used for material transfer that carries containers of wafers to and from a tool location within a semiconductor production fab and/or load side.

After considering the above-described embodiments, it should be understood that some embodiments employ computer-implementable operations involving data stored in computer systems. These operations are those physical manipulations of physical quantities. Any of the operations described herein that form part of these embodiments are useful mechanical operations.

Some embodiments also relate to hardware units or devices for performing these operations. This device is purpose built for a special purpose computer. When defined as a special purpose computer, the computer performs other processing, program execution, or commonly used programs that are not part of the special purpose, but is still capable of operating for the special purpose.

In some embodiments, the operations may be performed by a computer selectively activated or configured by one or more computer programs stored in computer memory, cache memory, or available over a computer network . When data is obtained through a computer network, the data can be processed by other computers on the computer network (such as cloud computing resources).

One or more embodiments can also be embodied as computer readable code on a non-transitory computer readable medium. The non-transitory computer readable medium is any data storage hardware unit (such as a memory device, etc.) that stores data that is thereafter read by a computer system. Examples of non-transitory computer readable media include hard disk, network attached storage (NAS), ROM, RAM, compact disc ROM (CD-ROM), compact disc recordable (CD-R), compact disc (CD-RW), magnetic tape, and other optical and non-optical data storage hardware units. In some embodiments, the non-transitory computer-readable medium includes physical computer-readable media distributed over network-coupled computer systems such that computer-readable code is stored and executed in a distributed fashion.

Although the above method operations are described in a particular order, it should be understood that in many embodiments, other housekeeping operations are performed between the operations, or that the method operations are adjusted such that the operations occur at slightly different points in time, Or dispersed in a system that allows the method operations to occur over various time intervals, or performed in an order different from that described above.

It should also be noted that in one embodiment, one or more features from any of the embodiments described above are combined with one or more features of any other embodiment without departing from what is described in the many embodiments described in this disclosure. scope.

Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that several changes and modifications may be practiced within the scope of the appended claims. Accordingly, the present embodiments should be considered as illustrative rather than restrictive, and the embodiments are not limited to the details provided herein.

228‧‧‧edge ring

1604‧‧‧top surface

1606‧‧‧inner surface

1608‧‧‧inner surface

1610‧‧‧inner surface

1612‧‧‧Bottom surface

1614‧‧‧External surface

1616‧‧‧curved edge

1618‧‧‧inner surface

1620‧‧‧inner surface

1622‧‧‧steps

A1‧‧‧angle

A2‧‧‧angle

d1‧‧‧distance

d2‧‧‧length

d3‧‧‧distance

ID1‧‧‧inner diameter

MD‧‧‧intermediate diameter

OD1‧‧‧outer diameter

R1‧‧‧radius

R2‧‧‧radius

R3‧‧‧radius

R4‧‧‧radius

R5‧‧‧radius

R6‧‧‧radius

R7‧‧‧radius

Claims (32)

An edge ring for a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber, the edge ring comprising: the annular body having a bottom side , a top side, an inner side, and an outer side, wherein the bottom side is a horizontally oriented surface extending from a vertically oriented inner surface of the inner side to the outer side; a plurality of fastener holes are disposed along the bottom side on the In the annular body, each of the plurality of fastener holes has an inner surface for receiving threads of a fastener for attaching the annular body to a support ring; a step extending from the top side to the the vertically oriented inner surface of the inner side, wherein the step comprises an angled surface and a horizontally oriented inner surface; and a curved edge formed between the top side and the outer side, wherein the plurality of fastener holes are spaced at equal distances on the bottom side. An edge ring for a plasma processing chamber as claimed in claim 1, wherein the edge ring is consumable and replaceable. The edge ring for a plasma processing chamber according to claim 1, wherein the inner side has the angled surface, the horizontally oriented inner surface adjacent to the angled surface, and the horizontally oriented inner surface the vertically oriented inner surface adjacent to the inner surface, wherein the bottom side is horizontally oriented and adjoins the outer side and the vertically oriented inner surface, wherein the outer side is a vertically oriented surface, Wherein the curved edge is adjacent to the top side and the outer side. An edge ring for a plasma processing chamber as claimed in claim 1, wherein the substrate support is a chuck and the support ring is an adjustable edge sheath, wherein the bottom side has a first portion, a second part, and a third part, the first part is configured to be conductively coupled to the chuck by conductive gel, the second part is configured to be conductively coupled to the adjustable edge sheath by conductive gel , and the third moiety is adjacent to a base ring. An edge ring for a plasma processing chamber as claimed in claim 1, wherein the edge ring has an outer diameter ranging from 13.6 inches (inclusive) to 15 inches, wherein the outer diameter is limited to the outer side . An edge ring for a plasma processing chamber as claimed in claim 1, wherein the top side has an outer diameter greater than 13.6 inches and at most 15 inches, to reduce when a cover ring is disposed adjacent the outer side Possibility of arcing from the top side to the cover ring. The edge ring for a plasma processing chamber of claim 1, wherein when a cover ring is disposed adjacent the outer side, the curved edge reduces the possibility of arcing from the curved edge to the cover ring. An edge ring for a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber, the edge ring comprising: the annular body having a bottom side , a top side, an inner side, and an outer side, wherein the bottom side is a horizontally oriented surface extending from a vertically oriented inner surface of the inner side to the outer side; A plurality of fastener holes disposed in the annular body along the bottom side, each of the plurality of fastener holes having an inner surface for receiving threads of a fastener for attaching the annular body to a support ring; a step extending from the top side to the vertically oriented inner surface of the inner side, wherein the step includes an angled surface and a horizontally oriented inner surface; and curved edges formed on the top side and the outer side wherein one of the plurality of fastener holes is partially surrounded by the top surface of a groove formed in the bottom side of the edge ring and the side surface of the groove, wherein when a fastener is received in When in the slot, the gap between the top surface of the slot and the fastener is less than one millimeter to reduce the possibility of arcing within the gap. An edge ring for a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber, the edge ring comprising: the annular body having a bottom side , a top side, an inner side, and an outer side, wherein the bottom side is a horizontally oriented surface extending from a vertically oriented inner surface of the inner side to the outer side; a plurality of fastener holes are disposed along the bottom side on the the annular body of the edge ring, wherein each of the plurality of fastener holes has an inner surface for receiving threads of a fastener for attaching the annular body of the edge ring to a support ring; a a step extending from the top side to the vertically oriented inner surface of the inner side, wherein the step includes an angled surface and a horizontally oriented inner surface; and a curved edge formed between the top side and the outer side, Wherein, all the edges of the edge ring are arc-shaped. The edge ring for a plasma processing chamber as claimed in claim 9, wherein each of the plurality of fastener holes does not form a through hole in the annular body of the edge ring. The edge ring for a plasma processing chamber of claim 9, wherein each of the plurality of fastener holes does not extend along the entire length of the ring body. A cover ring for a plasma processing chamber, the cover ring comprising: an annular body having an upper body portion, a middle body portion, and a lower body portion, wherein the ring system is configured around an edge ring and adjacent to a A ground ring, wherein the upper body portion has a first annular width, wherein the intermediate body portion defines a stepped reduction from the upper body portion such that the intermediate body portion has a second annular width that is less than the A first annular width, wherein the lower body portion defines a stepped reduction from the intermediate body portion such that the lower body portion has a third annular width that is less than the second annular width. A cover ring for a plasma processing chamber as claimed in claim 12 of the patent application, wherein the cover ring is consumable and replaceable. The cover ring for a plasma processing chamber of claim 12, wherein the upper body portion, the middle body portion, and the lower body portion provide a path for voltage from the edge ring to the ground ring . A cover ring for a plasma processing chamber as claimed in claim 12, wherein the stepped reduction of the middle body portion from the upper body portion is directed away from the edge ring and the stepped reduction of the lower body portion from the middle body portion is in a direction towards the edge ring. A cover ring for a plasma processing chamber as claimed in claim 12, wherein the stepped reduction of the middle body portion from the upper body portion is directed towards the edge ring, and the lower body Part of the stepped reduction from the central body portion is directed away from the edge ring. The cover ring for a plasma processing chamber of claim 12, wherein the middle body portion has a first elongated depth, and the lower body portion has a second elongated depth. A cover ring for a plasma processing chamber as claimed in claim 12, wherein the upper body portion has a horizontally oriented top surface, a curved edge adjacent to the horizontally oriented top surface, and a curved edge adjacent to the curved edge a vertically oriented outer surface, a vertically oriented inner surface adjacent to the horizontally oriented top surface, a horizontally oriented inner surface adjacent to the vertically oriented inner surface, and a horizontally oriented outer surface adjacent to the vertically oriented outer surface surface, wherein the intermediate body portion has a vertically oriented inner surface adjacent to the horizontally oriented inner surface of the upper body portion, wherein the intermediate body portion has a vertically oriented inner surface adjacent to the horizontally oriented outer surface of the upper body portion a vertically oriented outer surface, and a horizontally oriented outer surface adjacent to the vertically oriented outer surface of the intermediate body portion, wherein the lower body portion has a vertically oriented outer surface adjacent to the horizontally oriented outer surface of the intermediate body portion adjacent to the vertically oriented outer surface of the lower body portion adjoining the horizontally oriented bottom surface, and a vertically oriented inner surface adjoining the horizontally oriented bottom surface of the lower body portion and the vertically oriented inner surface of the intermediate body portion. A cover ring for a plasma processing chamber according to claim 18, wherein the upper body portion is between the vertically oriented outer surface of the upper body portion and the horizontally oriented outer surface of the upper body portion has a second curved edge, wherein the upper body portion has a third curved edge between the horizontally oriented top surface of the upper body portion and the vertically oriented inner surface of the upper body portion, wherein the upper body portion has a third curved edge between the There is a fourth curved edge between the vertically oriented inner surface of the upper body portion and the horizontally oriented inner surface of the upper body portion. The cover ring for a plasma processing chamber of claim 19, wherein the middle body portion is between the horizontally oriented outer surface of the upper body portion and the vertically oriented outer surface of the middle body portion has a fifth curved edge, wherein the intermediate body portion has a sixth curved edge between the horizontally oriented inner surface of the upper body portion and the vertically oriented inner surface of the intermediate body portion, wherein the intermediate body portion is between the There is a seventh curved edge between the vertically oriented outer surface of the intermediate body portion and the horizontally oriented outer surface of the intermediate body portion. The cover ring for a plasma processing chamber of claim 20, wherein the lower body portion is between the horizontally oriented outer surface of the middle body portion and the vertically oriented outer surface of the lower body portion has an eighth curved edge, wherein the lower body portion has a ninth curved edge adjacent to the vertically oriented outer surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion, wherein the lower body portion is on the There is a tenth curved edge between the vertically oriented inner surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion. The cover ring for a plasma processing chamber as claimed in claim 12, wherein the inner edge of the cover ring is curved to reduce the possibility of arcing between the inner edge and the edge ring. A cover ring for a plasma processing chamber as claimed in claim 12 of the patent application, wherein all edges of the cover ring are arc-shaped. A cover ring for a plasma processing chamber according to claim 12, wherein a vertically oriented outer surface of the middle body portion is configured to be surrounded by the grounding ring, and a vertically oriented one of the lower body portions The outer surface of is configured to be surrounded by a base ring. A cover ring for a plasma processing chamber as claimed in claim 12, wherein a vertically oriented inner surface of the upper body portion is configured to surround the edge ring, and a vertically oriented outer surface of the middle body portion A surface is configured to be surrounded by the ground ring, and a vertically oriented outer surface of the lower body portion is configured to be surrounded by a base ring. A system for securing an edge ring of a plasma chamber, comprising: a support ring; an edge ring oriented above the support ring; a gel layer disposed on the bottom surface of the edge ring and the top surface of the support ring between; a plurality of screws configured to fix the edge ring to the support ring, each of the plurality of screws being attached to a screw hole configured in the bottom surface of the edge ring and passing through the support ring; a plurality of compression rods connected to the bottom surface of the support ring; and a plurality of pneumatic pistons, wherein each of the plurality of pneumatic pistons is coupled to an individual one of the plurality of compression rods for enabling the support ring and the edge The rings move simultaneously in a vertical direction. The system for fixing the edge ring of the plasma chamber as claimed in claim 26, wherein the plurality of pneumatic pistons are configured to apply a pull-down force to the plurality of compression rods, so that a substrate in the plasma chamber The edge ring and the support ring are secured to an insulator ring during processing. The system for securing an edge ring of a plasma chamber as claimed in claim 26, wherein the plurality of pneumatic pistons is configured to push the plurality of compression rods upward to remove the edge from the plasma chamber ring and the support ring for maintenance. For example, the system for fixing the edge ring of the plasma chamber as claimed in claim 26 of the patent application further includes: an insulator ring disposed under the support ring; and a plurality of fastening mechanisms configured to have the plurality of pressing rods, wherein each of the plurality of compression rods has a portion extending within the support ring and a portion extending within the insulator ring, wherein each of the plurality of fastening mechanisms is configured to individual ones of the plurality of compression rods or pull down to engage the support ring and the edge ring with the insulator ring during processing operations within the plasma chamber, and push the support ring and the edge ring up relative to the insulator ring to release the support ring and The edge ring. The system for securing an edge ring of a plasma chamber as claimed in claim 29, wherein each of the plurality of fastening mechanisms comprises: a cylinder; a piston body within the cylinder; attached to the a piston rod of the piston body; and a mounting seat configured to mount an individual one of the plurality of compression rods relative to the cylinder. A system for securing an edge ring of a plasma chamber as claimed in claim 30, further comprising: an air route configured to supply compressed air to the top portions of the cylinders to pull down the plurality of compression rods and an air route configured to supply compressed air to the bottom portion of the cylinders to push up the plurality of compression rods. A system for securing an edge ring of a plasma chamber as claimed in claim 26, wherein the first of the plurality of pneumatic pistons is part of a first fastening mechanism, and wherein the second of the plurality of pneumatic pistons is the second Part of two fastening mechanisms, wherein the third of the plurality of pneumatic pistons is part of a third fastening mechanism, the system further includes: the second fastening mechanism configured to cooperate with the first fastening mechanism to support the ring and the edge ring are fixed to a position different from that of an insulator ring, the support ring and the edge ring are fixed to the insulator ring; securing the support ring and the edge ring to the position of the insulator ring, and the first fastening mechanism A ring is secured to the insulator ring at a different location than that of the insulator ring, the support ring and the edge ring are secured to the insulator ring.

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