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TWI778531B - Release film roll, ceramic part sheet and method for producing the same, and ceramic part and method for producing the same - Google Patents

Release film roll, ceramic part sheet and method for producing the same, and ceramic part and method for producing the same Download PDF

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TWI778531B
TWI778531B TW110107286A TW110107286A TWI778531B TW I778531 B TWI778531 B TW I778531B TW 110107286 A TW110107286 A TW 110107286A TW 110107286 A TW110107286 A TW 110107286A TW I778531 B TWI778531 B TW I778531B
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release film
roll
ceramic
release
film
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TW202138196A (en
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飯島忠良
江守泰彦
飯田修治
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日商 Tdk 股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/10Kinds or types of circular or polygonal cross-section without flanges, e.g. cop tubes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/30Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/28Wound package of webs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/17Nature of material
    • B65H2701/172Composite material
    • B65H2701/1726Composite material including detachable components

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Absorbent Articles And Supports Therefor (AREA)

Abstract

本揭示之剝離膜卷具有:剝離膜,其具有基材膜及剝離層;及捲芯,其捲繞有該剝離膜。剝離膜卷側面之自捲芯之外周面沿徑向之距離r[mm]為10~130 mm時,於卷之外周面露出之剝離膜之表面,朝捲芯之中心測定之反彈硬度K(r)[HL]滿足下述式(1)。 -2r+670≦K(r)≦-1.25r+862.5…(1)The release film roll of the present disclosure has: a release film having a base film and a release layer; and a core on which the release film is wound. When the distance r [mm] along the radial direction from the outer peripheral surface of the roll core on the side of the release film roll is 10 to 130 mm, the rebound hardness K (r ) [HL] satisfies the following formula (1). -2r+670≦K(r)≦-1.25r+862.5…(1)

Description

剝離膜卷、陶瓷零件片材及其製造方法、以及陶瓷零件及其製造方法Release film roll, ceramic part sheet and method for producing the same, and ceramic part and method for producing the same

本揭示係關於一種剝離膜卷、陶瓷零件片材及其製造方法、以及陶瓷零件及其製造方法。The present disclosure relates to a release film roll, a ceramic part sheet and a method for producing the same, and a ceramic part and a method for producing the same.

近年來,隨著電子機器小型化之要求,電子零件亦逐漸小型化。電子零件之一種即陶瓷零件亦逐年小型化。例如,陶瓷零件之一種即積層陶瓷電容器將介電層及內部電極之厚度薄化而謀求大電容化。一般之積層陶瓷電容器藉由將剝離膜作為載體膜,將介電層及內部電極形成於載體膜上作為生坯片,剝離生坯片並積層而製造。In recent years, with the requirement of miniaturization of electronic machines, electronic components are also gradually miniaturized. One of the electronic parts, namely ceramic parts, has been miniaturized year by year. For example, a multilayer ceramic capacitor, which is one of the ceramic parts, has reduced the thickness of the dielectric layer and the internal electrode to increase the capacitance. A general multilayer ceramic capacitor is manufactured by using a release film as a carrier film, forming a dielectric layer and an internal electrode on the carrier film as a green sheet, peeling off the green sheet, and laminating.

若積層陶瓷電容器之介電層之厚度變薄,則有表示會產生短路等問題之耐電壓強度之耐壓性能降低之傾向。尤其,介電層之厚度不均一之情形時,較薄部分會成為耐壓性能降低之要因。具備具有此種較薄部分之介電層之積層陶瓷電容器耐壓不良,積層陶瓷電容器之良率降低。另一方面,若介電層之厚度均一,則耐壓性能良好,積層陶瓷電容器之良率提高。When the thickness of the dielectric layer of the multilayer ceramic capacitor becomes thinner, the withstand voltage performance, which is a problem such as short circuit, tends to decrease. In particular, when the thickness of the dielectric layer is non-uniform, the thinner portion may be a cause of lowering the withstand voltage performance. The multilayer ceramic capacitor having the dielectric layer having such a thin portion has poor withstand voltage, and the yield of the multilayer ceramic capacitor decreases. On the other hand, if the thickness of the dielectric layer is uniform, the withstand voltage performance is good, and the yield of the multilayer ceramic capacitor is improved.

作為介電層之載體膜使用之剝離膜中存在之損傷等成為介電層之厚度變動之要因。又,剝離膜表面之平滑性會對介電層之厚度均一性造成影響。鑑於此種狀況,例如專利文獻1中,研討有一種可使剝離膜平滑化而減少介電層之厚度不均之剝離膜卷。 [先前技術文獻] [專利文獻]Damage or the like in the release film used as the carrier film for the dielectric layer is a factor for the thickness variation of the dielectric layer. In addition, the smoothness of the surface of the release film affects the thickness uniformity of the dielectric layer. In view of such a situation, for example, in Patent Document 1, a release film roll that can smooth the release film and reduce the thickness unevenness of the dielectric layer is examined. [Prior Art Literature] [Patent Literature]

專利文獻1:日本專利特開2011-206995號公報Patent Document 1: Japanese Patent Laid-Open No. 2011-206995

[發明所欲解決之問題][Problems to be Solved by Invention]

陶瓷零件之製造步驟中,於自剝離膜卷拉出之剝離膜上,形成陶瓷生坯片。此處,作為用以提高陶瓷零件之生產性之對策,認為加長捲繞於剝離膜卷之剝離膜之捲繞長度,減少剝離膜卷之更換頻率較為有效。In the manufacturing step of the ceramic part, a ceramic green sheet is formed on the release film drawn from the release film roll. Here, as a measure for improving the productivity of ceramic parts, it is considered to be effective to lengthen the winding length of the release film wound around the release film roll and reduce the frequency of replacement of the release film roll.

此種剝離膜卷於保管及輸送時,由捲芯固定或支持。若捲繞長度變長,則因輸送時之振動等,有產生捲繞成卷狀之剝離膜竹筍狀滑動之現象之虞。又,亦有因振動而發生捲繞偏移,藉此於剝離層發生損傷之虞。若剝離層發生損傷,則可能會成為於介電層產生針孔之要因。作為避免發生此種捲繞偏移及滑動現象之對策,認為增大剝離膜之捲繞強度較為有效。Such release film rolls are fixed or supported by the core during storage and transportation. When the winding length is increased, there is a possibility that the roll-up release film may slip in the form of bamboo shoots due to vibrations during conveyance or the like. Moreover, there exists a possibility that a winding deviation will generate|occur|produce by vibration, and a peeling layer may be damaged by this. If the peeling layer is damaged, it may become a cause of pinholes in the dielectric layer. As a measure to avoid the occurrence of such winding offset and slip phenomenon, it is considered to be effective to increase the winding strength of the release film.

然而,若增大剝離膜之捲繞強度,則易將基材膜之凹凸形狀轉印於剝離層。若捲繞長度變長,則內側之剝離膜承受之壓力變大,尤其易轉印凹凸形狀。作為避免此種現象之對策,認為減小剝離膜之捲繞強度較為有效。However, when the winding strength of the release film is increased, the uneven shape of the base film can be easily transferred to the release layer. When the winding length becomes longer, the pressure on the inner release film becomes larger, and it becomes easier to transfer the concave-convex shape in particular. As a measure to avoid such a phenomenon, it is considered to be effective to reduce the winding strength of the release film.

如此,有為了抑制於捲芯附近轉印凹凸形狀而欲減小捲繞強度之情況,另一方面,亦有為了抑制輸送時等之捲繞偏移及滑動現象而欲增大捲繞強度之情況。為了加長剝離膜之捲繞長度,需要兼顧此種相反之要求。In this way, there are cases in which the winding strength is to be reduced in order to suppress the transfer of the concavo-convex shape near the winding core, and on the other hand, there are cases in which the winding strength is intended to be increased in order to suppress the winding deviation and slippage during conveyance and the like. Happening. In order to lengthen the winding length of the release film, it is necessary to take into account the opposite requirements.

因此,本揭示提供一種即使加長剝離膜之捲繞長度,亦可充分減少於剝離膜之剝離層產生之損壞的剝離膜卷。又,本揭示提供一種藉由使用此種剝離膜卷,而具有優異之可靠性之陶瓷零件片材之製造方法及陶瓷零件之製造方法。又,本揭示提供一種具有優異之可靠性之陶瓷零件片材及陶瓷零件。 [解決問題之技術手段]Therefore, the present disclosure provides a release film roll that can sufficiently reduce damage to the release layer of the release film even if the winding length of the release film is lengthened. Furthermore, the present disclosure provides a method for producing a ceramic component sheet and a method for producing a ceramic component having excellent reliability by using such a release film roll. Furthermore, the present disclosure provides a ceramic component sheet and ceramic component having excellent reliability. [Technical means to solve problems]

本揭示之一態樣之剝離膜卷具有:剝離膜,其具有基材膜及剝離層;及捲芯,其捲繞有該剝離膜;側面上之自捲芯之外周面沿徑向之距離r[mm]為10~130 mm時,於卷之外周面露出之剝離膜之表面,朝捲芯之中心測定之距離r處之剝離膜卷之反彈硬度K(r)[HL]滿足下述式(1)。 -2r+670≦K(r)≦-1.25r+862.5…(1)A release film roll of one aspect of the present disclosure has: a release film having a base film and a release layer; a core on which the release film is wound; and a distance in the radial direction from the outer peripheral surface of the core on the side surface When r [mm] is 10 to 130 mm, the rebound hardness K(r) [HL] of the release film roll at a distance r measured from the surface of the release film exposed on the outer peripheral surface of the roll toward the center of the roll core satisfies the following formula (1). -2r+670≦K(r)≦-1.25r+862.5…(1)

反彈硬度K(r)根據存在於捲繞之剝離膜間之間隙之空氣量而變化。當存在於剝離膜間之空氣變多時,反彈硬度K(r)降低,當空氣變少時,反彈硬度上升。此處,當反彈硬度K(r)過高時,相鄰之剝離膜彼此過度密接,易將基材膜之凹凸形狀轉印於剝離層。由於反彈硬度有剝離膜卷之內側變高之傾向,故易將凹凸形狀轉印於內側之剝離膜。因此,上述剝離膜卷之內側部分即距離r為10~130 mm之部分,將反彈硬度K(r)設為特定上限值(-1.25r+862.5)以下。藉此,抑制將凹凸形狀轉印於剝離膜。The rebound hardness K(r) varies depending on the amount of air existing in the gap between the wound release films. When the amount of air existing between the release films increases, the rebound hardness K(r) decreases, and when the amount of air decreases, the rebound hardness increases. Here, when the rebound hardness K(r) is too high, the adjacent release films are too close to each other, and the uneven shape of the base film is easily transferred to the release layer. Since the rebound hardness tends to increase on the inner side of the release film roll, it is easy to transfer the uneven shape to the inner release film. Therefore, the inner part of the peeling film roll, that is, the part where the distance r is 10 to 130 mm, the rebound hardness K(r) is set to be equal to or less than a specific upper limit value (-1.25r+862.5). Thereby, transcription|transfer of the uneven|corrugated shape to a release film is suppressed.

另一方面,當反彈硬度K(r)過低時,存在於相鄰之剝離膜間之空氣變多,於剝離膜卷之內側部分,有易竹筍狀滑動之傾向、及有易因振動而發生捲繞偏移之傾向。又,剝離膜卷有捲繞外側之剝離膜時之力作用於已捲繞於其內側之剝離膜,發生於捲繞方向偏移之捲繞過緊而形成褶皺之情形。因此,上述剝離膜卷中,於距離r為10~130 mm之部分,將反彈硬度K(r)設為特定下限值(-2r+670)以上。藉此,抑制剝離膜竹筍狀滑動、因振動發生捲繞偏移、及發生捲繞過緊。On the other hand, when the rebound hardness K(r) is too low, the air existing between the adjacent release films increases, and the inner part of the release film roll tends to slide easily in the form of bamboo shoots, and it is easy to be damaged by vibration. There is a tendency for winding offset to occur. In addition, when the release film is wound with the release film on the outside, the force acts on the release film already wound on the inner side, which occurs when the winding direction is shifted and the winding is tightened and wrinkles are formed. Therefore, in the said peeling film roll, the rebound hardness K(r) is made into the specific lower limit value (-2r+670) or more in the part where the distance r is 10-130 mm. Thereby, bamboo shoot-like slippage of the peeling film, occurrence of winding deviation due to vibration, and occurrence of winding tightness are suppressed.

因此,上述剝離膜卷係即使加長剝離膜之捲繞長度,亦可充分減少於剝離膜之剝離層產生之凹凸及損傷等損壞。Therefore, even if the winding length of the peeling film is lengthened, the above-mentioned peeling film roll can sufficiently reduce damages such as unevenness and damage generated in the peeling layer of the peeling film.

上述距離r未達10 mm之範圍之反彈硬度K(r)較佳為650 HL以上。藉此,可充分抑制剝離膜於捲芯附近產生捲繞偏移、或捲芯自剝離膜卷脫落。另,對於距離r未達10 mm之部分,可不形成陶瓷生坯片,而於更換作業時有效活用剝離膜卷。例如,可作為用以使送出速度減速之減速區域、及作為滯留於乾燥爐內之部分使用。The rebound hardness K(r) in the range where the distance r is less than 10 mm is preferably 650 HL or more. Thereby, it is possible to sufficiently suppress the occurrence of winding deviation of the release film in the vicinity of the core or the separation of the core from the release film roll. In addition, for the portion where the distance r is less than 10 mm, the ceramic green sheet may not be formed, and the peeling film roll can be effectively used in the replacement operation. For example, it can be used as a deceleration area for decelerating the delivery speed, and as a part that stays in a drying furnace.

上述剝離膜卷之自捲芯之外周面至卷狀剝離膜之外周面之沿徑向之距離r0 可為160 mm以上,距離r為160 mm以上之反彈硬度K(r)為350~662.5 HL。藉此,於剝離膜卷全體,可使相鄰之剝離膜彼此充分密接,且充分抑制於剝離膜卷之外周部之剝離膜產生褶皺。The distance r 0 from the outer peripheral surface of the roll core to the outer peripheral surface of the roll-shaped release film in the radial direction of the above-mentioned release film roll can be 160 mm or more, and the rebound hardness K(r) of the distance r is 160 mm or more is 350 ~ 662.5 HL. Thereby, in the whole peeling film roll, adjoining peeling films can be fully adhere|attached mutually, and generation|occurence|production of wrinkles in the peeling film in the outer peripheral part of a peeling film roll can be suppressed fully.

上述距離r為10~130 mm之範圍內,可以隨著距離r增加而反彈硬度K(r)[HL]減少之方式捲繞剝離膜。藉此,可充分抑制於剝離膜卷之內周附近與外周附近之兩者發生捲繞偏移。When the distance r is in the range of 10 to 130 mm, the release film can be wound so that the rebound hardness K(r) [HL] decreases as the distance r increases. Thereby, it is possible to sufficiently suppress the occurrence of winding misalignment in the vicinity of the inner circumference and the vicinity of the outer circumference of the release film roll.

本揭示之一態樣之陶瓷零件片材之製造方法具有以下步驟:於自上述任一剝離膜卷拉出之剝離膜之剝離層之表面,使用包含陶瓷粉末之糊膏形成陶瓷生坯片。A method of manufacturing a ceramic part sheet according to an aspect of the present disclosure includes the steps of forming a ceramic green sheet using a paste containing ceramic powder on the surface of the release layer of the release film drawn from any of the above-mentioned release film rolls.

上述製造方法使用自上述任一剝離膜卷拉出之剝離膜。充分抑制上述剝離膜之剝離層因捲繞偏移及滑動現象等所致之損傷之產生、及凹凸。因此,可於遍及自捲繞於剝離膜卷之剝離膜之前端至後端間之廣闊區域,形成充分減少厚度變動及針孔之陶瓷生坯片。因此,可製造可靠性優異之陶瓷零件片材。本揭示中,剝離膜之「後端」是指與捲芯相接之側之一端,剝離膜之「前端」是指出現於剝離膜卷之外周面之側之一端。The above-mentioned production method uses the release film drawn from any of the above-mentioned release film rolls. The peeling layer of the above-mentioned peeling film is sufficiently suppressed from the occurrence of damage and unevenness due to winding offset and sliding phenomenon. Therefore, a ceramic green sheet with sufficiently reduced thickness variation and pinholes can be formed over a wide area from the front end to the rear end of the release film wound on the release film roll. Therefore, a ceramic component sheet excellent in reliability can be produced. In the present disclosure, the "rear end" of the release film refers to an end on the side that is in contact with the roll core, and the "front end" of the release film refers to an end on the side that appears on the outer peripheral surface of the release film roll.

本揭示之一態樣之陶瓷零件之製造方法具有以下步驟:使用以上述製造方法獲得之陶瓷零件片材,獲得包含陶瓷生坯片之積層體;及燒成積層體,獲得燒結體。A method of manufacturing a ceramic part according to one aspect of the present disclosure includes the steps of: using the ceramic part sheet obtained by the above-described manufacturing method to obtain a laminate including a ceramic green sheet; and firing the laminate to obtain a sintered body.

上述製造方法中,使用充分抑制因捲繞偏移及滑動現象等所致之損傷之產生、及凹凸之剝離膜,製造陶瓷零件。藉此,可形成充分減少厚度變動及針孔之陶瓷生坯片。因此,可製造可靠性優異之陶瓷零件。In the above-mentioned production method, the ceramic parts are produced using a release film which sufficiently suppresses the occurrence of damage due to winding deviation, sliding phenomenon, and the like, and unevenness. Thereby, a ceramic green sheet with sufficiently reduced thickness variation and pinholes can be formed. Therefore, a ceramic part excellent in reliability can be manufactured.

本揭示之一態樣之陶瓷零件片材可於自上述任一剝離膜卷拉出之剝離膜之剝離層之表面,形成包含陶瓷生坯片之生坯片而獲得。The ceramic component sheet of one aspect of the present disclosure can be obtained by forming a green sheet including a ceramic green sheet on the surface of the release layer of the release film drawn from any of the above-mentioned release film rolls.

上述陶瓷零件片材可使用自上述任一剝離膜卷拉出之剝離膜而獲得。上述剝離膜之剝離層已充分抑制因捲繞偏移及滑動現象等所致之損傷之產生、及凹凸。因此,可充分減少陶瓷生坯片之厚度變動及針孔。形成包含此種陶瓷生坯片之生坯片而得之陶瓷零件片材具有優異之可靠性。The above-mentioned ceramic component sheet can be obtained using a release film drawn from any of the above-mentioned release film rolls. The peeling layer of the above-mentioned peeling film has sufficiently suppressed the occurrence of damage and unevenness due to winding offset and sliding phenomenon. Therefore, thickness variation and pinholes of the ceramic green sheet can be sufficiently reduced. A ceramic component sheet obtained by forming a green sheet including such a ceramic green sheet has excellent reliability.

本揭示之一態樣之陶瓷零件具備燒結體,其形成包含上述陶瓷零件片材之陶瓷生坯片之積層體,將該積層體燒成而獲得。上述陶瓷生坯片之厚度變動及針孔已充分減少。上述陶瓷零件具備將包含此種陶瓷生坯片之積層體燒成而得之燒結體,因而可靠性優異。 [發明之效果]A ceramic component according to one aspect of the present disclosure includes a sintered body obtained by forming a layered body of ceramic green sheets including the above-mentioned ceramic component sheet, and by firing the layered body. The thickness variation and pinholes of the above-mentioned ceramic green sheets have been sufficiently reduced. The above-mentioned ceramic component is provided with a sintered body obtained by sintering a layered body including such a ceramic green sheet, and thus is excellent in reliability. [Effect of invention]

根據本揭示,可提供一種即使加長剝離膜之捲繞長度,亦可充分減少於剝離膜之剝離層產生之損壞的剝離膜卷。又,可提供一種藉由使用此種剝離膜卷,而具有優異之可靠性之陶瓷零件片材之製造方法及陶瓷零件之製造方法。又,可提供一種具有優異之可靠性之陶瓷零件片材及陶瓷零件。According to the present disclosure, even if the winding length of the release film is lengthened, it is possible to provide a release film roll that can sufficiently reduce damage to the release layer of the release film. Moreover, by using such a peeling film roll, the manufacturing method of the ceramic component sheet|seat which has the outstanding reliability, and the manufacturing method of a ceramic component can be provided. In addition, a ceramic component sheet and ceramic component having excellent reliability can be provided.

以下,根據情形,參照圖式說明本揭示之實施形態。各圖式中,對同一或同等要件標註同一符號,根據情形省略重複之說明。但,以下之實施形態係用以說明本揭示之例示,並非旨在將本揭示限定於以下內容。Hereinafter, embodiments of the present disclosure will be described with reference to the drawings depending on the circumstances. In each drawing, the same or equivalent elements are marked with the same symbols, and repeated explanations are omitted depending on the situation. However, the following embodiments are examples for explaining the present disclosure, and are not intended to limit the present disclosure to the following contents.

圖1係一實施形態之剝離膜卷之立體圖。圖1之剝離膜卷100具備:剝離膜20,其具有基材膜及剝離層;及捲芯10,其捲繞有剝離膜20。剝離膜20例如於以積層陶瓷電容器為代表之陶瓷零件之製造步驟中,作為載體膜使用。該製造步驟中,例如於剝離膜之上藉由塗佈或印刷,而形成成為介電片材之陶瓷生坯片、及成為內部電極之電極生坯片,其後,將該等剝離並積層,燒成積層體而製造陶瓷零件。剝離膜20係自剝離膜卷100拉出而使用。Fig. 1 is a perspective view of a release film roll according to an embodiment. The release film roll 100 of FIG. 1 is provided with the release film 20 which has a base material film and a release layer, and the core 10 with which the release film 20 was wound. The release film 20 is used as a carrier film in, for example, a manufacturing process of ceramic parts including a multilayer ceramic capacitor. In this production step, for example, by coating or printing on the release film, a ceramic green sheet to be a dielectric sheet and an electrode green sheet to be an internal electrode are formed, and then these are peeled off and laminated. , sintering the laminate to manufacture ceramic parts. The release film 20 is used by being pulled out from the release film roll 100 .

作為捲芯10之材質,列舉紙、塑膠、金屬等。製造陶瓷零件時,由於顆粒會成為產生針孔之原因,故較佳為包含不產生紙粉之輕量之塑膠者。作為此種材料,列舉ABS樹脂、酚醛樹脂及纖維強化塑膠等。纖維強化塑膠因除了高機械強度外還具有柔軟性,故可較佳使用。作為纖維強化塑膠,列舉以熱硬化性樹脂強化纖維者。作為樹脂,列舉環氧樹脂、不飽和聚酯樹脂等。作為纖維,列舉玻璃纖維、芳族聚醯胺纖維等。考慮成本方面等,樹脂可為不飽和聚酯樹脂。基於同樣觀點,纖維可為玻璃纖維。Examples of the material of the core 10 include paper, plastic, metal, and the like. In the manufacture of ceramic parts, since the particles may cause pinholes, it is preferable to include a lightweight plastic that does not generate paper dust. Examples of such materials include ABS resins, phenolic resins, fiber-reinforced plastics, and the like. Fiber-reinforced plastics can be preferably used because they have flexibility in addition to high mechanical strength. Examples of fiber-reinforced plastics include fibers reinforced with thermosetting resins. As resin, epoxy resin, unsaturated polyester resin, etc. are mentioned. As fiber, glass fiber, aramid fiber, etc. are mentioned. In consideration of cost and the like, the resin may be an unsaturated polyester resin. From the same viewpoint, the fibers may be glass fibers.

捲芯10以纖維強化塑膠構成之情形時,r未達10 mm之範圍之反彈硬度K(r)可為950 HL以下。藉此,可抑制捲芯10發生破裂。另一方面,捲芯10以金屬構成之情形時,r未達10 mm範圍之反彈硬度K(r)可超過950 HL。捲芯10之外徑可為150 mm以下,亦可為100 mm以下。藉此,可減小剝離膜卷100之尺寸,減少設置空間及輸送成本。When the core 10 is made of fiber-reinforced plastic, the rebound hardness K(r) in the range where r is less than 10 mm may be less than 950 HL. Thereby, the occurrence of cracking of the winding core 10 can be suppressed. On the other hand, when the core 10 is made of metal, the rebound hardness K(r) in the range where r is less than 10 mm may exceed 950 HL. The outer diameter of the core 10 may be 150 mm or less, or 100 mm or less. Thereby, the size of the peeling film roll 100 can be reduced, and the installation space and transportation cost can be reduced.

捲繞於捲芯10之剝離膜20之捲繞長度可為4000 m以上,可為5000 m以上,亦可為6000 m以上。藉此,於陶瓷生坯片及陶瓷零件等之製造步驟中,可減少剝離膜卷100之更換頻率,進而提高各種製品之生產效率。剝離膜20之厚度可為10~110 μm,亦可為20~60 μm。剝離膜20之寬度可為例如100~1000 mm。另,本揭示中,將拉出及捲繞剝離膜時,搬送剝離膜之方向稱為長邊方向,將與剝離膜之長邊方向正交之方向稱為剝離膜之寬度方向。The winding length of the release film 20 wound around the core 10 may be 4000 m or more, 5000 m or more, or 6000 m or more. Thereby, in the manufacturing steps of ceramic green sheets and ceramic parts, etc., the replacement frequency of the peeling film roll 100 can be reduced, thereby improving the production efficiency of various products. The thickness of the peeling film 20 may be 10-110 μm, or 20-60 μm. The width of the release film 20 may be, for example, 100 to 1000 mm. In addition, in the present disclosure, the direction in which the release film is conveyed when the release film is drawn and wound is referred to as the longitudinal direction, and the direction orthogonal to the longitudinal direction of the release film is referred to as the width direction of the release film.

圖2係顯示剝離膜之一例之剖視圖。剝離膜20具有基材膜22及其一面上之剝離層24。基材膜22可為合成樹脂膜。作為合成樹脂,列舉聚酯樹脂、聚丙烯樹脂及聚乙烯樹脂等聚烯烴樹脂、聚乳酸樹脂、聚碳酸酯樹脂、聚甲基丙烯酸甲酯樹脂等丙烯酸系樹脂、聚苯乙烯樹脂、尼龍等聚醯胺樹脂、聚氯乙烯樹脂、聚胺酯樹脂、氟系樹脂、以及聚苯硫醚樹脂等。其中,較佳為聚酯樹脂。聚酯樹脂中,基於力學性質、透明性、成本等觀點,更佳為聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)。FIG. 2 is a cross-sectional view showing an example of a release film. The release film 20 has a base film 22 and a release layer 24 on one side thereof. The base film 22 may be a synthetic resin film. Examples of synthetic resins include polyolefin resins such as polyester resins, polypropylene resins, and polyethylene resins, acrylic resins such as polylactic acid resins, polycarbonate resins, and polymethyl methacrylate resins, polystyrene resins, and polyamide resins such as nylon. Amide resin, polyvinyl chloride resin, polyurethane resin, fluorine resin, polyphenylene sulfide resin, etc. Among them, polyester resins are preferred. Among the polyester resins, polyethylene terephthalate (PET) is more preferred from the viewpoints of mechanical properties, transparency, cost, and the like.

基材膜22之厚度較佳為10~100 μm,更佳為20~50 μm。厚度未達10 μm之情形時,有剝離膜20之尺寸穩定性等物理特性受損之傾向。厚度超出100 μm之情形時,有導致剝離膜20之每單位面積之製造成本上升之傾向。The thickness of the base film 22 is preferably 10 to 100 μm, more preferably 20 to 50 μm. When the thickness is less than 10 μm, the physical properties such as the dimensional stability of the release film 20 tend to be impaired. When the thickness exceeds 100 μm, the production cost per unit area of the release film 20 tends to increase.

基於充分提高剝離膜20之機械強度之觀點,基材膜22可以無損透明性之程度含有填充料(填充劑)。本實施形態之剝離膜卷100係即使基材膜22含有填充料,亦可充分抑制將填充料之形狀轉印於相鄰之剝離膜20之剝離層24。填充料並非特別限定者,列舉例如碳酸鈣、磷酸鈣、二氧化矽、高嶺土、滑石粉、氧化鈦、燒製二氧化矽、氧化鋁、及有機粒子等。From the viewpoint of sufficiently improving the mechanical strength of the release film 20, the base film 22 may contain a filler (filler) to such an extent that transparency is not impaired. The release film roll 100 of the present embodiment is capable of sufficiently suppressing the transfer of the shape of the filler to the release layer 24 of the adjacent release film 20 even if the base film 22 contains the filler. The filler is not particularly limited, and examples thereof include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium oxide, fired silica, alumina, and organic particles.

使用聚酯膜作為基材膜22之情形時,可根據以下順序製造。首先,將熔融之聚酯由擠出機澆鑄於旋轉冷卻滾筒。將熔融之聚酯自形成有縫隙之口型板擠出。其後,冷卻、自旋轉冷卻滾筒剝離,藉此獲得未延伸之聚酯膜。若調整擠出機之縫隙之間隙,則可調整聚酯膜之厚度及其變動幅度。When a polyester film is used as the base film 22, it can be manufactured according to the following procedure. First, molten polyester is cast from an extruder onto a rotating cooling drum. The molten polyester is extruded from a slotted die. Then, it cooled and peeled from a rotating cooling roll, and obtained the polyester film which is not extended|stretched. If the gap of the gap of the extruder is adjusted, the thickness of the polyester film and its variation range can be adjusted.

接著,使未延伸之聚酯膜延伸,調整成期望之厚度,且賦予機械強度。聚酯膜之延伸較佳以雙軸延伸進行。該情形時,於縱延伸後進行橫延伸。延伸時之延伸溫度較佳以聚酯膜之玻璃轉移溫度以上且熔融溫度以下進行。縱延伸及橫延伸時,可分別延伸數倍左右。延伸後亦延續未延伸膜之厚度變動。因此,藉由控制未延伸膜之厚度變動,可調節基材膜22及剝離膜20之厚度變動幅度。Next, the unstretched polyester film is stretched, adjusted to a desired thickness, and given mechanical strength. The stretching of the polyester film is preferably carried out by biaxial stretching. In this case, horizontal stretching is performed after vertical stretching. The stretching temperature at the time of stretching is preferably performed at a temperature equal to or higher than the glass transition temperature of the polyester film and lower than or equal to the melting temperature. When extending vertically and horizontally, it can be extended several times respectively. The thickness variation of the unstretched film is also continued after stretching. Therefore, by controlling the thickness variation of the unstretched film, the thickness variation range of the base film 22 and the release film 20 can be adjusted.

剝離層24係於基材膜22之一面上塗佈包含剝離劑之溶液,使之乾燥及硬化而形成。塗佈方法未特別限定,只要使用反向塗佈法、凹版塗佈法、桿式塗佈法、棒式塗佈法、邁耶棒式塗佈法、模塗法、噴塗法等即可。乾燥可使用熱風乾燥、紅外線乾燥、自然乾燥等。為抑制乾燥時之水分結露,較佳進行加熱,且可為60~120°C左右。The release layer 24 is formed by coating a solution containing a release agent on one surface of the base film 22, drying and curing it. The coating method is not particularly limited, as long as a reverse coating method, a gravure coating method, a bar coating method, a bar coating method, a Meyer bar coating method, a die coating method, a spray coating method, or the like is used. For drying, hot air drying, infrared drying, natural drying and the like can be used. In order to suppress moisture condensation during drying, heating is preferably performed, and it can be about 60 to 120°C.

作為形成剝離層24所使用之剝離劑,列舉例如矽酮系剝離劑、長鏈烷基系剝離劑、氟系剝離劑及胺基醇酸樹脂系者。矽酮系剝離劑基於硬化反應之差異,有加成反應系矽酮剝離劑、縮合系酮矽剝離劑、紫外線硬化系剝離劑等。As a release agent used for forming the release layer 24, a silicone type release agent, a long-chain alkyl type release agent, a fluorine type release agent, and an amino alkyd resin type are mentioned, for example. Silicone-based release agents include addition reaction-type silicone release agents, condensation-type ketone-silicon release agents, and UV-curable release agents based on the difference in curing reaction.

硬化條件只要根據剝離劑之硬化系統適當選擇即可。例如,若剝離劑為加成反應系之矽酮,則可藉由以80~130°C加熱處理數十秒而使之硬化。若為紫外線硬化系,則可將水銀燈、金屬鹵素燈等作為光源,照射紫外線使之硬化。照射紫外線使自由基聚合之情形時,為防止氧抑制,較佳於氮氣氛圍下進行硬化。剝離層24之厚度變動幅度宜小為佳。The curing conditions may be appropriately selected according to the curing system of the release agent. For example, if the release agent is an addition reaction type silicone, it can be hardened by heat treatment at 80-130°C for several tens of seconds. In the case of an ultraviolet curing system, a mercury lamp, a metal halide lamp, or the like can be used as a light source, and ultraviolet rays can be irradiated and cured. In the case of radical polymerization by irradiation with ultraviolet rays, it is preferable to perform curing in a nitrogen atmosphere in order to prevent oxygen inhibition. The thickness variation of the peeling layer 24 is preferably small.

加成反應系矽酮剝離劑使於聚二甲基矽氧烷之末端及/或側鏈導入有乙烯基者與氫矽氧烷反應而硬化。硬化可使用鉑催化劑。例如,可以100°C左右之硬化溫度使之硬化數十秒至數分鐘。剝離層24之厚度亦可為50~300 nm左右。作為加成反應系之剝離劑,可列舉信越化學工業股份有限公司製之K847、KS847T、KS-776L、KS-776A、KS-841、KS-774、KS-3703T、KS-3601等(皆為商品名)。The addition reaction-based silicone release agent reacts with hydrosiloxane to harden the polydimethylsiloxane with vinyl groups introduced into the terminal and/or side chain. Hardening can use platinum catalysts. For example, it can be hardened at a hardening temperature of about 100°C for several tens of seconds to several minutes. The thickness of the peeling layer 24 may also be about 50-300 nm. As the release agent of the addition reaction system, K847, KS847T, KS-776L, KS-776A, KS-841, KS-774, KS-3703T, KS-3601, etc., manufactured by Shin-Etsu Chemical Co., Ltd. (all are Product name).

剝離層24亦可以例如(甲基)丙烯酸酯成分與(甲基)丙烯酸酯改性矽酮之硬化物構成。由於此種硬化物可以紫外線硬化,故可增大剝離層24之厚度。因此,例如於基材膜22包含填充料之情形時,可覆蓋因填料所致之突起,使剝離層24之表面(剝離面)平滑化。該情形時,剝離層24之厚度亦可為30~3000 nm。The peeling layer 24 may be constituted by, for example, a (meth)acrylate component and a cured product of a (meth)acrylate modified silicone. Since such a cured product can be cured by ultraviolet rays, the thickness of the peeling layer 24 can be increased. Therefore, for example, when the base film 22 contains the filler, the protrusions due to the filler can be covered, and the surface (release surface) of the release layer 24 can be smoothed. In this case, the thickness of the peeling layer 24 may be 30 to 3000 nm.

亦可使用互不相溶之(甲基)丙烯酸酯單體與(甲基)丙烯酸酯改性矽酮油。將該等與反應引發劑一起混合於溶劑中,塗佈於基材膜22後,使溶劑乾燥。如此,亦可於使矽酮改性矽酮油於表面附近局部化之狀態下,利用紫外線使之硬化,形成剝離層24。作為(甲基)丙烯酸酯改性矽酮油,可使用眾所周知者。例如,可列舉信越化學工業股份有限公司製之X-22-164A、X-22-164B、X-22-174DX、X-22-2445(皆為商品名)等。It is also possible to use immiscible (meth)acrylate monomers and (meth)acrylate modified silicone oils. These are mixed with a reaction initiator in a solvent, and after apply|coating to the base film 22, the solvent is dried. In this way, the release layer 24 can also be formed by curing the silicone-modified silicone oil with ultraviolet rays in a state where the silicone-modified silicone oil is localized near the surface. As the (meth)acrylate-modified silicone oil, well-known ones can be used. For example, X-22-164A, X-22-164B, X-22-174DX, X-22-2445 (all are trade names) by Shin-Etsu Chemical Co., Ltd., etc. are mentioned.

剝離膜20之剝離層24之表面較佳為平滑。具體而言,剝離層24之表面粗糙度(Rp)較佳為100 nm以下,更佳為50 nm以下。本實施形態之剝離層24之表面粗糙度(Rp)為JIS B 0601-2001所規定之最大峰值,可使用接觸式表面粗糙度計或掃描型白色干涉顯微鏡測定。The surface of the release layer 24 of the release film 20 is preferably smooth. Specifically, the surface roughness (Rp) of the peeling layer 24 is preferably 100 nm or less, more preferably 50 nm or less. The surface roughness (Rp) of the peeling layer 24 of the present embodiment is the maximum peak value specified in JIS B 0601-2001, and can be measured using a contact surface roughness meter or a scanning white interference microscope.

剝離膜20之寬度方向之厚度變動幅度較佳為0.5 μm以下,更佳為0.4 μm以下,進而佳為0.3 μm以下。尤其佳為0.2 μm以下。若該厚度變動幅度變大,則因捲繞之剝離膜20彼此於較厚部分強烈接觸,反彈硬度較其它部分高。藉由縮小該厚度變動幅度,可抑制剝離膜20之變形。又,於剝離膜20上形成陶瓷生坯片時,可縮小陶瓷生坯片之厚度變動幅度。The thickness fluctuation range in the width direction of the release film 20 is preferably 0.5 μm or less, more preferably 0.4 μm or less, and still more preferably 0.3 μm or less. Especially preferably, it is 0.2 μm or less. When the thickness fluctuation range becomes large, the repulsion hardness is higher than the other parts because the wound release films 20 are in strong contact with each other in the thick part. Deformation of the release film 20 can be suppressed by reducing the thickness fluctuation range. In addition, when the ceramic green sheets are formed on the release film 20, the thickness fluctuation range of the ceramic green sheets can be reduced.

本揭示之剝離膜之寬度方向之厚度變動幅度為剝離膜20之寬度方向之兩端間之剝離膜之厚度的最大值與最小值之差。該差如下求得。The width of the thickness variation in the width direction of the release film of the present disclosure is the difference between the maximum value and the minimum value of the thickness of the release film between both ends in the width direction of the release film 20 . The difference is obtained as follows.

於剝離膜20設置基準點,沿寬度方向設定複數個測定剝離膜之厚度之位置。測定之位置之間隔適當設定即可。例如,由於剝離膜之厚度實質上不易劇烈變化,故設為1 mm至10 mm左右之間隔即可。又,基準點可設為例如剝離膜之側端。於各個測定位置測定剝離膜之厚度,且使膜於長邊方向適當移動,同樣地,適時測定剝離膜之厚度。使用於寬度方向上之相同位置測定出之複數個長邊方向之厚度測定值,算出平均值,就寬度方向之測定位置各者算出之剝離膜之厚度平均值中之最大值與最小值之差成為厚度變動幅度。A reference point is set on the release film 20, and a plurality of positions for measuring the thickness of the release film are set along the width direction. The interval between the measured positions can be appropriately set. For example, since the thickness of the peeling film is substantially less likely to change drastically, it may be set to an interval of about 1 mm to 10 mm. Moreover, a reference point can be set as the side edge of a peeling film, for example. The thickness of the peeling film was measured at each measurement position, and the film was appropriately moved in the longitudinal direction. Similarly, the thickness of the peeling film was appropriately measured. The average value is calculated by using a plurality of measured values of thickness in the longitudinal direction measured at the same position in the width direction, and the difference between the maximum value and the minimum value of the average value of the thickness of the release film calculated for each measurement position in the width direction becomes the thickness variation range.

作為厚度測定方法,列舉接觸式厚度測定器、光學式厚度測定器、靜電電容式厚度測定器、及使用β射線或螢光X射線等之放射線式之厚度測定器等之方法、以及利用顯微鏡觀察測定剝離膜20之剖面之方法等。若使用接觸式厚度測定器,則可直接測定剝離膜20之厚度變動。又,亦可以相同之方法或不同之方法分別測定基材膜22與剝離層24之厚度變動幅度,並合計各者之厚度作為剝離膜20之厚度。例如,亦可以放射線式膜厚計測定基材膜22之厚度,以由分光光度求得之光學式測定,測定剝離層24之厚度,並合計各者之厚度變動幅度,作為剝離膜20之厚度變動幅度。另,光學式厚度測定器之測定點徑只要適當設定即可,亦可設為0.2 m~ 2 mm左右。As the thickness measurement method, methods such as a contact thickness measurement device, an optical thickness measurement device, an electrostatic capacitance type thickness measurement device, and a radiation type thickness measurement device using beta rays, fluorescent X-rays, etc., and observation by a microscope are exemplified. A method of measuring the cross section of the release film 20, etc. If a contact thickness measuring device is used, the thickness variation of the release film 20 can be directly measured. In addition, the thickness fluctuation range of the base film 22 and the peeling layer 24 may be measured separately by the same method or a different method, and the thickness of each may be summed up as the thickness of the peeling film 20 . For example, the thickness of the base film 22 may be measured with a radiation-type film thickness meter, the thickness of the release layer 24 may be measured by an optical measurement obtained by spectrophotometry, and the thickness variation of each may be summed up as the thickness of the release film 20 . range of change. In addition, the measurement spot diameter of the optical thickness measuring device may be appropriately set, and may be set to about 0.2 m to 2 mm.

又,亦可於塗佈裝置或切斷裝置等之生產線內設置厚度測定器,逐次測定厚度。藉由以光學式或放射線式進行將測定器設置於生產線內之厚度測定,而可防止測定器與剝離膜20接觸。藉此,可抑制損傷等,充分維持剝離膜卷之品質。藉由於塗佈生產線或切斷生產線內設置厚度測定器,於搬送剝離膜20時一面於寬度方向橫穿厚度測定器一面進行測定,而可遍及剝離膜20之全長測量厚度。In addition, a thickness measuring device may be installed in a production line such as a coating device or a cutting device, and the thickness may be measured successively. By carrying out the thickness measurement in which the measuring device is installed in the production line by an optical type or a radiation type, it is possible to prevent the measuring device from coming into contact with the release film 20 . Thereby, damage etc. can be suppressed, and the quality of a peeling film roll can be fully maintained. By arranging the thickness gauge in the coating line or the cutting line, the thickness can be measured over the entire length of the release film 20 by measuring while crossing the thickness gauge in the width direction when the release film 20 is conveyed.

圖3係剝離膜卷100之側視圖。於剝離膜卷100之側面12,捲繞於捲芯10之剝離膜20之側端部露出。但,圖3中,為了說明,僅顯示最外周之剝離膜20。如圖3所示,側視圖中,自剝離膜卷100之捲芯10之外周面10a沿剝離膜卷100之徑向R測定之距離r[mm]為10~130 mm時,滿足下述式(1)。 (-2r+670)≦K(r)≦(-1.25r+862.5)…(1)FIG. 3 is a side view of the roll 100 of release film. On the side surface 12 of the release film roll 100, the side end of the release film 20 wound around the core 10 is exposed. However, in FIG. 3, only the release film 20 of the outermost periphery is shown for illustration. As shown in FIG. 3, in the side view, when the distance r [mm] measured from the outer peripheral surface 10a of the core 10 of the peeling film roll 100 along the radial direction R of the peeling film roll 100 is 10 to 130 mm, the following formula is satisfied (1). (-2r+670)≦K(r)≦(-1.25r+862.5)…(1)

式(1)中,K(r)表示反彈硬度[HL]。該反彈硬度K(r)係由使球撞擊剝離膜卷100之外周面26之剝離膜20之表面之回彈而求得。反彈硬度K(r)可由里氏硬度計或以反彈式硬度計等名稱在市場銷售之測定器測定。作為測定器之製造公司,列舉SMART SENSOR公司等。另,亦有將本揭示之反彈硬度稱為里氏硬度之情形。另,上述式(1)中,特定出距離r為10~130 mm時之反彈硬度K(r)之上限值與下限值。In the formula (1), K(r) represents the rebound hardness [HL]. The rebound hardness K(r) is obtained from the rebound of the surface of the release film 20 of the outer peripheral surface 26 of the release film roll 100 when a ball hits it. The rebound hardness K(r) can be measured by a Leeb hardness tester or a tester sold in the market under the name of a rebound hardness tester. As a manufacturing company of the measuring device, SMART SENSOR and the like are mentioned. In addition, there are cases where the rebound hardness of the present disclosure is called Leeb hardness. In addition, in the above formula (1), the upper limit value and the lower limit value of the rebound hardness K(r) when the distance r is 10 to 130 mm are specified.

自捲芯10之外周面10a至卷狀剝離膜20之外周面26之沿徑向R之距離r0 之下限可為160 mm,亦可為200 mm。該情形時,距離r為160 mm以上時,反彈硬度K(r)可為350~662.5 HL。藉此,於剝離膜卷100全體,可使相鄰之剝離膜20彼此充分密接,且充分抑制於剝離膜卷100之外周部之剝離膜產生褶皺。距離r0 之上限可為500 mm。The lower limit of the distance r 0 along the radial direction R from the outer peripheral surface 10 a of the roll core 10 to the outer peripheral surface 26 of the roll release film 20 may be 160 mm or 200 mm. In this case, when the distance r is 160 mm or more, the rebound hardness K(r) may be 350 to 662.5 HL. Thereby, in the whole peeling film roll 100, the adjacent peeling films 20 can be sufficiently adhered to each other, and the generation of wrinkles in the peeling film in the outer peripheral portion of the peeling film roll 100 can be sufficiently suppressed. The upper limit of the distance r 0 may be 500 mm.

圖4係用以說明反彈硬度K(r)之測定方法之圖。圖3之剝離膜卷100中,距離r0 超出130 mm之情形時,為了測定距離r在10~130 mm範圍之反彈硬度K(r),需拉出捲繞於剝離膜卷100之剝離膜20,直至距離r為130 mm為止。且,卷23之側面12A中,剝離膜卷100之沿徑向之捲芯10之外周面10a至卷23之外周面26A之距離r達到130 mm後,如圖4所示,將測定器之感測器抵壓於在卷23(剝離膜卷)之外周面26A露出之剝離膜20之表面27,測定反彈硬度K(r)。此時,感測器抵壓於剝離膜20之寬度方向之中央部。又,如箭頭P所示,朝捲芯之中心C抵壓。藉此,測定距離r為130 mm時之反彈硬度K(r)。其後,一面拉出剝離膜20,一面測定距離r在10~130 mm範圍之反彈硬度K(r)即可。一般而言,由於剝離膜卷中可謂反彈硬度不會劇烈變化,故較佳以每隔5 mm左右之距離r測定反彈硬度K(r)。又,距離r0 超出130 mm之情形時,於為了測定距離r在10~130 mm範圍之反彈硬度K(r),而拉出捲繞於剝離膜卷100之剝離膜20直至距離r變為130 mm之過程中,亦可與上述同樣地適當設定距離r之間隔,測定130 mm至距離r0 之反彈硬度K(r)。FIG. 4 is a diagram for explaining a method of measuring the rebound hardness K(r). In the release film roll 100 of FIG. 3, when the distance r 0 exceeds 130 mm, in order to measure the rebound hardness K(r) of the distance r in the range of 10 to 130 mm, the release film wound on the release film roll 100 needs to be pulled out. 20 until the distance r is 130 mm. And, in the side surface 12A of the roll 23, after the distance r from the outer peripheral surface 10a of the core 10 in the radial direction of the release film roll 100 to the outer peripheral surface 26A of the roll 23 reaches 130 mm, as shown in FIG. The sensor is pressed against the surface 27 of the release film 20 exposed on the outer peripheral surface 26A of the roll 23 (release film roll), and the rebound hardness K(r) is measured. At this time, the sensor is pressed against the central portion of the release film 20 in the width direction. Moreover, as shown by the arrow P, it presses toward the center C of a winding core. Thereby, the rebound hardness K(r) when the distance r was 130 mm was measured. After that, while pulling out the release film 20, it is sufficient to measure the rebound hardness K(r) of the distance r in the range of 10 to 130 mm. Generally speaking, since the rebound hardness does not change drastically in the release film roll, it is preferable to measure the rebound hardness K(r) at a distance r of about 5 mm. In addition, when the distance r 0 exceeds 130 mm, in order to measure the rebound hardness K(r) of the distance r in the range of 10 to 130 mm, the release film 20 wound on the release film roll 100 is pulled out until the distance r becomes In the process of 130 mm, the interval of distance r can also be appropriately set in the same way as above, and the rebound hardness K(r) from 130 mm to distance r 0 can be measured.

距離r為10~130 mm時,若反彈硬度K(r)變高,則相鄰之剝離膜20彼此過度密接,易將基材膜22之凹凸形狀轉印於剝離層24。若於此種剝離膜20上形成陶瓷生坯片,則有陶瓷生坯片之厚度變動幅度變大之傾向。另一方面,若反彈硬度K(r)變低,則於相鄰之剝離膜20間存在之空氣變多,於剝離膜卷100之內側部分,有剝離膜20易竹筍狀滑動之傾向、及易因振動而產生捲繞偏移之傾向。若發生此種現象,則會於剝離層24產生損傷,易在形成於剝離膜上之陶瓷生坯片產生針孔。因本實施形態之剝離膜卷100滿足上述式(1),故可充分減少於剝離膜20之剝離層24產生之損壞(凹凸及損傷)。When the distance r is 10 to 130 mm, when the rebound hardness K(r) is high, the adjacent release films 20 are too closely adhered to each other, and the uneven shape of the base film 22 is easily transferred to the release layer 24 . When a ceramic green sheet is formed on such a release film 20, the thickness variation of the ceramic green sheet tends to increase. On the other hand, if the rebound hardness K(r) becomes lower, more air exists between the adjacent release films 20, and the inner portion of the release film roll 100 tends to be prone to the release film 20 sliding like bamboo shoots, and The tendency of winding deflection due to vibration. If such a phenomenon occurs, the peeling layer 24 is damaged, and pinholes are easily generated in the ceramic green sheet formed on the peeling film. Since the peeling film roll 100 of the present embodiment satisfies the above-mentioned formula (1), damage (unevenness and damage) generated in the peeling layer 24 of the peeling film 20 can be sufficiently reduced.

距離r在10~130 mm之範圍內,可以隨著距離r增加反彈硬度K(r)減少之方式捲繞剝離膜20。藉此,可充分抑制於剝離膜卷100之內周部與外周部之兩者產生捲繞偏移。距離r為130 mm以上時,亦可以隨著距離r增加反彈硬度K(r)減少之方式捲繞剝離膜20。距離r未達10 mm之範圍時,反彈硬度K(r)可為650 HL以上。藉此,可充分抑制剝離膜於捲芯10附近產生捲繞偏移,或捲芯10自剝離膜卷100脫落。另,對於距離r未達10 mm之部分,可不形成陶瓷生坯片,而於剝離膜卷之更換作業時加以有效活用。When the distance r is in the range of 10-130 mm, the release film 20 can be wound in such a manner that the rebound hardness K(r) decreases as the distance r increases. Thereby, generation|occurrence|production of winding misalignment in both the inner peripheral part and the outer peripheral part of the peeling film roll 100 can be suppressed fully. When the distance r is 130 mm or more, the release film 20 may be wound so that the rebound hardness K(r) decreases as the distance r increases. When the distance r is less than 10 mm, the rebound hardness K(r) can be above 650 HL. Thereby, it is possible to sufficiently suppress the occurrence of winding deviation of the release film in the vicinity of the core 10 or the detachment of the core 10 from the release film roll 100 . In addition, for the part where the distance r is less than 10 mm, the ceramic green sheet may not be formed, and it can be effectively used in the replacement operation of the peeling film roll.

圖5係顯示剝離膜卷100之製造裝置之一例之圖。圖5之製造裝置300中,使用剝離膜卷200。剝離膜卷200將具有較剝離膜20寬之寬度(例如1~2 m)之剝離膜20A捲繞於捲芯11。剝離膜卷200藉由以眾所周知之方法,將剝離膜20A捲繞於捲芯11而製造。此時,可將剝離膜20A之基材膜側作為內側捲繞於捲芯11,亦可將剝離層側作為內側而捲繞。5 : is a figure which shows an example of the manufacturing apparatus of the peeling film roll 100. In the manufacturing apparatus 300 of FIG. 5, the peeling film roll 200 is used. The release film roll 200 winds the release film 20A having a wider width (for example, 1 to 2 m) than the release film 20 on the core 11 . The release film roll 200 is manufactured by winding the release film 20A around the core 11 by a well-known method. At this time, the base film side of the release film 20A may be wound around the core 11 as the inner side, or the release layer side may be wound as the inner side.

製造裝置300於上游側,將剝離膜卷200之捲芯11插入至旋轉軸202,旋轉軸202可旋轉地支持剝離膜卷200。又,製造裝置300具備:夾壓輥50,其具備於上下方向夾著自剝離膜卷200拉出之剝離膜20A之一對輥;切斷部60;及捲取軸102,其插入至剝離膜卷100之捲芯10,可旋轉地支持捲芯10。The manufacturing apparatus 300 inserts the core 11 of the peeling film roll 200 on the upstream side to the rotating shaft 202, and the rotating shaft 202 supports the peeling film roll 200 rotatably. Moreover, the manufacturing apparatus 300 is provided with the nip roll 50 provided with the pair of rolls which sandwich the release film 20A pulled out from the release film roll 200 in the up-down direction; the cutting part 60; The core 10 of the film roll 100 supports the core 10 rotatably.

夾壓輥50中,上輥50a可為表面係橡膠製之輥。下輥50b可為表面係金屬之輥。夾壓輥50具有使剝離膜20A之張力於其之上游側與下游側不同之功能。藉此,可高度自由地進行將剝離膜20捲繞於捲芯10時之張力控制。Among the nip rollers 50, the upper roller 50a may be a roller whose surface is made of rubber. The lower roller 50b may be a roller whose surface is made of metal. The nip roll 50 has a function of making the tension of the release film 20A different between its upstream side and its downstream side. Thereby, the tension control at the time of winding the release film 20 around the core 10 can be performed highly freely.

切斷部60具有上刃輥60a與下刃輥60b。上刃輥60a可沿其旋轉軸方向,以特定間隔安裝複數片上刃。上刃輥60a之上刃可與下刃輥60b嚙合。將通過夾壓輥50之剝離膜20A於上刃輥60a與下刃輥60b間,沿長邊方向切斷。藉此,分割成例如具有100~500 mm寬度之剝離膜20。若於捲取軸102安裝複數個捲芯10,一面以接觸輥70按壓被切斷之剝離膜20一面將其捲繞於捲芯10,則可一次性製造複數個剝離膜卷100。切斷部60可使用排刃等眾所周知之切斷機。另,亦可不具有切斷部60。該情形時,可自一個剝離膜卷200獲得一個剝離膜卷100。The cutting part 60 has an upper blade roller 60a and a lower blade roller 60b. The upper blade roller 60a may be provided with a plurality of upper blades at specific intervals along the rotation axis direction thereof. The upper blade of the upper blade roller 60a may be engaged with the lower blade roller 60b. The release film 20A that has passed through the nip roll 50 is cut in the longitudinal direction between the upper blade roll 60a and the lower blade roll 60b. Thereby, it is divided|segmented into the release film 20 which has a width|variety of 100-500 mm, for example. When a plurality of cores 10 are attached to the take-up shaft 102 and the cut release film 20 is wound around the core 10 while pressing the cut release film 20 with the touch roll 70, a plurality of release film rolls 100 can be produced at one time. As the cutting part 60, a well-known cutting machine such as a row blade can be used. In addition, the cutting part 60 may not be provided. In this case, one release film roll 100 can be obtained from one release film roll 200 .

將以切斷部60切斷而得之剝離膜20捲繞於安裝在捲取軸102之捲芯10。此時,捲取軸102以特定轉矩旋轉,且一面與剝離膜20之剝離層24接觸一面旋轉之接觸輥70將捲繞之剝離膜20按壓於捲芯10側。即,剝離膜20一面由接觸輥70按壓一面捲繞。接觸輥70亦可旋轉驅動。如此,藉由使用接觸輥70,即使不增大張力亦可充分減少剝離膜20間之空氣。藉此,可抑制捲繞偏移、滑動現象及捲繞過緊之產生,抑制於剝離層24產生褶皺及損傷。The release film 20 cut by the cutting part 60 is wound around the core 10 attached to the winding shaft 102 . At this time, the take-up shaft 102 rotates with a predetermined torque, and the contact roller 70 which rotates while being in contact with the release layer 24 of the release film 20 presses the wound release film 20 against the core 10 side. That is, the release film 20 is wound while being pressed by the touch roll 70 . The touch roller 70 may also be rotationally driven. In this way, by using the touch roller 70, the air between the release films 20 can be sufficiently reduced without increasing the tension. Thereby, the occurrence of winding misalignment, slip phenomenon, and winding tightness can be suppressed, and the occurrence of wrinkles and damage in the peeling layer 24 can be suppressed.

藉由控制接觸輥70之按壓力及驅動力、及捲取軸102之轉矩控制,可調整捲繞於剝離膜卷100之剝離膜20之剝離層24表面之反彈硬度K(r)。例如,若切斷剝離膜20而捲繞,則剝離膜卷100之直徑(卷徑)逐漸變大。藉由根據捲繞時之卷徑控制捲取軸102之轉矩,而將捲繞張力調整為期望之張力。隨著卷徑變大,張力所需以上地降低,反彈硬度K(r)低於下限之情形時,只要提高捲取軸102之轉矩即可提高反彈硬度。又,即使卷徑變大張力亦未充分降低,反彈硬度K(r)超出上限之情形時,可降低捲取軸102之轉矩,而降低反彈硬度。By controlling the pressing force and driving force of the touch roller 70 and the torque control of the winding shaft 102 , the rebound hardness K(r) of the surface of the release layer 24 of the release film 20 wound on the release film roll 100 can be adjusted. For example, when the release film 20 is cut and wound, the diameter (roll diameter) of the release film roll 100 gradually increases. The winding tension is adjusted to a desired tension by controlling the torque of the winding shaft 102 according to the winding diameter during winding. As the coil diameter increases, the tension decreases more than necessary, and when the rebound hardness K(r) is lower than the lower limit, the rebound hardness can be increased only by increasing the torque of the winding shaft 102 . In addition, even if the coil diameter increases, the tension is not sufficiently lowered, and when the rebound hardness K(r) exceeds the upper limit, the torque of the winding shaft 102 can be reduced to reduce the rebound hardness.

剝離膜卷100之製造方法不限定於上述方法。例如,亦可僅藉由驅動接觸輥,調整接觸輥之轉矩而製造。The manufacturing method of the peeling film roll 100 is not limited to the said method. For example, it is also possible to manufacture only by driving the touch roll and adjusting the torque of the touch roll.

圖6係本揭示之一實施形態之陶瓷零件片材之剖視圖。圖6之陶瓷零件片材40之製造方法具有以下步驟:於自剝離膜卷100拉出之剝離膜20之剝離層24之表面24a,使用包含陶瓷粉末之糊膏與電極糊膏,形成包含陶瓷生坯片32及電極生坯片34之生坯片30。6 is a cross-sectional view of a ceramic component sheet according to an embodiment of the present disclosure. The manufacturing method of the ceramic part sheet 40 of FIG. 6 has the following steps: on the surface 24a of the peeling layer 24 of the peeling film 20 drawn from the peeling film roll 100, a paste containing ceramic powder and an electrode paste are used to form a paste containing ceramic powder and an electrode paste. Green sheet 30 of green sheet 32 and electrode green sheet 34 .

陶瓷生坯片32可塗佈含有陶瓷粉末之陶瓷糊膏,使之乾燥而形成。電極生坯片34可於陶瓷生坯片32之上塗佈電極糊膏,使之乾燥而形成。The ceramic green sheet 32 can be formed by coating and drying a ceramic paste containing ceramic powder. The electrode green sheet 34 can be formed by coating electrode paste on the ceramic green sheet 32 and drying it.

例如若為積層陶瓷電容器,則可將介電質原料(陶瓷粉末)與有機媒劑混練而調製陶瓷糊膏。作為介電質原料,列舉藉由燒成而成為複合氧化物或氧化物之各種化合物。例如,可自碳酸鹽、硝酸鹽、氫氧化物、有機金屬化合物等適當選擇使用。介電質原料之平均粒子徑為4 μm以下,較佳為0.1~3.0 μm之粉末。For example, in the case of a multilayer ceramic capacitor, a ceramic paste can be prepared by kneading a dielectric raw material (ceramic powder) and an organic vehicle. As a dielectric raw material, various compounds which become composite oxides or oxides by firing are exemplified. For example, carbonates, nitrates, hydroxides, organometallic compounds and the like can be appropriately selected and used. The average particle size of the dielectric raw material is 4 μm or less, preferably 0.1-3.0 μm powder.

電極糊膏例如可將選自由各種導電性金屬及合金等之導電體材料、以及各種氧化物、有機金屬化合物及樹脂酸鹽等於燒成後成為導電體材料之材料等所組成之群之至少一者、與有機媒劑混練而調製。作為製造電極糊膏時使用之導電體材料,較佳使用Ni金屬、Ni合金、或該等之混合物。為提高接著性,電極糊膏亦可包含塑化劑。作為塑化劑,列舉鄰苯二甲酸丁基苄酯(BBP,Butyl Benzyl Phthalate)等鄰苯二甲酸酯、己二酸、磷酸酯、乙二醇類等。The electrode paste can be, for example, at least one selected from the group consisting of conductive materials such as various conductive metals and alloys, and various oxides, organometallic compounds, and resinates that become conductive materials after firing. It is prepared by mixing with organic media. As the conductor material used in the production of the electrode paste, Ni metal, Ni alloy, or a mixture thereof is preferably used. To improve adhesion, the electrode paste may also contain a plasticizer. Examples of the plasticizer include phthalates such as butyl benzyl phthalate (BBP, Butyl Benzyl Phthalate), adipic acid, phosphoric acid esters, glycols, and the like.

陶瓷糊膏及電極糊膏所含之有機媒劑係將黏合劑樹脂溶解於有機溶劑中而調製。作為用於有機媒劑之黏合劑樹脂,列舉例如乙基纖維素、丙烯酸系樹脂、縮丁醛系樹脂、聚乙烯縮醛、聚乙烯醇、聚烯烴、聚胺酯、聚苯乙烯、及該等之共聚物等。其中,較佳使用縮丁醛系樹脂,具體而言係聚乙烯縮丁醛系樹脂。藉由使用縮丁醛系樹脂,可提高陶瓷生坯片之機械強度。陶瓷糊膏及電極糊膏之一者或兩者亦可視需要含有選自由各種分散劑、塑化劑、除電劑、介電質、玻璃粉、絕緣體等所組成之群之至少一種添加物。The organic vehicle contained in the ceramic paste and the electrode paste is prepared by dissolving a binder resin in an organic solvent. Examples of the binder resin used for the organic vehicle include ethyl cellulose, acrylic resin, butyral resin, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and the like. Copolymers, etc. Among them, butyral-based resins, specifically polyvinyl butyral-based resins, are preferably used. By using the butyral-based resin, the mechanical strength of the ceramic green sheet can be improved. One or both of the ceramic paste and the electrode paste may optionally contain at least one additive selected from the group consisting of various dispersants, plasticizers, antistatic agents, dielectrics, glass frit, insulators, and the like.

使用例如刮板裝置等,將上述陶瓷糊膏塗佈於剝離膜20之剝離層24之表面24a。且,使塗佈之陶瓷糊膏於乾燥裝置內,例如以50~100°C之溫度乾燥1~20分鐘,形成陶瓷生坯片32。陶瓷生坯片32與乾燥前相比,收縮5~25%。The above-mentioned ceramic paste is applied to the surface 24a of the release layer 24 of the release film 20 using, for example, a squeegee device. Then, the applied ceramic paste is dried in a drying apparatus, for example, at a temperature of 50 to 100° C. for 1 to 20 minutes to form a ceramic green sheet 32 . The ceramic green sheet 32 shrinks by 5 to 25% compared to before drying.

其後,於陶瓷生坯片32之表面32a上,使用例如網版印刷裝置,以成為特定圖案之方式印刷上述電極糊膏。使印刷後之電極糊膏於乾燥裝置內,例如以50~100°C之溫度乾燥1~20分鐘,形成電極生坯片34。如此,可獲得於剝離膜20之剝離層24之上依序積層有陶瓷生坯片32與電極生坯片34之陶瓷零件片材40。Then, on the surface 32a of the ceramic green sheet 32, the above-mentioned electrode paste is printed in a specific pattern using, for example, a screen printing apparatus. The printed electrode paste is dried in a drying device, for example, at a temperature of 50 to 100° C. for 1 to 20 minutes to form an electrode green sheet 34 . In this way, the ceramic component sheet 40 in which the ceramic green sheet 32 and the electrode green sheet 34 are sequentially laminated on the release layer 24 of the release film 20 can be obtained.

若剝離膜卷100之剝離膜20之凹凸變大,則陶瓷生坯片32之厚度變動幅度變大。自剝離膜卷100拉出之剝離膜20已充分減少於剝離層24因捲繞偏移及滑動現象等所致之損傷之產生及凹凸。因此,可於遍及自捲繞於剝離膜卷100之剝離膜20之前端至後端間之廣闊區域,形成充分抑制厚度變動之陶瓷生坯片32。使用具備此種陶瓷生坯片之陶瓷零件片材40製作之陶瓷零件可靠性佳。When the unevenness|corrugation of the release film 20 of the release film roll 100 becomes large, the thickness fluctuation range of the ceramic green sheet 32 becomes large. The peeling film 20 pulled out from the peeling film roll 100 has sufficiently reduced the generation of damage and unevenness of the peeling layer 24 due to winding deviation and sliding phenomenon. Therefore, the ceramic green sheet 32 in which thickness variation is sufficiently suppressed can be formed over a wide area from the front end to the rear end of the release film 20 wound on the release film roll 100 . The reliability of a ceramic part produced using the ceramic part sheet 40 having such a ceramic green sheet is good.

陶瓷生坯片32及電極生坯片34之厚度亦可分別為1.0 μm以下。即使厚度如此小,厚度變動亦得到抑制,因此可獲得具有高可靠性之陶瓷零件。本揭示之陶瓷零件片材不限定於圖6者,例如亦可不具有電極生坯片,而僅以陶瓷生坯片32構成。The thickness of the ceramic green sheet 32 and the electrode green sheet 34 may be 1.0 μm or less, respectively. Even if the thickness is so small, thickness variation is suppressed, so that a ceramic part with high reliability can be obtained. The ceramic component sheet of the present disclosure is not limited to that shown in FIG. 6 , and for example, it may be composed of only the ceramic green sheet 32 without the electrode green sheet.

本揭示之一實施形態之陶瓷零件之製造方法具有:積層步驟,其準備複數個陶瓷零件片材,積層複數個陶瓷零件片材之生坯片,獲得積層體;燒成步驟,其燒成積層體,獲得燒結體;及電極形成步驟,其於該燒結體形成端子電極,獲得積層陶瓷電容器。A method of manufacturing a ceramic part according to an embodiment of the present disclosure includes: a lamination step of preparing a plurality of ceramic part sheets, laminating green sheets of the plurality of ceramic part sheets to obtain a laminated body; and a firing step of firing the laminated body body to obtain a sintered body; and an electrode formation step of forming terminal electrodes on the sintered body to obtain a multilayer ceramic capacitor.

圖7係顯示以上述製造方法製造之積層陶瓷電容器之一例之剖視圖。積層陶瓷電容器90具備內層部92、及於積層方向夾著該內層部92之一對外層部93。積層陶瓷電容器90於側面具有端子電極95。FIG. 7 is a cross-sectional view showing an example of a multilayer ceramic capacitor manufactured by the above-described manufacturing method. The multilayer ceramic capacitor 90 includes an inner layer portion 92 and an outer layer portion 93 sandwiching one of the inner layer portions 92 in the stacking direction. The multilayer ceramic capacitor 90 has terminal electrodes 95 on the side surfaces.

內層部92具有複數層(本例中為13層)陶瓷層96(介電層)、及複數層(本例中為12層)內部電極層94。陶瓷層96與內部電極層94交替積層。內部電極層94與端子電極95電性連接。外層部93由陶瓷層形成。該陶瓷層例如亦可與陶瓷生坯片32同樣地形成。The inner layer portion 92 has a plurality of layers (13 layers in this example) of ceramic layers 96 (dielectric layers) and a plurality of layers (12 layers in this example) of internal electrode layers 94 . The ceramic layers 96 and the internal electrode layers 94 are alternately laminated. The internal electrode layer 94 is electrically connected to the terminal electrode 95 . The outer layer portion 93 is formed of a ceramic layer. This ceramic layer may be formed in the same manner as the ceramic green sheet 32, for example.

積層步驟中,剝離圖6所示之陶瓷零件片材40之剝離膜20,獲得生坯片30。將該生坯片30之一面30b積層於外層用生坯片。自另一陶瓷零件片材40剝離另一剝離膜20,獲得另一生坯片30,以最先剝離之生坯片之電極生坯片34與另一生坯片30之30b相向之方式積層。其後,藉由重複進行此種順序,積層生坯片30,而獲得積層體。即,該積層步驟中,剝離剝離膜20,獲得生坯片30,並依序積層生坯片30。藉由重複複數次該順序,形成積層體。最後,亦進行外層用生坯片之積層。In the lamination step, the release film 20 of the ceramic component sheet 40 shown in FIG. 6 is peeled off to obtain a green sheet 30 . One surface 30b of the green sheet 30 is laminated on the green sheet for outer layers. The other peeling film 20 is peeled off from the other ceramic part sheet 40 to obtain another green sheet 30, and the electrode green sheet 34 of the first peeled green sheet and the electrode green sheet 30b of the other green sheet 30 are laminated so that they face each other. Then, by repeating this procedure, the green sheets 30 are laminated to obtain a laminated body. That is, in this lamination step, the release film 20 is peeled off to obtain a green sheet 30, and the green sheets 30 are sequentially laminated. By repeating this sequence a plurality of times, a layered body is formed. Finally, lamination of green sheets for outer layers is also performed.

積層體之生坯片之積層片數未特別限制,例如可為數十層至數百層。亦可於與積層體之積層方向正交之兩端面,設置未形成電極層之厚的外層用生坯片。亦可於形成積層體後,切斷積層體而作為生坯片。The number of laminated sheets of the green sheets of the laminated body is not particularly limited, and may be, for example, tens to hundreds of layers. A green sheet for an outer layer having a thickness where no electrode layer is formed may be provided on both end surfaces orthogonal to the lamination direction of the laminate. After forming the layered body, the layered body may be cut and used as a green sheet.

燒成步驟中,將積層步驟中獲得之積層體(生坯片)進行燒成,獲得燒結體。燒成條件較佳以1100~1300°C,於加濕之氮氣與氫氣之混合氣體等之氛圍下進行。但,燒成時之氛圍中之氧分壓較佳為10-2 Pa以下,更佳為10-2 ~10-8 Pa。另,較佳於燒成前實施積層體之脫黏合劑處理。脫黏合劑處理可以通常條件進行。例如,使用Ni或Ni合金等賤金屬作為內部電極層之介電質材料之情形時,較佳以200~600°C進行。In the firing step, the layered body (green sheet) obtained in the layering step is fired to obtain a sintered body. The firing conditions are preferably 1100 to 1300°C in an atmosphere such as a humidified mixed gas of nitrogen and hydrogen. However, the oxygen partial pressure in the atmosphere during firing is preferably 10 -2 Pa or less, more preferably 10 -2 to 10 -8 Pa. In addition, it is preferable to perform the debindering process of a laminated body before baking. The debinder treatment can be carried out under normal conditions. For example, when a base metal such as Ni or a Ni alloy is used as the dielectric material of the internal electrode layer, it is preferably performed at 200 to 600°C.

燒成後,為了使構成燒結體之陶瓷層再氧化,亦可進行熱處理。熱處理之保持溫度或最高溫度較佳為1000~1100°C。熱處理時之氧分壓較佳高於燒成時之還原氛圍之氧分壓,更佳為10-2 Pa~1 Pa。較佳為對如此獲得之燒結體利用例如滾筒研磨、噴砂等實施端面研磨。After firing, in order to reoxidize the ceramic layer constituting the sintered body, heat treatment may be performed. The holding temperature or the maximum temperature of the heat treatment is preferably 1000 to 1100°C. The oxygen partial pressure during heat treatment is preferably higher than the oxygen partial pressure of the reducing atmosphere during firing, more preferably 10 -2 Pa to 1 Pa. The sintered body thus obtained is preferably subjected to face grinding by, for example, barrel grinding, sandblasting, or the like.

電極形成步驟中,藉由於燒結體之側面上燒接端子電極用糊膏,形成端子電極95,而可獲得圖7所示之積層陶瓷電容器90。該積層陶瓷電容器90之製造方法中,使用具有充分減少因剝離膜20之凹凸及捲繞偏移等所致之損傷之剝離層的剝離膜卷100。因此,可充分減少陶瓷層96及內部電極層94之厚度不均及針孔。因此,抑制耐壓降低,可靠性優異。In the electrode forming step, the terminal electrode 95 is formed by firing the terminal electrode paste on the side surface of the sintered body, whereby the multilayer ceramic capacitor 90 shown in FIG. 7 can be obtained. In the manufacturing method of this multilayer ceramic capacitor 90, the peeling film roll 100 which has the peeling layer which fully reduces the damage by the unevenness|corrugation of the peeling film 20, winding offset, etc. is used. Therefore, thickness unevenness and pinholes of the ceramic layer 96 and the internal electrode layer 94 can be sufficiently reduced. Therefore, the breakdown of the withstand voltage is suppressed, and the reliability is excellent.

以上,雖已說明若干實施形態,但本揭示並非限定於上述實施形態者。例如,雖已說明形成積層陶瓷電容器作為陶瓷零件之例,但本揭示之陶瓷零件不限定於積層陶瓷電容器,例如亦可為其它陶瓷零件。陶瓷零件亦可為例如變阻器或積層電感器。 [實施例]Although some embodiments have been described above, the present disclosure is not limited to the above-mentioned embodiments. For example, although the example of forming a multilayer ceramic capacitor as a ceramic component has been described, the ceramic component of the present disclosure is not limited to a multilayer ceramic capacitor, and may be other ceramic components, for example. The ceramic part can also be, for example, a varistor or a multilayer inductor. [Example]

雖欲參照實施例及比較例,更詳細地說明本揭示之內容,但本揭示並非限定於下述實施例者。Although the content of the present disclosure will be described in more detail with reference to Examples and Comparative Examples, the present disclosure is not limited to the following Examples.

(實施例1) <剝離膜卷之製作> 為製作剝離膜,根據以下順序調製剝離劑溶液。對於100質量部之壬二醇二丙烯酸酯,準備0.25質量部之丙烯酸酯改性矽酮油(商品名:X-22-2445,信越化學工業股份有限公司製)、100質量部之甲基乙基酮、及100質量部之甲苯。將該等放入金屬製容器中攪拌混合,獲得無色透明溶液。(Example 1) <Production of peeling film roll> In order to prepare a release film, a release agent solution was prepared according to the following procedure. For 100 parts by mass of nonanediol diacrylate, prepare 0.25 parts by mass of acrylate-modified silicone oil (trade name: X-22-2445, manufactured by Shin-Etsu Chemical Co., Ltd.), and 100 parts by mass of methyl ethyl acetate ketone, and 100 parts by mass of toluene. These were put into a metal container, stirred and mixed to obtain a colorless and transparent solution.

於上述溶液中加入2.5質量部之反應引發劑(商品名:Omnirad127、IGM Rasins B.V.製),調製塗佈液。自塗佈裝置之縫隙擠出塗佈液,塗佈於寬度1100 mm之雙軸延伸聚對苯二甲酸乙二酯膜(PET膜,厚度:30 μm)之一面,以溫度80°C之熱風吹30秒,使甲基乙基酮及甲苯蒸發。如此,於PET膜上形成塗佈層。2.5 parts by mass of a reaction initiator (trade name: Omnirad127, manufactured by IGM Rasins B.V.) was added to the above solution to prepare a coating liquid. The coating liquid was extruded from the gap of the coating device, and coated on one side of a biaxially stretched polyethylene terephthalate film (PET film, thickness: 30 μm) with a width of 1100 mm, and heated at a temperature of 80°C. The air was blown for 30 seconds to evaporate methyl ethyl ketone and toluene. In this way, a coating layer is formed on the PET film.

接著,於氧濃度100 ppm之氮氛圍下照射紫外線,使塗佈層硬化,形成具有剝離功能之剝離層。如此,獲得於PET膜之一面具有剝離層之剝離膜(切斷前)。使用掃描型白色干涉顯微鏡(裝置名:VS1540,日立Hightech股份有限公司製),測定剝離膜之剝離層之表面粗糙度(Rp)。其結果,剝離層之表面粗糙度(Rp)為30 nm。將此種剝離膜捲繞於捲芯,獲得剝離膜卷(切斷前)。另,剝離層之厚度為1 μm,剝離膜之寬度方向之厚度的最大值與最小值之差即厚度變動幅度為0.5 μm。又,製作之剝離膜之全長為7000 m。Next, ultraviolet rays are irradiated in a nitrogen atmosphere with an oxygen concentration of 100 ppm to harden the coating layer to form a peeling layer with a peeling function. In this way, a release film (before cutting) having a release layer on one surface of the PET film was obtained. Using a scanning white interference microscope (device name: VS1540, manufactured by Hitachi Hightech Co., Ltd.), the surface roughness (Rp) of the release layer of the release film was measured. As a result, the surface roughness (Rp) of the peeling layer was 30 nm. Such a release film was wound around a core to obtain a release film roll (before cutting). In addition, the thickness of the peeling layer was 1 μm, and the thickness fluctuation range, which is the difference between the maximum value and the minimum value of the thickness in the width direction of the peeling film, was 0.5 μm. In addition, the total length of the produced release film was 7000 m.

使用如圖5所示之製造裝置,將上述剝離膜卷(切斷前)安裝於旋轉軸202。以切斷部60將自剝離膜卷(切斷前)拉出之剝離膜沿長邊方法切斷成5個,設為寬度200 mm之尺寸。如圖5所示,將5卷剝離膜(切斷後)各者以剝離層24成為外側之方式捲繞於卷芯10。捲繞時,將接觸輥70按壓於剝離膜卷100,且一面使捲取軸102與接觸輥70旋轉驅動,一面將其捲繞於卷芯10。如此,獲得5卷剝離膜卷。5卷剝離膜卷以相同條件捲繞。5卷剝離膜卷之捲繞長度皆為6000 m。又,5卷剝離膜卷中,自捲芯之外周面至捲繞成卷狀之剝離膜之外周面之距離r0 皆為約205 mm。Using the manufacturing apparatus shown in FIG. 5, the said peeling film roll (before cutting) was attached to the rotating shaft 202. The peeling film drawn out from the peeling film roll (before cutting) was cut into five pieces along the long side by the cutting part 60, and the size was set to a width of 200 mm. As shown in FIG. 5 , each of the five rolls of the release film (after cutting) was wound around the core 10 so that the release layer 24 became the outer side. At the time of winding, the touch roll 70 is pressed against the release film roll 100 , and the winding shaft 102 and the touch roll 70 are driven to rotate, and are wound around the core 10 . In this way, 5 rolls of release film were obtained. 5 rolls of release film were wound under the same conditions. The winding length of the 5 rolls of release film is 6000 m. Moreover, in 5 rolls of peeling film rolls, the distance r0 from the outer peripheral surface of a core to the outer peripheral surface of the peeling film wound in a roll shape was all about 205 mm.

<反彈硬度K(r)之測定> 測定如此獲得之5卷剝離膜卷中之第1卷剝離膜卷之剝離層之反彈硬度K(r)。對反彈硬度K(r)之測定使用SMART SENSOR公司製之數位硬度計(商品名:AR936,測定範圍:170~960 HLD)。<Measurement of rebound hardness K(r)> The rebound hardness K(r) of the peeling layer of the first peeling film roll among the five peeling film rolls thus obtained was measured. The rebound hardness K(r) was measured using a digital hardness tester (trade name: AR936, measuring range: 170-960 HLD) manufactured by SMART SENSOR.

反彈硬度K(r)之測定係於剝離膜卷中捲繞於最外側之剝離膜之剝離層之表面(寬度方向之中央部),將數位硬度計之感測器抵壓於捲芯之中心C進行。測定係一面解卷剝離膜卷,一面測定沿徑向之距離r達到特定值時之剝離膜卷之反彈硬度K(r)。具體而言,於r為195 mm至135 mm之範圍,以10 mm之間隔測定。即,分別測定距離r為195 mm、185 mm、・・・135 mm時之反彈硬度K(r)。又,於距離r為135 mm至5 mm之範圍,以5 mm之間隔測定。即,分別測定距離r為135 mm、130 mm、・・・5 m時之反彈硬度K(r)。圖8中繪製出實施例1之距離r與反彈硬度K(r)之關係。如圖8所示,距離r為10~130 m時,反彈硬度K(r)滿足上述式(1)。The rebound hardness K(r) is measured on the surface of the release layer (the center part in the width direction) of the outermost release film in the release film roll, and the sensor of the digital hardness tester is pressed against the center of the roll core C is carried out. The measurement is to measure the rebound hardness K(r) of the release film roll when the distance r in the radial direction reaches a specific value while unwinding the release film roll. Specifically, in the range of r from 195 mm to 135 mm, measurements were made at 10 mm intervals. That is, the rebound hardness K(r) was measured when the distance r was 195 mm, 185 mm, and 135 mm. Also, when the distance r is in the range of 135 mm to 5 mm, the measurement is performed at intervals of 5 mm. That is, the rebound hardness K(r) was measured when the distance r was 135 mm, 130 mm, and 5 m. The relationship between the distance r and the rebound hardness K(r) of Example 1 is plotted in FIG. 8 . As shown in FIG. 8 , when the distance r is 10 to 130 m, the rebound hardness K(r) satisfies the above formula (1).

<介電質生坯片之形成與評估> 自5卷剝離膜卷中之第2卷剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,無特別異常。使用5卷剝離膜卷中之第3條剝離膜卷,根據以下順序形成介電質生坯片作為陶瓷零件片材。分別準備BaTiO3 系粉末作為陶瓷粉末,聚乙烯縮丁醛(PVB,Polyvinyl butyral)作為有機黏合劑,及甲醇作為溶劑。接著,對於100質量部之陶瓷粉末,調配10質量部之有機黏合劑、及165質量部之溶劑,以球磨機混練,獲得介電質漿料。<Formation and Evaluation of Dielectric Green Sheet> The release film was pulled out from the second release film roll among the 5 release film rolls, and the surface state of the release layer of the release film was visually inspected. As a result, there was no particular abnormality. Using the 3rd release film roll among the 5 rolls of release film rolls, a dielectric green sheet was formed as a ceramic component sheet according to the following procedure. BaTiO3 - based powder was prepared as a ceramic powder, polyvinyl butyral (PVB) as an organic binder, and methanol as a solvent, respectively. Next, with respect to 100 parts by mass of the ceramic powder, 10 parts by mass of the organic binder and 165 parts by mass of the solvent were prepared, and kneaded with a ball mill to obtain a dielectric slurry.

將剝離膜卷安裝於塗佈機,於自剝離膜卷拉出之剝離膜之剝離層側塗佈介電質漿料,於剝離膜上形成介電質生坯片。介電質生坯片之設定厚度為0.9 μm。調查形成於剝離膜上之介電質生坯片有無針孔、及介電質生坯片之厚度變動幅度。藉由圖像處理檢查裝置調查有無針孔。厚度變動幅度係使用直列設置之透過型X射線膜厚計(商品名:AccureX(股份)Hutec製)連續測定。厚度變動幅度由厚度之平均值、最大值及最小值求得。即,將最大值-平均值之絕對值與最小值-平均值之絕對值中較大的值設為厚度變動幅度。The release film roll was mounted on a coater, and the dielectric slurry was applied to the release layer side of the release film pulled out from the release film roll to form a dielectric green sheet on the release film. The set thickness of the dielectric green sheet was 0.9 μm. The presence or absence of pinholes in the dielectric green sheet formed on the release film and the variation in thickness of the dielectric green sheet were investigated. The presence or absence of pinholes is checked by an image processing inspection device. The thickness variation range was continuously measured using a transmission-type X-ray film thickness meter (trade name: manufactured by AccureX Co., Ltd. Hutec) installed in-line. The thickness variation range is obtained from the average value, maximum value and minimum value of the thickness. That is, the larger value of the absolute value of the maximum value and the average value and the absolute value of the minimum value and the average value is used as the thickness variation width.

其結果,介電質生坯片之厚度之平均值為0.9 μm,厚度變動幅度為0.04 μm。該變動幅度為設定厚度(0.9 μm)之±5%以內(0.045 μm),為良品。又,未檢測出針孔。As a result, the average thickness of the dielectric green sheets was 0.9 μm, and the thickness fluctuation range was 0.04 μm. The fluctuation range is within ±5% (0.045 μm) of the set thickness (0.9 μm), which is a good product. Also, no pinhole was detected.

(實施例2) 除了調整使用捲繞裝置捲繞剝離膜(切斷後)時之捲取軸102之轉矩,將施加於捲繞之剝離膜之張力設為實施例1之約0.8倍以外,與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定、介電質生坯片之形成及評估。圖8中繪製出實施例2之距離r與反彈硬度K(r)之關係。如圖8所示,距離r為10~130 m時,反彈硬度K(r)滿足上述式(1)。自剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,無特別異常。介電質生坯片之厚度之平均值為0.9 μm。又,介電質生坯片之厚度之變動幅度為0.03 μm,為良品。又,未檢測出針孔。(Example 2) The same procedure as in Example 1 was carried out, except that the torque of the winding shaft 102 when the release film (after cutting) was wound using the winding device was adjusted, and the tension applied to the wound release film was set to about 0.8 times that of Example 1. to make rolls of release film. And, similarly to Example 1, the measurement of rebound hardness K(r), and the formation and evaluation of a dielectric green sheet were performed. The relationship between the distance r and the rebound hardness K(r) of Example 2 is plotted in FIG. 8 . As shown in FIG. 8 , when the distance r is 10 to 130 m, the rebound hardness K(r) satisfies the above formula (1). The release film was pulled out from the release film roll, and the surface state of the release layer of the release film was visually inspected. As a result, there was no particular abnormality. The average thickness of the dielectric green sheets was 0.9 μm. In addition, the variation range of the thickness of the dielectric green sheet was 0.03 μm, which was a good product. Also, no pinhole was detected.

(實施例3) 除了調整使用捲繞裝置捲繞剝離膜(切斷後)時之捲取軸102之轉矩,將施加於捲繞之剝離膜之張力設為實施例1之約0.6倍以外,與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定、介電質生坯片之形成及評估。圖8中繪製出實施例3之距離r與反彈硬度K(r)之關係。如圖8所示,距離r為10~130 m時,反彈硬度K(r)滿足上述式(1)。又,自剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,無特別異常。介電質生坯片之厚度平均值為0.9 μm。又,介電質生坯片之厚度之變動幅度為0.03 μm,為良品。又,未檢測出針孔。(Example 3) The same procedure as in Example 1 was carried out, except that the torque of the winding shaft 102 when the release film (after cutting) was wound using the winding device was adjusted, and the tension applied to the wound release film was set to about 0.6 times that of Example 1. to make rolls of release film. And, similarly to Example 1, the measurement of rebound hardness K(r), and the formation and evaluation of a dielectric green sheet were performed. The relationship between the distance r and the rebound hardness K(r) of Example 3 is plotted in FIG. 8 . As shown in FIG. 8 , when the distance r is 10 to 130 m, the rebound hardness K(r) satisfies the above formula (1). Moreover, the peeling film was pulled out from the peeling film roll, and the surface state of the peeling layer of the peeling film was visually inspected. As a result, there was no particular abnormality. The average thickness of the dielectric green sheets was 0.9 μm. In addition, the variation range of the thickness of the dielectric green sheet was 0.03 μm, which was a good product. Also, no pinhole was detected.

(比較例1) 除了調整使用捲繞裝置捲繞剝離膜(切斷後)時之捲取軸102之轉矩,將施加於捲繞之剝離膜之張力設為實施例1之約1.3倍以外,與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定、介電質生坯片之形成及評估。圖9中繪製出比較例1之距離r與反彈硬度K(r)之關係。如圖9所示,距離r為10~約45 mm時,反彈硬度K(r)超出上述式(1)之上限。自剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,無特別異常。另一方面,介電質生坯片之厚度變動幅度隨著接近捲芯而變大。距離剝離膜之後端40 mm間之剝離膜上之介電質生坯片之厚度變動超出0.06 μm,無法滿足設定厚度(0.9 μm)之±5%以內。(Comparative Example 1) The same procedure as in Example 1 was carried out, except that the torque of the winding shaft 102 when the release film (after cutting) was wound using the winding device was adjusted, and the tension applied to the wound release film was set to about 1.3 times that of Example 1. to make rolls of release film. And, similarly to Example 1, the measurement of rebound hardness K(r), and the formation and evaluation of a dielectric green sheet were performed. The relationship between the distance r and the rebound hardness K(r) of Comparative Example 1 is plotted in FIG. 9 . As shown in FIG. 9 , when the distance r is 10 to about 45 mm, the rebound hardness K(r) exceeds the upper limit of the above formula (1). The release film was pulled out from the release film roll, and the surface state of the release layer of the release film was visually inspected. As a result, there was no particular abnormality. On the other hand, the thickness variation of the dielectric green sheet becomes larger as it approaches the core. The thickness variation of the dielectric green sheet on the release film within 40 mm from the rear end of the release film exceeds 0.06 μm and cannot meet within ±5% of the set thickness (0.9 μm).

(比較例2) 除了調整使用捲繞裝置捲繞剝離膜(切斷後)時之捲取軸102之轉矩,將張力設為實施例1之約0.3倍以外,與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定。圖9中繪製出比較例2之距離r與反彈硬度K(r)之關係。如圖9所示,距離r為約30~約115 mm時,反彈硬度K(r)低於上述式(1)之下限。形成介電質生坯片時,欲搬運時,剝離膜卷之捲芯附近之剝離膜竹筍狀鼓出,導致卷形狀不均一。於該時點,判斷比較例2之剝離膜卷不適宜,評估結束。(Comparative Example 2) A release film roll was produced in the same manner as in Example 1, except that the torque of the winding shaft 102 when the release film (after cutting) was wound using a winding device was adjusted and the tension was about 0.3 times that of Example 1. And, similarly to Example 1, the measurement of rebound hardness K(r) was performed. The relationship between the distance r and the rebound hardness K(r) of Comparative Example 2 is plotted in FIG. 9 . As shown in FIG. 9 , when the distance r is about 30 to about 115 mm, the rebound hardness K(r) is lower than the lower limit of the above formula (1). When the dielectric green sheet is formed, when it is about to be transported, the peeling film near the core of the peeling film roll bulges out like a bamboo shoot, causing the roll shape to be uneven. At this point, the peeling film roll of Comparative Example 2 was judged to be unsuitable, and the evaluation was completed.

(比較例3) 捲繞時,以施加於捲繞之剝離膜之張力大致固定之方式,調製捲取軸102之轉矩,且將接觸輥對剝離膜卷之壓力設為實施例1之約1.5倍。除此以外皆與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定。圖10中繪製出比較例3之距離r與反彈硬度K(r)之關係。如圖10所示,距離r為約110~130 mm時,反彈硬度K(r)超出上述式(1)之上限。(Comparative Example 3) During winding, the torque of the winding shaft 102 was adjusted so that the tension applied to the wound release film was approximately constant, and the pressure of the touch roller on the release film roll was set to about 1.5 times that of Example 1. Except for this, it carried out similarly to Example 1, and produced the peeling film roll. And, similarly to Example 1, the measurement of rebound hardness K(r) was performed. The relationship between the distance r and the rebound hardness K(r) of Comparative Example 3 is plotted in FIG. 10 . As shown in FIG. 10 , when the distance r is about 110 to 130 mm, the rebound hardness K(r) exceeds the upper limit of the above formula (1).

自剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,於距離r為70 mm以下之捲芯側之部分,發生複數個排列於寬度方向之於剝離膜之長邊方向延伸的褶皺,確認到剝離膜發生變形。認為因此種褶皺所致之變形係受捲繞過緊影響。於該時點,判斷比較例3之剝離膜卷不適宜,評估結束。The release film was pulled out from the release film roll, and the surface state of the release layer of the release film was visually inspected. As a result, in the portion on the core side where the distance r was 70 mm or less, a plurality of wrinkles that were arranged in the width direction and extended in the longitudinal direction of the release film occurred, and it was confirmed that the release film was deformed. It is believed that the deformation caused by such folds is affected by the winding tightness. At this point, the peeling film roll of Comparative Example 3 was judged to be unsuitable, and the evaluation was completed.

(比較例4) 自開始捲繞至捲繞結束,不使捲繞轉矩發生大變化。又,將接觸輥對剝離膜卷之壓力設為實施例1之約0.7倍。此外,與實施例1同樣地製作剝離膜卷。且,與實施例1同樣地,進行反彈硬度K(r)之測定。圖10中繪製出比較例4之距離r與反彈硬度K(r)之關係。如圖10所示,距離r為約35~130 mm時,反彈硬度K(r)低於上述式(1)之下限。(Comparative Example 4) The winding torque does not change greatly from the start of the winding to the end of the winding. Moreover, the pressure of the touch roll with respect to the peeling film roll was about 0.7 times that of Example 1. Moreover, it carried out similarly to Example 1, and produced the peeling film roll. And, similarly to Example 1, the measurement of rebound hardness K(r) was performed. The relationship between the distance r and the rebound hardness K(r) of Comparative Example 4 is plotted in FIG. 10 . As shown in FIG. 10 , when the distance r is about 35 to 130 mm, the rebound hardness K(r) is lower than the lower limit of the above formula (1).

獲得之剝離膜卷之外周部之剝離膜之側端部(切斷部)變得不整齊。自剝離膜卷拉出剝離膜,目視檢查剝離膜之剝離層之表面狀態。其結果,於距離側端部往內側約3 cm以內之區域,可見如剝離膜折疊之變形。作為側端部不整齊之結果,壓力變形地作用於側端部附近,其結果,認為剝離膜發生變形。於該時點,判斷比較例4之剝離膜卷不適宜,評估結束。 [產業上之可利用性]The side edge part (cut part) of the release film of the outer peripheral part of the obtained release film roll became uneven. The release film was pulled out from the release film roll, and the surface state of the release layer of the release film was visually inspected. As a result, in the region within about 3 cm inward from the side end, deformation such as folding of the release film was observed. As a result of the unevenness of the side end portion, pressure deformation acts on the vicinity of the side end portion, and as a result, it is considered that the release film is deformed. At this point, the peeling film roll of Comparative Example 4 was judged to be unsuitable, and the evaluation was completed. [Industrial Availability]

根據本揭示,根據本揭示,可提供一種即使加長剝離膜之捲繞長度,亦可充分減少於剝離膜之剝離層產生之損壞的剝離膜卷。又,可提供一種藉由使用此種剝離膜卷,而具有優異之可靠性之陶瓷零件片材之製造方法及陶瓷零件之製造方法。又,可提供一種具有優異之可靠性之陶瓷零件片材及陶瓷零件。According to the present disclosure, according to the present disclosure, even if the winding length of the release film is lengthened, it is possible to provide a release film roll that can sufficiently reduce damage to the release layer of the release film. Moreover, by using such a peeling film roll, the manufacturing method of the ceramic component sheet|seat which has the outstanding reliability, and the manufacturing method of a ceramic component can be provided. In addition, a ceramic component sheet and ceramic component having excellent reliability can be provided.

10:捲芯 10a:外周面 11:捲芯 12:側面 12A:側面 20:剝離膜 20A:剝離膜 22:基材膜 23:卷 24:剝離層 24a:表面 26:外周面 26A:外周面 27:表面 30:生坯片 30b:一面 32:陶瓷生坯片 32a:表面 34:電極生坯片 40:陶瓷零件片材 50:夾壓輥 50a:上輥 50b:下輥 60:切斷部 60a:上刃輥 60b:下刃輥 70:接觸輥 90:積層陶瓷電容器 92:內層部 93:外層部 94:內部電極層 95:端子電極 96:陶瓷層 100:剝離膜卷 102:捲取軸 200:剝離膜卷 202:旋轉軸 300:製造裝置 C:中心 P:箭頭 R:徑向 r:距離 r0 :距離10: Core 10a: Outer peripheral surface 11: Core 12: Side 12A: Side 20: Release film 20A: Release film 22: Base film 23: Roll 24: Release layer 24a: Surface 26: Outer peripheral surface 26A: Outer peripheral surface 27 : Surface 30: Green sheet 30b: One side 32: Ceramic green sheet 32a: Surface 34: Electrode green sheet 40: Ceramic parts sheet 50: Pinch roll 50a: Top roll 50b: Bottom roll 60: Cut portion 60a : Upper blade roller 60b : Lower blade roller 70 : Contact roller 90 : Multilayer ceramic capacitor 92 : Inner layer part 93 : Outer layer part 94 : Internal electrode layer 95 : Terminal electrode 96 : Ceramic layer 100 : Release film roll 102 : Winding shaft 200: peeling film roll 202: rotating shaft 300: manufacturing apparatus C: center P: arrow R: radial direction r: distance r 0 : distance

圖1係一實施形態之剝離膜卷之立體圖。 圖2係顯示剝離膜之一例之剖視圖。 圖3係一實施形態之剝離膜卷之側視圖。 圖4係用以說明反彈硬度K(r)之測定方法之圖。 圖5係顯示一實施形態之剝離膜卷之製造裝置之一例之圖。 圖6係一實施形態之陶瓷零件片材之剖視圖。 圖7係顯示一實施形態之陶瓷零件之剖視圖。 圖8係顯示實施例1、2、3之剝離膜卷之距離r與反彈硬度K(r)之關係之圖表。 圖9係顯示比較例1、2之剝離膜卷之距離r與反彈硬度K(r)之關係之圖表。 圖10係顯示比較例3及比較例4之剝離膜卷之距離r與反彈硬度K(r)之關係之圖表。Fig. 1 is a perspective view of a release film roll according to an embodiment. FIG. 2 is a cross-sectional view showing an example of a release film. Fig. 3 is a side view of the release film roll of one embodiment. FIG. 4 is a diagram for explaining a method of measuring the rebound hardness K(r). It is a figure which shows an example of the manufacturing apparatus of the peeling film roll of one Embodiment. Fig. 6 is a cross-sectional view of a ceramic component sheet according to an embodiment. Fig. 7 is a cross-sectional view showing a ceramic part according to an embodiment. FIG. 8 is a graph showing the relationship between the distance r of the peeling film rolls and the rebound hardness K(r) of Examples 1, 2, and 3. FIG. FIG. 9 is a graph showing the relationship between the distance r of the peeling film rolls and the rebound hardness K(r) of Comparative Examples 1 and 2. FIG. 10 is a graph showing the relationship between the distance r of the peeling film rolls and the rebound hardness K(r) of Comparative Example 3 and Comparative Example 4. FIG.

20:剝離膜 20: peel off film

22:基材膜 22: substrate film

24:剝離層 24: Peel layer

Claims (8)

一種剝離膜卷,其具有:剝離膜,該剝離膜具有基材膜及剝離層;及捲芯,其捲繞有該剝離膜;側面中,自上述捲芯之外周面沿徑向之距離r[mm]為10~130mm時,於卷之外周面露出之上述剝離膜之表面,朝上述捲芯之中心測定之距離r處之剝離膜卷之反彈硬度K(r)[HL]滿足下述式(1),-2r+670≦K(r)≦-1.25r+862.5…(1)。 A release film roll comprising: a release film having a base film and a release layer; and a core on which the release film is wound; in a side surface, a distance r from an outer peripheral surface of the core in a radial direction When [mm] is 10 to 130 mm, the rebound hardness K(r) [HL] of the release film roll at a distance r measured toward the center of the roll core on the surface of the release film exposed on the outer peripheral surface of the roll satisfies the following: Formula (1), -2r+670≦K(r)≦-1.25r+862.5…(1). 如請求項1之剝離膜卷,其中上述距離r未達10mm時,上述反彈硬度K(r)為650HL以上。 The peeling film roll according to claim 1, wherein when the distance r is less than 10 mm, the rebound hardness K(r) is 650HL or more. 如請求項1或2之剝離膜卷,其中上述捲芯之外周面至卷狀剝離膜之外周面之沿上述徑向之距離r0為160mm以上,上述距離r為160mm以上時,上述反彈硬度K(r)為350~662.5HL。 The release film roll of claim 1 or 2, wherein the distance r 0 along the radial direction from the outer peripheral surface of the roll core to the outer peripheral surface of the roll-shaped release film is 160 mm or more, and when the distance r is 160 mm or more, the rebound hardness K(r) is 350~662.5HL. 如請求項1或2之剝離膜卷,其中於上述距離r為10~130mm之範圍內,隨著上述距離r增加,上述反彈硬度K(r)[HL]減少。 The peeling film roll according to claim 1 or 2, wherein within the range of the distance r being 10 to 130 mm, the rebound hardness K(r) [HL] decreases as the distance r increases. 一種陶瓷零件片材之製造方法,其具有以下步驟:於自如請求項1至4中任一項之剝離膜卷拉出之上述剝離膜之上述剝離層之表面,使用包含陶瓷粉末之糊膏,形成陶瓷生坯片;且上述陶瓷生坯片之厚度為1.0μm以下。 A method for producing a ceramic part sheet, comprising the steps of: using a paste containing ceramic powder on the surface of the above-mentioned release layer of the above-mentioned release film drawn from the release film roll of any one of claims 1 to 4, A ceramic green sheet is formed; and the thickness of the ceramic green sheet is 1.0 μm or less. 一種陶瓷零件之製造方法,其具有以下步驟:使用以如請求項5之製造方法獲得之上述陶瓷零件片材,獲得包含上述陶瓷生坯片之積層體;及燒成上述積層體,獲得燒結體。 A method of manufacturing a ceramic part, comprising the steps of: using the above-mentioned ceramic part sheet obtained by the manufacturing method as claimed in claim 5 to obtain a layered body comprising the above-mentioned ceramic green sheet; and firing the above-mentioned layered body to obtain a sintered body . 一種陶瓷零件片材,其係於自如請求項1至4中任一項之剝離膜卷拉出之上述剝離膜之上述剝離層之表面,形成包含陶瓷生坯片的生坯片而獲得。 A ceramic component sheet obtained by forming a green sheet comprising a ceramic green sheet on the surface of the above-mentioned release layer of the above-mentioned release film drawn from the release film roll of any one of claims 1 to 4. 一種陶瓷零件,其具備燒結體,該燒結體係形成包含如請求項7之陶瓷零件片材之陶瓷生坯片之積層體,將該積層體燒成而獲得。A ceramic part provided with a sintered body, the sintering system forming a layered body of ceramic green sheets including the ceramic part sheet according to claim 7, and obtained by firing the layered body.
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