TWI768347B - Thermosetable composition, epoxy curable product prepared thereby and a method for degrading epoxy curable product - Google Patents
Thermosetable composition, epoxy curable product prepared thereby and a method for degrading epoxy curable product Download PDFInfo
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 108
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims description 32
- 230000000593 degrading effect Effects 0.000 title claims description 10
- 239000004417 polycarbonate Substances 0.000 claims abstract description 63
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 60
- 239000003822 epoxy resin Substances 0.000 claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 58
- 239000003054 catalyst Substances 0.000 claims abstract description 33
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 125000005587 carbonate group Chemical group 0.000 claims abstract description 9
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 8
- 238000006731 degradation reaction Methods 0.000 claims description 28
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 230000015556 catabolic process Effects 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 16
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 15
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 14
- 238000006136 alcoholysis reaction Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- 238000007098 aminolysis reaction Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000004843 novolac epoxy resin Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical group CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920000638 styrene acrylonitrile Polymers 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 abstract description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 abstract description 6
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000002203 pretreatment Methods 0.000 abstract 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 15
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 13
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
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- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- 230000001365 aminolytic effect Effects 0.000 description 4
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
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- 238000002411 thermogravimetry Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- KGYYLUNYOCBBME-UHFFFAOYSA-M 4-fluoro-2-phenyl-4-(4-propylcyclohexyl)cyclohexa-1,5-diene-1-carboxylate Chemical compound C1CC(CCC)CCC1C1(F)C=CC(C([O-])=O)=C(C=2C=CC=CC=2)C1 KGYYLUNYOCBBME-UHFFFAOYSA-M 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
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- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000004227 thermal cracking Methods 0.000 description 2
- -1 1,3-dihexylurea (1,3-dihexylurea) Chemical compound 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- WOHOXHYMCWWJJH-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1.CC1=NC=CN1 WOHOXHYMCWWJJH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LNVWRBNPXCUYJI-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazol-4-amine Chemical compound CC1=NNC(C)=C1N LNVWRBNPXCUYJI-UHFFFAOYSA-N 0.000 description 1
- OBKXEAXTFZPCHS-UHFFFAOYSA-N 4-phenylbutyric acid Chemical compound OC(=O)CCCC1=CC=CC=C1 OBKXEAXTFZPCHS-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 229920007019 PC/ABS Polymers 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Epoxy Resins (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
Description
本發明係關於一種可固化組成物、其製備之環氧固化物及降解環氧固化物的方法,尤其是關於一種包含環氧樹脂、觸媒以及聚碳酸酯或聚碳酸酯合金的可固化組成物、其製備之環氧固化物及降解環氧固化物的方法。The present invention relates to a curable composition, its prepared epoxy cured product and a method for degrading the epoxy cured product, in particular to a curable composition comprising epoxy resin, catalyst and polycarbonate or polycarbonate alloy A product, an epoxy cured product prepared therefrom, and a method for degrading the epoxy cured product.
聚碳酸酯係由雙酚和光氣進行界面縮合反應而得,或者和碳酸二苯酯進行酯交換反應而得,其中雙酚A是最常被使用的雙酚。雙酚A型聚碳酯(或簡稱PC)是一種具有良好的光學和機械性質的高分子,常被使用於數據存取,如CD、DVD等影音光碟片、安全玻璃和汽車零件上。除純樹脂外,聚碳酸酯合金,如PC/ABS合金(丙烯腈-丁二烯-苯乙烯共聚合物,Acrylonitrile-Butadiene-Styrene copolymer)或PC/SAN合金(苯乙烯-丙烯腈共聚合物,Styrene-Acrylonitrile copolymer)也被廣泛的應用。Polycarbonate is obtained by the interfacial condensation reaction of bisphenol and phosgene, or by transesterification with diphenyl carbonate, among which bisphenol A is the most commonly used bisphenol. Bisphenol A polycarbonate (or PC for short) is a polymer with good optical and mechanical properties, and is often used in data access, such as CD, DVD and other audio-visual discs, safety glass and automotive parts. In addition to pure resins, polycarbonate alloys such as PC/ABS alloys (Acrylonitrile-Butadiene-Styrene copolymer) or PC/SAN alloys (styrene-acrylonitrile copolymers) , Styrene-Acrylonitrile copolymer) is also widely used.
目前回收PC分為兩大方法,第一種係透過機械加工或是物理摻混其他材料的物理性回收方法;第二種係透過降解高分子鏈的方式來得到有用的單體,如雙酚A、PBA的雙(羥乙基)醚、碳酸二甲酯、碳酸二乙酯、羥基-N,N’-二亞苯基-異丙基雙氨基甲酸酯、N,N’-二芐基脲的化學降解法;第三種係透過熱裂解的方式來回收聚碳酸酯。其中,化學降解法需要合適的溶劑以及分離程序,以避免引起環境上的問題,而熱裂解法的單體選擇性很低。At present, there are two methods for recycling PC. The first is a physical recycling method through mechanical processing or physical mixing of other materials; the second is a method of degrading polymer chains to obtain useful monomers, such as bisphenol. A. Bis(hydroxyethyl) ether of PBA, dimethyl carbonate, diethyl carbonate, hydroxy-N,N'-diphenylene-isopropyl biscarbamate, N,N'-dibenzyl The chemical degradation method of base urea; the third system recovers polycarbonate by thermal cracking. Among them, the chemical degradation method requires suitable solvents and separation procedures to avoid causing environmental problems, while the thermal cracking method has very low monomer selectivity.
有鑑於此,若能直接將聚碳酸酯作為反應物與環氧樹脂進行反應,使聚碳酸酯的回收工業具有吸引力,遂成相關業者努力的目標。In view of this, if polycarbonate can be directly used as a reactant to react with epoxy resin, the recycling industry of polycarbonate can be attractive, and it has become the goal of the relevant industry.
本發明之一目的在於提供一種可固化組成物,其包含環氧樹脂、觸媒以及聚碳酸酯或聚碳酸酯合金,並進行固化反應製備出環氧固化物,且此環氧固化物可進行降解,使產品能夠回收再利用,減輕環境負擔。One object of the present invention is to provide a curable composition, which comprises epoxy resin, catalyst and polycarbonate or polycarbonate alloy, and undergoes a curing reaction to prepare an epoxy cured product, and the epoxy cured product can be cured Degradation, so that the product can be recycled and reused, reducing the burden on the environment.
本發明之一實施方式提供一種可固化組成物,其係包含環氧樹脂、聚碳酸酯或聚碳酸酯合金與觸媒,其中聚碳酸酯之碳酸酯基與環氧樹脂之環氧基的當量比值為0.8至1.2,且聚碳酸酯具有如式(I)所示之一結構:
依據前段所述之可固化組成物,其中觸媒可為選自由4-二甲基氨基吡啶、咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑所組成之一群組。According to the curable composition described in the preceding paragraph, the catalyst may be selected from the group consisting of 4-dimethylaminopyridine, imidazole, 2-methylimidazole, and 2-ethyl-4-methylimidazole.
依據前段所述之可固化組成物,其中觸媒的添加量可為環氧樹脂含量的0.1重量百分比至5重量百分比。According to the curable composition described in the preceding paragraph, the additive amount of the catalyst may be 0.1 to 5 weight percent of the epoxy resin content.
依據前段所述之可固化組成物,其中環氧樹酯可為雙酚A型環氧樹脂、酚醛環氧樹脂、甲基酚醛環氧樹脂、雙環戊二烯苯酚環氧樹脂、含萘環氧樹脂、磷系環氧樹脂或其混合。According to the curable composition described in the preceding paragraph, wherein the epoxy resin can be bisphenol A epoxy resin, novolac epoxy resin, methyl novolac epoxy resin, dicyclopentadiene phenol epoxy resin, naphthalene-containing epoxy resin Resin, phosphorus-based epoxy resin, or a mixture thereof.
依據前段所述之可固化組成物,可更包含一溶劑,其係用以溶解聚碳酸酯與環氧樹脂,以形成固含量為10重量百分比至30重量百分比之溶液。The curable composition described in the preceding paragraph may further include a solvent for dissolving the polycarbonate and the epoxy resin to form a solution with a solid content of 10 to 30 wt %.
本發明之另一實施方式提供一種環氧固化物,其係藉由前述可固化組成物進行一固化反應而得。Another embodiment of the present invention provides an epoxy cured product obtained by performing a curing reaction with the aforementioned curable composition.
依據前段所述之環氧固化物,其中固化反應係加熱可固化組成物來完成,且固化反應的一固化溫度係180o C至240o C。According to the epoxy cured product described in the preceding paragraph, the curing reaction is completed by heating the curable composition, and a curing temperature of the curing reaction is 180 ° C to 240 ° C.
依據前段所述之環氧固化物,其可具有如式(1)、式(2)、式(3)或式(4)所示之一局部結構:
本發明之再一實施方式提供一種胺解降解環氧固化物的方法,包含提供前述環氧固化物以及進行一降解步驟,其中降解步驟係將一含胺基之化合物與環氧固化物反應,以胺解降解環氧固化物。Yet another embodiment of the present invention provides a method for aminolytic degradation of an epoxy cured product, comprising providing the aforementioned epoxy cured product and performing a degradation step, wherein the degradation step is to react an amine group-containing compound with the epoxy cured product, The epoxy cured product is degraded by aminolysis.
本發明之更一實施方式提供一種醇解降解環氧固化物的方法,包含提供前述環氧固化物以及進行一降解步驟,其中降解步驟係將一含醇基之化合物於一離子液體的催化下與環氧固化物反應,以醇解降解環氧固化物。A further embodiment of the present invention provides a method for degrading an epoxy cured product by alcoholysis, comprising providing the aforementioned epoxy cured product and performing a degradation step, wherein the degradation step is to catalyze an alcohol group-containing compound under the catalysis of an ionic liquid Reacts with epoxy cured products to degrade epoxy cured products by alcoholysis.
藉此,本發明之可固化組成物係利用聚碳酸酯作為環氧樹脂的硬化劑,並在觸媒催化下形成具有優異性質的環氧固化物,且可進行降解使其能夠進行回收再利用,符合環保效益。Thereby, the curable composition of the present invention uses polycarbonate as the hardener of epoxy resin, and forms epoxy cured product with excellent properties under catalyst catalysis, and can be degraded so that it can be recycled and reused , in line with environmental benefits.
下述將更詳細討論本發明各實施方式。然而,此實施方式可為各種發明概念的應用,可被具體實行在各種不同的特定範圍內。特定的實施方式是僅以說明為目的,且不受限於揭露的範圍。Various embodiments of the present invention are discussed in greater detail below. However, this embodiment can be an application of various inventive concepts and can be embodied in various specific scopes. The specific embodiments are for illustrative purposes only, and are not intended to limit the scope of the disclosure.
>可固化組成物>>Curable composition>
本發明提供一種可固化組成物,其係包含環氧樹脂、聚碳酸酯或聚碳酸酯合金與觸媒,其中聚碳酸酯之碳酸酯基與環氧樹脂之環氧基的當量比值為0.8至1.2。The present invention provides a curable composition comprising epoxy resin, polycarbonate or polycarbonate alloy and catalyst, wherein the equivalent ratio of carbonate group of polycarbonate to epoxy group of epoxy resin is 0.8 to 1.2.
前述聚碳酸酯具有如式(I)所示之一結構:
前述環氧樹脂可為雙酚A型環氧樹脂(Diglycidyl ether of Bisphenol A, DGEBA)、酚醛環氧樹脂(Phenol novolac epoxy, PNE)、甲基酚醛環氧樹脂(Cresol novolac epoxy, CNE)、雙環戊二烯苯酚環氧樹脂(Dicyclopentadiene-phenol epoxy, DNE)、含萘環氧樹脂(Naphthalene-containing epoxy)、磷系環氧樹脂或其混合。換言之,前述環氧樹脂可單獨使用,也可同時使用兩種以上,且當使用兩種以上時,可依任何比例混合。藉此,可藉由選用適當的環氧樹脂,賦予後續固化產物所需的性質。The aforementioned epoxy resin can be bisphenol A epoxy resin (Diglycidyl ether of Bisphenol A, DGEBA), novolac epoxy resin (Phenol novolac epoxy, PNE), cresol novolac epoxy resin (CNE), bicyclic epoxy resin Dicyclopentadiene-phenol epoxy (DNE), naphthalene-containing epoxy (Naphthalene-containing epoxy), phosphorus-based epoxy or a mixture thereof. In other words, the aforementioned epoxy resins may be used alone, or two or more of them may be used simultaneously, and when two or more of them are used, they may be mixed in any ratio. In this way, desired properties can be imparted to the subsequent cured product by selecting an appropriate epoxy resin.
前述觸媒可包含未共用電子對,其選自由4-二甲基氨基吡啶(4-Dimethylaminopyridine, DMAP)、咪唑(Imidazole)、2-甲基咪唑(2-Methylimidazole)與2-乙基-4-甲基咪唑(2-Ethyl-4-methylimidazole)所組成之一群組。藉此,觸媒的未共用電子對可與環氧樹脂的環氧基作用而有利於引發後續的固化反應。具體地,前述觸媒的添加量可為環氧樹脂含量的0.1重量百分比至5重量百分比。The aforementioned catalyst may comprise an unshared electron pair selected from the group consisting of 4-Dimethylaminopyridine (DMAP), imidazole (Imidazole), 2-Methylimidazole (2-Methylimidazole) and 2-ethyl-4 - A group consisting of 2-Ethyl-4-methylimidazole. Thereby, the unshared electron pair of the catalyst can interact with the epoxy group of the epoxy resin to facilitate the subsequent curing reaction. Specifically, the addition amount of the aforementioned catalyst may be 0.1% by weight to 5% by weight of the epoxy resin content.
另外,前述可固化組成物可更包含一溶劑,其係用以溶解聚碳酸酯與環氧樹脂,以形成固含量為10重量百分比至30重量百分比之溶液。In addition, the aforementioned curable composition may further comprise a solvent for dissolving the polycarbonate and the epoxy resin to form a solution with a solid content of 10 to 30 wt%.
詳細來說,本發明之可固化組成物係利用聚碳酸酯中的碳酸酯基與環氧樹脂中的環氧基進行反應,為了證明上述概念,本發明先透過合成例1進行模式反應(model reaction),將碳酸二苯酯(diphenyl carbonate)和苯基縮水甘油醚(glycidyl phenyl ether)在觸媒4-二甲氨基吡啶下進行反應。具體地,取2.00克(9.3毫莫耳)的碳酸二苯酯、2.79克(18.6莫耳)的苯基縮水甘油醚以及0.014克的4-二甲氨基吡啶置入250 mL的三頸瓶中,升溫至80o
C確認溶解後繼續升溫至120o
C並反應2小時。之後,根據合成例1所得之產物進行光譜分析,氫譜的數據:1
H-NMR (DMSO-d6
), δ=4.32 (8H, H5
), 5.38 (2H, H6
), 6.97 (8H, H1
and H3
), 7.28 (4H, H2
);碳譜的數據:13
C-NMR (DMSO-d6
), δ=65.9 (C5
), 74.6 (C6
), 114.4 (C3
), 120.9 (C1
), 129.4 (C2
), 153.7 (C4
);紅外線光譜的數據:FTIR(KBr): ν(cm-1
)=1750 (C=O stretch of carbonyl group); 以及高解析度質譜數據:High resolution LC-MS (ESI-MS) m/z: [M+
] calcd. for C31
H31
O7
515.20 g/mol; anal., 515.2050 g/mol。合成例1的反應方程式如下表一所示,結果發現碳酸酯基可與環氧基進行反應。
>環氧固化物>>Epoxy Cured Product>
本發明進一步提供一種環氧固化物,其係藉由前述可固化組成物進行一固化反應而得,而前述固化反應參照第1圖簡單說明如下,其中第1圖繪示依照本發明之一實施方式之環氧固化物的製備方法100的步驟流程圖。在第1圖中,環氧固化物的製備方法100包含步驟110與步驟120。The present invention further provides an epoxy cured product, which is obtained by carrying out a curing reaction of the curable composition, and the curing reaction is briefly described below with reference to FIG. The flow chart of the steps of the
步驟110是進行一混合步驟,其係將環氧樹脂、聚碳酸酯或聚碳酸酯合金與觸媒混合而得到可固化組成物。具體來說,藉由步驟110,聚碳酸酯、環氧樹脂與觸媒可形成含有可固化組成物的一前驅物溶液。此外,前驅物溶液所用之溶劑係用以幫助聚碳酸酯與環氧樹脂共混,因此,只要可溶解聚碳酸酯、環氧樹脂且不與前述二者反應者,皆可作為步驟110中的溶劑使用。至於聚碳酸酯、環氧樹脂以及觸媒的細節請參照前文,在此不予以贅述。
步驟120是進行一固化步驟,使聚碳酸酯與環氧樹脂在觸媒催化下產生交聯以形成環氧固化物。具體來說,可透過加熱前驅物溶液使聚碳酸酯與環氧樹脂在觸媒催化下產生交聯,且最後加熱之固化溫度可為180o
C至240o
C,而加熱時間可為1小時至6小時。更具體地,前述加熱方式可採用多段加熱固化方式加熱前驅物溶液,例如,以180o
C、200o
C、220o
C各加熱2小時。關於加熱之固化溫度與加熱時間可隨所使用聚碳酸酯與環氧樹脂的種類彈性調整,本發明並不以此為限。
>胺解降解環氧固化物的方法>>Method for aminolysis to degrade epoxy cured product>
請參閱第2圖,其係繪示依照本發明之另一實施方式之胺解降解環氧固化物的方法200的步驟流程圖。在第2圖中,胺解降解環氧固化物的方法200包含步驟210以及步驟220。Please refer to FIG. 2 , which is a flow chart showing the steps of a
步驟210為提供前述環氧固化物。步驟220為進行一降解步驟,其係將一含胺基之化合物與前述環氧固化物反應,以胺解降解環氧固化物。
>醇解降解環氧固化物的方法>>Method for degrading epoxy cured product by alcoholysis>
請參閱第3圖,其係繪示依照本發明之又一實施方式之醇解降解環氧固化物的方法300的步驟流程圖。在第3圖中,醇解降解環氧固化物的方法300包含步驟310以及步驟320。Please refer to FIG. 3 , which is a flow chart of the steps of a
步驟310為提供前述環氧固化物。步驟320為進行一降解步驟,其係將一含醇基之化合物於一離子液體的催化下與環氧固化物反應,以醇解降解環氧固化物。Step 310 is to provide the aforementioned epoxy cured product. Step 320 is a degradation step, which is to react an alcohol group-containing compound with the epoxy cured product under the catalysis of an ionic liquid to degrade the epoxy cured product by alcoholysis.
茲以下列具體實施例進一步示範說明本發明,用以有利於本發明所屬技術領域通常知識者,可在不需過度解讀的情形下完整利用並實踐本發明,而不應將這些實施例視為對本發明範圍的限制,但用於說明如何實施本發明的材料及方法。The following specific examples are hereby used to further demonstrate the present invention, so as to help those skilled in the art to which the present invention pertains to fully utilize and practice the present invention without excessive interpretation, and these examples should not be regarded as It is intended to limit the scope of the invention, but to illustrate how the materials and methods of the invention may be practiced.
>實施例>>Example>
實施例1:取0.50克聚碳酸酯與0.74克的雙酚A型環氧樹脂(長春人造樹脂商品代號BE188),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,並在80o C下加熱至全溶,再加入0.0037克的4-二甲氨基吡啶。接著利用玻璃塗佈機將前驅物溶液塗佈於玻璃上,階段升溫至80o C持續12小時以除去大部分溶劑,再以180o C、200o C、220o C各2小時進行固化,泡水脫模後得到黃色的環氧固化物。Embodiment 1: take 0.50 grams of polycarbonate and 0.74 grams of bisphenol A type epoxy resin (Changchun artificial resin commodity code BE188), so that the aforementioned two are in an equivalent ratio of 1:1, with N-methyl Pyrrolidone was used as a solvent to prepare a precursor solution with a solid content of 20 wt%, which was heated to complete dissolution at 80 ° C, and then 0.0037 g of 4-dimethylaminopyridine was added. Then use a glass coater to coat the precursor solution on the glass, raise the temperature stepwise to 80 o C for 12 hours to remove most of the solvent, and then cure at 180 o C, 200 o C, and 220 o C for 2 hours each, After soaking in water and demoulding, a yellow epoxy cured product was obtained.
實施例2:取0.50克聚碳酸酯與1.898克的雙酚A型環氧樹脂(長春人造樹脂商品代號BE501),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,其餘步驟皆與實施例1相同,泡水脫模後得到黃色的環氧固化物。Embodiment 2: get 0.50 grams of polycarbonate and 1.898 grams of bisphenol A type epoxy resin (Changchun artificial resin commodity code BE501), so that the aforementioned two are in an equivalent ratio of 1:1, with N-methyl Pyrrolidone was used as a solvent to prepare a precursor solution with a solid content of 20 wt%, and the remaining steps were the same as in Example 1. After soaking in water and demoulding, a yellow epoxy cured product was obtained.
實施例3:取0.25克聚碳酸酯與1.774克的雙酚A型環氧樹脂(長春人造樹脂商品代號BE504),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,其餘步驟皆與實施例1相同,泡水脫模後得到黃色的環氧固化物。Embodiment 3: take 0.25 grams of polycarbonate and 1.774 grams of bisphenol A type epoxy resin (Changchun artificial resin commodity code BE504), so that the aforementioned two are in an equivalent ratio of 1:1, with N-methyl Pyrrolidone was used as a solvent to prepare a precursor solution with a solid content of 20 wt%, and the remaining steps were the same as in Example 1. After soaking in water and demoulding, a yellow epoxy cured product was obtained.
實施例4:取0.50克聚碳酸酯與1.024克的雙環戊二烯苯酚環氧樹脂(長春人造樹脂商品代號DNE),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,其餘步驟皆與實施例1相同,泡水脫模後得到黃色的環氧固化物。Embodiment 4: get 0.50 grams of polycarbonate and 1.024 grams of dicyclopentadiene phenol epoxy resin (Changchun artificial resin commodity code DNE), so that the above two are in the ratio of equivalence ratio 1:1, with N-methyl Pyrrolidone was used as a solvent to prepare a precursor solution with a solid content of 20 wt%, and the remaining steps were the same as in Example 1. After soaking in water and demoulding, a yellow epoxy cured product was obtained.
實施例5:取0.50克聚碳酸酯與0.807克的甲基酚醛環氧樹脂(長春人造樹脂商品代號CNE),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,其餘步驟皆與實施例1相同,泡水脫模後得到黃色的環氧固化物。Embodiment 5: take 0.50 g of polycarbonate and 0.807 g of methyl novolac epoxy resin (Changchun artificial resin commodity code CNE), so that the above two are in the ratio of the equivalent ratio of 1:1, with N-methylpyrrolidone. The solvent was configured as a precursor solution with a solid content of 20 wt%, and the remaining steps were the same as those in Example 1. After soaking in water and demoulding, a yellow epoxy cured product was obtained.
實施例6:取0.50克聚碳酸酯與1.064克的磷系環氧樹脂(長春人造樹脂商品代號PE),以使前述兩者在當量比1:1的比例下,以N-甲基吡咯烷酮為溶劑配置成固含量20 wt%的前驅物溶液,其餘步驟皆與實施例1相同,泡水脫模後得到黃色的環氧固化物。Embodiment 6: take 0.50 grams of polycarbonate and 1.064 grams of phosphorus-based epoxy resin (Changchun artificial resin commodity code PE), so that the above two are in the ratio of equivalent ratio 1:1, with N-methylpyrrolidone as The solvent was configured as a precursor solution with a solid content of 20 wt%, and the remaining steps were the same as in Example 1. After soaking in water and demoulding, a yellow epoxy cured product was obtained.
關於實施例1至實施例6之聚碳酸酯為式(I)中,X為式(i)、R為氫之結構,而環氧樹脂結構如下表二所示。
請參閱第4圖,其係繪示本發明實施例1至實施例6之環氧固化物的外觀示意圖,其中(a)、(b)、(c)、(d)、(e)、(f)分別為實施例1至實施例6之環氧固化物。由第4圖的結果可見,實施例1至實施例6的環氧固化物為黃色透明薄膜,且具有可撓性。Please refer to FIG. 4, which is a schematic diagram of the appearance of the epoxy cured products of Examples 1 to 6 of the present invention, wherein (a), (b), (c), (d), (e), ( f) are the epoxy cured products of Example 1 to Example 6, respectively. It can be seen from the results in Fig. 4 that the epoxy cured products of Examples 1 to 6 are yellow transparent films and have flexibility.
另外,請參閱第5圖,其係繪示本發明實施例4之各升溫階段的傅立葉紅外光譜圖。由第5圖的結果可見,其顯示在室溫下(RT),碳酸酯基的C=O吸收峰為1780 cm-1
,而經由加熱固化後,實施例4之環氧固化物的C=O吸收峰為1750 cm-1
,可知碳酸酯基從芳香族-芳香族碳酸酯(Ar-O(C=O)O-Ar)轉變成脂肪族-脂肪族(R-O(C=O)O-R)的碳酸酯,故實施例4之環氧固化物具有如式(1)所示之一局部結構:
同理於實施例4,實施例1、實施例5以及實施例6分別具有如式(2)、式(3)以及式(4)所示之一局部結構:
將實施例1至實施例6進行機械性質與熱性質評估,熱性質評估包含玻璃轉移溫度(Tg )、5%熱重損失溫度(Td5% )以及焦炭殘餘率,評估方法如下。The mechanical properties and thermal properties of Examples 1 to 6 were evaluated. The thermal property evaluation included glass transition temperature (T g ), 5% thermogravimetric loss temperature (T d5% ) and coke residual rate. The evaluation methods were as follows.
(一)玻璃轉移溫度:使用動態機械分析儀(Dynamic Mechanical Analyzer, DMA)測量實施例1至實施例6所製得之環氧固化物的儲存模數(Storage Modulus)及Tan delta曲線和溫度的關係以及玻璃轉移溫度。另外使用熱機械分析法(Thermo-Mechanical Analysis, TMA)來測量玻璃轉移溫度,熱機械分析法的條件為在5o C/min的加熱速率下量測。(1) Glass transition temperature: use a dynamic mechanical analyzer (Dynamic Mechanical Analyzer, DMA) to measure the storage modulus (Storage Modulus) and the Tan delta curve and temperature of the epoxy cured products obtained in Examples 1 to 6 relationship and glass transition temperature. In addition, the glass transition temperature was measured using Thermo-Mechanical Analysis (TMA), which was measured at a heating rate of 5 o C/min.
(二)5%熱重損失溫度及焦炭殘餘率:使用熱重分析法(Thermo-Gravimetric Analysis, TGA)來量測樣品的5%熱重損失溫度以及800o C的焦炭殘餘率(Char yield)。熱重量分析的條件是在氮氣氣氛下、以20o C/min的加熱速率,使用熱重分析儀量測樣品的重量變化。5%熱重損失溫度是指固化物樣品的重量損失達5%的溫度,其中5%熱重損失溫度愈高代表樣品的熱穩定性愈佳。800o C的焦炭殘餘率是指加熱溫度達800o C時的樣品的殘餘重量比率,其中800o C的殘餘重量比率愈高代表樣品的熱穩定性愈佳。(2) 5% thermogravimetric loss temperature and coke residual rate: use thermogravimetric analysis (Thermo-Gravimetric Analysis, TGA) to measure the 5% thermogravimetric loss temperature of the sample and the coke residual rate (Char yield) at 800 o C . The condition of thermogravimetric analysis is to measure the weight change of the sample using a thermogravimetric analyzer under a nitrogen atmosphere at a heating rate of 20 o C/min. The 5% thermogravimetric loss temperature refers to the temperature at which the weight loss of the cured product sample reaches 5%, wherein the higher the 5% thermogravimetric loss temperature, the better the thermal stability of the sample. The coke residual ratio of 800 o C refers to the residual weight ratio of the sample when the heating temperature reaches 800 o C, and the higher the residual weight ratio of 800 o C, the better the thermal stability of the sample.
請參閱第6圖,其繪示本發明實施例1至實施例6之環氧固化物的應力應變圖。藉由拉力測試以測得抗拉強度(tensile strength)以及斷裂延伸率(elongation at break),其中拉力測試是由EZ-SX在室溫中量測,試片大小為5公分長、1公分寬、0.042至0.107毫米厚,且抗拉強度對應第6圖中的應力,斷裂延伸率對應第6圖中的應變。關於實施例1至實施例6的抗拉強度以及斷裂延伸率之量測結果如下表三所示。
請參閱第7圖,其繪示本發明實施例1至實施例6之環氧固化物的動態熱機械分析圖。關於實施例1至實施例6的玻璃轉移溫度、儲存模數、熱重損失溫度以及焦炭殘餘率之量測結果如下表四所示。另外,將實施例1至實施例4之聚碳酸酯改為酚醛樹脂作為環氧樹脂的硬化劑,以製得比較例1至比較例4之環氧固化物,其玻璃轉移溫度、熱重損失溫度以及焦炭殘餘率之量測結果如下表四所示。
由表三的結果可見,當進行拉力測試時,顯示以聚碳酸酯作為環氧樹脂硬化劑可得具可撓性的熱固性薄膜。由表四的結果可見,當進行動態機械分析法量測時,以聚碳酸酯固化環氧樹脂和以酚醛樹脂固化環氧樹脂之間的熱性質接近,而在熱重分析的測試中,顯示以聚碳酸酯作為環氧樹脂硬化劑具有良好的熱穩定性。It can be seen from the results in Table 3 that when the tensile test is performed, it is shown that a flexible thermosetting film can be obtained by using polycarbonate as the epoxy resin hardener. From the results in Table 4, it can be seen that the thermal properties between the epoxy resin cured with polycarbonate and the epoxy resin cured with phenolic resin are close when measured by dynamic mechanical analysis, while in the test of thermogravimetric analysis, it is shown that Polycarbonate as epoxy resin hardener has good thermal stability.
>胺解降解環氧固化物>>Aminolytic degradation of epoxy cured products>
實施例7至實施例10分別為實施例1至實施例4之環氧固化物進行胺解降解反應所得之結果。首先,取實施例1至實施例4之環氧固化物薄膜與1-己胺置於反應器中,反應結束後直接使用減壓濃縮機將1-己胺抽出,可得降解完成之實施例7至實施例10。關於實施例7至實施例10中所需之環氧固化物添加量、1-己胺添加量、反應溫度、反應時間以及殘留重量皆列於下表五。
請參考第8圖,其係繪示實施例7之1 H-NMR分析圖。詳細來說,第8圖之(a)為實施例1與1-己胺進行胺解反應後,蒸去1-己胺之產物的1 H-NMR圖,而第8圖之(b)為實施例1與1-己胺進行胺解反應後,蒸去1-己胺並倒入甲醇以去除小分子者的1 H-NMR圖。Please refer to FIG. 8 , which shows the 1 H-NMR analysis chart of Example 7. In detail, (a) of Figure 8 is the 1 H-NMR chart of the product obtained by distilling off 1-hexylamine after the aminolysis reaction between Example 1 and 1-hexylamine, and (b) of Figure 8 is Example 1 After the aminolysis reaction with 1-hexylamine, 1-hexylamine was distilled off and poured into methanol to remove the 1 H-NMR chart of small molecules.
由第8圖的結果可見,實施例1與1-己胺進行胺解反應後之產物為1,3-二己基脲(1,3-dihexylurea)以及苯氧樹脂(phenoxy resin),且經由第8圖以及表五的結果,可說明本發明之環氧固化物與含胺基之化合物反應後具有可分解性,且環氧固化物的殘留重量為0%。實施例7的反應方程式如下表六所示。
>醇解降解環氧固化物>>Degradation of epoxy resin by alcoholysis>
實施例11以及實施例12為實施例1之環氧固化物進行醇解降解反應所得之結果。首先,將3克(19.7毫莫耳)的1,8-二氮雜二環[5.4.0]十一碳-7-烯(DBU)與1.34克(19.7毫莫耳)的咪唑於室溫下反應8小時,可得到淡黃色的[HDBU][IM]離子液體,其中[HDBU][IM]離子液體的反應方程式如下表七所示。
接著,取實施例1之環氧固化物薄膜與2-乙基己醇在離子液體[HDBU][IM]的催化下進行反應,而在200o
C的高壓反應器中反應18小時後,冷卻至室溫可得膏狀液體,代表降解完全,且可證明本發明之環氧固化物在醇解中很穩定。關於實施例11以及實施例12中所需之環氧固化物添加量、2-乙基己醇添加量、觸媒添加量、反應溫度、反應時間以及殘留重量皆列於下表八。
另外,同理於胺解降解試驗,實施例1與2-乙基己醇在離子液體的催化下,進行醇解降解之反應方程式如下表九所示,且經由表八的結果,可說明本發明之環氧固化物與含醇基之化合物在離子液體的催化下具有可分解性,且實施例11之環氧固化物的殘留重量為0%。
>比較例>>Comparative Example>
比較例5至比較例7為本發明之環氧固化物與2-乙基己醇在不同觸媒的催化下進行降解反應所得之結果。關於比較例5至比較例7中所需之環氧固化物添加量、2-乙基己醇添加量、觸媒種類、觸媒添加量、反應溫度、反應時間以及殘留重量皆列於下表十。
另外,比較例8至比較例9為實施例1之環氧固化物進行鹼水解降解所得之結果。關於比較例8至比較例9中所需之環氧固化物添加量、水添加量、觸媒、反應溫度、反應時間以及殘留重量皆列於下表十一。
由表十的結果可知,使用Ti(OBu)4 觸媒的降解效果不佳,而使用Zn(Ac)2 觸媒對實施例1之環氧固化物的降解效果中等,但對於實施例4之環氧固化物的降解效果不佳,而由表十一的結果可知,本發明之環氧固化物在鹼水下則無法進行降解。From the results in Table 10, it can be seen that the degradation effect of using Ti(OBu) 4 catalyst is not good, while the degradation effect of using Zn(Ac) 2 catalyst on the epoxy cured product of Example 1 is moderate, but for Example 4 The degradation effect of the epoxy cured product is not good, and it can be seen from the results in Table 11 that the epoxy cured product of the present invention cannot be degraded under alkaline water.
綜上所述,本發明之可固化組成物係藉由聚碳酸酯作為環氧樹脂的硬化劑,並搭配觸媒得到優異性質的環氧固化物,可使聚碳酸酯衍生之產品(例如廢棄的光碟片)轉變成有用的環氧熱固性材料,且此過程不會使用到任何的降解或裂解的前處理程序,和傳統的化學改質法相比具有低成本的特點。另外,本發明所製備之環氧固化物可進行降解,使得產品可回收再利用,減輕環境的負擔。To sum up, the curable composition of the present invention uses polycarbonate as a hardener of epoxy resin and is matched with a catalyst to obtain an epoxy cured product with excellent properties, which can make polycarbonate-derived products (such as waste products) CDs) into useful epoxy thermosetting materials, and this process does not use any pretreatment procedures of degradation or cracking, and has the characteristics of low cost compared with traditional chemical modification methods. In addition, the epoxy cured product prepared by the present invention can be degraded, so that the product can be recycled and reused, thereby reducing the burden on the environment.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the appended patent application.
100:環氧固化物的製備方法
200:胺解降解環氧固化物的方法
300:醇解降解環氧固化物的方法
110,120,210,220,310,320:步驟100: Preparation method of epoxy cured product
200: Method for the degradation of epoxy cured products by aminolysis
300: Method for degrading epoxy cured products by
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖係繪示依照本發明之一實施方式之環氧固化物的製備方法的步驟流程圖; 第2圖係繪示依照本發明之另一實施方式之胺解降解環氧固化物的方法的步驟流程圖; 第3圖係繪示依照本發明之又一實施方式之醇解降解環氧固化物的方法的步驟流程圖; 第4圖係繪示本發明實施例1至實施例6之環氧固化物的外觀示意圖; 第5圖係繪示本發明實施例4之各升溫階段的傅立葉紅外光譜圖; 第6圖係繪示本發明實施例1至實施例6之環氧固化物的應力應變圖; 第7圖係繪示本發明實施例1至實施例6之環氧固化物的動態熱機械分析圖;以及 第8圖係繪示實施例7之1 H-NMR分析圖。In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: Figure 1 illustrates the preparation of epoxy cured products according to one embodiment of the present invention The flow chart of the steps of the method; Fig. 2 shows the flow chart of the steps of the method for aminolysis degradation of epoxy resin according to another embodiment of the present invention; Fig. 3 is a flow chart of the method according to another embodiment of the present invention Step flow chart of the method for degrading the epoxy cured product by alcoholysis; Fig. 4 is a schematic view of the appearance of the epoxy cured product of Example 1 to Example 6 of the present invention; Fig. 5 is a schematic diagram of Example 4 of the present invention Fourier transform infrared spectrograms of each heating stage; Fig. 6 is a stress-strain diagram of the epoxy cured products of Example 1 to Example 6 of the present invention; Fig. 7 is a diagram of Example 1 to Example 6 of the present invention Dynamic thermomechanical analysis diagram of the epoxy cured product; and FIG. 8 is a 1 H-NMR analysis diagram of Example 7.
100:環氧固化物的製備方法100: Preparation method of epoxy cured product
110,120:步驟110, 120: Steps
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| WO2024026679A1 (en) * | 2022-08-02 | 2024-02-08 | 上纬创新育成股份有限公司 | Carbonate ester-containing epoxy resin, preparation method therefor, epoxy cured product prepared therefrom, and method for degrading epoxy cured product |
| WO2024119458A1 (en) * | 2022-12-09 | 2024-06-13 | 上纬创新育成股份有限公司 | Polycarbonate oligomer and preparation method therefor, curable composition, epoxy cured product, and method for degrading epoxy cured product by means of aminolysis |
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