TWI765217B - Probe and manufacturing method thereof - Google Patents
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- TWI765217B TWI765217B TW109101980A TW109101980A TWI765217B TW I765217 B TWI765217 B TW I765217B TW 109101980 A TW109101980 A TW 109101980A TW 109101980 A TW109101980 A TW 109101980A TW I765217 B TWI765217 B TW I765217B
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- probe
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- 239000000523 sample Substances 0.000 title claims abstract description 112
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000003780 insertion Methods 0.000 claims abstract description 17
- 230000037431 insertion Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 21
- 238000005304 joining Methods 0.000 claims description 14
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims 2
- 238000003466 welding Methods 0.000 description 33
- 239000000463 material Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
本發明係關於使用於被檢測體之特性的測定的探針及其製造方法。 The present invention relates to a probe for use in the measurement of properties of an object and a method for producing the same.
為了在不與晶圓分離的狀態下進行測定積體電路等被檢測體的特性,而使用有探針(參照專利文獻1)。例如,使用具有柱塞(plunger)及管身(barrel)之探針,該柱塞係接觸被檢查體之小直徑之棒形狀,該管身供柱塞之一部分插入之大直徑之圓筒形狀。關於柱塞之插入的部分與管身的接合,係使用一邊以2片的熔接電極夾著管身而從兩側加壓(press),一邊對管身與柱塞之間流通電流的點(spot)熔接。 Probes are used in order to measure the characteristics of a test object such as an integrated circuit without being separated from the wafer (see Patent Document 1). For example, use a probe having a plunger in the shape of a rod with a small diameter that contacts the object to be inspected and a barrel in the shape of a cylinder with a large diameter into which a part of the plunger is inserted . For the connection between the inserted part of the plunger and the tube body, a point at which a current flows between the tube body and the plunger is used while the tube body is sandwiched by two welding electrodes and pressed from both sides (press). spot) welding.
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
(專利文獻1)日本特開2002-267686號公報 (Patent Document 1) Japanese Patent Laid-Open No. 2002-267686
然而,若使用點熔接,由於藉由2片的熔接電極所造成的加壓,管身會朝外側鼓起,而易產生鄰接的探針彼此的接觸。因此,點熔接會無法將探針的間隔設得較窄,而難以達到探針的窄間距化。而且,由於管身鼓起的原因,會產生無法將探針插入用以保持探針之探針頭的貫穿孔的問題。 However, if point welding is used, due to the pressure caused by the two welding electrodes, the tube body will bulge outward, and the adjacent probes are likely to come into contact with each other. Therefore, in spot welding, the pitch of the probes cannot be narrowed, and it is difficult to narrow the pitch of the probes. Furthermore, there is a problem in that the probe cannot be inserted into the through hole of the probe head for holding the probe due to the bulging of the tube body.
再者,在點熔接中,則會包含在以2片的熔接電極加壓管身之後流通電流的步驟。亦即,須要有以2片的熔接電極物理性地夾住管身進行加壓的時間,以及對夾著管身的2片的熔接電極流通電流而將管身與柱塞熔接的時間。因此,管身與柱塞之熔接所需要的時間會變長,而增長了探針的製造時間。 In addition, in point welding, after pressurizing the tube body with two welding electrodes, a step of passing an electric current is included. That is, it takes time for the two pieces of welding electrodes to physically sandwich the tube body and pressurize, and a time for current to flow through the two pieces of welding electrodes sandwiching the tube body to weld the tube body and the plunger. Therefore, the time required for the welding of the tube body and the plunger becomes longer, which increases the manufacturing time of the probe.
鑑於上述問題點,本發明目的在於提供一種可抑制製造時間的增長,且可達到窄間距化的探針及探針的製造方法。 In view of the above-mentioned problems, an object of the present invention is to provide a probe needle and a probe needle manufacturing method which can suppress the increase in the manufacturing time and can achieve a narrower pitch.
依據本發明的一型態,提供一種探針,係具備:管身,係管形狀且具有開口端;及柱塞,係棒形狀且具有從開口端插入於管身之內部的插入部及連結於插入部的前端部;其中,於形成在管身之外壁部之一部分的凹狀的接合區域,管身之內壁部與柱塞之外壁部的接觸部位經合金化且管身與柱塞接合。 According to one aspect of the present invention, there is provided a probe comprising: a tube body in the shape of a tie tube and having an open end; and a plunger in the shape of a tie rod and having an insertion portion inserted into the inside of the tube body from the open end and a connection At the front end portion of the insertion portion; wherein, in the concave joint area formed in a part of the outer wall portion of the tube body, the contact portion between the inner wall portion of the tube body and the outer wall portion of the plunger is alloyed and the tube body and the plunger engage.
依據本發明的另一型態,提供一種探針的製造方法,係包含:作成將柱塞之插入部從開口端插入於管身的內部的狀態,藉由對屬於管身與柱塞之重疊的區域的一部分之接合區域照射雷射光所產生的熱來熔 解接合區域的管身與柱塞,使熔解後的管身的內壁部與熔解後的柱塞的外壁部的接觸部位合金化,而於接合區域將管身與柱塞接合。 According to another aspect of the present invention, there is provided a method for manufacturing a probe, comprising: making a state in which the insertion portion of the plunger is inserted into the inside of the tube body from the open end, A part of the area of the bonding area is fused by the heat generated by irradiating the laser light The pipe body and the plunger in the disjoint region are alloyed at the contact portion between the inner wall of the molten pipe body and the outer wall of the molten plunger, and the pipe body and the plunger are joined in the joint region.
依據本發明,能夠提供可抑制製造時間的增長,且可達到窄間距化的探針及探針的製造方法。 ADVANTAGE OF THE INVENTION According to this invention, it can suppress the increase of manufacturing time, and can provide the probe needle and the manufacturing method of a probe needle which can achieve a narrow pitch.
1:探針 1: Probe
2:探針頭 2: Probe head
10、10A:管身 10, 10A: tube body
20、20A:柱塞 20, 20A: plunger
21:前端部 21: Front end
22:插入部 22: Insertion part
30:合金部 30: Alloy Department
50:接合區域 50: Joint area
51:頂側接合區域 51: Top side joint area
52:底側接合區域 52: Bottom side joint area
201:頂側柱塞 201: Top Side Plunger
202:底側柱塞 202: Bottom side plunger
301:第一熔接電極 301: The first welding electrode
302:第二熔接電極 302: Second welding electrode
500:輔助器 500: Auxiliary
D1、D2:距離 D1, D2: distance
L:雷射光 L: laser light
第1圖為顯示本發明之實施型態之探針的構成的示意圖。 Fig. 1 is a schematic diagram showing the configuration of a probe according to an embodiment of the present invention.
第2圖為顯示沿著第1圖之II-II方向的剖面圖。 FIG. 2 is a cross-sectional view taken along the II-II direction of FIG. 1 .
第3圖為顯示以探針頭保持本發明之實施型態之探針之例的示意圖。 Fig. 3 is a schematic view showing an example of a probe holding the probe head according to the embodiment of the present invention.
第4圖為用以說明本發明之實施型態之探針的製造方法之示意性的工序圖(之一)。 FIG. 4 is a schematic process diagram (Part 1) for explaining a method of manufacturing a probe according to an embodiment of the present invention.
第5圖為用以說明本發明之實施型態之探針的製造方法之示意性的工序圖(之二)。 FIG. 5 is a schematic process diagram (Part 2) for explaining a method for manufacturing a probe according to an embodiment of the present invention.
第6圖為用以說明本發明之實施型態之探針的製造方法之示意性的工序圖(之三)。 FIG. 6 is a schematic process diagram (Part 3) for explaining a method for manufacturing a probe according to an embodiment of the present invention.
第7圖為顯示本發明之實施型態之探針的接合區域的剖面的照片。 FIG. 7 is a photograph showing a cross-section of the junction region of the probe according to the embodiment of the present invention.
第8圖為顯示本發明之實施型態之探針的俯視圖。 Fig. 8 is a plan view of a probe showing an embodiment of the present invention.
第9圖為顯示管身與柱塞之接合強度之評估條件的表。 FIG. 9 is a table showing evaluation conditions of the joint strength of the tube body and the plunger.
第10圖為顯示管身與柱塞之接合強度之評估結果的曲線圖。 FIG. 10 is a graph showing the evaluation result of the joint strength of the tube body and the plunger.
第11圖為顯示評估管身與柱塞之接合強度所獲得樣本之接合區域的照片。 FIG. 11 is a photograph showing the joint area of the sample obtained by evaluating the joint strength of the tube body and the plunger.
第12圖為顯示管身與柱塞之接合工序的示意圖,第12圖(a)顯示游隙為12μm時,第12圖(b)顯示游隙為6μm時,第12圖(c)顯示游隙為0μm時。 Fig. 12 is a schematic diagram showing the joining process of the tube body and the plunger. Fig. 12(a) shows when the clearance is 12μm, Fig. 12(b) shows when the clearance is 6μm, and Fig. 12(c) shows the clearance When the gap is 0 μm.
第13圖為顯示使游隙改變後之管身與柱塞之接合強度之評估結果的曲線圖。 FIG. 13 is a graph showing the results of evaluation of the joint strength of the tube body and the plunger after changing the clearance.
第14圖為顯示游隙為12μm時之接合區域的照片。 FIG. 14 is a photograph showing the bonding area when the clearance is 12 μm.
第15圖為用以說明比較例之探針的製造方法的示意圖。 FIG. 15 is a schematic diagram for explaining a method of manufacturing a probe of a comparative example.
第16圖為顯示比較例之探針之形狀的示意圖。 FIG. 16 is a schematic diagram showing the shape of the probe of the comparative example.
第17圖為顯示本發明之實施型態之探針的接合區域之例的俯視圖。 FIG. 17 is a plan view showing an example of the bonding region of the probe according to the embodiment of the present invention.
第18圖為顯示本發明之實施型態之探針的接合區域之另一例的俯視圖。 Fig. 18 is a plan view showing another example of the bonding region of the probe according to the embodiment of the present invention.
第19圖為顯示本發明之另一實施型態之探針的構成的示意圖。 FIG. 19 is a schematic diagram showing the structure of a probe according to another embodiment of the present invention.
接著,參照圖面來說明本發明的實施型態。於以下的圖面的記載中,相同或類似的部分係標註相同或類似的符號。其中,圖面為示意性者,應留意各部之厚度的比率等與現實的構成為不同的情形。此外,於圖面相互之間當然也包含相互的尺寸的關係或比率為不同的部分。以下所示的實施型態為例示用以將本發明之技術思想予以具體化的裝置或方法 者,本發明之實施型態並非將構成構件的材質、形狀、構造、配置等具體限定為以下所說明者。 Next, embodiments of the present invention will be described with reference to the drawings. In the description of the following drawings, the same or similar parts are denoted by the same or similar symbols. However, the drawings are schematic, and it should be noted that the ratio of the thickness of each part is different from the actual configuration. In addition, it is needless to say that the relationship or ratio of the dimensions is different between the drawings. The embodiments shown below are examples of devices or methods for embodying the technical idea of the present invention However, the embodiments of the present invention do not specifically limit the material, shape, structure, arrangement, etc. of the constituent members to those described below.
如第1圖所示,本發明之實施型態的探針係具備:具有開口端之管形狀的管身10;具有從開口端插入於管身10之內部的插入部22及連接於插入部22的前端部21之棒形狀的柱塞20。
As shown in FIG. 1, a probe according to an embodiment of the present invention includes: a
第1圖所示的探針中,管身10的兩端各自設有開口端。於管身10之一側的開口端插入有一個柱塞20(以下稱為「頂側柱塞201」)的插入部22。再者,於管身10之另一側的開口端插入有另一個柱塞20(以下稱為「底側柱塞202」)的插入部22。在此說明,「柱塞20」為頂側柱塞201與底側柱塞202的總稱。
In the probe shown in FIG. 1, both ends of the
在實施型態的探針中,於形成在管身10的外壁部之一部分之凹狀的接合區域50,管身10與柱塞20接合。在接合區域50中,藉由後述的製造方法,管身10的內壁部與柱塞20的外壁部被合金化。於屬於沿著第1圖之II-II方向的剖面圖的第2圖中,以合金部30表示經合金化後的部分。管身10與各個柱塞20在一個部位之接合區域50(合金部30)接合。
In the probe of the embodiment, the
第1圖所示的探針為使用於判斷例如被檢查體的電性特性時。此情形下,說明了一方的柱塞20(例如頂側柱塞201)的前端部21會接觸被檢查體。此外,另一側的柱塞20(例如底側柱塞202)的前端部21會與配線基板等的端子接觸,藉由配線基板而與測試器(tester)等測定機器電性地連接。
The probe shown in FIG. 1 is used for judging, for example, the electrical properties of an object to be inspected. In this case, it has been described that the
因此,使用導電性材料作為管身10及柱塞20。例如,使用鎳(Ni)或磷化鎳(NiP)等作為管身10的材料。使用AgPdCu(APC)或鎢(W)等
作為柱塞20的材料。管身10及柱塞20的材料係以管身10的內壁部與柱塞20的外壁部的接觸部位熔解時會合金化的方式來選擇。
Therefore, a conductive material is used as the
例如第3圖所示,探針藉由探針頭2所保持。亦即,被檢查體的測定上所必須的個數的探針1以貫穿了探針頭2的貫穿孔的狀態來配置。如此一來,從探針頭2之一側的主面露出的探針1的一側的端部(例如頂側柱塞201的前端部21)會接觸於被檢查體。從探針頭2之另一側的主面露出的探針1的另一側的端部(例如底側柱塞202的前端部21)會電性地連接於測定機器。
For example, as shown in FIG. 3 , the probe is held by the probe head 2 . That is, the probes 1 necessary for the measurement of the object to be inspected are arranged in a state of penetrating through the through holes of the probe head 2 . In this way, one end of the probe 1 exposed from the main surface on one side of the probe head 2 (eg, the
以下說明第1圖所示之探針1的製造方法。首先,如第4圖所示,設成將柱塞20的插入部22從開口部插入於管身10之內部的狀態。
Next, the manufacturing method of the probe 1 shown in FIG. 1 is demonstrated. First, as shown in FIG. 4 , it is assumed that the
接著如第5圖所示,藉由雷射裝置(未圖示)於預先設定之預定的接合區域50對管身10的外壁部照射雷射光L。接合區域50係設定於管身10與柱塞20之插入部22之重疊的區域的一部分。
Next, as shown in FIG. 5 , the outer wall portion of the
藉由照射雷射光L所產生的熱,如第6圖所示,管身10於接合區域50熔解。然後,在與熔解後的管身10的內壁部的接觸部位,柱塞20的外壁部也熔解,熔解後的管身的內壁部與熔解後的柱塞20的外壁部的接觸部位合金化。之後,合金化的接觸部位凝固而如第2圖所示形成合金部30。
By the heat generated by irradiating the laser light L, as shown in FIG. 6 , the
如上述的方式,於接合區域50,管身10與柱塞20接合。實施型態之探針的製造方法中,如第7圖中在接合區域50切斷而獲得的照片所示,管身10不會朝外側鼓起。因此,不會阻礙探針之配置的窄間距化。
在此說明,所謂「鼓起」係柱塞20與熔接後的管身10的外壁部比熔接前的管身10之外壁部更朝外側鼓起的現象。
As described above, the
依據實施型態之探針的製造方法,管身10因雷射光L的照射而熔解,於接合區域50中,管身10的外壁部比周圍更往中心軸方向後退。亦即,接合區域50之管身10的外壁部成為比周圍更凹陷的狀態。
According to the manufacturing method of the probe of the embodiment, the
管身10與柱塞20的尺寸方面,能夠選擇各式各樣的組合。例如將外徑為42μm的柱塞20接合於外徑為60μm且內徑為47μm的管身10。或將外徑為48μm的柱塞20接合於外徑為70μm且內徑為54μm的管身10。或將外徑為72μm的柱塞20接合於外徑為95μm且內徑為80μm的管身10。探針的全長為例如6.2mm至8.4mm左右。
In terms of the dimensions of the
雷射光L的功率及照射時間為因應管身10及柱塞20的材料及厚度而適當地選擇。
The power and irradiation time of the laser light L are appropriately selected according to the materials and thicknesses of the
當雷射光L的功率過於小時,就無法將管身10及柱塞20熔解。相對於此,當雷射光L的功率過於大時,就會在管身10形成孔。雷射光L的功率例如為10W至40W左右。此外,當雷射光L的照射時間過於短時,管身10及柱塞20就無法熔解,當雷射光L的照射時間過於長時,就會在管身10形成孔。雷射光L的照射時間為0.0001秒至0.001秒。
When the power of the laser light L is too small, the
再者,雷射光L的束徑為因應柱塞20的直徑等來選擇。束徑為例如柱塞20之直徑的一半左右,束徑使用20μm之雷射光L等。
In addition, the beam diameter of the laser beam L is selected according to the diameter of the
第8圖中顯示將形成有接合區域50的區域作為上表面之探針的俯視圖。藉由雷射光L的照射,在俯視下,接合區域50形成為大致圓形
狀。沿著管身10的軸向的接合區域50的直徑為與雷射光L之束徑相同的程度。此外,從開口端至接合區域50之中心為止的距離為例如0.1μm左右。
FIG. 8 shows a plan view of the probe with the region where the
本發明之發明人等如以下所述的方式,進行了藉由雷射光L的照射所接合之管身10與柱塞20之接合強度的評估。第9圖中顯示使用於接合強度之評估之管身10的尺寸及柱塞20的材料、雷射光L的輸出等條件。此接合強度之評估中,使用形成有例如直徑為3.5mm之孔的光圈,將從雷射裝置以設定輸出所輸出的雷射光以衰減70%後的實際輸出照射至接合區域50。如第9圖所示,針對外徑為60μm(內徑為47μm)的管身10,使雷射裝置的設定輸出上升至50W,此時的雷射光L的實際輸出為15W。此外,針對外徑為70μm(內徑為54μm)的管身10,使雷射裝置的設定輸出上升至60W,此時的雷射光L的實際輸出為18W。
The inventors of the present invention evaluated the bonding strength of the
雷射光L的照射時間設為0.5m秒。針對柱塞20的材料為材料A:APC、材料B:銠(Rh)與金(Au)的合金(Rh+Au)、材料C:W與Au的合金(W+Au)的情形,分別評估了接合強度。管身10的材料設為NiP。此外,將於接合後把柱塞20按入於管身10時接合部分不會剝離的按壓力,作為管身10與柱塞20的接合強度。
The irradiation time of the laser light L was set to 0.5 msec. The materials of the
第10圖顯示接合強度的評估結果。於第10圖中顯示將管身10的外徑為60μm時的接合強度設為S60,將管身10的外徑為70μm時的接合強度設為S70。如第10圖所示,接合強度S60在雷射光L之實際輸出為15W時充分大於設定為接合強度規格之下限的45gf。此外,接合強度S70在雷射光L之實際輸出為18W時充分大於設定為接合強度規格之下限的45gf。
Fig. 10 shows the evaluation results of the joint strength. FIG. 10 shows that the joint strength when the outer diameter of the
第11圖針對材料A至C,顯示接合強度比接合強度規格之下限還大之樣本的接合區域50的平面及剖面。管身10的外徑為60μm的情形與70μm的情形中的任一者,不論柱塞20的材料如何,接合的狀態均為良好。此外,照射雷射光L的期間,較佳為進行用以使接合區域50冷卻的氮氣的噴霧。第11圖所示的接合之中,除了管身10的外徑為70μm且柱塞20的材料為材料B以外,照射雷射光L的期間為進行氮氣的噴霧。
FIG. 11 shows, for materials A to C, the plan and cross-section of the
然而,假設於藉由雷射光L的照射所為之管身10與柱塞20的接合工序中,會有管身10的中心軸與柱塞20的中心軸不一致的情形。本發明的發明人等使從雷射光L所照射之側的管身10的內壁部至柱塞20的外壁部為止的距離(以下稱「游隙」)改變,而評估了管身10的中心軸與柱塞20的中心軸不一致時的接合強度。
However, it is assumed that in the bonding process of the
具體而言,針對使外徑為70μm且內徑為54μm的管身10改變游隙並插入柱塞20的接合工序,對管身10與柱塞20的接合強度進行評估。第12圖(a)顯示柱塞20的外徑為42μm,且柱塞20的外壁部接觸於與雷射光L所照射之側相對向之管身10的內壁部的情況1。亦即,情況1的游隙為12μm。第12圖(b)顯示柱塞20的外徑為48μm,且柱塞20的外壁部接觸於與雷射光L所照射之側相對向之管身10的內壁部的情況2。亦即,情況2的游隙為6μm。第12圖(c)顯示柱塞20的外徑為48μm,且柱塞20的外壁部接觸於雷射光L所照射之側之管身10的內壁部的情況3。亦即,情況3的游隙為0μm。
Specifically, the bonding strength of the
如第12圖(a)至第12圖(c)所示,使管身10與柱塞20被輔助器500支撐俾使構成預定的游隙,並且對接合區域50照射雷射光L。管身10
的材料為NiP,柱塞20的材料為Rh與Au的合金。雷射裝置的設定輸出設為50W或60W,藉由光圈將設定輸出衰減70%而作為雷射光L的實際輸出。第13圖顯示針對情況1(游隙C=12μm)、情況2(游隙C=6μm)、情況3(游隙C=0μm),評估了接合強度而獲得的結果。於第13圖中,以白色圈圈表示雷射裝置之設定輸出為50W的接合強度,以黑色圓點表示雷射裝置之設定輸出為60W的接合強度。
As shown in FIGS. 12( a ) to 12 ( c ), the
如第13圖所示,於情況1至3的任一者,接合強度比作為接合強度之下限的45gf都大。因此,於游隙為0μm至12μm的範圍中,管身10與柱塞20的接合狀態為良好。因此,可在一定的範圍內以使管身10的中心軸與柱塞20之中心軸的位置不一致的方式將管身10與柱塞20接合。此情形下,可獲得管身10與柱塞20以管身10的中心軸與柱塞20之中心軸的位置不一致的方式所接合而成的探針。
As shown in FIG. 13 , in any of the cases 1 to 3, the bonding strength was greater than 45 gf, which is the lower limit of the bonding strength. Therefore, when the clearance is in the range of 0 μm to 12 μm, the joint state of the
此外,游隙為12μm時,從與接合區域50相對向之管身10的內壁部至柱塞20之外壁部為止的距離,在情況1為0μm,在接合工序中,柱塞20的外壁部接觸於接合區域50的情況為12μm。第14圖顯示游隙為12μm時的接合區域50的平面及剖面。
In addition, when the clearance is 12 μm, the distance from the inner wall portion of the
此外,在上述中,管身10與頂側柱塞201的接合區域50(以下稱「頂側柱塞接合區域」)與管身10與底側柱塞202的接合區域50(以下稱「底側柱塞接合區域」),係在俯視下形成於同一平面。亦即,連結頂側接合區域與底側接合區域的直線為與管身10的軸向平行。然而,形成接合區域50的面可任意地設定,而不須將該等接合區域50形成於同一面。
In addition, in the above, the
以下說明藉由點熔接來接合管身與柱塞之方法的例子作為探針之製造方法的比較例。 An example of the method of joining the barrel and the plunger by spot welding will be described below as a comparative example of the manufacturing method of the probe.
點熔接的話,如第15圖所示的比較例,藉由一對熔接電極(第一熔接電極301與第二熔接電極302)夾著探針,一邊朝箭頭符號的方向進行加壓一邊對管身10A與柱塞20A流通電流。藉此,使管身10A與柱塞20A的接觸面產生電阻熱,藉由該電阻熱而在管身10A及柱塞20A的內部產生金屬的熔解凝固,而將管身10A與柱塞20A熔接。因此時的加壓,如第16圖所示,藉由形狀的改變而於管身10A的表面產生鼓起。
In the case of spot welding, as in the comparative example shown in FIG. 15, the probe is sandwiched between a pair of welding electrodes (the
當探針的表面產生鼓起時,為了防止探針彼此的接觸,必須將探針的間隔放寬。因此,會阻礙探針之配置的窄間距化。 In order to prevent the probes from contacting each other when the surfaces of the probes are bulged, the distance between the probes must be widened. Therefore, the narrow pitch of the arrangement|positioning of probe needles is hindered.
相對於此,依據上述所說明之實施型態的探針的製造方法,於管身10的接合區域50不會產生因加壓所造成的鼓起。因此,不須為了防止探針彼此的接觸而將探針的間隔放寬。而可達到探針之配置的窄間距化。再者,由於探針不會產生鼓起,所以也不會產生探針無法插入用以保持探針之探針頭的貫穿孔的問題。
On the other hand, according to the manufacturing method of the probe of the above-described embodiment, the
再者,若藉由點熔接,則藉由熔接電極物理性地夾著探針的時間為每一探針10秒鐘左右。此外,藉由點熔接而對管身與柱塞流通電流並將熔接部位熔接所需要的時間為每一個接合部位平均5秒鐘左右。亦即,將頂側柱塞與底側柱塞接合到管身的情形,點熔接所需要的時間為15秒鐘左右。 Furthermore, in the case of spot welding, the time for physically pinching the probes by the welding electrodes is about 10 seconds per probe. In addition, the time required to flow a current to the tube body and the plunger by spot welding and to weld the welded portion is about 5 seconds on average per welded portion. That is, when the top-side plunger and the bottom-side plunger are joined to the tube body, the time required for spot welding is about 15 seconds.
相對於此,藉由實施型態之探針的製造方法中的雷射光L的照射來接合管身10與柱塞20所需要的時間,針對一個接合區域50為0.0005
秒鐘左右。因此,為了將頂側柱塞201與底側柱塞202依序接合到管身10所需要的時間為0.001秒鐘。而且,由於不需要於熔接前以熔接電極物理性地夾著管身的時間,所以實施型態之探針的製造方法會縮短探針的製造時間。
On the other hand, the time required to join the
再者,於實施型態之探針的製造方法中,形成接合區域50之管身10的位置可任意地設定。亦即,不須針對照射雷射光L的位置進行嚴密地對準,即使管身10的端部與接合區域50之間的距離有若干的不均勻也不構成問題。
Furthermore, in the manufacturing method of the probe of the embodiment, the position of the
而且,形成接合區域50的面可任意地設定。亦即,使頂側柱塞201及底側柱塞202接合到管身10時,也可不將頂側接合區域與底側接合區域形成在俯視下為管身10的同一面。例如,將形成有頂側接合區域的面設為管身10的上表面時,於與上表面相反向的管身10的下表面形成底側接合區域。或於沿著上表面與下表面之間的周圍方向之任意的位置形成底側接合區域。第17圖顯示形成有頂側接合區域51之面與形成有底側接合區域52之面所形成的角為大致90度的例子。
Also, the surface on which the
如以上所述,也可為於俯視下,使形成頂側接合區域之管身10的面與形成底側接合區域之管身10的面不同。亦即,連結頂側接合區域與底側接合區域的直線可不與管身10的軸向平行。
As described above, the surface of the
再者,在將頂側柱塞201與底側柱塞202分別從管身10之兩端的開口端插入的狀態下,能夠使頂側柱塞201與底側柱塞202同時或連續地與管身10接合。此時,不須要精密的對準。亦即,從管身10的端部至接合區域50為止的距離,在頂側接合區域與底側接合區域可為不同。第18圖
顯示了從插入有頂側柱塞201之管身10的開口端至頂側接合區域51為止的距離D1,與從插入有底側柱塞202之管身10的開口端至底側接合區域52為止的距離D2為不同的例子(D1<D2)。
Furthermore, in a state in which the top-
此外,能夠使用兩台雷射裝置,同時使頂側柱塞201與底側柱塞202與管身10接合。或變更照射雷射光L的位置,連續地使頂側柱塞201與底側柱塞202和管身10接合。或是將照射雷射光L的位置予以固定而使探針移動,藉此,能夠連續地使頂側柱塞201與底側柱塞202和管身10接合。
In addition, two laser devices can be used to simultaneously engage the top-
如以上所述,對於接合區域50之位置的設定有較高靈活度,且於照射雷射光L時不須要精密的對準。因此,依據實施型態之探針的製造方法,與點熔接作比較,能夠大幅地縮短管身10與柱塞20之接合所需要的時間。從而,能夠增高製品流通量而使探針的生產效率提升。
As described above, the setting of the position of the
再者,於點熔接須有熔接電極與探針的對準工序,藉由熔接電極夾著探針的工序,一邊加壓一邊流通電流而將管身與柱塞熔接的工序等多數的工序。因此,於點熔接中易產生探針的製造不均勻。 In addition, spot welding requires a process of aligning the welding electrode and the probe, a process of sandwiching the probe with the welding electrode, and a process of welding the tube body and the plunger while applying current while applying pressure. Therefore, unevenness in the manufacture of probes is likely to occur in spot welding.
相對於此,依據實施型態之探針的製造方法,能夠比點熔接更減少工序。因此,能夠抑制探針的製造不均勻。 On the other hand, according to the manufacturing method of the probe needle of an embodiment, the number of steps can be reduced more than spot welding. Therefore, the manufacturing unevenness of the probe can be suppressed.
如以上的說明,實施型態的探針係藉由雷射光L的照射而將管身10與柱塞20接合,藉此,抑制探針的鼓起。因此,可達到探針之配置的窄間距化。再者,依據實施型態之探針的製造方法,能夠比點熔接縮短製造時間,且能夠抑制製造不均勻。從而,能夠提升製造良率及生產效率。
As described above, in the probe of the embodiment, the
伴隨著積體電路的細微化,積體電路之檢查用墊(pad)的個數亦會增大,並進行檢查用墊的間隔的窄間距化。從而,需使用以接觸積體電路之檢查用墊之探針的配置的窄間距化。因此,存在著要有效率地製造與窄間距化對應的多數個細微的探針的需求。為了解決此需求,實施型態之探針及探針的製造方法就能夠良好地應用。 Along with the miniaturization of integrated circuits, the number of inspection pads in the integrated circuits is also increased, and the intervals between the inspection pads are narrowed. Therefore, it is necessary to use a narrower pitch for the arrangement of probes that contact the inspection pads of the integrated circuit. Therefore, there is a need to efficiently manufacture a large number of fine probes corresponding to the narrowing of the pitch. In order to solve this requirement, the probe of the implementation type and the manufacturing method of the probe can be well applied.
(其他實施型態) (Other implementations)
如以上所述,本發明係以實施型態的方式來記載,惟不應理解為構成此發明揭示的一部分的論述及圖式為限定本發明的內容。由此發明揭示,本發明所屬技術領域中具有通常知識者當可清楚明白各式各樣的代替實施型態、實施例及運用技術。 As described above, the present invention is described in the form of an embodiment, but it should not be construed that the discussion and drawings constituting a part of the disclosure of the present invention limit the content of the present invention. Based on the disclosure of the present invention, those with ordinary knowledge in the technical field to which the present invention pertains can clearly understand various alternative implementation forms, embodiments and application techniques.
例如,在上述的說明中已針對管身10的兩端部分別供柱塞20插入的探針進行了說明,惟本實施型態也可應用於如第19圖所示的方式之僅於管身10之單側的端部插入有柱塞20所構成的探針。例如,也可使插入於管身10之一側的端部的柱塞20接觸被檢查體,而使管身10的另一側的端部接觸配線基板等的端子。
For example, in the above description, the probe into which the
再者,雖已說明了探針的剖面的形狀為圓形狀的情形,惟剖面的形狀也可為四角形等多角形狀。此外,雖已說明了頂側柱塞201的前端部21為圓錐狀,底側柱塞202的前端部21為圓筒形狀的例子,惟可配合前端部21所接觸的端子的形狀等而適切地選擇柱塞20的前端部21的形狀。
Furthermore, although the case where the cross-sectional shape of the probe is circular has been described, the cross-sectional shape may be a polygonal shape such as a quadrangle. In addition, although the example in which the
此外,也可於探針的側面形成螺旋狀的切口等,而於探針形成彈簧部。藉此,探針可於軸向自由伸縮。接合區域50係例如設定於彈簧部與開口端之間。
In addition, a helical cut or the like may be formed on the side surface of the probe, and a spring portion may be formed on the probe. Thereby, the probe can freely expand and contract in the axial direction. The engaging
如以上所述,本發明當然包含本發明內容中未記載之各式各樣的實施型態等。 As mentioned above, it is needless to say that the present invention includes various embodiments and the like which are not described in the content of the present invention.
10:管身 10: Tube body
20:柱塞 20: Plunger
21:前端部 21: Front end
22:插入部 22: Insertion part
50:接合區域 50: Joint area
201:頂側柱塞 201: Top Side Plunger
202:底側柱塞 202: Bottom side plunger
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|---|---|---|---|---|
| WO2018216273A1 (en) * | 2017-05-24 | 2018-11-29 | 山一電機株式会社 | Mems-type probe and electrical inspection device using same |
| TW201920965A (en) * | 2017-08-24 | 2019-06-01 | 日商日本麥克隆尼股份有限公司 | Probe and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202045931A (en) | 2020-12-16 |
| JP2020118667A (en) | 2020-08-06 |
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