TWI764221B - Composite material structure - Google Patents
Composite material structureInfo
- Publication number
- TWI764221B TWI764221B TW109126152A TW109126152A TWI764221B TW I764221 B TWI764221 B TW I764221B TW 109126152 A TW109126152 A TW 109126152A TW 109126152 A TW109126152 A TW 109126152A TW I764221 B TWI764221 B TW I764221B
- Authority
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- Prior art keywords
- block
- layer
- carbon fiber
- core
- composite material
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- 239000002131 composite material Substances 0.000 title claims abstract description 44
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 63
- 239000004917 carbon fiber Substances 0.000 claims abstract description 63
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000010410 layer Substances 0.000 claims description 65
- 239000012792 core layer Substances 0.000 claims description 48
- 239000012790 adhesive layer Substances 0.000 claims description 47
- 239000011162 core material Substances 0.000 claims description 39
- 229920003023 plastic Polymers 0.000 claims description 25
- 239000004033 plastic Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920001610 polycaprolactone Polymers 0.000 claims description 3
- 239000004632 polycaprolactone Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920005862 polyol Polymers 0.000 claims description 3
- 150000003077 polyols Chemical class 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 6
- MIHRIUIDCRJCOF-UHFFFAOYSA-N benzene ethene prop-2-enenitrile Chemical group C=C.C1=CC=CC=C1.C(C=C)#N MIHRIUIDCRJCOF-UHFFFAOYSA-N 0.000 claims 1
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 description 13
- 238000001746 injection moulding Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Landscapes
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Abstract
Description
本發明是有關於一種複合材料,且特別是有關於一種複合材料結構。The present invention relates to a composite material, and in particular to a composite material structure.
隨著消費者的生活與工作型態的改變,智慧型手機、平板電腦、電子書閱讀器以及筆記型電腦等可攜式電子裝置已成為當前的市場主流。為提高攜帶便利性並減少攜帶負擔,可攜式電子裝置無不朝輕量化發展。機殼作為可攜式電子裝置的主要零部件,不僅可用以裝載電子元件或顯示面板,也能起防護的效果。With the changes in consumers' living and working patterns, portable electronic devices such as smart phones, tablet computers, e-book readers, and notebook computers have become mainstream in the current market. In order to improve the convenience of carrying and reduce the carrying burden, the portable electronic devices are all developing towards light weight. As the main component of the portable electronic device, the casing can not only be used for loading electronic components or display panels, but also has a protective effect.
因機殼在可攜式電子裝置中的重量占比極大,開發出質輕且機械強度優異的機殼始終為相關廠商的重要課題。一般而言,常見的機殼包括塑膠機殼、合金機殼以及碳纖維機殼,其中碳纖維機殼的重量較塑膠機殼與合金機殼為輕,且碳纖維機殼的機械強度又較塑膠機殼與合金機殼為優異,故碳纖維機殼的開發逐漸受到重視。Since the chassis accounts for a large proportion of the weight of the portable electronic device, developing a chassis with light weight and excellent mechanical strength is always an important issue for related manufacturers. Generally speaking, common casings include plastic casings, alloy casings and carbon fiber casings. The weight of carbon fiber casings is lighter than that of plastic casings and alloy casings, and the mechanical strength of carbon fiber casings is higher than that of plastic casings. And alloy casing is excellent, so the development of carbon fiber casing has gradually been paid attention to.
目前,碳纖維機殼採用的工法可分為熱固法與熱塑法,其中熱塑法採用射出成型技術,且量產速度快,主要應用於製作可攜式電子裝置的機殼。然而,在射出成型的過程中,時常發生塑料滲入芯材的情況,進而影響到碳纖維機殼的重量與機械強度。At present, the construction methods used for carbon fiber casings can be divided into thermosetting methods and thermoplastic methods. The thermoplastic method adopts injection molding technology and has a fast mass production speed, and is mainly used in the production of casings for portable electronic devices. However, in the process of injection molding, the infiltration of plastic into the core material often occurs, which in turn affects the weight and mechanical strength of the carbon fiber casing.
本發明提供一種複合材料結構,其質輕且機械強度優異。The present invention provides a composite material structure that is lightweight and excellent in mechanical strength.
本發明提出一種複合材料結構,其包括芯材、第一碳纖維層以及第二碳纖維層。芯材包括第一區塊與連接第一區塊的第二區塊,其中第一區塊具有第一厚度,且第二區塊具有小於第一厚度的第二厚度。第一碳纖維層貼合於芯材的一側,且自第一區塊延伸至第二區塊。第二碳纖維層貼合於芯材的另一側,且自第一區塊延伸至第二區塊。芯材位於第一碳纖維層與第二碳纖維層之間。The present invention provides a composite material structure, which includes a core material, a first carbon fiber layer and a second carbon fiber layer. The core material includes a first block and a second block connected to the first block, wherein the first block has a first thickness, and the second block has a second thickness smaller than the first thickness. The first carbon fiber layer is attached to one side of the core material and extends from the first block to the second block. The second carbon fiber layer is attached to the other side of the core material and extends from the first block to the second block. The core material is located between the first carbon fiber layer and the second carbon fiber layer.
在本發明的一實施例中,上述的芯材包括芯層、第一黏著層以及第二黏著層,且芯層具有第一表面與相對於第一表面的第二表面。第一黏著層設置於第一表面上,且第二黏著層設置於第二表面上。第一碳纖維層貼合於第一黏著層,且第二碳纖維層貼合於第二黏著層。In an embodiment of the present invention, the above-mentioned core material includes a core layer, a first adhesive layer and a second adhesive layer, and the core layer has a first surface and a second surface opposite to the first surface. The first adhesive layer is arranged on the first surface, and the second adhesive layer is arranged on the second surface. The first carbon fiber layer is attached to the first adhesive layer, and the second carbon fiber layer is attached to the second adhesive layer.
在本發明的一實施例中,上述的芯層具有位於第一區塊內的多個第一孔穴與位於第二區塊內的多個第二孔穴,這些第一孔穴的孔徑大於這些第二孔穴的孔徑。In an embodiment of the present invention, the above-mentioned core layer has a plurality of first holes in the first block and a plurality of second holes in the second block, and the diameters of the first holes are larger than those of the second holes The hole diameter.
在本發明的一實施例中,上述的這些第一孔穴互不連通,且這些第二孔穴互不連通。In an embodiment of the present invention, the above-mentioned first holes are not communicated with each other, and the second holes are not communicated with each other.
在本發明的一實施例中,上述的這些第一孔穴與這些第二孔穴的孔徑介於0.05至0.5毫米。In an embodiment of the present invention, the diameters of the first holes and the second holes are between 0.05 and 0.5 mm.
在本發明的一實施例中,上述的第一碳纖維層與第一黏著層之間存在第一交界線,且部分第一黏著層自第一表面滲入部分第一孔穴與部分第二孔穴以形成第二交界線,其中第二交界線的長度與第一交界線的長度的比值大於1.05。In an embodiment of the present invention, a first boundary line exists between the first carbon fiber layer and the first adhesive layer, and part of the first adhesive layer penetrates into part of the first hole and part of the second hole from the first surface to form The second boundary line, wherein the ratio of the length of the second boundary line to the length of the first boundary line is greater than 1.05.
在本發明的一實施例中,上述的芯層的材料包括丙烯腈與甲基丙烯酸的合成物、聚甲基丙烯醯亞胺、聚氯乙烯、聚苯乙烯、聚胺酯、丙烯腈-苯乙烯共聚物、聚醚醯亞胺、聚丙烯或其組合。In an embodiment of the present invention, the material of the above-mentioned core layer includes a compound of acrylonitrile and methacrylic acid, polymethacrylimide, polyvinyl chloride, polystyrene, polyurethane, acrylonitrile-styrene copolymer compound, polyetherimide, polypropylene, or a combination thereof.
在本發明的一實施例中,上述的第一黏著層與第二黏著層的材料包括聚己內酯、聚醚多元醇、聚氨酯或其組合。In an embodiment of the present invention, the materials of the first adhesive layer and the second adhesive layer include polycaprolactone, polyether polyol, polyurethane or a combination thereof.
在本發明的一實施例中,上述的芯層的厚度介於0.1至1.5毫米。In an embodiment of the present invention, the thickness of the above-mentioned core layer ranges from 0.1 to 1.5 mm.
在本發明的一實施例中,上述的芯層的密度介於0.003至1公克/立方公分。In an embodiment of the present invention, the density of the core layer is between 0.003 and 1 g/cm 3 .
在本發明的一實施例中,上述的第一碳纖維層在第一區塊與第二區塊之間的交界產生轉折,且第一碳纖維層在第一區塊內的高度高於第一碳纖維層在第二區塊內的高度。In an embodiment of the present invention, the above-mentioned first carbon fiber layer is turned at the interface between the first block and the second block, and the height of the first carbon fiber layer in the first block is higher than that of the first carbon fiber The height of the layer within the second block.
在本發明的一實施例中,上述的第一厚度與第二厚度的比值小於等於15且大於1。In an embodiment of the present invention, the above-mentioned ratio of the first thickness to the second thickness is less than or equal to 15 and greater than 1.
在本發明的一實施例中,上述的複合材料結構更包括塑料層。塑料層覆蓋第一碳纖維層中位於第二區塊內的至少部分。In an embodiment of the present invention, the above-mentioned composite material structure further includes a plastic layer. The plastic layer covers at least a portion of the first carbon fiber layer located within the second block.
在本發明的一實施例中,上述的第一區塊的長度大於第二區塊的長度。In an embodiment of the present invention, the length of the first block is greater than the length of the second block.
基於上述,在本發明的複合材料結構中,芯材分為第一區塊與圍繞第一區塊的第二區塊,其中芯材在第二區塊內的厚度小於芯材在第一區塊內的厚度,且芯材在第二區塊內的密度大於芯材在第一區塊內的密度。後續,在射出成型的過程中,密度較大的第二區塊能有效地防止塑料向內滲入芯材。因此,複合材料結構的質輕且機械強度優異。Based on the above, in the composite material structure of the present invention, the core material is divided into a first block and a second block surrounding the first block, wherein the thickness of the core material in the second block is smaller than that of the core material in the first block thickness in the block, and the density of the core material in the second block is greater than the density of the core material in the first block. Subsequently, in the process of injection molding, the second block with higher density can effectively prevent the plastic from infiltrating into the core material. Therefore, the composite structure is lightweight and excellent in mechanical strength.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
圖1是本發明一實施例的複合材料結構的俯視示意圖。圖2是圖1的複合材料結構沿剖線I-I的局部放大剖面示意圖。請參考圖1與圖2,在本實施例中,複合材料結構100可應用於碳纖維機殼,其中複合材料結構100包括芯材110、第一碳纖維層120以及第二碳纖維層130,且芯材110位於第一碳纖維層120與第二碳纖維層130之間。換句話說,第一碳纖維層120與第二碳纖維層130分別位於芯材110的兩對側。FIG. 1 is a schematic top view of a composite material structure according to an embodiment of the present invention. FIG. 2 is a partial enlarged cross-sectional schematic diagram of the composite material structure of FIG. 1 along the section line I-I. Please refer to FIG. 1 and FIG. 2 , in this embodiment, the
芯材110包括第一區塊A1與連接第一區塊A1的第二區塊A2,其中第二區塊A2圍繞第一區塊A1,且第一區塊A1的面積大於第二區塊A2的面積。舉例來說,複合材料結構100置放於空間中的X-Y平面上,在X軸或Y軸上,第一區塊A1的長度L1大於第二區塊A2的長度L2。The
另一方面,芯材110的第一區塊A1具有第一厚度T1,且芯材110的第二區塊A2具有小於第一厚度T1的第二厚度T2。進一步來說,第一厚度T1與第二厚度T2的比值小於等於15且大於1。On the other hand, the first block A1 of the
舉例來說,原始的芯材的厚度等厚,經壓合製程後,芯材110分為第一區塊A1與圍繞第一區塊A1的第二區塊A2,其中芯材110在第二區塊A2內的厚度小於芯材110在第一區塊A1內的厚度,且芯材110在第二區塊A2內的密度大於芯材110在第一區塊A1內的密度。後續,在射出成型的過程中,密度較大的第二區塊A2能有效地防止塑料向內滲入芯材110。因此,複合材料結構100的質輕且機械強度優異。For example, the thickness of the original core material is equal. After the lamination process, the
請參考圖2,第一碳纖維層120貼合於芯材110的一側,且自第一區塊A1延伸至第二區塊A2。第二碳纖維層130貼合於芯材110的另一側,且自第一區塊A1延伸至第二區塊A2。詳細而言,芯材110包括芯層111、第一黏著層112以及第二黏著層113,且芯層111具有第一表面111a與相對於第一表面111a的第二表面111b。第一黏著層112設置於第一表面111a上,且第二黏著層113設置於第二表面111b上。第一碳纖維層120貼合於第一黏著層112,且第二碳纖維層130貼合於第二黏著層113。Referring to FIG. 2 , the first
在本實施例中,芯層111可為聚合物發泡材料(polymer foam),較佳為封閉式多孔發泡材料。進一步來說,芯層111的材料可包括丙烯腈與甲基丙烯酸的合成物、聚甲基丙烯醯亞胺、聚氯乙烯、聚苯乙烯、聚胺酯、丙烯腈-苯乙烯共聚物、聚醚醯亞胺、聚丙烯或其組合。另一方面,第一黏著層112與第二黏著層113的材料可包括聚己內酯、聚醚多元醇、聚氨酯或其組合。In this embodiment, the
進一步來說,芯層111具有位於第一區塊A1內的多個第一孔穴114與位於第二區塊A2內的多個第二孔穴115,其中這些第一孔穴114互不連通,且這些第二孔穴115互不連通。也就是說,每一個第一孔穴114為獨立且封閉的孔穴,不與其他的第一孔穴114相連通,也不與任一個第二孔穴115相連通。另一方面,每一個第二孔穴115為獨立且封閉的孔穴,不與其他的第二孔穴115相連通,也不與任一個第一孔穴114相連通。Further, the
這些第一孔穴114的孔徑R1大於這些第二孔穴115的孔徑R2,其中這些第一孔穴114的孔徑存在大小之別,且這些第二孔穴115的孔徑存在大小之別。進一步來說,這些第一孔穴114中孔徑最小者大於這些第二孔穴115中孔徑最大者,且這些第一孔穴114的孔徑R1與這些第二孔穴115的孔徑R2介於0.05至0.5毫米。The hole diameters R1 of the
舉例來說,原始的芯層具有多個孔穴,但這些孔穴並未因區塊不同而有明顯的大小區別。經壓合製程後,芯層111在第二區塊A2內的壓縮量較大,因此,位於第二區塊A2內的孔穴形成孔徑較小的第二孔穴115。後續,在射出成型的過程中,孔徑較小的第二孔穴115能有效地防止塑料向內滲入芯層111。因此,複合材料結構100的質輕且機械強度優異。For example, the original core layer has a plurality of cavities, but these cavities do not differ significantly in size from block to block. After the lamination process, the compression amount of the
在本實施例中,芯層111在第一區塊A1內的厚度為T3,且芯層111在第二區塊A2內的厚度為T4。厚度T4小於厚度T3,其中厚度T3最大可為1.5毫米,且厚度T4最小可為0.1毫米,故芯層111的厚度介於0.1至1.5毫米。In this embodiment, the thickness of the
舉例來說,原始的芯層的厚度等厚,經壓合製程後,芯層111在第二區塊A2內的厚度小於芯層111在第一區塊A1內的厚度,且芯層111在第二區塊A2內的密度大於芯層111在第一區塊A1內的密度。後續,在射出成型的過程中,密度較大的第二區塊A2能有效地防止塑料向內滲入芯層111。因此,複合材料結構100的質輕且機械強度優異。進一步來說,芯層111的密度介於0.003至1公克/立方公分,且密度最大的位置落在第二區塊A2內。For example, the thickness of the original core layer is the same thickness. After the lamination process, the thickness of the
請參考圖2,在本實施例中,第一碳纖維層120在第一區塊A1與第二區塊A2之間的交界101產生轉折,且第一碳纖維層120在第一區塊A1內的高度高於第一碳纖維層120在第二區塊A2內的高度。另一方面,第二碳纖維層130為平順地延伸,且第二碳纖維層130在第一區塊A1內的高度等於第二碳纖維層130在第二區塊A2內的高度。Referring to FIG. 2 , in this embodiment, the first
舉例來說,第一碳纖維層120與第一黏著層112之間存在第一交界線S1,且第一交界線S1落在第一黏著層112的上表面。第一黏著層112的下表面貼合於芯層111的第一表面111a,在熱壓合的過程中,部分第一黏著層112自第一表面111a滲入部分第一孔穴114與部分第二孔穴115以形成第二交界線S2。第二交界線S2的長度大於第一交界線S1的長度,其中第二交界線S2存在凹凸起伏,且第二交界線S2的長度與第一交界線S1的長度的比值大於1.05。基於此,第一黏著層112與芯層111可緊密地結合在一起,且第一碳纖維層120可透過第一黏著層112緊密地貼合於芯層111。For example, a first boundary line S1 exists between the first
相似地,第二碳纖維層130與第二黏著層113之間存在第三交界線S3,其中第三交界線S3落在第二黏著層113的下表面。第二黏著層113的上表面貼合於芯層111的第二表面111b,在熱壓合的過程中,部分第二黏著層113自第二表面111b滲入部分第一孔穴114與部分第二孔穴115以形成第四交界線S4。第四交界線S4的長度大於第三交界線S3的長度,其中第四交界線S4存在凹凸起伏,且第四交界線S4的長度與第三交界線S3的長度的比值大於1.05。基於此,第二黏著層113與芯層111可緊密地結合在一起,且第二碳纖維層130可透過第二黏著層113緊密地貼合於芯層111。Similarly, a third boundary line S3 exists between the second
特別說明的是,第二交界線S2是由被第一黏著層112填入的部分第一孔穴114與部分第二孔穴115所界定出的分界線,且存在凹凸起伏。另外,第四交界線S4是由被第二黏著層113填入的部分第一孔穴114與部分第二孔穴115所界定出的分界線,且存在凹凸起伏。Specifically, the second boundary line S2 is a boundary line defined by part of the
圖3是本發明另一實施例的複合材料結構的局部放大剖面示意圖。請參考圖3,相較於前一實施例的複合材料結構100而言,本實施例的複合材料結構100A更包括塑料層140a,其中塑料層140a採用射出成型技術形成於芯材110的第二區塊A2,且塑料層140a局部覆蓋位於第二區塊A2內的第一碳纖維層120。進一步來說,塑料層140a的所在位置靠近第二區塊A2的邊緣。另一方面,塑料層140a還覆蓋芯層111的邊緣,但塑料層140a沒有滲入芯層111。3 is a partial enlarged cross-sectional schematic diagram of a composite material structure according to another embodiment of the present invention. Referring to FIG. 3 , compared with the
圖4是本發明又一實施例的複合材料結構的局部放大剖面示意圖。請參考圖4,相較於前一實施例的複合材料結構100而言,本實施例的複合材料結構100B更包括塑料層140b,其中塑料層140b採用射出成型技術形成於芯材110的第二區塊A2,且塑料層140b完全覆蓋位於第二區塊A2內的第一碳纖維層120。另一方面,塑料層140b還覆蓋芯層111的邊緣,但塑料層140b沒有滲入芯層111。4 is a partial enlarged cross-sectional schematic diagram of a composite material structure according to another embodiment of the present invention. Referring to FIG. 4 , compared with the
綜上所述,在本發明的複合材料結構中,芯層在第二區塊內的厚度小於芯層在即第一區塊內的厚度,且芯層在第二區塊內的密度大於芯層在第一區塊內的密度。後續,在射出成型的過程中,密度較大的第二區塊能有效地防止塑料向內滲入芯層。因此,複合材料結構的質輕且機械強度優異。另一方面,位於第二區塊內的孔穴為孔徑較小的第二孔穴,後續,在射出成型的過程中,孔徑較小的第二孔穴能有效地防止塑料向內滲入芯層。To sum up, in the composite material structure of the present invention, the thickness of the core layer in the second block is smaller than the thickness of the core layer in the first block, and the density of the core layer in the second block is greater than that of the core layer Density within the first block. Subsequently, in the process of injection molding, the second block with higher density can effectively prevent the plastic from infiltrating into the core layer. Therefore, the composite structure is lightweight and excellent in mechanical strength. On the other hand, the holes located in the second block are second holes with smaller diameters, and subsequently, in the process of injection molding, the second holes with smaller diameters can effectively prevent the plastic from infiltrating into the core layer.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the appended patent application.
100、100A、100B:複合材料結構
101:交界
110:芯材
111:芯層
111a:第一表面
111b:第二表面
112:第一黏著層
113:第二黏著層
114:第一孔穴
115:第二孔穴
120:第一碳纖維層
130:第二碳纖維層
140a、140b:塑料層
A1:第一區塊
A2:第二區塊
I-I:剖線
L1、L2:長度
R1、R2:孔徑
S1:第一交界線
S2:第二交界線
S3:第三交界線
S4:第四交界線
T1:第一厚度
T2:第二厚度
T3、T4:厚度100, 100A, 100B: Composite Structures
101: Junction
110: Core material
111:
圖1是本發明一實施例的複合材料結構的俯視示意圖。 圖2是圖1的複合材料結構沿剖線I-I的局部放大剖面示意圖。 圖3是本發明另一實施例的複合材料結構的局部放大剖面示意圖。 圖4是本發明又一實施例的複合材料結構的局部放大剖面示意圖。FIG. 1 is a schematic top view of a composite material structure according to an embodiment of the present invention. FIG. 2 is a partial enlarged cross-sectional schematic diagram of the composite material structure of FIG. 1 along the section line I-I. 3 is a partial enlarged cross-sectional schematic diagram of a composite material structure according to another embodiment of the present invention. 4 is a partial enlarged cross-sectional schematic diagram of a composite material structure according to another embodiment of the present invention.
100:複合材料結構 100: Composite Structures
101:交界 101: Junction
110:芯材 110: Core material
111:芯層 111: Core layer
111a:第一表面 111a: first surface
111b:第二表面 111b: second surface
112:第一黏著層 112: The first adhesive layer
113:第二黏著層 113: Second adhesive layer
114:第一孔穴 114: The first hole
115:第二孔穴 115: The second hole
120:第一碳纖維層 120: First carbon fiber layer
130:第二碳纖維層 130: Second carbon fiber layer
A1:第一區塊 A1: The first block
A2:第二區塊 A2: Second block
R1、R2:孔徑 R1, R2: aperture
S1:第一交界線 S1: First Junction
S2:第二交界線 S2: Second Junction
S3:第三交界線 S3: Third Junction
S4:第四交界線 S4: Fourth Junction
T1:第一厚度 T1: first thickness
T2:第二厚度 T2: Second thickness
T3、T4:厚度 T3, T4: Thickness
Claims (13)
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| TW201834842A (en) * | 2017-03-24 | 2018-10-01 | 日商積水化成品工業股份有限公司 | Fiber reinforced composite body |
| TW201909713A (en) * | 2017-07-17 | 2019-03-01 | 仁寶電腦工業股份有限公司 | Plate member, casing including plate member and manufacturing method thereof |
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| DE102010035787A1 (en) * | 2010-08-30 | 2012-03-01 | Airbus Operations Gmbh | Aircraft structure assembly |
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