TWI756400B - 黏著劑層、附黏著劑層之單面保護偏光薄膜、影像顯示裝置及其連續製造方法 - Google Patents
黏著劑層、附黏著劑層之單面保護偏光薄膜、影像顯示裝置及其連續製造方法 Download PDFInfo
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- 239000012748 slip agent Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229920005552 sodium lignosulfonate Polymers 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- PFADVMKRWMHNTC-UHFFFAOYSA-N tert-butyl (2-methylpropan-2-yl)oxycarbonyloxy carbonate Chemical compound CC(C)(C)OC(=O)OOC(=O)OC(C)(C)C PFADVMKRWMHNTC-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Polarising Elements (AREA)
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| JP2017065812 | 2017-03-29 | ||
| JP2017065819 | 2017-03-29 | ||
| JP2017-065812 | 2017-03-29 | ||
| JP2017-065819 | 2017-03-29 | ||
| JP2018-049340 | 2018-03-16 | ||
| JP2018049340A JP6688822B2 (ja) | 2017-03-29 | 2018-03-16 | 粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
| JP2018-049345 | 2018-03-16 | ||
| JP2018049345A JP6730348B2 (ja) | 2017-03-29 | 2018-03-16 | 粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
| JP2018-063036 | 2018-03-28 | ||
| JP2018063036A JP7153459B2 (ja) | 2018-03-28 | 2018-03-28 | 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
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| TW201840774A TW201840774A (zh) | 2018-11-16 |
| TWI756400B true TWI756400B (zh) | 2022-03-01 |
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| CN (1) | CN110382648B (ja) |
| TW (1) | TWI756400B (ja) |
| WO (1) | WO2018181715A1 (ja) |
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| EP3454694A4 (en) | 2016-05-11 | 2020-01-22 | Ensitech IP Pty Ltd | ELECTROLYTIC BRUSH ARRANGEMENT |
| TWI741886B (zh) * | 2020-11-26 | 2021-10-01 | 達邁科技股份有限公司 | 熱硬化型抗靜電之黏著片 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076802A (zh) * | 2009-04-30 | 2011-05-25 | 日东电工株式会社 | 光学薄膜用粘合剂组合物、光学薄膜用粘合剂层、粘合型光学薄膜及图像显示装置 |
| TW201435025A (zh) * | 2013-02-13 | 2014-09-16 | Lintec Corp | 黏接性組合物、黏接劑以及黏接片 |
| TW201617651A (zh) * | 2014-09-30 | 2016-05-16 | Nitto Denko Corp | 單面保護偏光薄膜、附黏著劑層之偏光薄膜、影像顯示裝置及其連續製造方法 |
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| WO2010126054A1 (ja) * | 2009-04-30 | 2010-11-04 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置 |
| JP5687420B2 (ja) * | 2009-09-08 | 2015-03-18 | 日東電工株式会社 | 溶剤系光学部材用粘着剤組成物、粘着剤層、および粘着剤付光学部材 |
| JP2012247574A (ja) * | 2011-05-26 | 2012-12-13 | Nitto Denko Corp | 粘着型偏光板および画像表示装置 |
| JP5912833B2 (ja) * | 2011-05-26 | 2016-04-27 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付光学フィルムおよび画像表示装置 |
| JP6001255B2 (ja) * | 2011-11-15 | 2016-10-05 | 日東電工株式会社 | 粘着シート |
| JP2013148722A (ja) * | 2012-01-19 | 2013-08-01 | Nitto Denko Corp | 粘着剤層付光学フィルムおよび画像表示装置 |
| JP6157133B2 (ja) * | 2012-02-06 | 2017-07-05 | 日本合成化学工業株式会社 | マスキングフィルム用粘着剤組成物、これを架橋させてなるマスキングフィルム用粘着剤、およびこの粘着剤を有するマスキングフィルム |
| JP6114649B2 (ja) * | 2013-06-28 | 2017-04-12 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
| WO2016052549A1 (ja) * | 2014-09-30 | 2016-04-07 | 日東電工株式会社 | 片保護偏光フィルム、粘着剤層付偏光フィルム、画像表示装置およびその連続製造方法 |
| JP6523715B2 (ja) * | 2015-03-05 | 2019-06-05 | 大王製紙株式会社 | 粘着シートおよびこれを備える電気電子機器 |
| WO2016157921A1 (ja) * | 2015-03-31 | 2016-10-06 | リンテック株式会社 | 表面保護フィルム |
| JP6675242B2 (ja) * | 2016-03-18 | 2020-04-01 | 日本カーバイド工業株式会社 | 粘着剤組成物及び粘着剤層付偏光板 |
| JP6580540B2 (ja) * | 2016-09-28 | 2019-09-25 | 藤森工業株式会社 | 粘着剤組成物及び粘着フィルム |
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2018
- 2018-03-29 CN CN201880015688.7A patent/CN110382648B/zh active Active
- 2018-03-29 TW TW107111034A patent/TWI756400B/zh active
- 2018-03-29 WO PCT/JP2018/013242 patent/WO2018181715A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076802A (zh) * | 2009-04-30 | 2011-05-25 | 日东电工株式会社 | 光学薄膜用粘合剂组合物、光学薄膜用粘合剂层、粘合型光学薄膜及图像显示装置 |
| TW201435025A (zh) * | 2013-02-13 | 2014-09-16 | Lintec Corp | 黏接性組合物、黏接劑以及黏接片 |
| TW201617651A (zh) * | 2014-09-30 | 2016-05-16 | Nitto Denko Corp | 單面保護偏光薄膜、附黏著劑層之偏光薄膜、影像顯示裝置及其連續製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110382648A (zh) | 2019-10-25 |
| CN110382648B (zh) | 2022-06-07 |
| WO2018181715A1 (ja) | 2018-10-04 |
| TW201840774A (zh) | 2018-11-16 |
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